WO2015115642A1

WO2015115642A1 - Hot-melt adhesive agent composition and pseudo-adhesive label

Info

Publication number: WO2015115642A1
Application number: PCT/JP2015/052823
Authority: WO
Inventors: 大介冨田
Original assignee: リンテック株式会社
Priority date: 2014-02-03
Filing date: 2015-02-02
Publication date: 2015-08-06
Also published as: JP2015145475A

Abstract

A hot-melt adhesive agent composition according to the present invention can be used for pseudo-adhesion, and comprises a thermoplastic resin containing an ethylene-propylene copolymer and solid paraffin, wherein the solid paraffin is contained in an amount of 1 to 20 parts by mass relative to 100 parts by mass of the thermoplastic resin and the melt viscosity of the hot-melt adhesive agent composition is 2000 to 10000 mPa·s at 160°C.

Description

Hot melt adhesive composition and pseudo-adhesive label

The present invention relates to a hot-melt adhesive composition and a pseudo-adhesive label having a pseudo-adhesive layer made of the hot-melt adhesive composition.

Conventionally, pseudo-adhesive labels using pseudo-adhesion have been known so that the surface substrate can be easily peeled off after various labels are attached to an adherend with an adhesive. It is being used as. The pseudo-adhesive label is constituted by, for example, a surface base material, a pseudo-adhesive layer, an intermediate base material, an adhesive layer, and a release sheet laminated in this order, and the surface base material is simulated on the intermediate base material via the pseudo-adhesive layer. Some are glued.
This pseudo-adhesive label is obtained by melting and extruding a thermoplastic resin for forming a pseudo-adhesive layer from a T-die between a surface base material and an intermediate base material from the surface base material, the pseudo-adhesive layer, and the intermediate base material. It is known that after a three-layer structure is formed, an adhesive sheet composed of an adhesive layer and a release sheet is bonded to an intermediate substrate (see, for example, Patent Documents 1 and 2).

As the thermoplastic resin used for pseudo-adhesion, a hot-melt adhesive that melts or softens when heated and does not have tackiness at room temperature is used. For example, in Patent Document 2, a material made of a single polyethylene resin is used. Has been.
In addition, hot melt adhesives have conventionally been improved in various ways, and various additives may be blended into the thermoplastic resin. For example, Patent Document 3 discloses a hot melt adhesive in which a propylene / ethylene copolymer is blended with a maleic anhydride-modified polypropylene wax as a tackifier so that the adhesive strength changes depending on the processing temperature. Yes.

JP 2010-243919 A JP 2010-039185 A WO2007 / 013185

By the way, in the manufacture of the pseudo-adhesive label, various processing methods have been studied for the purpose of reducing the number of processes and manufacturing cost. For example, the present inventors coated a hot melt adhesive on a surface substrate with a resin coater to form a pseudo-adhesive layer, and then formed pseudo-adhesiveness (that is, appropriate fluidity and tackiness) by residual heat during the coating. A processing method for obtaining a pseudo-adhesive label by adhering another sheet member (for example, a laminate of an adhesive sheet and an intermediate substrate) to a pseudo-adhesive layer having a property).

However, in the above processing method, the temperature at which another sheet member is bonded to the pseudo-adhesive layer may vary due to variations in processing speed, cooling conditions after coating, and the like. On the other hand, as in Patent Document 2, when the pseudo-adhesion layer is made of a single thermoplastic resin, the pseudo-adhesive property is greatly changed by a slight change in processing temperature, and so-called open time tends to be shortened. In the processing method, it becomes difficult to stably manufacture the pseudo-adhesive label. For example, the pseudo-adhesion layer is completely adhered to the surface base material, and a problem such that the surface base material cannot be peeled off from the pseudo-adhesion layer occurs, or the pseudo-adhesion layer does not adhere to the surface base material at all.
Further, even when the hot melt adhesive disclosed in Patent Document 3 is used, the adhesive strength tends to change depending on the heated temperature, so that the same problem may occur.

The present invention has been made in view of the above problems, and when manufacturing a pseudo-adhesive label by bonding another sheet or the like to the pseudo-adhesion layer, the processing conditions such as the bonding temperature have changed. Another object of the present invention is to provide a hot melt adhesive composition capable of stably producing a pseudo-adhesive label.

As a result of intensive studies, the present inventors have found that a hot-melt adhesive composition containing a thermoplastic resin containing an ethylene / propylene copolymer and solid paraffin in a predetermined blending ratio is pseudo-adhesive in a wide temperature range. It has been found that even if the processing temperature changes, the adhesive force hardly changes greatly, so that the pseudo-adhesive label can be stably manufactured even if the processing conditions such as the bonding temperature change. Furthermore, it has been found that in order to properly apply a hot melt adhesive with a resin coater, it is necessary to keep the melt viscosity of the thermoplastic resin within a certain range while having the above-mentioned pseudo-adhesiveness. The following present invention was completed.

