WO2015169032A1 - 一种热控机壳 - Google Patents

一种热控机壳 Download PDF

Info

Publication number
WO2015169032A1
WO2015169032A1 PCT/CN2014/087235 CN2014087235W WO2015169032A1 WO 2015169032 A1 WO2015169032 A1 WO 2015169032A1 CN 2014087235 W CN2014087235 W CN 2014087235W WO 2015169032 A1 WO2015169032 A1 WO 2015169032A1
Authority
WO
WIPO (PCT)
Prior art keywords
casing
thermal
film
upper cover
heat
Prior art date
Application number
PCT/CN2014/087235
Other languages
English (en)
French (fr)
Inventor
徐永田
邱腾渊
张明明
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to US15/124,821 priority Critical patent/US20170055375A1/en
Priority to EP14891396.5A priority patent/EP3113588A4/en
Publication of WO2015169032A1 publication Critical patent/WO2015169032A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof

Definitions

  • the utility model relates to the field of temperature control of electronic and communication equipment, in particular to a thermal control casing which can be used for various electronic and communication equipment.
  • the surface temperature of the casing will become higher and higher, especially the surface temperature of the casing near the heat-generating components will be particularly high. If the surface temperature of the casing is too high, it will cause some problems: when the casing is stacked with other equipment, the surface temperature of the casing is too high, which will directly increase the temperature of other equipment; the surface temperature of the casing of the household electronic equipment is too high. High, human hands touch in time, local high temperature on the surface of the casing may burn people.
  • the embodiment of the present invention provides a thermal control casing, which reflects the surface temperature of the casing by reflecting the thermal radiation film on the inner surface of the casing and reflecting the heat radiation back into the casing.
  • a thermal control casing includes: a lower casing; an upper cover fitted over the lower casing; and a thermal energy reflecting film attached to an inner surface of the lower casing and/or the upper cover.
  • the thermal energy reflective film is a reflective metal film.
  • the reflective metal film is sprayed or plated or adhered to the inner surface of the lower casing and/or the upper cover.
  • the inner surface of the lower casing and/or the upper cover is composed of a plurality of horizontal planes and a plurality of non-horizontal planes at an angle to the horizontal plane.
  • the non-horizontal plane corresponds to a heat generating component arrangement.
  • the reflective metal film is a copper film or an aluminum film.
  • the utility model attaches a thermal energy reflective film on the inner surface of the casing, and can reflect the heat radiation of the electronic component back to the inside of the casing, thereby reducing the heat absorption of the casing and reducing the surface temperature of the casing;
  • the thermal energy reflective film of the utility model adopts a reflective metal film, which can not only reflect the heat radiation back into the interior of the casing, but also can effectively extend the temperature due to the high thermal conductivity of the reflective metal film, thereby making the surface temperature of the casing more uniform. Eliminate local high temperature hot spots on the surface of the casing and effectively control the surface temperature of the casing;
  • the inner surface of the casing of the utility model is composed of a horizontal plane and a non-horizontal plane, and the non-horizontal plane is correspondingly arranged with the heat generating component, and the non-horizontal plane reflects the heat radiation from the heat generating component to the inside of the casing through a certain reflection angle.
  • the heating component area or the heat-resistant area eliminates the local high temperature hot spot on the surface of the casing and effectively controls the surface temperature of the casing.
  • FIG. 1 is a schematic structural view of a thermal control casing of the present invention.
  • a thermal control casing includes: a lower casing 1; and an upper cover 2 fitted above the lower casing 1. Among them, a heat generating component is installed inside the casing.
  • the heat-generating components inside the casing are generally dissipated in three ways: heat conduction, convection, and heat radiation.
