WO2015046846A1

WO2015046846A1 - Metal member and manufacturing method therefor

Info

Publication number: WO2015046846A1
Application number: PCT/KR2014/008803
Authority: WO
Inventors: 윤주식
Original assignee: 주식회사 위스코하이텍
Priority date: 2013-09-26
Filing date: 2014-09-23
Publication date: 2015-04-02
Also published as: CN105764683A; US20160208388A1

Abstract

The present invention can improve corrosion resistance and fingerprint resistance, and shield electromagnetic waves, as well as provide a metallic texture by treating a surface of a metal material that is prone to oxidation, such as magnesium and magnesium alloy, aluminium, aluminium alloy, titanium, titanium alloy, copper, copper alloy, silver or silver alloy, using a passivation layer, a protection layer and a fingerprint prevention layer. The present invention comprises: a structural pattern formed on the surface of one side of a base layer; a passivation layer formed on the structural pattern; a protection layer formed on the passivation layer; and another passivation layer opposed to the protection layer and that is formed on the surface of the other side of the base layer.

Description

Metal member and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a metal member that is applied to a case, a housing, and the like (hereinafter, referred to as a "body") of a mobile phone, a notebook computer, and various electronic devices. More specifically, magnesium, magnesium alloy Protection, including passivation layers, on metals with easy surface oxidation, such as aluminum, aluminum alloys, titanium, titanium alloys, copper, copper alloys, silver, and silver alloys (hereinafter referred to as "metals"). The present invention relates to a metal member that provides a metal texture through surface treatment such as a layer and an anti-fingerprint layer, and improves corrosion resistance, fingerprint resistance, and shields electromagnetic waves.

In recent years, magnesium and magnesium alloy materials are lightweight, and excellent in electromagnetic wave shielding and heat dissipation, and are widely used in various fields such as automobiles, aircrafts, as well as computers, notebooks, cameras, mobile phones, and other electronic products and electronic devices.

However, in order to practically use a material such as magnesium or magnesium alloy having high oxidative property and low corrosion resistance problem, it is necessary to separate surface treatment to ensure durability of various interior parts and exterior parts.

Meanwhile, the 'chemical treatment solution for magnesium alloy, surface treatment method and magnesium alloy base material' disclosed in Korean Laid-Open Patent Publication No. 2002-0077150 (October 11, 2002) (this is referred to as 'Document 1') is already widely used. Known.

Referring to the above-mentioned document 1, as a means for imparting paint adhesion, corrosion resistance, and rust prevention property to magnesium alloy, phosphate ions and permanganate ions are contained, and the pH is 1.5 to 7 for chemical conversion treatment. A solution and a surface treatment method are proposed.

However, in the conventional method, since the chemical treatment solution should be preferred in the range of pH 2.0 to 4.0, which is a strong acid treatment condition, for example, when the pH of the chemical treatment solution exceeds 7, the amount of film deposition due to the decrease in the oxidation power of permanganate ions is extremely high. Since it is reduced, the film has a problem in that sufficient corrosion resistance, coating adhesion, etc. cannot be obtained because of poor reliability of reproducing the film.

The present invention for solving the conventional problems as described above can improve the corrosion resistance and the like through the surface treatment formed with a passivation layer (protective layer) and a protective layer for the base layer provided with a metal that is easy to surface oxidation Its purpose is to provide a metal member.

In addition, the metal member of the present invention has yet another object to form a metal texture by forming a structure pattern of various shapes on the surface of the base layer.

In addition, the metal member of the present invention has a further object to form a fingerprint prevention layer for the base material layer, to prevent the fingerprints and traces of oil, such as the human body from getting dirty.

In addition, the metal member of the present invention is provided with a conductive material to further protect the human body by shielding the electromagnetic waves generated from various electronic devices and the like.

As a constituent means of the metal member for solving the problems of the present invention as described above is characterized in that the structure pattern (Pattern) formed on one surface of the base layer is configured.

In addition, the passivation layer formed on the structure pattern and a protective layer formed of a coating film on the passivation layer are characterized in that the configuration.

And it is characterized by including the passivation layer which opposes the said protective layer, and was formed in the other surface of the said base material layer.

Another structural means of the metal member for solving the problems of the present invention as described above is characterized in that the structure pattern (Pattern) formed on one surface of the base layer is configured.

In addition, the passivation layer formed on the structure pattern and the protective layer formed on the passivation layer is characterized in that the configuration.

In addition, the anti-fingerprint layer formed on the protective layer is characterized in that the configuration.

And a passivation layer which is opposite to the fingerprint prevention layer and formed on the other surface of the base material layer).

On the other hand, another structural means of the metal member for solving the problem of the present invention is characterized in that the structure pattern (Pattern) formed on one surface of the substrate layer is configured.

In addition, the passivation layer formed on the structure pattern is characterized in that the configuration.

In addition, the passivation layer is opposed to the passivation layer, characterized in that the passivation layer formed on the other surface of the base layer is configured.

And, it characterized in that it comprises a protective layer formed on the passivation layer.

And, it characterized in that it comprises a protective layer formed on the passivation layer and the anti-fingerprint layer formed on the protective layer formed on the structure pattern.

On the other hand, the method of manufacturing a metal member for solving the problems of the present invention as described above is characterized in that the step provided to form a structure pattern (Pattern) on the surface of the base layer.

In addition, the substrate layer is characterized in that it is provided with a step of forming a passivation layer by reaction with the passivating solution in a state in which it is deposited in a passivating solution heated to the passivation heat temperature.

And, it characterized in that the step of forming a protective layer for protecting the structure pattern on the passivation layer.

