WO2015159126A1 - Del flexible - Google Patents

Del flexible Download PDF

Info

Publication number
WO2015159126A1
WO2015159126A1 PCT/IB2014/060747 IB2014060747W WO2015159126A1 WO 2015159126 A1 WO2015159126 A1 WO 2015159126A1 IB 2014060747 W IB2014060747 W IB 2014060747W WO 2015159126 A1 WO2015159126 A1 WO 2015159126A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
pcb
lighting
referring
light
Prior art date
Application number
PCT/IB2014/060747
Other languages
English (en)
Inventor
Stefan Kreidler
Original Assignee
Stefan Kreidler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stefan Kreidler filed Critical Stefan Kreidler
Priority to PCT/IB2014/060747 priority Critical patent/WO2015159126A1/fr
Publication of WO2015159126A1 publication Critical patent/WO2015159126A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • LED lighting arrangements can be based on many principles.
  • "Corn-Lamps” are normally an assembly of rigid fiberglass or aluminum PCB-Elements each one equipped with several relatively low powered LEDs. Smaller Corn-Lamps are integrating a number of PCBs normally by soldering one to the other while bigger Corn-Lamps may contain structures to keep the PCBs in their position.
  • “LED-Arrays” are somewhat similar to Corn-Lamps but they are typically restricted to flat (two-dimensional) arrangements.
  • LED-Strips are a thing in between, they are linear and Flexible. LED-Strips can be used for many things - even to provide three-dimensional shape to a device for decoration or lighting. Yet LED-strips are not really suitable to create devices since they normally imply a lot of labor, additional heatsink and structural parts to avoid the strips wiggling or moving away from their intended position.
  • LED-Lighting assemblies based on multiple rigid PCBs look like "tinker" -items. Visible and touchable solder-contacts on the surface and the sheer number of solder-joints make such products unreliable and expensive.
  • the PCB-Material By absence of conducts or by adding (varnishing or laminating) isolating layers, the PCB-Material can be designed and specified to comply with requirements for isolation. By coating or filling the structure with resin or varnish, the targeted apparatus can additionally be equipped with an "IP-degree of protection" - if required.
  • Heat sink and heat abduction By specifying the thickness and material of conductive layers also the heat within the PCB can be managed according to requirements. One common method is to enlarge conducts to increase their surface for heat dissipation. "Wings" or particular dissipation surfaces can be added as required. Also it is possible to abduct heat to a separate dissipation unit by the use of conductive layers as heat-pipes.
  • the big advantage and saving is to be found in the "assembly" of the flexible PCB.
  • This consists normally of 1 (one single) piece.
  • the amount of employed labor and the risk of quality issues are much smaller.
  • the product takes the desired shape and function. Alignment and (manual) soldering are reduced to a minimum or even immanent to the PCBs design.
  • LED- modules By adopting pattern and layouts suitable for parallel or serial multiplication of such structures, big surfaces and big quantities of light can be reached. Further such LED- modules can be equipped with logic or ID-control, so they can perform as pixels or arrays in correspondingly controlled applications.
  • This invention has a broad scope of application ranging from possible tiny G4 to big E40 LED-Bulb applications, to adaptable replacement-solutions for existing or new types of wall- or ceiling apparatus or any kind of freely shaped surface-lighting of small, modular or substantial dimension (e.g. barrel-shaped bill-boards).
  • the invention may be used also in streetlights or in the automotive field.
  • High, mid or low power LEDs, COB or as defined hereafter COFB, and even remote phosphor may be applied to make use of the principles specified in this invention.
  • PCB Flexible Printed Circuit Board
  • This invention also differentiates from rigid PCBs that may be bendable to one side if only one side is used for conductive layers.
  • the aim of this invention is to integrate a number (l..n) of potentially three-dimensional PCB-Surfaces that are interlinked on the same unit of PCB.
  • Such "single-free-cutout" pattern shall be bent and fixed to obtain designated two or three dimensional lighting units with virtually no limitation to geometric shape.
  • Chip on Flexible Board (COFB) Since this COFB-technology is an innovative approach proposed here, it requires some effort to deduct and define the intention of the term.
  • COB Chip on Board
  • Such substrates are made of Ceramics, Aluminum or other materials providing a good heatsink and rigid protection along with built-in reflectors or other function.
  • filament LEDs With the increased popularity of filament LEDs some new kinds of substrate have found their way to the markets.
  • Filament LEDs a number (typically 7..10 pes) of very low power LED-Chips is placed in series on a very slim glass or aluminum strip- substrate. Then by bonding to each other and to the circuit at the end of the substrate the LED-Chips get connected.
