WO2015177038A1 - Enceinte thermo-optique pour applications d'éclairage à del - Google Patents

Enceinte thermo-optique pour applications d'éclairage à del Download PDF

Info

Publication number
WO2015177038A1
WO2015177038A1 PCT/EP2015/060714 EP2015060714W WO2015177038A1 WO 2015177038 A1 WO2015177038 A1 WO 2015177038A1 EP 2015060714 W EP2015060714 W EP 2015060714W WO 2015177038 A1 WO2015177038 A1 WO 2015177038A1
Authority
WO
WIPO (PCT)
Prior art keywords
envelope
cavity
heat pipe
light source
lamp
Prior art date
Application number
PCT/EP2015/060714
Other languages
English (en)
Inventor
Simon Eme Kadijk
Vincent Stefan David Gielen
Abraham Rudolf Balkenende
Jordy Bernard Margreth SCHOENMAEKERS
Original Assignee
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips N.V. filed Critical Koninklijke Philips N.V.
Priority to CN201580026106.1A priority Critical patent/CN106461168A/zh
Priority to US15/313,381 priority patent/US20170184296A1/en
Priority to JP2016568565A priority patent/JP2017517109A/ja
Priority to EP15722221.7A priority patent/EP3149391A1/fr
Publication of WO2015177038A1 publication Critical patent/WO2015177038A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lamp, and to an envelope assembly and a power assembly that may be part of such lamp.
  • the invention further relates to a method for providing such lamp.
  • wick materials can be chosen to be compatible with the working fluid.
  • the wick layer may relatively easily be applied, such as via a pump stem or through coating of subassemblies prior to assembling the vapor chamber.
  • two pump stems may optionally be applied, a first pump stem for introduction of the coating liquid, and a second pump stem for escape of gas, and option some (superfluous) coating liquid.
  • the pump stem(s) may be closed (including optionally a partial removal of (one or more of) the pump stem(s)).
  • a derivative solution is to deliberately add a controlled amount non- condensable gas to the vapor chamber in order to guarantee a minimum internal pressure in the container and thereby reduce the stresses on the vapor chamber container that arise from the difference between ambient en internal pressure. In this way, a balance can be between thermal performance and mechanical robustness of the system.
  • the container is shaped in such a way that the non-condensable gasses are not trapped in a section of the container but can mix with the evaporating fluid.
  • the invention provides a lamp, the lamp comprising: (i) a solid state light source ("light source”) and a first envelope at least partially enclosing the solid state light source, thereby forming a first cavity hosting said solid state light source, wherein at least part of the first envelope is transmissive for visible light (“light”) generated by the solid state light source; and (ii) a second envelope at least partially enclosing the first envelope, wherein the first envelope and the second envelope provide a (closed) second cavity at least partially enclosing the solid state light source, wherein at least part of the second envelope is transmissive for visible light generated by the solid state light source and transmitted through the first envelope into the second cavity, wherein the (closed) second cavity is configured as a heat pipe comprising a heat pipe working fluid ("working fluid” or "fluid”) and comprising over at least part of an internal surface (upstream face) of said second cavity a heat pipe wick layer ("wick layer” or "wick” or “wick structure”)
  • thermo-optical enclosure i.e. the envelope assembly
  • wick layer may be applied in a relatively easy way, such as with a sol-gel coating liquid or other liquid, which may include particulate material, which may provide a wick layer with (the desired) porosity.
  • the light source is configured to generate visible light, either directly or in combination with a light converter especially integrated in the solid state light source, such as in a dome on a LED die or in a luminescent layer (such as a foil) on or close to a LED die.
  • the materials of the first envelope and second envelope are substantially the same. This facilitates the integration of the envelopes into an envelope assembly that at least partly encloses the light source and that provides the second cavity as heat pipe.
  • the material of the first envelope and/or the material of the second envelope may comprise one or more materials selected from the group consisting of a transmissive organic material support, such as selected from the group consisting of PE (polyethylene), PP (polypropylene), PEN (polyethylene napthalate), PC (polycarbonate), polymethylacrylate (PMA), polymethylmethacrylate (PMMA) (Plexiglas or Perspex), cellulose acetate butyrate (CAB), silicone, polyvinylchloride (PVC), polyethylene terephthalate (PET), (PETG) (glycol modified polyethylene terephthalate), PDMS
  • a transmissive organic material support such as selected from the group consisting of PE (polyethylene), PP (polypropylene), PEN (polyethylene napthalate), PC (polycarbonate), polymethylacrylate (PMA), polymethylmethacrylate (PMMA) (Plexiglas or Perspex), cellulose acetate butyrate (
  • the light source especially comprises a light emitting surface, relative to the light emitting surface, the first envelope may enclose the light source over an angle larger than 180°, such as e.g. 270° or larger.
