WO2015167827A1 - Caloduc de pompe à bouchon - Google Patents

Caloduc de pompe à bouchon Download PDF

Info

Publication number
WO2015167827A1
WO2015167827A1 PCT/US2015/026391 US2015026391W WO2015167827A1 WO 2015167827 A1 WO2015167827 A1 WO 2015167827A1 US 2015026391 W US2015026391 W US 2015026391W WO 2015167827 A1 WO2015167827 A1 WO 2015167827A1
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
condenser
capillary channels
liquid
vapor
Prior art date
Application number
PCT/US2015/026391
Other languages
English (en)
Inventor
Jeremy Rice
Original Assignee
J R Thermal LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J R Thermal LLC filed Critical J R Thermal LLC
Publication of WO2015167827A1 publication Critical patent/WO2015167827A1/fr

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Definitions

  • a capillary wick heat pipe is a tube with a wick structure bonded to the inner diameter of the tube and a hollow core.
  • Heat can be input at any location along the pipe, and anywhere heat is applied is called an evaporator.
  • the liquid that saturates the wick is vaporized and flows down the hollow core.
  • the sections along the heat pipe where heat is removed is called the condenser.
  • the condenser In the condenser, vapor from the core condenses on the wick. Liquid is pumped by capillary action from the condenser to the evaporator.
  • the most common operating limit of a heat pipe is the capillary dry-out limit.
  • the capillary pressure is insufficient to pump the liquid through the wick from the condenser to the evaporator, resulting in a dry wick (no liquid) in the evaporator.
  • Increased transport distance limits the heat load an individual heat pipe can tolerate. Pumping against gravity also limits the transport length.
  • a looped heat pipe operates similarly to a conventional heat pipe in that it is driven by capillarity.
  • the main difference is that there is only a wick in the evaporator, where the vapor flows to the condenser in one tube while the liquid is returned to the evaporator in another tube. Since the liquid flows in a tube, not a wick, the resistance to the liquid flow is reduced significantly, compared to a capillary wicked heat pipe, thus increasing the transport distance.
  • the major drawback of a looped heat pipe is that vapor plugs in the liquid line that pass through the wick in the evaporator can make the unit fail to function, since the wick needs to be saturated with liquid. Special consideration needs to be taken to ensure these conditions don't arise.
  • thermosyphon is another two phase device, where the condensate is returned from the condenser to the evaporator by gravity. Vapor flows upwards, against the pull of gravity, through the center of a relatively large diameter tube while liquid condensate flows downwards along the tube walls. The pool of liquid that accumulates in the bottom of the tube may be boiled to continue the process. The condensation process may only happen above the evaporator, therefore these units have a significant orientation dependence. When orientation is favorable, these units can be used to transfer several watts to several kilowatts or more.
  • thermosyphon is similar to a thermosyphon in that gravity returns condensate to the evaporator, however, the liquid is returned to the evaporator via a distinct tube. Vapor is supplied to the condenser through a separate tube as well. There is liquid build up in or immediately following the condenser in these devices. The difference in this liquid build up height, to the liquid height in the evaporator drives the fluid flow. For a low impedance system, this liquid build up may be as low as 5mm, but can also be several meters or more. The major drawback of this system is the same as a thermosyphon, in that condensation can only occur above the evaporator.
  • a bubble pump is a two-phase device, and consists of an evaporator and a condenser with tubes connecting the two devices. During the evaporation/boiling process, vapor and liquid are supplied to the condenser/radiator. Vapor bubbles generated in the evaporator drive liquid slugs upwards, with respect to gravity, towards a condenser/radiator.
  • a bubble pump operates by latent heat transfer as well as sensible heat transfer, since the liquid flow rates induced by the bubble pump are much greater than the liquid flow rates produced by condensing vapor alone.
  • a pulsating heat pipe consists of a serpentine capillary tube.
  • the tube is structured to have several parallel flow paths between the evaporator and the condenser.
  • the flow is a capillary liquid slug and vapor plug flow. Since the length and position of these slugs and plugs is not the same in each channel, the expansion of the vapor slugs in the evaporator and contraction in the condenser causes the fluid to oscillate in the tubes.
