WO2015053159A1 - Composition de résine, article moulé en résine, et procédé pour produire un article moulé en résine - Google Patents

Composition de résine, article moulé en résine, et procédé pour produire un article moulé en résine Download PDF

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Publication number
WO2015053159A1
WO2015053159A1 PCT/JP2014/076358 JP2014076358W WO2015053159A1 WO 2015053159 A1 WO2015053159 A1 WO 2015053159A1 JP 2014076358 W JP2014076358 W JP 2014076358W WO 2015053159 A1 WO2015053159 A1 WO 2015053159A1
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Prior art keywords
resin
mass
resin composition
group
molded product
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PCT/JP2014/076358
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English (en)
Japanese (ja)
Inventor
庄司　英和
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三菱エンジニアリングプラスチックス株式会社
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Priority claimed from JP2014196764A external-priority patent/JP5706032B1/ja
Priority claimed from JP2014196765A external-priority patent/JP5706033B1/ja
Application filed by 三菱エンジニアリングプラスチックス株式会社 filed Critical 三菱エンジニアリングプラスチックス株式会社
Priority to CN201480043194.1A priority Critical patent/CN105452526B/zh
Publication of WO2015053159A1 publication Critical patent/WO2015053159A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Definitions

  • the present invention relates to a resin composition for laser direct structuring. Furthermore, it is related with the manufacturing method of the resin molded product formed by shape
  • LDS laser direct structuring
  • the flame retardancy tends to be inferior.
  • the flame retardancy is also affected by the type of LDS additive.
  • the LDS additive is necessary for forming the plating, but can be a foreign matter in the resin molded product.
  • the present invention aims to solve such problems of the prior art, and maintains various plating properties while maintaining various plating properties such as flexural modulus, flexural strength, Charpy impact strength and deflection temperature under load. It aims at providing the resin composition excellent in the flame retardance.
  • ⁇ 1> Laser direct structuring additive 5 to 20 containing 0.5 to 10 parts by mass of elastomer, copper and chromium with respect to 100 parts by mass of resin component 40 to 95% by mass and glass fiber 5 to 60% by mass Including at least one flame retardant selected from 5 parts by mass, a phosphazene compound and a condensed phosphate ester, and 0.1 to 1 part by mass of polytetrafluoroethylene,
  • a resin composition for laser direct structuring wherein the resin component comprises 65 to 90% by mass of a polycarbonate resin and 35 to 10% by mass of a styrene resin.
  • the glass fiber has an oblateness ratio of 1.5 or less indicated by a major axis / minor axis ratio (D2 / D1) where the major axis of the cross section perpendicular to the length direction is D2 and the minor axis is D1.
  • D2> or ⁇ 3> The resin composition for laser direct structuring as described in ⁇ 3>.
  • the flatness indicated by the ratio of major axis / minor axis (D2 / D1) when the major axis of the cross section perpendicular to the length direction is D2 and the minor axis is D1 exceeds 1.5.
  • the flame retardant contains a condensed phosphate ester,
  • the glass fiber has a flatness ratio of more than 1.5 and not more than 8.0 expressed by a ratio of major axis / minor axis (D2 / D1) where D2 is a major axis of a cross section perpendicular to the length direction and D1 is a minor axis.
  • ⁇ 7> The resin composition for laser direct structuring according to any one of ⁇ 1> to ⁇ 6>, wherein the laser direct structuring additive is a spinel structure.
  • ⁇ 8> The resin composition for laser direct structuring according to any one of ⁇ 1> to ⁇ 7>, wherein the elastomer is a siloxane copolymer elastomer.
  • ⁇ 10> The resin molded product according to ⁇ 9>, wherein the evaluation of the UL-94 test of the resin molded product at an average thickness of 1.6 mm is V-0.
  • ⁇ 11> The resin molded product according to ⁇ 9> or ⁇ 10>, which has a plating layer on the surface of the resin molded product.
  • ⁇ 12> The resin molded product according to ⁇ 11>, wherein the plated layer has performance as an antenna.
  • ⁇ 13> The resin molded product according to any one of ⁇ 9> to ⁇ 12>, which is a portable electronic device part.
  • ⁇ 14> The surface of a resin molded product obtained by molding the resin composition for laser direct structuring according to any one of ⁇ 1> to ⁇ 8> is irradiated with a laser, and then a metal is applied to form a plating layer.
  • the manufacturing method of the resin molded product with a plating layer including forming.
  • ⁇ 15> The method for producing a resin molded article with a plating layer according to ⁇ 14>, wherein the plating layer is a copper plating layer.
  • a method for manufacturing a portable electronic device component having an antenna including the method for manufacturing a resin-molded article with a plated layer according to ⁇ 14> or ⁇ 15>.
  • the present invention it is possible to provide a resin composition excellent in various mechanical properties such as bending elastic modulus, bending strength, Charpy impact strength and deflection temperature under load and flame retardancy while maintaining plating properties. .
  • FIG. 1 indicates a resin molded product
  • 2 indicates a laser
  • 3 indicates a portion irradiated with the laser
  • 4 indicates a plating solution
  • 5 indicates a plating layer.
  • the resin composition of the present invention is a laser direct structuring containing 0.5 to 10 parts by weight of an elastomer, copper and chromium with respect to 100 parts by weight of a component containing 40 to 95% by weight of a resin component and 5 to 60% by weight of glass fiber. Containing 5 to 20 parts by mass of an additive, 5 to 30 parts by mass of a flame retardant selected from a phosphazene compound and a condensed phosphate ester, and 0.1 to 1 part by mass of polytetrafluoroethylene, It contains 65 to 90% by mass of polycarbonate resin and 35 to 10% by mass of styrene resin. By using such a resin composition for LDS, higher plating properties can be achieved.
  • a preferred first embodiment of the resin composition of the present invention is an aspect in which the flame retardant contains a phosphazene compound.
  • the flame retardant contains a condensed phosphate ester
  • the glass fiber has a major axis D2 and a minor axis D1 in a cross section perpendicular to the length direction.
  • the aspect ratio indicated by the ratio of major axis / minor axis (D2 / D1) is more than 1.5 and not more than 8.0.
  • the resin composition of the present invention contains a resin component.
  • the resin component contains 65 to 90% by weight of polycarbonate resin and 35 to 10% by weight of styrene resin, 65 to 85% by weight of polycarbonate resin and 35 to 15% by weight of styrene resin. Is more preferable.
  • the resin component may contain other resin components. However, the other resin is preferably 5% by mass or less of the total resin components. Only one type of resin component may be used, or two or more types may be used in combination.
  • the polycarbonate resin used in the present invention is not particularly limited, and any of aromatic polycarbonate, aliphatic polycarbonate, and aromatic-aliphatic polycarbonate can be used. Of these, an aromatic polycarbonate is preferable, and a thermoplastic aromatic polycarbonate polymer or copolymer obtained by reacting an aromatic dihydroxy compound with phosgene or a diester of carbonic acid is more preferable.
  • a compound in which one or more tetraalkylphosphonium sulfonates are bonded to the above aromatic dihydroxy compound, or a polymer containing both terminal phenolic OH groups having a siloxane structure or Oligomers and the like can be used.