On the other hand, another method of manufacturing a metal member for solving the problems of the present invention as described above is characterized in that the step provided to form a structure pattern (Pattern) on the surface of the base layer.

And forming a protective layer on the passivation layer on the other surface on which the protective layer for protecting the structure pattern and the structure pattern are not formed on the passivation layer.

Hereinafter, the construction means and various processes for the problem to be solved by the present invention will become more apparent from the detailed description of the various embodiments shown in the accompanying drawings.

As such, the present invention provides an effect of improving corrosion resistance and the like through a surface treatment in which a passivation layer and a protective layer are formed on a base layer provided with a metal which is easily surface-oxidized.

In addition, the present invention provides a metal texture by forming a structure pattern of various shapes on the surface of the base layer, thereby providing another effect of improving the design of the product.

In addition, the present invention provides another effect that the fingerprint prevention layer formed on the base layer prevents fingerprints and traces of oil from the human body, and keeps a clean surface at all times.

In addition, when attaching the metal member provided with the conductivity of the present invention to the outer surface of the main body to shield the electromagnetic waves generated from various electronic devices, and provides another effect that can protect the human body from electromagnetic waves.

1 is a view schematically illustrating an embodiment in which a metal member according to the present invention is applied.

2 is a view schematically showing a first embodiment of the structure pattern formed on the surface of the substrate layer in FIG. 1 according to the present invention.

3 is a view schematically showing a second example of the structure pattern formed on the surface of the substrate layer in FIG. 1 according to the present invention.

4 is a view schematically showing a third embodiment of the structure pattern formed on the surface of the substrate layer in FIG. 1 according to the present invention.

5 is a view schematically showing a fourth embodiment of the structure pattern formed on the surface of the base layer in FIG. 1 according to the present invention.

6 is a first exemplary diagram schematically showing a manufacturing process for a metal member according to the present invention.

7 is a diagram illustrating a second embodiment schematically showing a manufacturing process for a metal member according to the present invention.

8 is a third exemplary embodiment schematically showing a manufacturing process for a metal member according to the present invention.

9 is a fourth exemplary embodiment schematically showing a manufacturing process for a metal member according to the present invention.

In describing specific embodiments of the present invention, illustrated by the drawings of the present invention, the constituent means and operations are described as at least one embodiment, whereby the technical spirit and core of the present invention. It is to be understood that certain components and practices are not limited.

For reference, in designating reference numerals in the drawings described in the present invention, it should be noted that the same components are given the same reference numerals even though they are shown in different drawings.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings shown in FIGS. 1 to 9.

The metal member 100 according to the present invention includes magnesium, magnesium alloy, and aluminum, aluminum alloy, titanium, titanium alloy, copper, copper alloy, silver, silver alloy, etc. (hereinafter referred to as "metal"), which is easy to surface oxidation. Characterized in that provided with a metal material such as.

In addition, in the present invention, the metal member 100 is provided with a base layer provided in various ways such as die casting, injection, extrusion, rolling, pressing, or etching by using the above-mentioned metal material. I) 100a (also referred to as "base material layer"), including passivation layers (120, 120a) (also referred to as "floating"). The

protective layers

130 and 130a and the anti-fingerprint layer 140 are formed to give the metal member 100 a metal texture and to improve corrosion resistance, flame resistance, rust resistance, paint adhesion, fingerprint resistance, and the like. It is characterized in that to further shield the electromagnetic waves.

In the present invention, the base layer 100a may be magnesium (Mg) alone or may be Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li, Be At least any one selected from among magnesium alloys.

In addition, in the present invention, the base layer 100a may be aluminum (Al) alone or in aluminum (Al), Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li At least one selected from among Be, including an aluminum alloy.

Further, in the present invention, the base layer 100a may be copper (Cu) alone or copper (Cu) in Mg, Al, Ti, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li And at least one selected from the group consisting of copper alloys.

In addition, in the present invention, the base layer 100a may be titanium (Ti) alone or titanium (Ti) in Mg, Al, Cu, Ag, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li At least one selected from the group consisting of titanium alloys including Be.

Further, in the present invention, the base layer 100a may be silver (Ag) alone or silver (Ag) in Mg, Al, Cu, Ti, Ni, Si, Cr, Mn, Zn, Zr, Fe, Ca, Li , At least one selected from the group consisting of silver alloys.

In addition, in the present invention, the thickness t1 of the base layer 100a is characterized in that composed of 0.02 to 6mm.

For example, when the thickness t1 of the substrate layer 100a is too thin, 0.02 mm or less, the structure pattern 102 and the passivation layer, which will be described later, include difficulties in thin film processing through etching or the like. Difficulties also arise in the formation of (120, 120a), on the other hand, if the thickness is more than 6mm is easy to work, but not only increases the weight, but also can be a factor that unnecessarily increases the material requirements.

Therefore, the present invention preferably has a thickness (t1) of about 2 mm or less in the range of 0.02 to 6 mm in accordance with the chemical and physical properties and workability of the metal material, and the purpose or use thereof. It would be desirable to include thinner or thicker ones.

On the other hand, the reliability test conditions for the metal member 100 according to the present invention, including a constant temperature and humidity test carried out for 24 hours at a temperature of 60 ℃, humidity 90%, 30 minutes at a temperature of -40 ℃ 30 minutes at 80 ℃ The surface treatment technology is of the utmost importance because there must be no deformation or alteration in the cold and hot thermal shock test conducted over 24 cycles and the salt water test conducted for 5 hours at 5% of the brine.

First, with reference to the accompanying drawings for the constitutional means and one embodiment of the metal member 100 for solving the problem according to the present invention will be described in detail.

