WO2015185167A1

WO2015185167A1 - Building block, building block assembly, and method for producing a building block

Info

Publication number: WO2015185167A1
Application number: PCT/EP2014/075117
Authority: WO
Inventors: Roland KÜPFER; Nouhad Bachnak; Waldemar HONSTEIN
Original assignee: Multiple Dimensions Ag
Priority date: 2014-06-03
Filing date: 2014-11-20
Publication date: 2015-12-10
Also published as: TW201545794A; CH709778A2

Abstract

A building block (100) comprises a main member (102) with coupling elements for removably coupling the building block (100) to at least one other building block. The building block further comprises a plurality of strip conductors (106, 106'), at least one of which is applied to each of two opposite surfaces of the building block (100) and which can be electrically connected to strip conductors on adjacent other coupled building blocks.

Description

Device, device assembly and method of manufacturing a device

The present invention relates to a device, a device assembly and a method for manufacturing a device according to independent claims 1, 9 and 12.

The basic idea of building something with building blocks has a long tradition in the toy industry. Blocks are known as individual modules which can be easily interconnected to thereby build models on a reduced scale. These building blocks can be stacked or coupled one above the other, side by side or in each case offset in order to emulate any objects or models.

The blocks each comprise coupling elements by means of which the blocks can be removed by frictional connection

can be coupled together. exemplary

Building blocks can assume a cuboid shape of different extent, with which, for example, walls of a house to be imitated are constructed in miniature format. Further exemplary modules can be a

assume flattened slope with which, for example, the saddle roof of the house to be imitated is built. Such building blocks are also known as toys of the "Lego Group", commonly referred to as Lego bricks.With these Lego bricks the imagination knows no bounds, whole Construct miniature worlds. For this purpose, the

Lego bricks are connected in appropriate ways to play on a playful and mentally

challenging way to build entire houses, cities, vehicles, planes, etc.

The concept of building or constructing through

Pinning together building blocks has been enhanced by the desire to incorporate some features such as lighting and drive into the environment. In recent years, the objects to be imitated or designed have become more and more complex, and more and more electrical and / or electronic components have been added, which are integrated in a module. Examples thereof include an electric motor, switches, electrically driven actuators and a plurality of

Lighting units of different brightness and color. In particular, light-emitting diodes (LEDs) have prevailed here. These light-emitting diodes are hereby integrated into individual modular components and are used, for example, to emulate real-appearing headlamps, direction indicators or taillights of vehicles of all kinds to be set up. The use of an electric motor integrated in a module is just as varied and can be used, for example, in real life

Replica of a toy crane to be built. Through the use of electric motors can

For example, playfully lifting loads at the touch of a button, turning over the crane boom, a trolley on the Crane boom are moved and the loads are in turn deposited in a different position. This collection of electrical components, integrated in the

Building blocks, was very successful and led to the development of increasingly complex electronic components, with which, for example, reproduced robots are built whose motion sequences are programmed.

Any electrical or electronic device, e.g. a light emitting diode device or a device with a

integrated miniature processor, of course, needs the power supply. For this it is known that

Cable lines are led out of the respective blocks and each with standardized termination modules

are connected. These completion modules are

For example, directly with a power supply

(For example, 3 volts, 6 volts, 9 volts or 12 volts) connected or can serve as a branch. As a result, complex structures, such as a robot with many actuators, motors and light emitting diodes, can be constructed.

The disadvantage is the wiring itself. On the one hand, the wiring disturbs the appearance of the built-up

Construction and on the other hand increases with growing

Cabling the risk of wiring errors. To the

Finding and eliminating possible cabling errors, the laboriously constructed construction partially

be dismantled, which is complicated and unsatisfactory is. In addition, the wiring is very tedious and time consuming. In certain constructions, even no cabling is possible due to lack of space. Another disadvantage is the high cost of the wiring arrangement. Overall, the principle of simple mating is adversely injured.

The object of the present invention is to provide a device, a device assembly and a method for manufacturing a device, in which the disadvantages of the prior art are solved.

