WO2015139402A1 - Radio-frequency asymmetrical low-impedance test fixture - Google Patents
Radio-frequency asymmetrical low-impedance test fixture Download PDFInfo
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- WO2015139402A1 WO2015139402A1 PCT/CN2014/083056 CN2014083056W WO2015139402A1 WO 2015139402 A1 WO2015139402 A1 WO 2015139402A1 CN 2014083056 W CN2014083056 W CN 2014083056W WO 2015139402 A1 WO2015139402 A1 WO 2015139402A1
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- impedance
- test fixture
- pcb board
- microstrip lines
- radio
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- 238000012360 testing method Methods 0.000 title claims abstract description 40
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 239000003990 capacitor Substances 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000009466 transformation Effects 0.000 claims 3
- 238000005259 measurement Methods 0.000 abstract description 6
- 230000010355 oscillation Effects 0.000 abstract description 4
- 230000001131 transforming effect Effects 0.000 description 14
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
Definitions
- the invention relates to the technical field of radio frequency microwave measurement, in particular to a radio frequency asymmetric low impedance test fixture. Background technique
- a 50 ⁇ test fixture is usually used to test a large gate width, high power PA (Power Amplifier, power amplifier), a 50 ⁇ test fixture is a symmetrical test fixture, and a symmetrical test fixture refers to an input and output end converted into equal impedance values. Because the input and output impedances of the device under test are not equal, the input impedance and output impedance of the existing 50 ⁇ test fixture cannot fully match the test of the device under test. The input impedance mismatch causes the test power to easily cause low frequency. Oscillation, burning the device, and output impedance mismatch lead to inaccurate measurements. Summary of the invention
- the technical problem to be solved by the present invention is to provide a radio frequency asymmetric low-impedance test fixture capable of matching the input and output impedance of the device to be tested, preventing the device to be tested from being burned, and ensuring the accuracy of the microwave performance measurement of the device to be tested.
- the present invention provides a radio frequency asymmetric low-impedance test fixture, including: a PCB board and a bottom board; a left side of the PCB board is provided with a first impedance transforming unit, and the right side of the PCB board is disposed There is a second impedance transforming unit; the first impedance transforming unit and the second impedance transforming unit are respectively composed of a set of gradual microstrip lines, each of the sets of the microstrip lines having the same width , the length of each of the microstrip lines in the arrangement direction is from small to large, and then from large to small
- the PCB board is further provided with a fan capacitor, a power terminal and a ground terminal, and one plate of the fan capacitor is connected to the second impedance conversion unit and the power terminal, and the other pole of the fan capacitor
- the board is grounded, the ground end is used for grounding; the PCB board is connected to the upper end of the bottom board.
- the PCB board is further provided with a heat dissipation hole.
- a screw is further included; the PCB board is disposed on the bottom plate by the screw. Further, a heat dissipation hole is disposed on the bottom plate.
- each of the microstrip lines includes 100 of the microstrip lines.
- the radio frequency asymmetric low-impedance test fixture provided by the invention respectively transforms the impedance matched with the input and output of the device to be tested by the first impedance transforming unit and the second impedance transforming unit, thereby effectively improving the real part of the impedance of the transistor to be tested. Solve the source problem of oscillation, prevent burning of the device to be tested, and ensure the accuracy of microwave measurement of the device to be tested.
- FIG. 1 is a schematic structural diagram of a PCB board according to an embodiment of the present invention.
- FIG. 2 is a schematic structural diagram of a bottom plate according to an embodiment of the present invention. detailed description
- an RF asymmetric low-impedance test fixture provided by an embodiment of the present invention includes: a PCB board 7, a bottom plate 9, and a screw.
- a first impedance transforming unit 1 is disposed on the left side of the PCB board 7, and a second impedance transforming unit 2 is disposed on the right side of the PCB board 7, and the first impedance transforming unit 1 and the second impedance transforming unit 2 are respectively composed of a set of gradual With a line (such as Klopfenstein gradient microstrip line), each group of microstrip lines consists of 100 microstrip lines, each microstrip line in each group has the same width, each group The length of the microstrip line varies in the direction of arrangement from small to large and then from large to small.