As shown in FIG. 1, the present invention relates to a case, a housing (hereinafter referred to as a “body”), a synthetic resin, a urethane, a rubber resin, and the like in a mobile phone, a notebook computer, various electronic devices, and the like. Or the like, but as shown in FIG. 7 attached to the outer surface of the main body 200 mentioned above, the metal member 100 may be provided through the adhesive layer 150 as an attachment means so as to contact the passivation layer 120a. As shown in FIG. 9, the metal member 100 is provided through the adhesive layer 150 as an attachment means so as to contact the protective layer 130a.

Unlike the metal member 100 of the present invention, the passivation layer 120a or the protective layer may be formed by locking means such as bosses, ribs, and hooks provided in the main body 200. 130a may be configured to be in contact with the outer surface, and of course, the main body 200 should not be limited to the above-mentioned materials.

In addition, according to the present invention, as shown in FIGS. 1 and 2 to 5, various structure patterns 102 are formed on one surface 101 of the base layer 100a provided in the metal member 100. The structure pattern 102 is characterized by a hairline 102a, a figure 102b, an image 102c, a logo 102d by physical and chemical means. ) To visualize it.

For example, the structure pattern 102 mentioned above includes a hairline in which the peaks 102-1 and the valleys 102-2 are continuously formed at the same or non-periodic intervals as shown in FIG. 102a).

At this time, the hairline (102a) is characterized in that the mountain (102-1) and the valley (102-2) is formed in 10 to 400 cycles in the 1cm interval (L1).

In other words, in the hairline 102a, the hill 102-1 and the valley 102-2 are 10 cycles or less within the 1 cm interval L1, that is, the hill 102-1 or the valley 102-2. If the number is formed to five or less, this may reduce the metal texture due to the sparsely spacing, thereby reducing the design of the product, while the acid (102-1) and the valley (102-2) ), The metal texture or design when densely forming 400 or more cycles within the 1 cm interval (L1), that is, 200 or more hills 102-1 or 102-2. Although the refinement and the like is excellent, but it may act as a factor to increase the time and cost for polishing or processing this, in consideration of this point it is preferable to form within 200 cycles within 1cm interval (L1), but the present invention It is more preferable to form in 10 to 400 cycles.

In addition, the structure pattern 102 has one or the same figure 102b of the same or different size as shown in the accompanying FIG. 3 by the combination of the yaw 102-3 and the iron 102-4. It may include a configuration formed to be disposed on the surface 101 of the base layer (100a) above.

For example, the figure 102b may include various types of figures 102b, such as a circle, a triangle, a rectangle, a pentagon, a hexagon, and a diamond, and are naturally limited to the figures 102b listed above. Would not be.

At this time, the figure (102b) is characterized in that the portion of the yaw (102-3) or iron (102-4) formed 4 to 400 in 1cm2.

In other words, if the yaw (102-3) is formed to four or less, this too can be deteriorated due to the shape of the metal (Metal) texture, there is a fear that the design of the product is deteriorated, while (102-3) In the case of densely forming more than 400, there is an advantage of excellent metal texture, design, refinement, etc., but it increases the time and cost for polishing or processing it. In consideration of this point, it is preferable to form around 200 in view of the above, but in the present invention, it is more preferable to form 4 to 400.

In addition, as shown in FIG. 4, the structure pattern 102 may include one or more substrate layers by combining the image 102c and the concave 102-3 and the iron 102-4. It may include a configuration formed to be disposed on the surface 101 of 100a.

For example, the image 102c may include plants such as flowers, leaves, trees, and the like, insects such as butterflies and bees, and may also include animals such as dogs and pigs, and may also include people, portraits, and the like. Of course, it should not be limited to the images 102c listed above.

In addition, as shown in FIG. 5, the structure pattern 102 may include one or more substrate layers (a logo 102d) by a combination of the yaw 102-3 and the iron 102-4. It may include a configuration formed to be disposed on the surface 101 of 100a.

For example, the logo 102d may include a company name, a school name, a school name, a store name, a group name, a local government name, etc., but may also include a person name or a business card, and the like. It should not be.

Meanwhile, in the present invention, the structure pattern 102 is a figure 102b based on the aforementioned hairline 102a as a means for better utilizing the metal texture and design sense as shown in FIG. 2. ), Any one selected from the image 102c and the logo 102d is formed by the combination of the yaw 102-3 and the iron 102-4, or the figure 102b, the image 102c, the logo ( 102d) may include a configuration in which at least two or more are selected and formed by the combination of the urine 102-3 and the iron 102-4.

In this case, the figure 102b, the image 102c, the logo 102d are formed to protrude from the surface 101 of the base layer 100a on which the hairline 102a is formed to a height of 0.01 to 0.6 mm. It will be desirable to differentiate it from the hairline 102a.

Further, the protruded figure 102b, the image 102c, and the logo 102d may be mirror-processed or hatched on the surface (not shown) to form the hairline 102a. ) And differentiation, as well as better visual sensation.

For example, if the protruding height of the figure 102b, the image 102c, and the logo 102d is formed to be 0.01 mm or less, it is not clearly differentiated from the hairline 102a formed based on the base. There is a risk of dropping the visual sense, on the other hand, if formed to be too high than 0.6mm, compared to the hairline (102a) excellent visual differentiation effect but the surface of the substrate layer (100a) due to severe protrusion Since 101 may be damaged, in view of this, it may be preferable to protrude to a height of 0.01 to 0.6 mm.

And, in the present invention, the yaw (102-3) and iron (102-4) included in the above-described structure pattern (Pattern) 102 can be represented or formed in the intaglio and embossed )something to do.

