WO2015101015A1 - 一种微型钻头及其加工方法 - Google Patents

一种微型钻头及其加工方法 Download PDF

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Publication number
WO2015101015A1
WO2015101015A1 PCT/CN2014/082374 CN2014082374W WO2015101015A1 WO 2015101015 A1 WO2015101015 A1 WO 2015101015A1 CN 2014082374 W CN2014082374 W CN 2014082374W WO 2015101015 A1 WO2015101015 A1 WO 2015101015A1
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WO
WIPO (PCT)
Prior art keywords
groove
spiral groove
offset
spiral
drill
Prior art date
Application number
PCT/CN2014/082374
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English (en)
French (fr)
Inventor
屈建国
郭强
王磊
Original Assignee
深圳市金洲精工科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市金洲精工科技股份有限公司 filed Critical 深圳市金洲精工科技股份有限公司
Priority to US14/411,945 priority Critical patent/US9468981B2/en
Priority to JP2016556786A priority patent/JP6073538B1/ja
Priority to KR1020167018657A priority patent/KR101749606B1/ko
Publication of WO2015101015A1 publication Critical patent/WO2015101015A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B51/00—Tools for drilling machines
    • B23B51/02—Twist drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B51/00—Tools for drilling machines
    • B23B51/011—Micro drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/24—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2251/00—Details of tools for drilling machines
    • B23B2251/08—Side or plan views of cutting edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2251/00—Details of tools for drilling machines
    • B23B2251/14—Configuration of the cutting part, i.e. the main cutting edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2251/00—Details of tools for drilling machines
    • B23B2251/24—Overall form of drilling tools

Definitions

  • the present invention relates to the field of microtools, and more particularly to a micro drill bit and a method of processing the same. ⁇ Background technique ⁇
  • Micropores are one of the important components of PCB. After electroplating, micropores play the role of electrical interconnection and component support in PCB. Micropores can be divided into two categories: through holes and blind holes (see buried holes) One type of through hole is a blind hole mainly in the HDI board, and the through hole is mainly present in the single/double panel, the multilayer board, the soft board and the package substrate. In recent years, the package substrate has been developed with the advantages of multi-pin, reduced package area, improved electrical performance and heat dissipation, and high density. The high-speed development of the FC package substrate is a distinctive feature.
  • High-level MCM (multi-chip) Packages) and SIP (system package) CSP package substrates have been greatly developed and rapidly expanded, and are widely popular, especially for packaged substrate applications represented by Apple and Samsung's smartphones and tablets, in consumer electronics.
  • the field has achieved brilliant sales results.
  • the high-density multi-layer substrate technology is fully utilized, and the manufacturing cost of the package substrate is reduced.
  • the cost of the package substrate is about 40%-50% in the case of BGA, and 70%-80 in the manufacturing cost of the FC substrate. %), the main producing countries and regions have formed a situation of fierce competition.
  • Packaging substrates have become one of the important "weapons" in the development of the microelectronics industry in a country and a region.
  • the main impact of drilling on the package substrate is that the hole diameter is finer, the drilling density is higher, the hole position precision is higher, and the number of stacked plates is larger than that of the ordinary plate.
  • Chinese Patent Application: ZL200510105356 proposes a drill bit structure comprising: a first spiral groove and a second spiral groove, the first spiral groove and the second spiral groove being disposed at a non-central symmetrical position with respect to the center of rotation of the drill bit (two spiral grooves)
  • the angle of the relative rotation center is set to be greater than 40° and less than 180°
  • the length of the first spiral groove land portion is greater than the second spiral groove
  • the second spiral groove is a blind groove, that is, the second spiral groove does not extend to the drill tail.
  • the above design brings two problems: 1) The spiral groove is not centrally symmetrical with respect to the center of rotation, and the drill tip portion The center of mass is too large to deviate from the axis. When the bit is clamped on the machine at high speed, it is easy to cause excessive swing, which affects the hole position accuracy. 2)
  • the second spiral groove is shorter than the first spiral groove and is a blind groove. It gathers in the blind slot, causing dry friction and heat with the hole wall. At the same time, the first spiral groove takes up too much chip removal, and the space of the air suction in the groove on the drill bed is further reduced, thereby affecting the heat dissipation of the drill tip.
