WO2015192413A1 - 一种led封装结构及液晶显示装置 - Google Patents

一种led封装结构及液晶显示装置 Download PDF

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Publication number
WO2015192413A1
WO2015192413A1 PCT/CN2014/081709 CN2014081709W WO2015192413A1 WO 2015192413 A1 WO2015192413 A1 WO 2015192413A1 CN 2014081709 W CN2014081709 W CN 2014081709W WO 2015192413 A1 WO2015192413 A1 WO 2015192413A1
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WO
WIPO (PCT)
Prior art keywords
metal bracket
cup
emitting chip
light emitting
bowl
Prior art date
Application number
PCT/CN2014/081709
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English (en)
French (fr)
Inventor
樊勇
Original Assignee
深圳市华星光电技术有限公司
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Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/387,541 priority Critical patent/US9406655B2/en
Publication of WO2015192413A1 publication Critical patent/WO2015192413A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Definitions

  • the present invention relates to the field of display panel technologies, and in particular, to an LED package structure and a liquid crystal display device.
  • Thin film transistor liquid crystal display (TFT-LCD, Thin Film Transistor- Liquid Crystal Display) is the only display device that fully catches up with and exceeds the cathode ray tube display in terms of brightness, contrast, power consumption, life, volume and weight. It has excellent performance, large-scale production characteristics and high automation. , quickly became the current mainstream product.
  • the color TFT-LCD display device is mainly a light emitting diode (LED, Light) using a yellow phosphor.
  • LED Light
  • Emitting Diode Emitting Diode
  • the LED with yellow phosphor is matched with the LCD panel, usually the color saturation is not high enough.
  • B is currently mainly used in LED backlights.
  • Chip blue light emitting chip
  • RG phosphor red green light emitting phosphor
  • BR chip +G phosphor BG chip +R Phosphor and other forms.
  • An object of the present invention is to provide an LED package structure and a liquid crystal display device, which improve the luminous efficiency of the entire LED.
  • An LED package structure comprising:
  • the first cup is placed with a blue light-emitting chip, and the first cup is filled with a red-emitting phosphor mixed with silica gel, which is a silicate or a nitride or a quantum dot. Or sulfide;
  • a green light emitting chip is placed in the second bowl, and the second bowl is filled with silica gel and scattering particles.
  • the bottom of the bracket includes a metal bracket
  • the inner bottom of the first cup includes a first wire and a first metal bracket
  • the first metal bracket is a part of the metal bracket
  • the blue The color light emitting chip is disposed on the first metal bracket
  • the first wire is electrically connected to the blue light emitting chip and the first metal bracket, respectively.
  • the inner bottom of the second cup includes a second wire and a second metal bracket, the second metal bracket is a part of the metal bracket, and the green light emitting chip is disposed at the second On the metal bracket, the second wires are electrically connected to the green light emitting chip and the second metal bracket, respectively.
  • An LED package structure comprising:
  • the first cup is placed with a blue light-emitting chip, and the first cup is filled with a red-emitting phosphor mixed with the silica gel;
  • a green light emitting chip is placed in the second bowl, and the second cup is filled with silica gel.
  • the second bowl is also filled with scattering particles.
  • the red luminescent phosphor is a silicate or a nitride or a quantum dot or a sulfide.
  • the bottom of the bracket includes a metal bracket
  • the inner bottom of the first cup includes a first wire and a first metal bracket
  • the first metal bracket is a part of the metal bracket
  • the blue The color light emitting chip is disposed on the first metal bracket
  • the first wire is electrically connected to the blue light emitting chip and the first metal bracket, respectively.
  • the inner bottom of the second cup includes a second wire and a second metal bracket, the second metal bracket is a part of the metal bracket, and the green light emitting chip is disposed at the second On the metal bracket, the second wires are electrically connected to the green light emitting chip and the second metal bracket, respectively.
  • a liquid crystal display device includes a backlight and a liquid crystal display panel, wherein the backlight comprises a light emitting diode LED package structure, and the LED package structure comprises:
  • the first cup is placed with a blue light-emitting chip, and the first cup is filled with a red-emitting phosphor mixed with the silica gel;
  • a green light emitting chip is placed in the second bowl, and the second cup is filled with silica gel.
  • the second bowl is filled with scattering particles.
  • the red phosphor is a silicate or a nitride or a quantum dot or a sulfide.
  • the bottom of the holder includes a metal bracket
  • the bottom portion of the first cup includes a first wire and a first metal bracket
  • the first metal bracket is a part of the metal bracket
  • the blue The color light emitting chip is disposed on the first metal bracket
  • the first wire is electrically connected to the blue light emitting chip and the first metal bracket, respectively.
  • the inner bottom of the second cup includes a second wire and a second metal bracket, the second metal bracket is a part of the metal bracket, and the green light emitting chip is disposed at the second On the metal bracket, the second wires are electrically connected to the green light emitting chip and the second metal bracket, respectively.