In addition, in the present invention, the depth D1 of the above-mentioned structure pattern 102 is formed to be 0.01 to 20 μm from the surface 101 of the base layer 100a as shown in FIGS. 6 to 9. The configuration is characterized by that.

In this case, when the depth D1 of the structure pattern 102 is formed to be shallower than 0.01 μm, it may be difficult to distinguish visually, that is, visually, so that the metal texture may be degraded. In the case of forming deeper than the above, since the base layer 100a of the metal member 100 may be damaged, the present invention may be preferably formed with a depth D1 of 0.01 to 20 μm.

6 and 7, the passivation layer 120 is formed on the structure pattern 102, and the passivation layer is formed on the passivation layer 120 by a coating layer. 130) is formed.

In the present invention, the protective layer 130 has a thickness of 0.2 to 20 μm in order to protect the structure pattern 102 from being damaged and to improve corrosion resistance of the substrate layer 100a on which the passivation layer 120 is formed. It is characterized by the structure formed uniformly by the coating film.

In this case, when the thickness of the protective layer 130 is formed to be 0.2 μm or less, the fine structure pattern 102 may be well implemented, and thus, there is an advantage of utilizing the metal texture. However, since the thickness of the coating film is too thin, On the other hand, if the thickness is formed to a thickness of more than 20㎛ thick, but excellent in the protection and corrosion resistance, there is a fear that the implementation of the fine structure pattern 102, as well as the fall of light from the outside Reflected light may interfere with each other to reduce the metal texture of the fine structure pattern 102.

Therefore, the thickness of the protective layer 130 is not so thin or thick in the range of 0.2 to 20㎛ the thickness of the base layer 100a, that is, depending on the chemical and physical properties of the metal material, the purpose or use thereof, etc. It will be desirable to select and form suitably.

In addition, the protective layer 130 is opposed to the passivation layer, which is provided on the lower portion of the base layer 100a, that is, on the other surface 101a on which the structure pattern 102 is not formed. ) Is characterized by including a configuration to form the layer (120a).

Furthermore, the present invention is configured to form a fingerprint prevention layer 140 to be described later on the protective layer 130 to a thickness of 0.01 to 2㎛.

In addition, the anti-fingerprint layer 140 is characterized in that it comprises a configuration for forming the passivation layer 120a on the other surface 101a of the base layer 100a.

In the present invention, the passivation layer (120, 120a) is filled with the passivation solution 110, which will be described later in the solution tank 300, as shown in Figs. 100a is deposited on the passivation solution 110 heated (or also referred to as "heating") to a passivation heat temperature T1 by a separate heating means such as a heater or the like (this is "Dipping"). In the state of forming a film on the

surfaces

101 and 101a of the base layer 100a by reaction with the passivation solution 110.

At this time, the passivation layer (120, 120a) is characterized in that the thickness is formed to 0.00l to 10㎛ corresponding to 0.005 to 0.5 times the thickness of the protective layer 130.

For example, when the thickness of the passivation layers 120 and 120a is formed to be 0.001 μm or less, there is less damage to the fine structure pattern 102 and thus the metal texture is well utilized. Corrosion resistance is reduced because the thickness is too thin. On the other hand, when the thickness is formed to a thickness of 10 μm or more, the corrosion resistance is excellent, but the fine structure pattern 102 may be damaged. There may be.

Accordingly, in the present invention, the passivation layers 120 and 120a may have a thickness of the base layer 100a, for example, a passivation heat temperature T1 and a passivation solution 110, that is, a reactant, including a metal material. Although it may vary depending on the type or deposition time, the present invention will be desirable to form the thickness of 0.001 to 10㎛.

In addition, the present invention is configured to attach to the outer surface of the main body 200 by forming an adhesive adhesive layer 150 on the passivation layer (120a) is not formed as shown in Figure 7 attached to the structure Becomes

On the other hand, the present invention, as shown in Figure 6 attached to the outer surface of the main body 200 is provided with a metal member 100 through the adhesive layer 150 as an attachment means to contact the protective layer (130a), the base material layer ( One surface 101 of 100a is configured to form a structure pattern 102.

Unlike the metal member 100 of the present invention, the protective layer 130a is formed by a locking means such as bosses, ribs, and hooks provided in the main body 200. It may be configured to contact the outer surface of the (200).

In addition, the other passivation layer 120 formed on the structure pattern 102 and the other passivation layer facing the passivation layer 120 and provided on the lower portion of the base layer 100a ( The passivation layer 120a is also formed in 101a.

At this time, the surface pattern 101a is characterized in that the structure pattern 102 is not formed.

In addition, the passivation layer (120, 120a) is characterized in that it comprises a configuration for forming a protective layer (130, 130a) formed of a coating film.

In the present invention, the

protective layers

130 and 130a are mentioned above to protect the structure pattern 102 from being damaged and to improve corrosion resistance of the base layer 100a having the passivation layers 120 and 120a formed therein. As mentioned above, it becomes the structure which forms uniformly in the coating film of thickness 0.2-20 micrometers.

Furthermore, the present invention is configured to form the fingerprint layer 140, which will be described later, on the protective layer 130, that is, on the structure pattern 102 to a thickness of 0.01 to 2㎛.

In addition, the passivation layer (120, 120a) has a thickness of 0.00l to 10㎛ corresponding to 0.005 to 0.5 times the thickness of the protective layer (130, 130a) as mentioned above.

On the other hand, in the present invention, the passivation layer (120, 120a) is provided with a solution tank 300 is filled with the passivation solution 110, which will be described later, as shown in Figs. Passive 100a is deposited in a passivation solution 110 heated (or also referred to as "heating") to a passivation heat temperature T1 by a separate heating means such as a heater. The reaction with the solution 110 forms the

surfaces

101 and 101a of the base layer 100a.

