WO2015103753A1 - Led灯具及发光灯芯 - Google Patents

Led灯具及发光灯芯 Download PDF

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Publication number
WO2015103753A1
WO2015103753A1 PCT/CN2014/070362 CN2014070362W WO2015103753A1 WO 2015103753 A1 WO2015103753 A1 WO 2015103753A1 CN 2014070362 W CN2014070362 W CN 2014070362W WO 2015103753 A1 WO2015103753 A1 WO 2015103753A1
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WO
WIPO (PCT)
Prior art keywords
led
substrate
fixed
heat sink
led chip
Prior art date
Application number
PCT/CN2014/070362
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English (en)
French (fr)
Inventor
温明华
Original Assignee
深圳市新益昌自动化设备有限公司
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Application filed by 深圳市新益昌自动化设备有限公司 filed Critical 深圳市新益昌自动化设备有限公司
Priority to PCT/CN2014/070362 priority Critical patent/WO2015103753A1/zh
Publication of WO2015103753A1 publication Critical patent/WO2015103753A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present application relates to the field of light emitting diodes, and in particular, to an LED lamp and a illuminating wick.
  • LED Light Emitting Diode
  • LED is a semiconductor device that converts electrical energy into light energy. It is widely used due to its high luminous efficiency, long service life, energy saving, environmental protection, small size, and safety. Display, lighting and other fields.
  • an integrated power type LED component or a chip type LED component is mainly used, and the LED component is soldered on an aluminum-based circuit board, and the heat generated by the LED component passes through the aluminum-based circuit board and the aluminum casing.
  • the aluminum casing is both a protective casing and a heat sink.
  • the existing LED bulbs have at least the following problems: First, the LED components are directly attached to the aluminum-based circuit board, so that under high power requirements, the aluminum-based circuit boards also need to be increased accordingly, Meeting the heat dissipation requirements, increasing the cost of the aluminum material, making the LED bulbs bulky, which is not conducive to space saving; Second, the light emitted by the directional LED elements is directly radiated through the lampshade, and there is no light distribution for improving light utilization.
  • the LED drive power is generally set on the aluminum-based circuit board together with the LED components, LED drive
  • the heat generated by the power supply and the LED components is radiated to the aluminum casing through the aluminum-based circuit board for heat dissipation, so that the heat conduction is too concentrated.
  • the heat is generated, the heat is difficult to dissipate in time, and the heat collecting effect easily leads to a decrease in the life of the LED lamp.
  • the light effect is fast decayed and the failure rate is high.
  • the present application provides an LED lamp and a illuminating wick to meet the requirements of high power, small size, low cost, high space utilization, good illumination performance, and good heat dissipation performance.
  • the present application provides an LED lamp, comprising: a connector, and an LED illuminating wick, the LED illuminating wick comprising: a heat sink, an LED driving power source, and an LED lighting component, the LED lighting component comprising: a fluorescent colloid
  • an LED chip and a substrate provided with a line electrically connected to the LED chip, the heat sink, the LED driving power source and the substrate are assembled to form a firmware structure, and the portion of the substrate provided with the LED chip protrudes from the firmware structure
  • the substrate has at least one mounting surface to which the LED chip is fixed.
  • the LED chip protrudes from one side of the substrate and extends in a direction parallel to a plane of the substrate.
  • the heat sink is fixed to one side of the substrate, and the LED driving power source is fixed to the heat sink.
  • the heat sink is fixed on one side of the substrate, and the LED driving power source is fixed on the other side.
  • the LED chip extends from one side of the substrate and the LED chip extends in a direction perpendicular to the substrate.
  • the heat sink and the LED driving power source are fixed on the other surface of the substrate, or the heat sink is fixed on the other surface of the substrate, and the LED driving power source is fixed on the heat sink.
  • the LED lamp further includes: a protective cover, and a diffuser disposed at an opposite end of the protective cover and the connector, the firmware structure being disposed in the first cavity defined by the protective cover, The portion of the substrate on which the LED chip is disposed is placed in a second cavity defined by the diffuser, or
  • the LED luminaire further includes: a glue layer wrapped around the LED illuminating wick by means of a potting package.
  • a side of the protective cover adjacent to the astigmatism cover, and/or a side of the astigmatism cover adjacent to the protective cover is provided with a reflective plate, and the reflective plate is provided with a supply A through hole through which the LED chip is inserted.