According to the invention, a building block comprises a base body with coupling elements for removably coupling the building block with at least one further building block, furthermore comprises a plurality of conductor tracks, wherein

opposite surfaces of the block in each case at least one conductor track is applied, wherein the

Conductor tracks with respective interconnects of adjacent further coupled modules are electrically connected.

This allows a plurality of electrical or

electronic components without costly and expensive

Wiring to be powered. The current is only applied via printed conductors between the

Power source and the electrical or electronic

Block (pantograph) passed. The conductor tracks are in this case on surfaces of the respective blocks plotted that the respective corresponding tracks of different components electrically

be connected with each other as soon as the building blocks

adjacent to each other, for example, side by side or one above the other, be coupled. Thus, at portions of the package surfaces to which the pattern is applied, viewed over the arrangement of the plurality of packages, a uniform electrical potential is present. The power supply takes place on each provided

Building block, and the connection to the current-decreasing

electrical building block happens simply over that

Pinning the blocks together. The basic principle with

Building something to build something includes now also the electrification.

Preferably, the interconnects are using the MID (Molded Interconnect Device) technology on the

Surfaces applied. The for applying the

MID technology used in interconnects enables high integration even with the smallest dimensions. By applying the MID technology, the

Apply conductor tracks particularly precisely and with high strength to the base body. As a result, a reliable and permanent electrical contact between each coupled together blocks is guaranteed. In addition, MID technology also reduces production costs. Due to the MID technology, it is basically possible to attach the power supply directly to the components, ie to the substrate of the Building blocks, for example, acrylonitrile-butadiene-styrene (ABS) urafasst. After the thermoplastic injection molding of

Blocks are then lasered onto the tracks, these are then galvanized and thus brought to conductivity and possibly equipped with components. The power line can be connected via the mating of these blocks from the power source to the consumer on.

Preferably, the base body comprises an electrical

insulating material, wherein the conductor tracks are electrically insulated from each other by the electrically insulating material. By applying a voltage between the two interconnects, a potential difference is applied between these interconnects, which can be tapped by the aforementioned electrical or electronic device at any point within the device assembly. The assembled components thus simultaneously form a conductor, whereby

advantageously, a separate wiring can be saved. The opposing interconnects are electrically isolated from each other by the substrate or material of the device, such as plastic. Because the applied voltage is a low voltage

(for example, a maximum of 12 volts), no measures must be taken against voltage breakdown. The

Building blocks of the aforementioned type are usually produced or cast by injection molding of thermoplastic material (substrate), which simultaneously excellent insulator and provides sufficient resistance to voltage breakdown.

Preferably, the conductor tracks are applied on the respective surfaces at least circumferentially. Here, at least surface portions at the edge portions or peripheral areas (in plan view) of the respective

Blocks electrically conductive, so that the electrical connection with each adjacent, corresponding blocks can be ensured. Thus, the traces do not need the entire surface on the surfaces

be applied, thereby saving costs.

Preferably, the module comprises at least one

electrical or electronic component. The electrical or electronic components have a low

Current consumption (electrical connections in the

Low current range).

Preferably, the electrical or electronic component comprises at least two electrical inputs, which are each electrically connected to the opposite conductor tracks. In this case, the electrical or

electronic components inside the device

be poured and be electrically connected by conductor sections (Lötfahnen) with the respective opposite conductor tracks. Preferably, the electrical or electronic component comprises a lighting unit, in particular a

Light emitting diode (LED), a switch, a button, an electric motor, a display unit, a

electroacoustic transducer and / or electronic

Switching unit, in particular a miniature processor. Thus, the electrical or electronic components which are integrated in the module can be reliably supplied with voltage without any conductor wire.

This eliminates the annoying, time-consuming and

error-prone work for cabling. In addition, the appearance will not be disturbed and will cost

saved.