  • heat conduction convection
  • heat radiation heat radiation
  • the utility model attaches the thermal energy reflecting film 3 on the inner surface of the casing, and can reflect the heat radiation of the heat-generating electronic component back into the casing, thereby reducing the heat absorption of the casing and reducing the surface of the casing.
  • the temperature is reflected; the heat energy reflected back inside the casing can be dissipated through other heat dissipation methods such as heat conduction and convection.
  • the thermal energy reflective film 3 may be attached to the inner surface of the lower case 1 and/or the upper cover 2 according to actual needs.
  • the thermal energy reflective film 3 of the present invention is preferably a reflective metal film, and the reflective metal film can not only reflect the heat radiation back into the interior of the casing, but also can effectively extend the temperature due to the high thermal conductivity of the reflective metal film, thereby making the surface temperature of the casing more Uniform, eliminates local high temperature hot spots on the surface of the casing and effectively controls the surface temperature of the casing.
  • the inner surface of the lower casing 1 and/or the upper cover 2 may be designed to be composed of a plurality of horizontal planes and a plurality of non-horizontal planes at an angle to the horizontal plane, and the non-horizontal planes may construct a certain reflection. Angle, the heat radiation from the heating component is reflected back to the non-heating component area or the heat-resistant area inside the casing at a certain reflection angle, eliminating the local high temperature hot spot on the surface of the casing, and effectively controlling the surface temperature of the casing.
  • the non-horizontal plane is arranged corresponding to the heat-generating component, and the non-horizontal surface receives the heat radiation from the heat-generating component and reflects the heat radiation from the heat-generating component to the non-heat-generating component region inside the casing through a certain reflection angle. Or heat resistant area.
  • the thermal control casing of the utility model can effectively reduce the temperature influence of the casing on other adjacent devices, reduce the possibility of scalding on the human body, and improve the safety of the electronic casing to the human body.
  • the reflective metal film of the present invention is preferably a copper film or an aluminum film.
  • the reflective metal film may be a metal film such as a copper foil or an aluminum foil, and is attached to the inner surface of the casing by means of adhesive tape; the reflective metal film may also be directly sprayed or plated in the casing by spraying or coating. surface.
  • the thermal control casing provided by the embodiment of the present invention has the following beneficial effects: the thermal energy reflective film is attached to the inner surface of the casing, and the heat radiation of the electronic component can be reflected back to the inside of the casing, thereby reducing the casing pair.
  • the heat absorption reduces the surface temperature of the casing;
  • the thermal energy reflection film uses a reflective metal film, which not only reflects the heat radiation back into the casing, but also can effectively extend the temperature due to the high thermal conductivity of the reflective metal film, thereby making the surface of the casing
  • the temperature is more uniform, the local high temperature hotspot on the surface of the casing is eliminated, and the surface temperature of the casing is effectively controlled;
  • the inner surface of the casing is composed of a horizontal plane and a non-horizontal plane, and the non-horizontal plane is correspondingly set with the heat generating component, and the non-horizon plane passes through a certain reflection angle.
  • the heat radiation from the heat-generating component is reflected to the non-heating component area or the heat-resistant area inside the casing, and the local high-temperature hot spot on the surface of the casing is eliminated, and the surface temperature of the casing is effectively controlled.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Building Environments (AREA)