In addition, the present invention is configured to attach to the outer surface of the main body 200 by forming an adhesive adhesive layer 150 on the protective layer 130a is not formed, as shown in Figure 6 attached to the structure pattern 102 Becomes

At this time, the adhesive layer 150 is formed by applying at least one or two or more of the pressure-sensitive adhesive formed from a silicone, acrylic, urethane, synthetic resin, fluorine resin, epoxy, PET (PET) system.

As another means, the adhesive layer 150 is formed by including a double-sided tape selected from at least one of polyamide-based, polyimide-based, silicone-based, fluorine resin-based, epoxy-based, urethane-based, PET (PET) -based, acrylic, synthetic resin It becomes the structure letting you go.

Next will be described in detail with reference to the accompanying drawings for the manufacturing process and one embodiment of the metal member 100 for solving the problem according to the present invention.

First, as shown in FIG. 6, a step of forming a structure pattern 102 on the surface 101 of the base layer 100a provided with the metal material mentioned above is provided.

In addition, in the state in which the substrate layer 100a is deposited in the passivation solution 110 heated to the passivation heat temperature T1, the passivation layer 120 is formed by reaction with the passivation solution 110. Forming a 120a).

In the present invention, the passivation layers 120 and 120a are filled with the passivation solution 110 in the solution tank 300 as shown in FIG. 6 (c), and the substrate layer 100a is heated by a heater. Reaction with the passivation solution 110 in a state of being deposited in the passivation solution 110 heated (or also referred to as "heating") to the passivation heat temperature T1 by a separate heating means such as). It forms in the surface 101 of the base material layer 100a by this.

In addition, the passivation layer 120 is provided with a step of forming the protective layer 130 by the coating process to protect the structure pattern 102, as already mentioned above.

In the present invention, the protective layer 130 is formed of a transparent resin or a color resin, which is formed by a coating treatment by at least one of electrodeposition coating method, synthetic resin coating method, powder coating method, and electrostatic coating method. It features.

And, it characterized in that it comprises the step of forming an anti-fingerprint layer 140 on the protective layer 130.

In the present invention, the anti-fingerprint layer 140 adsorbs an anti-fingerprint solution (not shown) to the protective layer 130 (also referred to as “contacting”), and then 1 to 15 at a thermal temperature of 40 to 120 ° C. Coating by a heat treatment for minutes to form a thickness of 0.01 to 2㎛.

In addition, the anti-fingerprint solution may be mixed with a fluorine solvent and a volatile solvent in a weight ratio of 1 to 3: 7 to 9 to spray the surface of the protective layer 130, or to be deposited on the anti-fingerprint solution (" It may be desirable to adsorb by an adsorption means such as " Dipping ").

In this case, since the heat treatment means means that the fingerprint solution contains a volatile substance, it is possible to allow natural drying, but it may be more preferable to dry by infrared rays or hot air.

In addition, when the weight ratio of the fluorine solvent in the anti-fingerprint solution is set too low to 1 or less, the thickness of the anti-fingerprint layer 140 is less than 0.01 μm by the remaining fluorine solvent after the volatile solvent is removed by heat treatment. There is a concern that the coating (Coating) is low, On the other hand, if the weight ratio of the fluorine solvent is set to 3 or more, the thickness of the fingerprint layer 140 is coated too thick, 2㎛ or more, rather than fingerprints or oil In addition to being difficult to remove, since the reflected light of the light from the outside may interfere with each other to reduce the metal texture of the fine structure pattern 102 in consideration of this uniform thickness to 0.01 to 2㎛ It would be desirable to form them.

In addition, when the heat temperature for the heat treatment is 40 ° C or less, the coating treatment for the volatile solvent may not be performed properly, so that the fingerprint layer 140 may be easily peeled off, whereas the heat temperature is 120 ° C or higher. In the case of making it too high, drying of the volatile solvent proceeds too fast and peeling phenomenon may occur to the anti-fingerprint layer 140. Therefore, in consideration of this, it is preferable to select a suitable temperature in the range of 40 to 120 ° C. something to do.

If the heat treatment time is shorter than 1 minute, the coating treatment for the volatile solvent may not be performed properly, and thus the fingerprint protection layer 140 may be easily peeled off. If the length is too long, there is an advantage of obtaining a perfect anti-fingerprint layer 140, but the process time for heat treatment is unnecessarily long, so it can be economically a wasteful factor, so select a suitable time in the range of 1 to 15 minutes. It would be desirable.

On the other hand, in the present invention, the fingerprint layer 140 is characterized in that the coating (Coating) to a thickness of 0.01 to 2㎛ using a polymer (Polymer) or oligomer (Oligomer) resin. When the thickness of the anti-fingerprint layer 140 is coated too thin to 0.01 μm or less, it may be easily peeled off or damaged. On the other hand, when the coating is made too thick at 2 μm or more, the fingerprint or human oil may be removed. Not only is it difficult to be difficult, and since the reflected light of the light from the outside may interfere with each other to reduce the metal texture of the fine structure pattern 102, in view of this, too thin with a thickness of 0.01 to 2㎛ It may be desirable to form uniformly so as not to be thick.

