WO2015133340A1 - Dispositif électrochimique - Google Patents

Dispositif électrochimique Download PDF

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Publication number
WO2015133340A1
WO2015133340A1 PCT/JP2015/055322 JP2015055322W WO2015133340A1 WO 2015133340 A1 WO2015133340 A1 WO 2015133340A1 JP 2015055322 W JP2015055322 W JP 2015055322W WO 2015133340 A1 WO2015133340 A1 WO 2015133340A1
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WO
WIPO (PCT)
Prior art keywords
electrochemical device
case
region
terminal
opening
Prior art date
Application number
PCT/JP2015/055322
Other languages
English (en)
Japanese (ja)
Inventor
和徳 江原
裕樹 河井
直人 萩原
海樹 高橋
ゆり子 伊藤
Original Assignee
太陽誘電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014040360A external-priority patent/JP2018088431A/ja
Priority claimed from JP2014080473A external-priority patent/JP2018088432A/ja
Application filed by 太陽誘電株式会社 filed Critical 太陽誘電株式会社
Publication of WO2015133340A1 publication Critical patent/WO2015133340A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/116—Primary casings; Jackets or wrappings characterised by the material
    • H01M50/117—Inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/08—Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/74—Terminals, e.g. extensions of current collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78—Cases; Housings; Encapsulations; Mountings
    • H01G11/82—Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
    • H01M50/103—Primary casings; Jackets or wrappings characterised by their shape or physical structure prismatic or rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/131—Primary casings; Jackets or wrappings characterised by physical properties, e.g. gas permeability, size or heat resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78—Cases; Housings; Encapsulations; Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/147—Lids or covers
    • H01M50/166—Lids or covers characterised by the methods of assembling casings with lids
    • H01M50/169—Lids or covers characterised by the methods of assembling casings with lids by welding, brazing or soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to an electrochemical device including a chargeable / dischargeable storage element.
  • Electrochemical devices equipped with chargeable / dischargeable storage elements are widely used for backup power supplies and the like.
  • Such an electrochemical device generally has a structure in which a storage element and an electrolytic solution are enclosed in a liquid chamber provided in an insulating case.
  • a positive electrode and a negative electrode terminal are provided on the bottom surface of the electrochemical device, and the positive electrode and the negative electrode of the power storage element are electrically connected to terminals of respective polarities through wiring provided on the case.
  • the terminal is soldered to the substrate so that the electrochemical device is fixed to the substrate and the storage element is electrically connected to the substrate.
  • both of the electric double layer capacitors described in Patent Documents 1 and 2 have a configuration in which a terminal is provided on the bottom surface.
  • the element housed therein is electrically connected to the mounting object via the terminal.
  • a lid (lid) that closes the liquid chamber containing the element and the electrolyte is electrically connected to the positive electrode or the negative electrode of the element, It is common to form a conductive path between the element and the terminal.
  • both of the electric double layer capacitors described in Patent Documents 1 and 2 have a configuration in which a terminal is provided on the bottom surface thereof.
  • the element accommodated in the terminal is electrically connected to the mounting object via the terminal.
  • JP 2001-216852 A (paragraph [0020], FIG. 1)
  • JP 2006-303381 A (paragraph [0017], FIG. 1)
  • solder balls may be generated when the terminals are soldered to the mounting board.
  • the solder ball is a hemispherical lump of solder that protrudes from the periphery of the case. When solder balls are formed, the solder balls roll away from the mounting substrate after mounting, causing a short circuit or the like.
  • an object of the present invention is to provide an electrochemical device capable of preventing the occurrence of a short circuit due to solder.
  • an electrochemical device includes a case, a seal ring, a lid, a terminal, a power storage element, and an electrolytic solution.
  • the case is made of an insulating material, has a concave storage space, and has an opening surface on which the opening of the storage space is located, a bottom surface opposite to the opening surface, and a position between the opening surface and the bottom surface. And a rough surface region that is formed between the terminal and the opening surface on the side surface and is rougher than other regions on the side surface.
  • the seal ring is made of a conductive material, is disposed on the opening surface, and is electrically connected to the first electrode.
  • the lid is joined to the seal ring and closes the housing space to form a liquid chamber.
  • the terminal is disposed on the case, is exposed on the bottom surface, and is electrically connected to the second electrode.
  • the power storage element is provided in the liquid chamber and includes a first electrode and a second electrode having different polarities. The electrolytic solution is accommodated in the liquid chamber.
  • an electrochemical device includes a case, a lid, a terminal, a power storage element, and an electrolytic solution.
  • the case is made of an insulating material, has a concave storage space, and has an opening surface on which the opening of the storage space is located, a bottom surface opposite to the opening surface, and a position between the opening surface and the bottom surface. And a rough surface region that is formed between the terminal and the opening surface on the side surface and is rougher than other regions on the side surface.
  • the lid is made of a conductive material, joined to the opening surface, closes the accommodation space to form a liquid chamber, and is electrically connected to the first electrode.
  • the terminal is disposed on the case, is exposed on the bottom surface, and is electrically connected to the second electrode.
  • the power storage element is provided in the liquid chamber and includes a first electrode and a second electrode having different polarities.
  • the electrolytic solution is accommodated in the liquid chamber.
  • an electrochemical device includes a case, a lid, a power storage element, an electrolytic solution, and a terminal.
  • the case has a concave accommodation space, and includes an opening surface on which the opening of the accommodation space is located, a bottom surface opposite to the opening surface, and a side surface located between the opening surface and the bottom surface, The side surface is provided with an inclined region that is continuous with the bottom surface and has an angle greater than a right angle with the bottom surface.
  • the lid closes the accommodation space to form a liquid chamber.
  • the power storage element is accommodated in the liquid chamber.
  • the electrolytic solution is accommodated in the liquid chamber.
  • the terminal is disposed on the bottom surface and is electrically connected to the power storage element.
  • FIG. 1 is a perspective view of an electrochemical device according to a first embodiment of the present invention. It is sectional drawing of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a top view of the case of the same electrochemical device. It is a top view of the case of the same electrochemical device It is a top view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the same electrochemical device. It is a perspective view of the case of the
  • An electrochemical device includes a case, a seal ring, a lid, a terminal, a power storage element, and an electrolytic solution.
  • the case is made of an insulating material, has a concave storage space, and has an opening surface on which the opening of the storage space is located, a bottom surface opposite to the opening surface, and a position between the opening surface and the bottom surface. And a rough surface region that is formed between the terminal and the opening surface on the side surface and is rougher than other regions on the side surface.
  • the seal ring is made of a conductive material, is disposed on the opening surface, and is electrically connected to the first electrode. The lid is joined to the seal ring and closes the housing space to form a liquid chamber.
  • the terminal is disposed on the case, is exposed on the bottom surface, and is electrically connected to the second electrode.
  • the power storage element is provided in the liquid chamber and includes a first electrode and a second electrode having different polarities.
  • the electrolytic solution is accommodated in the liquid chamber.
  • the seal ring electrically connected to the first electrode is located on the opening surface of the case, and the terminal electrically connected to the second electrode is located on the bottom surface of the case.
  • solder is supplied to the terminals, and soldering is performed between the terminals provided on the mounting board.