That is, the present invention provides the following (1) to (14).
(1) A hot melt adhesive composition used for pseudo-adhesion, which includes a thermoplastic resin containing an ethylene / propylene copolymer and solid paraffin, and the solid paraffin is the thermoplastic resin 100. A hot melt adhesive composition containing 1 to 20 parts by mass with respect to parts by mass, and having a melt viscosity of 2000 to 10,000 mPa · s at 160 ° C.
(2) The hot melt adhesive composition has two or more exothermic peaks in DSC measurement measured by decreasing the temperature from 180 ° C. to 0 ° C. at a temperature rate of −5 ° C./min.
The hot melt adhesive composition according to (1), wherein a temperature range in which an exothermic peak is confirmed, which is a difference between a peak top temperature of an exothermic peak on the highest temperature side and an exothermic peak on the lowest temperature side, is 30 ° C. or higher.
(3) The hot melt adhesive composition according to (1) or (2), wherein the solid paraffin has a melting point of 90 ° C. or higher.
(4) The hot melt adhesive composition according to any one of (1) to (3), wherein the thermoplastic resin contains two or more resins having different melting points.
(5) Any of the above (1) to (4), wherein the thermoplastic resin further comprises an ethylene / α-olefin copolymer other than the ethylene / propylene copolymer, having a melting point different from that of the ethylene / propylene copolymer. A hot melt adhesive composition according to claim 1.
(6) The hot melt adhesive composition according to the above (5), wherein the ethylene / α-olefin copolymer is an ethylene / 1-octene copolymer.
(7) A pseudo-adhesive label comprising a pseudo-adhesive layer formed from the hot melt adhesive composition according to any one of (1) to (6) above.
(8) The pseudo-adhesive label according to (7), comprising a surface base material, the pseudo-adhesive layer, an intermediate base material, and an adhesive layer in this order.
(9) The pseudo-adhesive label according to (8), wherein the pseudo-adhesive layer and the intermediate base material are pseudo-adhered.
(10) The pseudo-adhesive label according to (8) or (9), further including a release substrate attached to the pressure-sensitive adhesive layer.
(11) The pseudoadhesive label according to any one of (8) to (10), wherein the surface substrate is paper.
(12) The pseudoadhesive label according to any one of (8) to (11), wherein the intermediate base material is paper or a resin film.
(13) The pseudoadhesive label according to any one of (8) to (12), wherein at least one of the surface base material and the intermediate base material is thermal paper.
(14) A step of applying the hot melt adhesive composition according to any one of (1) to (6) above on the surface substrate, and cooling the applied hot melt adhesive composition. A method for producing a pseudo-adhesive label, comprising a step of pressing and bonding another sheet member to a pseudo-adhesive layer having a pseudo-adhesiveness at a predetermined temperature.

The hot melt adhesive composition of the present invention has pseudo-adhesiveness in a wide temperature range, and the pseudo-adhesive force is hardly changed even when the processing temperature is changed, and the melt viscosity is an appropriate value. . Therefore, even if the processing conditions such as the bonding temperature change, the pseudo-adhesive label can be manufactured stably.

It is a typical sectional view showing an example of the pseudoadhesive label of the present invention. It is a typical top view showing an example of a pseudoadhesive label of the present invention. It is a schematic diagram which shows an example of the pseudo-adhesive label manufacturing apparatus of this invention.

Hereinafter, the present invention will be specifically described with reference to embodiments thereof.
[Hot melt adhesive composition]
The hot melt adhesive composition of the present invention contains a thermoplastic resin and solid paraffin. The hot melt adhesive composition of the present invention is used for pseudo-adhesion. In addition, the pseudo-adhesion is usually one in which, for example, a member such as a sheet can be easily peeled off from another adherend in a use environment, and after peeling, there is no tack and it cannot be attached again.

<Thermoplastic resin>
The thermoplastic resin contained in the hot melt adhesive composition contains at least an ethylene / propylene copolymer. By using an ethylene / propylene copolymer, it becomes possible to obtain pseudo adhesiveness in a wide temperature range. The thermoplastic resin preferably contains 40% by mass or more, more preferably 50% by mass or more of the ethylene / propylene copolymer with respect to the total amount of the thermoplastic resin. The thermoplastic resin may be composed of one ethylene / propylene copolymer, but preferably contains two or more resins having different melting points.