  • the LED package structure and the liquid crystal display device provided by the present invention, the blue light emitting chip B chip and the green light emitting chip G
  • the chips are respectively packaged in two different cups, and the cups encapsulating the blue light-emitting chip B chip are also filled with a red-emitting phosphor R phosphor mixed with the silica gel, thereby avoiding the prior art R.
  • the phosphor absorbs G light, and most of the technical problems of G light energy loss improve the luminous efficiency of the entire LED.
  • FIG. 1 is a schematic structural view of an LED package provided by the present invention.
  • FIG. 2 is a schematic diagram of another LED package structure provided by the present invention.
  • FIG. 3 is a schematic structural view of a metal bracket in an LED package structure provided by the present invention.
  • FIG. 4 is another schematic structural diagram of a metal bracket in an LED package structure provided by the present invention.
  • FIG. 5 is a schematic structural diagram of a liquid crystal display device according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of an LED package according to an embodiment of the present invention, wherein the LED package structure includes:
  • a support 103 carrying the first cup 101 and the second cup 102;
  • first cup 101 is placed with a blue light-emitting chip 104, and the first cup 101 is filled with a red-emitting phosphor 105 mixed with silica gel;
  • a green light emitting chip 106 is placed in the second bowl 102, and the second bowl 102 is filled with silica gel.
  • the red luminescent phosphor 105 can be a silicate silicate or a nitride nitride or a quantum dot Quantum. Dots or materials such as sulfides.
  • the LED package structure provided by the present invention has a blue light emitting chip (B chip) 104 and a green light emitting chip (G).
  • Chips 106 are respectively packaged in two different cups, and the first cup 101 enclosing the blue light-emitting chip 104 is also filled with a red-emitting phosphor mixed with silica gel (R) Phosphorus 105, the second cup 102 enclosing the green light-emitting chip 106 has no luminescent phosphor, and is only filled with silica gel (not shown in FIG.
  • the red luminescent phosphor 105 absorbs G light, and the technical problem of most G light energy loss improves the luminous efficiency of the entire LED.
  • FIG. 2 is a schematic diagram of another LED package structure provided by the present invention.
  • the second cup 102 is further filled with scattering particles 107.
  • the bracket 103 includes a plastic bracket 1031 and a metal bracket 1032, wherein the plastic bracket 1031 is disposed on the first bowl 101 and the second bowl 102. Between the cups, the metal bracket 1032 is disposed at the bottom of the first cup 101 and the second cup 102, that is, at the bottom of the bracket 103.
  • FIG. 3 is a schematic diagram showing the arrangement of the metal bracket 1032 in the LED package structure.
  • the bottom of the first cup 101 includes a first wire 1011 and a first a metal bracket, wherein the first metal bracket is a part of the metal bracket 1032; the bottom of the second bowl 102 includes a second wire 1021 and a second metal bracket, and the second metal bracket is also A portion of the metal bracket 1032, as shown in FIG. a and b are the first metal brackets, and c and d are the second metal brackets.
  • the blue light emitting chip 104 is disposed on the first metal bracket, and the first wire 1011 is electrically connected to the blue light emitting chip 104 and the first metal bracket, respectively.
  • the blue light emitting chip 104 is disposed on the first metal bracket a, and the first wire 1011 is disposed on the blue light emitting chip 104, and the first wire 1011 is pinned.
  • the first metal bracket a is connected, and the other pin is connected to the first metal bracket b.
  • the green light emitting chip 106 is disposed on the second metal bracket, and the second wire 1021 is electrically connected to the green light emitting chip 106 and the second metal bracket, respectively.
  • the green light emitting chip 106 is disposed on the second metal bracket d
  • the second wire 1021 is disposed on the green light emitting chip 106
  • the second wire 1021 is a pin and a second metal bracket. c is connected and the other pin is connected to the second metal bracket d.
  • the first metal bracket b may extend through the intermediate plastic bracket 1031 region to the lower side of the second metal bracket d, and the second metal bracket c may also pass through the intermediate plastic
  • the region of the bracket 1031 is extended above the first metal bracket a, as shown in FIG. 4, which is another schematic structural diagram of the metal bracket 1032 in the LED package structure, wherein the metal bracket is as shown in FIG. 103 is disposed in the middle of the bottom of the package structure, which can increase the strength of the package structure and is not easy to break.
  • the metal bracket 103 and the wire of the embodiment can be further disposed.
  • the first wire 1011 can be connected to the first metal bracket a and the other pin can be connected to the second metal bracket c.
  • the second wire 1021 is connected to the second metal bracket b by one pin, and the other pin is connected to the second metal bracket d.
  • FIG. 3 and FIG. 4 are exemplified, and the invention is not limited.
  • the blue light emitting chip 104 and the green light emitting chip 106 are respectively packaged in two different cups, and the blue light emitting chip 104 and the green light emitting chip 106 are independently driven, specifically Pulse width modulation (PWM, Pulse-Width Modulation)
  • PWM Pulse width modulation
  • the drive mode adjusts the duty cycle of the LED drive current to adjust the chromaticity.
  • the two chips are connected in parallel or in series, and can not respectively give different driving currents or duty ratios of the two LEDs.