  • the terminal and the seal ring have different polarities, which may cause a short circuit between them. .
  • the first electrode or the second electrode may be a positive electrode or a negative electrode.
  • the electrochemical device includes a case, a lid, a terminal, a power storage element, and an electrolytic solution.
  • the case is made of an insulating material, has a concave storage space, and has an opening surface on which the opening of the storage space is located, a bottom surface opposite to the opening surface, and a position between the opening surface and the bottom surface. And a rough surface region that is formed between the terminal and the opening surface on the side surface and is rougher than other regions on the side surface.
  • the lid is made of a conductive material, joined to the opening surface, closes the accommodation space to form a liquid chamber, and is electrically connected to the first electrode.
  • the terminal is disposed on the case, is exposed on the bottom surface, and is electrically connected to the second electrode.
  • the power storage element is provided in the liquid chamber and includes a first electrode and a second electrode having different polarities.
  • the electrolytic solution is accommodated in the liquid chamber.
  • the lid electrically connected to the first electrode is located on the opening surface of the case, and the terminal electrically connected to the second electrode is located on the bottom surface of the case.
  • the electrochemical device when the electrochemical device is mounted on the mounting substrate, there is a possibility that a short circuit occurs between the terminal and the lid.
  • a rough surface region is provided on the side surface of the case, and the wet surface of the solder is prevented by the rough surface region, so that the occurrence of the short circuit can be prevented. It is.
  • either the first electrode or the second electrode may be a positive electrode or a negative electrode.
  • the rough surface area may be a fracture surface of the case.
  • the case can be manufactured by forming a case group in which a plurality of cases are connected and dividing the case group into individual cases. At this time, by applying stress to the case group, the case group can be broken and divided into individual cases.
  • the fracture surface formed at this time is rougher than other regions on the side surface, and can be used as a rough surface region.
  • the arithmetic average roughness Ra of the rough surface area may be 0.75 ⁇ m or more.
  • the surface area of the rough surface area is increased, and the property of the rough surface area to repel solder is improved, so that wetting of the solder can be prevented. It is.
  • the case has a concave accommodation space, and includes an opening surface on which the opening of the accommodation space is located, a bottom surface opposite to the opening surface, and a side surface located between the opening surface and the bottom surface, The side surface is provided with an inclined region that is continuous with the bottom surface and has an angle greater than a right angle with the bottom surface.
  • the lid closes the accommodation space to form a liquid chamber.
  • the power storage element is accommodated in the liquid chamber.
  • the electrolytic solution is accommodated in the liquid chamber.
  • the terminal is disposed on the bottom surface and is electrically connected to the power storage element.
  • the above electrochemical device can be mounted by soldering terminals provided on the bottom surface of the case to a mounting substrate.
  • a slope region is provided on the side surface of the case and is continuous with the bottom surface of the case, even if a solder ball is formed by solder protruding to the periphery of the case, it is crushed in contact with the slope region, or Absorbed by rebounding. That is, in this electrochemical device, it is possible to suppress the formation of solder balls.
  • the terminal may be provided adjacent to the inclined region.
  • This configuration is suitable for suppressing the formation of solder balls because the solder easily comes into contact with the terminals, spreads on the terminals, and is easily absorbed.
  • the case is provided on the side surface, has an inclined region that is continuous with the bottom surface, and has an angle greater than a right angle with the bottom surface,
  • the electrochemical device wherein the rough surface region is a region rougher than the inclined region.
  • the continuity of the side surface of the case is reduced, and the solder is prevented from spreading on the side surface during soldering. That is, in addition to the effect of the rough surface region, the provision of the inclined region also prevents the solder from spreading and prevents a short circuit between the positive electrode and the negative electrode.
  • the said case is an electrochemical device which is formed between the said terminal and the said opening surface in the said side surface, and has a rough surface area
  • the formation of solder balls is suppressed by the inclined region, and the solder surface is prevented from spreading by the rough surface region, so that it is possible to prevent a short circuit between the positive electrode and the negative electrode.
  • the case may be made of a ceramic material.
  • the ceramic material has a property of repelling solder, so that it is possible to prevent the solder from spreading by forming a rough surface region.
  • the above case may be made of HTCC (High Temperature Co-fired Ceramics) or LTCC (Low Temperature Co-fired Ceramics).
  • HTCC or LTCC can be formed by laminating and sintering plate members made of ceramic materials.
  • a conductive material or the like can be disposed between the layers, and the manufacturing efficiency is excellent. Therefore, it is suitable as a constituent material of the case.
  • FIG. 1 is a perspective view showing an appearance of an electrochemical device 100 according to this embodiment
  • FIG. 2 is a cross-sectional view of the electrochemical device 100 taken along line S11-S11 (FIG. 1).
  • the electrochemical device 100 includes a case 11, a lid 12, a power storage element 13, a positive electrode wiring 14, a positive electrode adhesive layer 15, a positive electrode terminal 16, a negative electrode adhesive layer 17, a seal ring 18, a negative electrode wiring 19, and It has a negative electrode terminal 20.
  • the case 11 and the lid 12 are joined via the seal ring 18, and the storage element 13 and the electrolytic solution (not shown) are sealed in the liquid chamber R formed thereby. Configured.
  • the case 11 forms a liquid chamber R together with the lid 12.
  • 3 is a perspective view showing the case 11, FIG. 3 (a) is a view seen from the liquid chamber R side, and FIG. 3 (b) is a view seen from the opposite side.
  • the case 11 has an accommodation space 11a.
  • the storage space 11 a is a space that is closed by the lid 12 and forms the liquid chamber R, and is formed in the case 11 in a concave shape.
  • the shape of the storage space 11 a is not limited to a rectangular parallelepiped shape as shown in the figure, and may be any shape that can form the liquid chamber R together with the lid 12.
  • a via 11b through which the positive electrode wiring 14 is inserted is formed on the bottom surface of the accommodation space 11a.
  • a surface on which the opening of the accommodation space 11a is located is defined as an opening surface 11c.
  • the opening surface 11c corresponds to the upper surface of the side wall of the accommodation space 11a, and is a surface surrounding the periphery of the opening of the accommodation space 11a.
  • a surface on the opposite side (back side) of the opening surface 11c in the case 11 is a bottom surface 11d.
  • the positive electrode terminal 16 and the negative electrode terminal 20 are exposed on the bottom surface 11d.
  • the surface between the opening surface 11c and the bottom face 11d be the side surface 11e.
  • the side surface 11e corresponds to the outer peripheral surface of the side wall of the accommodation space 11a.
  • a rough surface region 11f is formed on the side surface 11e. 3A and 3B, the rough surface region 11f is shown as a gray region.
  • the rough surface region 11f is a region that is rougher and rougher than the other regions on the side surface 11e, and details thereof will be described later.
  • the case 11 is made of an insulating material.
  • the case 11 is made of a ceramic material such as aluminum oxide (Al 2 O 3 ), and is made of HTCC (High Temperature Co-fired Ceramics) or LTCC (Low Temperature Co-fired Ceramics). Ceramics).
  • HTCC and LTCC are obtained by laminating and sintering plate-like members formed from granular ceramic materials. By arranging a metal material or the like on the plate-like member in the lamination process, it is possible to embed the positive electrode wiring 14 and the like inside the case 11 and the manufacturing efficiency is excellent.