  • the reflector is recessed toward the joint; the reflector is a mirror surface, or a reflective film or a reflective coating is attached to the reflective surface of the reflector opposite to the joint. material.
  • the substrate has two, three or four mounting faces to which the LED chip is fixed.
  • the substrate is an aluminum-based circuit board; the substrate is rectangular, square, polygonal or irregular; the protective casing is screwed, plugged or snapped with the diffuser Assembly; the protective casing is made of high temperature resistant flame retardant material.
  • the present application further provides an LED light-emitting wick, comprising: a heat sink, an LED driving power source, and an LED lighting component, the LED lighting component comprising: an LED chip wrapped with a fluorescent colloid, and being electrically disposed with the LED chip a substrate of the connected circuit, the heat sink, the LED driving power source and the substrate are assembled to form a firmware structure, the portion of the substrate provided with the LED chip is protruded from the firmware structure, and the substrate has at least two fixed The mounting surface of the LED chip.
  • the LED chip protrudes from one side of the substrate and extends in a direction parallel to a plane of the substrate.
  • the heat sink is fixed on one side of the substrate, the LED driving power source is fixed on the heat sink, or the heat sink is fixed on one side of the substrate, and the LED is fixed on the other side. Drive power.
  • the LED chip extends from one side of the substrate and the LED chip extends in a direction perpendicular to the substrate.
  • the heat sink and the LED driving power source are fixed on the other surface of the substrate, or the heat sink is fixed on the other surface of the substrate, and the LED driving power source is fixed on the heat sink.
  • the substrate has two, three or four mounting faces to which the LED chips are fixed.
  • the substrate is an aluminum-based circuit board; the substrate has a rectangular shape, a square shape, a polygonal shape or an irregular shape.
  • the LED luminaire comprises: a connector, and an LED illuminating wick comprising: a heat sink, an LED driving power source, and an LED lighting component, the LED illuminating component comprising: a fluorescent colloid
  • an LED chip and a substrate provided with a circuit electrically connected to the LED chip, the heat sink, the LED driving power source and the substrate are assembled to form a firmware structure, and the portion of the substrate provided with the LED chip protrudes from the firmware structure
  • the substrate has at least one mounting surface to which the LED chip is fixed. In this way, the LED chip and the substrate are discretely designed.
  • the substrate volume does not need to increase with the increase of the LED chip, the material is reduced, the cost is reduced, and the lamp is small in size and saves space.
  • the side of the protective cover close to the diffuser and/or the side of the diffuser close to the protective cover is provided with a reflector, the light emitted by the LED chip can be reflected by the reflector, and the secondary optical design enhances the light. Utilization; using a diffuser, so that the emitted light can meet the requirements of uniform illumination and comfortable brightness distribution; the heat generated by the LED driving power supply and the LED lighting component directly radiates heat through the radiator, which enhances the heat dissipation performance of the lamp and ensures the lamp The service life.
  • FIG. 1 is a perspective view showing the structure of an LED lamp according to Embodiment 1 of the present application.
  • FIG. 2 is a schematic exploded view of an LED lamp according to Embodiment 1 of the present application.
  • FIG. 3 is a cross-sectional structural view of an LED lamp according to Embodiment 1 of the present application.
  • FIG. 4 is a schematic structural view of an LED lighting assembly according to Embodiment 1 of the present application.
  • the embodiment provides an LED luminaire provided with an LED illuminating wick, which mainly includes: a protective casing 1, a joint disposed at one end of the protective casing 1, and a diffuser disposed at the other end of the protective casing 1. 3, and LED lighting wick.
  • the LED light-emitting wick includes: a heat sink 4, an LED driving power source 5, and an LED lighting assembly 6.
  • the LED lighting assembly 6 includes: an LED chip 62 wrapped with a fluorescent colloid 61, and a substrate 63 provided with a line electrically connected to the joint 2 and the LED chip 62, respectively.
  • the heat sink 4, the LED driving power source 5 and the substrate 63 are assembled to form a firmware structure disposed in the first cavity defined by the protective casing 1, and the portion of the substrate 63 provided with the LED chip 62 is protruded from the firmware structure and placed The second cavity defined by the diffuser 3.