  • the present invention finely adjusts the driving current. Separate driving of the blue light emitting chip 104 and the green light emitting chip 106 can be realized. At the same time, the chip independent driving mode of the LED package structure can also be applied to the timing driving backlight field to realize color timing display.
  • the liquid crystal module satisfies the requirements of the manufacturer for the white point chromaticity.
  • the LED is filled with the silica gel mixed with the phosphor and then centrifuged, thereby accelerating the precipitation of the LED phosphor and increasing the yield of the bin in the chromaticity.
  • the LED package structure provided by the present invention has a blue light emitting chip (B chip) 104 and a green light emitting chip (G).
  • Chips 106 are respectively packaged in two different cups, and the first cup 101 enclosing the blue light-emitting chip 104 is also filled with a red-emitting phosphor mixed with silica gel (R) Phosphorus 105, thereby avoiding the absorption of G light by the red luminescent phosphor 105 in the existing cup, and the technical problem of most G light energy loss improves the luminous efficiency of the entire LED.
  • R silica gel
  • separate driving of the blue light emitting chip 104 and the green light emitting chip 106 can be achieved by fine adjustment of the driving current.
  • the main application of the invention is common with ordinary RGB trichromatic CF LCD high color gamut backlight field and backlight field of LCD display device used for color timing display.
  • the embodiment of the present invention further provides a liquid crystal display device including the LED package structure.
  • the meaning of the noun is the same as that in the above LED package structure.
  • FIG. 5 is a schematic structural diagram of a liquid crystal display device according to an embodiment of the present invention, including a backlight 501 and a liquid crystal display panel 502, wherein the backlight 501 includes an LED package structure 503, and the LED package structure 503 can refer to the LED package structure as shown in FIG. 1 and FIG. 2, including:
  • bracket 103 carrying the first cup 101 and the second cup 102;
  • first cup 101 is placed with a blue light-emitting chip 104, and the first cup 101 is filled with a red-emitting phosphor 105 mixed with silica gel;
  • a green light emitting chip 106 is placed in the second bowl 102, and the second bowl 102 is filled with silica gel.
  • the red luminescent phosphor 105 can be a silicate silicate or a nitride nitride or a quantum dot Quantum. Dots or materials such as sulfides.
  • the second bowl 102 is further filled with scattering particles 107.
  • the bracket 103 comprises a plastic bracket 1031 and a metal bracket 1032, wherein the plastic bracket 1031 is disposed between the first cup 101 and the cup of the second cup 102, the metal The bracket 1032 is disposed at the bottom of the first cup 101 and the second cup 102, that is, at the bottom of the bracket 103.
  • FIG. 3 is a schematic diagram showing the arrangement of the metal bracket 1032 in the LED package structure.
  • the bottom of the first cup 101 includes a first wire 1011 and a first a metal bracket, wherein the first metal bracket is a part of the metal bracket 1032; the bottom of the second bowl 102 includes a second wire 1021 and a second metal bracket, and the second metal bracket is also A portion of the metal bracket 1032, as shown in FIG. a and b are the first metal brackets, and c and d are the second metal brackets.
  • the blue light emitting chip 104 is disposed on the first metal bracket, and the first wire 1011 is electrically connected to the blue light emitting chip 104 and the first metal bracket, respectively.
  • the blue light emitting chip 104 is disposed on the first metal bracket a, and the first wire 1011 is disposed on the blue light emitting chip 104, and the first wire 1011 is pinned.
  • the first metal bracket a is connected, and the other pin is connected to the first metal bracket b.
  • the green light emitting chip 106 is disposed on the second metal bracket, and the second wire 1021 is electrically connected to the green light emitting chip 106 and the second metal bracket, respectively.
  • the green light emitting chip 106 is disposed on the second metal bracket d
  • the second wire 1021 is disposed on the green light emitting chip 106
  • the second wire 1021 is a pin and a second metal bracket. c is connected and the other pin is connected to the second metal bracket d.
  • the first metal bracket b may extend through the intermediate plastic bracket 1031 region to the lower side of the second metal bracket d, and the second metal bracket c may also pass through the intermediate plastic
  • the region of the bracket 1031 is extended above the first metal bracket a, as shown in FIG. 4, which is another schematic structural diagram of the metal bracket 1032 in the LED package structure, wherein the metal bracket is as shown in FIG. 103 is disposed in the middle of the bottom of the package structure, which can increase the strength of the package structure and is not easy to break.
  • the metal bracket 103 and the wire of the embodiment can be further disposed.
  • the first wire 1011 can be connected to the first metal bracket a and the other pin can be connected to the second metal bracket c.
  • the second wire 1021 is connected to the second metal bracket b by one pin, and the other pin is connected to the second metal bracket d.
  • FIG. 3 and FIG. 4 are exemplified, and the invention is not limited.
  • the blue light emitting chip 104 and the green light emitting chip 106 are respectively packaged in two different cups, and the blue light emitting chip 104 and the green light emitting chip 106 are independently driven, specifically Pulse width modulation (PWM, Pulse-Width Modulation)
  • PWM Pulse width modulation
  • the drive mode adjusts the duty cycle of the LED drive current to adjust the chromaticity.