  • polycarbonate resins used in the present invention include polycarbonate resins derived from 2,2-bis (4-hydroxyphenyl) propane; 2,2-bis (4-hydroxyphenyl) propane and other aromatic dihydroxy compounds A polycarbonate copolymer derived from
  • the molecular weight of the polycarbonate resin is preferably 14,000 to 30,000 in terms of viscosity average molecular weight converted from the solution viscosity measured at a temperature of 25 ° C. using methylene chloride as a solvent, and 15,000 to 28,000. More preferably, it is 16,000 to 26,000. It is preferable for the viscosity average molecular weight to be in the above range since the mechanical strength becomes better and the moldability becomes better.
  • the method for producing the polycarbonate resin is not particularly limited, and the present invention also uses a polycarbonate resin produced by any method such as the phosgene method (interfacial polymerization method) and the melting method (transesterification method). can do. Moreover, in this invention, after passing through the manufacturing process of a general melting method, you may use the polycarbonate resin manufactured through the process of adjusting the amount of OH groups of a terminal group.
  • the polycarbonate resin used in the present invention may be not only a polycarbonate resin as a virgin raw material but also a polycarbonate resin regenerated from a used product, a so-called material recycled polycarbonate resin.
  • the resin composition of the present invention may contain only one type of polycarbonate resin, or may contain two or more types.
  • the resin composition of the present invention contains a styrene resin in addition to the polycarbonate resin as a resin component.
  • Styrenic resin is a styrene polymer composed of styrene monomers, a copolymer of styrene monomers and other copolymerizable vinyl monomers, or styrene in the presence of a rubbery polymer. It means at least one polymer selected from the group consisting of a copolymer obtained by polymerizing a monomer or a styrene monomer and another copolymerizable vinyl monomer. Among these, it is preferable to use a styrene monomer or a copolymer of a styrene monomer and another copolymerizable vinyl monomer in the presence of a rubbery polymer.
  • styrenic monomer examples include styrene derivatives such as styrene, ⁇ -methylstyrene, p-methylstyrene, divinylbenzene, ethylvinylbenzene, dimethylstyrene, pt-butylstyrene, bromostyrene, and dibromostyrene.
  • styrene is preferable.
  • these can also be used individually or in mixture of 2 or more types.
  • vinylcyan compounds such as acrylonitrile and methacrylonitrile, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, amyl acrylate, hexyl acrylate, Acrylic acid alkyl esters such as 2-ethylhexyl acrylate, octyl acrylate and cyclohexyl acrylate, methacrylic acid such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, amyl methacrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, octyl methacrylate and cyclohexyl methacrylate Acrylic esters, phenyl acrylate, benzyl acrylate, etc.
  • Methacrylic acid aryl esters such as acid aryl esters, phenyl methacrylate and benzyl methacrylate, epoxy group-containing acrylic acid esters or methacrylic acid esters such as glycidyl acrylate and glycidyl methacrylate, maleimides such as N, N-methylmaleimide and N-phenylmaleimide Examples thereof include ⁇ -, ⁇ -unsaturated carboxylic acids such as acrylic monomers, acrylic acid, methacrylic acid, maleic acid, maleic anhydride, fumaric acid and itaconic acid, or anhydrides thereof.
  • rubbery polymers that can be copolymerized with styrene monomers include polybutadiene, polyisoprene, styrene-butadiene random copolymers and block copolymers, acrylonitrile-butadiene random copolymers and block copolymers, acrylonitrile.
  • styrene resins include, for example, styrene resin, high impact polystyrene (HIPS), acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), methyl methacrylate-acrylonitrile-butadiene.
  • HIPS high impact polystyrene
  • AS resin acrylonitrile-styrene copolymer
  • ABS resin acrylonitrile-butadiene-styrene copolymer
  • methyl methacrylate-acrylonitrile-butadiene methyl methacrylate-acrylonitrile-butadiene.
  • MABS resin acrylonitrile-styrene-acrylic rubber copolymer
  • ASA resin acrylonitrile-ethylenepropylene rubber-styrene copolymer
  • AES resin acrylonitrile-ethylenepropylene rubber-styrene copolymer
  • MS resin styrene-methyl methacrylate copolymer
  • acrylonitrile-styrene copolymer AS resin
  • ABS resin acrylonitrile-butadiene-styrene copolymer
  • ASA resin acrylonitrile-styrene-acrylic rubber copolymer
  • AES resin acrylonitrile-ethylenepropylene rubber-styrene A copolymer
  • ABS resin an acrylonitrile-butadiene-styrene copolymer
  • ASA resin acrylonitrile-styrene-acrylic rubber copolymer
  • ABS resin acrylonitrile-ethylenepropylene rubber-styrene copolymer
  • ABS resin acrylonitrile-butadiene-styrene copolymer
  • ABS resin acrylonitrile-ethylenepropylene rubber-styrene copolymer
  • ABS resin acrylonitrile-butadiene-styrene copolymer
  • ABS resin acrylonitrile-butadiene-
  • the styrene resin is produced by a method such as emulsion polymerization, solution polymerization, bulk polymerization, suspension polymerization or bulk / suspension polymerization.
  • the styrene resin or styrene random copolymer is used.
  • those produced by bulk polymerization, suspension polymerization, or bulk / suspension polymerization are suitable.
  • a styrene-based graft copolymer bulk polymerization, bulk / suspension polymerization or Those produced by emulsion polymerization are preferred.
  • ABS resin acrylonitrile-butadiene-styrene copolymer
  • ABS resin thermoplastic graft copolymer obtained by graft copolymerization of acrylonitrile and styrene with a butadiene rubber component, and a copolymer of acrylonitrile and styrene. It is a mixture of
  • the butadiene rubber component is preferably 5 to 40% by mass, more preferably 10 to 35% by mass, and particularly preferably 13 to 25% by mass in 100% by mass of the ABS resin component.
  • the rubber particle diameter is preferably 0.1 to 5 ⁇ m, more preferably 0.2 to 3 ⁇ m, further 0.3 to 1.5 ⁇ m, and particularly preferably 0.4 to 0.9 ⁇ m.
  • the rubber particle size distribution may be either a single distribution or a plurality of distributions of two or more peaks.
  • the resin composition of the present invention may contain only one type of styrenic resin, or may contain two or more types.
  • 40% by mass or more of the total composition is preferably a resin component, more preferably 50% by mass or more is a resin component, and 60% by mass or more is a resin component. Is more preferable.
  • the resin composition of the present invention contains glass fibers.
  • a glass fiber consists of glass compositions, such as A glass, C glass, and E glass, and E glass (an alkali free glass) is especially preferable.
  • Glass fiber refers to a fiber having a fiber-like outer shape with a cross-sectional shape cut at right angles to the length direction and having a perfect circle or polygonal shape.
  • the form of the glass fiber is “glass roving” in which single fibers or a plurality of twisted strands are continuously wound, “chopped strand” trimmed to a length of 1 to 10 mm, and pulverized to a length of about 10 to 500 ⁇ m. Any of "Mildo fiber” etc. may be sufficient.