In addition, in the present invention, the anti-fingerprint layer 140 may be formed including a polymer film. At this time, the polymer film is formed to a thickness of 0.01 to 2㎛ by the adhesive layer (not shown) as mentioned above, but if too thin to form a thickness of 0.01㎛ or less easily peeled off or damaged On the other hand, if the thickness is formed to be 2 μm or thicker, the fingerprint or human oil may be difficult to remove, but the reflected light of the light from the outside may interfere with each other to form a fine structure pattern 102. Since there is a possibility that the metal texture of the) may be reduced in consideration of this, it will be desirable to form uniformly so as not to be too thin or thick with a thickness of 0.01 to 2㎛.

In addition, in the present invention, the anti-fingerprint layer 140 may be formed to be transparent in order to implement the metal texture for the finely formed structure pattern 102 to stand out more.

Next will be described in detail with reference to the accompanying drawings for another manufacturing process and one embodiment of the metal member 100 for solving the problem according to the present invention.

First, as shown in FIG. 7, a step of forming a structure pattern 102 on the surface 101 of the base layer 100a provided with the metal material mentioned above is provided.

In addition, the step of forming a protective layer 130 for protecting the structure pattern 102 on the passivation layer 120.

At this time, the protective layer 130 is formed of a transparent resin or a color (Color) resin, which is characterized in that it is formed by a coating treatment by at least one of electrodeposition coating method, synthetic resin coating method, powder coating method, electrostatic coating method. do.

The adhesive layer 150 is formed on another passivation layer 120a that faces the protective layer 130 and does not have the structure pattern 102, and then the adhesive layer 150. It characterized in that it comprises the step of attaching to the outer surface of the main body 200 through.

Meanwhile, in the present invention, the passivation layers 120 and 120a are filled with the passivation solution 110 in the solution tank 300 as shown in FIG. 7 (c), and the substrate layer 100a is heated. And the passivation solution 110 in a state of being deposited in the passivation solution 110 heated (or also referred to as "heating") at a passivation heat temperature T1 by a separate heating means such as a heater. Is formed on the

surfaces

101 and 101a of the base layer 100a.

In addition, the adhesive layer 150 is formed by applying a pressure-sensitive adhesive formed by selecting at least one or two or more of silicone, acrylic, urethane, synthetic resin, fluorine, epoxy, and PET. .

In another embodiment, the adhesive layer 150 may include a double-sided tape selected from at least one of polyamide, polyimide, silicone, fluorine resin, epoxy, urethane, PET, acrylic, and synthetic resins. It can be a configuration that allows.

At this time, the adhesive layer 150 is characterized in that the thickness is formed from 0.02 to 0.2mm. For example, when the thickness of the adhesive layer 150 is reduced to 0.02 mm or less, the adhesiveness is weak and the metal member 100 may easily fall off the outer surface of the main body 200. On the other hand, when the thickness of the adhesive layer 150 is thicker than 0.2 mm, Although the adhesive strength is strong, since the overall thickness including the main body 200 becomes thick, it may be a disadvantage in the thinning of the product, so selecting the appropriate thickness according to the product, the purpose, the use, etc. to which the metal member 100 of the present invention is applied. Would be preferred.

In addition, the passivation layer 120 is provided with a step of forming a protective layer 130 to protect the structure pattern (102).

In addition, forming the anti-fingerprint layer 140 mentioned above on the protective layer 130 is provided.

In addition, the step of forming a protective layer 130a on the passivation layer 120a of the other surface 101a which is opposite to the fingerprint layer 140 and does not have a structure pattern 102 is formed. It is provided.

Meanwhile, in the present invention, the passivation layers 120 and 120a are filled with the passivation solution 110 in the solution tank 300 as shown in (c) of FIG. 6 and the substrate layer 100a is heated. And the passivation solution 110 in a state of being deposited in the passivation solution 110 heated (or also referred to as "heating") at a passivation heat temperature T1 by a separate heating means such as a heater. Is formed on the

surfaces

101 and 101a of the base layer 100a.

In addition, after the adhesive layer 150 is formed on the protective layer 130a, the adhesive layer 150 may be attached to the outer surface of the main body 200 through the adhesive layer 150.

Here, the protective layers (130, 130a) is formed of a transparent resin or a color (Color) resin, which is formed by a coating treatment by at least one of electrodeposition coating method, synthetic resin coating method, powder coating method, electrostatic coating method It features.

The following will be described in more detail with respect to various embodiments that can be included in the present invention made of the manufacturing process as mentioned above.

First, in the present invention, as shown in FIG. 2-1, the structure pattern 102 includes a hairline in which the mountain 102-1 and the valley 102-2 are continuously formed at the same or non-identical period ( Hairline) 102a.

At this time, the hairline (102a) is characterized in that the acid (102-1) and the valley (102-2) is formed in 10 to 400 cycles in the 1cm interval (L1) as mentioned in detail above.

Also, in the present invention, the structure pattern 102 includes a combination of the yaw 102-3 and the iron 102-4 with the same or the same size figure 102b as shown in FIG. 2-2. It may be configured to include the formed.

At this time, the figure 102b is characterized in that the yaw (102-3) or the iron (102-4) portion formed in 4 to 400 in 1 cm 2 as specifically mentioned above.

In addition, in the present invention, the structure pattern 102 includes an image 102c formed of a combination of the yaw 102-3 and the iron 102-4, as shown in FIG. 2-3. Can be.

In addition, in the present invention, the structure pattern 102 is formed of a combination of the yaw (102-3) and iron (102-4) of the logo (102) as shown in Figs. It can be configured to include.

In addition, in the present invention, the above-mentioned structure pattern 102 may have a depth D1 as mentioned above at least one selected from among laser processing, cutting processing, grinding processing, corrosion processing, and sand blast processing. It becomes the structure formed in 0.01-20 micrometers.