  • the operation of the pulsating heat pipe depends on a perpetually unstable thermodynamic condition. These devices can operate against gravity, and heat can travel a relatively large distance (several meters); however, there is contradictory evidence to the limitations and characteristics of such devices, such as heat limits, and temperature differentials required for operation.
  • the slug pump heat pipe addresses limitations in gravity or inertial driven two-phase heat transfer systems, such as looped thermosyphons.
  • liquid and vapor are stratified in the bottom of the condenser (or collector) with an interface height above the evaporator. This condition does not allow for condensation heat transfer below the evaporator, thus limiting the application base where the technology can be applied.
  • the slug pump heat pipe allows for condensation heat transfer below the evaporator. This feature is enabled by the use of many parallel capillary channels in the condenser which promote the formation of discrete liquid slugs and vapor plugs along the length of the channel.
  • FIG 1 is a schematic drawing of a looped thermosyphon in accordance with prior art
  • FIG 2 is a schematic drawing of one embodiment of a slug pump heat pipe of the present invention
  • FIG 3 is a schematic drawing of the equivalent pressure head of a series of slugs in a capillary tube relative to a large diameter tube;
  • FIG 4 is a schematic drawing of a second embodiment of a slug pump heat pipe in which the evaporator and condenser are configured to switch functionality;
  • FIG 5 is a schematic drawing of one embodiment of a slug pump heat pipe for use in an electronics system
  • FIG 6 is a schematic drawing of one embodiment of a condenser with numerous parallel capillary channels
  • FIG 7 is a schematic drawing of one embodiment of an evaporator with numerous parallel capillary channels.
  • FIG 8 is a schematic drawing of one embodiment of a slug pump heat pipe air-to- air heat exchanger.
  • Various embodiments of the slug pump heat pipe of the present invention allow for the passive heat transport of a two-phase (liquid/vapor) flow under multiple orientations by utilizing pressure head built up in the condenser by recurring liquid slugs and vapor plugs along the length of capillary channels under gravitational forces.
  • the channel diameter or width must be less than the critical dimension defined as follows:
  • the surface tension is denoted by cr , the density by p , and gravity by g.
  • D the density
  • p the density
  • g gravity
  • the critical diameter is small, it is necessary to have many parallel channels along the length of the condenser, which increases the total cross-sectional area for fluid to travel with less resistance, thus reducing the pressure loss.
  • the high number of channels also increases the total surface area for heat transfer to occur.
  • the liquid 102 flows from the condenser 105 to the evaporator 104 through a first tube connecting the two components.
  • Heat 100 is applied to the evaporator 104 and the liquid 102 is vaporized.
  • Vapor 103 flows through a second tube connecting the evaporator 104 to the condenser 105 where heat is rejected 101, closing the loop.
  • the flow in the tube filled with vapor 103 will have some liquid 102 in it.
  • the flow in this tube may be annular flow, with vapor 103 in the core and liquid 102 on the periphery, or may be stratified with liquid 102 on the bottom and vapor 103 on the top, depending on the mass flux of each phase and the tube diameter.
  • thermosyphon appears to be a similar device. It can also achieve operation under multiple orientations, however, due to the stratification of the liquid and vapor phases in the condenser, much of the condenser length below the evaporator is ineffective.
  • the poor condenser performance below the evaporator is the result of sub-cooling a liquid (below the saturation temperature) under the low liquid flow rates in the system.
  • FIG. 1 demonstrates this phenomena, where the evaporator 104 sits mid-way up the condenser 105, with respect to gravity 106.
  • a slug pump heat pipe is presented in FIG.
  • the condenser 105 and evaporator 104 sit in the same relative position as with the looped thermosyphon.
  • the liquid slugs 107 start forming near the top of the condenser 105, due to the surface tension effects in the small diameter channels.
  • the formation of the these liquid slugs 107 allow for vapor plugs 108 to exist below the evaporator 104, while still maintaining a net pressure head to drive the condensate back to the evaporator 104. Wherever a vapor plug 108 comes into contact with a capillary channel wall, condensation will occur, enabling good heat transfer attributes.
  • the length of the vapor plugs 108 will decrease along the length of the condenser 105, as the specific volume of the vapor 103 is much greater than that of liquid 102.