  • a distance from the light source to the first opening at a first end ("one side") of the first envelope may be larger than a distance between the light source and a second end ("opposite side") of the first envelope, wherein the first end and the second end substantially define the length of the first envelope.
  • Such configuration improves distribution of the light and distribution of heat. Hence, in this way the lamp may be more efficient.
  • the heat pipe comprises over at least part of its internal surface the wick or wick layer.
  • the internal surface of the heat pipe comprises at least part of the external surface (downstream surface) of the first envelope and at least part of the internal surface (upstream surface) of the second envelope.
  • the wick layer may cover the whole internal surface or only part thereof.
  • the wick layer should also be transmissive. This can e.g. be achieved by using a thin layer, by using material that is transmissive for light, etc.
  • the heat pipe wick layer may comprise a binder material.
  • the binder material may optionally have an index of refraction differing in value less than 15% of an index of refraction of the particle material.
  • the particles (or beads) may be hollow particles, filled with a fluid such as air or water, etc. Especially, the particles may be filled with a fluid particle filling material having an index of refraction (also) differing in value less than 15% of an index of refraction of the particle material. However, the particles may also be massive particles (i.e. not hollow). The particles (or beads) may be spherical, but may also have other shapes. Also combinations of different shaped particles may be applied. Instead of particles (or beads), one may also apply a glass fiber layer, such as a glass fiber sleeve.
  • the working fluid may comprise a substantially pure fluid, such as less than 10 vol.%, especially less than 5 vol.%, even more especially less than 1 vol.% of the total fluid being other fluids (such as a non-condensable fluid; see below) than the main fluid.
  • a substantially pure fluid such as less than 10 vol.%, especially less than 5 vol.%, even more especially less than 1 vol.% of the total fluid being other fluids (such as a non-condensable fluid; see below) than the main fluid.
  • a substantially pure fluid such as less than 10 vol.%, especially less than 5 vol.%, even more especially less than 1 vol.% of the total fluid being other fluids (such as a non-condensable fluid; see below) than the main fluid.
  • one may include (liquid) water in the heat pipe and remove air by evacuation, which may provide the substantially pure working fluid, such as pure water.
  • a non-condensable fluid such as air, and/or or especially a low density gas like He or Ne.
  • the first envelope of the second envelope may include a pump stem.
  • the pump stem can be closed. This can be done by methods know in the art, like melting, soldering, sealing, etc.. Assuming the pump stem to be part of the first envelop, this may imply that a small piece of pump stem may extend from the first cavity. For this reason, the power assembly (see also below) may include an assembly cavity to host this pump stem (remains). This may not be necessary when the pump stem is (was) associated with the second envelope. In this situation, there is no gas contact between the first cavity and the second cavity.
  • the heat pipe is especially configured to transport the heat from the light source to the second envelop.
  • the heat has to be transferred through the first envelope.
  • the light source may be in thermal contact with the first envelope.
  • This support may include a PCB (printed circuit board).
  • the support may be in physical contact with the first envelope.
  • the solid state light source support includes a heat sink, and wherein the heat sink is in thermal contact with the first envelope, especially in physical contact with the first envelope.
  • the solid state light source support includes a heat sink, wherein the heat sink comprises a ceramic heat pipe.
  • the lamp includes two heat pipes. As indicated above, optionally also a thermally conductive paste to improve thermal contact between the support and the first envelope.
  • the heat pipe wick layer may be provided before assembly especially by providing a coating composition to (at least part of) the external surface or downstream surface of the first envelope. Thereafter, the first envelope and second envelope may be assembled into the envelope assembly. After assembly of the envelope, a coating
  • composition to (at least part of) the external surface or downstream surface of the first envelope may be applied via the second cavity opening, such as via a pump stem.
  • the second envelope may be closed by closing the second cavity opening, such as by closing a pump stem, like by e.g. melting or providing a plug.
  • the afore-mentioned particles such as alumina particles, titania particles, silica particles are especially transmissive for visible light, and are further especially stable under the operation conditions of the lamp.
  • the weight averaged mean particle sizes may especially be in the range of 1-150 ⁇ , like 5-120 ⁇ .
  • Figs. 2A-2B schematically depict some possible embodiments of the lamp
  • the schematic drawing 1C shows an embodiment of the second envelope 200.
  • the second envelope has an internal surface or upstream surface 200a, and an external surface or downstream surface 200b.