  • Such glass fibers are commercially available from Asahi Fiber Glass Co., Ltd. under the trade names “Glasslon Chopped Strand” and “Glasslon Milled Fiber”, and are easily available. Glass fibers having different forms can be used in combination.
  • the glass fiber either a circular cross-sectional shape or a modified cross-sectional shape is preferable.
  • the cross-sectional shape is distinguished by the flatness indicated by the long diameter / short diameter ratio (D2 / D1) when the long diameter of the cross section perpendicular to the length direction of the fiber is D2 and the short diameter is D1.
  • the flatness in the present invention is the average flatness.
  • glass fibers having a flatness ratio of more than 1.5 and not more than 8.0 are preferable, glass fibers having a flatness ratio of 2.0 to 6.0 are more preferable, and a flatness ratio of 2.0 to 6.0 is preferable.
  • 4.0 glass fiber is more preferred.
  • the major axis D2 is preferably 18-30 ⁇ m
  • the minor axis D1 is preferably 5-12 ⁇ m.
  • a glass fiber with a flatness ratio of 1.5 or less is preferable, a glass fiber with a flatness ratio of 1.3 or less is more preferable, a glass fiber with a flatness ratio of 1.1 or less is more preferable, and the flatness ratio is 1 glass fiber is particularly preferred.
  • the glass fiber may be surface-treated with a silane coupling agent such as ⁇ -methacryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, and the like.
  • a silane coupling agent such as ⁇ -methacryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, and the like.
  • the amount is usually 0.01 to 1% by mass of the glass fiber.
  • a lubricant such as a fatty acid amide compound, silicone oil, an antistatic agent such as a quaternary ammonium salt, a resin having a film forming ability such as an epoxy resin or a urethane resin, a resin having a film forming ability and a heat What was surface-treated with a mixture of a stabilizer, a flame retardant, etc. can also be used.
  • the compounding amount of the glass fiber in the resin composition of the present invention is 5 to 60% by mass, preferably 15 to 60% by mass, preferably 15 to 55% by mass when the total amount of the resin component and the glass fiber is 100% by mass. % Is more preferable, and 20 to 50% by mass is further preferable. By setting it as such a range, higher plating property can be achieved.
  • the resin composition of the present invention may contain only one type of glass fiber, or may contain two or more types. When two or more types are included, the total amount falls within the above range. In the resin composition of the present invention, it is usually preferable that the resin component and the glass fiber occupy 70% by mass or more of the total components.
  • the resin composition of the present invention contains an elastomer. By containing the elastomer, the impact resistance of the resin composition can be improved.
  • the elastomer used in the present invention include methyl methacrylate-butadiene-styrene copolymer (MBS resin), methyl methacrylate-butadiene rubber copolymer (MB resin), and styrene-butadiene triblock called SBS and SEBS.
  • Copolymer and its hydrogenated product styrene-isoprene triblock copolymer called SPS and SEPS and its hydrogenated product, olefinic thermoplastic elastomer called TPO, polyester elastomer, siloxane Examples thereof include rubber, acrylate rubber, and siloxane copolymer elastomer.
  • elastomer elastomers described in paragraph numbers 0075 to 0088 of JP2012-251061A, elastomers described in paragraph numbers 0101 to 0107 of JP2012-1777047A, and the like can be used. It is incorporated herein.
  • MBS resin, MB resin or siloxane copolymer elastomer is particularly preferably used, and siloxane copolymer elastomer is more preferable.
  • the elastomer used in the present invention is preferably a graft copolymer obtained by graft copolymerizing a rubber component with a monomer component copolymerizable therewith.
  • the production method of the graft copolymer may be any production method such as bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization, and the copolymerization method may be single-stage graft or multi-stage graft.
  • the rubber component generally has a glass transition temperature of 0 ° C. or lower, preferably ⁇ 20 ° C. or lower, more preferably ⁇ 30 ° C. or lower.
  • Specific examples of the rubber component include polybutadiene rubber, polyisoprene rubber, polybutyl acrylate and poly (2-ethylhexyl acrylate), polyalkyl acrylate rubber such as butyl acrylate / 2-ethyl hexyl acrylate copolymer, and polyorganosiloxane rubber.
  • Silicone rubber butadiene-acrylic composite rubber, IPN (Interpenetrating Polymer Network) type composite rubber composed of polyorganosiloxane rubber and polyalkylacrylate rubber, styrene-butadiene rubber, ethylene-propylene rubber, ethylene-butene rubber, ethylene-octene rubber, etc. And ethylene- ⁇ -olefin rubber, ethylene-acrylic rubber, fluororubber, and the like. These may be used alone or in admixture of two or more.
  • IPN Interpenetrating Polymer Network
  • polybutadiene rubber polyalkyl acrylate rubber, polyorganosiloxane rubber, IPN composite rubber composed of polyorganosiloxane rubber and polyalkyl acrylate rubber, and styrene-butadiene rubber are preferable. .
  • monomer components that can be graft copolymerized with the rubber component include aromatic vinyl compounds, vinyl cyanide compounds, (meth) acrylic acid ester compounds, (meth) acrylic acid compounds, glycidyl (meth) acrylates, and the like.
  • These monomer components may be used alone or in combination of two or more.
  • aromatic vinyl compounds, vinyl cyanide compounds, (meth) acrylic acid ester compounds, and (meth) acrylic acid compounds are preferable from the viewpoint of mechanical properties and surface appearance, and (meth) acrylic acid esters are more preferable.
  • Specific examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate, octyl (meth) acrylate, and the like. be able to.
  • the graft copolymer obtained by copolymerizing the rubber component is preferably a core / shell type graft copolymer type from the viewpoint of impact resistance and surface appearance.
  • a rubber component selected from polybutadiene-containing rubber, polybutyl acrylate-containing rubber, polyorganosiloxane rubber, IPN type composite rubber composed of polyorganosiloxane rubber and polyalkyl acrylate rubber is used as a core layer, and around it.
  • a core / shell type graft copolymer comprising a shell layer formed by copolymerizing (meth) acrylic acid ester is particularly preferred.
  • the core / shell type graft copolymer preferably contains 40% by mass or more of a rubber component, and more preferably contains 60% by mass or more. Moreover, what contains 10 mass% or more of (meth) acrylic acid is preferable.
  • the core / shell type in the present invention does not necessarily have to be clearly distinguishable between the core layer and the shell layer, and widely includes compounds obtained by graft polymerization of a rubber component around the core portion. It is the purpose.
  • these core / shell type graft copolymers include methyl methacrylate-butadiene-styrene copolymer (MBS), methyl methacrylate-acrylonitrile-butadiene-styrene copolymer (MABS), methyl methacrylate-butadiene copolymer.
  • MB methyl methacrylate-acrylic rubber copolymer
  • MA methyl methacrylate-acrylic rubber-styrene copolymer
  • MAS methyl methacrylate-acrylic / butadiene rubber copolymer
  • methacrylate-acrylic / butadiene rubber- Styrene copolymer methyl methacrylate- (acryl / silicone IPN rubber) copolymer
  • Polyorganosiloxane polyalkyl (meth) silicone containing acrylate - acrylic composite rubber and methyl methacrylate - butadiene copolymer (MB) is particularly preferred.