  • Glass-Substrate has the advantage of permitting the light transmission to both sides of the substrate and a little bit of heat-abduction while aluminum "threads" have better heat abduction but may chop some of the light. Both technologies are very subtle and filigree for making and in particular for applying the phosphorus to the LED-Filament. Further the assembly-process to obtain filament-based Lamps (looking like "original” bulbs) is very cumbersome and implies a lot of manual labor.
  • Lighting Device The invention clearly aims for lighting purposes. Applications for arrangements of controller or other electronics are not in the primary focus, even if they may contain some LED lighting units to indicate a control-status.
  • Heat-Sink Even if LEDs are very efficient the energy supplied to them will be transferred to structural heat in an extent of around 90%. Sustainable lighting devices must therefore foresee the abduction and dissipation of the heat generated in the LEDs.
  • the heat of the targeted lighting devices shall be fully dissipated by the flexible PCBs. Additional heat-sink capacity (e.g. aluminum cooler) shall be attached only if required.
  • additional cooling can be provided by abducting heat with "extra-heat-pads" attached as wings to the PCBs structure or by using a PCBs duct as a heat-pipe to lead excessive heat to an "external” dissipation-device.
  • Modularity When a lighting module is done in a pattern that can be used in a cluster of double or multiple (l..n) without changing the general setup of the arrangement this is considered being modular. It is foreseen to provide such lighting modules to enable the creation of big surfaces of lighting-modules, arranged in flat or three dimensional manner.
  • Flexible PCB Composition of bendable materials to enable the operation of electronic components by leading electricity through the conducts of the material.
  • the composition consists of different layers of materials to perform different functions such as isolation, conduction, etc.
  • PCB-Carrier-Material Isolating material (for flexible PCBs e.g. Polyimide - but not limited thereto) to constitute and carry the structures of a printed circuit.
  • PCB-Conducting layers Typical flexible PCBs consist of one or two conducting layers. Typically the Front-Layer is used for small "local" circuits while the layer on the PCBs rear is used for the supply with current throughout the PCB. 4. Via: Conductors / conducting layers on the two sides of the PCB (or on multiple layers) are inter-connected with plated-through holes named "via”.
  • PCB-lsolation layer and optical enhancements to the layer(s) Electric isolation is a vital function of PCBs. Such isolation can be composed of Laminate, LED-phosphor (on COB), Varnish, absence of material ("air” or vacuum), liquids or other method if applicable. An interrupt (by void, cut, break, etc.) of optically carrying material can be required for "optical isolation”. This may be the case to prevent (blue or red) LED-light from COFB-LED-Chips to escape through its transparent PCB carrying substrate (that would function as an optical duct if not interrupted).
  • the isolation layer of a PCB being subject to this invention shall however possibly abduct the heat of a conductive layer to the next layer above or to the ambient of the PCB. Therefore isolating layers may be optimized for their heat sink-function or they may be additionally equipped with particular surface to increase heat dissipation.
  • Transparent or partly opaque flexible isolation layers may be utilized to distribute the emitted light over a desired surface. In order to do so a transparent substrate can be provided with (printed, engraved, etc.) structure in order to capture eventually inducted light for redistribution (principle known from LED-Panels).
  • a transparent substrate can be provided with (printed, engraved, etc.) structure in order to capture eventually inducted light for redistribution (principle known from LED-Panels).
  • PCB information Layer(s) Text or numeric information can be added to a PCB e.g. by modifying conductive layers by removing "negative text" from the corresponding surface. The same method could be used for "negative information" on the isolating layer. More commonly however is the application of data or marketing-information to the top-surface of the isolating or heat dissipating layer.
  • Connector is a unit on the PCB foreseen to connect this same to another element of the functioning system.
  • Connectors may be used to attach a standardized Base to the apparatus or to attach a controller, driver or also to attach other PCB-Elements in a modular system.
  • Connector may find embodiments as solder-points (often coinciding with a Via) or as a jack- or plug-module soldered to the surface of the PCB. Wiggle-Line-Contacts leading the PCBs conducts to another system-element may be part of some embodiments.
  • Figure 1 shows a typical example of a G4 LED-Corn-Lamp next to a G4 Halogen-Lamp
  • Figure 2. shows a scheme of a G4-LED-Corn-Lamp made of flexible PCB
  • Figure 3 shows a possible PCB-pattern for a materialization of the lamp illustrated in fig. 2