- a line such as Klopfenstein gradient microstrip line
- the PCB board 7 is further provided with a sector capacitor 3, a power terminal 4 and a ground terminal 5.
- One plate of the sector capacitor 3 is connected to the second impedance conversion unit 2 and the power terminal 4, and the other plate of the sector capacitor 3 is grounded and grounded.
- the terminal 5 is used for grounding, and is connected to the end hole of the PCB board 7 to be grounded;
- the PCB board 7 is connected to the upper end of the bottom plate 9 by screws, and the bottom plate 9 is made of a copper plate, and the two ends of the bottom plate 9 can be provided with electrical connectors according to actual needs. Used to connect with external electrical components.
- the PCB 7 is further provided with a heat dissipation hole 6.
- a heat dissipation hole is provided in the bottom plate 9.
- the impedance-transform pre-matching PCB board 7 Since the low-impedance test fixture needs to test the S-parameters of different frequency points of the large gate width LDMO S device to evaluate the device frequency characteristics, the impedance-transform pre-matching PCB board 7 must be broadband, and the gradient microstrip line can be well implemented. At the same time, in combination with the impedance of the device under test, etc., in the present invention, the PCB 7 is implemented by a 100-section Klopfenstein gradient microstrip line, the input impedance is changed from 50 ohms to 10 ohms, and the output impedance is changed from 50 ohms to 3 ohms. The fan capacitor 3 functions to isolate the high frequency signal and filter the power supply ripple.
- the two pins of the device to be tested are respectively connected to the heads of the first impedance transforming unit and the second impedance transforming unit (ie, the two sets of microstrip lines are relatively Dense end).
- the bandwidth of the radio frequency asymmetric low-impedance test fixture provided by the embodiment of the invention covers the P-band, the L-band, and the S-band, and the test has a wide application range, and can test the unstable region of the device to be tested.
- the radio frequency asymmetric low-impedance test fixture provided by the embodiment of the invention can be used for the device performance test of the microwave RF power tube, but its use may introduce test errors, and the vector network analyzer test results include a low-impedance test fixture.
- the TRL algorithm can be used to accurately calibrate the low-impedance test fixture.
- the radio frequency asymmetric low-impedance test fixture provided by the invention can obtain the impedance matched with the input and output of the device to be tested by the first impedance transforming unit 1 and the second impedance transforming unit, and can effectively improve the period to be tested (eg, The real part of the impedance of the transistor to be tested solves the source problem of the oscillation, prevents burning of the device to be tested, and ensures the accuracy of microwave measurement of the device to be tested.
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Microwave Amplifiers (AREA)
Abstract
The present invention relates to the technical field of radio-frequency microwave measurement, and particularly to a radio-frequency asymmetrical low-impedance test fixture. The test fixture comprises: a PCB board (7) and a bottom plate (9). The left side of the PCB board (7) is provided with a first impedance conversion unit (1), and the right side of the PCB board (7) is provided with a second impedance conversion unit (2). The first impedance conversion unit (1) and the second impedance conversion unit (2) are respectively composed of a group of gradually varied microstrip lines, wherein the widths of all microstrip lines of each group of microstrip lines are the same, and the lengths of each group of microstrip lines regularly change in order from small to big and then in order from big to small in the arrangement direction. The PCB board (7) is connected to the upper end of the bottom plate (9). The provided radio-frequency asymmetrical low-impedance test fixture can effectively increase the real part of the impedance of a transistor to be tested, solve the source problem of oscillation, and prevent a device to be tested from being burnt, thereby guaranteeing that the radio frequency and microwave performance of the device to be tested are fully played.