Preferably, the device further comprises at least one label applied using MID technology. Another advantage of MID technology is the high-quality labeling of components or elements in general. Thus, currently used adhesive films for labeling the blocks can be saved, their disadvantages in the rapid aging and

insufficient precision. The integration of colors and designs in the design are therefore no limits.

The above object is also achieved by a device arrangement according to independent claim 9. The inventive device arrangement comprises a plurality of coupled components according to one of claims 1 to 8, which are coupled to each other such that on each opposite surfaces of the blocks applied conductor tracks are each electrically connected to each other. This block arrangement offers in addition to advantageous structural or design

Viewpoints also the advantageous possibility that now blocks in which at least one

electrical or electronic component is integrated, can be supplied via the conductor tracks as an electrical conductor easily with electrical power. For this purpose, an electrical voltage is applied between the opposing interconnects of this module only on one of the components. It should be noted that the opposing tracks are electrically isolated from each other by the material of the device. Thus, a current can flow across the tracks and through the respective integrated electrical component, e.g. a light-emitting diode, fHessen. Overall, it is easy to integrate components which are equipped with an electrical component into the component arrangement and at the same time operate them reliably (application of a voltage), without the need for error-prone, time-consuming and expensive cabling. In addition, the appearance of the

Block arrangement not negatively influenced.

Preferably, the package arrangement further comprises

at least one electrical power source for applying a voltage between two on opposite

Surfaces of the respective building blocks applied Interconnects. Thus, the electrical components are reliably supplied with voltage. The applied voltage can include discrete voltages. Alternatively, the voltage may be stepwise variable, for example from 0V to 12V. The block arrangement allows a

Modularization of functions in the building blocks, such as lighting, motor functions, etc., and combines the basic principle of assembling an assembly or a construction by multiple blocks with simultaneous power management structure.

Preferably, the electrical power source comprises a voltage transformer, at least one battery or a rechargeable battery and / or at least one solar cell. As a result, reliable supply of the electrical components is reliably ensured.

The above object is also achieved by a method for producing a device according to one of claims 1 to 8 according to independent claim 12. The inventive method comprises an injection molding of a base body, and an application of at least one

Track on each opposite surfaces of the body. As a result, building blocks are created at a low cost, in which the current is carried out on each block provided, and wherein the

Connection to an electrical component via the

Plugging the blocks happens. Preferably, the traces are formed using the MID technology on the surfaces of the package

applied. A very significant advantage of using the MID technology is in accurately positioning the electrical components, e.g. Lighting units,

especially LEDs, drives, batteries, etc., in the

Blocks. Furthermore, switches, buttons,

Illumination patterns and displays are integrated by the MID technology, directly on the material or substrate of the building blocks.

Preferably, the method comprises applying at least one label to at least one

Surface of the device using MID technology. In contrast to conventional adhesive films, using the MID technology makes it possible to label the components, which is particularly durable.

Embodiments of the present invention will be explained in more detail below with reference to figures. Show it :

Figure 1 is a representation of a block according to the prior art in a perspective view;

FIG. 2 shows a representation of a module according to the invention in perspective view; FIG. 3 shows a representation of the module according to the invention in a further embodiment in FIG

Perspective view;

FIG. 4 shows a representation of the module according to the invention in a further embodiment in FIG

Perspective view;

FIG. 5 shows a representation of the module according to the invention in a further embodiment in FIG

Perspective view;

FIG. 6 shows a block arrangement according to the invention in FIG

Perspective view; and

Figure 7 is a view of a wiring arrangement for

Wiring a built-in a block electrical component according to the prior art.

FIG. 1 shows a module 10 according to the prior art

Technique in a perspective view. This building block 10, also known as Lego stone, is a so-called 3 1

Component of a modular building block system, which can be coupled with other modular building blocks. The module 10 shown in Figure 1 comprises three nubs 12 in a row. This module 10 is hollowed out and comprises in the hollowed-out interior, a plurality of tubes (not shown), which are in the one shown in FIG

Alignment of the block 10 in the vertical direction

extend. These tubes are in this case designed such that they with nubs of a couplable below the block 10 block a frictional connection and

Can produce positive connection. Also outer surfaces of nubs of a building block can be

Inner wall sections of another block by

Frictional connection and positive connection

connect or couple with each other. The blocks are in this case positively connected in the vertical direction, while they form fit in the horizontal direction

are connected.