  • Such rubbery polymers may be used alone or in combination of two or more.
  • elastomers examples include “Paraloid (registered trademark, the same applies hereinafter) EXL2602”, “Paraloid EXL2603”, “Paraloid EXL2655”, “Paraloid EXL2311”, “Paraloid EXL2313” manufactured by Rohm and Haas Japan. , “Paraloid EXL2315”, “Paraloid KM330”, “Paraloid KM336P”, “Paraloid KCZ201”, “Metabrene (registered trademark, the same applies hereinafter) C-223A”, “Metabrene E-901”, “Metabrene S” manufactured by Mitsubishi Rayon Co., Ltd.
  • the blending amount of the elastomer is 0.5 to 10 parts by mass, more preferably 1 to 8 parts by mass, and further preferably 1.5 to 5 parts by mass with respect to 100 parts by mass of the component including the resin component and the glass fiber.
  • the resin composition of the present invention may contain only one type of elastomer or two or more types. When two or more types are included, the total amount falls within the above range.
  • the resin composition of the present invention includes an LDS additive containing copper and chromium.
  • LDS additive containing copper and chromium, flame retardancy and plating properties can be improved.
  • the LDS additive in the present invention is obtained by adding 4 parts by mass of an additive considered to be an LDS additive to 100 parts by mass of polycarbonate resin (manufactured by Mitsubishi Engineering Plastics, Iupilon (registered trademark), S-3000F) at 1064 nm.
  • YAG laser is used to print by laser irradiation under any of the conditions of output 2.6 to 13 W, speed 1 to 2 m / s, frequency 10 to 50 ⁇ s, and then test This refers to a compound capable of forming a plating when a piece is degreased with sulfuric acid, treated with THP alkaline acti and THP alkaline acce manufactured by Kizai, and then plated with a SEL copper manufactured by Kizai.
  • the LDS additive used in the present invention may be a synthetic product or a commercial product. Moreover, as long as the commercially available product satisfies the requirements for the LDS additive in the present invention, it may be a material sold for other uses as well as those marketed as LDS additives.
  • the LDS additive in the present invention is not particularly limited as long as it contains copper and chromium.
  • the LDS additive in the present invention preferably contains 10 to 30% by mass of copper. Further, it is preferable to contain 15 to 50% by mass of chromium.
  • the LDS additive in the present invention is preferably an oxide containing copper and chromium.
  • the LDS additive in the present invention is preferably a spinel structure.
  • a spinel structure is one of the typical crystal structure types found in double oxide AB 2 O 4 type compounds (A and B are metal elements). That is, in the present invention, a spinel structure which is an oxide containing copper and chromium is more preferable.
  • the LDS additive may contain a trace amount of other metals in addition to copper and chromium.
  • other metals include antimony, tin, lead, indium, iron, cobalt, nickel, zinc, cadmium, silver, bismuth, arsenic, manganese, magnesium, calcium, and the like. These metals may exist as oxides. The content of these metals is preferably 0.001% by mass or less.
  • the particle size of the LDS additive is preferably 0.01 to 50 ⁇ m, more preferably 0.05 to 30 ⁇ m.
  • the blending amount of the LDS additive is 5 to 20 parts by mass, preferably 6 to 15 parts by mass, and more preferably 8 to 13 parts by mass with respect to 100 parts by mass of the component including the resin component and the glass fiber.
  • the resin composition of the present invention may contain only one type of LDS additive, or may contain two or more types. When two or more types are included, the total amount falls within the above range.
  • the resin composition of the present invention contains at least one flame retardant selected from phosphazene compounds and condensed phosphate esters.
  • the blending amount of the flame retardant is 5 to 30 parts by weight, preferably 6 to 25 parts by weight, more preferably 10 to 20 parts by weight, with respect to 100 parts by weight of the component including the resin component and the glass fiber. Part is particularly preferred.
  • the resin composition of the present invention may contain only one type of at least one flame retardant selected from phosphazene compounds and condensed phosphate esters, or may contain two or more types.
  • an embodiment that includes only one or two or more phosphazene compounds and does not include a condensed phosphate ester an embodiment that includes only one or two or more condensed phosphate esters, and does not include a hofphazene compound,
  • the aspect containing 2 or more types of phosphazene compounds and 1 type, or 2 or more types of condensed phosphate ester is mentioned. When 2 or more types of flame retardants are included, the total amount is in the above range.
  • the resin composition of the present invention contains a phosphazene compound.
  • a phosphazene compound is an organic compound having —P ⁇ N— bond in the molecule, preferably a cyclic phosphazene compound represented by the following general formula (1), a chain phosphazene represented by the following general formula (2) A compound, and at least one selected from the group consisting of a crosslinked phosphazene compound in which at least one phosphazene compound selected from the group consisting of the following general formula (1) and the following general formula (2) is crosslinked by a crosslinking group It is a compound of this.
  • a is an integer of 3 to 25, R 1 and R 2 may be the same or different, and an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an allyloxy group, an amino group, A hydroxy group, an aryl group or an alkylaryl group is shown.
  • R 3 and R 4 may be the same or different, and an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an allyloxy group, an amino group, A hydroxy group, an aryl group or an alkylaryl group is shown.
  • R 5 is selected from —N ⁇ P (OR 3 ) 3 groups, —N ⁇ P (OR 4 ) 3 groups, —N ⁇ P (O) OR 3 groups, and —N ⁇ P (O) OR 4 groups.
  • R 6 represents at least one type, and R 6 represents —P (OR 3 ) 4 group, —P (OR 4 ) 4 group, —P (O) (OR 3 ) 2 group, —P (O) (OR 4 ) 2 At least one selected from the group is shown.
  • examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a t-butyl group, a pentyl group, a hexyl group, an octyl group, and a decyl group.
  • An alkyl group having 1 to 6 carbon atoms such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a t-butyl group, a pentyl group and a hexyl group.
  • Particularly preferred are alkyl groups having 1 to 4 carbon atoms such as ethyl group and propyl group.
  • cycloalkyl group examples include a cycloalkyl group having 5 to 14 carbon atoms such as a cyclopentyl group and a cyclohexyl group, among which a cycloalkyl group having 5 to 8 carbon atoms is preferable.
  • alkenyl group examples include alkenyl groups having 2 to 8 carbon atoms such as vinyl group and allyl group.
  • cycloalkenyl group examples include cycloalkenyl groups having 5 to 12 carbon atoms such as cyclopentyl group and cyclohexyl group. Is mentioned.
  • alkynyl group examples include alkynyl groups having 2 to 8 carbon atoms such as ethynyl group and propynyl group, and aryl such as ethynylbenzene group.
  • aryl group examples include aryl groups having 6 to 20 carbon atoms such as a phenyl group, a methylphenyl (ie, tolyl) group, a dimethylphenyl (ie, xylyl) group, a trimethylphenyl group, and a naphthyl group.
  • a phenyl group having 6 to 10 carbon atoms is preferable, and a phenyl group is particularly preferable.
  • alkylaryl group examples include aralkyl groups having 6 to 20 carbon atoms such as benzyl group, phenethyl group, and phenylpropyl group. Among them, aralkyl groups having 7 to 10 carbon atoms are preferable, and benzyl group is particularly preferable. .