  • the vapor plugs 108 may shrink into bubbles once there isn't enough volume to fill up the cross-section of the channels. These bubbles may condense all the way or may flow back to the evaporator 104. In the latter case, the bubble will aide in the flow, and will act like a bubble pump below the evaporator 104.
  • the existence of vapor bubbles at the bottom of the condenser 105 will depend on many factors, including total heat flow, channel diameter, length of condenser, as well as other factors.
  • FIG. 3 An illustration of the equivalent hydrostatic pressure build up in a capillary tube with liquid slugs 107 compared to a large tube with stratified phases is presented in FIG. 3.
  • the equivalent liquid height, h, 109 of the capillary tube may be obtained by taking an integral along the centerline 110 of the capillary tube as follows:
  • the pressure head along the capillary tube is approximately equivalent to the total length of the liquid slugs 107 along the center line.
  • the total pressure differential of the slug pump heat pipe, Ap is the pressure head difference on the condenser side and the evaporator side, as can be calculated by EQ 3. If the frictional losses in the system are less than this pressure differential, then the system will function, if not, dry-out conditions will occur.
  • the charge of the working fluid is also critical in these systems. An approximate starting point to determine the charge is to calculate the volume inside the tubes, evaporator 104, condenser 105 and any reservoirs or headers. The volume will be occupied by 30-70% liquid and the rest vapor. Experimentation will usually be required to fine tune the charge amount for a particular application.
  • FIG. 4 An alternative embodiment is represented in FIG. 4 where both the evaporator
  • the vapor plugs 108 will be longer in the evaporator 104 and the liquid slugs 107 will be longer in the condenser 105. This difference creates the pressure head necessary for the circulation of liquid 102 and vapor 103. Since the evaporator 104 and condenser 105 both have many parallel capillary channels, the direction of heat flow may be reversed, and the condenser 105 may have heat applied to it instead of rejected from it, thus making it an evaporator. The reverse is true for the evaporator 104.
  • FIG. 5 The general components of a slug pump heat pipe and how they may be designed for a lower profile electronics system are presented in FIG. 5.
  • This embodiment has two evaporators 104 connected to a common condenser 105, by a tube 111 supplying liquid 102 to the evaporators and a second tube 112 returning vapor 103 to the condenser 105.
  • the evaporators 104 make contact with an electronics component, such as a CPU (not shown), via a thermal interface material and an external force that creates a pressure between the two devices. Since the condenser 105 has many capillary channels, a high degree of functionality may be achieved when the slug pump heat pipe is orientated in many ways with respect to gravity 106.
  • gravity 106 may point down or up, as seen in FIG. 5, in which case the evaporators 104 sit mid-way up the condenser 105.
  • the formation of liquid slugs 107 in the capillary channels inside the condenser 105 help promote condensation below the evaporator 104. If the same design were to be operated in an orientation where the condenser 105 was above the evaporators 104 with respect to gravity (gravitational vector pointed to the left), the unit can operate at nearly the same performance.
  • liquid slugs 107 will still form in the condenser 105 as a result of the capillary channels, however, they do not aid in the pressure head build up since they are perpendicular to the gravitational force 106.
  • the unit can operate with gravity 106 oriented towards the z axis.
  • the condenser 105 must be above the evaporators 104, with respect to gravity 106, in order to drive liquid back to the evaporators 104.
  • the liquid slugs 107 do not aid in the pressure head build up since the capillary channels are normal to gravity 106. Even when the capillary channels don't aid in the buildup of liquid pressure head, they do aid in the overall heat transfer characteristics of the condenser 105, since there is a significant increase in overall surface area inside the condenser 105.
  • the size of the condenser 105 is approximately 1.5" tall by 9" wide and 1.5" deep in the embodiment presented in FIG. 5, the evaporators 104 are approximately 1.5" x 1.5" x 0.25", and the evaporators 104 are located approximately 4 and 8 inches from the front of the condenser 105. It may be desirable to size the tube diameter for the horizontal implementation (gravity pointed into the z axis), since the pressure head to drive the fluid through the system is approximately 10mm, which is the lowest pressure head of all the viable orientations.
  • the evaporators 104 may be made out of copper, aluminum or other suitable materials.
  • the transport tubes 111, 112 may be made from the same material as the evaporators 104.