  • the second envelope 100 may include a cylindrical part having a diameter d 2 . This cylindrical part may enclose the cylindrical part of the first envelope 100 (see below).
  • the second envelope 200 includes an opening 201, through which part of the first envelope 100 may be arranged.
  • the length of the second envelop is indicated with reference 1 2 .
  • the second envelope includes optionally a second cavity opening 258 with pump stem 257.
  • Fig. ID schematically depicts an embodiment of a power assembly 300.
  • the power assembly includes at least two light sources 10, configured on a support 1200, which also includes a heat sink 12.
  • the light source 10 is configured to provide light 11, especially having a visible component. With dashed lines, electrical connections 301 are indicated, which are in electrical contact with an end cap 302, for instance an Edison cap.
  • Reference 310 indicated by way of example electronics and/or a control unit, and may e.g. include a transformer and/or remote control elements.
  • Reference 330 indicates a cavity for the pump stem remains. Note that the first envelope encloses the light source(s) 10 over angles of at least about 270°.
  • the power assembly with light source may be inserted via the first opening 101 from the first cavity 100 and may be glued into this first envelope, thereby providing the lamp 1.
  • Reference 307 indicates an optional protective cap and reference 309 indicates a closing means, for sealing of the first opening 101 of the first envelope.
  • the wick layer 254 may be provided before or after (as described here) assembly of the envelope assembly 400.
  • first envelope 100 and the second envelope comprise a (transmissive) ceramic material.
  • This embodiment thus comprises two heat pipes.
  • the present invention also solves the problem that if packaged or soldered LEDs are used, they appear not to survive an oxygen-depleted sealed environment (such as a He only atmosphere).
  • Fig. 3D schematically depicts an embodiment of the lamp 1 including at least two subsets 21,22 of solid state light sources 10 arranged within the first cavity 150.
  • the temperature of the outer glass part was measured.
  • the outside glass has a very uniform temperature, as can only be expected from a vapour chamber.
  • the measured average temperature is about 63°C. From the three measured temperatures one can derive an Rth outer-glass to amb of 4.6 K/W and a Rth alu to outer-glass of 3.5 K/W.
  • the thermal resistance from aluminum to the outer glass can still be improved by the dimensioning of the internal parts in the internal glass cylinder.
  • the bulb was not evacuated, and ambient air was trapped after the sealing of the container.
  • Low cost wick material is a trivial prerequisite for a low cost solution.
  • Glass particles, in particular glass spheres are available at low cost; also sol-gel is a low cost material.
  • Porous glass wicks have been prepared on flat glass using a sol-gel solution filled with glass spheres. The wicking properties of the coatings prepared by the sol-gel process with glass spheres were measured in a so-called capillary rate of rise experiment. Results are given in the table.
  • an aluminum salt results in the incorporation of aluminum in the binder material, which largely decreases the solubility as well as the dissolution rate.
  • aluminum acetate and aluminum isopropoxide have been successfully added in an amount of 0.5 g to the TEOS dispersion.
  • the tubes with wick coating based on a TEOS binder can also be impregnated with aluminum acetate solution. Upon subsequent annealing aluminum is incorporated in the binder, thus again reducing the binder solubility.
  • Aluminum acetate concentrations in the range of 0.007-0.035 g/cm 3 resulted in lifetime extension by a factor of 4.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une lampe (1) comprenant (i) une source de lumière à semi-conducteurs (10) et une première enveloppe (100) entourant au moins partiellement la source de lumière (10), formant ainsi une première cavité (150) hébergeant ladite source de lumière à semi-conducteurs (10), au moins une partie de la première enveloppe (100) étant transmissive pour la lumière visible (11) générée par la source de lumière à semi-conducteurs (10) ; et (ii) une seconde enveloppe (200) entourant au moins partiellement la première enveloppe (100), la première enveloppe (100) et la seconde enveloppe (200) créant une seconde cavité (250) entourant au moins partiellement la source de lumière (10), au moins une partie de la seconde enveloppe (200) étant transmissive pour la lumière visible (11) générée par la source de lumière (10) et transmise à travers la première enveloppe (100) dans la seconde cavité (250), la seconde cavité (250) étant configurée sous la forme d'un caloduc (251).
PCT/EP2015/060714 2014-05-22 2015-05-14 Enceinte thermo-optique pour applications d'éclairage à del WO2015177038A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201580026106.1A CN106461168A (zh) 2014-05-22 2015-05-14 用于led照明应用的热‑光学外壳
US15/313,381 US20170184296A1 (en) 2014-05-22 2015-05-14 Thermo-optical enclosure for led lighting applications
JP2016568565A JP2017517109A (ja) 2014-05-22 2015-05-14 Ｌｅｄ照明用途のための熱光学筐体
EP15722221.7A EP3149391A1 (fr) 2014-05-22 2015-05-14 Enceinte thermo-optique pour applications d'éclairage à del