  • R 1 and R 2 in the general formula (1) and R 3 and R 4 in the general formula (2) are an aryl group and an arylalkyl group are preferable.
  • R 1 , R 2 , R 3 and R 4 are more preferably aryl groups, and particularly preferably phenyl groups.
  • Examples of the cyclic and / or chain phosphazene compounds represented by the general formulas (1) and (2) include, for example, (polyoxyphosphazene, o-tolyloxyphosphazene, m-tolyloxyphosphazene, p-tolyloxyphosphazene, etc.
  • (Poly) xylyloxyphosphazenes such as tolyloxyphosphazene, o, m-xylyloxyphosphazene, o, p-xylyloxyphosphazene, m, p-xylyloxyphosphazene, o, m, p-trimethylphenyloxy
  • phenoxytolyloxyphosphazenes such as phosphazene, phenoxy o-tolyloxyphosphazene, phenoxy m-tolyloxyphosphazene, phenoxy p-tolyloxyphosphazene, phenoxy o, m-xylyloxyphosphazene, phenoxy o, p-ki Examples include (poly) phenoxytolyloxyxylyloxyphosphazene, phenoxy o, m, p-trimethylphenyloxyphosphazene, etc., preferably cycl
  • cyclic phosphazene compound represented by the general formula (1) cyclic phenoxyphosphazene in which R 1 and R 2 are phenyl groups is particularly preferable.
  • examples of such cyclic phenoxyphosphazene compounds include hexachlorocyclotriphosphazene, octachlorochloromethane, and a mixture of cyclic and linear chlorophosphazene obtained by reacting ammonium chloride and phosphorus pentachloride at a temperature of 120 to 130 ° C.
  • Examples include compounds such as phenoxycyclotriphosphazene, octaphenoxycyclotetraphosphazene, and decaffenoxycyclopentaphosphazene obtained by removing a cyclic chlorophosphazene such as cyclotetraphosphazene and decachlorocyclopentaphosphazene and then substituting with a phenoxy group.
  • the cyclic phenoxyphosphazene compound is preferably a compound in which a in the general formula (1) is an integer of 3 to 8, and may be a mixture of compounds having different a.
  • chain phosphazene compound represented by the general formula (2) chain phenoxyphosphazene in which R 3 and R 4 are phenyl groups is particularly preferable.
  • a chain phenoxyphosphazene compound is obtained by, for example, subjecting hexachlorocyclotriphosphazene obtained by the above method to reversion polymerization at a temperature of 220 to 250 ° C., and obtaining a linear dichlorophosphazene having a polymerization degree of 3 to 10,000. Examples include compounds obtained by substitution with a phenoxy group.
  • b in the linear phenoxyphosphazene compound is preferably 3 to 1000, more preferably 3 to 100, and still more preferably 3 to 25.
  • bridged phosphazene compound examples include a compound having a crosslinked structure of 4,4′-sulfonyldiphenylene (that is, a bisphenol S residue), and a crosslinked structure of 2,2- (4,4′-diphenylene) isopropylidene group.
  • Compounds having a crosslinked structure of 4,4′-diphenylene group such as compounds having a crosslinked structure of 4,4′-oxydiphenylene group, and compounds having a crosslinked structure of 4,4′-thiodiphenylene group Etc.
  • crosslinked phosphazene compound a crosslinked phenoxyphosphazene compound in which a cyclic phenoxyphosphazene compound in which R 1 and R 2 are phenyl groups in the general formula (1) is crosslinked by the above-mentioned crosslinking group, or the above general formula (2)
  • a crosslinked phenoxyphosphazene compound in which a chain phenoxyphosphazene compound in which R 3 and R 4 are phenyl groups is crosslinked by the crosslinking group is preferable from the viewpoint of flame retardancy, and the cyclic phenoxyphosphazene compound is crosslinked by the crosslinking group.
  • a crosslinked phenoxyphosphazene compound is more preferable.
  • the content of the phenylene group in the crosslinked phenoxyphosphazene compound is such that the cyclic phosphazene compound represented by the general formula (1) and / or the all phenyl groups in the chain phenoxyphosphazene compound represented by the general formula (2) and Based on the number of phenylene groups, it is usually 50 to 99.9%, preferably 70 to 90%.
  • the crosslinked phenoxyphosphazene compound is particularly preferably a compound having no free hydroxyl group in the molecule.
  • the phosphazene compound is a crosslinked phenoxy obtained by crosslinking the cyclic phenoxyphosphazene compound represented by the general formula (1) and the cyclic phenoxyphosphazene compound represented by the general formula (1) with a crosslinking group.
  • at least one selected from the group consisting of phosphazene compounds is preferable.
  • the resin composition of the present invention contains a condensed phosphate ester. Flame retardance can be improved by blending the condensed phosphate ester.
  • the condensed phosphate ester is preferably represented by the following general formula (1).
  • R 1 , R 2 , R 3 and R 4 each independently represents a hydrogen atom or an organic group, except that R 1 , R 2 , R 3 and R 4 are all hydrogen atoms.
  • X represents a divalent organic group, p is 0 or 1, q represents an integer of 1 or more, and r represents 0 or an integer of 1 or more.
  • examples of the organic group include an alkyl group, a cycloalkyl group, and an aryl group, which may or may not have a substituent, and the substituent includes an alkyl group, an alkoxy group, and an alkylthio group.
  • a group in which these substituents are combined, or a group in which these substituents are combined by combining with an oxygen atom, a sulfur atom, a nitrogen atom, or the like may be used.
  • the divalent organic group refers to a divalent or higher group formed by removing one carbon atom from the above organic group. Examples thereof include an alkylene group, a phenylene group, a substituted phenylene group, and a polynuclear phenylene group derived from bisphenols.
  • condensed phosphate ester represented by the general formula (1) include, for example, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, Tricresyl phenyl phosphate, octyl diphenyl phosphate, diisopropyl phenyl phosphate, tris (chloroethyl) phosphate, tris (dichloropropyl) phosphate, tris (chloropropyl) phosphate, bis (2,3-dibromopropyl) Phosphate, bis (2,3-dibromopropyl) -2,3-dichlorophosphate, bis (chloropropyl) monooctyl phosphate, bisphenol A tetraphenyl phosphate DOO, bisphenol A tetra cresyl diphosphate,
  • condensed phosphate esters examples include “CR733S” (resorcinol bis (diphenyl phosphate)), “CR741” (bisphenol A bis (diphenyl phosphate)), “PX-200” from Daihachi Chemical Industry Co., Ltd. (Resorcinol bis (dixylenyl phosphate)), “Adekastab FP-700” (2,2-bis (p-hydroxyphenyl) propane / trichlorophosphine oxide polycondensate (polymerization degree 1 to 4) from Asahi Denka Kogyo Co., Ltd. It is sold under the trade name such as 3) phenol condensate and is readily available.
  • the resin composition of the present invention contains polytetrafluoroethylene (PTFE).
  • PTFE polytetrafluoroethylene
  • polytetrafluoroethylene having fibril forming ability is preferable.