  • the tubes 111, 112 connecting the evaporators 104 to the condenser 105 may be flame brazed, when the materials are different (e.g., aluminum or copper) or the same (e.g., aluminum).
  • the entire assembly may be brazed as a single unit.
  • Working fluids that are suitable for this design are hydrofluorocarbons, hydrofluoroethers, hydrofluoroolefins, hydrocarbons, water or ammonia among others.
  • the tube sizing depends on the operating temperatures, fluid selection and maximum power that is desired to be supported, since these parameters impact the fluid velocities and thus the hydrodynamic losses within the system.
  • capillary channels Inside the condenser 105 there are many capillary channels which, in some embodiments, are in a parallel configuration. This is necessary since the hydrodynamic loss inside a single channel will be relatively large compared to a larger channel, which will likely lead to a severe limit in the maximum supported channels.
  • An extruded tube or other suitable alternative may be used to construct these capillary channels. In the case where there needs to be several rows of these channels, limitations of extrusion technology may prevent this from happening.
  • the channels can be constructed by alternate methods. One example of an alternate method for producing these channels is depicted in FIG. 6.
  • the capillary channels in this embodiment are formed from a formed sheet of metal 113 that has a wavy pattern, and a flat piece of sheet metal 114.
  • the condenser core is brazed to a fin stack 118 in which air may pass through, allowed the heat released by the condensation process to be absorbed by the air passing through.
  • Alterative embodiments may have a series of condenser cores and fin stacks 118 to limit the reliance on thermal conduction within the fins 118 when the condenser size increases.
  • FIG. 7 One embodiment is presented in FIG. 7 where the same basic components as are used in the condenser are used, such as a wavy fin 113, a flat fin 114, a top cover 115, and a bottom cover 116.
  • the bottom cover 116 will come into contact with a heat generating component, such as a CPU, via thermal interface material.
  • the fins in the evaporator protrude perpendicularly to the bottom 116 and top 115 covers, which differs from the condenser, where the formed material is generally parallel to these pieces.
  • the designer may choose one of these configurations or an alternate configuration to form the capillary channels.
  • a single row of rectangular or square capillary channels may also be used with a stacked or folded fin.
  • the present invention may be utilized in air to air heat transfer applications, as presented in FIG. 8.
  • hot air may be cooled as is passes through, as the heat vaporizes the liquid inside of it.
  • cool air may pass through and increase in temperature as it passes through, as the vapor condenses.
  • the condenser core 119 consists of many parallel capillary channels and conducts to a stack of fins 118.
  • the evaporator may be of identical construction as the condenser.
  • the warm and cool air streams may be reversed, thus converting the functionality of the evaporator into the condenser and vice versa.
  • gravity 106 In order for this process to be reversible, gravity 106 must be pointed down or up as seen on the page. When gravity 106 is pointed down, the capillary channels help promote two-phase heat transfer in both the condenser 105 and evaporator 104 along the entire vertical length of each device, thus allowing for a high percentage of the overall cross-sectional area to be utilized for heat transfer. If gravity is pointed towards the left, the evaporator and condenser will still function, but the system will lose the ability to reverse the direction of the heat flow.
  • Gravity 106 has been described as the driving force for the slug pump heat pipe to operate.
  • a centrifugal force may replace gravity as the driving force as well, and the slug pump heat pipe may also operate, as long as many capillary channels are utilized in the condenser.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un caloduc de pompe à bouchon permettant un transport passif de chaleur d'un système à deux phases (liquide/vapeur) fermé dans de multiples orientations par rapport à la gravité ou sous une force d'inertie, telle qu'une force centrifuge. Alors que l'écoulement de fluide est entraîné par une force gravitationnelle ou inertielle (par exemple une force centrifuge) le dispositif permet un transfert de chaleur de condensation sous l'évaporateur, par rapport à une telle force de corps. Étant donné qu'un transfert de chaleur de condensation peut être obtenu sous l'évaporateur, la zone efficace du condenseur est presque uniforme dans diverses orientations.
PCT/US2015/026391 2014-04-28 2015-04-17 Caloduc de pompe à bouchon WO2015167827A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461984916P 2014-04-28 2014-04-28
US61/984,916 2014-04-28

