WO2015089535A1 - Élément optique destiné à une source lumineuse - Google Patents

Élément optique destiné à une source lumineuse Download PDF

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Publication number
WO2015089535A1
WO2015089535A1 PCT/AT2014/000228 AT2014000228W WO2015089535A1 WO 2015089535 A1 WO2015089535 A1 WO 2015089535A1 AT 2014000228 W AT2014000228 W AT 2014000228W WO 2015089535 A1 WO2015089535 A1 WO 2015089535A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical element
structures
light source
element according
silicone
Prior art date
Application number
PCT/AT2014/000228
Other languages
German (de)
English (en)
Inventor
Martin Siegel
Original Assignee
Zumtobel Lighting Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102013226957.9A external-priority patent/DE102013226957A1/de
Application filed by Zumtobel Lighting Gmbh filed Critical Zumtobel Lighting Gmbh
Publication of WO2015089535A1 publication Critical patent/WO2015089535A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder

Definitions

  • Optical element for mm light source
  • the invention clearlyende- 'heirifft an optical element for a light source, in particular the dispensing Liebt LED or oiled by means of the optical element - that is, a so-called organic LED - to be infiuenced.
  • LED-based light sources can be found in all areas of the industry
  • Lighting technology Use, in particular in the room lighting or in the lighting of larger buildings or building complexes. Since the lichteiniti Schlleiterehip an LED usually radiates the Liebt in a very large angular range, a variety of optics are used, with the help of which the light is then bundled in the desired manner or in the desired manner .ausge coordinator. Often the light output is even affected by several optical elements, on the one hand a so-called, primary optics, which is formed directly on the LED chip or associated with this, and on the other hand, a in
  • the primary optics directly assigned to the LED chip usually also simultaneously fulfill a protective function, since they cause light pollution
  • Halide element is shielded from external influences. Furthermore can be contained within the primary optics also Farbkonversionspartil el or phosphors with the 'help of at least a part of light emitted from the LED chip light is converted into light of another wavelength, so that terndiich ei Lsehlieht suitable color or generated with appropriate color temperature is , This represents, for example, a relatively easy way to produce with the help of an LED light source Welßiicht.
  • the primary optics applied directly to the LED chip consist of silicone material. Such optics are then either in. Injection molding or in the case of simpler optics also produced by simple dispensing methods.
  • the present invention is therefore based on the object - to provide a novel solution to the manufacturer: optical elements, which allows, if necessary, to be able to realize structures in the micrometer range with sufficient accuracy.
  • the solution according to the invention is based on the idea of forming the desired optical element from a silicone material.
  • This silicone material has at least partially structures that were created by processing the silicone material by means of a laser.
  • optical element for influencing the light output, in particular a LED or OLED LiehtquelSe
  • the optical element comprises a made of ' a silicone material body having created by processing the silicone material by means of laser structures, in particular microstructures.
  • the solution according to the invention is based on a technology known from the prior art in which a polymerizafiom process can be controlled in a targeted manner with the aid of laser radiation in certain silicone materials.
  • This method has been developed especially in the medical field and is used here in a number of different applications.
  • With the present invention it is now proposed to use this method specifically for the production of Siükon-based structures in the field of lighting technology. This opens up the possibility of producing new optical elements which can benefit from the advantageous material properties of silicone, namely its mixer stability and its optical transparency.
  • Femer can with the help of
  • Process structures can be created with accuracies of a few microns. wa meets the above requirements for the purposeful influencing of the light output.
  • the structures produced by means of the laser machining can be located on a surface of the optical element facing away from the light source.
  • the structures could also be embedded in the optical element in such a way that they are surrounded by a silicon material with different optical properties, in particular with a different refractive index.
  • This configuration is achieved in a simple manner in that, with the aid of laser radiation, regions of the starting silicone material that are influenced in such a way - in fact polymerized - are such that they have a different refractive index compared to the regions not processed with the laser radiation. In this way, virtually any three-dimensional structures can be introduced into the silicone body.
  • the non-polymerizing material is subsequently removed therefrom, if necessary in part, it results in an optical element which consists exclusively of the material processed with the aid of the laser radiation or has the optical structures on its surface as described above.
  • the erfindungsgen ate microstructures for example, lens-like
  • Structures include "It may, however, also be concerned with light-scattering structures that are based, for example, on lattice or grid structures. Furthermore, with the aid of the procedure according to the invention, the surface of the optical element could also be provided with an anti-reflective structure, wherein it would also be conceivable to realize these different thoughts together in an optical element.