  • the lid 12 is joined to the case 11 via the seal ring 18 to seal the liquid chamber R.
  • the lid 12 can be made of any conductive material, for example, can be made of Kovar (iron-nickel-cobalt alloy). Further, the lid 12 may be a clad material in which a base material such as Kovar is coated with a coating made of a metal having high corrosion resistance such as nickel, platinum, silver, gold or palladium in order to prevent electrolytic corrosion. It is.
  • the lid 12 is joined to the case 11 via the seal ring 18 after the electric storage element 13 is arranged inside the liquid chamber R, and seals the liquid chamber R.
  • a direct joining method such as seam welding or laser welding can be used, or an indirect joining method via a conductive joining material can be used.
  • the electricity storage element 13 is accommodated in the liquid chamber R and accumulates (accumulates) electric charge or discharges (discharges) electric charge.
  • the electrical storage element 13 includes a positive electrode sheet 13a, a negative electrode sheet 13b, and a separate sheet 13c, and the separate sheet 13c is sandwiched between the positive electrode sheet 13a and the negative electrode sheet 13b. .
  • the positive electrode sheet 13a is a sheet containing an active material.
  • the active material is a material that adsorbs electrolyte ions (for example, BF 4 ⁇ ) on its surface to form an electric double layer, and can be, for example, activated carbon or PAS (Polyacenic Semiconductor: polyacenic organic semiconductor).
  • PAS Polyacenic Semiconductor: polyacenic organic semiconductor.
  • the positive electrode sheet 13a is formed by rolling a mixture of the above active material, conductive additive (for example, ketjen black) and binder (for example, PTFE (polytetrafluoroethylene)), and cutting it. it can.
  • the negative electrode sheet 13b is a sheet containing an active material like the positive electrode sheet 13a.
  • the negative electrode sheet 13b is formed by rolling a mixture of an active material, a conductive additive and a binder into a sheet shape, and cutting it. it can.
  • the negative electrode sheet 13b can be made of the same material as the positive electrode sheet 13a, or can be made of a different material.
  • the separate sheet 13c is a sheet that electrically insulates the electrodes.
  • the separate sheet 13c can be a porous sheet made of glass fiber, cellulose fiber, plastic fiber or the like.
  • the electrolytic solution accommodated in the liquid chamber R together with the power storage element 13 can be arbitrarily selected.
  • the cation includes lithium ion, tetraethylammonium ion, triethylmethylammonium ion, 5-azoniaspiro [4.4] nonane ion, ethylmethylimidazolium ion, etc.
  • the anion includes BF 4 ⁇ (tetrafluoroborate ion).
  • PF 6 - hexafluorophosphate ion
  • (CF 3 SO 2) 2 N - include anions such (TFSA ion), as the solvent of propylene carbonate, ethylene carbonate, dimethyl carbonate, ethyl methyl carbonate, dimethyl Carbonate, sulfolane, dimethyl sulfone, ethyl methyl sulfone, ethyl isopropyl sulfone and the like can be included.
  • a propylene carbonate solution of 5-azoniaspiro [4.4] nonane-BF 4 or ethylmethylimidazolium-BF 4 can be used.
  • the positive electrode wiring 14 is made of a conductive material, and electrically connects the positive electrode sheet 13 a of the energy storage device 13 and the positive electrode terminal 16 through the positive electrode adhesive layer 15. Specifically, the positive electrode wiring 14 can pass through the inside of the case 11 via the via 11 b and be connected to the positive electrode terminal 16. Metal plating may be formed on the end of the positive electrode wiring 14 on the positive electrode adhesive layer 15 side in order to protect it from electrolytic corrosion due to contact with the electrolytic solution.
  • the positive electrode adhesive layer 15 is made of a conductive adhesive, and adheres the positive electrode sheet 13 a to the case 11 and electrically connects the positive electrode sheet 13 a and the positive electrode wiring 14. As shown in FIG. 2, the positive electrode adhesive layer 15 is disposed on the bottom surface of the liquid chamber R and contacts the positive electrode sheet 13 a and the positive electrode wiring 14. The positive electrode adhesive layer 15 is preferably formed over the entire region of the power storage element 13 (positive electrode sheet 13a) for adhesion and electrical connection of the power storage element 13.
  • the conductive adhesive constituting the positive electrode adhesive layer 15 can be a synthetic resin containing conductive particles.
  • the conductive particles preferably have high chemical stability.
  • graphite particles can be used.
  • the synthetic resin those having low swelling property with respect to the electrolytic solution, high heat resistance, and high chemical stability are suitable.
  • a phenol resin can be used.
  • the positive electrode terminal 16 is a terminal disposed outside the electrochemical device 100, contacts the positive electrode wiring 14, and is connected to the positive electrode (positive electrode sheet 13 a) of the storage element 13 via the positive electrode wiring 14 and the positive electrode adhesive layer 15. Electrically connected. As shown in FIG. 3B, the positive terminal 16 is exposed at least on the bottom surface 11d. The positive terminal 16 may be exposed on the side surface 11e in addition to the bottom surface 11d. The positive electrode terminal 16 is disposed in a recess provided in the bottom surface 11d, and may form the same surface as the bottom surface 11d as shown in FIG. 3B, or may be formed so as to protrude from the bottom surface 11d. Good.
  • the positive electrode terminal 16 is used to connect the electrochemical device 100 to the outside, for example, the mounting substrate and the electrochemical device 100.
  • the positive electrode terminal 16 can be made of any conductive material, and its arrangement and shape are not particularly limited. Various shapes of the positive electrode terminal 16 will be described later.
  • the negative electrode adhesive layer 17 is made of a conductive adhesive, and fixes the negative electrode sheet 13 b to the lid 12 and electrically connects the negative electrode sheet 13 b and the lid 12.
  • the conductive adhesive constituting the negative electrode adhesive layer 17 can be a synthetic resin containing conductive particles, similarly to the positive electrode adhesive layer 15.
  • the negative electrode adhesive layer 17 and the positive electrode adhesive layer 15 may be made of the same kind of conductive adhesive or may be made of another kind of conductive adhesive.
  • the seal ring 18 connects the case 11 and the lid 12 to seal the liquid chamber R, and electrically connects the lid 12 and the negative electrode wiring 19.
  • the seal ring 18 can be made of a conductive material such as Kovar (iron-nickel-cobalt alloy). Further, a corrosion-resistant film (for example, a nickel film and a gold film) can be formed on the surface of the seal ring 18.
  • the seal ring 18 can be disposed on the case 11 and the lid 12 by brazing or the like, or can be disposed on the case 11 by printing of a conductive material or the like.
  • the negative electrode wiring 19 electrically connects the negative electrode sheet 13 b of the electricity storage element 13 and the negative electrode terminal 20 via the negative electrode adhesive layer 17, the lid 12 and the seal ring 18.
  • the negative electrode wiring 19 can be formed from the seal ring 18 along the outer periphery of the case 11 and connected to the negative electrode terminal 20.
  • the negative electrode wiring 19 may be connected to the negative electrode terminal 20 through the inside of the case.
  • the negative electrode wiring 19 is made of any conductive material, and the arrangement and shape are not particularly limited.