Meanwhile, in the present invention, the passivation solution 110 included in the means for forming the passivation layers 120 and 120a on the

surfaces

101 and 101a of the base layer 100a, that is, the reaction material for forming the oxide film. For example, ethanol, methanol, isopropyl alcohol, butyl alcohol, octyl alcohol, or at least one selected from the group consisting of two or more volatile alcohols (alcohol) It is composed of a system-based material.

In addition, the passivation solution 110 is a volatile ketone (Acetone), methyl ethyl ketone (Methyl Ethyl Ketone), methyl isobutyl ketone (Methyl Isobutyl Ketone) is a volatile ketone (Ketone) ) -Based material may be included.

Meanwhile, in the present invention, the passivation heat temperature T1 included in the means for forming the passivation layers 120 and 120a on the

surfaces

101 and 101a of the substrate layer 100a is applied to the solution tank 300. By heating the passivation solution 110 of the alcohol-based or ketone-based material in the range of 40 ° C. to the boiling point, thereby facilitating the reaction for the formation of the passivation layers 120 and 120a. It would be desirable to.

In addition, the passivation heat temperature (T1) by heating the passivation solution 110 of the alcohol (Alcohol) or ketone (Ketone) material filled in the solution tank 300 in the range 40 to 220 ℃, It will be desirable to facilitate the reaction for the formation of 120, 120a).

For example, when the passivation heat temperature T1 is set to 40 ° C. or less, the reaction of the passivation solution 110 is lowered, and the passivation layers 120 and 120a are dense on the

surfaces

101 and 101a of the base layer 100a. On the other hand, if the passivation heat temperature (T1) is set above the boiling point or above 220 ° C, evaporation of the passivation solution 110 composed of an alcohol-based or ketone-based volatile substance may occur. Not only is it economically disadvantageous due to severe losses, and there is a fear that the uniform passivation layers 120 and 120a may not be formed. It may be more desirable to select a suitable passivation heat temperature (T1) in the range from to 220 ° C.

In other words, when looking at the boiling point (알코올) of the alcohol-based reactants contained in the passivation solution 110, ethanol is 78.3 ℃, methanol is 64.65 ℃, isopropyl alcohol is 82 ℃, butyl alcohol 117.7 ℃, octyl alcohol is 194.5 ° C., while the boiling point of ketone-based reactants included in the passivation solution 110 is 56.5 ° C., methylethyl ketone is 79.6 ° C., and methyl isobutyl ketone is 115.9 ° C. The passivation heat temperature (T1) is appropriately selected in the range of 40 ° C. to the boiling point or in the range of 40 to 220 ° C., depending on the kind of the reactant, which is selected and composed either alone or by mixing two or more. Would be more desirable.

In addition, in the present invention, for example, the passivation solution heated to the passivation heat temperature T1 included in the means for forming the passivation layers 120 and 120a on the

surfaces

101 and 101a of the base layer 100a. The time for depositing the base layer 100a on the 110 may vary depending on the type of alcohol-based or ketone-based reactant included in the passivation solution 110 mentioned above, but may be deposited in the range of 1 second to 30 minutes. It is more preferable to give.

For example, if the deposition time is set too short to less than 1 second, the reaction of the passivation solution 110 is lowered so that the passivation layers 120 and 120a are not formed densely on the

surfaces

101 and 101a of the base layer 100a. On the other hand, if the setting time is longer than 30 minutes, the density of the passivation layers 120 and 120a may be increased. However, the process time for the passivation layers 120 and 120a, that is, the passivation process, is unnecessarily long. The present invention may be more suitably selected in the range of 1 second to 30 minutes because it may cause an economic waste.

As such, the thicknesses of the passivation layers 120 and 120a formed on the

surfaces

101 and 101a of the base layer 100a include the passivation solution 110, including the passivation heat temperature T1 heated in the solution tank 300. It may vary depending on the type or deposition time of the reactant, but preferably characterized in that it is formed in the range of 0.001 to 10㎛.

For example, when the thickness of the passivation layers 120 and 120a is formed to be 0.001 μm or less, there is less damage to the fine structure pattern 102 so that the metal texture can be well implemented. Corrosion resistance is reduced because the thickness is too thin. On the other hand, when the thickness is formed to be 10 μm or more, the corrosion resistance is excellent, but the fine structure pattern 102 may be damaged. There can be.

The passivation layers 120 and 120a formed as described above have an effect of increasing the adsorption force of the coating film upon formation of the

protective layers

130 and 130a based on the coating together with the improvement of the corrosion resistance. The metal member 100 further improves metal (Metal) texture, including corrosion resistance and rust resistance.

On the other hand, the present invention is sufficient to sufficiently remove the foreign matter on the surface (101, 101a) through a sufficient degreasing and cleaning process before immersing the above-mentioned substrate layer (100a) in the solution tank 300 filled with the passivation solution 110 It may be desirable to remove it.

In other words, when foreign matter is deposited on the

surfaces

101 and 101a of the base layer 100a, the passivation solution 110 is not uniformly buried as a result of surface tension, resulting in the formation of the passivation layers 120 and 120a. It can have a bad effect on the situation.

Subsequently, after forming the passivation layers 120 and 120a, the method may further include drying the base layer 100a.

For example, since the passivation solution 110 is a volatile material, it may be naturally dried at room temperature. However, it may be more preferable to dry by infrared rays or hot air at a heat temperature in the range of 20 to 60 ℃, or by ultrasonic drying.

It will be apparent to those skilled in the art that various changes, modifications, and the like can be made without departing from the technical spirit of the present invention through the above description.

Therefore, the technical scope of the present invention should not be limited to the contents described in various exemplary embodiments as mentioned, but should be defined by the claims of the present invention.

