WO2015119409A1 - Surface treatment method for metal base - Google Patents

Surface treatment method for metal base Download PDF

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Publication number
WO2015119409A1
WO2015119409A1 PCT/KR2015/001086 KR2015001086W WO2015119409A1 WO 2015119409 A1 WO2015119409 A1 WO 2015119409A1 KR 2015001086 W KR2015001086 W KR 2015001086W WO 2015119409 A1 WO2015119409 A1 WO 2015119409A1
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Prior art keywords
passivation
metal
metal substrate
surface treatment
magnesium
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PCT/KR2015/001086
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French (fr)
Korean (ko)
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윤주식
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주식회사 위스코하이텍
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Publication of WO2015119409A1 publication Critical patent/WO2015119409A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions

Definitions

  • the present invention is an interior and exterior materials, an exterior case (Case), a housing (Housing), a body (body) and the like (hereinafter referred to as "metal base material") provided with metals such as automobiles, aircrafts, ships, and the like including mobile phones, notebook computers, and various electronic devices. ), More specifically, easy to oxidize such as magnesium, magnesium alloy, aluminum, aluminum alloy, titanium, titanium alloy, copper, copper alloy, silver, silver alloy (hereinafter referred to as "metal”). It gives durability and gives metal texture through surface treatment by forming a passivation layer, a dissimilar metal protective layer, a coating protective layer, etc., on the surface of a substrate made of a metal. The present invention relates to a technique capable of improving corrosion resistance, coating adhesion, and the like.
  • magnesium and magnesium alloy materials are lightweight and excellent in electromagnetic shielding and heat dissipation, and are widely used in various fields such as automobiles, aircrafts, ships, as well as computers, notebooks, cameras, mobile phones, and other electronic products and electronic devices.
  • the chemical treatment solution should be preferred in the range of pH 2.0 to 4.0, which is a strong acid treatment condition, for example, when the pH of the chemical treatment solution exceeds 7, the amount of film deposition due to the decrease in the oxidation power of permanganate ions is extremely high. Since it is reduced, the film has a problem in that sufficient corrosion resistance, coating adhesion, etc. cannot be obtained because of poor reliability of reproducing the film.
  • the present invention for solving the conventional problems as described above is a heterogeneous metal protective layer, such as a passivation layer, the coating film protection on the surface of the substrate provided with a metal that is easy to oxidize It is an object of the present invention to provide a metal substrate that can improve durability, corrosion resistance, coating film adhesion and the like through surface treatment for forming a layer or the like.
  • the metal substrate of the present invention has another object to provide a metal substrate that can form a dissimilar metal protective layer on the surface, thereby increasing the metal texture.
  • a passivation layer is formed on the surface of the metal substrate by reaction with the passivation solution in a state in which the metal substrate is deposited in an alcohol or ketone passivation solution heated to the passivation heat temperature. It is characterized by the fact that the giving step.
  • Another method for solving the problem of the present invention is characterized in that the alcohol (Alcohol) or ketone (Ketone) -based passivating solution is heated to the passivation heat temperature.
  • a passivation layer is formed on the surface of the metal substrate by reaction with the passivation solution in a state in which the metal substrate is deposited in an alcohol or ketone passivation solution heated to the passivation heat temperature. It is characterized by the fact that the giving step.
  • the present invention provides a surface treatment for forming a dissimilar metal protective layer, a coating film protective layer, etc., including a passivation layer, on a surface of a substrate provided with an easily oxidized metal. It provides an effect of improving durability, corrosion resistance, coating film adhesion, and the like.
  • the metal base of the present invention provides another effect of further enhancing the metal texture by forming a dissimilar metal protective layer on the surface thereof.
  • FIG. 1 is a first exemplary diagram schematically showing a process of the surface treatment for the metal substrate according to the present invention.
  • FIG. 2 is a diagram illustrating a second exemplary embodiment schematically showing a process of performing a surface treatment on a metal substrate according to the present invention.
  • FIG 3 is a third exemplary embodiment schematically showing a process of surface treatment for a metal substrate according to the present invention.
  • the metal substrate 100 includes an interior and exterior material, a case or a housing provided with a metal such as a mobile phone, a notebook computer, various electronic devices, an automobile, an aircraft, a ship, etc. It is applied to housing, body, etc. (hereinafter referred to as "metal base”), and it is applicable to aluminum, aluminum alloy, titanium, titanium alloy, copper, copper It is characterized by including a material such as alloy, silver, silver alloy (hereinafter referred to as "metal”), of course, the metal substrate 100 of the present invention is limited to the above-mentioned product and metal materials It should not be.
  • the metal substrate 100 may be formed by various processing methods such as die casting, injection, extrusion, rolling, pressing, or etching using the above-mentioned metal materials. It is characterized by.
  • the metal substrate 100 according to the present invention is heterogeneous including the passivation layer (also referred to as "floating behavior") 120a and 120b with respect to the surfaces 100a and 100b thereof.
  • the metal substrate 100 enhances the metal texture through a surface treatment for forming the metal protective layers 130a and 130b and the coating protective layers 130-1a and 130-1b.
  • it is characterized in that to improve the durability, corrosion resistance, flame resistance, rust resistance, coating film adhesion and the like.
  • the surface 100a means the outer surface of the target product, that is, the outer surface side, and the other surface 100b is It means the inner side of the product to be implemented.