Abstract

一种热控机壳，包括下壳体（1）；配合安装在所述下壳体（1）上方的上盖（2）；所述下壳体（1）和／或上盖（2）的内表面附着有热能反射膜（3），所述热能反射膜为反光金属膜。该热控机壳结构简单，成本低，能有效控制机壳的表面温度。

Description

一种热控机壳 技术领域
本实用新型涉及电子和通讯设备的温度控制领域，尤其涉及一种可用于各种电子和通讯设备的热控机壳。
背景技术
在电子、通讯等设备的机壳内部，随着电子芯片和功率器件的发热，机壳的表面温度会越来越高，尤其是靠近这些发热元器件的机壳位置的表面温度会特别高。机壳表面温度过高会带来一些问题：当该机壳与其他设备叠放使用时，该机壳的表面温度过高，将直接增高其他设备的温度；家用电子设备的机壳表面温度过高，人手触及时，机壳表面的局部高温可能烫伤人手。
实用新型内容
本实用新型实施例提供了一种热控机壳，通过在该机壳的内表面附着热能反射膜，将热辐射反射回机壳内部，从而有效控制机壳的表面温度。
为了实现本实用新型的上述目的，提供以下技术方案：
一种热控机壳，包括：下壳体；配合安装在所述下壳体上方的上盖；所述下壳体和/或上盖的内表面附着有热能反射膜。
优选地，所述热能反射膜为反光金属膜。
优选地，所述反光金属膜喷涂或涂镀或粘贴在所述下壳体和/或上盖的内表面。
优选地，所述下壳体和/或上盖的内表面由若干水平面和若干与所述水平面呈一定夹角的非水平面组成。
优选地，所述非水平面对应于发热元器件设置。
优选地，所述反光金属膜为铜膜或铝膜。
本实用新型的有益效果体现在以下方面：
1)本实用新型在机壳内表面附着热能反射膜，可以把电子元器件的热辐射反射回机壳内部，从而降低机壳对热的吸收，降低机壳表面温度；
2)本实用新型的热能反射膜采用反光金属膜，不仅可以将热辐射反射回机壳内部，而且由于反光金属膜的导热系数较高，可以有效延展温度，从而使得机壳表面温度更均匀，消除机壳表面的局部高温热点，有效控制机壳表面温度；
3)本实用新型机壳的内表面由水平面和非水平面组成，并且将非水平面与发热元器件对应设置，非水平面通过一定的反射角度将来自发热元器件的热辐射反射到机壳内部的无发热元器件区域或耐热区域，消除机壳表面的局部高温热点，有效控制机壳表面温度。
附图说明
图1是本实用新型热控机壳的结构示意图。
附图标记说明：1-下壳体；2-上盖；3-热能反射膜。
具体实施方式
如图1所示，一种热控机壳，包括：下壳体1；配合安装在所述下壳体1上方的上盖2。其中，该机壳内部安装有发热元器件。
目前，机壳内部的发热元器件一般会通过三种方式进行散热：导热、对流和热辐射。随着发热元器件逐渐发热，会增加其对机壳表面的热辐射，引起机壳表面温度升高，尤其靠近发热元器件位置的机壳局部温度更高。
为了降低机壳表面温度，本实用新型在机壳的内表面附着热能反射膜3，可以把发热电子元器件的热辐射反射回机壳内部，从而降低机壳对热的吸收，降低机壳表面温度；而反射回机壳内部的热能可以通过导热和对流等其余散热方式散发出去。
具体实施时，可以根据实际需要，在下壳体1和/或上盖2的内表面附着热能反射膜3。
本实用新型的热能反射膜3优选反光金属膜，反光金属膜不仅可以将热辐射反射回机壳内部，而且由于反光金属膜的导热系数较高，可以有效延展温度，从而使得机壳表面温度更均匀，消除机壳表面的局部高温热点，有效控制机壳表面温度。
另外，在具体设计时，可以将下壳体1和/或上盖2的内表面设计成由若干水平面和若干与所述水平面呈一定夹角的非水平面组成，这些非水平面可以构造一定的反射角度，将来自发热元器件的热辐射以一定的反射角度反射回机壳内部的无发热元器件区域或耐热区域，消除机壳表面的局部高温热点，有效控制机壳表面温度。
具体操作时，将非水平面与发热元器件对应设置，非水平面接收到来自发热元器件的热辐射并通过一定的反射角度将来自发热元器件的热辐射反射到机壳内部的无发热元器件区域或耐热区域。
本实用新型的热控机壳可有效降低该机壳对其余相邻设备的温度影响，也降低了对人体烫伤的可能性，提高了电子机壳对人体的安全性。
本实用新型结构简单，制作工艺简单灵活，反光金属膜可喷涂或涂镀或粘贴在所述下壳体1和/或上盖2的内表面。由于铜或铝的导热系数较高，本实用新型的反光金属膜优选铜膜或铝膜。具体的，反光金属膜可以是一种铜箔或铝箔等金属薄膜，采用胶贴的方式贴于机壳内表面；反光金属膜也可以采用喷涂或涂镀等方式直接喷或镀在机壳内表面。
尽管上述对本实用新型做了详细说明，但本实用新型不限于此，本技术领域的技术人员可以根据本实用新型的原理进行修改，因此，凡按照本实用新型的原理进行的各种修改都应当理解为落入本实用新型的保护范围。
工业实用性
如上所述，本发明实施例提供的一种热控机壳具有以下有益效果：在机壳内表面附着热能反射膜，可以将电子元器件的热辐射反射回机壳内部，从而降低机壳对热的吸收，降低机壳表面温度；热能反射膜采用反光金属膜，不仅可以将热辐射反射回机壳内部，而且由于反光金属膜的导热系数较高，可以有效延展温度，从而使得机壳表面温度更均匀，消除机壳表面的局部高温热点，有效控制机壳表面温度；机壳的内表面由水平面和非水平面组成，并且将非水平面与发热元器件对应设置，非水平面通过一定的反射角度将来自发热元器件的热辐射反射到机壳内部的无发热元器件区域或耐热区域，消除机壳表面的局部高温热点，有效控制机壳表面温度。