  • the two chips are connected in parallel or in series, and the driving currents of different driving currents or duty ratios of the two LEDs cannot be respectively given.
  • the invention can be finely adjusted by the driving current.
  • the individual driving of the blue light emitting chip 104 and the green light emitting chip 106 is realized.
  • the chip independent driving mode of the LED package structure can also be applied to the timing driving backlight field to realize color timing display.
  • the liquid crystal module satisfies the requirements of the manufacturer for the white point chromaticity.
  • the LED is filled with the silica gel mixed with the phosphor and then centrifuged, thereby accelerating the precipitation of the LED phosphor and increasing the yield of the bin in the chromaticity.
  • the blue light emitting chip 104 and the green light emitting chip 106 are respectively packaged in two different cups, and the blue light emitting chip 104 is packaged.
  • a bowl of cup 101 is also filled with red luminescent phosphor 105 mixed with silica gel, thereby avoiding the absorption of G light by the red luminescent phosphor 105 in the existing cup, and the technical problem of most G light energy loss improves the overall LED illuminating. effectiveness.
  • separate driving of the blue light emitting chip 104 and the green light emitting chip 106 can be achieved by fine adjustment of the driving current.
  • the main application of the invention is common with ordinary RGB trichromatic CF LCD high color gamut backlight field and backlight field of LCD display device used for color timing display.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED封装结构，包括：一第一碗杯（101）、一第二碗杯（102）以及承载第一碗杯（101）和第二碗杯（102）的支架（103）；其中第一碗杯（101）内放置有蓝色发光芯片（104），且填充有与硅胶混合的红色发光荧光粉（105）；以及第二碗杯（102）内放置有绿色发光芯片（106），且填充有硅胶。避免了现有技术中R phosphor吸收G光，大部分G光能量损耗的技术问题，提高了整个LED发光效率。

Description

一种LED封装结构及液晶显示装置 技术领域
本发明涉及显示面板技术领域，特别涉及一种LED封装结构及液晶显示装置。
 背景技术
薄膜晶体管液晶显示器（TFT-LCD，Thin Film Transistor- Liquid Crystal Display）是目前唯一在亮度、对比度、功耗、寿命、体积和重量等综合性能上全面赶上和超过阴极射线管显示器的显示器件，它具有性能优良、大规模生产特性好以及自动化程度高等优点，迅速成为目前的主流产品。
现有技术中，彩色TFT-LCD显示器件主要是以采用黄光荧光粉的发光二极管（LED，Light Emitting Diode）作为背光源，但采用黄光荧光粉的LED搭配LCD面板后，通常色彩饱和度不够高。为进一步提高色域，实现LCD显示器更鲜艳的色彩表现，目前在LED背光源上主要采用B chip（蓝色发光芯片）+RG phosphor（红色绿色发光荧光粉），BR chip +G phosphor，BG chip +R phosphor等形式。