  • Figure 4. shows options to increase the heatsink surface to flexible PCB-pattern
  • Figure 5. shows a methods to stabilize & shape flexible PCB without using additional components
  • FIG. shows possible enhancements of PCB-Segments to add functionality
  • FIG. shows possible generic PCB-Pattern for modular application
  • Figure 8. shows additional optical elements attached to an embodiment made of flexible PCB
  • FIG. shows two methods for making COFB assemblies (LED-Chips On Flexible Board)
  • Figure 10 shows two methods for making CIFB assemblies (LED-Chips inside Flexible Board)
  • Figure 11 shows a possible cutout-pattern for an E27 A55-Replacement Lamp using CIFB
  • Figure 12. shows a Mockup of E27 A55-Replacement Lamp using the CIFB-Pattern of Fig. 11 Detailed description of the invention - Part 4:
  • Figure 1 shows an example of a G4 Halogen Lamp and its LED-Substitute next to it.
  • Corn Lamps received their name due to their appearance as the single LEDs look like Corn on a Cob (maize).
  • Corn Lamps are typically an assembly of a number of relatively low power LEDs in an arrangement to ensure a desired light distribution. The quantity of LEDs and their power determine the flux of the apparatus.
  • Such arrangement has some advantages in comparison to morphologies based on power LEDs emitting big quantities of light to one direction and requiring structural heatsink in an extent corresponding to their power.
  • the relatively low power in the (big) number of LEDs on a corn makes heat-management easier - it is normally dissipated by the PCB or "absorbed".
  • the distribution of light according to the positioning of the individual LEDs is another advantage.
  • Figure 2 shows a simple product to replace products as shown in fig. 1 based on flexible PCB. All the lighting-part of this G4 LED lamp is placed on a double sided flexible PCB.
  • This flexible PCB is in its final structure strong enough to fulfill the lamps static requirements when installing and in operation.
  • the use of latest technology LEDs also allows the placement of printed information (legal requirement often not considered in small corn lamps of "old style"). Looks and haptics of the new product are much "smoother" and will improve the acceptance.
  • the air convection enabled with this arrangement will - by making use of the rear side of the PCB - significantly increase the heatsink of this product in comparison to a traditional corn lamp.
  • Figure 3 shows some of the elementary steps for the "making of" a lamp as shown in fig.2.
  • the invention is clegrly tgrgeted glso to bigger Igmps gnd gppgrgtus to genergte big gmounts of light, even for public lighting.
  • This "tiny" grrgngement is used here for the egse of understgnding gnd illustrgtion.
  • the principles of this invention gre explicitly gpplicgble glso to big gnd powerful lighting gppgrgtus.
  • Figure 3.1 shows the cutout pgttern of the PCB-Module. It shgll be mentioned here thgt the cutout will normglly be done when the "rgw" PCB is finished in gll its Igyers. However it will be essentigl for the efficient industrigl production gnd for the gssembly of these products thgt entire sheets of PCB will be produced. Such sheets will be typicglly contgining severgl (l..n) PCB-Modules gnd they gre equipped with devices for alignment of the sheet throughout the following process of equipping with electronic components and LEDs. The single Module will remain connected to the sheet by predetermined breaking points until the production will no longer require alignment for automated processing or for ease of workflow. Such predetermined breaking points are illustrated in fig. 7 in relation to the positioning and detachment of "wiggle" connectors.
  • Figure 3.1 also shows the "long-hole” cutouts to determine the easy and correct folding of the sections. Besides these cutouts there are through holes to prepare the "vias" of the PCB.
  • Figure 3.2 shows the rear conductive layer of the flexible PCB.
  • This layers first purpose is to supply the entire PCBs surface with electric potential.
  • the layout of this "supply-layer” is designed to enable individual provision and control of every "branch” and element on the PCB. Voids in the supply-layer are added to make the fold easier and precise in designated locations.
  • the maximization of the conductive layer in relation to the entire surface of the PCB is mainly intended to utilize the ability of heat conduction by the layers material.
  • the heat - normally inducted from the opposite side layer bearing the LEDs - will be absorbed and dissipated by the opposite supply-layer.
  • Figure 3.3 displays the front circuit of the PCB.
  • the arrangement of conductive surfaces and vias enables the individual supply with electric potential to every element of the PCB. Big and multiple Vias can help to maximize the heat transfer from the front to the back-side. However - a big part of heat will be transferred through the PCB-carrier. To maximize this desired effect all surfaces of the circuit layers conducts are extended as much as possible.