  • the technical problem to be solved by the present invention is to provide a micro drill which has good dust discharge and high hole position precision and a processing method thereof.
  • a micro drill bit comprising: a first rake face, a first flank face, a second rake face, and a second flank face disposed at a position of a drill tip; a first spiral groove extending from the drill tip toward the tail end and a second spiral groove symmetrically disposed with the first spiral groove, the first spiral groove intersecting the first rake face to form a first cutting edge, The second spiral groove intersects the second rake face to form a second cutting edge;
  • an offset groove disposed in a front end region of the drill bit, the offset groove intersecting the second rake face such that a length of the second cutting edge is smaller than a length of the first cutting edge, the offset groove Intersecting with the second spiral groove.
  • the offset groove also intersects the second flank face such that the length of the intersection of the second flank face and the drill body is smaller than the width of the cutter.
  • the area and space of the offset groove are further increased, thereby further improving the heat dissipation efficiency and the efficiency of the air suction device to absorb air.
  • the length of the intersection of the second flank face and the drill body is greater than or equal to zero.
  • the offset groove intersects with the first spiral groove, so that the ability of the dust suction device to absorb air is extended to the first spiral groove region, so that the hot air can be sucked out as soon as possible, thereby improving heat dissipation.
  • Efficiency of course, according to the specific model of the drill bit, such as the diameter, in the case of ensuring the strength of the drill tip, the length of the intersection can be adjusted correspondingly to avoid the strength of the drill tip.
  • the length of the second cutting edge is greater than or equal to zero.
  • the second cutting edge completely loses the cutting function, so that the efficiency of sucking air in the second spiral groove reaches the maximum High state, better heat dissipation efficiency.
  • the offset groove extends from the outside of the second spiral groove to the inside of the second spiral groove, and the width of the intersection area of the offset groove and the second spiral groove is smaller than the width of the second spiral groove.
  • the depth of the groove is greater than the depth of the second spiral groove. This allows the dust suction device to accelerate the air in the drill tip area and improve the heat dissipation efficiency.
  • the width of the offset groove is larger than the width of the second spiral groove and covers the second spiral groove area. Further, the dust suction device is further sucked away from the air in the drill tip area to improve the heat dissipation efficiency.
  • an angle ⁇ between an edge of the offset groove and an edge of the second spiral groove is: 180° ⁇ ⁇ >
  • the helix angle of the offset groove is the same as the helix angle of the second spiral groove.
  • this configuration ensures that the thickness of the drill core in the drill tip area is relatively uniform.
  • the helix angle of the offset groove is different from the helix angle of the second spiral groove.
  • Different processing requirements, in the case of ensuring the strength is reached, such as the hole position accuracy requirements, this structure can be used to meet the cutting accuracy requirements.
  • a method of processing a micro drill bit according to the claims comprising the steps of:
  • the present invention provides an offset groove in the front end region of the drill bit, the offset groove intersecting the second rake face such that the length of the second cutting edge is smaller than the length of the first cutting edge, the offset The groove intersects the second spiral groove. After the length of the second cutting edge is smaller than the length of the first cutting edge, the chip cutting ability of the second cutting edge is reduced or even lost, so that the chip of the second spiral groove is reduced or not, so that the dust suction device can accelerate the second spiral
  • the air in the drill tip area increases the heat dissipation efficiency.
  • the offset groove also forms a large heat dissipating surface, which improves the heat exchange efficiency between the drill tip and the air, and further improves the heat dissipation efficiency under the action of the air suction device accelerating the air.
  • FIG. 1 is a schematic structural view of a drill tip according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural view of a front end of a drill body according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural view of a front end of a drill body according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural view of a front end of a drill body according to Embodiment 1 of the present invention.
  • Figure 5 is a schematic view showing the structure of the front end of the drill body according to the first embodiment of the present invention.
  • FIG. 6 is a schematic structural view of a drill tip according to a second embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a front end of a drill body according to a second embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a drill tip according to a third embodiment of the present invention.
  • FIG. 9 is a schematic structural view of a front end of a drill body according to a third embodiment of the present invention.
  • Figure 10 is a schematic view showing the structure of a drill tip according to a fourth embodiment of the present invention.
  • Figure 11 is a schematic view showing the structure of the front end of the drill body according to the fourth embodiment of the present invention.