  • the advantage of the solution according to the invention is that it makes use of the silicone materials, which have already been widely used in the past. Accordingly, it can also be provided that the silicone material of the optical element according to the invention additionally phospliore or other
  • the optical element according to the invention or its silicone body can be arranged directly on the LED light source and then correspondingly form a primary optic. Alternati v to this, the silicone body could, however, also be arranged on a separate support element, which is then preferably transparent, so for example consists of glass.
  • the invention will be explained in more detail in the attached drawing. 1 shows a schematic illustration to illustrate the procedure according to the invention for creating micro-opaque structures.
  • FIG. 2 is a plan view of a first embodiment of an optic according to the invention
  • FIG. Fig. 3 shows a second Ausrhrungsungsbeispiel a erfmdungsge ate optics in
  • FIG. 1 shows a first exemplary embodiment of a primary optics according to the invention for influencing the light of an LED light source
  • a Prr aroptic for a LED chip 100 wherein the optics, which is generally designated by the reference numeral 1, a silicone body 10 which is disposed on the Liehtabstrahhmg provided surface of the LED chip 100.
  • the silicone body 0 could, for example, be applied to the surface 101 of the LED chip 100 by a correspondingly simple dispenser loss.
  • the microstructure 20 indicated schematically in FIG. 1 is to be created »; This is done by machining the silicone body 10 with the aid of a laser beam 50, wherein the laser beam 50 can be focused on a specific area of the silicone body 10. The laser beam.
  • structures 20 could thus be introduced into the silicone dome 10, as they are shown by way of example in FIG. 2.
  • a laser structure 50 was introduced into the silicone material 10 with the aid of the laser beam 50, by means of which the light emitted by the LED chip 100 should be influenced in a corresponding manner.
  • the distances d between the individual lines 26 and their width can thereby be influenced be chosen in almost any way, since the process in this regard has a very high flexibility.
  • FIG. 3 Another way to realize a micro-optic . according to the present invention is shown in Fig. 3, in this. Fall is again the use as
  • the silicone material 10 is disposed directly on the surface of the LED chip 100 in the same way, however, would also be conceivable that as a support substrate for the silicone material 10 is a Glaspiuschichen or the like is used, in which case dan the optical element is no longer necessarily used as the primary optics but then, for example, at a certain distance from the light uelle is arranged.
  • a lens structure 28 is now introduced into the silicone material with the aid of the laser beam.
  • Such a structure 20 also makes it possible for the light emitted by the LED 100 to be influenced with regard to the angular range in which the light is radiated, the influence now being significantly greater than in the case of those known from the prior art primary optics. Since, in turn, there are no restrictions with regard to the design of the lens structures 28, the light-influencing property of the optical element 1 according to the invention can be varied almost as desired.
  • the lenses 28 for example, the realization of prism structures, for example in the form of pyramid or p ramidenstumpfrbrmiger structures conceivable. These may be elongate or arranged like a mairix.
  • the finally obtained structures 20 can remain within the uncured silicone 10, so that they are therefore protected by this. However, it would also be conceivable to at least partially remove the non-cured silicone after completion of the laser processing. In this case, only the cured structure 20 would remain. This is true for both shown Unsen- or prism structures as well as for the lattice structure in the Ausfxihrungsbeispiel according to Figure 2.
  • the exemplary embodiment of FIG. 4 differs from the
  • Silikonmatena! 10 additionally a phosphor layer 1 10 was introduced. With the help of this phosphor layer 1 10 occurring light beams are at least partially implemented in Lieht a different wavelength, so that in Kombinatton with the not influenced by the Phosphormalerial light a mixed light, is generated, which is emitted via the erfindungsgssiee optical element 1.
  • Macro structure does not necessarily cover the entire Kchteellendert area of the LED chip. It would be conceivable, for example, that the microstructure covers only a portion of the chip and in other areas no microstructure is provided or the structure is designed differently here. This can be useful, in particular, if the optical element is used as primary optics for an LED cluster consisting of a plurality of LEDs which emit light of different colors. In this case, it would be entirely conceivable that the optics, the light of individual colors, would be used specifically to optimize, for example, the mixing of the different LED colors or to achieve a special licensing of the LED light.
  • microstructures do not necessarily serve to influence the light output but can also be used to others
  • optical elements according to the invention need not necessarily be used for LEDs but, for example, also in the case of other light sources, e.g. In general, however, the effort to create the macrostructures will increase, the greater the luminous area of the assigned