  • the substrate 63 has at least two fixed There is a mounting surface of the LED chip 62, and FIG. 4 shows that four mounting surfaces are provided with the LED chip 62, but the embodiment in which the substrate 63 has two, three, five, etc. mounting surfaces can also be used as an alternative. .
  • the layout of the LED chip 62 on the mounting surface can be selected according to actual conditions, such as denser or sparse density. In this way, the LED chip and the substrate are discretely designed. Under the high power requirement, the substrate volume does not need to increase with the increase of the LED chip, the material is reduced, the cost is reduced, and the lamp is small in size and saves space.
  • the LED chip 62 protrudes from the side of the substrate 63 and extends in a direction parallel to the plane in which the substrate 63 is located.
  • a heat sink 4 is fixed to the substrate 63, and the LED driving power source 5 is fixed to the heat sink 4.
  • a side of the protective casing 1 adjacent to the diffuser 3 is provided with a reflector 11, and a through hole for the LED chip 62 to pass through is formed in the reflector 11.
  • the reflector 11 is recessed toward the joint 2 to form a curved reflecting surface, which further improves the light utilization efficiency.
  • the substrate 63 is an aluminum-based wiring board, and the substrate 63 has a rectangular shape.
  • the protective casing 1 and the astigmatism cover 3 can be assembled by screwing, plugging or snapping, which can be conveniently disassembled and maintained. For example, when using screw-on assembly, threads or screws can be used. The way to install.
  • Protective case 1 It can be made of high temperature resistant flame retardant material to ensure that the protective case 1 will not be deformed or damaged by heat.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1
  • a heat sink is fixed on one side of the substrate, and an LED driving power source is fixed on the other side.
  • one side of the substrate extends out of the LED chip and the extending direction of the LED chip is perpendicular to the substrate.