  • the negative electrode terminal 20 is a terminal disposed outside the electrochemical device 100, contacts the negative electrode wiring 19, and is connected to the negative electrode of the electricity storage device 13 through the negative electrode wiring 19, the seal ring 18, the lid 12, and the negative electrode adhesive layer 17. (Negative electrode sheet 13b) is connected. As shown in FIG. 3B, the negative electrode terminal 20 can be provided apart from the positive electrode terminal 16 and exposed to the bottom surface 11d. The negative electrode terminal 20 may be exposed on the side surface 11e in addition to the bottom surface 11d.
  • the negative electrode terminal 20 is disposed in a recess provided in the case 11, and may form the same surface as the bottom surface 11d as shown in FIG. 3B, or may be formed so as to protrude from the bottom surface 11d. Good.
  • the negative electrode terminal 20 is used to connect the outside of the electrochemical device 100, for example, the mounting substrate and the electrochemical device 100, similarly to the positive electrode terminal 16.
  • the negative electrode terminal 20 can be made of any conductive material, and its arrangement and shape are not particularly limited. Various shapes of the negative electrode terminal 20 will be described later.
  • Electrochemical device 100 has the overall configuration as described above.
  • the positive electrode terminal 16 is electrically connected to the positive electrode (positive electrode sheet 13 a) of the energy storage device 13 through the positive electrode wiring 14 and the positive electrode adhesive layer 15.
  • the negative electrode terminal 20 is electrically connected to the negative electrode (negative electrode sheet 13 b) of the energy storage device 13 through the negative electrode wiring 19, the seal ring 18, the lid 12, and the negative electrode adhesive layer 17.
  • the positive electrode terminal 16 which is one of the terminals provided on the bottom surface 11d and the seal ring 18 and the lid 12 provided on the opening surface 11c have different polarities.
  • the positive electrode and the negative electrode of the electrochemical device 100 may be reversed. That is, the positive electrode terminal 16 is connected to the positive electrode of the energy storage device via the positive electrode wiring, the seal ring 18 and the lid 12 configured similarly to the negative electrode wiring 19, and the negative electrode terminal 20 is configured similarly to the positive electrode wiring 14. In addition, it may be connected to the negative electrode of the power storage element via the negative electrode wiring. That is, the seal ring 18 and the lid 12 function as a positive electrode conductive path. Even in this case, the negative electrode terminal 20 provided on the bottom surface 11d and the seal ring 18 and the lid 12 provided on the opening surface 11c have different polarities.
  • the side surface 11e is provided with the rough surface region 11f.
  • the rough surface region 11f is a region that is rougher than the region other than the rough surface region 11f on the side surface 11e, and specifically, a region having an arithmetic average roughness Ra of 0.75 ⁇ m or more (see the example). it can.
  • FIG. 4 is a schematic diagram showing the arrangement of the rough surface region 11f and shows the side surface 11e on the positive electrode terminal 16 side. As shown in the figure, the rough surface region 11f is provided between the positive electrode terminal 16 and the opening surface 11c on the side surface 11e. Between the positive electrode terminal 16 and the opening surface 11c means on the shortest path connecting the positive electrode terminal 16 and the opening surface 11c on the side surface 11e, and the rough surface region 11f is arranged to block at least the shortest path.
  • the arrangement of the rough surface region 11f is not limited to that shown in FIG. 4, and may be any one provided at least between the positive electrode terminal 16 and the opening surface 11c.
  • 5 to 11 are schematic views showing other arrangements of the rough surface region 11f. As shown in FIG. 5, the rough surface region 11 f may be provided apart from the upper side (side on the seal ring 18 side) of the positive electrode terminal 16, and provided on the peripheral edge of the positive electrode terminal 16 as shown in FIG. 6. May be.
  • the rough surface region 11f may be provided on a surface where the positive electrode terminal 16 is not exposed on the side surface 11e as shown in FIG. 2, or a surface where the positive electrode terminal 16 is not exposed on the side surface 11e as shown in FIG. May not be provided. Further, as shown in FIGS. 8 and 9, the side surface 11 e can be provided between the positive electrode terminal 16 and the opening surface 11 c according to the shape of the positive electrode terminal 16.
  • the positive electrode terminal 16 does not necessarily have to be exposed on the side surface 11e. As shown in FIGS. 10 and 11, when the positive electrode terminal 16 is not exposed to the side surface 11e, the rough surface region 11f is arranged to block at least the shortest distance connecting the positive electrode terminal 16 and the opening surface 11c in the side surface 11e. .
  • region 11f is an example in case the seal ring 18 joined to the opening surface 11c is a negative electrode.
  • the rough surface region 11f is provided between the negative electrode terminal 20 and the opening surface 11c on the side surface 11e. That is, the rough surface region 11f is disposed at least between the opening surface 11c and a terminal (positive electrode terminal 16 or negative electrode terminal 20) having a polarity different from that of the seal ring 18 joined to the opening surface 11c.
  • the electrochemical device 100 is mounted and used on a mounting object such as a mounting substrate.
  • 12A and 12B are schematic views showing how the electrochemical device 100 is mounted.
  • FIG. 12A is a view of the electrochemical device 100 viewed from the long side direction
  • FIG. 12B is a short side of the electrochemical device 100. It is the figure seen from the direction.
  • the electrochemical device 100 is mounted on the mounting substrate B by soldering with solder H.
  • FIG. 13 is a schematic diagram showing the spread of solder when the rough surface region 11f is not provided. As shown in the figure, when soldering, the solder H wets and spreads on the side surface 11 e and contacts the seal ring 18, a short circuit occurs between the seal ring 18 and the positive terminal 16. This is because the seal ring 18 is electrically connected to the negative electrode of the power storage element 13 as described above and has a polarity different from that of the positive electrode terminal 16.
  • the case 11 may be formed in a state where a plurality of cases 11 are connected. That is, when a lattice-like plate member is laminated on a flat plate-like member, as shown in the figure, each lattice forms an accommodation space 11a (see FIG. 3) and a plurality of cases 11 are connected. (Hereinafter referred to as case group).
  • the plate-like member can be formed by molding a granular ceramic material.
  • the positive electrode terminal 16, the negative electrode terminal 20, the positive electrode wiring 14, etc. shall be formed in the plate-shaped member before lamination
  • the seal ring 18 may be previously arrange
  • This case group is divided into individual cases 11. This division can be performed, for example, by a method described in “JP-A-9-11226” or “JP2001-157997”. The dividing methods described in these documents will be described according to the configuration of the present embodiment.
  • the cutting blade C is inserted from both the front and back surfaces of the case 11 (see JP-A-9-11226 [0007] and JP-A-2001-157997 [0004]).
  • the position where the cutting blade C is inserted is shown as a line L.
  • the cutting blade C is inserted halfway through the case 11, and the case 11 is not separated by the insertion of the cutting blade C. Subsequently, the case 11 is heated to sinter the ceramic material.
  • stress is applied to the case group along the long side direction and the short side direction of the case 11.
  • Stress can be applied by curving the case group.
  • it is possible to apply stress in the long side direction and the short side direction by bending the case group along one direction and changing the direction of the case group Japanese Patent Laid-Open No. 9-11226 [ [0007], and Japanese Patent Laid-Open No. 2001-157997 [0004]).