[Description of the code]

100: metal member

100a: substrate layer

101, 101a: surface

102: Pattern Pattern

102a: Hairline

102b: Shape

102c: Image

102d: Logo

102-1: Acid

102-2: Goal

102-3: Yo

102-4: Iron

110: Passive solution

120, 120a: Passive layer

130, 130a: protective layer

140: anti-fingerprint layer

150: adhesive layer

200: main body

300: solution bath

Claims

In the metal member 100,

A structure pattern 102 formed on one surface 101 of the base layer 100a;

A passivation layer (120) formed on the structure pattern (102);

A protective layer 130 formed of a coating film having a thickness of 0.2 to 20 μm to protect the structure pattern 102 on which the passivation layer 120 is formed; And

And a passivation layer (120a) formed on another surface (101a) of the base layer (100a) facing the protective layer (130).
The method of claim 1,

The metal member, characterized in that it further comprises a protective layer (130a) formed on the passivation layer (120a) with a coating film having a thickness of 0.2 to 20㎛.
According to claim 1, wherein the passivation layer (120, 120a) is a 1 second to 30 minutes range in the alcohol (Alcohol) -based passivation solution (110) heated the substrate layer (100a) to passivation heat temperature (T1) It is formed by the reaction with the passivating solution 110 in the deposited state,

The passivation heat temperature (T1) is a metal member, characterized in that the passivating solution (110) heated to 40 ℃ to the boiling point range or 40 to 220 ℃ range.
The method of claim 3, wherein the passivating solution 110 is any one or two selected from ethanol (ethanol), methanol (Methanol), isopropyl alcohol (Isopropyl alcohol), butyl alcohol (Butyl Alcohol), octyl alcohol (Octyl Alcohol) Metal member characterized in that the material is formed by mixing the branches.
According to claim 1, wherein the passivation layer (120, 120a) is in the range of 1 second to 30 minutes in the ketone-based passivation solution 110 heated to the substrate layer 100a at the passivation heat temperature (T1). Is formed by the reaction with the passivating solution 110 in the deposited state,

The passivation heat temperature (T1) is a metal member, characterized in that the passivating solution (110) heated to 40 ℃ to the boiling point range or 40 to 220 ℃ range.
The material of claim 5, wherein the passivation solution 110 is formed by mixing one or two or more selected from acetone, methyl ethyl ketone, and methyl isobutyl ketone. Metal member characterized in that.
The metal member according to claim 1, wherein the passivation layer (120, 120a) has a thickness of 0.005 to 0.5 times the thickness of the protective layer (130).
According to claim 1, wherein the protective layer 130 on the protective layer 130 after adsorbing the anti-fingerprint solution mixed with a weight ratio of fluorine solvent and volatile solvent 1 to 3: 7 to 9 to 40 to 120 ℃ Metal member, characterized in that the anti-fingerprint layer 140 was formed by heat treatment for 1 to 30 minutes at a thermal temperature of.
Forming a structure pattern 102 on one surface 101 of the base layer 100a;

An alcohol-based or ketone-type passivation solution 110 heated to the substrate layer 100a at a passivation heat temperature T1 of 40 ° C. to boiling point or 40 ° C. to 220 ° C. Forming a passivation layer (120, 120a) by reaction with the passivation solution (110) in a state of being deposited in the range of 1 second to 30 minutes in the; And

Forming a protective layer (130) for protecting the structure pattern (102) on the passivation layer (120).
The metal member of claim 9, further comprising forming a protective layer 130a on the passivation layer 120a of the other surface 101a on which the structure pattern 102 is not formed. Manufacturing method.
The method of claim 9, wherein the passivating solution 110 is any one or two selected from ethanol (ethanol), methanol (Methanol), isopropyl alcohol (Isopropyl alcohol), butyl alcohol (Butyl Alcohol), octyl alcohol (Octyl Alcohol) Method for producing a metal member, characterized in that the material is formed by mixing more than one branch.
The material of claim 9, wherein the passivation solution 110 is formed by mixing any one or two or more selected from acetone, methyl ethyl ketone, and methyl isobutyl ketone. Method for producing a metal member, characterized in that.
Forming a pattern 102 on one surface 101 of the base layer 100a of magnesium or magnesium alloy,

The substrate layer 100a is reacted with the passivation solution 110 in a state in which the substrate layer 100a is immersed in an alcohol-based or ketone passivation solution 110 heated to the passivation heat temperature T1. Forming a passivation layer (120, 120a); And

And forming a protective film layer (130) for protecting the structure pattern (102) on which the passivation layer (120) is formed.
The method of claim 13, further comprising forming a protective film layer 130a on the passivation layer 120a on the other surface 101a on which the structure pattern 102 is not formed. Method for producing a metal member.
The method of claim 13, wherein the passivating solution 110 is any one or two selected from ethanol (ethanol), methanol (Methanol), isopropyl alcohol (Isopropyl alcohol), butyl alcohol, octyl alcohol (Octyl Alcohol) Method for producing a metal member, characterized in that the material is formed by mixing more than one branch.
The material of claim 13, wherein the passivation solution 110 is formed by mixing any one or two or more selected from acetone, methyl ethyl ketone, and methyl isobutyl ketone. Method for producing a metal member, characterized in that.
15. The method of claim 13, wherein the time for depositing the substrate layer (100a) in the passivation solution (110) is in the range of 1 second to 30 minutes.
The method of claim 13, wherein the passivation heat temperature (T1) is a method for producing a metal member, characterized in that the passivating solution (110) is heated in the range of 40 ℃ to boiling point or 40 ℃ to 220 ℃ range.