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14169385 2014-05-22
EP14169385.3 2014-05-22

Publications (1)

Publication Number Publication Date
WO2015177038A1 true WO2015177038A1 (fr) 2015-11-26

Family

ID=50842049

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/060714 WO2015177038A1 (fr) 2014-05-22 2015-05-14 Enceinte thermo-optique pour applications d'éclairage à del

Country Status (5)

Country Link
US (1) US20170184296A1 (fr)
EP (1) EP3149391A1 (fr)
JP (1) JP2017517109A (fr)
CN (1) CN106461168A (fr)
WO (1) WO2015177038A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3193073A1 (fr) * 2016-01-14 2017-07-19 Philips Lighting Holding B.V. Dispositif d'éclairage
WO2018010992A1 (fr) 2016-07-14 2018-01-18 Philips Lighting Holding B.V. Dispositif d'éclairage
WO2018010990A1 (fr) 2016-07-14 2018-01-18 Philips Lighting Holding B.V. Ampoule d'éclairage à semi-conducteurs
JP2018073950A (ja) * 2016-10-27 2018-05-10 パナソニックＩｐマネジメント株式会社 発光モジュール及び照明器具
WO2020173731A1 (fr) * 2019-02-27 2020-09-03 Signify Holding B.V. Dispositif d'éclairage à del
GB2554823B (en) * 2015-05-28 2021-05-19 Technical Consumer Products Inc Lighting device including multiple diffusers for blending light

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180058664A1 (en) * 2016-08-31 2018-03-01 Kun-Yuan Chiang Omni-directional LED Lamps
US11415281B2 (en) * 2018-08-28 2022-08-16 Mary Elle Fashions, Inc. Flickering mineral light
CN109307252B (zh) * 2018-09-10 2021-03-19 长春希达电子技术有限公司 一种相变液及包含该相变液的热传输模块
CN109973870B (zh) * 2019-03-13 2021-03-19 李张炼 一种泳池使用的led灯

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004100213A2 (fr) * 2003-05-05 2004-11-18 Gelcore Llc Ampoule electrique a del
US20100078151A1 (en) * 2008-09-30 2010-04-01 Osram Sylvania Inc. Ceramic heat pipe with porous ceramic wick
US20100271836A1 (en) * 2009-04-28 2010-10-28 Ledon Lighting Jennersdorf Gmbh Led lamp
US20110074296A1 (en) * 2009-09-28 2011-03-31 Yu-Nung Shen Light-Emitting Diode Illumination Apparatuses
DE102011004718A1 (de) * 2011-02-25 2012-08-30 Osram Ag Verfahren zum Herstellen einer lichtdurchlässigen Abdeckung einer Leuchtvorrichtung
US20130113358A1 (en) * 2011-02-07 2013-05-09 Cree, Inc. Lamp with remote led light source and heat dissipating elements
DE102012211279A1 (de) * 2012-06-29 2014-01-02 Osram Gmbh Halbleiter-leuchtvorrichtung mit wärmerohr

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101644387B (zh) * 2009-08-21 2013-04-10 中山伟强科技有限公司 发光二极管灯具

