WO2015161842A1 - Procédé de post-nettoyage d'éléments de contact métalliques - Google Patents

Procédé de post-nettoyage d'éléments de contact métalliques Download PDF

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Publication number
WO2015161842A1
WO2015161842A1 PCT/DE2015/100080 DE2015100080W WO2015161842A1 WO 2015161842 A1 WO2015161842 A1 WO 2015161842A1 DE 2015100080 W DE2015100080 W DE 2015100080W WO 2015161842 A1 WO2015161842 A1 WO 2015161842A1
Authority
WO
WIPO (PCT)
Prior art keywords
aqueous solution
ppm
solution according
surfactants
solution
Prior art date
Application number
PCT/DE2015/100080
Other languages
German (de)
English (en)
Inventor
Alexander Meyerovich
Helmut RIECHMANN
Original Assignee
Harting Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harting Kgaa filed Critical Harting Kgaa
Publication of WO2015161842A1 publication Critical patent/WO2015161842A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/20—Other heavy metals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0073—Anticorrosion compositions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C11D2111/16—
    • C11D2111/22—

Definitions

  • the invention is based on an aqueous solution for the pretreatment or post-cleaning of contact elements with a surface made of a silicon-containing copper alloy.
  • DE 36 35 636 A1 discloses an aqueous solution for the pretreatment or post-purification of copper-containing surfaces, wherein the solution has a pH of> 7.
  • DE 10 78 405 B discloses corrosion inhibitors for
  • a thin layer of silicon that can interfere with the adhesion of a subsequent coating to the base material and that can lead to layer spalling usually needs a silicon-containing copper alloy
  • a subsequent cleaning or a pretreatment of workpieces with a silicon-containing copper alloy surface takes place in an aqueous solution.
  • a solution is also called a post-cleaning solution.
  • a solution based on sodium hydroxide (NaOH) or potassium hydroxide (KOH).
  • an addition of corrosion inhibitor and anionic and / or nonionic surfactants is preferably present in the solution. This allows a uniform removal of the silicon-containing copper alloy surface with low average roughness.
  • the surface is silicate-containing, since the silicon is also present in the oxidized state.
  • the post-cleaning solutions which are alkaline according to the present invention contain corrosion inhibitors which reduce a negative effect on the non-ferrous metal surfaces. Without these corrosion inhibitors, the surfaces would be attacked with increasing alkalinity of the solutions, which may lead to a more or less significant weight change, occasionally associated with a gloss decrease of polished surfaces.
  • Alkylaminotriazole such as alkylaminotriazole in Fatty acid polydiethanolamide (Texamin® AT3), benzotriazoles,
  • MEA Monoethanolamine
  • the solution contains 5 to 1000 ppm (parts per million), preferably 10 to 200 ppm, of one or more corrosion inhibitors, Particular preference is given to the use of 20 ppm Corrosion inhibitor in the solution, which provides good corrosion protection with sufficient surface coverage.
  • the Nachtherapies want used in the invention preferably contains at least two different surfactants from the
  • surfactants are compounds which reduce the interfacial tension of a solution. These are amphiphilic compounds with at least one hydrophobic and one hydrophilic moiety.
  • surfactants such as anionic surfactants and / or nonionic surfactants, amphoteric surfactants and block copolymers (in particular of ethylene oxide and
  • the surface and interfacial tension can be significantly reduced.
  • An example of the anionic surfactants is sodium 2-ethylhexyl sulfate. This wetting agent is highly effective, but low foaming for strongly alkaline and electrolyte-containing media.
  • the nonionic surfactants such as, for example, the fatty alcohols, are generally well suited for reducing the surface tension of the aqueous solution according to the invention. They have the added benefit of lathering little and thus the
  • foaming can reduce the circulation pump pressure in the plating bath.
  • Suitable nonionic surfactants are, for example, alkyl polyglycosides (e.g., octyl glycosides, hexyl glycosides), fatty alcohol ethoxylates having a chain length of 10-18 carbon atoms, and 2-10 moles of ethylene oxide
  • EO EO
  • PO propylene oxide
  • Supporting agents are so-called wetting agents, preferably ethoxylated fatty acid phosphates and fatty amine oxides.
  • Cocoamidopropylbetaines and / or cocopropylsulfobetaines are preferably used as amphoteric surfactants.
  • the content of anionic surfactants in the solution is preferably 15 to 500 ppm, more preferably 15 to 100 ppm, still more preferably 15 to 50 ppm.
  • Nonionic surfactants in the solution are preferably 15 to 500 ppm, more preferably 15 to 200 ppm, more preferably 25 to 100 ppm.
  • the ready-to-use solution preferably has one
  • the surface tension is determined by means of a tensiometer according to the so-called bubble pressure method.
  • the contact element to be treated is preferably exposed to the solution for between 10 seconds and 6 minutes.
  • the solutions according to the invention for the post-purification of the silicon-containing copper alloys are very suitable.
  • silicon-containing copper alloys are provided with metal coatings of nickel, copper, tin and their respective alloys.
  • the layer adhesion is tested by bending tests of the sheets, wherein the sheets are bent by about 180 °.
  • the poor layer adhesion of Comparative Examples 1 and 2 is shown in the bending test by flaking off the galvanized layer at the kink point.
  • the coating properties are not affected by the components introduced into the bath by the aftertreatment, in particular by the corrosion inhibitor, surfactants or alkaline Solution, negatively affected.