Claims (6)

  1. 一种热控机壳，包括：
    下壳体；
    配合安装在所述下壳体上方的上盖；
    所述下壳体和/或上盖的内表面附着有热能反射膜。
  2. 如权利要求1所述的热控机壳，其中，所述热能反射膜为反光金属膜。
  3. 如权利要求2所述的热控机壳，其中，所述反光金属膜喷涂或涂镀或粘贴在所述下壳体和/或上盖的内表面。
  4. 如权利要求3所述的热控机壳，其中，所述下壳体和/或上盖的内表面由若干水平面和若干与所述水平面呈一定夹角的非水平面组成。
  5. 如权利要求4所述的热控机壳，其中，所述非水平面对应于发热元器件设置。
  6. 如权利要求5所述的热控机壳，其中，所述反光金属膜为铜膜或铝膜。
PCT/CN2014/087235 2014-05-09 2014-09-23 一种热控机壳 WO2015169032A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/124,821 US20170055375A1 (en) 2014-05-09 2014-09-23 Thermal control enclosure
EP14891396.5A EP3113588A4 (en) 2014-05-09 2014-09-23 Thermal control housing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201420239325.0U CN203896613U (zh) 2014-05-09 2014-05-09 一种热控机壳
CN201420239325.0 2014-05-09

Publications (1)

Publication Number Publication Date
WO2015169032A1 true WO2015169032A1 (zh) 2015-11-12

Family

ID=51722959

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/087235 WO2015169032A1 (zh) 2014-05-09 2014-09-23 一种热控机壳

Country Status (4)