  • the micro drill includes: a first rake face 111, a first flank face 112, a second rake face 121, and a second set at a drill point position. a flank 122; a first spiral groove 10 extending from the drill tip toward the tail end; and a second spiral groove 20 symmetrically disposed with the first spiral groove, the first spiral groove 10 and the first front knife
  • the faces 111 intersect to form a first cutting edge 110
  • the second spiral groove 20 intersects the second rake face 121 to form a second cutting edge 120
  • an offset groove 30 disposed at a front end region of the drill bit
  • the offset groove 30 intersects the second rake face 121 such that the length of the second cutting edge 120 is smaller than the length of the first cutting edge 110, and the offset groove 30 intersects the second spiral groove 20.
  • the chipping ability of the second cutting edge 120 is reduced or even lost, so that the chips of the second spiral groove 20 are reduced or even absent, so that the suction device can accelerate the suction.
  • the air in the drill point area of the second spiral groove is taken to improve the heat dissipation efficiency.
  • the offset groove 30 also forms a large heat dissipating surface, which improves the heat exchange efficiency of the drill tip and the air, and further improves the heat dissipation efficiency under the action of the suction device accelerating the suction of air.
  • the invention also provides a processing method for the above drill bit, specifically, comprising the steps of: S1, according to the existing drill
  • the micro drill includes: a first rake face 111, a first flank face 112, a second rake face 121, and a second flank face 122 disposed at a position of the drill tip; a first spiral groove 10 extending in a direction of a drill tail and a second spiral groove 20 symmetrically disposed with the first spiral groove, the first spiral groove 10 intersecting the first rake face 111 to form a first cutting edge 110, the second spiral groove 20 intersects with the second rake face 121 to form a second cutting edge 120; and an offset groove 30 disposed at a position of a front end region of the drill bit, as shown in FIG.
  • the groove 30 intersects the second rake face 121 such that the length L1 of the second cutting edge 120 is smaller than the length L2 of the first cutting edge 110, and the offset groove 30 intersects the second spiral groove 20. .
  • the depth of the offset groove 30 is greater than the depth of the second spiral groove 20, which enlarges the offset groove space of the drill bit region, so that the dust collection efficiency is faster, and the air in the drill tip region can be exchanged more quickly.
  • the offset groove 30 also intersects the second flank 122, as shown in FIG. 3, such that the length L3 of the intersection of the second flank 122 and the drill body is smaller than the width L4 of the cutter. Thereby, the area and space of the offset groove are further increased, and the heat dissipation efficiency and the efficiency of the air suction device for sucking air are further improved.
  • the value at the intersection of this embodiment is greater than zero.
  • the value of the intersection is set according to the specific model of the drill bit. For example, the diameter of the drill can adjust the size of the intersection to ensure the strength of the drill tip is reduced.
  • the length of the second cutting edge 120 is so small that it substantially loses the cutting ability, so that the resistance of the suction device to suck air is lowered, and the efficiency of sucking air is improved, correspondingly, heat dissipation Efficiency has also improved.
  • the angle c between the edge of the offset groove 30 and the edge of the second spiral groove 20 is: 180° ⁇ ⁇ > 90°.
  • the length of the second cutting edge 120 is greater than or equal to zero. When the length of the second cutting edge 120 is equal to zero, the second cutting edge 120 completely loses the cutting function, so that the efficiency of the second spiral groove absorbs air. It reaches the highest state and has better heat dissipation efficiency.
  • the difference from the first embodiment is that the length of the intersection of the second flank 122 and the drill body in the first embodiment is less than zero; such a result results in the offset groove 30.
  • the first spiral groove 10 is intersected with each other, so that the ability of the dust suction device to absorb air is expanded to the first spiral groove 10 region, so that the hot air can be sucked out as soon as possible, thereby improving heat dissipation efficiency.
  • the spiral angle of the offset groove 30 is different from the spiral angle of the second spiral groove. This is because the requirements for the strength of the drill bit and the accuracy of the hole position are different for different processing requirements, and therefore, the helix angle of the offset groove 30 can be selected as needed.
  • the difference from the second embodiment is that, in the embodiment, the first spiral groove 10 and the second spiral groove 20 are symmetrically disposed, and the offset groove 30 is extended from the outside of the second spiral groove.