但是在实践中，发明人发现现有技术至少存在以下问题：
目前的BG chip +R phosphor ，虽然有采用BG chip分别独立驱动的形式，但是LED能效普遍不高。其中一个重要的原因是由于目前的BG+R phosphor LED 的BG chip 和R phosphor都封装在同一个碗杯（cup）中，这样会造成R phosphor吸收G chip发出的G光，但由于G光激发R phosphor的效率很低，导致很大部分G光能量损耗，且G光对LED的光通量影响很大。
故，有必要提出一种新的技术方案，以解决上述技术问题。
 技术问题
本发明的目的在于提供一种LED封装结构及液晶显示装置，提高了整个LED发光效率。
 技术解决方案
为解决上述问题，本发明实施例的技术方案如下：
一种LED封装结构，其中包括：
一第一碗杯；
一第二碗杯；以及
承载所述第一碗杯和所述第二碗杯的支架；
其中所述第一碗杯内放置有蓝色发光芯片，且所述第一碗杯内填充有与硅胶混合的红色发光荧光粉，所述红色发光荧光粉为硅酸盐或者氮化物或者量子点或者硫化物；
所述第二碗杯内放置有绿色发光芯片，且所述第二碗杯内填充有硅胶以及散射颗粒。
在上述LED封装结构中，所述支架底部包括金属支架，所述第一碗杯内底部包括第一导线和第一金属支架，所述第一金属支架为所述金属支架的一部分，所述蓝色发光芯片设置在所述第一金属支架上，所述第一导线分别与所述蓝色发光芯片和所述第一金属支架电性连接。
在上述LED封装结构中，所述第二碗杯内底部包括第二导线和第二金属支架，所述第二金属支架为所述金属支架的一部分，所述绿色发光芯片设置在所述第二金属支架上，所述第二导线分别与所述绿色发光芯片和所述第二金属支架电性连接。
为解决上述问题，本发明实施例的技术方案如下：
一种LED封装结构，其中，包括：
一第一碗杯；
一第二碗杯；以及
承载所述第一碗杯和所述第二碗杯的支架；
其中所述第一碗杯内放置有蓝色发光芯片，且所述第一碗杯内填充有与硅胶混合的红色发光荧光粉；
所述第二碗杯内放置有绿色发光芯片，且所述第二碗杯内填充有硅胶。
在上述LED封装结构中，所述第二碗杯内还填充有散射颗粒。
在上述LED封装结构中，所述红色发光荧光粉为硅酸盐或者氮化物或者量子点或者硫化物。
在上述LED封装结构中，所述支架底部包括金属支架，所述第一碗杯内底部包括第一导线和第一金属支架，所述第一金属支架为所述金属支架的一部分，所述蓝色发光芯片设置在所述第一金属支架上，所述第一导线分别与所述蓝色发光芯片和所述第一金属支架电性连接。
在上述LED封装结构中，所述第二碗杯内底部包括第二导线和第二金属支架，所述第二金属支架为所述金属支架的一部分，所述绿色发光芯片设置在所述第二金属支架上，所述第二导线分别与所述绿色发光芯片和所述第二金属支架电性连接。
为解决上述问题，本发明实施例的技术方案如下：
一种液晶显示装置，包括背光源与液晶显示面板，其中所述背光源包括发光二极管LED封装结构，所述LED封装结构包括：
一第一碗杯；
一第二碗杯；以及
承载所述第一碗杯和所述第二碗杯的支架；
其中所述第一碗杯内放置有蓝色发光芯片，且所述第一碗杯内填充有与硅胶混合的红色发光荧光粉；
所述第二碗杯内放置有绿色发光芯片，且所述第二碗杯内填充有硅胶。
在上述液晶显示装置中，所述第二碗杯内还填充有散射颗粒。
在上述液晶显示装置中，所述红光荧光粉为硅酸盐或者氮化物或者量子点或者硫化物。
在上述液晶显示装置中，所述支架底部包括金属支架，所述第一碗杯内底部包括第一导线和第一金属支架，所述第一金属支架为所述金属支架的一部分，所述蓝色发光芯片设置在所述第一金属支架上，所述第一导线分别与所述蓝色发光芯片和所述第一金属支架电性连接。
在上述液晶显示装置中，所述第二碗杯内底部包括第二导线和第二金属支架，所述第二金属支架为所述金属支架的一部分，所述绿色发光芯片设置在所述第二金属支架上，所述第二导线分别与所述绿色发光芯片和所述第二金属支架电性连接。
 有益效果
相对现有技术，本发明提供的LED封装结构及液晶显示装置，将蓝色发光芯片B chip和绿色发光芯片G chip分别封装在两个不同的碗杯中，并且封装有蓝色发光芯片B chip的碗杯中还填充有与硅胶混合的红色发光荧光粉R phosphor，从而避免了现有技术中R phosphor吸收G光，大部分G光能量损耗的技术问题，提高了整个LED发光效率。
 附图说明
图1为本发明提供的一种LED封装结构示意图；
图2为本发明提供的另一LED封装结构示意图；
图3为本发明提供的LED封装结构中金属支架的结构简图；
图4为本发明提供的LED封装结构中金属支架的另一结构简图；
图5为本发明实施例提供的一种液晶显示装置结构示意图。
 本发明的最佳实施方式
请参照图式，其中相同的组件符号代表相同的组件，本发明的原理是以实施在一适当的运算环境中来举例说明。以下的说明是基于所例示的本发明具体实施例，其不应被视为限制本发明未在此详述的其它具体实施例。
请参考图1，图1为本发明实施例提供的一种LED封装结构示意图，其中，所述LED封装结构，包括：
一第一碗杯101；
一第二碗杯102；以及
承载所述第一碗杯101和所述第二碗杯102的支架103；