  • the front layer In “opposite” alignment with the "supply-layer” also the front layer foresees "voids" to enable easy and correct bending of the PCB.
  • Figures 3.4 to 3.6 depict a number of steps in the process of making LED-Modules.
  • Figures 3.7 and 3.8 show how the flexible PCB assembly is attached to a controller / driver-PCB and finalized with a plastic cover to close the bottom of the product.
  • Figure 4.1 and 4.2 show two possible embodiments of increasing the heatsink-surface by adding surface to the PCB.
  • the number of variants and arrangements of such "heatsink-pads" is numerous.
  • the temperature inside the LED (and other electronic components) is relevant for its lifetime. Additional surface to abduct and distribute heat will be of benefit as long as the system temperature can be lowered. Having high temperature on a dissipation wing is not a problem as long as the temperature in the LEDs is lowered by the use of more surface or abduction.
  • One additional option is to use highly reflective conductive layers (e.g. silver) to ensure a maximum emission of the LED-light eventually reflected from within the assembly.
  • the phosphor can be applied to the LEDs and eventually to the opposite side of the (transparent) carrier by different methods.
  • Figure 9.1 shows an image with the phosphor applied through a stencil - similar to a stencil for applying solder paste.
  • Phosphor also on the "back" of the LED-chip respectively on the opposite side of the substrate.
  • the advantage will be that the substrate emits light to all directions. Further methods and variants to apply the phosphor are not listed in detail or combination here since there are many (injection molding, remote phosphor pads, tubes or domes, etc.). All methods are applicable on one side or on both sides depending on the targeted effect and arrangement for lighting.
  • red LEDs By blending in red LED- light Phosphor with less red-part can be used. This is normally more efficient. Concerning the phosphor also the difference between silicon-Based (flexible) phosphor shall be considered in comparison to phosphor integrated to rigid plastic. While rigid phosphor will provide some robustness to the assembly in the same this may be dangerous in relation to the moving parts. The use of soft silicone-based phosphor shall therefore be considered. It is expected that the bonding is showing better reliability when the ambient structure allows some marginal movements according to thermal or mechanical stress.
  • FIG. 10 depicts schematically two principles for the making of CIFB-Assemblies (Chip in (inserted to) flexible board).
  • the novelty of this development is of a kind that it is applicable not only to flexible but also the rigid substrates such as Glass, Polycarbonate (PC), PMMA or any other adequate material.
  • the abbreviated name for such application is CIB - Chip IN Board. Making CIB/CIFB for lighting applications is totally new in its kind.
  • the substrate gets perforated in the locations where an LED-Chip shall be inserted.
  • Such perforations can be big enough for one single LED-Chip or for a "cluster" of LED-Chips (l..n).
  • the LED-Chips can be bonded directly to each other or by using conducts "printed” to the surface of the substrate or to an underlying carrier (becoming the conductive substrate).
  • Such perforated "Array” can extend considerably according to the requirements and targets of the lighting apparatus.
  • the targets of inserting the LED-Chips to the substrate are the following:
  • the light being emitted laterally is available for distribution throughout the surface of the substrate being used as optical duct. By adding texture to the substrate or to its surface the light carried by it can be extracted and distributed as required.
  • a "sandwich-assembly" of two (or more l..n) substrates and/or layers can be another method to obtain the desired results (Figure 10.2).
  • Substrates and layers may be equipped with desired particular function (electric, optical, thermal, etc.) to optimize the results.
  • Figure 11 shows a possible layout pattern for the making of a CIFB-Based replacement "bulb".
  • This CIFB-Module is done in one single piece for the demonst tion of this possibility. Since the gssembly in this cgse mgy require some skills it mgy be considered to do such product in two or more pieces of PCB. Also it mgy be considered - in cgse the flexibility is not gn essentigl fgctor for the gssembly of such [gmp - to use "rigid” or relgtively "stiff" mgterigl for this gssembly. The hgptic perception mgy require some "mgss".
  • Figure 12 shows a Mockup based on the layout pattern of Figure 11.
  • the proposed solution offers as an enhancement the possibility to "flip" the front-parts of the lamps wings. This is to redirect the light emitted from this part to desired direction (e.g. more to the front). All 4 elements may be flipped individually to one or the other direction. If the market will require it for better acceptance a “housing” (outer Bulb) can be added to such apparatus as it is done to protect filament LEDs. For the sake of heatsink it will be better however to assure sufficient cooling to the lighting devices.
  • housing outer Bulb