Description
射频非对称低阻抗测试夹具 RF asymmetric low impedance test fixture
技术领域 Technical field
本发明涉及射频微波测量技术领域，特别涉及一种射频非对称低阻抗测试 夹具。 背景技术 The invention relates to the technical field of radio frequency microwave measurement, in particular to a radio frequency asymmetric low impedance test fixture. Background technique
目前， 通常使用 50 Ω测试夹具测试大栅宽、 高功率的 PA(Power Amplifier, 功率放大器）， 50 Ω测试夹具为对称型测试夹具， 对称型测试夹具是指输入输 出端变换成相等的阻抗值， 因为被测试设备的输入、 输出阻抗不相等， 所以现 有的 50 Ω测试夹具变换后的输入阻抗与输出阻抗不能够完全匹配被测试设备 的测试， 输入阻抗失配导致测试大功率容易引起低频振荡， 烧毁器件， 输出阻 抗失配导致测量不准确。 发明内容 At present, a 50 Ω test fixture is usually used to test a large gate width, high power PA (Power Amplifier, power amplifier), a 50 Ω test fixture is a symmetrical test fixture, and a symmetrical test fixture refers to an input and output end converted into equal impedance values. Because the input and output impedances of the device under test are not equal, the input impedance and output impedance of the existing 50 Ω test fixture cannot fully match the test of the device under test. The input impedance mismatch causes the test power to easily cause low frequency. Oscillation, burning the device, and output impedance mismatch lead to inaccurate measurements. Summary of the invention
本发明所要解决的技术问题是提供一种能够与待测试器件的输入、输出阻 抗相匹配， 防止烧毁待测试器件， 保证待测试器件微波性能测量准确度的射频 非对称低阻抗测试夹具。 The technical problem to be solved by the present invention is to provide a radio frequency asymmetric low-impedance test fixture capable of matching the input and output impedance of the device to be tested, preventing the device to be tested from being burned, and ensuring the accuracy of the microwave performance measurement of the device to be tested.
为解决上述技术问题， 本发明提供了一种射频非对称低阻抗测试夹具， 包 括： PCB板及底板； 所述 PCB板的左侧设置有第一阻抗变换单元， 所述 PCB 板的右侧设置有第二阻抗变换单元；所述第一阻抗变换单元和所述第二阻抗变 换单元分别由一组渐变的微带线组成，每组所述微带线中的每条微带线的宽度 相同， 每组所述微带线的长度在排列方向上按照从小到大， 再从大到小的规律
变化； 所述 PCB板上还设置有扇形电容、 电源端和接地端， 所述扇形电容的 一个极板与所述第二阻抗变换单元及所述电源端连接，所述扇形电容的另一个 极板接地， 所述接地端用于接地； 所述 PCB板连接在所述底板的上端。 In order to solve the above technical problem, the present invention provides a radio frequency asymmetric low-impedance test fixture, including: a PCB board and a bottom board; a left side of the PCB board is provided with a first impedance transforming unit, and the right side of the PCB board is disposed There is a second impedance transforming unit; the first impedance transforming unit and the second impedance transforming unit are respectively composed of a set of gradual microstrip lines, each of the sets of the microstrip lines having the same width , the length of each of the microstrip lines in the arrangement direction is from small to large, and then from large to small The PCB board is further provided with a fan capacitor, a power terminal and a ground terminal, and one plate of the fan capacitor is connected to the second impedance conversion unit and the power terminal, and the other pole of the fan capacitor The board is grounded, the ground end is used for grounding; the PCB board is connected to the upper end of the bottom board.
进一步地， 所述 PCB板上还设置有散热孔。 Further, the PCB board is further provided with a heat dissipation hole.
进一步地， 还包括螺钉； 所述 PCB板通过所述螺钉设置在所述底板上。 进一步地， 所述底板上设置有散热孔。 Further, a screw is further included; the PCB board is disposed on the bottom plate by the screw. Further, a heat dissipation hole is disposed on the bottom plate.
进一步地， 每组所述微带线中包含 100根所述微带线。 Further, each of the microstrip lines includes 100 of the microstrip lines.