  • the portion of the case group where the cutting blade C is not inserted is broken, and the case group is separated into individual cases 11.
  • minute irregularities of the constituent material of the case 11 are formed to become a rough surface region 11f. In this way, the case 11 having the rough surface region 11f on the side surface 11e is formed.
  • sticking adhesive tape to both the front and back sides of the case group prevents each case 11 from falling apart when the case group is divided, and is suitable for subsequent handling. is there.
  • the plate-like members constituting the case group can be formed by molding a granular ceramic material, but the roughness of the rough surface region 11f can be controlled by the particle size of the ceramic material. This is because the ceramic material is sintered before fracture, but the particle shape of the ceramic material is maintained to some extent and the particles are exposed on the fracture surface. Specifically, the roughness of the fracture surface (rough surface region 11f) can be increased by increasing the particle size of the ceramic material.
  • the method for forming the rough surface region 11f is an example, and the rough surface region 11f may be formed by other methods.
  • the rough surface region 11f may be formed by filing the side surface 11e, or may be formed by chemical etching or physical etching.
  • FIG. 16 is a schematic view showing an electrochemical device 200 according to a modification of the present embodiment.
  • 16A is a diagram of the electrochemical device 200 viewed from the long side direction
  • FIG. 16B is a diagram viewed from the short side direction.
  • symbol same as the electrochemical device 100 is attached
  • an inclined region 11g and an inclined region 11h may be formed on the side surface 11e in addition to the rough surface region 11f.
  • the inclined region 11g is a region that is continuous with the bottom surface 11d and is inclined with respect to a plane perpendicular to the bottom surface 11d so that an angle formed by the inclined region 11g and the bottom surface 11d is greater than a right angle.
  • the inclined region 11h is a region that is continuous with the opening surface 11c and is inclined with respect to a surface perpendicular to the opening surface 11c so that an angle formed by the inclined region 11h and the opening surface 11c is greater than a right angle.
  • the inclined regions 11g and 11h are provided, the continuity of the side surface 11e is lowered, and the solder is prevented from spreading on the side surface 11e during soldering. That is, in addition to the effect of the rough surface region 11f, the provision of the inclined region 11g and the inclined region 11h can prevent the solder from spreading and prevent a short circuit between the positive electrode and the negative electrode.
  • the formation method of the inclined region 11g and the inclined region 11h is not particularly limited, but the inclined region 11g and the inclined region 11h can be formed by inserting the cutting blade C into the case group as shown in FIG. is there. That is, the rough surface region 11f, the inclined region 11g, and the inclined region 11h can be formed together by this manufacturing method.
  • FIGS. 17 and 18 are views showing an electrochemical device 300 according to another modified example
  • FIG. 17 is a perspective view showing an appearance of the electrochemical device 300
  • FIG. 18 is a line S12-S12 of the electrochemical device 300 (FIG. It is sectional drawing which follows 17).
  • symbol similar to the electrochemical device 100 is attached
  • the lid 12 may be directly joined to the opening surface 11c without the seal ring 18 interposed therebetween.
  • the lid 12 is directly connected to the negative electrode wiring 19 and electrically connected to the negative electrode terminal 20.
  • the liquid chamber R is formed.
  • FIG. 19 is a perspective view showing an appearance of the electrochemical device 500 according to the present embodiment
  • FIG. 20 is a cross-sectional view of the electrochemical device 500 taken along the line S11-S11 (FIG. 19).
  • the electrochemical device 500 includes a case 511, a lid 512, a power storage element 513, a positive electrode wiring 514, a positive electrode adhesive layer 515, a positive electrode terminal 516, a negative electrode adhesive layer 517, a seal ring 518, a negative electrode wiring 519, and A negative electrode terminal 520 is included.
  • a case 511 and a lid 512 are joined via a seal ring 518, and a storage chamber 513 and an electrolytic solution (not shown) are sealed in a liquid chamber R formed thereby. Configured.
  • the case 511 forms a liquid chamber R together with the lid 512.
  • 21 is a perspective view showing the case 511, FIG. 21 (a) is a view seen from the liquid chamber R side, and FIG. 21 (b) is a view seen from the opposite side.
  • the case 511 has an accommodation space 511a.
  • the storage space 511a is a space that is closed by the lid 512 and forms the liquid chamber R, and is formed in the case 511 in a concave shape.
  • the shape of the storage space 511 a is not limited to a rectangular parallelepiped shape as shown in the figure, and may be a shape that can form the liquid chamber R together with the lid 512.
  • a via 511b through which the positive electrode wiring 514 is inserted is formed on the bottom surface of the accommodation space 511a.
  • an opening surface 511c a surface on which the opening of the accommodation space 511a is located.
  • the opening surface 511c corresponds to the upper surface of the side wall of the accommodation space 511a, and is a surface surrounding the periphery of the opening of the accommodation space 511a.
  • a surface opposite to the opening surface 511c (back side) in the case 511 is a bottom surface 511d.
  • a positive electrode terminal 516 and a negative electrode terminal 520 are disposed on the bottom surface 511d.
  • a surface between the opening surface 511c and the bottom surface 511d is a side surface 511e.
  • the side surface 511e corresponds to the outer peripheral surface of the side wall of the accommodation space 511a.
  • the inclined region 511f is formed on the side surface 511e.
  • the inclined region 511f is a region that is continuous with the bottom surface 511d and has an angle greater than a right angle with the bottom surface 511d, and details thereof will be described later.
  • Case 511 is made of an insulating material.
  • the case 511 is made of a ceramic material such as aluminum oxide (Al 2 O 3 ) as a raw material, and is made of HTCC (High Temperature Co-fired Ceramics) or LTCC (Low Temperature Co-fired Ceramics). Ceramics).
  • HTCC and LTCC are obtained by laminating and sintering plate-like members formed from granular ceramic materials. By arranging a metal material or the like on the plate-like member in the lamination process, the positive electrode wiring 514 or the like can be embedded in the case 511, and the manufacturing efficiency is excellent.
  • the lid 512 is joined to the case 511 via the seal ring 518 to seal the liquid chamber R.
  • the lid 512 can be made of any conductive material, and can be made of, for example, Kovar (iron-nickel-cobalt alloy). Further, the lid 512 may be a clad material in which a base material such as Kovar is coated with a coating made of a highly corrosion-resistant metal such as nickel, platinum, silver, gold, or palladium in order to prevent electrolytic corrosion. It is.
  • the lid 512 is joined to the case 511 via the seal ring 518 after the electric storage element 513 is disposed inside the liquid chamber R, and seals the liquid chamber R.
  • a direct joining method such as seam welding or laser welding can be used, or an indirect joining method via a conductive joining material can be used.
  • the lid 512 may be directly joined to the opening surface 511c without using the seal ring 518.
  • the electricity storage element 513 is accommodated in the liquid chamber R and accumulates (accumulates) or discharges (discharges) electric charges. As shown in FIG. 20, the power storage element 513 includes a positive electrode sheet 513a, a negative electrode sheet 513b, and a separate sheet 513c, and the separate sheet 513c is sandwiched between the positive electrode sheet 513a and the negative electrode sheet 513b. .