Abstract

L'invention concerne une solution aqueuse de prétraitement ou de post-nettoyage d'éléments de contact possédant une surface en alliage de cuivre contenant du silicium, la solution étant alcaline, c'est-à-dire ayant un pH>7, et contenant au moins un inhibiteur de corrosion. Idéalement, la solution contient au moins deux agents tensioactifs différents, les agents tensioactifs étant des agents tensioactifs anioniques et/ou des agents tensioactifs non ioniques et/ou des agents tensioactifs amphotères et/ou des copolymères en bloc.
PCT/DE2015/100080 2014-04-25 2015-03-02 Procédé de post-nettoyage d'éléments de contact métalliques WO2015161842A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014105823.2A DE102014105823A1 (de) 2014-04-25 2014-04-25 Nachreinigungsverfahren von metallischen Kontaktelementen
DE102014105823.2 2014-04-25

Publications (1)

Publication Number Publication Date
WO2015161842A1 true WO2015161842A1 (fr) 2015-10-29

Family

ID=52807472

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2015/100080 WO2015161842A1 (fr) 2014-04-25 2015-03-02 Procédé de post-nettoyage d'éléments de contact métalliques

Country Status (2)

Country Link
DE (1) DE102014105823A1 (fr)
WO (1) WO2015161842A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1078405B (de) 1954-09-16 1960-03-24 Geigy Ag J R Korrosionsinhibitor zum Schutze von Kupfer und seinen Leigierungen
DE3635636A1 (de) 1985-10-23 1987-04-23 Ciba Geigy Ag Korrosionsinhibierendes verfahren
DE4119102A1 (de) * 1991-06-10 1992-12-17 Henkel Kgaa Verfahren zur vorbehandlung von buntmetall-oberflaechen vor einer galvanischen metallbeschichtung
US20010004633A1 (en) * 1999-11-16 2001-06-21 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US20050181961A1 (en) * 2004-02-12 2005-08-18 Ashutosh Misra Alkaline chemistry for post-CMP cleaning
DE102004045297A1 (de) 2004-09-16 2006-03-23 Basf Ag Verfahren zum Behandeln von metallischen Oberflächen unter Verwendung von Formulierungen auf Basis von wasserarmer Methansulfonsäure
EP2415887A1 (fr) * 2009-03-31 2012-02-08 JX Nippon Mining & Metals Corporation Alliage de cuivre à base de cuivre, de cobalt et de silicium destiné à être utilisé dans l'électronique, et procédé de fabrication de cet alliage

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1078405B (de) 1954-09-16 1960-03-24 Geigy Ag J R Korrosionsinhibitor zum Schutze von Kupfer und seinen Leigierungen
DE3635636A1 (de) 1985-10-23 1987-04-23 Ciba Geigy Ag Korrosionsinhibierendes verfahren
DE4119102A1 (de) * 1991-06-10 1992-12-17 Henkel Kgaa Verfahren zur vorbehandlung von buntmetall-oberflaechen vor einer galvanischen metallbeschichtung
US20010004633A1 (en) * 1999-11-16 2001-06-21 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US20050181961A1 (en) * 2004-02-12 2005-08-18 Ashutosh Misra Alkaline chemistry for post-CMP cleaning
DE102004045297A1 (de) 2004-09-16 2006-03-23 Basf Ag Verfahren zum Behandeln von metallischen Oberflächen unter Verwendung von Formulierungen auf Basis von wasserarmer Methansulfonsäure
EP2415887A1 (fr) * 2009-03-31 2012-02-08 JX Nippon Mining & Metals Corporation Alliage de cuivre à base de cuivre, de cobalt et de silicium destiné à être utilisé dans l'électronique, et procédé de fabrication de cet alliage

Also Published As

Publication number Publication date
DE102014105823A1 (de) 2015-10-29

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