  • Polytetrafluoroethylene having fibril-forming ability is classified as type 3 according to the ASTM standard. Examples of polytetrafluoroethylene having fibril-forming ability include Teflon (registered trademark) 6-J manufactured by Mitsui / Dupont Fluorochemical Co., Ltd., and Polyflon F201L, FA500B, and FA500C manufactured by Daikin Chemical Industries, Ltd. .
  • aqueous dispersion of polytetrafluoroethylene examples include Fluon D-1 manufactured by Daikin Chemical Industries, Ltd. and a polytetrafluoroethylene compound having a multilayer structure obtained by polymerizing a vinyl monomer. Any type can be used for the resin composition of the present invention.
  • a specific coated polytetrafluoroethylene (hereinafter referred to as coated polytetrafluoroethylene and coated with an organic polymer) is used. May be abbreviated).
  • the specific coated polytetrafluoroethylene is one in which the content ratio of polytetrafluoroethylene in the coated polytetrafluoroethylene falls within the range of 40 to 95% by mass, of which 43 to 80% by mass, and further 45 It is preferable that the amount is ⁇ 70% by mass, particularly 47 to 60% by mass.
  • the specific coated polytetrafluoroethylene for example, Metablene A-3800, A-3700, KA-5503 manufactured by Mitsubishi Rayon Co., Ltd., PolyPTS AD001 manufactured by PIC Co., etc. can be used.
  • the blending amount of polytetrafluoroethylene is 0.1 to 1 part by weight, more preferably 0.2 to 0.8 part by weight, with respect to 100 parts by weight of the component containing the resin component and glass fiber. 0.6 parts by weight is particularly preferred.
  • the amount added corresponds to the amount of pure polytetrafluoroethylene.
  • the blending amount of polytetrafluoroethylene is less than 0.1 parts by mass, the flame retardant effect is insufficient. On the other hand, when it exceeds 1 part by mass, the appearance of the molded product may be deteriorated.
  • the resin composition of the present invention may contain only one type of polytetrafluoroethylene or two or more types. When two or more types are included, the total amount falls within the above range.
  • the resin composition of the present invention preferably contains an organic phosphorus stabilizer.
  • an organic phosphorus stabilizer By blending the organophosphorus stabilizer, the polycarbonate resin by the LDS additive is hardly decomposed, and the effect of the present invention is more effectively exhibited.
  • the organophosphorous stabilizer the description in paragraphs 0073 to 0095 of JP2009-35691A can be referred to, and the contents thereof are incorporated in the present specification.
  • a more preferable organophosphorus stabilizer is a compound represented by the following general formula (3).
  • R is an alkyl group or an aryl group, which may be the same or different.
  • M is an integer of 0 to 2.
  • R is preferably an alkyl group having 1 to 30 carbon atoms or an aryl group having 6 to 30 carbon atoms, and an alkyl group having 2 to 25 carbon atoms, a phenyl group, a nonylphenyl group, a stearylphenyl group, 2,4- More preferred are a ditert-butylphenyl group, a 2,4-ditert-butylmethylphenyl group, and a tolyl group.
  • phosphate esters represented by the following general formula (3 ') are preferred.
  • R ′ is an alkyl group having 2 to 25 carbon atoms, which may be the same or different.
  • m ′ is 1 or 2.
  • examples of the alkyl group include octyl group, 2-ethylhexyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, dodecyl group, tridecyl group, isotridecyl group, tetradecyl group, hexadecyl group, octadecyl group and the like.
  • a tetradecyl group, a hexadecyl group and an octadecyl group are preferable, and an octadecyl group is particularly preferable.
  • phosphate esters examples include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, tris (nonylphenyl) phosphate, 2-ethylphenyldiphenyl phosphate, tetrakis (2,4-di-). tert-butylphenyl) -4,4-diphenylene phosphonite, monostearyl acid phosphate, distearyl acid phosphate and the like.
  • R ′ is an alkyl group or an aryl group, and each may be the same or different.
  • R ′ is preferably an alkyl group having 1 to 25 carbon atoms or an aryl group having 6 to 12 carbon atoms.
  • R ′ is an alkyl group, an alkyl group having 1 to 30 carbon atoms is preferable.
  • R ′ is an aryl group, an aryl group having 6 to 30 carbon atoms is preferable.
  • phosphites include triphenyl phosphite, trisnonylphenyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, trinonyl phosphite, tridecyl phosphite, trioctyl phosphite , Trioctadecyl phosphite, distearyl pentaerythritol diphosphite, tricyclohexyl phosphite, monobutyl diphenyl phosphite, monooctyl diphenyl phosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol phosphite Bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol phosphite, 2,2-methylenebis (4
  • the amount of the phosphorus stabilizer is preferably 0.01 to 5 parts by weight with respect to 100 parts by weight of the component containing the resin component and the glass fiber. -1.0 part by mass is more preferable, 0.08-0.5 part by mass is more preferable, and 0.08-0.3 part by mass is particularly preferable.
  • disassembly of polycarbonate resin by an LDS additive can be suppressed more effectively, By making it 5 mass parts or less, the adhesive strength of glass fiber and a polycarbonate is raised, The strength can be further improved.
  • the resin composition of the present invention may contain only one type of organophosphorous stabilizer or two or more types. When two or more types are included, the total amount is preferably within the above range.
  • monostearyl acid phosphate and / or distearyl acid phosphate as an organophosphorus stabilizer is preferably 5 parts by mass or less, more preferably 1 part by mass or less based on 100 parts by mass of the resin component and glass fiber.
  • 0.5 parts by mass or less is more preferable, 0.3 parts by mass or less is particularly preferable, and 0.25 parts by mass or less is more preferable.
  • 0.01 mass part or more is preferable, 0.05 mass part or more is more preferable, and 0.08 or more is further more preferable.
  • the resin composition of the present invention may contain an antioxidant.
  • an antioxidant a phenolic antioxidant is preferable, and more specifically, 2,6-di-t-butyl-4-methylphenol, n-octadecyl-3- (3 ′, 5′-di- t-butyl-4′-hydroxyphenyl) propionate, tetrakis [methylene-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, tris (3,5-di-t-butyl- 4-hydroxybenzyl) isocyanurate, 4,4′-butylidenebis- (3-methyl-6-tert-butylphenol), triethylene glycol-bis [3- (3-tert-butyl-hydroxy-5-methylphenyl) propionate And 3,9-bis ⁇ 2- [3- (3-t-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethyl Tileth
  • the resin composition of the present invention contains an antioxidant
  • the blending amount of the antioxidant is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the component containing the resin component and the glass fiber. 0.05 to 3 parts by mass is more preferable.
  • the resin composition of the present invention may contain only one kind of antioxidant or two or more kinds. When two or more types are included, the total amount falls within the above range.
  • the resin composition of the present invention may contain a release agent.
  • the release agent is preferably at least one compound selected from aliphatic carboxylic acids, aliphatic carboxylic acid esters, and aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15000. Among these, at least one compound selected from aliphatic carboxylic acids and aliphatic carboxylic acid esters is more preferably used.
  • aliphatic carboxylic acid examples include saturated or unsaturated aliphatic monocarboxylic acid, dicarboxylic acid, and tricarboxylic acid.