As already mentioned, the component 10 shown in FIG. 1 is part of a modular system. Other devices may include an I-1 device, a 2-by-2 device, a 4-by-2 device, and so on. Due to the high degree of freedom of the coupling of the modular building blocks with each other, there are no limits to designing or constructing different building block arrangements on a reduced scale, for example houses, vehicles, airplanes, etc. The building blocks can be colored differently, so that also color Aspects can be considered. The module 10 shown in Figure 1 is made of plastic, for example, acrylonitrile-butadiene-styrene (ABS). For the production of the module 10 is suitable

especially a thermoplastic injection molding process. FIG. 2 shows a block 100 according to the invention in a perspective view. The module 100 comprises a main body 102 and three nubs 104 for coupling the

Module 100 with further components (not shown). The front surface and the back surface of the

Base 102 in the orientation shown in the figure each include a conductive trace 106, 106 'of conductive metal.

For applying the conductor tracks 106, 106 ', the MID technology is used. For this purpose, various MID methods can be used, the most common of which are briefly explained below:

In the hot stamping process, the plastic substrate is metallized and structured in one step. With an embossing stamp on which the positive conductor pattern is applied, a copper embossing film with adhesion-promoting

Layer under pressure and heat on the

Plastic substrate pressed. The substrate is melted by the heat at the surface. The

Conductors are sheared out of the copper foil and connected to the substrate.

When film-back injection is formed by sieve or

Pad printing of a primer on a film

structured conductor pattern. During one

Conditioning process under temperature goes the primer a chemical bond with the substrate surface and ensures good adhesion. During this process, the film is simultaneously formed. Subsequently, the film is placed in an injection molding machine and

back-molded. After the back injection, the

Conductor tracks galvanically reinforced and finished.

In the two-component injection molding process, the structure of the conductor pattern with a first injection molding

made of metallizable plastic, which serves as a substrate for the chemical metallization. Depending on the plastic, after the first injection molding the surface of the

Plastic still to be treated. The sprue is placed again in a mold and not with

metallized plastic encapsulated. The remaining conductor tracks are then chemically metallized and refined.

In the mask process, the metallization of the

Plastic carrier by chemical coating. When

Substrate serves a plastic injection molded part, in which the surface is first prepared for pickling by pickling or etching. Subsequently, the

Metallization. For structuring, a photoresist is applied and exposed through a three-dimensional mask with UV light. After development of the photoresist, the exposed metal layer is galvanically reinforced and coated with an etching mask. After removal of the photoresist, the remaining metal is etched away and then the surface is finished. In contrast to the mask method, the direct laser structuring structures the etching resist directly with the laser. At the locations where the etch resist was removed by the laser, the metal is etched away.

Finally, the surface is finished.

In the LPKF laser direct structuring process, which is named after the company LPKF, a plastic part is first injected. Subsequently, the transfer of the

Structure image with a writing or imaging laser system. The subsequent metallization takes place in a chemically reductive bath.

The two interconnects 106, 106 'are advantageously formed by the material or substrate of the main body 102, for example acrylonitrile-butadiene-styrene (ABS),

electrically isolated from each other. The conductor tracks 106, 106 'are in particular at the edge regions

(Peripheral sections) of the two surfaces applied.

If further components (not shown) are now coupled to this component 100, then the edge portions of the conductors 106, 106 'with the corresponding ones

Conductor tracks of the coupled further modules

electrically connected. Thus, in an array of multiple devices, a device array (structure) having two opposing surfaces is provided, the interconnect sections being separated from each other

(isolated), an areal uniform electrical Can accept potential. Thus, if a voltage is applied between the opposing conductor tracks, then this voltage between the conductor tracks can be tapped off at further positions within the module arrangement. As described in detail below, so can a

Module with an integrated electrical component are supplied with voltage, without requiring an external wiring between this component and a

Voltage source is necessary.