其中所述第一碗杯101内放置有蓝色发光芯片104，且所述第一碗杯101内填充有与硅胶混合的红色发光荧光粉105；
所述第二碗杯102内放置有绿色发光芯片106，且所述第二碗杯102内填充有硅胶。
可以理解的是，所述红色发光荧光粉105可以为硅酸盐silicate或者氮化物nitride或者量子点Quantum dots或者硫化物sulfide等材料。
如图1所示，本发明提供的LED封装结构，将蓝色发光芯片（B chip）104和绿色发光芯片（G chip）106分别封装在两个不同的碗杯中，并且封装有蓝色发光芯片104的第一碗杯101中还填充有与硅胶混合的红色发光荧光粉（R phosphor）105，封装有绿色发光芯片106的第二碗杯102内无发光荧光粉，只填充硅胶（图1中未示出），由于蓝色发光芯片104和绿色发光芯片106独立封装，从而避免了现有碗杯中红色发光荧光粉105吸收G光，大部分G光能量损耗的技术问题，提高了整个LED发光效率。
请一并参考图2，图2为本发明提供的另一LED封装结构示意图，优选的，所述第二碗杯102内还填充有散射颗粒107。
可以理解的是，本实施例中封装有绿色发光芯片106的第二碗杯102内无发光荧光粉，填充有与散射颗粒107混合的硅胶；由于散射颗粒可以增大G光的发散角，从而可以缩短G光与B光R光的混光距离，进一步的提高了LED的发光效率。
进一步优选的，如图1和图2所示，所述支架103包括塑料支架1031和金属支架1032，其中，所述塑料支架1031设置于所述第一碗杯101和所述第二碗杯102的杯体之间，所述金属支架1032设置于所述第一碗杯101和所述第二碗杯102的底部，也就是设置于支架103的底部。
在一种可选的实施方式中，如图3所示，图3为所述LED封装结构中金属支架1032的设置结构简图，所述第一碗杯101内底部包括第一导线1011和第一金属支架，其中所述第一金属支架为所述金属支架1032的一部分；所述第二碗杯102内底部包括第二导线1021和第二金属支架，所述第二金属支架也为所述金属支架1032的一部分，如图3所示， a和b为所述第一金属支架，c和d为所述第二金属支架。
在所述第一碗杯101内，所述蓝色发光芯片104设置在所述第一金属支架上，所述第一导线1011分别与所述蓝色发光芯片104和所述第一金属支架电性连接，如图3所示，所述蓝色发光芯片104设置在所述第一金属支架a上，所述第一导线1011设置于蓝色发光芯片104上，第一导线1011一引脚与第一金属支架a连接，另一引脚与第一金属支架b连接。
在所述第二碗杯102内，所述绿色发光芯片106设置在所述第二金属支架上，所述第二导线1021分别与所述绿色发光芯片106和所述第二金属支架电性连接，如图3所示，所述绿色发光芯片106设置在所述第二金属支架d上，所述第二导线1021设置于绿色发光芯片106上，第二导线1021一引脚与第二金属支架c连接，另一引脚与第二金属支架d连接。
在一种可选的实施方式中，所述第一金属支架b可以通过中间塑料支架1031区域，伸长至所述第二金属支架d的下方，所述第二金属支架c也可以通过中间塑料支架1031区域，伸长至所述第一金属支架a的上方，如图4所示，为所述LED封装结构中金属支架1032的另一设置结构简图，其中，如图4所示金属支架103设置在该封装结构底部中间，可以增加该封装结构的强度，不易折断。
可以理解的是，本实施例金属支架103和导线还可以进行其他的设置，例如可以第一导线1011一引脚与第一金属支架a连接，另一引脚与第二金属支架c连接，对应的，第二导线1021一引脚与第二金属支架b连接，另一引脚与第二金属支架d连接，此处仅以图3和图4进行举例说明，不构成对发明的限定。
更进一步优选的，本发明实施例，将蓝色发光芯片104和绿色发光芯片106分别封装在两个不同的碗杯中，且对蓝色发光芯片104和绿色发光芯片106采取独立驱动，具体的，可以利用脉宽调变 (PWM，Pulse-Width Modulation)驱动方式调节LED驱动电流的占空比来调节色度，例如，LED CIE色坐标的y值偏小y=A，而规格要求y 至少要大于A，则可以把驱动绿色发光芯片106的电流占空比调高一点即可。相比于现有的双晶LED基本都是两个芯片并联在一起或者串联在一起，并不能分别给两颗LED不同的驱动电流或占空比的驱动方式，本发明通过驱动电流的细微调整可实现对蓝色发光芯片104和绿色发光芯片106的单独驱动，同时，所述LED封装结构的芯片独立驱动方式还可应用于时序驱动的背光领域以实现彩色时序显示。
另容易想到的是，为了使TFT-LCD 液晶模组满足厂商对白点色度的要求，在LED中填入混有荧光粉的硅胶后进行离心沉淀，从而可以加速LED荧光粉的沉淀，也可以增加色度中bin的良率。
有上述可知，本发明提供的LED封装结构，将蓝色发光芯片（B chip）104和绿色发光芯片（G chip）106分别封装在两个不同的碗杯中，并且封装有蓝色发光芯片104的第一碗杯101中还填充有与硅胶混合的红色发光荧光粉（R phosphor）105，从而避免了现有碗杯中红色发光荧光粉105吸收G光，大部分G光能量损耗的技术问题，提高了整个LED发光效率。进一步的，通过驱动电流的细微调整可实现对蓝色发光芯片104和绿色发光芯片106的单独驱动。本发明主要应用与普通的具有RGB三色CF的 LCD高色域背光源领域和应用于彩色时序显示的LCD显示器件的背光领域。
为便于更好的实施本发明实施例提供的LED封装结构，本发明实施例还提供一种包含所述LED封装结构的液晶显示装置。其中名词的含义与上述LED封装结构中相同，具体实现细节可以参考LED封装结构实施例中的说明。
请参考图5，图5为本发明实施例提供的一种液晶显示装置结构示意图，包括背光源501与液晶显示面板502，其中，所述背光源501包括LED封装结构503，所述LED封装结构503可参考如1和图2所示的LED封装结构，包括：
一第一碗杯101；
一第二碗杯102；
以及承载所述第一碗杯101和所述第二碗杯102的支架103；
其中所述第一碗杯101内放置有蓝色发光芯片104，且所述第一碗杯101内填充有与硅胶混合的红色发光荧光粉105；
所述第二碗杯102内放置有绿色发光芯片106，且所述第二碗杯102内填充有硅胶。
可以理解的是，所述红色发光荧光粉105可以为硅酸盐silicate或者氮化物nitride或者量子点Quantum dots或者硫化物sulfide等材料。
优选的，所述第二碗杯102内还填充有散射颗粒107。
可以理解的是，本实施例中封装有绿色发光芯片106的第二碗杯102内无发光荧光粉，填充有与散射颗粒107混合的硅胶；由于散射颗粒可以增大G光的发散角，从而可以缩短G光与B光R光的混光距离，进一步的提高了LED的发光效率。
进一步优选的，所述支架103包括塑料支架1031和金属支架1032，其中，所述塑料支架1031设置于所述第一碗杯101和所述第二碗杯102的杯体之间，所述金属支架1032设置于所述第一碗杯101和所述第二碗杯102的底部，也就是设置于支架103的底部。
在一种可选的实施方式中，如图3所示，图3为所述LED封装结构中金属支架1032的设置结构简图，所述第一碗杯101内底部包括第一导线1011和第一金属支架，其中所述第一金属支架为所述金属支架1032的一部分；所述第二碗杯102内底部包括第二导线1021和第二金属支架，所述第二金属支架也为所述金属支架1032的一部分，如图3所示， a和b为所述第一金属支架，c和d为所述第二金属支架。
在所述第一碗杯101内，所述蓝色发光芯片104设置在所述第一金属支架上，所述第一导线1011分别与所述蓝色发光芯片104和所述第一金属支架电性连接，如图3所示，所述蓝色发光芯片104设置在所述第一金属支架a上，所述第一导线1011设置于蓝色发光芯片104上，第一导线1011一引脚与第一金属支架a连接，另一引脚与第一金属支架b连接。
在所述第二碗杯102内，所述绿色发光芯片106设置在所述第二金属支架上，所述第二导线1021分别与所述绿色发光芯片106和所述第二金属支架电性连接，如图3所示，所述绿色发光芯片106设置在所述第二金属支架d上，所述第二导线1021设置于绿色发光芯片106上，第二导线1021一引脚与第二金属支架c连接，另一引脚与第二金属支架d连接。
在一种可选的实施方式中，所述第一金属支架b可以通过中间塑料支架1031区域，伸长至所述第二金属支架d的下方，所述第二金属支架c也可以通过中间塑料支架1031区域，伸长至所述第一金属支架a的上方，如图4所示，为所述LED封装结构中金属支架1032的另一设置结构简图，其中，如图4所示金属支架103设置在该封装结构底部中间，可以增加该封装结构的强度，不易折断。
可以理解的是，本实施例金属支架103和导线还可以进行其他的设置，例如可以第一导线1011一引脚与第一金属支架a连接，另一引脚与第二金属支架c连接，对应的，第二导线1021一引脚与第二金属支架b连接，另一引脚与第二金属支架d连接，此处仅以图3和图4进行举例说明，不构成对发明的限定。
更进一步优选的，本发明实施例，将蓝色发光芯片104和绿色发光芯片106分别封装在两个不同的碗杯中，且对蓝色发光芯片104和绿色发光芯片106采取独立驱动，具体的，可以利用脉宽调变 (PWM，Pulse-Width Modulation)驱动方式调节LED驱动电流的占空比来调节色度，例如，LED CIE色坐标的y值偏小y=A，而规格要求y 至少要大于A，则可以把驱动绿色发光芯片106的电流占空比调高一点即可。相对于现有的双晶LED基本都是两个芯片并联在一起或者串联在一起，并不能分别给两颗LED不同的驱动电流或占空比的驱动方式，本发明通过驱动电流的细微调整可实现对蓝色发光芯片104和绿色发光芯片106的单独驱动，同时，所述LED封装结构的芯片独立驱动方式还可应用于时序驱动的背光领域以实现彩色时序显示。
另容易想到的是，为了使TFT-LCD 液晶模组满足厂商对白点色度的要求，在LED中填入混有荧光粉的硅胶后进行离心沉淀，从而可以加速LED荧光粉的沉淀，也可以增加色度中bin的良率。
由上述可知，本发明提供的液晶显示装置，其LED封装结构中，将蓝色发光芯片104和绿色发光芯片106分别封装在两个不同的碗杯中，并且封装有蓝色发光芯片104的第一碗杯101中还填充有与硅胶混合的红色发光荧光粉105，从而避免了现有碗杯中红色发光荧光粉105吸收G光，大部分G光能量损耗的技术问题，提高了整个LED发光效率。进一步的，通过驱动电流的细微调整可实现对蓝色发光芯片104和绿色发光芯片106的单独驱动。本发明主要应用与普通的具有RGB三色CF的 LCD高色域背光源领域和应用于彩色时序显示的LCD显示器件的背光领域。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见上文相关的详细描述，此处不再赘述。