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004100213A2 (fr) * 2003-05-05 2004-11-18 Gelcore Llc Ampoule electrique a del
US20100078151A1 (en) * 2008-09-30 2010-04-01 Osram Sylvania Inc. Ceramic heat pipe with porous ceramic wick
US20100271836A1 (en) * 2009-04-28 2010-10-28 Ledon Lighting Jennersdorf Gmbh Led lamp
US20110074296A1 (en) * 2009-09-28 2011-03-31 Yu-Nung Shen Light-Emitting Diode Illumination Apparatuses
US20130113358A1 (en) * 2011-02-07 2013-05-09 Cree, Inc. Lamp with remote led light source and heat dissipating elements
DE102011004718A1 (de) * 2011-02-25 2012-08-30 Osram Ag Verfahren zum Herstellen einer lichtdurchlässigen Abdeckung einer Leuchtvorrichtung
DE102012211279A1 (de) * 2012-06-29 2014-01-02 Osram Gmbh Halbleiter-leuchtvorrichtung mit wärmerohr

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2554823B (en) * 2015-05-28 2021-05-19 Technical Consumer Products Inc Lighting device including multiple diffusers for blending light
EP3193073A1 (fr) * 2016-01-14 2017-07-19 Philips Lighting Holding B.V. Dispositif d'éclairage
WO2017121723A1 (fr) * 2016-01-14 2017-07-20 Philips Lighting Holding B.V. Dispositif d'éclairage
WO2018010992A1 (fr) 2016-07-14 2018-01-18 Philips Lighting Holding B.V. Dispositif d'éclairage
WO2018010990A1 (fr) 2016-07-14 2018-01-18 Philips Lighting Holding B.V. Ampoule d'éclairage à semi-conducteurs
CN109477614A (zh) * 2016-07-14 2019-03-15 飞利浦照明控股有限公司 照明设备
US20190154207A1 (en) * 2016-07-14 2019-05-23 Philips Lighting Holding B.V. Solid-state lighting lamp
US10544908B2 (en) 2016-07-14 2020-01-28 Signify Holding B.V. Lighting device
CN109477614B (zh) * 2016-07-14 2020-11-03 昕诺飞控股有限公司 照明设备
US10928011B2 (en) 2016-07-14 2021-02-23 Signify Holding B.V. Solid-state lighting lamp
JP2018073950A (ja) * 2016-10-27 2018-05-10 パナソニックＩｐマネジメント株式会社 発光モジュール及び照明器具
WO2020173731A1 (fr) * 2019-02-27 2020-09-03 Signify Holding B.V. Dispositif d'éclairage à del

Also Published As

Publication number Publication date
EP3149391A1 (fr) 2017-04-05
JP2017517109A (ja) 2017-06-22
CN106461168A (zh) 2017-02-22
US20170184296A1 (en) 2017-06-29

Similar Documents

Publication Publication Date Title
US20170184296A1 (en) Thermo-optical enclosure for led lighting applications
JP5588024B2 (ja) 散乱特性を増強した遠隔リン光体及びディフューザの構成を用いるｌｅｄランプ又は電球
US9234655B2 (en) Lamp with remote LED light source and heat dissipating elements
JP5676654B2 (ja) 光を均一な放射パターンに散乱させる不均一なディフューザ
EP3172489B1 (fr) Mèche d'artère enroulée et flexible
US8632196B2 (en) LED lamp incorporating remote phosphor and diffuser with heat dissipation features
CN103003625B (zh) 固态灯
US9500325B2 (en) LED lamp incorporating remote phosphor with heat dissipation features
US20110193479A1 (en) Evaporation Cooled Lamp
US9365766B2 (en) Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion
CN103765077A (zh) 紧凑高效的远置led模块
JP2012519350A (ja) Ｌｅｄに基づくランプ及びそのランプのための熱管理システム
TW201432198A (zh) 用於發光二極體燈之保護擴散性塗層
WO2014126648A1 (fr) Lampe à del à refroidissement liquide
US9401468B2 (en) Lamp with LED chips cooled by a phase transformation loop
EP2893254A1 (fr) Lampe à source de lumière à del distante et éléments de dissipation thermique
TW201202626A (en) LED lamp with remote phosphor and diffuser configuration
JP2013528893A (ja) 遠隔リン光体及びディフューザの構成を用いるｌｅｄランプ
KR20130019389A (ko) 솔리드 스테이트 램프 및 전구
KR20130036220A (ko) 원격 형광체 및 디퓨저 구성을 갖는 발광 다이오드 램프

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15722221

Country of ref document: EP

Kind code of ref document: A1

REEP Request for entry into the european phase

Ref document number: 2015722221

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2015722221

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2016568565

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 15313381

Country of ref document: US