When the thermoplastic resin contains two or more kinds of resins having different melting points, for example, the thermoplastic resin may contain two or more kinds of ethylene / propylene copolymers having different melting points. A resin other than the ethylene / propylene copolymer, which has a melting point different from that of the propylene copolymer, may be contained. Here, as the resin other than the ethylene / propylene copolymer, an ethylene / α-olefin copolymer is preferably used.
The ethylene / α-olefin copolymer is a copolymer of ethylene and an α-olefin other than ethylene and propylene. Examples of the α-olefin include 1-butene, 1-pentene, 1-hexene and 1-heptene. Α-olefins having about 4 to 10 carbon atoms such as 1-octene, 1-nonene, 1-decene, 4-methyl-1-pentene, 4-methyl-1-hexene, and the like. Or two or more of them may be used in combination. The ethylene / α-olefin copolymer is preferably an ethylene / 1-octene copolymer in which the α-olefin is 1-octene. By using the ethylene / 1-octene copolymer, a relatively high pseudo-adhesive force can be easily imparted to the pseudo-adhesive layer even if the pseudo-adhesive layer is bonded to another layer at a relatively low temperature.

The melting point of each ethylene / propylene copolymer contained in the thermoplastic resin is preferably 50 ° C. or higher and 100 ° C. or lower. By setting the melting point to 50 ° C. or higher, the adhesiveness hardly changes even when the temperature rises in summer, etc., and by setting the temperature to 100 ° C. or lower, the thermal paper develops color even when the thermal paper is used as the surface substrate. The fear is reduced. From these viewpoints, the melting point of each ethylene / propylene copolymer contained in the thermoplastic resin is more preferably 70 ° C. or higher and lower than 90 ° C.
From the viewpoint of obtaining pseudo-adhesiveness in a wide temperature range, when two or more types of ethylene / propylene copolymers having different melting points are contained, the difference in melting point is preferably 5 ° C. or more, and preferably 10 ° C. or more. It is more preferable.
The ethylene / α-olefin copolymer other than the ethylene / propylene copolymer preferably has a melting point of 50 ° C. or higher and 100 ° C. or lower, more preferably 55 ° C. or higher and 75 ° C. or lower. In addition, the ethylene / α-olefin copolymer other than the ethylene / propylene copolymer should be lower than the melting point of the ethylene / propylene copolymer, and the melting point difference from the ethylene / propylene copolymer having the lowest melting point is It is preferable that it is 5 degreeC or more.
As described above, by setting the melting point of each component of the thermoplastic resin to 50 ° C. or higher, the hot melt adhesive composition does not have tackiness at room temperature, the heat resistance is improved, and the adhesive strength is adjusted to the temperature. It becomes difficult to change accordingly. In addition, since the processing temperature such as the coating temperature can be set low by setting it to 100 ° C. or lower, the occurrence of curling of the surface base material during processing is prevented, and furthermore, when thermal paper is used for the surface base material Unnecessary color development of the surface base material can be prevented.

As described above, when a high melting point and a low melting point ethylene / propylene copolymer having different melting points are included, the mass ratio is high melting point ethylene / propylene copolymer / low melting point ethylene / propylene copolymer. The ratio is preferably 10/90 to 90/10, and more preferably 70/30 to 30/70.
Further, when the thermoplastic resin contains an ethylene / α-olefin copolymer other than the ethylene / propylene copolymer, the ethylene / propylene copolymer and the ethylene / α-olefin other than the ethylene / propylene copolymer are used. The copolymer preferably has a mass ratio of 90:10 to 50:50, more preferably 80:20 to 60:40. By setting it as such mass ratio, a hot-melt-adhesive composition becomes easy to express favorable pseudo-adhesive property in a wide temperature range, ensuring the melt viscosity mentioned later, and becomes easy to lengthen open time.

The thermoplastic resin is composed of at least two ethylene / propylene copolymers having different melting points and different ethylene / α other than ethylene / propylene copolymers. -It may contain other resins such as olefin copolymers. In this case, the same ethylene / propylene copolymer and other resins as described above are used.
The hot melt adhesive composition thus contains three types of resins having different melting points, and thus easily exhibits good pseudo-adhesiveness in a wide temperature range, and easily suppresses changes in the pseudo-adhesive force due to processing temperature. Become.
The thermoplastic resin is a main component of the hot melt adhesive composition and is not particularly limited, but is usually 50% by mass or more, preferably 75% by mass or more, based on the total amount of the hot melt adhesive composition. More preferably, the content is 85% by mass or more.

<Solid paraffin>
The solid paraffin is CAS No. 8002-74-2 solid paraffin, and the melting point thereof is preferably higher than that of the ethylene / propylene copolymer contained in the thermoplastic resin. Specifically, the melting point of the solid paraffin is preferably 90 ° C. or higher, more preferably 90 to 130 ° C., and further preferably 100 to 125 ° C. By setting the melting point of the solid paraffin to 90 ° C. or higher, it becomes possible to increase the open time, and further, it is suppressed that the adhesion force of the pseudo adhesive layer when processed at a high temperature becomes higher than necessary. The Further, by setting the melting point to 130 ° C. or lower, the pseudo adhesive layer can be formed at a low processing temperature.