  • the width of the intersection of the offset groove 30 and the second spiral groove 20 is smaller than the width of the second spiral groove 20, and the depth of the offset groove 30 is greater than the depth of the second spiral groove 20;
  • This arrangement allows the dust suction device to accelerate the absorption of air from the drill tip area, further improving heat dissipation efficiency.
  • the helix angle of the offset groove 30 is the same as the helix angle of the second spiral groove 20. According to the strength requirement of the structure of the drill body, the structure can ensure that the thickness of the drill core in the drill bit area is relatively uniform, thereby increasing the strength relatively. .
  • the length of the intersection of the second flank 122 and the drill body is very small, close to zero.
  • the area of the offset groove 30 is reached. Maximize, heat dissipation area and suction efficiency can be higher.
  • the width of the offset groove 30 is larger than the width of the second spiral groove 20 and covers the area of the second spiral groove 20.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drilling Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

一种微型钻头，包括：设置在钻尖位置的第一前刀面、第一后刀面、第二前刀面、第二后刀面；由钻尖向钻尾方向延伸的第一螺旋槽以及与所述第一螺旋槽对称设置的第二螺旋槽，所述第一螺旋槽与所述第一前刀面相交形成第一切削刃，所述第二螺旋槽与所述第二前刀面相交形成第二切削刃；以及一设置在钻头的大头区域位置的偏置槽，该偏置槽与所述第二前刀面相交，使所述第二切削刃的长度小于所述第一切削刃的长度，该偏置槽与所述第二螺旋槽相交。

Description

一种徴型钻头及其加工方法
【技术领域】
本发明涉及微型刀具领域，更具体的说，涉及一种微型钻头及其加工方法。 【背景技术】
微孔是 PCB的重要组成部分之一，经电镀以后的微孔在 PCB中起着电气互 连和元件的支撑作用 ，微孔可分为两大类：通孔和盲孔（埋孔可看成通孔的一 种）b 盲孔主要存在于 HDI板中 ，通孔主要存在于单 /双面板、 多层板、 软板和 封装基板中。 近年来，封装基板凭借可实现多引脚化、 縮小封装产品面积、 改 善电性能及散热性、 实现高密度化等突出优点，以 FC封装基板高速发展为鲜明 特点，高水平的 MCM (多芯片封装)和 SIP (系统封装)用 CSP封装基板得到较大 发展并迅速扩大，广为流行，特别是以苹果、 三星公司生产的智能手机、 平板 电脑为代表的封装基板应用 ，在消费性电子产品领域取得了辉煌的销售业绩。 在 IC封装中充分运用高密度多层基板技术方面，以及降低封装基板的制造成本 方面 (封装基板成本以 BGA为例约占 40%-50% ,在 FC基板制造成本方面约占 70%-80%) ,主要生产国家、 地区形成了激烈竞争的局面。 封装基板已成为一个 国家、 一个地区在发展微电子产业中的重要"武器" 之一。
