WO2015081538A1 - Modulateur optique et module de dispositif photonique planaire - Google Patents
Modulateur optique et module de dispositif photonique planaire Download PDFInfo
- Publication number
- WO2015081538A1 WO2015081538A1 PCT/CN2013/088676 CN2013088676W WO2015081538A1 WO 2015081538 A1 WO2015081538 A1 WO 2015081538A1 CN 2013088676 W CN2013088676 W CN 2013088676W WO 2015081538 A1 WO2015081538 A1 WO 2015081538A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor plate
- capacitor
- optical
- laser
- optical modulator
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 90
- 239000003990 capacitor Substances 0.000 claims abstract description 120
- 239000012792 core layer Substances 0.000 claims abstract description 39
- 229920000642 polymer Polymers 0.000 claims abstract description 39
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 36
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 64
- 238000005253 cladding Methods 0.000 claims description 58
- 229920001940 conductive polymer Polymers 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002861 polymer material Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 26
- 239000010408 film Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- -1 flexible PCBs Chemical class 0.000 description 5
- 230000003993 interaction Effects 0.000 description 5
- 230000031700 light absorption Effects 0.000 description 5
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012789 electroconductive film Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/015—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction
- G02F1/025—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction in an optical waveguide structure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
- G02F2202/022—Materials and properties organic material polymeric
Definitions
- the present invention relates to the field of communications technologies, and in particular, to a light modulator and a planar photonic device module. Background technique
- the design of the currently used lithium niobate (LiNb0 3 ) electro-optic modulator generally follows the following procedure: based on the LiNb0 3 substrate material, cutting along the X and z directions of the crystal, and using Ti element diffusion to form a waveguide on the LiNb0 3 substrate, And designed the Mach-Zehnder (MZ) modulator structure.
- the modulation principle of the LiNb0 3 electro-optic modulator utilizes the nonlinear secondary electro-optic effect of the LiNb0 3 material to adjust the nonlinear refractive index of the material by voltage modulation, and converts the phase modulation of the signal into intensity modulation by the MZ interferometer structure.
- the first capacitor plate and the second capacitor plate are parallel to each other.
- the first capacitor plate is made of a graphene film
- the second capacitor plate is made of a conductive film.
- the material of the first contact electrode and the second contact electrode is gold, platinum, a conductive polymer, or indium tin oxide.
- the planar photonic device module includes a laser, a first driving circuit, a second driving circuit, and a light modulator according to various possible implementations, wherein the first driving circuit is configured to control and drive the laser to emit laser light, A second drive circuit is operative to apply a modulated voltage signal to the light modulator, the laser light from the laser being conducted to the light modulator, the light modulator for modulating the laser light.
- the field strength of the fundamental mode of the polymer waveguide is integrated into the fundamental mode of the polymer waveguide, which effectively enhances the interaction between the graphene and the optical mode field.
- the device size The reduction in the size of the light modulator will lead to further improvements in system integration.
- FIG. 3 is a schematic cross-sectional view of a light modulator according to a third preferred embodiment of the present invention.
- FIG. 4 is a block diagram of a preferred embodiment of a planar photonic device module provided by the present invention.
- the core layer 113 is covered by the upper cladding layer 111 and the lower cladding layer 112. Specifically, a portion of the core layer 113 is buried in the lower cladding layer 112, and the remaining portion is buried in the upper cladding layer 111.
- the lower cladding layer 112 has a larger cross-sectional area than the upper cladding layer 111.
- the polymer waveguide 110 composed of the upper cladding layer 111, the core layer 113, and the lower cladding layer 112 has a length of 10 ⁇ m to 200 ⁇ m.
- the core layer 113 is generally rectangular in cross section, and the cross section of the rectangle is generally 3 to 10 microns in length and width.
- the second contact electrode 122 is also disposed on the surface of the under cladding layer 112 and partially extends into the upper cladding layer 111 and the lower cladding layer 112.
- the first contact electrode 121 and the second contact electrode 122 are located on opposite sides of the core layer 113.
- a portion of the second contact electrode 122 located in the upper cladding layer 111 and the lower cladding layer 112 is connected to the second capacitor plate 132, respectively.