In the hot melt adhesive composition, the solid paraffin is contained in an amount of 1 to 20 parts by mass with respect to 100 parts by mass of the thermoplastic resin. When the content is less than 1 part by mass, it becomes difficult to ensure pseudo-adhesiveness when processed at a high temperature. Moreover, when it exceeds 20 mass parts, it will become easy to produce malfunctions, such as the pseudo adhesive force of a hot-melt-adhesive agent composition becoming low. In order to ensure appropriate pseudo-adhesiveness over a wide temperature range, the solid paraffin is preferably contained in an amount of 3 to 20 parts by mass with respect to 100 parts by mass of the thermoplastic resin. Is more preferable.

The melt viscosity at 160 ° C. of the hot melt adhesive composition is 2000 to 10,000 mPa · s. When the melt viscosity is less than 2000 mPa · s, when the hot melt adhesive composition is applied using a resin coater, dripping or the like may occur and appropriate application may not be realized. On the other hand, if it exceeds 10,000 mPa · s, there is a possibility that problems such as inability to extrude the hot melt adhesive composition from the resin coater may occur.
From the viewpoint of improving coatability, the melt viscosity is preferably 4000 to 9000 mPa · s.

The hot melt adhesive composition preferably has two or more exothermic peaks in DSC measurement measured at a temperature rate of -5 ° C / min from 180 ° C to 0 ° C. Here, the temperature range in which the exothermic peak is confirmed is preferably relatively wide. Specifically, the temperature range is preferably 30 ° C. or higher, more preferably 30 ° C. or higher and lower than 70 ° C., 35 It is more preferable that it is not lower than 65 ° C. and most preferable that it is not lower than 40 ° C. and lower than 60 ° C. Thus, when the temperature range in which the exothermic peak is confirmed is wide, the hot melt adhesive composition can have pseudo-adhesiveness in a wide temperature range. The temperature range in which the exothermic peak is confirmed is calculated by the difference between the peak top temperature of the exothermic peak on the highest temperature side and the peak top temperature of the exothermic peak on the lowest temperature side.

The above two or more exothermic peaks are considered to be peaks caused by ethylene / propylene copolymer at one place and peaks caused by solid paraffin at the other place. The exothermic peak is not limited as long as it is 2 or more. However, when a resin other than ethylene / propylene copolymer such as ethylene / 1-octene copolymer is contained, the exothermic peak usually increases further and 3 or more locations. The exothermic peak is observed. When the exothermic peak is 3 or more, it becomes easier to realize more stable pseudo-adhesiveness.

Further, the pseudo-adhesion force measured in the pseudo-adhesive sample prepared from the hot melt adhesive composition is obtained by increasing the surface temperature by 5 ° C. when the surface temperature at the time of sample preparation is 65-80 ° C. It is preferable that the change magnification at the time of manufacture is small. Specifically, the maximum change magnification is preferably 5.0 times or less, more preferably 4.0 times or less, and even more preferably 3.0 times or less. As described above, when the change ratio of the pseudo adhesive force is small, the pseudo adhesive force does not change greatly even if the processing temperature fluctuates, so that the processing method can be easily controlled.
The maximum change magnification may be 1.0 times or more, but is preferably 1.5 times or more. When the maximum change magnification is 1.5 times or more, the pseudo adhesive force can be finely adjusted by adjusting the bonding temperature. The method for measuring the pseudo adhesive force change magnification will be described later in detail.

The hot melt adhesive composition preferably has a softening point of about 85 to 140 ° C. By setting the softening point to 85 ° C. or higher, the pseudo-adhesive layer is prevented from being softened even in summer and the adhesion stability of the label is improved. Further, when the temperature is set to 140 ° C. or lower, the processing temperature can be lowered, and unnecessary coloring of the thermal paper during processing can be suppressed. From these viewpoints, the softening point is more preferably about 90 to 120 ° C.

As necessary, the hot-melt adhesive composition includes an antioxidant, an ultraviolet absorber, a light stabilizer, a flexibility imparting agent, a flame retardant, an antistatic agent, a foaming agent, a lubricant, a filler, a colorant, and the like. Various additives may be appropriately blended.