本领域技术人员将认识到，本文所使用的词语“优选的”意指用作实例、示例或例证。奉文描述为“优选的”任意方面或设计不必被解释为比其他方面或设计更有利。相反，词语“优选的”的使用旨在以具体方式提出概念。如本申请中所使用的术语“或”旨在意指包含的“或”而非排除的“或”。即，除非另外指定或从上下文中清楚，“X使用101或102”意指自然包括排列的任意一个。即，如果X使用101；X使用102;或X使用101和102二者，则“X使用101或102”在前述任一示例中得到满足。
而且，尽管已经相对于一个或多个实现方式示出并描述了本公开，但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本公开包括所有这样的修改和变型，并且仅由所附权利要求的范围限制。特别地关于由上述组件（例如元件、资源等）执行的各种功能，用于描述这样的组件的术语旨在对应于执行所述组件的指定功能（例如其在功能上是等价的）的任意组件（除非另外指示），即使在结构上与执行本文所示的本公开的示范性实现方式中的功能的公开结构不等同。此外，尽管本公开的特定特征已经相对于若干实现方式中的仅一个被公开，但是这种特征可以与如可以对给定或特定应用而言是期望和有利的其他实现方式的一个或多个其他特征组合。而且，就术语“包括”、“具有”、“含有”或其变形被用在具体实施方式或权利要求中而言，这样的术语旨在以与术语“包含”相似的方式包括。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (13)

  1. 一种LED封装结构，其中包括：
    一第一碗杯；
    一第二碗杯；以及
    承载所述第一碗杯和所述第二碗杯的支架；
    其中所述第一碗杯内放置有蓝色发光芯片，且所述第一碗杯内填充有与硅胶混合的红色发光荧光粉，所述红色发光荧光粉为硅酸盐或者氮化物或者量子点或者硫化物；
    所述第二碗杯内放置有绿色发光芯片，且所述第二碗杯内填充有硅胶以及散射颗粒。
  2. 根据权利要求1所述的LED封装结构，其中所述支架底部包括金属支架，所述第一碗杯内底部包括第一导线和第一金属支架，所述第一金属支架为所述金属支架的一部分，所述蓝色发光芯片设置在所述第一金属支架上，所述第一导线分别与所述蓝色发光芯片和所述第一金属支架电性连接。
  3. 根据权利要求2所述的LED封装结构，其中所述第二碗杯内底部包括第二导线和第二金属支架，所述第二金属支架为所述金属支架的一部分，所述绿色发光芯片设置在所述第二金属支架上，所述第二导线分别与所述绿色发光芯片和所述第二金属支架电性连接。
  4. 一种LED封装结构，其中包括：
    一第一碗杯；
    一第二碗杯；以及
    承载所述第一碗杯和所述第二碗杯的支架；
    其中所述第一碗杯内放置有蓝色发光芯片，且所述第一碗杯内填充有与硅胶混合的红色发光荧光粉；
    所述第二碗杯内放置有绿色发光芯片，且所述第二碗杯内填充有硅胶。
  5. 根据权利要求4所述的LED封装结构，其中所述第二碗杯内还填充有散射颗粒。
  6. 根据权利要求4所述的LED封装结构，其中所述红色发光荧光粉为硅酸盐或者氮化物或者量子点或者硫化物。
  7. 根据权利要求4所述的LED封装结构，其中所述支架底部包括金属支架，所述第一碗杯内底部包括第一导线和第一金属支架，所述第一金属支架为所述金属支架的一部分，所述蓝色发光芯片设置在所述第一金属支架上，所述第一导线分别与所述蓝色发光芯片和所述第一金属支架电性连接。
  8. 根据权利要求7所述的LED封装结构，其中所述第二碗杯内底部包括第二导线和第二金属支架，所述第二金属支架为所述金属支架的一部分，所述绿色发光芯片设置在所述第二金属支架上，所述第二导线分别与所述绿色发光芯片和所述第二金属支架电性连接。
  9. 一种液晶显示装置，包括背光源与液晶显示面板，其中所述背光源包括发光二极管LED封装结构，所述LED封装结构包括：
    一第一碗杯；
    一第二碗杯；以及
    承载所述第一碗杯和所述第二碗杯的支架；
    其中所述第一碗杯内放置有蓝色发光芯片，且所述第一碗杯内填充有与硅胶混合的红色发光荧光粉；
    所述第二碗杯内放置有绿色发光芯片，且所述第二碗杯内填充有硅胶。
  10. 根据权利要求9所述的液晶显示装置，其中所述第二碗杯内还填充有散射颗粒。
  11. 根据权利要求9所述的液晶显示装置，其中 所述红光荧光粉为硅酸盐或者氮化物或者量子点或者硫化物。
  12. 根据权利要求9所述的液晶显示装置，其中所述支架底部包括金属支架，所述第一碗杯内底部包括第一导线和第一金属支架，所述第一金属支架为所述金属支架的一部分，所述蓝色发光芯片设置在所述第一金属支架上，所述第一导线分别与所述蓝色发光芯片和所述第一金属支架电性连接。
  13. 根据权利要求12所述的液晶显示装置，其中所述第二碗杯内底部包括第二导线和第二金属支架，所述第二金属支架为所述金属支架的一部分，所述绿色发光芯片设置在所述第二金属支架上，所述第二导线分别与所述绿色发光芯片和所述第二金属支架电性连接。
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