FIG. 3 shows the module 100 according to the invention in a first embodiment. This device 100 includes an integrated electrical switch as an example of an electrical component. Same as in Figure 2

shown embodiment, the edge portion of the two surfaces with the conductor tracks 106, 106 'is provided. The electrical switching element is inside the

Basic body 102 is integrated or cast in and can be switched on or off by actuation on the front surface. For example, by a

Touching the lettering "ON / OFF" and a simultaneous touching a border surrounding this lettering a switching pulse to be triggered (touch-sensitive

Switch) . In response to a respective switching, for example, an additional in the block 100th

Enclosed electrical component (not shown)

switched on or off. Alternatively or optionally, by switching another

electrical component switched on or off which is included in a further component (not shown), for example a further component which adjoins the component 100 shown in FIG.

FIG. 4 shows a building block 100 according to the invention in a further embodiment. According to the invention are on both surfaces of the body 102 respectively

Printed conductors 106, 106 'applied. Additionally, the package 100 includes two illumination units 108, 108 as an example of an electrical component. The two

Lighting units 108, 108 ^λ may for example be designed as light emitting diodes (LED). The respective ones

Voltage inputs of the two illumination units 108, 108 ^λ extend within the main body 102 to the respective interconnects 106, 106 ^λ (not shown). When a voltage is applied between the two conductor tracks 106, 106, the two illumination units 108, 108 ^Λ can thus be illuminated. A significant advantage is that, in the case of an arrangement of this module 100 with a variety of others

Blocks (not shown), just a voltage

between two opposing tracks at any position within that package arrangement to illuminate these lights 108, ^108Λ . Thus, eliminates a costly, expensive and also disturbing the overall appearance of this device arrangement wiring. FIG. 5 shows the module 100 according to the invention in a further embodiment in a sectional view in a horizontal plane. This module 100 includes, integrated or embedded in the interior of the body 102, two schematically illustrated processor units 110, 110 ', whose electrical inputs are each electrically connected to the conductor tracks 106, 106 ^λ . Thus, these processor units 110, 110 are ^Λ supplied via the tracks 106, 106 ^Λ with voltage.

FIG. 6 shows a package arrangement 200 in one

Embodiment of the invention in one

Perspective view. The module arrangement 200 is composed of a plurality of individual modules 100, which, coupled together in the vertical direction, are non-positively coupled (vertically) and positively (horizontally) to one another. On the opposite surfaces of the individual components in each case electrically conductive tracks 106, 106 ^{λ are} applied, which are each electrically connected to tracks of both adjacent to each other or over or attached to each other building blocks.

On the top row of the block arrangement 200, blocks are equal to the block shown in FIG

attached. For a better understanding, these building blocks are shown in a transparent view. Both components are equipped inside with two processor units 110, 110 ^λ . The electrical inputs of these processor units 110, 110 are each electrically coupled via conductor connections to the conductor tracks 106, 106.

Furthermore, the package arrangement 200 comprises a module 100, which is equipped with lighting units 108, 108 ^λ , which are integrated directly in the module 100 and emit their light directed upwards. These

Lighting units 108, 108 ^Λ are also not shown via conductor connections each with the

opposite conductor tracks 106, 106 ^{λ of} the device 100 electrically connected. Thus, these become

Lighting units 108, 108 simply and reliably lit up once at any point

within the package arrangement 200 between two

opposite conductor tracks 106, 106 ^λ, a voltage is applied. This eliminates a shapeless in terms of the appearance of the device assembly 200

Wiring. Likewise, advantageously

Wiring errors excluded. At the same time costs are also saved by eliminating the wiring.