[Pseudo-adhesive label]
The pseudo-adhesive label of the present invention is not particularly limited as long as it has a pseudo-adhesive layer formed from the above hot melt adhesive composition, and examples thereof include those having the structure shown in FIGS. Specifically, as shown in FIGS. 1 and 2, the pseudo-adhesive label 10 is formed, for example, by laminating a surface base material 11, a pseudo-adhesion layer 12, an intermediate base material 13, and an adhesive layer 14 in this order. Furthermore, the peeling base material 15 is adhered to the pressure-sensitive adhesive layer 14, and the pressure-sensitive adhesive layer 14 is protected by the peeling base material 15. Such a pseudo adhesive label 10 is used as a delivery slip, for example.
The pseudo-adhesive label 10 is used after the release substrate 15 is peeled off from the pressure-sensitive adhesive layer 14 and is adhered to an adherend with the exposed pressure-sensitive adhesive layer 14. The pseudo-adhesive label 10 is obtained by pseudo-adhesion between the pseudo-adhesion layer 12 and the intermediate substrate 13 as a pseudo-adhesion interface. Therefore, for example, in the pseudo-adhesive label 10 attached to the adherend, the surface base material 11 can be easily peeled from the intermediate base material 13 together with the pseudo-adhesion layer 12.

The pseudo-adhesive label 10 is preferably stamped. In the punching process, the surface base material 11, the pseudo adhesive layer 12, the intermediate base material 13, and the pressure-sensitive adhesive layer 14 are punched and cut from the surface base material 11 side, and then unnecessary portions are removed from the release base material 15 by scraping. . Therefore, as shown in FIGS. 1 and 2, the surface base material 11, the pseudo-adhesive layer 12, the intermediate base material 13, and the pressure-sensitive adhesive layer 14 are slightly above the release base material 15 on the release base material 15. Are stacked.

Further, the pseudo adhesive label 10 may be provided with a half cut line 20. The half cut line 20 is obtained by cutting the surface base material 11 and the pseudo adhesive layer 12 so as not to cut the intermediate base material 13. The half cut line 20 may be formed in a perforated shape, or may be formed by a continuous single slit or the like. When the half-cut line 20 is provided, the surface base material 11 is cut along the half-cut line 20 together with the pseudo adhesive layer 12, and can be separated and separated as two sheets (label portions 21 and 22). . When the pseudo-adhesive label 10 is used as a delivery slip, for example, one label portion is used as a delivery slip, and the other label portion is used as a receipt slip that is peeled off after being stamped / signed. And used for slip arrangement.

As the surface base material 11, for example, paper such as kraft paper, fine paper, glassine paper, thermal paper, parchment paper, rayon paper, coated paper, and the like are used, but thermal paper is preferably used. The basis weight of the surface substrate 11 is, for example, a 15 ~ 120g / ^{m 2,} is preferably 20 ~ 100g / ^{m 2.} The surface substrate 11 is usually used as a surface on which information such as characters is displayed on the surface.
The pseudo adhesive layer 12 may be formed from the hot melt adhesive composition described above. The thickness of the pseudo adhesive layer 12 is not particularly limited, but is, for example, 10 to 50 μm, preferably 15 to 40 μm.

As the intermediate substrate 13, paper such as high-quality paper, glassine paper, thermal paper, parchment paper, rayon paper, coated paper, polystyrene resin, ABS resin, polyvinyl alcohol resin, acrylic resin, polylactic acid resin, cellophane film, etc. The resin film is preferably used, but paper such as thermal paper is preferably used. By using paper, particularly thermal paper, for the intermediate base material 13, as will be described later, printing on the intermediate base material 13 can be easily performed by incorporating a printing device into the manufacturing apparatus. Since the intermediate substrate 13 is visually recognized when the surface substrate is peeled off, commercial printing or the like becomes possible.
The thickness of the intermediate substrate is not particularly limited, but is, for example, 5 to 100 μm, preferably 10 to 80 μm.
A peel control layer for reducing peel resistance may be coated on the surface of the intermediate substrate 13 that is bonded to the pseudo adhesive layer 12. The release control layer is not particularly limited, but styrene-acrylic copolymer, polystyrene, styrene-butadiene copolymer, ethylene vinyl acetate copolymer, acrylic ester, acrylic ester copolymer, ethylene / acrylic copolymer. It is formed by coalescence. Further, the thickness of the peeling control layer is not particularly limited, but for example, 5 to 25 μm, preferably 10 to 20 μm is preferable.

The pressure-sensitive adhesive layer 14 is a layer for adhering the pseudo-adhesive label 10 to an adherend. The pressure-sensitive adhesive layer 14 is formed from a conventionally known pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive, a natural rubber-based pressure-sensitive adhesive, a synthetic rubber-based pressure-sensitive adhesive, or a silicone-based pressure-sensitive adhesive. An agent is preferably used. The thickness of the pressure-sensitive adhesive layer 14 is not particularly limited, but is, for example, 5 to 50 μm, preferably 10 to 40 μm.

As the peeling substrate 15, a conventionally known peeling sheet is used without particular limitation. For example, polyester films such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyolefin films such as polyethylene, polypropylene, polymethylpentene, paper base materials such as clay coated paper, glassine paper, recycled paper, etc. A laminate paper or the like on which a thermoplastic resin such as polyethylene is laminated is used in which one side is peeled with a release treatment agent. Examples of the release treatment agent include silicone resins, long-chain alkyl resins, fluorine resins, etc., but silicone resins are preferable from the viewpoint of cost and releasability. The thickness of the release substrate 15 is not particularly limited, but is, for example, 20 to 200 μm, preferably 40 to 100 μm.