本发明提供的射频非对称低阻抗测试夹具，通过第一阻抗变换单元和第二 阻抗变换单元分别变换得到与待测试器件输入、输出相匹配的阻抗， 可以有效 的提高待测晶体管的阻抗实部， 解决振荡的源头问题， 防止烧毁待测试器件， 保证待测试器件微波测量准确度。 附图说明 The radio frequency asymmetric low-impedance test fixture provided by the invention respectively transforms the impedance matched with the input and output of the device to be tested by the first impedance transforming unit and the second impedance transforming unit, thereby effectively improving the real part of the impedance of the transistor to be tested. Solve the source problem of oscillation, prevent burning of the device to be tested, and ensure the accuracy of microwave measurement of the device to be tested. DRAWINGS
图 1为本发明实施例提供的 PCB板结构示意图； 1 is a schematic structural diagram of a PCB board according to an embodiment of the present invention;
图 2为本发明实施例提供的底板结构示意图。 具体实施方式 FIG. 2 is a schematic structural diagram of a bottom plate according to an embodiment of the present invention. detailed description
参见图 1和图 2， 本发明实施例提供的一种射频非对称低阻抗测试夹具， 包括： PCB板 7、底板 9及螺钉。 PCB板 7的左侧设置有第一阻抗变换单元 1， PCB板 7的右侧设置有第二阻抗变换单元 2， 第一阻抗变换单元 1和第二阻抗 变换单元 2分别由一组渐变的微带线 （如 Klopfenstein渐变微带线） 组成， 每 组微带线由 100条微带线组成， 每组微带线中的每条微带线的宽度相同， 每组
微带线的长度在排列方向上按照从小到大， 再从大到小的规律变化。 PCB板 7 上还设置有扇形电容 3、 电源端 4和接地端 5， 扇形电容 3的一个极板与第二 阻抗变换单元 2及电源端 4连接， 扇形电容 3 的另一个极板接地， 接地端 5 用于接地， 且与 PCB板 7上需要接地的端孔连接； PCB板 7通过螺钉连接在 底板 9的上端， 底板 9采用铜板， 且底板 9的两端可以根据实际需要设置电气 接头， 用于和外部的电器元件连接。 本发明实施例中， PCB 板 7 上还设置有 散热孔 6。 底板 9上设置有散热孔。 Referring to FIG. 1 and FIG. 2, an RF asymmetric low-impedance test fixture provided by an embodiment of the present invention includes: a PCB board 7, a bottom plate 9, and a screw. A first impedance transforming unit 1 is disposed on the left side of the PCB board 7, and a second impedance transforming unit 2 is disposed on the right side of the PCB board 7, and the first impedance transforming unit 1 and the second impedance transforming unit 2 are respectively composed of a set of gradual With a line (such as Klopfenstein gradient microstrip line), each group of microstrip lines consists of 100 microstrip lines, each microstrip line in each group has the same width, each group The length of the microstrip line varies in the direction of arrangement from small to large and then from large to small. The PCB board 7 is further provided with a sector capacitor 3, a power terminal 4 and a ground terminal 5. One plate of the sector capacitor 3 is connected to the second impedance conversion unit 2 and the power terminal 4, and the other plate of the sector capacitor 3 is grounded and grounded. The terminal 5 is used for grounding, and is connected to the end hole of the PCB board 7 to be grounded; the PCB board 7 is connected to the upper end of the bottom plate 9 by screws, and the bottom plate 9 is made of a copper plate, and the two ends of the bottom plate 9 can be provided with electrical connectors according to actual needs. Used to connect with external electrical components. In the embodiment of the invention, the PCB 7 is further provided with a heat dissipation hole 6. A heat dissipation hole is provided in the bottom plate 9.