  • the positive electrode sheet 513a is a sheet containing an active material.
  • the active material is a material that adsorbs electrolyte ions (for example, BF 4 ⁇ ) on its surface to form an electric double layer, and can be, for example, activated carbon or PAS (Polyacenic Semiconductor: polyacenic organic semiconductor).
  • PAS Polyacenic Semiconductor: polyacenic organic semiconductor.
  • the positive electrode sheet 513a is formed by rolling a mixture of the above active material, a conductive additive (for example, ketjen black) and a binder (for example, PTFE (polytetrafluoroethylene)) and cutting it. it can.
  • the negative electrode sheet 513b is a sheet containing an active material like the positive electrode sheet 513a, and is formed by rolling a mixture of an active material, a conductive additive and a binder into a sheet shape, and cutting it. it can.
  • the negative electrode sheet 513b can be made of the same material as the positive electrode sheet 513a, or can be made of a different material.
  • the separate sheet 513c is a sheet that electrically insulates the electrodes.
  • the separate sheet 513c can be a porous sheet made of glass fiber, cellulose fiber, plastic fiber or the like.
  • the electrolytic solution accommodated in the liquid chamber R together with the power storage element 513 can be arbitrarily selected.
  • the cation includes lithium ion, tetraethylammonium ion, triethylmethylammonium ion, 5-azoniaspiro [4.4] nonane ion, ethylmethylimidazolium ion, etc.
  • the anion includes BF 4 ⁇ (tetrafluoroborate ion).
  • PF 6 - hexafluorophosphate ion
  • (CF 3 SO 2) 2 N - include anions such (TFSA ion), as the solvent of propylene carbonate, ethylene carbonate, dimethyl carbonate, ethyl methyl carbonate, dimethyl Carbonate, sulfolane, dimethyl sulfone, ethyl methyl sulfone, ethyl isopropyl sulfone and the like can be included.
  • a propylene carbonate solution of 5-azoniaspiro [4.4] nonane-BF 4 or ethylmethylimidazolium-BF 4 can be used.
  • the positive electrode wiring 514 is made of a conductive material, and electrically connects the positive electrode sheet 513a of the power storage element 513 and the positive electrode terminal 516 via the positive electrode adhesive layer 515. Specifically, the positive electrode wiring 514 can pass through the inside of the case 511 through the via 511 b and be connected to the positive electrode terminal 516. Metal plating may be formed at the end of the positive electrode wiring 514 on the positive electrode adhesive layer 515 side in order to protect it from electrolytic corrosion due to contact with the electrolytic solution.
  • the positive electrode adhesive layer 515 is made of a conductive adhesive, and adheres the positive electrode sheet 513a to the case 511 and electrically connects the positive electrode sheet 513a and the positive electrode wiring 514. As shown in FIG. 20, the positive electrode adhesive layer 515 is disposed on the bottom surface of the liquid chamber R and contacts the positive electrode sheet 513 a and the positive electrode wiring 514. The positive electrode adhesive layer 515 is preferably formed over the entire region of the power storage element 513 (positive electrode sheet 513a) for adhesion and electrical connection of the power storage element 513.
  • the conductive adhesive constituting the positive electrode adhesive layer 515 can be a synthetic resin containing conductive particles.
  • the conductive particles preferably have high chemical stability.
  • graphite particles can be used.
  • the synthetic resin those having low swelling property with respect to the electrolytic solution, high heat resistance, and high chemical stability are suitable.
  • a phenol resin can be used.
  • the positive electrode terminal 516 is a terminal disposed outside the electrochemical device 500, contacts the positive electrode wiring 514, and is connected to the positive electrode (positive electrode sheet 513 a) of the power storage element 513 through the positive electrode wiring 514 and the positive electrode adhesive layer 515. Electrically connected. As shown in FIG. 21B, the positive terminal 516 can be disposed adjacent to the inclined region 511f on the bottom surface 511d. Further, the positive electrode terminal 516 may be disposed apart from the inclined region 511f on the bottom surface 511d. As shown in the figure, the positive electrode terminal 516 may be formed so as to protrude from the bottom surface 511d, may be disposed in a recess provided in the bottom surface 511d, and may constitute the same surface as the bottom surface 511d.
  • the positive electrode terminal 516 is used outside the electrochemical device 500, for example, for connecting the mounting substrate and the electrochemical device 500.
  • the positive electrode terminal 516 can be made of any conductive material, and its arrangement and shape are not particularly limited. Various shapes of the positive electrode terminal 516 will be described later.
  • the negative electrode adhesive layer 517 is made of a conductive adhesive, and fixes the negative electrode sheet 513b to the lid 512 and electrically connects the negative electrode sheet 513b and the lid 512.
  • the conductive adhesive constituting the negative electrode adhesive layer 517 can be a synthetic resin containing conductive particles.
  • the negative electrode adhesive layer 517 and the positive electrode adhesive layer 515 may be made of the same kind of conductive adhesive or may be made of another kind of conductive adhesive.
  • the seal ring 518 connects the case 511 and the lid 512 to seal the liquid chamber R, and electrically connects the lid 512 and the negative electrode wiring 519.
  • the seal ring 518 can be made of a conductive material such as Kovar (iron-nickel-cobalt alloy).
  • a corrosion-resistant film for example, a nickel film or a gold film
  • the seal ring 518 can be disposed on the case 511 and the lid 512 by brazing or the like, or can be disposed on the case 511 by printing a conductive material or the like. Note that when the lid 512 is directly joined to the opening surface 511c, the seal ring 518 may not be provided.
  • the negative electrode wiring 519 electrically connects the negative electrode sheet 513b of the power storage element 513 and the negative electrode terminal 520 through the negative electrode adhesive layer 517, the lid 512, and the seal ring 518. Specifically, the negative electrode wiring 519 can be connected from the seal ring 518 through the inside of the case 511 to the negative electrode terminal 520. Further, the negative electrode wiring 519 may be disposed on the outer periphery of the case 511 and connected to the negative electrode terminal 520.
  • the negative electrode wiring 519 is made of any conductive material, and its arrangement and shape are not particularly limited.
  • the negative electrode terminal 520 is a terminal disposed outside the electrochemical device 500, contacts the negative electrode wiring 519, and is connected to the negative electrode of the power storage element 513 through the negative electrode wiring 519, the seal ring 518, the lid 512, and the negative electrode adhesive layer 517. (Negative electrode sheet 513b) is connected.
  • the negative electrode terminal 520 can be disposed adjacent to the inclined region 511f on the bottom surface 511d, as shown in FIG. Further, the negative electrode terminal 520 may be disposed away from the inclined region 511f on the bottom surface 511d. As shown in the figure, the negative electrode terminal 520 may be formed so as to protrude from the bottom surface 511d, may be disposed in a recess provided in the bottom surface 511d, and may constitute the same surface as the bottom surface 511d.
  • the negative electrode terminal 520 is used to connect the outside of the electrochemical device 500, for example, the mounting substrate and the electrochemical device 500, similarly to the positive electrode terminal 516.
  • the negative electrode terminal 520 can be made of any conductive material, and its arrangement and shape are not particularly limited. Various shapes of the negative electrode terminal 520 will be described later.