Abstract

L'invention concerne un élément optique (1) permettant en particulier d'agir sur l'émission de lumière d'une source lumineuse à LED ou OLED. Ledit élément comporte un corps (10) composé d'un matériau à base de silicone, qui comporte des structures (20), en particulier des microstructures, produites par un usinage au laser (50) du matériau à base de silicone.
PCT/AT2014/000228 2013-12-20 2014-12-19 Élément optique destiné à une source lumineuse WO2015089535A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DEDE102013226957.9 2013-12-20
DE102013226957.9A DE102013226957A1 (de) 2013-12-20 2013-12-20 Optisches Element für eine Lichtquelle
ATGM31/2014U AT16053U1 (de) 2013-12-20 2014-01-27 Optisches Element für eine Lichtquelle
ATGM31/2014 2014-01-27

Publications (1)

Publication Number Publication Date
WO2015089535A1 true WO2015089535A1 (fr) 2015-06-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2014/000228 WO2015089535A1 (fr) 2013-12-20 2014-12-19 Élément optique destiné à une source lumineuse

Country Status (1)

Country Link
WO (1) WO2015089535A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007023439A2 (fr) * 2005-08-26 2007-03-01 Koninklijke Philips Electronics N.V. Diode electroluminescente avec conversion des couleurs
WO2007121486A2 (fr) * 2006-04-18 2007-10-25 Lamina Lighting, Inc. Dispositifs optiques pour mélange de couleurs régulé
US20080048200A1 (en) * 2004-11-15 2008-02-28 Philips Lumileds Lighting Company, Llc LED with Phosphor Tile and Overmolded Phosphor in Lens
US20120086028A1 (en) * 2006-03-24 2012-04-12 Beeson Karl W Wavelength conversion chip for use with light emitting diodes and method for making same
WO2012131532A1 (fr) * 2011-03-25 2012-10-04 Koninklijke Philips Electronics N.V. Couche de matériau fluorescent au silicone sensible aux ultraviolets à motifs sur des diodes électroluminescentes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080048200A1 (en) * 2004-11-15 2008-02-28 Philips Lumileds Lighting Company, Llc LED with Phosphor Tile and Overmolded Phosphor in Lens
WO2007023439A2 (fr) * 2005-08-26 2007-03-01 Koninklijke Philips Electronics N.V. Diode electroluminescente avec conversion des couleurs
US20120086028A1 (en) * 2006-03-24 2012-04-12 Beeson Karl W Wavelength conversion chip for use with light emitting diodes and method for making same
WO2007121486A2 (fr) * 2006-04-18 2007-10-25 Lamina Lighting, Inc. Dispositifs optiques pour mélange de couleurs régulé
WO2012131532A1 (fr) * 2011-03-25 2012-10-04 Koninklijke Philips Electronics N.V. Couche de matériau fluorescent au silicone sensible aux ultraviolets à motifs sur des diodes électroluminescentes

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
ALEKSANDR OVSIANIKOV ET AL: "Ultra-Low Shrinkage Hybrid Photosensitive Material for Two-Photon Polymerization Microfabrication", ACS NANO, vol. 2, no. 11, 25 November 2008 (2008-11-25), pages 2257 - 2262, XP055182536, ISSN: 1936-0851, DOI: 10.1021/nn800451w *
AMMER T ET AL: "CHIP-LEVEL INTEGRATED DIFFRACTIVE OPTICAL MICROLENSES FOR MULTIMODE VERTICAL-CAVITY SURFACE-EMITTING LASER TO FIBER COUPLING", OPTICAL ENGINEERING, SOC. OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS, BELLINGHAM, vol. 41, no. 12, 1 December 2002 (2002-12-01), pages 3141 - 3150, XP008035707, ISSN: 0091-3286, DOI: 10.1117/1.1518994 *
ANNICK BAY ET AL: "Optimal overlayer inspired by Photuris firefly improves light-extraction efficiency of existing light-emitting diodes", OPTICS EXPRESS, vol. 21, no. S1, 14 January 2013 (2013-01-14), pages A179 - A189, XP055182301 *
LI DING ET AL: "Large refractive index change in silicone-based and non-silicone-based hydrogel polymers induced by femtosecond laser micro-machining", OPTICS EXPRESS, vol. 14, no. 24, 27 November 2006 (2006-11-27), pages 11901, XP055182597, ISSN: 1094-4087, DOI: 10.1364/OE.14.011901 *
MANGIRDAS MALINAUSKAS ET AL: "Femtosecond laser polymerization of hybrid/integrated micro-optical elements and their characterization;Femtosecond laser polymerization of hybrid/integrated micro-optical elements and their characterization", JOURNAL OF OPTICS, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL GB, vol. 12, no. 12, 11 November 2010 (2010-11-11), pages 124010, XP020202244, ISSN: 2040-8986, DOI: 10.1088/2040-8978/12/12/124010 *

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