  • a heat sink and an LED driving power source are fixed on the other surface of the substrate, or a heat sink is fixed on the other surface of the substrate, and an LED driving power source is fixed on the heat sink.
  • the difference between this embodiment and the above embodiment is mainly that: a reflector on the side of the diffuser close to the protective casing is disposed.
  • the reflective surface opposite to the joint on the reflector is attached with a reflective film or sprayed with a reflective material, and the light reflection effect can also be achieved.
  • the substrate can be square, polygonal or irregular, etc., as various alternatives.
  • the LED lamp can be provided with the protective casing 1 and the astigmatism cover 3, and the glue layer is formed by coating the glue layer on the outside of the LED illuminating wick, thereby achieving the same protection and light treatment effect. .
  • the length of the substrate may vary depending on the required power level, and does not increase the diameter of the lamp itself.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

公开了一种LED灯具及发光灯芯，LED灯具包括：接头（2），以及LED发光灯芯，LED发光灯芯包括：散热器（4），LED驱动电源（5），以及LED发光组件（6），LED发光组件（6）包括：裹设有荧光胶体的LED芯片（62），以及设置有与LED芯片（62）电连接的线路的基板（63），散热器（4）、LED驱动电源（5）及基板（63）组装形成固件结构，基板（63）设置有LED芯片（62）的部分凸出于固件结构设置，基板（63）具有至少一个固定有LED芯片（62）的安装面。这样，LED芯片与基板分立式设计，在大功率要求下，基板体积无需随着LED芯片增多而增大，减少了用料，降低了成本，使灯具体积小巧，节约了空间。

Description

LED灯具及发光灯芯 技术领域
[0001] 本申请涉及发光二极管领域， 尤其涉及一种 LED灯具及发光灯芯。
背景技术
[0002] 发光二极管 （Light Emitting Diode, LED) 是一种将电能转换为光能的半导体器件， 其由于高发光效能、 使用寿命长、 节能、 环保、 体积小、 安全等优点， 被广泛应用于显示、 照明等领域。
[0003] 现有的 LED球泡灯中主要采用集成功率型 LED元件或贴片式 LED元件， LED元件 被焊接在铝基线路板上， LED 元件所产生的热量通过铝基线路板及铝外壳进行传导， 从而 达到散热的目的， 铝外壳既成为保护外壳， 又是散热器件。 基于这种结构， 现有的 LED 球 泡灯至少存在如下问题： 第一， LED 元件直接贴设于铝基线路板上， 使得在大功率要求 下， 铝基线路板也相应需要增大， 为了满足散热要求， 增加了铝料成本， 使得 LED 球泡灯 体积较大， 不利于节约空间； 第二， 定向发光的 LED 元件发出的光线直接通过灯罩照射出 去， 没有进行提高光线利用率的配光设计， 光利用率低， 并且光束照度过于强烈， 无法满足 照明质量中照度均匀、 舒适的亮度分布的要求； 第三， LED驱动电源一般是和 LED元件一 同设置在铝基线路板上， LED驱动电源及 LED元件所产生的热量是同时通过铝基线路板传 导到铝外壳上进行散热， 使得热量传导过于集中， 在发热量较大时， 热量难以及时散去， 集 热效应容易导致 LED灯具寿命减少， 光效衰减快， 故障率高。
发明内容
[0004] 本申请提供一种 LED 灯具及发光灯芯， 以满足大功率且体积小、 成本低、 空间利用 率高、 光照性能好及散热性能好的要求。