封装基板较普通板材机械钻孔加工孔径更微细、 钻孔密度更高、 孔位精度 要求更高、 叠板数更多，这对钻孔带来的主要影响是：
1) 由于排尘不良、 钻尖过度发热， 引起断刀。 2) 孔位精度不良。
中国专利申请： ZL200510105356提出一种钻头结构，其包括：第一螺旋槽 和第二螺旋槽，该第一螺旋槽和第二螺旋槽被设置在相对于钻头旋转中心非中 心对称位置（两螺旋槽相对旋转中心夹角设定为大于 40°小于 180° ) ,第一螺旋 槽刃带部长度大于第二螺旋槽，且第二螺旋槽为盲槽，即第二螺旋槽没有延伸 至钻尾。
上述设计带来两个问题： 1 )螺旋槽相对于旋转中心非中心对称，钻尖部分 质心偏离轴线过大，钻头夹持在机床上高速旋转时容易造成过大摆动 ，从而影 响孔位精度进一步提高， 2 )第二螺旋槽槽长短于第一螺旋槽，且为盲槽，切屑 容易聚集在盲槽内 ，造成与孔壁干摩擦发热，第一螺旋槽承担过多排屑的同时， 钻床上的吸尘器吸走槽内空气的空间进一步减小，从而影响钻尖散热。
【发明内容】
本发明所要解决的技术问题是提供一种、 排尘良好，孔位精度高的微型钻 头及其加工方法。
本发明的目的是通过以下技术方案来实现的： 一种微型钻头，包括： 设置在钻尖位置的第一前刀面、 第一后刀面、 第二前刀面、 第二后刀面； 由钻尖向钻尾方向延伸的第一螺旋槽以及与所述第一螺旋槽对称设置的第 二螺旋槽，所述第一螺旋槽与所述第一前刀面相交形成第一切削刃 ，所述第二 螺旋槽与所述第二前刀面相交形成第二切削刃 ；
以及一设置在钻头的前端区域的偏置槽，该偏置槽与所述第二前刀面相交， 使所述第二切削刃的长度小于所述第一切削刃的长度，该偏置槽与所述第二螺 旋槽相交。
优选的 ，所述偏置槽还与所述第二后刀面相交，使所述第二后刀面与钻身 的相交处的长度小于刀具的幅宽。 进一步加大偏置槽的面积及空间 ，从而进一 步提高散热效率，以及吸尘装置吸取空气的效率。
优选的 ，所述第二后刀面与钻身的相交处的长度大于等于零。 当相交处为 零时，即偏置槽与第一螺旋槽产生了相交，这样，吸尘装置吸取空气的能力扩 展到第一螺旋槽区域，从而使热空气能够尽快的被吸取出去，提高散热效率， 当然，根据钻头的具体型号，如直径大小，在确保钻尖强度的情况下，可以对 应的调整该相交处的长度，避免钻尖强度降低。
优选的 ，所述第二切削刃的长度大于等于零。 当第二切削刃的长度等于零 时，第二切削刃完全丧失切削功能，从而第二螺旋槽的吸取空气的效率达到最 高状态，散热效率更好。
优选的 ，所述偏置槽由所述第二螺旋槽的外部延伸至该第二螺旋槽的内部， 偏置槽与第二螺旋槽的相交区域的宽度小于该第二螺旋槽的宽度，偏置槽的深 度大于第二螺旋槽的深度。 这样可以使吸尘装置加速吸走钻尖区域的空气，提 高散热效率。
优选的 ，所述偏置槽的宽度大于所述第二螺旋槽的宽度，并且覆盖第二螺 旋槽区域。 进一步提高吸尘装置吸走钻尖区域的空气，提高散热效率。
优选的 ，所述偏置槽的边缘与所述第二螺旋槽的边缘的夹角 α为 ： 180°≥α >
90°。
优选的 ，所述偏置槽的螺旋角与所述第二螺旋槽的螺旋角相同。 根据钻身 的结构强度需求，此种结构可以确保钻尖区域钻芯的厚度相对一致。
优选的 ，所述偏置槽的螺旋角与所述第二螺旋槽的螺旋角不同。 不同的加 工需求，在保证强度达到的情况下，如孔位精度要求不同的情况下，可采用该 种结构，以满足切削精度的要求。
一种如权利要求上所述的微型钻头的加工方法，包括步骤：
51、 磨削钻尖结构、 第一螺旋槽以及第二螺旋槽；
52、 磨削偏置槽。