[Method for producing pseudo-adhesive label]
Next, a method for manufacturing a pseudo adhesive label will be described.
The method for producing the pseudo-adhesive label is not particularly limited, but usually includes a step of attaching another sheet member to the pseudo-adhesive layer formed from the hot melt adhesive composition described above. The sheet member usually has a pressure-sensitive adhesive layer. Preferably, the pressure-sensitive adhesive layer and the intermediate base material are laminated in this order on a release sheet (release substrate).
The method for producing a pseudo-adhesive label includes a step of applying a hot-melt adhesive composition on a surface substrate, and cooling the applied hot-melt adhesive composition to a predetermined temperature to perform pseudo-adhesion. It is preferable to include a step of bonding another sheet member by, for example, pressure bonding to the pseudo-adhesive layer having the properties (that is, appropriate fluidity and tackiness). By such a method, the formation of the pseudo adhesive layer and the bonding of the pseudo adhesive layer and the sheet member can be continuously performed in a series of steps, so that the pseudo adhesive label can be manufactured with a small number of processes. become.

The hot melt adhesive composition is preferably heated so as to be melted when applied onto the surface substrate, specifically, preferably heated to 120 to 180 ° C., and 130 to More preferably, it is heated to 170 ° C. By setting the above temperature range, the coatability can be improved and curling of the surface substrate can be prevented. Furthermore, even when the surface substrate is thermal paper, the surface substrate is colored. Can be prevented.
Further, when another sheet member is bonded, the pseudo-adhesion layer may be at a temperature having pseudo-adhesiveness, and the temperature is, for example, about 30 to 90 ° C., preferably about 40 to 60 ° C. .

In the present invention, it is more preferable to manufacture using the pseudo-adhesive label manufacturing apparatus 30 shown in FIG. The pseudo-adhesive label manufacturing apparatus 30 includes an adhesive coating device 31 that coats a hot melt adhesive composition on one surface of the surface base material 11, and a coating pressure-bonding roll that is provided to face the adhesive coating device 31. 32 and a pressure-bonding roll 33 for adhering another sheet member 25 to the pseudo-adhesive layer 12 provided so as to be adjacent to the coating pressure-bonding roll 32 and formed of the hot melt adhesive composition.

In the manufacturing apparatus 30, the surface base material 11 is fed from the first feed roll 35, travels to the coating pressure-bonding roll 32 through the guide roll 36 </ b> A, and is wound around the coating pressure-bonding roll 32. The hot melt adhesive composition is applied to one surface of the surface base material 11 wound around the coating pressure roll 32 by the adhesive coating device 31. The adhesive coating device 31 is, for example, a resin coater for extruding and applying a hot melt adhesive composition that has been heated and melted.
The surface base material 11 coated with the hot melt adhesive composition is fed between the pressure-bonding roll 33 and the coating pressure-bonding roll 32 while being wound around the coating pressure-bonding roll 32. Here, the coating pressure-bonding roll 32 has a cooling function through which cooling water or the like is passed. Therefore, the surface base material 11 coated with the hot melt adhesive composition is cooled by the coating pressure-bonding roll 32 until it is sent between the pressure-bonding roll 33 and the coating pressure-bonding roll 32. By this cooling, the applied hot-melt adhesive composition is cooled to a predetermined temperature when bonded to the sheet member 25, and becomes a pseudo-adhesive layer having appropriate pseudo-adhesive performance.
Moreover, it is preferable that the coating pressure-bonding roll 32 is in contact with the cooling roll 36 at a position where the surface base material is not wound. The cooling roll 36 has an outer peripheral surface made of metal and has a cooling function by passing cooling water or the like through the inside. Therefore, the coating pressure-bonding roll 32 is efficiently cooled by the cooling roll 36.
Further, the sheet member 25 to be bonded to the pseudo adhesive layer 12 is fed from the second feeding roll 37 and wound around the pressure roll 33, and the pseudo adhesive layer is interposed between the coating pressure roll 32 and the pressure roll 33. Then, the pseudo-adhesive label 10 is obtained. After that, the pseudo-adhesive label 10 is subjected to punching and half-cutting using a pinnacle die, Thomson blade, laser processing, etc., if necessary, and then scraped and wound around a winding roll 38. Taken.