[0005] 本申请提供一种 LED灯具， 包括： 接头， 以及 LED发光灯芯， 该 LED发光灯芯包 括： 散热器、 LED驱动电源， 以及 LED发光组件， 该 LED发光组件包括： 裹设有荧光胶体 的 LED芯片， 以及设置有与该 LED芯片电连接的线路的基板， 所述散热器、 LED驱动电源 及基板组装形成固件结构， 所述基板设置有所述 LED 芯片的部分凸出于该固件结构设置， 所述基板具有至少一个固定有所述 LED芯片的安装面。
[0006] 进一步地， 所述 LED 芯片从所述基板一侧伸出且延伸方向与所述基板所在平面平 行。
[0007] 进一步地， 所述基板一面固定有所述散热器， 所述 LED 驱动电源固定于所述散热器 上， 或者， 所述基板一面固定有所述散热器， 另一面固定有所述 LED驱动电源。
[0008] 进一步地， 所述基板一面延伸出所述 LED芯片且所述 LED芯片的延伸方向与所述基 板垂直。
[0009] 进一步地， 所述基板另一面固定有所述散热器及 LED 驱动电源， 或者， 所述基板另 一面固定有所述散热器， 所述 LED驱动电源固定于所述散热器上。
[0010] 进一步地， 该 LED 灯具还包括： 保护外壳， 以及设置于该保护外壳与所述接头相对 一端的散光罩， 所述固件结构置于所述保护外壳所限定的第一腔体内， 所述基板设置有所述 LED芯片的部分置于所述散光罩所限定的第二腔体内， 或者，
所述 LED灯具还包括： 采用灌胶封装的方式裹设于所述 LED发光灯芯外部的胶层。
[0011] 进一步地， 所述保护外壳上靠近所述散光罩的一侧， 和 /或， 所述散光罩上靠近所述 保护外壳的一侧设置有反光板， 该反光板上开设有供所述 LED芯片贯穿的通孔。
[0012] 进一步地， 所述反光板向所述接头方向凹陷； 所述反光板为反光镜面， 或者， 所述 反光板上与所述接头相对的反光面上贴设有反光膜或喷涂有反光材料。
[0013] 进一步地， 所述基板具有两个、 三个或四个固定有所述 LED芯片的安装面。
[0014] 进一步地， 所述基板为铝基线路板； 所述基板呈长方形、 正方形、 多边形或不规则 形； 所述保护外壳与所述散光罩螺接式、 插拔式或卡扣式相装配； 所述保护外壳采用耐高温 阻燃材料。
[0015] 本申请还提供一种 LED发光灯芯， 包括： 散热器、 LED驱动电源， 以及 LED发光 组件， 该 LED发光组件包括： 裹设有荧光胶体的 LED芯片， 以及设置有与该 LED芯片电 连接的线路的基板， 所述散热器、 LED 驱动电源及基板组装形成固件结构， 所述基板设置 有所述 LED芯片的部分凸出于该固件结构设置， 所述基板具有至少两个固定有所述 LED芯 片的安装面。
[0016] 进一步地， 所述 LED 芯片从所述基板一侧伸出且延伸方向与所述基板所在平面平 行。
[0017] 进一步地， 所述基板一面固定有所述散热器， 所述 LED 驱动电源固定于所述散热器 上， 或者， 所述基板一面固定有所述散热器， 另一面固定有所述 LED驱动电源。
[0018] 进一步地， 所述基板一面延伸出所述 LED芯片且所述 LED芯片的延伸方向与所述基 板垂直。
[0019] 进一步地， 所述基板另一面固定有所述散热器及 LED 驱动电源， 或者， 所述基板另 一面固定有所述散热器， 所述 LED驱动电源固定于所述散热器上。 [0020] 进一步地， 所述基板具有两个、 三个或四个固定有所述 LED芯片的安装面。
[0021] 进一步地， 所述基板为铝基线路板； 所述基板呈长方形、 正方形、 多边形或不规则 形。
[0022] 本申请的有益效果是：
通过提供一种 LED灯具及发光灯芯， LED灯具包括： 接头， 以及 LED发光灯芯， 该 LED 发光灯芯包括： 散热器、 LED驱动电源， 以及 LED发光组件， 该 LED发光组件包括： 裹设 有荧光胶体的 LED 芯片， 以及设置有与该 LED 芯片电连接的线路的基板， 所述散热器、 LED驱动电源及基板组装形成固件结构， 所述基板设置有所述 LED芯片的部分凸出于该固 件结构设置， 所述基板具有至少一个固定有所述 LED芯片的安装面。 这样， LED芯片与基 板分立式设计， 在大功率要求下， 基板体积无需随着 LED 芯片增多而增大， 减少了用料， 降低了成本， 使灯具体积小巧， 节约了空间。 另外， 由于保护外壳上靠近散光罩的一侧， 和 /或， 散光罩上靠近保护外壳的一侧设置有反光板， LED 芯片发出的光线可通过反光板进行 反射， 二次光学设计提高了光利用率； 采用散光罩， 使得发出的光线能满足照度均匀、 舒适 亮度分布的要求； LED驱动电源及 LED发光组件所产生的热量直接通过散热器进行散热， 增强了灯具的散热性能， 保证了灯具的使用寿命。
附图说明
[0023] 图 1为本申请实施例一的 LED灯具的立体结构示意图。
[0024] 图 2为本申请实施例一的 LED灯具的分解结构示意图。
[0025] 图 3为本申请实施例一的 LED灯具的剖面结构示意图。
[0026] 图 4为本申请实施例一中 LED发光组件的结构示意图。
具体实施方式
[0027] 下面通过具体实施方式结合附图对本申请作进一步详细说明。
[0028] 实施例一：