  • the electrochemical device 500 has the overall configuration as described above.
  • the positive electrode terminal 516 is electrically connected to the positive electrode (positive electrode sheet 513 a) of the power storage element 513 through the positive electrode wiring 514 and the positive electrode adhesive layer 515.
  • the negative electrode terminal 520 is electrically connected to the negative electrode (negative electrode sheet 513 b) of the power storage element 513 through the negative electrode wiring 519, the seal ring 518, the lid 512, and the negative electrode adhesive layer 517.
  • the positive electrode and the negative electrode of the electrochemical device 500 may be the reverse of the above. That is, the positive electrode terminal 516 is connected to the positive electrode of the power storage element via the positive electrode wiring, the seal ring 518 and the lid 512 configured similarly to the negative electrode wiring 519, and the negative electrode terminal 520 is configured similarly to the positive electrode wiring 514. In addition, it may be connected to the negative electrode of the power storage element via the negative electrode wiring. In this case, the seal ring 518 and the lid 512 function as a positive electrode conductive path.
  • the inclined region 511f is provided on the side surface 511e of the case 511.
  • the inclined region 511f is a region that is continuous with the bottom surface 511d and has an angle greater than a right angle with the bottom surface 511d.
  • FIG. 22 is a schematic diagram showing an angle formed by the inclined region 511f and the bottom surface 511d.
  • 22A is a diagram of the case 511 viewed from the long side
  • FIG. 22B is a diagram of the case 511 viewed from the short side.
  • an angle (R in the figure) formed by the inclined region 511f and the bottom surface 511d is an angle larger than a right angle.
  • region 511f and the bottom face 511d make may mutually be the same, and may differ.
  • the inclined region 511f is formed continuously to the side where the positive electrode terminal 516 or the negative electrode terminal 520 is provided at least on the periphery of the bottom surface 511d, that is, adjacent to the positive electrode terminal 516 or the negative electrode terminal 520. Can be.
  • FIG. 23 to FIG. 28 are schematic views showing the arrangement of the inclined region 511f, and are views of the case 511 viewed from the bottom surface 511d side. As shown in FIG. 23, the inclined region 511f may be provided on all side surfaces 511e, and as shown in FIG. May be.
  • the inclined region 511f is provided according to the arrangement of the positive terminal 516 and the negative terminal 520. As shown in FIG. 25, the positive electrode terminal 516 and the negative electrode terminal 520 may be provided adjacent to the long side of the bottom surface 511d. In this case, the inclined region 511f is provided continuously to the long side of the bottom surface 511d. can do. Further, as shown in FIG. 26, the positive terminal 516 and the negative terminal 520 may be provided at the corner of the bottom surface 511d. In this case, the inclined region 511f is provided so as to be continuous with the long side and the short side of the bottom surface 511d. It can be.
  • the inclined region 511f may be formed only on a part of the side where the positive electrode terminal 516 or the negative electrode terminal 520 is provided in the periphery of the bottom surface 511d. As shown in the figure, the inclined region 511f can be provided only in the vicinity of the positive electrode terminal 516 or the negative electrode terminal 520 in the side where the positive electrode terminal 516 or the negative electrode terminal 520 is provided.
  • the positive terminal 516 and the negative terminal 520 are not necessarily provided adjacent to the periphery of the bottom surface 511d, and may be provided close to the periphery.
  • the inclined region 511f is formed continuously from the peripheral edge of the bottom surface 511d to the side closest to the positive electrode terminal 516 and the side closest to the negative electrode terminal 520. Can do.
  • the inclined region 511f is preferably formed continuously from both the side where the positive electrode terminal 516 is provided and the side where the negative electrode terminal 520 is provided, of the periphery of the bottom surface 511d. It may be continuous only on at least one of the sides. Only one of the positive electrode terminal 516 and the negative electrode terminal 520 may be formed on the bottom surface 511d, and the other may be connected to the outside by another method (for example, wire bonding). In this case, the inclined region 511f can be continuously formed on the side where either the positive electrode terminal 516 or the negative electrode terminal 520 is provided.
  • FIG. 29 is a schematic diagram showing an aspect of mounting the electrochemical device 500. As shown in the figure, the electrochemical device 500 is mounted on the mounting substrate B by soldering with solder H.
  • Solder H connects the positive terminal 516 and the terminal (not shown) on the mounting board B side, and another solder H separated from the solder H connects the negative terminal 520 and the terminal on the mounting board B side.
  • solder balls may be generated.
  • FIG. 30 is a schematic diagram showing an aspect of mounting the electrochemical device 600 according to the comparative example. As shown in the figure, the electrochemical device 600 has no inclined region. In addition, about another structure, it is the same as that of the electrochemical device 500, and the same code
  • FIGS. 31 to 33 are enlarged views showing the manner of soldering the electrochemical device 600 and the mounting substrate B.
  • FIG. 31 is a view of the electrochemical device 600 as viewed from the short side 511e side
  • FIG. 32 is a view from the long side 511e side
  • FIG. 33 is a view from the bottom 511d side.
  • the mounting substrate B is not shown.
  • surplus solder H protrudes around the case 511 and forms solder balls D.
  • the solder balls D are separated from the mounting board B after mounting, causing a short circuit or the like.
  • FIGS. 34 to 36 are enlarged views showing a manner of soldering the electrochemical device 500 and the mounting substrate B.
  • FIG. 34 is a view of the electrochemical device 600 as viewed from the short side 511e side
  • FIG. 35 is a view from the long side 511e side
  • FIG. 36 is a view from the bottom 511d side.
  • the mounting substrate B is not shown.
  • the solder ball D is formed in the case of the electrochemical device 500, it spreads thinly and is absorbed by the solder H by wetting.
  • solder ball D comes into contact with the inclined region 511f and is crushed or repels the inclined region 511f.
  • the case 511 is made of a ceramic material with low solder H wettability, the repulsion of the solder balls D by the inclined region 511f becomes larger.
  • the positive electrode terminal 516 and the negative electrode terminal 520 are provided adjacent to the inclined region 511f, the solder H tends to come into contact with these terminals and spread easily, which is preferable in suppressing the formation of solder balls. is there.
  • the formation of the solder ball D is suppressed, and it is possible to prevent the occurrence of a short circuit or the like due to the solder ball D.
  • a plurality of cases 511 can be formed in a connected state. That is, when a lattice-like plate member is laminated on a flat plate-like member, as shown in the figure, each lattice forms an accommodation space 511a (see FIG. 21), and a plurality of cases 511 are connected. (Hereinafter referred to as case group).
  • the plate-like member can be formed by molding a granular ceramic material.
  • the positive electrode terminal 516, the negative electrode terminal 520, the positive electrode wiring 514, and the like can be formed on the plate member before the lattice member is laminated.
  • a seal ring 518 may be provided in advance on the opening surface 511c around each accommodation space 511a.
  • This case group is divided into individual cases 511. This division can be performed, for example, by a method described in “JP-A-9-11226” or “JP2001-157997”. The dividing methods described in these documents will be described according to the configuration of the present embodiment.
  • the cutting blade C is inserted from both the front and back surfaces of the case 511 (see Japanese Patent Laid-Open Nos. 9-11226 [0007] and 2001-157997 [0004]).