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention (solutions d'éclairage et ampoules à DEL et DEL-COFB à base de PCB flexible) porte sur des procédés de fabrication de dispositifs électroluminescents et des agencements pour modules ou « ampoules » d'éclairage à DEL utilisant un certain nombre de sources de lumière à DEL placées sur une structure de PCB flexible. La présente invention envisage l'utilisation d'une PCB flexible, intégrant et assurant plusieurs fonctions. Outre le circuit électrique sur une, deux couches ou plus, la PCB peut assurer une fonction statique, des fonctions isolantes, la dissipation thermique, l'abduction de chaleur vers des éléments dissipateurs thermiques (caloducs), la facilité de montage automatisé, et principalement la réalisation de formes tridimensionnelles conçues librement pour des ampoules ou autres appareils d'éclairage avec ou sans la nécessité d'utiliser des composants additionnels assurant la fonction statique, de dissipation thermique, électrique ou autre. La technologie COB sera en particulier étudiée puisqu'on peut prévoir qu'une telle technologie peut conduire à un saut quantique dans la fabrication et l'apparence d'un appareil d'éclairage à DEL. Les dispositifs d'éclairage sur la base de la présente invention peuvent être utilisés pour un éclairage direct ou en combinaison avec des éléments optiques. Le but de la présente invention est d'offrir des procédés faciles à réaliser mais hautement rentables et efficaces pour la création de dispositifs d'éclairage. Des ampoules à DEL, modules, moteurs lumière, éléments d'éclairage ou tout type d'appareil pouvant tirer parti de l'utilisation de PCB flexibles tridimensionnelles sont des sujets de la présente invention. L'invention peut être étudiée pour un appareil d'éclairage de conception nouvelle ou un appareil modernisé comme les applications d'installation rétroactive. La présente invention facilite l'intégration de processus, l'automatisation et la production de masse. Une fabrication orientée sur la qualité est simple et fiable.
PCT/IB2014/060747 2014-04-16 2014-04-16 Del flexible WO2015159126A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/IB2014/060747 WO2015159126A1 (fr) 2014-04-16 2014-04-16 Del flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2014/060747 WO2015159126A1 (fr) 2014-04-16 2014-04-16 Del flexible