由于低阻抗测试夹具需要测试大栅宽 LDMO S器件不同频点的 S参数来评 估器件频率特性， 因此这个阻抗变换预匹配 PCB板 7必须是宽带的， 采用渐 变微带线能够很好的实现。 同时结合被测试器件阻抗等问题， 本发明中， PCB 板 7采用 100节 Klopfenstein渐变微带线来实现， 输入端阻抗从 50欧姆变换 到 10欧姆， 输出端阻抗从 50欧姆变换到 3欧姆。扇形电容 3起到隔离高频信 号以及滤除电源紋波作用，待测试器件的两个管脚分别连接在第一阻抗变换单 元和第二阻抗变换单元的头部 （即两组微带线较为密集的一端）。 本发明实施 例提供的射频非对称低阻抗测试夹具的带宽涵盖 P波段、 L波段、 S波段， 测 试适用范围很广， 并且可以测试出待测试器件不稳定区域。 本发明实施例提供 的射频非对称低阻抗测试夹具， 可以用于微波射频功率管的器件性能测试， 但 它的使用可能会引入测试误差，利用矢量网络分析仪测试得到的是包括低阻抗 测试夹具和待测管整体的 S 参数， 把射频非对称低阻抗测试夹具的误差影响 去除掉就可以得到待测管准确的 S 参数。 因此对低阻抗测试夹具的校准是测 试的理论前提， 本实施例可采用 TRL算法可以实现对低阻抗测试夹具的准确 校准。
发明提供的射频非对称低阻抗测试夹具，通过第一阻抗变换单元 1和第二 阻抗变换单元分 2别变换得到与待测试器件输入、 输出相匹配的阻抗， 可以有 效的提高待测试期间（如待测试的晶体管）的阻抗实部，解决振荡的源头问题， 防止烧毁待测试器件， 保证待测试器件微波测量准确度。 Since the low-impedance test fixture needs to test the S-parameters of different frequency points of the large gate width LDMO S device to evaluate the device frequency characteristics, the impedance-transform pre-matching PCB board 7 must be broadband, and the gradient microstrip line can be well implemented. At the same time, in combination with the impedance of the device under test, etc., in the present invention, the PCB 7 is implemented by a 100-section Klopfenstein gradient microstrip line, the input impedance is changed from 50 ohms to 10 ohms, and the output impedance is changed from 50 ohms to 3 ohms. The fan capacitor 3 functions to isolate the high frequency signal and filter the power supply ripple. The two pins of the device to be tested are respectively connected to the heads of the first impedance transforming unit and the second impedance transforming unit (ie, the two sets of microstrip lines are relatively Dense end). The bandwidth of the radio frequency asymmetric low-impedance test fixture provided by the embodiment of the invention covers the P-band, the L-band, and the S-band, and the test has a wide application range, and can test the unstable region of the device to be tested. The radio frequency asymmetric low-impedance test fixture provided by the embodiment of the invention can be used for the device performance test of the microwave RF power tube, but its use may introduce test errors, and the vector network analyzer test results include a low-impedance test fixture. And the S-parameter of the whole tube to be tested, the error of the RF asymmetric asymmetric low-impedance test fixture can be removed to obtain the accurate S-parameter of the tube to be tested. Therefore, the calibration of the low-impedance test fixture is the theoretical premise of the test. In this embodiment, the TRL algorithm can be used to accurately calibrate the low-impedance test fixture. The radio frequency asymmetric low-impedance test fixture provided by the invention can obtain the impedance matched with the input and output of the device to be tested by the first impedance transforming unit 1 and the second impedance transforming unit, and can effectively improve the period to be tested (eg, The real part of the impedance of the transistor to be tested solves the source problem of the oscillation, prevents burning of the device to be tested, and ensures the accuracy of microwave measurement of the device to be tested.
最后所应说明的是，以上具体实施方式仅用以说明本发明的技术方案而非 限制， 尽管参照实例对本发明进行了详细说明， 本领域的普通技术人员应当理 解， 可以对本发明的技术方案进行修改或者等同替换， 而不脱离本发明技术方 案的精神和范围， 其均应涵盖在本发明的权利要求范围当中。
It should be noted that the above specific embodiments are only for explaining the technical solutions of the present invention and are not intended to be limiting. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that the technical solutions of the present invention can be Modifications or equivalents are intended to be included within the scope of the appended claims.