  • FIG. 37 the position where the cutting blade C is inserted is shown as a line L.
  • FIG. 38A the cutting blade C is inserted partway through the case 511, and the case 511 is not separated by the insertion of the cutting blade C. Subsequently, the case 511 is heated to sinter the ceramic material.
  • stress is applied to the case group along the long side direction and the short side direction of the case 511.
  • Stress can be applied by curving the case group.
  • it is possible to apply stress in the long side direction and the short side direction by bending the case group along one direction and changing the direction of the case group Japanese Patent Laid-Open No. 9-11226 [ [0007], and Japanese Patent Laid-Open No. 2001-157997 [0004]).
  • the portion of the case group where the cutting blade C is not inserted is broken, and the case group is separated into individual cases 511.
  • the portion where the cutting blade C has been inserted becomes an inclined region 511f.
  • region 11g whose angle formed with the opening surface 511c is larger than a right angle is formed also in the opening surface 511c side of the side surface 511e.
  • adhesive tape is applied to both the front and back surfaces of the case group, so that the cases 511 are not separated when the case group is divided, and are suitable for subsequent handling. It is.
  • region 511f is not restricted to the above-mentioned thing.
  • the inclined region 511f can be formed by grinding the case 511 or the like.
  • FIG. 39 is a schematic diagram showing an electrochemical device 700 according to a modification of the present embodiment.
  • symbol as the electrochemical device 500 is attached
  • FIG. 39 is a schematic diagram showing an electrochemical device 700 according to a modification of the present embodiment.
  • symbol as the electrochemical device 500 is attached
  • both or one of the rough surface region 511h (gray region in the figure) and the inclined region 511g may be formed on the side surface of the case.
  • the rough surface region 511h is a region that is rougher than the other regions of the side surface 511e.
  • the formation method of the rough surface region 511h is not particularly limited, but the fracture surface can be changed to the rough surface region 511h by breaking the case group as shown in FIG. In other words, the inclined region 511f, the rough surface region 511h, and the inclined region 511g can be formed together by this manufacturing method.
  • the electrochemical device 100 having the rough surface region 11f and the electrochemical device having no rough surface region (hereinafter referred to as the electrochemical device 400) according to the first embodiment are created, and the arithmetic average roughness Ra is measured. did.
  • FIG. 40 is a schematic diagram illustrating measurement points of the arithmetic average roughness Ra.
  • the measurement locations A and B are locations where the rough surface region 11f is provided, and the measurement location C is a location where the rough surface region 11f is not provided.
  • the same measurement as in FIG. 40 was performed.
  • any measurement location is a location where no rough surface area is provided.
  • the measurement result of arithmetic average roughness Ra is shown in FIG.
  • the number of electrochemical devices measured was three each, and FIG. 41 shows the maximum value, the minimum value, and the average value of the arithmetic average roughness Ra.
  • a large arithmetic average roughness Ra was measured for the measurement results (measurement points A and B of the electrochemical device 100) where the rough surface region 11f was provided. From this measurement result, the arithmetic average roughness Ra of the rough surface region 11f was set to 0.75 ⁇ m or more based on the following equation.

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  • Sealing Battery Cases Or Jackets (AREA)

Abstract

Le problème décrit par la présente invention est de fournir un dispositif électrochimique qui est configuré pour empêcher l'apparition d'un court-circuit par une soudure. La solution selon la présente invention porte sur un dispositif électrochimique qui comporte un boîtier, un anneau d'étanchéité, un couvercle, une borne, un élément de stockage d'électricité et une solution d'électrolyte. Le boîtier est formé en un matériau isolant, et a une surface d'ouverture où l'ouverture d'un espace de conteneur est positionnée, une surface inférieure qui est sur le côté inverse de la surface d'ouverture, et une surface latérale qui est positionnée entre la surface d'ouverture et la surface inférieure. Une région de surface rugueuse est formée dans la surface latérale entre la borne et la surface d'ouverture, et la surface rugueuse est plus rugueuse que les autres régions de la surface latérale. L'anneau d'étanchéité est formé en un matériau conducteur, est disposé sur la surface d'ouverture, et est connecté électriquement à une première électrode. Le couvercle est lié à l'anneau d'étanchéité et forme une chambre de liquide par fermeture par le dessus de l'espace de conteneur. La borne est disposée sur le boîtier de manière à être présentée dans la surface inférieure, et est électriquement connectée à une seconde électrode. L'élément de stockage d'électricité est contenu dans la chambre de liquide et comporte la première électrode et la seconde électrode, qui ont des polarités différentes l'une par rapport à l'autre. La solution d'électrolyte est contenue dans la chambre de liquide.
PCT/JP2015/055322 2014-03-03 2015-02-25 Dispositif électrochimique WO2015133340A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014040360A JP2018088431A (ja) 2014-03-03 2014-03-03 電気化学デバイス
JP2014-040360 2014-03-03
JP2014080473A JP2018088432A (ja) 2014-04-09 2014-04-09 電気化学デバイス
JP2014-080473 2014-04-09

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WO2015133340A1 true WO2015133340A1 (fr) 2015-09-11

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019163941A1 (fr) * 2018-02-22 2019-08-29 京セラ株式会社 Substrat pour modules d'alimentation, et module d'alimentation
WO2022172908A1 (fr) * 2021-02-15 2022-08-18 株式会社村田製作所 Batterie entièrement solide, dispositif électronique et véhicule électrique
US11830672B2 (en) 2016-11-23 2023-11-28 KYOCERA AVX Components Corporation Ultracapacitor for use in a solder reflow process

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284313U (fr) * 1988-12-20 1990-06-29
JP2010199537A (ja) * 2009-02-23 2010-09-09 Samsung Electro-Mechanics Co Ltd 電気二重層キャパシタパッケージ
JP2012069910A (ja) * 2010-08-23 2012-04-05 Seiko Instruments Inc 電子部品、及び電子装置
JP2012104547A (ja) * 2010-11-08 2012-05-31 Tdk Corp 電子部品およびその製造方法
JP2013232570A (ja) * 2012-05-01 2013-11-14 Taiyo Yuden Co Ltd 電気化学キャパシタ及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284313U (fr) * 1988-12-20 1990-06-29
JP2010199537A (ja) * 2009-02-23 2010-09-09 Samsung Electro-Mechanics Co Ltd 電気二重層キャパシタパッケージ
JP2012069910A (ja) * 2010-08-23 2012-04-05 Seiko Instruments Inc 電子部品、及び電子装置
JP2012104547A (ja) * 2010-11-08 2012-05-31 Tdk Corp 電子部品およびその製造方法
JP2013232570A (ja) * 2012-05-01 2013-11-14 Taiyo Yuden Co Ltd 電気化学キャパシタ及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11830672B2 (en) 2016-11-23 2023-11-28 KYOCERA AVX Components Corporation Ultracapacitor for use in a solder reflow process
WO2019163941A1 (fr) * 2018-02-22 2019-08-29 京セラ株式会社 Substrat pour modules d'alimentation, et module d'alimentation
WO2022172908A1 (fr) * 2021-02-15 2022-08-18 株式会社村田製作所 Batterie entièrement solide, dispositif électronique et véhicule électrique

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