  • the term “aliphatic carboxylic acid” is used to include alicyclic carboxylic acids.
  • mono- or dicarboxylic acids having 6 to 36 carbon atoms are preferable, and aliphatic saturated monocarboxylic acids having 6 to 36 carbon atoms are more preferable.
  • aliphatic carboxylic acids include palmitic acid, stearic acid, valeric acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, mellic acid, and tetrariacontanoic acid. , Montanic acid, glutaric acid, adipic acid, azelaic acid and the like.
  • the same aliphatic carboxylic acid as that described above can be used.
  • the alcohol component constituting the aliphatic carboxylic acid ester examples include saturated or unsaturated monohydric alcohols and saturated or unsaturated polyhydric alcohols. These alcohols may have a substituent such as a fluorine atom or an aryl group. Of these alcohols, monovalent or polyvalent saturated alcohols having 30 or less carbon atoms are preferable, and aliphatic saturated monohydric alcohols or polyhydric alcohols having 30 or less carbon atoms are more preferable.
  • the aliphatic alcohol also includes an alicyclic alcohol.
  • these alcohols include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane, dipentaerythritol.
  • Etc. These aliphatic carboxylic acid esters may contain an aliphatic carboxylic acid and / or alcohol as impurities, and may be a mixture of a plurality of compounds.
  • aliphatic carboxylic acid ester examples include beeswax (mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, octyldodecyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin Examples thereof include distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, and pentaerythritol tetrastearate.
  • the compounding amount of the release agent is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the component containing the resin component and the glass fiber. 0.05 to 3 parts by mass is more preferable.
  • the resin composition of the present invention may contain only one type of release agent, or may contain two or more types. When two or more types are included, the total amount falls within the above range.
  • the resin composition of the present invention may contain other components without departing from the spirit of the present invention.
  • Other components include stabilizers other than phosphorus stabilizers, ultraviolet absorbers, inorganic fillers, fluorescent whitening agents, anti-dripping agents, antistatic agents, antifogging agents, lubricants, antiblocking agents, fluidity improvers, Plasticizers, dispersants, antibacterial agents and the like can be mentioned. Two or more of these may be used in combination.
  • descriptions in JP2007-314766A, JP2008-127485A, JP2009-51989A, JP2012-72338A, and the like can be referred to, and the contents thereof are described in the present specification. Embedded in the book.
  • the method for producing the resin composition of the present invention is not particularly defined, and a wide variety of known methods for producing a thermoplastic resin composition can be adopted. Specifically, each component is mixed in advance using various mixers such as a tumbler or Henschel mixer, and then melt kneaded with a Banbury mixer, roll, Brabender, single-screw kneading extruder, twin-screw kneading extruder, kneader, etc. By doing so, a resin composition can be produced.
  • various mixers such as a tumbler or Henschel mixer, and then melt kneaded with a Banbury mixer, roll, Brabender, single-screw kneading extruder, twin-screw kneading extruder, kneader, etc.
  • the phosphazene compound is preferably blended as a master batch or as a specific granular phosphazene.
  • the first embodiment is obtained by melt-kneading 40 to 65% by mass of an aromatic polycarbonate resin (A) having a mass average molecular weight of 15000 to 55000 and 35 to 60% by mass of an aromatic phosphazene compound (B).
  • Examples of the flame retardant masterbatch are characterized in that the sum of the component (A) and the component (B) is 95 to 100% by mass.
  • a second embodiment is a flame retardant masterbatch obtained by melting and kneading an aromatic polycarbonate resin (A) having a mass average molecular weight of 5,000 to 55,000 and an aromatic phosphazene compound (B) in a pressure kneader. is there.
  • a second embodiment is a flame retardant masterbatch obtained by melting and kneading an aromatic polycarbonate resin (A) having a mass average molecular weight of 5,000 to 55,000 and an aromatic phosphazene compound (B) in a pressure kneader. is there.
  • a total of 100 parts by mass of the aromatic polycarbonate resin (A) 85 to 20% by mass and the aromatic phosphazene compound (B) 15 to 80% by mass, and the fluoropolymer (C) is 0.005 to 2%. It is a flame retardant masterbatch obtained by melt-kneading a mass part. By setting it as such a structure, the workability at the time of melt-kneading with resin is excellent, and also when it mix
  • the proportion on the sieve having an opening of 400 ⁇ m is 55% by mass or more, and the bulk density is 0.3 to 1.5 g / ml, which is added to the resin as a granular phosphazene compound.
  • the phosphazene compound is finely powdered at room temperature, but has the property of solidifying against compression and shearing. If this is done, the phosphazene compound adheres to the extruder screw when melt-kneaded with a thermoplastic resin in an extruder. However, the use of the granular phosphazene compound makes it difficult to cause problems such as sticking to the extruder screw.
  • a polycarbonate resin particle (B) having a ratio of passing through a sieve having an opening of 1000 ⁇ m is 30% by mass or more, and a mass ratio of (A) / (B) is 85/15 to 5 / 95, and is blended into the resin as a granular phosphazene compound characterized by having a bulk density of 0.4 to 1.5 g / ml.
  • the method for producing a resin molded product from the resin composition of the present invention is not particularly limited, and a molding method generally employed for thermoplastic resins, that is, a general injection molding method, an ultra-high speed injection molding method, Injection compression molding method, two-color molding method, hollow molding method such as gas assist, molding method using heat insulating mold, molding method using rapid heating mold, foam molding (including supercritical fluid), insert Molding, IMC (in-mold coating molding) molding method, extrusion molding method, sheet molding method, thermoforming method, rotational molding method, laminate molding method, press molding method and the like can be employed.
  • a molding method using a hot runner method can also be selected.
  • the resin molded product with a plated layer of the present invention includes forming a plated layer by applying a metal to the surface of a resin molded product formed by molding the resin composition of the present invention after laser irradiation.
  • FIG. 1 is a schematic view showing a process of forming plating on the surface of a resin molded product 1 by a laser direct structuring technique.
  • the resin molded product 1 is a flat substrate.
  • the resin molded product 1 is not necessarily a flat substrate, and may be a resin molded product having a partially or entirely curved surface.
  • the resin molded product is not limited to the final product, and includes various parts.
  • the resin molded product in the present invention is preferably used for parts of portable electronic devices, vehicles and medical devices, and electronic parts including other electric circuits.
  • the resin molded product of the present invention has both high impact resistance, rigidity, and excellent heat resistance, as well as low anisotropy and low warpage, so that it can be used in electronic notebooks, portable computers, etc. It is extremely effective as an internal structure and casing such as a PDA, a pager, a mobile phone, and a PHS.
  • the resin molded product is suitable for flat plate-like parts having an average thickness excluding ribs of 1.2 mm or less (the lower limit is not particularly defined, for example, 0.4 mm or more). Particularly suitable as a housing. Further, it is suitable for applications in which the evaluation of the UL-94 test of resin molded products having an average thickness of 1.6 mm is required to be V-0.
  • the resin molded product 1 is irradiated with a laser 2.
  • the laser here is not particularly defined, and can be appropriately selected from known lasers such as a YAG laser, an excimer laser, and electromagnetic radiation, and a YAG laser is preferable.