Claims
1、 一种射频非对称低阻抗测试夹具， 其特征在于， 包括： PCB板及底板； 所述 PCB板的左侧设置有第一阻抗变换单元， 所述 PCB板的右侧设置有第二 阻抗变换单元；所述第一阻抗变换单元和所述第二阻抗变换单元分别由一组渐 变的微带线组成， 每组所述微带线中的每条微带线的宽度相同， 每组所述微带 线的长度在排列方向上按照从小到大， 再从大到小的规律变化； 所述 PCB板 上还设置有扇形电容、 电源端和接地端， 所述扇形电容的一个极板与所述第二 阻抗变换单元及所述电源端连接， 所述扇形电容的另一个极板接地， 所述接地 端用于接地； 所述 PCB板连接在所述底板的上端。 1. A radio frequency asymmetric low-impedance test fixture, characterized in that it includes: a PCB board and a bottom plate; a first impedance conversion unit is provided on the left side of the PCB board, and a second impedance is provided on the right side of the PCB board Transformation unit; the first impedance transformation unit and the second impedance transformation unit are respectively composed of a group of gradually changing microstrip lines, and the width of each microstrip line in each group of microstrip lines is the same, and the width of each microstrip line in each group is the same. The length of the microstrip line changes in the arrangement direction from small to large, and then from large to small; the PCB is also provided with a fan-shaped capacitor, a power terminal and a ground terminal, and one plate of the fan-shaped capacitor is connected to The second impedance conversion unit is connected to the power terminal, the other plate of the sector capacitor is grounded, and the ground terminal is used for grounding; the PCB board is connected to the upper end of the base plate.
2、 根据权利要求 1所述的射频非对称低阻抗测试夹具， 其特征在于， 所 述 PCB板上还设置有散热孔。 2. The radio frequency asymmetric low-impedance test fixture according to claim 1, characterized in that the PCB is also provided with heat dissipation holes.
3、 根据权利要求 1所述的射频非对称低阻抗测试夹具， 其特征在于， 还 包括螺钉； 所述 PCB板通过所述螺钉设置在所述底板上。 3. The radio frequency asymmetric low-impedance test fixture according to claim 1, further comprising screws; the PCB board is arranged on the base plate through the screws.
4、 根据权利要求 1所述的射频非对称低阻抗测试夹具， 其特征在于， 所 述底板上设置有散热孔。 4. The radio frequency asymmetric low-impedance test fixture according to claim 1, characterized in that the bottom plate is provided with heat dissipation holes.
5、 根据权利要求 1所述的射频非对称低阻抗测试夹具， 其特征在于， 每 组所述微带线中包含 100根所述微带线。
5. The radio frequency asymmetric low-impedance test fixture according to claim 1, characterized in that each group of the microstrip lines contains 100 of the microstrip lines.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410102906.4A CN103852602B (en) | 2014-03-19 | 2014-03-19 | Radio frequency asymmetric Low ESR test fixture |
| CN201410102906.4 | 2014-03-19 |
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| CN203587627U (en) * | 2013-12-05 | 2014-05-07 | 上海联星电子有限公司 | Low-impedance broadband test fixture |
| CN104698227A (en) * | 2013-12-05 | 2015-06-10 | 上海联星电子有限公司 | Low-impedance broadband test fixture |
| CN103852602B (en) * | 2014-03-19 | 2016-12-07 | 上海联星电子有限公司 | Radio frequency asymmetric Low ESR test fixture |
| CN104407181B (en) * | 2014-12-25 | 2017-06-30 | 上海联星电子有限公司 | A kind of test fixture |
| CN106383251B (en) * | 2016-11-30 | 2018-10-09 | 中国电子科技集团公司第二十九研究所 | A kind of wideband high-power test fixture |
| CN106771389A (en) * | 2016-12-07 | 2017-05-31 | 中国科学院微电子研究所 | Fixture and load balance factor system for load balance factor system |
| CN107612572A (en) * | 2017-09-08 | 2018-01-19 | 上海斐讯数据通信技术有限公司 | A kind of radio-frequency match module, the radio system for mobile terminal |
| CN110398678A (en) * | 2019-06-11 | 2019-11-01 | 西安电子科技大学 | A kind of wide impedance ranges test method of large power semiconductor device |
| CN113593344A (en) * | 2021-08-06 | 2021-11-02 | 广东工业大学 | Simulation identification method and system for parameter oscillation of power amplifier |
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| CN103852602A (en) | 2014-06-11 |
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