本发明由于在钻头的前端区域设置了偏置槽，该偏置槽与所述第二前刀面 相交，使所述第二切削刃的长度小于所述第一切削刃的长度，该偏置槽与所述 第二螺旋槽相交。 第二切削刃的长度小于第一切削刃的长度后，第二切削刃的 切屑能力降低甚至丧失，使得第二螺旋槽的切屑减少甚至没有，这样，吸尘装 置可以加速的吸走第二螺旋槽钻尖区域的空气，从而提高散热效率。 同时，偏 置槽也形成了一个较大的散热面，提高钻尖与空气的换热效率，在吸尘装置加 速吸取空气的作用下，使得散热效率得以进一步提高。
【附图说明】 图 1是本发明实施例一的钻尖结构示意图 ，
图 2是本发明实施例一的钻身前端结构示意图 ，
图 3是本发明实施例一的钻身前端结构示意图 ，
图 4是本发明实施例一的钻身前端结构示意图 ，
图 5是本发明实施例一的钻身前端结构示意图 ，
图 6是本发明实施例二的钻尖结构示意图 ，
图 7是本发明实施例二的钻身前端结构示意图 ，
图 8是本发明实施例三的钻尖结构示意图 ，
图 9是本发明实施例三的钻身前端结构示意图 ，
图 10是本发明实施例四的钻尖结构示意图 ，
图 11是本发明实施例四的钻身前端结构示意图。
【具体实施方式】
如图 1-10所述为本发明提供的几个实施例，微型钻头包括：设置在钻尖位置 的第一前刀面 111、 第一后刀面 112、 第二前刀面 121、 第二后刀面 122；由钻尖 向钻尾方向延伸的第一螺旋槽 10以及与所述第一螺旋槽对称设置的第二螺旋槽 20 ,所述第一螺旋槽 10与所述第一前刀面 111相交形成第一切削刃 110 ,所述 第二螺旋槽 20与所述第二前刀面 121相交形成第二切削刃 120；以及一设置在 钻头的前端区域位置的偏置槽 30 ,该偏置槽 30与所述第二前刀面 121相交，使 所述第二切削刃 120的长度小于所述第一切削刃 110的长度，该偏置槽 30与所 述第二螺旋槽 20相交。 第二切削刃 120的长度小于第一切削刃 110的长度后， 第二切削刃 120的切屑能力降低甚至丧失，使得第二螺旋槽 20的切屑减少甚至 没有，这样，吸尘装置可以加速的吸走第二螺旋槽钻尖区域的空气，从而提高 散热效率。 同时，偏置槽 30也形成了一个较大的散热面，提高钻尖与空气的换 热效率，在吸尘装置加速吸取空气的作用下，使得散热效率得以进一步提高。
本发明同时提供上述钻头的加工方法，具体的，包括步骤： S1 ,按照现有钻 头的结构，磨出钻尖的结构（包括第一前刀面 111、 第一后刀面 112、 第二前刀 面 121、 第二后刀面 122 )以及第一螺旋槽以及第二螺旋槽； S2 ,在 S1基础上， 磨出偏置槽。
下面结合附图和较佳的实施例对本发明作进一步说明。
实施例一
如图 1至图 3所示，微型钻头包括：设置在钻尖位置的第一前刀面 111、 第 一后刀面 112、 第二前刀面 121、 第二后刀面 122； 由钻尖向钻尾方向延伸的第 一螺旋槽 10以及与所述第一螺旋槽对称设置的第二螺旋槽 20，所述第一螺旋槽 10与所述第一前刀面 111相交形成第一切削刃 110 ,所述第二螺旋槽 20与所述 第二前刀面 121相交形成第二切削刃 120；以及一设置在钻头的前端区域位置的 偏置槽 30 ,如图 5所示，该偏置槽 30与所述第二前刀面 121相交，使所述第二 切削刃 120的长度 L1小于所述第一切削刃 110的长度 L2 ,该偏置槽 30与所述 第二螺旋槽 20相交。 偏置槽 30的深度是大于第二螺旋槽 20的深度的，这样可 以扩大钻头区域的偏置槽空间 ，使得吸尘效率更快，钻尖区域的空气能够更快 的被换出。
在本实施例中 ，偏置槽 30还与第二后刀面 122相交，如图 3所示，这样使 得第二后刀面 122与钻身的相交处的长度 L3小于刀具的幅宽 L4 ,从而进一步 加大偏置槽的面积和空间 ，进一步提高散热效率以及吸尘装置吸取空气的效率。 本实施例相交处的值大于零，具体相交处的值根据钻头的具体型号设置，如直 径大小，在确保钻尖强度的前提下，可对应的调整相交处的大小，避免钻尖强 度降低。
在本实施例中所述第二切削刃 120的长度非常的小，以至于其基本上丧失了 切削能力 ，这样，吸尘装置吸取空气的阻力降低，吸取空气的效率得以提高， 相应的，散热效率也得以提高。
本实施例中 ，如图 4所示，所述偏置槽 30的边缘与第二螺旋槽 20的边缘的 夹角 c (为 ： 180°≥α > 90°。 在本实施例中 ，所述第二切削刃 120的长度大于等于零的，当第二切削刃 120 的长度等于零时，第二切削刃 120完全丧失切削功能，从而第二螺旋槽的吸取 空气的效率达到最高状态，散热效率更好。
实施例二
如图 6至图 7所示，与实施例一的不同之处在于，实施例一中的第二后刀面 122与钻身的相交处的长度小于零；这样的结果造成了偏置槽 30与第一螺旋槽 10相交，这样，吸尘装置吸取空气的能力扩展到第一螺旋槽 10区域，从而使热 空气能够尽快的被吸取出去，提高散热效率。
作为本实施例的一种设计结构，所述偏置槽 30的螺旋角与第二螺旋槽的螺 旋角不同。 这是因为不同的加工需求，对于钻头强度、 孔位精度的要求不同 ， 因此，可根据需要选择偏置槽 30的螺旋角。
实施例三
如图 8至 9所示，与实施例二的不同之处在于，在本实施例中 ，第一螺旋槽 10和第二螺旋槽 20对称设置，偏置槽 30由第二螺旋槽的外部延伸至该第二螺 旋槽 20的内部，偏置槽 30与第二螺旋槽 20的相交区域的宽度小于该第二螺旋 槽 20的宽度，偏置槽 30的深度大于第二螺旋槽 20的深度；这样设置可以使吸 尘装置加速吸走钻尖区域的空气，进一步提高散热效率。 而且偏置槽 30的螺旋 角与第二螺旋槽 20的螺旋角相同，根据钻身的结构的强度需求，此种结构可以 确保钻尖区域钻芯的厚度相对一致，从而相对的增大其强度。
实施例四
如图 10至 11所示，本实施例中 ，所述第二后刀面 122与钻身的相交处的长 度非常的小，接近于零，这种结构下，偏置槽 30的面积空间达到最大化，散热 面积及吸气效率可以更高。 在本实施例中 ，所述偏置槽 30的宽度大于所述第二 螺旋槽 20的宽度，并且覆盖第二螺旋槽 20区域。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明 ，不能 认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通技 术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换， 都应当视为属于本发明的保护范围。

Claims

权 利 要 求
1、 一种微型钻头，包括：
设置在钻尖位置的第一前刀面、 第一后刀面、 第二前刀面、 第二后刀面； 由钻尖向钻尾方向延伸的第一螺旋槽以及与所述第一螺旋槽对称设置的第 二螺旋槽，所述第一螺旋槽与所述第一前刀面相交形成第一切削刃 ，所述第二 螺旋槽与所述第二前刀面相交形成第二切削刃 ；
以及一设置在微型钻头的前端区域的偏置槽，该偏置槽与所述第二前刀面 相交，使所述第二切削刃的长度小于所述第一切削刃的长度，该偏置槽与所述 第二螺旋槽相交。
2、 如权利要求 1所述的微型钻头，其中 ，所述偏置槽还与所述第二后刀面 相交，使所述第二后刀面与钻身的相交处的长度小于刀具的幅宽。
3、 如权利要求 2所述的微型钻头，其中 ，所述第二后刀面与钻身的相交处 的长度大于等于零。
4、 如权利要求 1所述的微型钻头，其中 ，所述第二切削刃的长度大于等于 零。
5、 如权利要求 1所述的微型钻头，其中 ，所述偏置槽由所述第二螺旋槽的 外部延伸至该第二螺旋槽的内部，偏置槽与第二螺旋槽的相交区域的宽度小于 该第二螺旋槽的宽度，偏置槽的深度大于第二螺旋槽的深度。
6、 如权利要求 1所述的微型钻头，其中 ，所述偏置槽的宽度大于所述第二 螺旋槽的宽度，并且覆盖第二螺旋槽区域。
7、 如权利要求 1所述的微型钻头，其中 ，所述偏置槽的边缘与所述第二螺 旋槽的边缘的夹角 C (为 ： 180°≥α > 90°。
8、 如权利要求 1所述的微型钻头，其中 ，所述偏置槽的螺旋角与所述第二 螺旋槽的螺旋角相同。
9、 如权利要求 1所述的微型钻头，其中 ，所述偏置槽的螺旋角与所述第二 螺旋槽的螺旋角不同。
10、 一种微型钻头的加工方法，包括步骤：
51、 磨削钻尖结构、 第一螺旋槽以及第二螺旋槽；
52、 磨削偏置槽。
PCT/CN2014/082374 2013-12-31 2014-07-17 一种微型钻头及其加工方法 WO2015101015A1 (zh)

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