Moreover, in this manufacturing method, you may print on the surface base material 11. FIG. For example, in the manufacturing apparatus 30 described above, a printing device is provided between the first delivery roll 35 and the coating pressure-bonding roll 32, and is sent from the first delivery roll 35 before being wound around the coating pressure-bonding roll 32. The surface base material 11 may be printed.
In addition, when the sheet member 25 includes an intermediate base material, the intermediate base material may be printed. For example, in the manufacturing apparatus 30 described above, a printing device is provided between the second delivery roll 37 and the pressure roll 33, and the intermediate base material is fed from the second delivery roll 37 and wound around the pressure roll 33. May be printed.
In addition, as said printing apparatus, the thing of well-known systems, such as an offset printing apparatus and a thermal printer, can be used. As described above, when the printing apparatus is incorporated, it is not necessary to print the intermediate base material and the surface base material in advance, so that the print contents can be flexibly changed.

In the above manufacturing method, the temperature at which the sheet member is bonded to the pseudo adhesive layer may not be adjusted accurately. For example, immediately after the start of production, the feed speed of the surface base material from the first feed roll 35 is usually slow, and the time from application of the hot melt adhesive composition to bonding becomes longer than usual. Sometimes. Moreover, the temperature of the coating pressure-bonding roll 32 and the cooling roll 36 may fluctuate, and the cooling conditions may change as production continues.
However, the hot melt adhesive composition of the present invention, as described above, has pseudo-adhesiveness over a wide temperature range and has a long open time, so the temperature of the pseudo-adhesive layer at the time of bonding cannot be accurately adjusted. However, it is difficult for bonding failure to occur. In addition, since the pseudo-adhesive strength of the hot melt adhesive composition of the present invention does not vary greatly even when the bonding temperature changes, it is possible to stably produce a pseudo-adhesive label with little variation in pseudo-adhesive strength. Become.

Further, in the above manufacturing method, the coating temperature when applying the hot melt adhesive composition is controlled to a predetermined temperature or lower, and the subsequent bonding of the sheet member to the pseudo-adhesive layer is performed by coating. It is carried out by preheating due to heating, and the temperature is not raised above the coating temperature. Therefore, since the surface base material and the intermediate base material are not heated more than necessary, for example, even thermal paper is not unnecessarily colored in the process of manufacturing the pseudo-adhesive label.

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

The measurement method and evaluation method in the present invention are as follows.
(1) Melt viscosity (2) Melting point The melting point of each resin is measured by DSC. The DSC measurement conditions at the time of measuring the melting point were from 0 ° C. to a temperature rate of 5 ° C./min, a sample amount of 10 mg, and the peak top temperature of the endothermic peak.
(3) Softening point The softening point of the hot melt adhesive composition was measured by the ring and ball method (JIS K 7234 4.1).
(4) Exothermic peak measurement by DSC (DSC measurement)
DSC measurement was performed using Q2000 manufactured by TA Instruments. The measurement was performed by lowering the temperature from 180 ° C. to 0 ° C. at a temperature rate of −5 ° C./min. The sample amount was 10 mg, and the peak top temperature of each exothermic peak was detected.
(5) Pseudo-adhesive strength The hot melt adhesive composition heated and melted on the surface opposite to the surface provided with the thermal coat layer of thermal paper (TP50KS-HS, manufactured by Nippon Paper Industries Co., Ltd.) is applied to the applicator. Was used to obtain a sheet having a pseudo adhesive layer on one side of the thermal paper. The sheet was placed in a 120 ° C. thermostat and heated for 1 minute, then taken out of the thermostat and cooled, and the surface temperature of the resin was measured using a surface thermometer (CUSTOM IR-303). A high-quality paper (NPi Foam <55>, manufactured by Nippon Paper Industries Co., Ltd.) was bonded using a 9 kg roller at a temperature of 5 ° C. to prepare a pseudo-adhesive sample and cooled to room temperature (23 ° C.).
Next, the obtained pseudo-adhesive sample having a length of 10 cm and a width of 50 mm was subjected to a surface substrate (thermal paper) side with a peeling angle of 180 ° and a peeling speed of 0.3 m at room temperature (23 ° C.). It peeled on condition of / min, and the force required for the peeling was measured as a pseudo-adhesive force. The pseudo-adhesive force was measured on pseudo-adhesive samples prepared at temperatures of 65 ° C., 70 ° C., 75 ° C., and 80 ° C. when bonding was performed (bonding temperature). And the magnification | multiplying_factor (change magnification) of the pseudoadhesion force about the pseudoadhesion sample from which bonding temperature differs 5 degreeC was calculated | required, and the largest thing was made into the maximum change magnification among the obtained magnifications.
(6) Manufacturing machine test Using the pseudo-adhesive label manufacturing apparatus shown in FIG. 3, the productivity when the pseudo-adhesive label shown in FIGS. “A” indicates that the productivity is good, and “B” indicates that the productivity is slightly inferior in terms of stability of the pseudo-adhesive force, but “B” indicates that the production is possible, and “F” indicates that the pseudo-adhesive label cannot be produced. "

Examples 1 to 9, Comparative Examples 1 and 2
The raw materials shown in Table 2 were blended in the blending amounts shown in Table 1 to obtain hot melt adhesive compositions of Examples and Comparative Examples. Table 3 shows the results of DSC measurement of the hot melt adhesive compositions of Examples and Comparative Examples, and Table 4 shows other evaluation results.