请参考图 1-3， 本实施例提供一种设置有 LED发光灯芯的 LED灯具， 主要包括： 保护外壳 1、 设置于该保护外壳 1一端的接头 2、 设置于保护外壳 1另一端的散光罩 3， 以及 LED发 光灯芯。 其中 LED发光灯芯包括： 散热器 4、 LED驱动电源 5， 以及 LED发光组件 6。 其 中， 该 LED发光组件 6包括： 裹设有荧光胶体 61的 LED芯片 62， 以及设置有分别与接头 2及该 LED芯片 62电连接的线路的基板 63。 散热器 4、 LED驱动电源 5及基板 63组装形 成一置于保护外壳 1所限定的第一腔体内的固件结构， 而基板 63设置有 LED芯片 62的部 分凸出于该固件结构设置并置于散光罩 3所限定的第二腔体内。 基板 63具有至少两个固定 有 LED芯片 62的安装面， 图 4中示出了有四个安装面布设有 LED芯片 62， 但是基板 63具 有两个、 三个、 五个等数量的安装面的实施方式也可以作为替代方案。 当然， LED 芯片 62 在安装面上的布局可参照实际情况选择， 例如密度较密集或稀疏等。 这样， LED 芯片与基 板分立式设计， 在大功率要求下， 基板体积无需随着 LED 芯片增多而增大， 减少了用料， 降低了成本， 使灯具体积小巧， 节约了空间。
[0029] LED芯片 62从基板 63—侧伸出且延伸方向与基板 63所在平面平行。 基板 63—面固 定有散热器 4， LED驱动电源 5固定于散热器 4上。
[0030] 保护外壳 1上靠近散光罩 3的一侧设置有反光板 11， 该反光板 11上开设有供 LED 芯片 62贯穿的通孔。 这样， LED芯片发出的光线可通过反光板进行反射， 二次光学设计提 高了光利用率， 提高了照度及亮度。 反光板 11 向接头 2方向凹陷， 从而形成一个弧面形反 光面， 进一步提高了光利用率。
[0031] 基板 63为铝基线路板， 基板 63呈长方形。
[0032] 保护外壳 1 与散光罩 3 可采用螺接式、 插拔式或卡扣式相装配， 可以方便地进行灯 具拆卸维护， 例如， 当采用螺接式装配时， 可采用螺纹或螺钉等方式进行安装。 保护外壳 1 可采用耐高温阻燃材料， 保证了保护外壳 1不会因受热而变形或损坏。
[0033] 实施例二：
本实施例与上述实施例区别主要在于： 基板一面固定有散热器， 另一面固定有 LED 驱动电 源。
[0034] 实施例三：
本实施例与上述实施例区别主要在于： 基板一面延伸出 LED芯片且 LED芯片的延伸方向与 基板垂直。 基板另一面固定有散热器及 LED 驱动电源， 或者， 基板另一面固定有散热器， LED驱动电源固定于所述散热器上。
[0035] 实施例四：
本实施例与上述实施例区别主要在于： 散光罩上靠近保护外壳的一侧设置有反光板。
[0036] 实施例五：
本实施例与上述实施例区别主要在于： 反光板上与接头相对的反光面上贴设有反光膜或喷涂 有反光材料， 同样可实现光反射的作用。
[0037] 实施例六：
本实施例与上述实施例区别主要在于： 基板可呈正方形、 多边形或不规则形等， 作为多种替 代方案。 [0038] 实施例七：
本实施例与上述实施例区别主要在于： LED灯具可不设置保护外壳 1以及散光罩 3， 而采用 灌胶封装的方式， 形成胶层裹设于 LED 发光灯芯外部， 从而同样达到保护以及光处理效 果。
[0039] 另外， 在实际应用中， 基板的长度可随需要的功率大小不同而改变， 并不增加灯具 本身直径大小。
[0040] 以上内容是结合具体的实施方式对本申请所作的进一步详细说明， 不能认定本申请 的具体实施只局限于这些说明。 对于本申请所属技术领域的普通技术人员来说， 在不脱离本 申请构思的前提下， 还可以做出若干简单推演或替换。

Claims

权 利 要 求 书
1. 一种 LED灯具， 其特征在于， 包括： 接头， 以及 LED发光灯芯， 该 LED发光灯芯包 括： 散热器、 LED驱动电源， 以及 LED发光组件， 该 LED发光组件包括： 裹设有荧光胶体 的 LED芯片， 以及设置有与该 LED芯片电连接的线路的基板， 所述散热器、 LED驱动电源 及基板组装形成固件结构， 所述基板设置有所述 LED芯片的部分凸出于该固件结构设置， 所述基板具有至少一个固定有所述 LED芯片的安装面。
2. 如权利要求 1所述的 LED灯具， 其特征在于， 所述 LED芯片从所述基板一侧伸出且延 伸方向与所述基板所在平面平行。
3. 如权利要求 2所述的 LED灯具， 其特征在于， 所述基板一面固定有所述散热器， 所述 LED驱动电源固定于所述散热器上， 或者， 所述基板一面固定有所述散热器， 另一面固定 有所述 LED驱动电源。
4. 如权利要求 1所述的 LED灯具， 其特征在于， 所述基板一面延伸出所述 LED芯片且所 述 LED芯片的延伸方向与所述基板垂直。
5. 如权利要求 4所述的 LED灯具， 其特征在于， 所述基板另一面固定有所述散热器及 LED 驱动电源， 或者， 所述基板另一面固定有所述散热器， 所述 LED驱动电源固定于所述散热 器上。