- the second capacitor plates 132 are each partially located within the upper cladding layer 111 and the lower cladding layer 112, with the remaining portions extending into the core layer 113. Further, the two second capacitor plates 132 are parallel to each other and are parallel to the first capacitor plate 131.
- the first capacitor plate 131 and the second capacitor plate 132 are graphene films.
- the graphene film may be a single layer of graphene or an oligographene (having an atomic layer of 2 to 10 layers).
- the material of the first contact electrode 121 and the second contact electrode 122 may be gold or platinum, and the first contact electrode 121 and the second contact electrode 122 may also be a conductive polymer film or an indium tin oxide film.
- the modulation principle of the light modulator 100 is based on the electrically tunable light absorption characteristics of graphene. Since graphene has ultra-high carrier mobility and ultra-fast carrier relaxation time, the combination of optical waveguide design can effectively enhance graphene. The interaction with the optical mode field, so theoretically can achieve a modulation bandwidth of 500 GHz. In addition, since the materials used in the light modulator 100 are polymers and graphene, the material cost of both and the preparation cost of the polymer waveguides are relatively low, and large-scale production is expected.
- a third preferred embodiment of the first technical solution of the present invention provides a light modulator 300.
- the optical modulator 300 provided in this embodiment is similar in structure to the optical modulator 200 provided in the second embodiment, and the working principle and the functions realized are similar.
- the light modulator 300 includes a substrate 301, a lower cladding layer 312, a first contact electrode 321, a second contact electrode 322, a first capacitor plate 331, a second capacitor plate 332, a core layer 313, and an upper cladding layer 311. The difference is that the second capacitor plate 332 of the light modulator 300 is made of a conductive film material.
- a preferred embodiment of the second technical solution of the present invention provides a planar photonic device (PLC) module 10, which includes a laser 20, a first driving circuit 30, and an optical waveguide. 40.
- PLC planar photonic device
- the second driving circuit 50 and the optical modulator provided by the first technical solution of the present invention.
- the optical modulator 100 provided in the first preferred embodiment of the first aspect is described as an example.
- the light modulator 100 as an on-chip light modulator, a monolithically integrated planar photonic device module 10 of small size, low power consumption, and large bandwidth can be designed.
- the optical waveguide 40 may not be connected between the laser 20 and the optical modulator 100, and the laser 20 is directly connected to the optical modulator 100, and the laser light emitted by the laser 20 is directly transmitted to the optical modulation. Inside the device 100.
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
La présente invention concerne un modulateur optique (100), comportant un guide d'ondes polymère (110), au moins une première plaque de condensateur (131), et au moins une seconde plaque de condensateur (132); ledit guide d'ondes polymère comprenant une couche d'âme (113); ladite première plaque de condensateur (131) et la seconde plaque de condensateur (132) étant séparées l'une de l'autre et s'étendant dans la couche d'âme (113); la projection de ladite première plaque de condensateur (131) et la projection de ladite seconde plaque de condensateur (132) étant au moins en partie coïncidentes dans la direction radiale de la section transversale; ladite première plaque de condensateur (131) et/ou la seconde plaque de condensateur (132) étant réalisées en film mince de graphène; lors de l'application d'un signal de tension modulé entre ladite première plaque de condensateur (131) et la seconde plaque de condensateur (132), le coefficient d'absorption optique de graphène dans la première plaque de condensateur (131) et/ou la seconde plaque de condensateur (132) se modifie, entraînant ainsi la modulation de la lumière du guide d'ondes polymère (110). Le modulateur optique (100) possède une petite dimension intégrée, une faible consommation d'énergie, et une large bande passante de modulation. L'invention concerne également un module de dispositif photonique (10) comportant ledit modulateur optique (100).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2013/088676 WO2015081538A1 (fr) | 2013-12-05 | 2013-12-05 | Modulateur optique et module de dispositif photonique planaire |