FIG. 7 shows an exemplary prior art wiring arrangement 300. More specifically, a view of a wiring assembly 300 for wiring a device-integrated electrical device according to the prior art is shown. In the example shown, two light-emitting elements 310, 310 as ^λ miniature headlights of a block assembly for constructing a miniature vehicle (not shown) are performed. To supply power to these luminous elements 310, 310 serve two cable strands 320, 320 which are each paired in the form of dual ribbon cables to a first adapter module 330 out. Within this adapter module 330, the pairwise two-way

Ribbon cable 320, 320 ^λ linked to a quadruple ribbon cable 340, which in turn is guided to a second adapter module 350. Both adapter blocks 330, 350 (not shown) having electrical contacts may be provided, via which the two light-emitting elements 310, 310 ^λ, either individually or can be supplied with voltage in common.

A disadvantage of this wiring arrangement 300 is the unsightly wiring itself, which disturbs the appearance of a painstakingly constructed block arrangement.

In addition, the wiring can be difficult to implement, especially if the cable strands 320, 320 ', 340 must be installed in a greatly reduced space within the device block. Another disadvantage is a high probability of faulty cabling. Another source of error is that the

Cable strands along their extension can be damaged and thus do not conduct electricity. In addition, the adapter modules 330, 350 often have a

Have loose contact. The search for possible sources of error is very tedious and time consuming. Often a painstakingly constructed device assembly must be at least partially dismantled to a fault within the wiring arrangement to locate and correct. In addition, the cabling of the prior art shown by way of example is very expensive due to the high number of components.

Claims

claims

A package (100) comprising a base (102) having coupling elements for removably coupling the package (100) to at least one further package, further comprising a plurality of traces (106, 106 '), wherein on opposite surfaces of the package (100 ) in each case at least one conductor track is applied, wherein the conductor tracks (106, 106 ') are electrically connectable to respective conductor tracks of adjacent further coupled components.

2. Module (100) according to claim 1, wherein the

Printed conductors (106, 106 ') are applied to the surfaces using MID (Molded Interconnect Device) technology.

3. The module (100) according to claim 1 or 2, wherein the base body (102) comprises an electrically insulating material, wherein the conductor tracks (106, 106 ') are electrically insulated from each other by the electrically insulating material.

4. block (100) according to one of the preceding

Claims in which the conductor tracks (106, 106 ')

at least circumferentially on the respective surfaces

are applied.

5. The module (100) according to any one of the preceding claims, further comprising at least one electrical or electronic component (108, 108 ', 110, 110').

6. The module (100) according to claim 5, wherein the electrical or electronic component (108, 108 '; 110, 110') comprises at least two electrical inputs which are in each case electrically connected to the opposing conductor tracks (106, 106 ') ,

7. module (100) according to claim 5 or 6, wherein the electrical or electronic component (108, 108 ', 110, 110'), a lighting unit (108, 108 '), in particular a light emitting diode, a switch, a button, an electric motor, a display unit, a

electroacoustic transducer and / or an electronic switching unit (110, 110 '), in particular a miniature processor.

8. block (100) according to one of the preceding

Claims, further comprising at least one label, which is applied using the MID technology.

9. block arrangement (200), comprising a plurality of coupled blocks (100) according to one of claims 1 to 8, which are coupled together in such a way that respectively opposite surfaces of the blocks (100) applied conductor tracks (106, 106 ') are each electrically connected to each other.

The device package (200) of claim 9, further comprising at least one electrical power source for applying a voltage between the two

opposite surfaces of the respective blocks applied conductor tracks (106, 106 ').

11. The package assembly (200) of claim 10, wherein the electrical power source comprises a

Voltage transformer, at least one battery or a rechargeable battery and / or at least one solar cell comprises.

12. A method of manufacturing a device (100) according to any one of claims 1 to 8, comprising:

Injection molding of a base body (102), and

Applying at least one conductor track (106, 106 ') on respective opposite surfaces of the base body (102).

13. The method of claim 12, wherein the

Conductor tracks (106, 106 ') are applied to the surfaces of the device (100) using MID technology.

14. The method of claim 13, further comprising

Applying at least one label on at least one surface of the package (100) using the MID technology.