As described above, in the hot melt adhesive composition of each of the above examples, by adding solid paraffin to a thermoplastic resin containing an ethylene / propylene copolymer, an appropriate pseudo adhesive property can be obtained even if the processing temperature is changed. Further, the pseudo-adhesive force could be not greatly changed even when the processing temperature was changed. For this reason, the pseudo-adhesive label production apparatus was able to produce the pseudo-adhesive label without any problem. In each example, two or more peak tops were confirmed in the DSC measurement, and the range in which these peak tops were confirmed was 30 ° C. or more.
On the other hand, the hot melt adhesive composition of Comparative Example 1 was able to impart pseudo-adhesiveness in a relatively wide temperature range by using two types of thermoplastic resins having different melting points. When the processing temperature changes, it changes greatly. For this reason, when a pseudo-adhesive label is produced with a production apparatus, there is a pseudo-adhesive label in which the pseudo-adhesive layer is completely adhered to the intermediate base material, and the surface base material cannot be peeled off from the intermediate base material side. Could not be realized. Further, the hot melt adhesive of Comparative Example 2 was unable to bond high-quality paper to the pseudo-adhesion layer at 65 to 80 ° C., and it was not possible to produce a pseudo-adhesive label in the production apparatus.

DESCRIPTION OF SYMBOLS 10 ... Pseudo adhesive label 11 ... Surface base material 12 ... Pseudo adhesive layer 13 ... Intermediate base material 14 ... Adhesive layer 15 ... Peeling base material 20 ... Half cut line 25 ... Sheet member 30 ... Pseudo adhesive label manufacturing apparatus 31 ... Adhesive Coating device 32 ... Coating pressure roll 33 ... Pressing pressure roll 36 ... Cooling roll

Claims

A hot melt adhesive composition used for pseudo-adhesion, comprising a thermoplastic resin containing an ethylene / propylene copolymer and solid paraffin, wherein the solid paraffin is added to 100 parts by mass of the thermoplastic resin. On the other hand, a hot melt adhesive composition containing 1 to 20 parts by mass and having a melt viscosity of 2000 to 10,000 mPa · s at 160 ° C.
In the DSC measurement in which the hot melt adhesive composition was measured by decreasing the temperature from 180 ° C. to 0 ° C. at a temperature rate of −5 ° C./min, it had two or more exothermic peaks,
The hot melt adhesive composition according to claim 1, wherein a temperature range in which an exothermic peak is confirmed, which is a difference between a peak top temperature of an exothermic peak on the highest temperature side and an exothermic peak on the lowest temperature side, is 30 ° C or higher.
The hot melt adhesive composition according to claim 1 or 2, wherein the solid paraffin has a melting point of 90 ° C or higher.
The hot melt adhesive composition according to any one of claims 1 to 3, wherein the thermoplastic resin contains two or more resins having different melting points.
The hot resin according to any one of claims 1 to 4, wherein the thermoplastic resin further includes an ethylene / α-olefin copolymer other than the ethylene / propylene copolymer having a melting point different from that of the ethylene / propylene copolymer. Melt adhesive composition.
The hot melt adhesive composition according to claim 5, wherein the ethylene / α-olefin copolymer is an ethylene / 1-octene copolymer.
A pseudo-adhesive label comprising a pseudo-adhesive layer formed from the hot melt adhesive composition according to any one of claims 1 to 6.
The pseudoadhesive label according to claim 7, comprising a surface substrate, the pseudoadhesive layer, an intermediate substrate, and an adhesive layer in this order.
The pseudo-adhesive label according to claim 8, wherein the pseudo-adhesive layer and the intermediate base material are pseudo-adhered.
The pseudo-adhesive label according to claim 8 or 9, further comprising a release substrate adhered to the pressure-sensitive adhesive layer.
11. The pseudoadhesive label according to claim 8, wherein the surface base material is paper.
The pseudoadhesive label according to any one of claims 8 to 11, wherein the intermediate substrate is paper or a resin film.
13. The pseudoadhesive label according to claim 8, wherein at least one of the surface base material and the intermediate base material is thermal paper.
A step of applying the hot melt adhesive composition according to any one of claims 1 to 6 on the surface substrate, and cooling the applied hot melt adhesive composition to a predetermined temperature. A method for producing a pseudo-adhesive label, comprising a step of pressure-bonding another sheet member to a pseudo-adhesive layer having pseudo adhesion.