Publications (1)

Publication Number Publication Date
WO2015167827A1 true WO2015167827A1 (fr) 2015-11-05

Family

ID=54334440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/026391 WO2015167827A1 (fr) 2014-04-28 2015-04-17 Caloduc de pompe à bouchon

Country Status (2)

Country Link
US (1) US20150308750A1 (fr)
WO (1) WO2015167827A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI717263B (zh) * 2019-04-17 2021-01-21 日商古河電氣工業股份有限公司 散熱裝置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2540670B (en) 2016-06-22 2018-02-14 Future Energy Source Ltd A solar energy capture, energy conversion and energy storage system
US10260819B2 (en) * 2016-07-26 2019-04-16 Tokitae Llc Thermosiphons for use with temperature-regulated storage devices
JP6904190B2 (ja) * 2017-09-19 2021-07-14 株式会社デンソー 車両用熱交換装置
US11686530B2 (en) * 2018-03-16 2023-06-27 Hamilton Sundstrand Corporation Plate fin heat exchanger flexible manifold
US11051428B2 (en) * 2019-10-31 2021-06-29 Hamilton Sunstrand Corporation Oscillating heat pipe integrated thermal management system for power electronics
CN113473790B (zh) * 2020-03-15 2022-10-28 英业达科技有限公司 浸入式冷却系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788922B2 (ja) * 1986-09-29 1995-09-27 株式会社日立製作所 ヒ−トパイプ型蒸気発生器
US20060266499A1 (en) * 2003-01-24 2006-11-30 Choi Jae J Cooling device of hybrid-type
JP2007263427A (ja) * 2006-03-28 2007-10-11 Seizo Hataya ループ型ヒートパイプ
KR20140006680A (ko) * 2012-07-06 2014-01-16 삼성전자주식회사 냉장고 및 이에 구비되는 열교환기
US20140110087A1 (en) * 2012-01-05 2014-04-24 Huawei Technologies Co., Ltd. Gravity loop heat pipe heat sink, condenser, and production methods thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6615912B2 (en) * 2001-06-20 2003-09-09 Thermal Corp. Porous vapor valve for improved loop thermosiphon performance
US6684941B1 (en) * 2002-06-04 2004-02-03 Yiding Cao Reciprocating-mechanism driven heat loop
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
US20050217294A1 (en) * 2004-04-01 2005-10-06 Norsk Hydro Asa Thermosyphon-based refrigeration system
EP2568789B1 (fr) * 2011-09-06 2014-04-16 ABB Research Ltd. Échangeur de chaleur

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788922B2 (ja) * 1986-09-29 1995-09-27 株式会社日立製作所 ヒ−トパイプ型蒸気発生器
US20060266499A1 (en) * 2003-01-24 2006-11-30 Choi Jae J Cooling device of hybrid-type
JP2007263427A (ja) * 2006-03-28 2007-10-11 Seizo Hataya ループ型ヒートパイプ
US20140110087A1 (en) * 2012-01-05 2014-04-24 Huawei Technologies Co., Ltd. Gravity loop heat pipe heat sink, condenser, and production methods thereof
KR20140006680A (ko) * 2012-07-06 2014-01-16 삼성전자주식회사 냉장고 및 이에 구비되는 열교환기

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI717263B (zh) * 2019-04-17 2021-01-21 日商古河電氣工業股份有限公司 散熱裝置
US10996001B2 (en) 2019-04-17 2021-05-04 Furukawa Electric Co., Ltd. Heatsink

Also Published As

Publication number Publication date
US20150308750A1 (en) 2015-10-29

Similar Documents

Publication Publication Date Title
US20150308750A1 (en) Slug Pump Heat Pipe
CN111642103B (zh) 高热流密度多孔热沉流动冷却装置
AU2008343788B2 (en) Heat pipes incorporating microchannel heat exchangers
US20070227703A1 (en) Evaporatively cooled thermosiphon
US20200041214A1 (en) Intermittent thermosyphon
US9777967B2 (en) Temperature glide thermosyphon and heat pipe
EP3115729B1 (fr) Échangeur de chaleur
US5655598A (en) Apparatus and method for natural heat transfer between mediums having different temperatures
JP6260368B2 (ja) 自励振動ヒートパイプ
JP6678235B2 (ja) 熱交換器
CN111504107A (zh) 一种树形结构热管
JP2011142298A (ja) 沸騰冷却装置
US20200049053A1 (en) System for efficient heat recovery and method thereof
CN210862316U (zh) 传热系统
CN212431877U (zh) 一种树形结构热管
CN111278255B (zh) 基于凝结传热的相变蓄热装置及其关键参数确定方法
US20180023900A1 (en) Diphasic cooling loop with satellite evaporators
CN108323099B (zh) 翅片式热管耦合散热器
Hammad Design and Investigation of a pulsating heat pipe for electronic cooling
CN113624046B (zh) 一种阵列翅片式冷凝装置及环路热管
AU2014250674A1 (en) Heat pipes incorporating microchannel heat exchangers
CN221598516U (zh) 散热器及散热系统
CN221575920U (zh) 相变散热装置及散热系统
KR100431500B1 (ko) 초소형 냉각장치
CN100356555C (zh) 散热器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15785512

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15785512

Country of ref document: EP

Kind code of ref document: A1