  • the wavelength of the laser is not particularly defined. A preferred wavelength range is 200 nm to 1200 nm. Particularly preferred is 800 to 1200 nm.
  • the resin molded product 1 is activated only in the portion 3 irradiated with the laser. In this activated state, the resin molded product 1 is applied to the plating solution 4.
  • the plating solution 4 is not particularly defined, and a wide variety of known plating solutions can be used.
  • a metal component in which copper, nickel, gold, silver, and palladium are mixed is preferable, and copper is more preferable.
  • the method of applying the resin molded product 1 to the plating solution 4 is not particularly defined, but for example, a method of introducing the resin molded product 1 into a solution containing the plating solution.
  • the plating layer 5 is formed only in the portion irradiated with the laser.
  • a circuit interval having a width of 1 mm or less and further 150 ⁇ m or less (the lower limit is not particularly defined, but for example, 30 ⁇ m or more) can be formed.
  • Such a circuit is preferably used as an antenna of a portable electronic device component.
  • a plating layer (preferably a copper plating layer) provided on the surface of the resin molded product of the present invention (preferably a portable electronic device component) is an antenna. Resin molded products possessing the performance as described above.
  • 3PA-820 manufactured by Nitto Boseki Co., Ltd., glass fiber having a flat cross section with a diameter of 28 ⁇ m and a short diameter of 7 ⁇ m (flatness ratio 4)
  • 3PL-820 manufactured by Nitto Boseki Co., Ltd., glass fiber having a flat cross section with a diameter of 20 ⁇ m and a short diameter of 10 ⁇ m (flatness ratio 2)
  • ⁇ Phosphazene compound> FP-100 Phenoxyphosphazene compound manufactured by Fushimi Pharmaceutical Co., Ltd.
  • ⁇ PTFE> 6-J Fluoropolymer having a fibril forming ability manufactured by Mitsui DuPont Fluorochemicals
  • the flame retardancy of each resin composition was evaluated by conditioning the test piece for UL test obtained by the above-mentioned method for 48 hours in a temperature-controlled room at a temperature of 23 ° C. and a humidity of 50%, and US Underwriters Laboratories.
  • the test was conducted in accordance with the UL94 test (combustion test of plastic materials for equipment parts) defined by (UL).
  • UL94V is a method for evaluating flame retardancy from the afterflame time and drip properties after indirect flame of a burner for 10 seconds on a test piece of a predetermined size held vertically, V-0, V- In order to have flame retardancy of 1 and V-2, it is necessary to satisfy the criteria shown in the following table.
  • the afterflame time is the length of time for which the test piece continues to burn with flame after the ignition source is moved away.
  • the cotton ignition by the drip is determined by whether or not the labeling cotton, which is about 300 mm below the lower end of the test piece, is ignited by a drip from the test piece. Further, when any one of the five samples did not satisfy the above criteria, it was evaluated as NR (not rated) as not satisfying V-2.
  • test piece After printing with laser irradiation under various conditions combined, the test piece was degreased with sulfuric acid, treated with THP Alkali Acti and THP Alkali Acce manufactured by Kizai Co., Ltd., and then plated with a SEL copper manufactured by Kizai Co., Ltd. went.
  • the test pieces after the plating treatment were visually judged and classified into the following five stages. 5: Among various laser conditions, the condition where the plating is clearly mounted is 75 to 100%.
  • the condition where the plating is clearly placed is 50 to 74% 3: Among various laser conditions, the condition where the plating is clearly mounted is 30 to 49% 2: 10 to 29% of the various laser conditions are clearly plated 1: Under various laser conditions, the condition where the plating is clearly placed is less than 10%.
  • the composition of the present invention when used, while maintaining the plating property, it has various mechanical properties such as bending elastic modulus, bending strength, Charpy impact strength and deflection temperature under load, and flame retardancy. Excellent test pieces were obtained (Examples 2-1 to 2-12).
  • the compounding amount of the LDS additive when the compounding amount of the LDS additive was small (Comparative Example 2-1), the flame retardancy was excellent, but the plating property was inferior.
  • the blending amount of the polycarbonate resin when the blending amount of the polycarbonate resin was small (Comparative Example 2-2), the plating property was excellent but the flame retardancy was inferior. It was also found that the warpage was particularly small when glass fibers having a flat cross section were used (Examples 2-7 to 2-12).

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Abstract

L'invention concerne une composition de résine ayant des caractéristiques ignifuges et mécaniques supérieures, telles que le module d'élasticité en flexion, la résistance en flexion, la résistance à l'impact de Charpy et la température de fléchissement sous charge, tout en conservant une capacité de placage. La composition de résine, qui est conçue pour une structuration directe par laser, contient, pour 100 parties en masse de constituants comprenant de 40 à 95 % en masse d'un constituant de résine et de 5 à 60 % en masse de fibre de verre, de 0,5 à 10 parties en masse d'un élastomère, de 5 à 20 parties en masse d'un additif de structuration directe par laser contenant du cuivre et du chrome, de 5 à 30 parties en masse d'au moins un produit ignifuge choisi parmi un composé de phosphazène et un ester de phosphate condensé, et de 0,1 à 1 partie en masse de polytétrafluoroéthylène. Le composant de résine contient de 65 à 90 % en masse d'une résine de polycarbonate et de 35 à 10 % en masse d'une résine de styrène.
PCT/JP2014/076358 2013-10-07 2014-10-02 Composition de résine, article moulé en résine, et procédé pour produire un article moulé en résine WO2015053159A1 (fr)

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN107177180A (zh) * 2016-03-10 2017-09-19 汉达精密电子(昆山)有限公司 玻纤增强聚碳酸酯树脂组合物及其产品
EP3216833A4 (fr) * 2014-12-01 2018-06-13 LG Chem, Ltd. Composition de résine de polycarbonate et son procédé de préparation
JP2018145304A (ja) * 2017-03-06 2018-09-20 三菱エンジニアリングプラスチックス株式会社 ポリカーボネート樹脂組成物及び成形品

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JP2010536947A (ja) * 2007-08-17 2010-12-02 ミツビシ ケミカル ヨーロッパ ゲーエムベーハー 芳香族ポリカーボネート組成物
JP2013144768A (ja) * 2011-12-14 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法

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JP2010536947A (ja) * 2007-08-17 2010-12-02 ミツビシ ケミカル ヨーロッパ ゲーエムベーハー 芳香族ポリカーボネート組成物
JP2013144768A (ja) * 2011-12-14 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3216833A4 (fr) * 2014-12-01 2018-06-13 LG Chem, Ltd. Composition de résine de polycarbonate et son procédé de préparation
US10077360B2 (en) 2014-12-01 2018-09-18 Lg Chem, Ltd. Polycarbonate resin composition and method of preparing the same
CN107177180A (zh) * 2016-03-10 2017-09-19 汉达精密电子(昆山)有限公司 玻纤增强聚碳酸酯树脂组合物及其产品
JP2018145304A (ja) * 2017-03-06 2018-09-20 三菱エンジニアリングプラスチックス株式会社 ポリカーボネート樹脂組成物及び成形品

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