Publications (1)

Publication Number Publication Date
WO2015159126A1 true WO2015159126A1 (fr) 2015-10-22

Family

ID=50829221

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2014/060747 WO2015159126A1 (fr) 2014-04-16 2014-04-16 Del flexible

Country Status (1)

Country Link
WO (1) WO2015159126A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017153856A1 (fr) * 2016-03-07 2017-09-14 Osram Gmbh Dispositif d'éclairage et procédé correspondant
TWI603036B (zh) * 2015-12-25 2017-10-21 LED lighting device and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090261368A1 (en) * 2008-04-16 2009-10-22 Harvatek Corporation Led chip package structure using a substrate as a lampshade and method for making the same
WO2010002156A2 (fr) * 2008-06-30 2010-01-07 Park Chang Soo Carte de circuits imprimés pour une lumière de del pouvant être facilement mise en application dans une forme polyèdre et polygonale
WO2010034873A1 (fr) * 2008-09-26 2010-04-01 Kone Corporation Agencement et procédé en relation avec un appareil d'éclairage
GB2484152A (en) * 2010-12-03 2012-04-04 Zeta Controls Ltd Method of manufacturing an electrical device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090261368A1 (en) * 2008-04-16 2009-10-22 Harvatek Corporation Led chip package structure using a substrate as a lampshade and method for making the same
WO2010002156A2 (fr) * 2008-06-30 2010-01-07 Park Chang Soo Carte de circuits imprimés pour une lumière de del pouvant être facilement mise en application dans une forme polyèdre et polygonale
WO2010034873A1 (fr) * 2008-09-26 2010-04-01 Kone Corporation Agencement et procédé en relation avec un appareil d'éclairage
GB2484152A (en) * 2010-12-03 2012-04-04 Zeta Controls Ltd Method of manufacturing an electrical device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603036B (zh) * 2015-12-25 2017-10-21 LED lighting device and manufacturing method thereof
WO2017153856A1 (fr) * 2016-03-07 2017-09-14 Osram Gmbh Dispositif d'éclairage et procédé correspondant

Similar Documents

Publication Publication Date Title
US10476543B2 (en) Method and apparatus for chip-on board flexible light emitting diode
TWI481071B (zh) Light-emitting device LED 3D surface lead frame
US9541274B2 (en) Illumination module and illumination device comprising a flexible carrier
EP2856004B1 (fr) Lampe avec carte de circuit flexible
JP2009277586A (ja) 電球型ｌｅｄ照明器具
TWI591289B (zh) 用於發光二極體之熱管理技術
JP2013004389A (ja) 照明装置
CN101641551B (zh) 具有全向发光和优化热耗散的led光源
JP6343812B2 (ja) コーティング式立体構造回路の製造方法、回路パネルを有しないｌｅｄ電球ランプおよび電子部品、ｌｅｄ照明装置
KR100878721B1 (ko) 탈부착형 ｌｅｄ 백라이트 장치
EP2314913A1 (fr) Support d'unité d'émission lumineuse et source lumineuse comportant ce support
CN101769521A (zh) 用于发光装置的散热装置及其发光装置
CN103791439A (zh) 新型led照明装置
CN102959327A (zh) 替代白炽灯的高强度led
CN104110598A (zh) 柔性led光源
WO2015159126A1 (fr) Del flexible
JP3146901U (ja) 発光ダイオード用フレキシブル薄型回路基板及びこれを応用して形成した発光ダイオードライトバー
JP6495307B2 (ja) Ｌｅｄ照明装置
CN103672485A (zh) Led灯具结构
CN103807622B (zh) 照明装置
CN202769315U (zh) 灯泡
EP2848102A1 (fr) Support de montage pour sources de rayonnement lumineux à semi-conducteur et sa source lumineuse
EP2856023B1 (fr) Dispositif d'éclairage possédant un dissipateur de chaleur séparé d'un organe de commande
CN205424463U (zh) 一种基于软性线路板的led灯
JP2011129381A (ja) 照明装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14726767

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14726767

Country of ref document: EP

Kind code of ref document: A1