CN201380002799.1A CN105264430B (zh) | 2013-12-05 | 2013-12-05 | 一种光调制器及平面光子器件模组 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2013/088676 WO2015081538A1 (fr) | 2013-12-05 | 2013-12-05 | Modulateur optique et module de dispositif photonique planaire |
Publications (1)
Publication Number | Publication Date |
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WO2015081538A1 true WO2015081538A1 (fr) | 2015-06-11 |
Family
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Family Applications (1)
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PCT/CN2013/088676 WO2015081538A1 (fr) | 2013-12-05 | 2013-12-05 | Modulateur optique et module de dispositif photonique planaire |
Country Status (2)
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CN (1) | CN105264430B (fr) |
WO (1) | WO2015081538A1 (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017144462A1 (fr) * | 2016-02-23 | 2017-08-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Ensemble circuit de commutation et procédé de fabrication d'un ensemble circuit de commutation |
CN108121091A (zh) * | 2017-12-08 | 2018-06-05 | 武汉邮电科学研究院 | 一种电光调制器及其制备方法 |
CN110147000A (zh) * | 2019-07-05 | 2019-08-20 | 吉林大学 | 一种基于掩埋型石墨烯电极的有机聚合物光波导吸收型光调制器 |
CN110687695A (zh) * | 2019-11-21 | 2020-01-14 | 吉林大学 | 一种基于梯形石墨烯的偏振不敏感的有机聚合物吸收型光调制器 |
WO2020035695A1 (fr) * | 2018-08-15 | 2020-02-20 | The University Of Manchester | Guides d'ondes actifs à commande électrique |
DE202020104362U1 (de) | 2020-07-28 | 2021-10-29 | Gesellschaft für angewandte Mikro- und Optoelektronik mit beschränkter Haftung - AMO GmbH | Elektro-optische Einrichtung, Halbleitereinrichtung und Halbleitervorrichtung, elektro-optische Anordnung und Verwendung |
WO2021221206A1 (fr) * | 2020-04-29 | 2021-11-04 | 엘지전자 주식회사 | Dispositif photonique au graphène |
Families Citing this family (2)
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JP7124741B2 (ja) * | 2019-02-06 | 2022-08-24 | 日本電信電話株式会社 | 光送信器 |
CN113093409A (zh) * | 2021-04-09 | 2021-07-09 | 东南大学 | 一种基于连续介质束缚态的二维材料电光调制器 |
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Cited By (10)
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WO2017144462A1 (fr) * | 2016-02-23 | 2017-08-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Ensemble circuit de commutation et procédé de fabrication d'un ensemble circuit de commutation |
US10436980B2 (en) | 2016-02-23 | 2019-10-08 | Fraunhofer-Gesellschaf T Zur Förderung Der Angewandten Forschung E.V. | Circuit assembly and method for producing a circuit assembly |
CN108121091A (zh) * | 2017-12-08 | 2018-06-05 | 武汉邮电科学研究院 | 一种电光调制器及其制备方法 |
WO2020035695A1 (fr) * | 2018-08-15 | 2020-02-20 | The University Of Manchester | Guides d'ondes actifs à commande électrique |
CN110147000A (zh) * | 2019-07-05 | 2019-08-20 | 吉林大学 | 一种基于掩埋型石墨烯电极的有机聚合物光波导吸收型光调制器 |
CN110687695A (zh) * | 2019-11-21 | 2020-01-14 | 吉林大学 | 一种基于梯形石墨烯的偏振不敏感的有机聚合物吸收型光调制器 |
WO2021221206A1 (fr) * | 2020-04-29 | 2021-11-04 | 엘지전자 주식회사 | Dispositif photonique au graphène |
EP4145197A4 (fr) * | 2020-04-29 | 2024-01-10 | LG Electronics, Inc. | Dispositif photonique au graphène |
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DE202020104362U1 (de) | 2020-07-28 | 2021-10-29 | Gesellschaft für angewandte Mikro- und Optoelektronik mit beschränkter Haftung - AMO GmbH | Elektro-optische Einrichtung, Halbleitereinrichtung und Halbleitervorrichtung, elektro-optische Anordnung und Verwendung |
Also Published As
Publication number | Publication date |
---|---|
CN105264430A (zh) | 2016-01-20 |
CN105264430B (zh) | 2019-05-28 |
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