6. 如权利要求 1所述的 LED灯具， 其特征在于， 该 LED灯具还包括： 保护外壳， 以及设 置于该保护外壳与所述接头相对一端的散光罩， 所述固件结构置于所述保护外壳所限定的第 一腔体内， 所述基板设置有所述 LED芯片的部分置于所述散光罩所限定的第二腔体内， 或 者，
所述 LED灯具还包括： 采用灌胶封装的方式裹设于所述 LED发光灯芯外部的胶层。
7. 如权利要求 6所述的 LED灯具， 其特征在于， 所述保护外壳上靠近所述散光罩的一侧， 和 /或， 所述散光罩上靠近所述保护外壳的一侧设置有反光板， 该反光板上开设有供所述 LED芯片贯穿的通孔。
8. 如权利要求 7所述的 LED灯具， 其特征在于， 所述反光板向所述接头方向凹陷； 所述反 光板为反光镜面， 或者， 所述反光板上与所述接头相对的反光面上贴设有反光膜或喷涂有反 光材料。
9. 如权利要求 1所述的 LED灯具， 其特征在于， 所述基板具有两个、 三个或四个固定有所 述 LED芯片的安装面。
10. 如权利要求 6所述的 LED灯具， 其特征在于， 所述基板为铝基线路板； 所述基板呈长 方形、 正方形、 多边形或不规则形； 所述保护外壳与所述散光罩螺接式、 插拔式或卡扣式相 装配； 所述保护外壳采用耐高温阻燃材料。
11. 一种 LED发光灯芯， 其特征在于， 包括： 散热器、 LED驱动电源， 以及 LED发光组 件， 该 LED发光组件包括： 裹设有荧光胶体的 LED芯片， 以及设置有与该 LED芯片电连 接的线路的基板， 所述散热器、 LED驱动电源及基板组装形成固件结构， 所述基板设置有 所述 LED芯片的部分凸出于该固件结构设置， 所述基板具有至少两个固定有所述 LED芯片 的安装面。
12. 如权利要求 11所述的 LED发光灯芯， 其特征在于， 所述 LED芯片从所述基板一侧伸 出且延伸方向与所述基板所在平面平行。
13. 如权利要求 12所述的 LED发光灯芯， 其特征在于， 所述基板一面固定有所述散热器， 所述 LED驱动电源固定于所述散热器上， 或者， 所述基板一面固定有所述散热器， 另一面 固定有所述 LED驱动电源。
14. 如权利要求 11所述的 LED发光灯芯， 其特征在于， 所述基板一面延伸出所述 LED芯 片且所述 LED芯片的延伸方向与所述基板垂直。
15. 如权利要求 14所述的 LED发光灯芯， 其特征在于， 所述基板另一面固定有所述散热器 及 LED驱动电源， 或者， 所述基板另一面固定有所述散热器， 所述 LED驱动电源固定于所 述散热器上。
16. 如权利要求 11所述的 LED发光灯芯， 其特征在于， 所述基板具有两个、 三个或四个固 定有所述 LED芯片的安装面。
17. 如权利要求 11至 16中任一项所述的 LED发光灯芯， 其特征在于， 所述基板为铝基线 路板； 所述基板呈长方形、 正方形、 多边形或不规则形。
PCT/CN2014/070362 2014-01-09 2014-01-09 Led灯具及发光灯芯 WO2015103753A1 (zh)

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Publication number Priority date Publication date Assignee Title
WO2008037940A1 (en) * 2006-09-26 2008-04-03 Ghollam Tahmosybayat Lamp assembly
CN201661883U (zh) * 2009-12-31 2010-12-01 深圳市泰迪伦光电科技有限公司 一种led灯泡
CN102597618A (zh) * 2009-09-10 2012-07-18 哈米什·麦克伦南 改进型发光二极管(led)组件及其制造方法
CN103267237A (zh) * 2013-05-21 2013-08-28 哈尔滨奥瑞德光电技术股份有限公司 一种led灯具结构
CN103388764A (zh) * 2013-01-09 2013-11-13 厦门立明光电有限公司 Led照明灯

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008037940A1 (en) * 2006-09-26 2008-04-03 Ghollam Tahmosybayat Lamp assembly
CN102597618A (zh) * 2009-09-10 2012-07-18 哈米什·麦克伦南 改进型发光二极管(led)组件及其制造方法
CN201661883U (zh) * 2009-12-31 2010-12-01 深圳市泰迪伦光电科技有限公司 一种led灯泡
CN103388764A (zh) * 2013-01-09 2013-11-13 厦门立明光电有限公司 Led照明灯
CN103267237A (zh) * 2013-05-21 2013-08-28 哈尔滨奥瑞德光电技术股份有限公司 一种led灯具结构

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