Country Link
US (1) US20170055375A1 (zh)
EP (1) EP3113588A4 (zh)
CN (1) CN203896613U (zh)
WO (1) WO2015169032A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2800701Y (zh) * 2005-06-10 2006-07-26 华为技术有限公司 移动终端壳体
US20070035930A1 (en) * 2005-08-10 2007-02-15 Chien-Min Sung Methods and devices for cooling printed circuit boards
CN201846543U (zh) * 2010-09-30 2011-05-25 苏州新海宜通信科技股份有限公司 户外通信设备用防太阳辐射机柜
CN201878439U (zh) * 2010-11-15 2011-06-22 华为终端有限公司 数据卡
CN102548341A (zh) * 2010-12-10 2012-07-04 旭丽电子(广州)有限公司 散热壳体结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2682987A (en) * 1948-12-04 1954-07-06 Nat Dairy Res Lab Inc Container for frozen products
US3929247A (en) * 1973-07-11 1975-12-30 Kaiser Aluminium Chem Corp Cryogenic tank
US4478858A (en) * 1982-02-08 1984-10-23 The Procter & Gamble Company Instant coffee containing packet and method of forming
US5709914A (en) * 1994-01-18 1998-01-20 Hayes; Claude Q. C. Thermal storage and transfer device
WO2001049574A2 (en) * 2000-01-04 2001-07-12 Thermokeep Ltd. Temperature controlling apparatus and method
AU2001222296B2 (en) * 2000-04-21 2004-09-02 Matsushita Refrigeration Company Heat insulation box, and vacuum heat insulation material used therefor
US6819559B1 (en) * 2002-05-06 2004-11-16 Apple Computer, Inc. Method and apparatus for controlling the temperature of electronic device enclosures
CA2418169A1 (en) * 2003-01-31 2004-07-31 Ian George Watson Reflective coating for a housing enclosure in a level measurement or time of flight ranging system
US20080164265A1 (en) * 2007-01-06 2008-07-10 Conforti Carl J Thermally-controlled package
US8603598B2 (en) * 2008-07-23 2013-12-10 Tokitae Llc Multi-layer insulation composite material having at least one thermally-reflective layer with through openings, storage container using the same, and related methods
US8377030B2 (en) * 2007-12-11 2013-02-19 Tokitae Llc Temperature-stabilized storage containers for medicinals
US8517075B2 (en) * 2010-08-12 2013-08-27 Rocktenn Cp, Llc Machine and method for forming a heat-reflective blank and container
US9296519B2 (en) * 2011-11-01 2016-03-29 Kiyan Suzuki Recyclability enhancement of food containers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2800701Y (zh) * 2005-06-10 2006-07-26 华为技术有限公司 移动终端壳体
US20070035930A1 (en) * 2005-08-10 2007-02-15 Chien-Min Sung Methods and devices for cooling printed circuit boards
CN201846543U (zh) * 2010-09-30 2011-05-25 苏州新海宜通信科技股份有限公司 户外通信设备用防太阳辐射机柜
CN201878439U (zh) * 2010-11-15 2011-06-22 华为终端有限公司 数据卡
CN102548341A (zh) * 2010-12-10 2012-07-04 旭丽电子(广州)有限公司 散热壳体结构

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3113588A4 *

Also Published As

Publication number Publication date
EP3113588A1 (en) 2017-01-04
US20170055375A1 (en) 2017-02-23
CN203896613U (zh) 2014-10-22
EP3113588A4 (en) 2017-04-05

Similar Documents

Publication Publication Date Title
JP6311111B2 (ja) 放熱構造
CN106813270A (zh) 一种电磁加热设备
WO2015169032A1 (zh) 一种热控机壳
CN201740106U (zh) 一种采用抛物线镜面反射板的远红外线取暖器
TWM525395U (zh) 一種燃氣灶具的餘熱發電結構
TW201440627A (zh) 可攜式電腦設備
CN204670942U (zh) 电加热盘及电饭煲
CN205006640U (zh) 一种具有散热结构的壳体及电压力锅
TWM511068U (zh) 展熱裝置
TWM542324U (zh) 可攜帶電子裝置之散熱塗層結構
CN202949578U (zh) 一种发热装置
CN203074359U (zh) 一种节能电加热炉
CN105054774A (zh) 一种具有散热结构的壳体及电压力锅
CN206094194U (zh) 带超薄控制器的电磁炉
CN204923861U (zh) 高温箱式炉
TW202031113A (zh) 感溫變色疊層及包含其之散熱模組
CN104706227B (zh) 电加热盘、电饭煲及制作电极板的方法
CN109140771A (zh) 一种踢脚线对流取暖器
CN204670947U (zh) 电加热盘及电饭煲
CN209072804U (zh) 一种电器设备防潮装置
CN211902994U (zh) 一种远红外加热炉
CN201631925U (zh) 电磁波治疗器照射头
GR20090100418A (el) Συγκροτημα ανακλασης θερμοτητας τοστιερας (εσω εξω ανακλαστηρας)
JP3191255U (ja) 遠赤外線放射可能な加熱装置
CN106264185B (zh) 一种导风散热式电烤炉

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14891396

Country of ref document: EP

Kind code of ref document: A1

REEP Request for entry into the european phase

Ref document number: 2014891396

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 15124821

Country of ref document: US

Ref document number: 2014891396

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE