WO2015100790A1 - 基板加热装置和方法 - Google Patents

基板加热装置和方法 Download PDF

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Publication number
WO2015100790A1
WO2015100790A1 PCT/CN2014/070503 CN2014070503W WO2015100790A1 WO 2015100790 A1 WO2015100790 A1 WO 2015100790A1 CN 2014070503 W CN2014070503 W CN 2014070503W WO 2015100790 A1 WO2015100790 A1 WO 2015100790A1
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Prior art keywords
substrate
heating
temperature
controller
rotation
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Ceased
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PCT/CN2014/070503
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English (en)
French (fr)
Inventor
覃事建
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/235,797 priority Critical patent/US20150226487A1/en
Publication of WO2015100790A1 publication Critical patent/WO2015100790A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories or equipment specially adapted for furnaces of these types
    • F27B9/36—Arrangements of heating devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories or equipment specially adapted for furnaces of these types
    • F27B9/40—Arrangements of controlling or monitoring devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00—Arrangement of elements for electric heating in or on furnaces
    • F27D11/02—Ohmic resistance heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00—Arrangement of elements for electric heating in or on furnaces
    • F27D11/12—Arrangement of elements for electric heating in or on furnaces with electromagnetic fields acting directly on the material being heated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangement of monitoring devices; Arrangement of safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0003—Monitoring the temperature or a characteristic of the charge and using it as a controlling value
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangement of monitoring devices; Arrangement of safety devices
    • F27D21/0014—Devices for monitoring temperature

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular, to a heating device and method.
  • the different hot spots of the substrate are heated by heaters disposed in different regions of the heating furnace, and the heating of the substrate is controlled by independently controlling the power of each heater.
  • the uniformity of temperature achieves the effect of making the temperature of each region of the substrate substantially uniform.
  • this method of controlling the temperature uniformity of the substrate only by the heater can only make the temperature of each region of the substrate substantially uniform, and can not achieve the effect of accurately controlling the uniformity of the substrate temperature.
  • a primary object of the present invention is to provide a heating apparatus and method for precisely controlling the uniformity of substrate temperature to achieve uniform temperature in various regions of the substrate.
  • the present invention provides a substrate heating apparatus including a heating furnace, a platform placed in the heating furnace, and a substrate to be heated placed on the platform, and disposed above the substrate for heating the substrate a plurality of spaced heaters, further comprising a reflective sheet respectively fixed to the plurality of heaters, and a rotation controller fixed on an inner surface of the furnace wall of the heating furnace for controlling the rotation of the reflector .
  • the substrate heating device further comprises a plurality of temperature measuring controllers disposed outside the furnace wall of the heating furnace, wherein the temperature measuring controller is configured to measure heating temperatures of the plurality of heaters on the substrate by the hot spot,
  • the temperature measuring controller is connected to the substrate through a temperature measuring line.
  • a plurality of said heaters are equally spaced.
  • the platform is provided with support legs for positioning the substrate within the heating zone of the heater.
  • the substrate heating device further comprises a plurality of temperature measuring controllers disposed outside the furnace wall of the heating furnace, wherein the temperature measuring controller is configured to measure heating temperatures of the plurality of heaters on the substrate by the hot spot,
  • the temperature measuring controller is connected to the substrate through a temperature measuring line.
  • the rotation controller is connected to the corresponding temperature measurement controller by rotating the control line, and controls the rotation angle of the corresponding reflection sheet according to the control signal sent by the temperature measurement controller.
  • a plurality of said heaters are equally spaced.
  • the invention further provides a substrate heating method comprising the following steps:
  • the heater heats the substrate placed on the platform
  • the temperature measuring controller measures the heating temperature of the corresponding heater on the substrate by the hot spot, obtains the temperature uniformity of the substrate according to the heating temperature, generates a control signal according to the temperature uniformity, and feeds back to the rotation controller;
  • the rotation controller controls the reflection piece to rotate a corresponding angle according to the control signal to adjust the temperature uniformity of the substrate.
  • the temperature measuring controller measures a heating temperature of the corresponding heater on the substrate by the hot spot, obtains temperature uniformity of the substrate according to the heating temperature, generates a control signal according to the temperature uniformity, and feeds back to the rotation control
  • the steps of the device include:
  • the temperature measuring controller measures the heating temperature of the corresponding heater on the substrate by the temperature measuring line, and converts the heating temperature into a corresponding electrical signal;
  • the generated control signal is fed back to the rotation controller by rotating the control line.
  • the method further comprises the steps of:
  • the reflective sheet rotates by a corresponding angle according to the control of the rotation controller, and reflects heat emitted from the heater to a corresponding position on the substrate to adjust temperature uniformity of the substrate.
  • the method further comprises the steps of:
  • the reflective sheet rotates by a corresponding angle according to the control of the rotation controller, and reflects heat emitted from the heater to a corresponding position on the substrate to adjust temperature uniformity of the substrate.
  • the method further comprises the steps of:
  • the substrate is placed on a platform, and the substrate is positioned within a heated area of the heater by a support leg provided on the platform.
  • the method further comprises the steps of:
  • the substrate is placed on a platform, and the substrate is positioned within a heated area of the heater by a support leg provided on the platform.
  • the present invention fixes a reflection sheet for reflecting heat generated above the heater to a corresponding position on the substrate over a plurality of heaters, and a rotation controller for controlling rotation of the reflection sheet on the inner side of the furnace wall of the heating furnace
  • the temperature measuring controller After detecting the heating temperature of the hot spot of each heater on the substrate by the temperature measuring controller, calculating the temperature uniformity of the substrate, the temperature measuring controller generates a control signal according to the temperature uniformity and feeds back to the rotation controller, and rotates The controller controls the rotation angle of the reflection sheet according to the control signal to make the temperature of each area on the substrate uniform, thereby achieving precise control of the uniformity of the substrate temperature.
  • FIG. 1 is a schematic flow chart of an embodiment of a substrate heating apparatus of the present invention
  • FIG. 2 is a schematic flow chart of a first embodiment of a substrate heating method according to the present invention.
  • FIG. 3 is a schematic flow chart of a feedback control signal of a temperature measuring controller to a rotation controller in a substrate heating method of the present invention
  • FIG. 5 is a schematic flow chart of a third embodiment of a method for heating a substrate according to the present invention.
  • the invention provides a substrate heating device.
  • FIG. 1 is a schematic flow chart of an embodiment of a substrate heating apparatus according to the present invention.
  • the substrate heating apparatus includes a heating furnace 10, a stage 20, and a substrate 30 to be heated, and a plurality of heaters 40.
  • the substrate 30 is placed on the platform 20, and the platform 20 and the substrate 30 are placed in the heating furnace 10.
  • a plurality of heaters 40 are disposed in the heating furnace 10 at intervals, and are located above the substrate 30, through the plurality of heaters.
  • the pair of substrates 30 are heated, and the distance between the heaters 40 can be set to be equally spaced according to actual needs, or can be set to be non-equal spacing, so that the heating region range of the plurality of heaters 40 can cover the entire surface of the substrate 30.
  • the platform 20 is provided with a support leg (not shown).
  • the substrate heating apparatus further includes a reflection sheet 50 and a rotation controller 60, the number of the reflection sheets 50 corresponding to the number of the heaters 40, and respectively fixed above the plurality of heaters 40 for the heaters
  • the heat generated above 40 is reflected to a corresponding position on the substrate 30; the rotation controller 60 is fixed on the inner side of the furnace wall of the heating furnace 10 for controlling the rotation of the reflection sheet 50.
  • the substrate heating device further includes a temperature measuring controller 70.
  • the number of the temperature measuring controllers 70 corresponds to the number of the heaters 40.
  • the temperature measuring controller 70 is disposed outside the furnace wall of the heating furnace 10, respectively.
  • Each of the heaters 70 is used to measure the heating temperature of the hot spot of each heater 40 on the substrate 30 through the temperature measuring line 71, and each of the temperature measuring controllers 70 is used to measure the heating temperature of the hot spot on the substrate 30 of the heater 40 corresponding thereto.
  • the control signal is fed back to the rotation controller 60 according to the calculated temperature uniformity, the control signal is used to indicate the angle at which the reflection sheet 50 needs to be rotated; the rotation controller 60 is connected to the corresponding temperature measurement controller 70 through the rotation control line 61, After receiving the control signal sent by the temperature measuring controller 70, the rotation angle of the corresponding reflection sheet 50 is controlled based on the control signal.
  • the substrate 30 to be heated opposed to the platform 20 is heated, first, heating is performed by a plurality of heaters 40 disposed above the substrate 30, and the temperature measuring line 70 is connected to the substrate 30, and the temperature measuring controller 70 is connected.
  • the heating temperature of the hot spot on each of the heaters 40 on the substrate 30 is detected, and the measured heating temperature is output to a computing device for the computing device to calculate the temperature uniformity of the substrate 30 based on the heating temperature.
  • the computing device calculates the temperature uniformity
  • the calculated result is sent to the corresponding temperature measuring controller 70, and after receiving the temperature uniformity, the temperature measuring controller 70 generates a control signal for controlling the rotation controller 60.
  • This embodiment fixes the reflection sheet 50 for reflecting the heat generated above the heater 40 to the corresponding position on the substrate 30 over the plurality of heaters 40, and fixes the inside of the furnace wall of the heating furnace 10 for controlling the reflection.
  • the rotation controller 60 of the sheet 50 rotates, after detecting the heating temperature of the hot spot of each heater 40 on the substrate 30 by the temperature measuring controller 70, calculates the temperature uniformity of the substrate 30, and the temperature measuring controller 70 according to the The temperature uniformity generation control signal is fed back to the rotation controller 60, and the rotation controller 60 controls the rotation angle of the reflection sheet 50 according to the control signal to make the temperature of each region on the substrate 30 uniform, thereby achieving precise control of the temperature of the substrate 30. Uniformity.
  • the invention also provides a substrate heating method.
  • FIG. 2 is a schematic flow chart of a first embodiment of a substrate heating method according to the present invention.
  • the substrate heating method comprises:
  • heating is performed by a plurality of heaters 40 disposed above the substrate 30.
  • a plurality of heaters 40 are disposed in the heating furnace 10 at intervals, and are located above the substrate 30.
  • the plurality of heaters 40 are used to heat the substrate 30.
  • the distance between the heaters 40 can be set according to actual needs.
  • the equal spacing can also be set to be non-equal spacing, ensuring that the range of heating regions through the plurality of heaters 40 can cover the entire surface of the substrate 30.
  • Step S20 the temperature measuring controller measures the heating temperature of the corresponding heater on the substrate by the hot spot, obtains the temperature uniformity of the substrate according to the heating temperature, generates a control signal according to the temperature uniformity, and feeds back to the rotation controller;
  • the temperature measuring controller 70 detects the heating temperature of the hot spot of each heater 40 on the substrate 30, when the temperature measuring controller After the temperature uniformity is obtained according to the heating temperature, a control signal for controlling the rotation controller 60 is generated based on the temperature uniformity and fed back to the rotation controller 60 for the rotation controller 60 to control the reflection sheet 50 according to the control signal.
  • the angle of rotation In this embodiment, the number of the temperature measuring controllers 70 corresponds to the number of the heaters 40, and the temperature measuring controller 70 is disposed outside the furnace wall of the heating furnace 10, and is connected to the substrate 30 through the temperature measuring line 71 for each heating.
  • the device 40 heats the area of the hot spot.
  • FIG. 3 is a schematic flow chart of the feedback control signal of the temperature measuring controller to the rotation controller in the substrate heating method of the present invention.
  • step S20 specifically includes:
  • Step S21 the temperature measuring controller measures the heating temperature of the corresponding heater on the substrate by the temperature measuring line, and converts the heating temperature into a corresponding electrical signal;
  • the heating temperature of each heater 40 on the substrate 30 is detected by the temperature measuring controller 70, and the heating temperature is converted into a corresponding electrical signal to output the heating temperature in the form of an electrical signal for
  • the computing device for calculating the temperature uniformity in the embodiment, the computing device may be a computer or a computer connected to the plurality of temperature measuring controllers 70 and communicable with each other.
  • Step S22 outputting the converted heating temperature, and receiving the temperature uniformity of the substrate calculated according to the heating thermometer, and generating a control signal for controlling the rotation of the reflective sheet according to the temperature uniformity;
  • step S23 the generated control signal is fed back to the rotation controller by rotating the control line.
  • the temperature measuring controller 70 outputs the electrical signal converted into the heating temperature to the computing device, and the computing device calculates the temperature uniformity of the substrate 30 according to the heating temperature, and sends the temperature uniformity to the corresponding temperature measuring controller 70 after the computer calculates the temperature uniformity.
  • the temperature controller 70 receives the temperature uniformity of the substrate 30, a control signal for controlling the rotation of the reflection sheet 50 is generated according to the temperature uniformity, and the generated control signal is fed back to the rotation control by the rotation control line 61.
  • the controller 60 is used to rotate the controller 60 to reflect the angle at which the sheet 50 needs to be rotated.
  • step S30 the rotation controller controls the reflection piece to rotate according to the control signal to adjust the temperature uniformity of the substrate.
  • the rotation controller 60 After the rotation controller 60 receives the control signal sent by the temperature measurement controller 70, the rotation angle of the corresponding reflection sheet 50 is controlled according to the control signal to reflect the heat generated by the corresponding heater 40 through the reflection sheet 50 to make the substrate
  • the lower temperature position on 30 is supplemented to make the temperature of the substrate 30 more uniform.
  • This embodiment fixes the reflection sheet 50 for reflecting the heat generated above the heater 40 to the corresponding position on the substrate 30 over the plurality of heaters 40, and fixes the inside of the furnace wall of the heating furnace 10 for controlling the reflection.
  • the rotation controller 60 of the sheet 50 rotates, after detecting the heating temperature of the hot spot of each heater 40 on the substrate 30 by the temperature measuring controller 70, calculates the temperature uniformity of the substrate 30, and the temperature measuring controller 70 according to the The temperature uniformity generation control signal is fed back to the rotation controller 60, and the rotation controller 60 controls the rotation angle of the reflection sheet 50 according to the control signal to make the temperature of each region on the substrate 30 uniform, thereby achieving precise control of the temperature of the substrate 30. Uniformity.
  • FIG. 4 is a schematic flow chart of a second embodiment of a substrate heating method according to the present invention.
  • the method further includes:
  • step S40 the reflection sheet rotates the corresponding angle according to the control of the rotation controller, and the heat emitted from the heater is reflected to the corresponding position on the substrate to adjust the temperature uniformity of the substrate.
  • FIG. 5 is a schematic flow chart of a third embodiment of a substrate heating method according to the present invention.
  • the method before performing step S10, the method further includes:
  • step S50 the substrate is placed on the platform, and the substrate is positioned within the heating region of the heater through the support legs provided on the platform.
  • the substrate 30 before the substrate 30 is heated by the heater 40, the substrate 30 is first placed on the platform 20, and the substrate 30 is positioned by the support legs disposed on the platform 20, that is, the substrate 30 is fixed to the heating.
  • the mounting of the substrate 30 is more robust within the heated area of the device 40.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Furnace Details (AREA)
  • Resistance Heating (AREA)

Abstract

一种基板加热装置及基板加热方法，该装置包括加热炉（10）、置放在该加热炉（10）中的平台（20）和置放在平台（20）上待加热的基板（30），以及设置在基板（30）上方用于加热基板（30）的多个间隔设置的加热器（40），还包括分别固定在多个加热器上方反射片（50），以及固定在加热炉（10）的炉壁的内表面上用于控制反射片转动的转动控制器（60）。该方案使基板（20）上各区域的温度达到均匀，从而实现了精确控制基板温度的均匀性。

Description

基板加热装置和方法
技术领域
　　　本发明涉及液晶显示技术领域，尤其涉及一种加热装置和方法。
　　　背景技术
　　　目前，通过大世代高温炉对基板进行加热时，通过设置在加热炉内不同区域的加热器对基板的不同受热点进行加热，并通过对每个加热器的功率进行独立控制，以调整基板加热温度的均匀性，达到使基板各区域温度基本均匀的效果。但是，这种只通过加热器对基板温度均匀性进行控制的方法，只能使基板各区域的温度基本均匀，而不能达到对基板温度均匀性进行精确控制的效果。
　　　上述内容仅用于辅助理解本发明的技术方案，并不代表承认上述内容是现有技术。
发明内容
　　　本发明的主要目的在于提供加热装置和方法，旨在精确控制基板温度的均匀性，使基板各区域温度达到均匀。
　　　为实现上述目的，本发明提供的一种基板加热装置，包括加热炉、置放在该加热炉中的平台和置放在平台上待加热的基板，以及设置在所述基板上方用于加热基板的多个间隔设置的加热器，还包括分别固定在多个所述加热器上方反射片，以及固定在所述加热炉的炉壁的内表面上用于控制所述反射片转动的转动控制器。
　　　优选地，基板加热装置还包括设置在所述加热炉的炉壁外侧的多个测温控制器，该测温控制器用于测量多个所述加热器在基板上的受热点的加热温度，所述测温控制器通过测温线与所述基板连接。
　　　优选地，所述转动控制器通过转动控制线与对应的测温控制器连接，根据所述测温控制器发送的控制信号控制对应的反射片的转动角度。
　　　优选地，多个所述加热器等间距设置。
　　　优选地，所述平台上设置有用于将所述基板定位在所述加热器的加热区域范围内的支撑脚。
　　　优选地，基板加热装置还包括设置在所述加热炉的炉壁外侧的多个测温控制器，该测温控制器用于测量多个所述加热器在基板上的受热点的加热温度，所述测温控制器通过测温线与所述基板连接。
　　　优选地，所述转动控制器通过转动控制线与对应的测温控制器连接，根据所述测温控制器发送的控制信号控制对应的反射片的转动角度。
　　　优选地，多个所述加热器等间距设置。　　　
　　　本发明进一步提供一种基板加热方法，包括以下步骤：
　　　加热器对置放在平台上的基板进行加热；
　　　测温控制器测量对应的加热器在基板上的受热点的加热温度，根据该加热温度得到基板的温度均匀性，根据所述温度均匀性生成控制信号，并反馈至转动控制器；
　　　转动控制器根据所述控制信号控制反射片转动相应的角度，以调整所述基板的温度均匀性。
　　　优选地，所述测温控制器测量对应的加热器在基板上的受热点的加热温度，根据该加热温度得到基板的温度均匀性，根据所述温度均匀性生成控制信号，并反馈至转动控制器的步骤包括：
　　　测温控制器通过测温线测量对应的加热器在基板上的受热点的加热温度，将该加热温度转换成相应的电信号；
　　　将转换后的所述加热温度输出，并接收根据所述加热温度计算出的基板的温度均匀性，根据该温度均匀性生成控制所述反射片转动的控制信号；
　　　通过转动控制线将生成的所述控制信号反馈至所述转动控制器。
　　　优选地，在所述转动控制器根据所述控制信号控制反射片转动相应的角度的步骤之后，还包括步骤：
　　　反射片根据所述转动控制器的控制，转动相应的角度，将所述加热器的上方发出的热量反射至所述基板上相应的位置，调整所述基板的温度均匀性。
　　　优选地，在所述加热器对置放在平台上的基板进行加热的步骤之前，还包括步骤：
　　　将基板置放在平台上，通过所述平台上设置的支撑脚将所述基板定位在所述加热器的加热区域范围内。
优选地，在所述转动控制器根据所述控制信号控制反射片转动相应的角度的步骤之后，还包括步骤：
反射片根据所述转动控制器的控制，转动相应的角度，将所述加热器的上方发出的热量反射至所述基板上相应的位置，调整所述基板的温度均匀性。
优选地，在所述加热器对置放在平台上的基板进行加热的步骤之前，还包括步骤：
将基板置放在平台上，通过所述平台上设置的支撑脚将所述基板定位在所述加热器的加热区域范围内。
　　　优选地，在所述加热器对置放在平台上的基板进行加热的步骤之前，还包括步骤：
　　　将基板置放在平台上，通过所述平台上设置的支撑脚将所述基板定位在所述加热器的加热区域范围内。　　　
　　　本发明通过在多个加热器上方固定用于将加热器上方产生的热量反射至基板上相应的位置的反射片，以及在加热炉的炉壁内侧上固定用于控制反射片转动的转动控制器，当通过测温控制器检测到每个加热器在基板上的受热点的加热温度后，计算基板的温度均匀性，测温控制器根据该温度均匀性产生控制信号反馈至转动控制器，转动控制器根据该控制信号控制反射片的转动角度，以使基板上各区域的温度达到均匀，从而实现了精确控制基板温度的均匀性。　　　
附图说明
　　　图1为本发明基板加热装置一实施例的流程示意图；
　　　图2为本发明基板加热方法第一实施例的流程示意图；
　　　图3为本发明基板加热方法中测温控制器反馈控制信号至转动控制器的流程示意图；
　　　图4为本发明基板加热方法第二实施例的流程示意图；
　　　图5为本发明基板加热方法第三实施例的流程示意图。　　　
　　　本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。　　　
具体实施方式
　　　应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
　　　本发明提供一种基板加热装置。
　　　参照图1，图1为图1为本发明基板加热装置一实施例的流程示意图。
　　　在一实施例中，该基板加热装置包括加热炉10、平台20和待加热的基板30，以及多个加热器40。其中，基板30置放在平台20上，平台20和基板30置放在加热炉10中；多个加热器40间隔设置在加热炉10中，并位于基板30的上方，通过这多个加热器40对基板30进行加热，加热器40的间隔距离可以根据实际需要设置为等间距，也可以设置为非等间距，保证通过多个加热器40的加热区域范围能够覆盖整个基板30的表面。本实施例中，平台20上设置有支撑脚（图中未示出），当基板30置放在平台20上后，通过该支撑脚对基板30进行定位，即将基板30固定在加热器40的加热区域范围内。在本实施例中，基板加热装置还包括反射片50和转动控制器60，反射片50的数量与加热器40的数量相对应，并且分别固定在多个加热器40上方，用于将加热器40上方产生的热量反射至基板30上相应的位置；转动控制器60固定在加热炉10的炉壁内侧上，用于控制反射片50转动。
　　　在本实施例中，基板加热装置还包括测温控制器70，该测温控制器70的数量与加热器40的数量对应，该测温控制器70设置在加热炉10的炉壁外侧，分别通过测温线71连接在基板30上对每个加热器40加热区域的受热点，每个测温控制器70用于测量与其对应的加热器40在基板30上的受热点的加热温度，并根据计算出的温度均匀性产生控制信号反馈至转动控制器60，该控制信号用于指示反射片50需要转动的角度；转动控制器60通过转动控制线61与对应的测温控制器70连接，在接收到测温控制器70发送的控制信号后，根据该控制信号控制对应的反射片50的转动角度。
　　　在对置放在平台20上的待加热的基板30进行加热时，首先通过设置在基板30上方的多个加热器40进行加热，通过测温线71与基板30的连接，测温控制器70检测每个加热器40在基板30上的受热点的加热温度，并将所测量到的加热温度输出至计算装置，供计算装置根据加热温度计算基板30的温度均匀性。在计算装置计算出温度均匀性后，会向相应的测温控制器70发送计算的结果，而测温控制器70接收到温度均匀性后，生成一用于控制转动控制器60的控制信号并反馈至转动控制器60，以供转动控制器60根据该控制信号控制反射片50的转动角度，以通过反射片50反射相应的加热器40上方产生的热量，使基板30上温度较低的位置得到补充，从而使基板30的温度更为均匀。
　　　本实施例通过在多个加热器40上方固定用于将加热器40上方产生的热量反射至基板30上相应的位置的反射片50，以及在加热炉10的炉壁内侧上固定用于控制反射片50转动的转动控制器60，当通过测温控制器70检测到每个加热器40在基板30上的受热点的加热温度后，计算基板30的温度均匀性，测温控制器70根据该温度均匀性产生控制信号反馈至转动控制器60，转动控制器60根据该控制信号控制反射片50的转动角度，以使基板30上各区域的温度达到均匀，从而实现了精确控制基板30温度的均匀性。　　　
　　　本发明还提供一种基板加热方法。
　　　参照图2，图2为本发明基板加热方法第一实施例的流程示意图。
　　　在一实施例中，该基板加热方法包括：
　　　步骤S10，加热器对置放在平台上的基板进行加热；
　　　在对置放在平台20上的待加热的基板30进行加热时，首先通过设置在基板30上方的多个加热器40进行加热。本实施例中，多个加热器40间隔设置在加热炉10中，并位于基板30的上方，通过这多个加热器40对基板30进行加热，加热器40的间隔距离可以根据实际需要设置为等间距，也可以设置为非等间距，保证通过多个加热器40的加热区域范围能够覆盖整个基板30的表面。
　　　步骤S20，测温控制器测量对应的加热器在基板上的受热点的加热温度，根据该加热温度得到基板的温度均匀性，根据温度均匀性生成控制信号，并反馈至转动控制器；
　　　在加热器40对基板30加热的过程中，通过测温线71与基板30的连接，测温控制器70检测每个加热器40在基板30上的受热点的加热温度，当测温控制器70根据该加热温度得到温度均匀性后，根据该温度均匀性生成一用于控制转动控制器60的控制信号并反馈至转动控制器60，以供转动控制器60根据该控制信号控制反射片50的转动角度。本实施例中，测温控制器70的数量与加热器40的数量对应，测温控制器70设置在加热炉10的炉壁外侧，分别通过测温线71连接在基板30上对每个加热器40加热区域的受热点。
　　　请一并参照图3，图3为本发明基板加热方法中测温控制器反馈控制信号至转动控制器的流程示意图。
　　　在本实施例中，步骤S20具体包括：
　　　步骤S21，测温控制器通过测温线测量对应的加热器在基板上的受热点的加热温度，将该加热温度转换成相应的电信号；
　　　通过测温控制器70对应检测每个加热器40在基板30上的受热点处的加热温度，并将该加热温度转换成相应的电信号，以将加热温度以电信号的形式输出至用于计算温度均匀性的计算装置，本实施例中，该计算装置可以为与多个测温控制器70连接并且可相互通信的电脑或计算机等。
　　　步骤S22，将转换后的加热温度输出，并接收根据加热温度计算出的基板的温度均匀性，根据该温度均匀性生成控制反射片转动的控制信号；
　　　步骤S23，通过转动控制线将生成的控制信号反馈至转动控制器。
　　　测温控制器70将加热温度转换成的电信号输出至计算装置，计算装置根据加热温度计算基板30的温度均匀性，在计算机计算出温度均匀性后，会向相应的测温控制器70发送计算的结果，而测温控制器70接收到基板30的温度均匀性后，根据该温度均匀性生成控制反射片50转动的控制信号，并通过转动控制线61将生成的控制信号反馈至转动控制器60，该控制信号用于转动控制器60反射片50需要转动的角度。
　　　步骤S30，转动控制器根据控制信号控制反射片转动相应的角度，以调整基板的温度均匀性。
　　　在转动控制器60接收到测温控制器70发送的控制信号后，根据该控制信号控制对应的反射片50的转动角度，以通过反射片50反射相应的加热器40上方产生的热量，使基板30上温度较低的位置得到补充，从而使基板30的温度更为均匀。
　　　本实施例通过在多个加热器40上方固定用于将加热器40上方产生的热量反射至基板30上相应的位置的反射片50，以及在加热炉10的炉壁内侧上固定用于控制反射片50转动的转动控制器60，当通过测温控制器70检测到每个加热器40在基板30上的受热点的加热温度后，计算基板30的温度均匀性，测温控制器70根据该温度均匀性产生控制信号反馈至转动控制器60，转动控制器60根据该控制信号控制反射片50的转动角度，以使基板30上各区域的温度达到均匀，从而实现了精确控制基板30温度的均匀性。　　　
　　　参照图4，图4为本发明基板加热方法第二实施例的流程示意图。
　　　在本发明基板加热方法第一实施例的基础上，执行步骤S30之后，还包括：
　　　步骤S40，反射片根据转动控制器的控制，转动相应的角度，将加热器的上方发出的热量反射至基板上相应的位置，调整基板的温度均匀性。
　　　本实施例中，在转动控制器60接收到测温控制器70发送的控制信号后，根据该控制信号控制反射片50，而反射片50根据转动控制器60的控制，转动所设定的相应的角度，将加热器40的上方所发出的热量反射至基板30上需要进行温度补充的位置，以使基板30的温度更为均匀，从而达到调整基板30的温度均匀性的效果。
　　　参照图5，图5为本发明基板加热方法第三实施例的流程示意图。
　　　在本发明基板加热方法第一实施例的基础上，执行步骤S10之前，还包括：
　　　步骤S50，将基板置放在平台上，通过平台上设置的支撑脚将基板定位在加热器的加热区域范围内。
　　　本实施例中，在通过加热器40对基板30进行加热前，首先将基板30置放在平台20上，并且通过设置在平台20上的支撑脚对基板30进行定位，即将基板30固定在加热器40的加热区域范围内，使得基板30的固定更为牢靠。　　　
以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (15)

  1. 一种基板加热装置，包括加热炉、置放在该加热炉中的平台和置放在平台上待加热的基板，以及设置在所述基板上方用于加热基板的多个间隔设置的加热器，其特征在于，还包括分别固定在多个所述加热器上方反射片，以及固定在所述加热炉的炉壁的内表面上用于控制所述反射片转动的转动控制器。
  2. 如权利要求1所述的基板加热装置，其特征在于，还包括设置在所述加热炉的炉壁外侧的多个测温控制器，该测温控制器用于测量多个所述加热器在基板上的受热点的加热温度，所述测温控制器通过测温线与所述基板连接。
  3. 如权利要求2所述的基板加热装置，其特征在于，所述转动控制器通过转动控制线与对应的测温控制器连接，根据所述测温控制器发送的控制信号控制对应的反射片的转动角度。
  4. 如权利要求3所述的基板加热装置，其特征在于，多个所述加热器等间距设置。
  5. 如权利要求1所述的基板加热装置，其特征在于，所述平台上设置有用于将所述基板定位在所述加热器的加热区域范围内的支撑脚。
  6. 如权利要求5所述的基板加热装置，其特征在于，还包括设置在所述加热炉的炉壁外侧的多个测温控制器，该测温控制器用于测量多个所述加热器在基板上的受热点的加热温度，所述测温控制器通过测温线与所述基板连接。
  7. 如权利要求6所述的基板加热装置，其特征在于，所述转动控制器通过转动控制线与对应的测温控制器连接，根据所述测温控制器发送的控制信号控制对应的反射片的转动角度。
  8. 如权利要求7所述的基板加热装置，其特征在于，多个所述加热器等间距设置。
  9. 一种基板加热方法，其特征在于，包括以下步骤：
    　　　加热器对置放在平台上的基板进行加热；
    　　　测温控制器测量对应的加热器在基板上的受热点的加热温度，根据该加热温度得到基板的温度均匀性，根据所述温度均匀性生成控制信号，并反馈至转动控制器；
    　　　转动控制器根据所述控制信号控制反射片转动相应的角度，以调整所述基板的温度均匀性。
  10. 如权利要求9所述的基板加热方法，其特征在于，所述测温控制器测量对应的加热器在基板上的受热点的加热温度，根据该加热温度得到基板的温度均匀性，根据所述温度均匀性生成控制信号，并反馈至转动控制器的步骤包括：
    　　　测温控制器通过测温线测量对应的加热器在基板上的受热点的加热温度，将该加热温度转换成相应的电信号；
    　　　将转换后的所述加热温度输出，并接收根据所述加热温度计算出的基板的温度均匀性，根据该温度均匀性生成控制所述反射片转动的控制信号；
    　　　通过转动控制线将生成的所述控制信号反馈至所述转动控制器。
  11. 如权利要求9所述的基板加热方法，其特征在于，在所述转动控制器根据所述控制信号控制反射片转动相应的角度的步骤之后，还包括步骤：
    　　　反射片根据所述转动控制器的控制，转动相应的角度，将所述加热器的上方发出的热量反射至所述基板上相应的位置，调整所述基板的温度均匀性。
  12. 如权利要求11所述的基板加热方法，其特征在于，在所述加热器对置放在平台上的基板进行加热的步骤之前，还包括步骤：
    　　　将基板置放在平台上，通过所述平台上设置的支撑脚将所述基板定位在所述加热器的加热区域范围内。
  13. 如权利要求9所述的基板加热方法，其特征在于，在所述转动控制器根据所述控制信号控制反射片转动相应的角度的步骤之后，还包括步骤：
    　　　反射片根据所述转动控制器的控制，转动相应的角度，将所述加热器的上方发出的热量反射至所述基板上相应的位置，调整所述基板的温度均匀性。
  14. 如权利要求13所述的基板加热方法，其特征在于，在所述加热器对置放在平台上的基板进行加热的步骤之前，还包括步骤：
    　　　将基板置放在平台上，通过所述平台上设置的支撑脚将所述基板定位在所述加热器的加热区域范围内。
  15. 如权利要求9所述的基板加热方法，其特征在于，在所述加热器对置放在平台上的基板进行加热的步骤之前，还包括步骤：
    将基板置放在平台上，通过所述平台上设置的支撑脚将所述基板定位在所述加热器的加热区域范围内。　
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