  • the metal base 100 is magnesium (Mg) alone or in magnesium (Mg) Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be, and the like may be configured to include a magnesium alloy.
  • the metal base 100 may be aluminum (Al) alone or in aluminum (Al), Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be, and aluminum alloys may be included.
  • the metal substrate 100 may be copper (Cu) alone or copper (Cu) in Mg, Al, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be and copper alloys may be configured to be included.
  • the metal substrate 100 is titanium (Ti) alone or titanium (Ti) Mg, Al, Cu, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be, and titanium alloys may be included.
  • the metal base 100 is silver (Ag) alone or silver (Ag) in Mg, Al, Cu, Ti, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca It may be configured to include a silver alloy selected from at least one selected from, Li, Be.
  • the passivation layer (which will be described later), including difficulty of thin film processing through etching or the like, may be difficult. 120a, 120b) is also difficult to form, while on the other hand, if the thickness (t1) is too thick, the processability is easy, but the weight and volume are not only large, but also a factor that unnecessarily increases the material cost when applied to the target product. This can be
  • the thickness t1 it may be preferable to select and use the thickness t1 according to the chemical, physical properties and workability of the metal substrate 100, the purpose, the use thereof, and the product to be used.
  • the reliability test conditions for the metal substrate 100 according to the present invention including a constant temperature and humidity test carried out for 240 hours at a temperature of 60 °C, humidity 90%, 30 minutes at a temperature of -40 °C 30 minutes at 80 °C
  • the surface treatment technology is of paramount importance because there must be no deformation or deterioration in the cold / hot thermal shock test conducted over 100 cycles and the saline test conducted for 5 hours at 5% of saline.
  • the metal substrate 100 provided by the above-described processing method is a burner (Burner), a heater (Heater), etc.
  • the alcohol (Alcohol) or ketone (Pa) -based passivation solution 200 in the solution tank 300 is heated (or referred to as "heating") by the passivation heat temperature T1 by separate heating means. Step) is provided.
  • the metal substrate 100 is deposited (also referred to as "dipping") in the alcohol- or ketone-based passivation solution 200 heated to the passivation heat temperature T1, thereby providing the passivation solution ( And forming a passivation layer (120a, 120b) on the surface (100a, 100b) of the metal substrate 100 by the reaction with the (200).
  • the surfaces 100a and 100b of the metal substrate 100 on which the passivation layers 120a and 120b are formed may be protected, and further, the durability and the corrosion resistance may be improved.
  • the dissimilar metal protective layers 130a and 130b may be formed of a conductive metal, that is, Al, Cu, Ti, Ag, Ni, Si, or the like when the metal substrate 100 is made of magnesium (Mg) or a magnesium alloy. Any one or two or more selected from Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be and a mixture thereof are mixed to form a vacuum chamber of 10 -3 to 10 -6 Torr (this is also referred to as a "vacuum atmosphere"). It is characterized in that the vapor deposition formed in the).
  • the dissimilar metal protective layers 130a and 130b may be formed of conductive metals such as Mg, Cu, Ti, Ag, Ni, Si, when the metal substrate 100 is made of aluminum (Al) or an aluminum alloy. Any one or two or more selected from Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be and a mixture thereof are mixed to form a vacuum chamber of 10 -3 to 10 -6 Torr (this is also referred to as a "vacuum atmosphere"). It is characterized in that the vapor deposition formed in the).
  • the deposition means for forming the dissimilar metal protective layers 130a and 130b may include a sputtering deposition method using plasma, an electron beam deposition method, a thermal deposition method, It is preferable to use an ion plating deposition method or the like, but this should not be limited to the examples listed above.
  • the dissimilar metal protective layers 130a and 130b may be formed of conductive metals such as Al, Cu, Ti, Ag, Ni, and Si when the metal substrate 100 is made of magnesium (Mg) or a magnesium alloy. , Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be, any one or two or more selected from the mixture is characterized in that it is formed by wet plating in the atmosphere.
  • the dissimilar metal protective layers 130a and 130b may be formed of conductive metals such as Mg, Cu, Ti, Ag, Ni, and Si when the metal substrate 100 is made of aluminum (Al) or an aluminum alloy. , Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be, any one or two or more selected from the mixture is characterized in that it is formed by wet plating in the atmosphere.
  • a top coat protective layer 130-2a may be formed as a coating film having a thickness of 0.2 to 20 ⁇ m, as shown in FIG. 2. 130-2b), thereby preventing the metal substrate 100 from being deformed from strong ultraviolet rays and preventing scratches of the surfaces 100a and 100b, and furthermore, with durability, It will function to improve corrosion resistance and rust resistance.
  • the present invention as shown in Figure 3 attached as a means for protecting the surface (100a, 100b) of the metal substrate 100, the passivation layer (120a, 120b) is formed of the passivation layer (120a, 120b)
  • the coating protective layers 130-1a and 130-1b of thickness 0.2-20 micrometers are made into one layer or multiple layers according to the kind or characteristic of a product to be implemented.
  • Forming step which, as mentioned above, improves the metal (Metal) texture for the metal substrate 100, and improves durability, corrosion resistance and rust resistance, and further, from the strong ultraviolet light It will have a variety of functions to prevent the deterioration of the 100) and the scratching of the surface (100a, 100b).
  • the upper protective film (130-2a, 130-2b) with a coating film of 0.2 to 20 ⁇ m thickness on the coating film (130-1a, 130-1b) By further comprising the step of preventing the scratches of the surface (100a, 100b) while protecting the metal substrate 100 from deterioration from strong ultraviolet rays, and furthermore, durability, corrosion resistance and It will function to further improve the rust resistance.
  • the coating protective layers 130-1a and 130-1b and the upper protective layers 130-2a and 130-2b of the present invention are transparent or colored resins. Color), or the like. &Quot;
  • the coating film protective layers 130-1a and 130-1b and the top coating layers 130-2a and 130-2b of the present invention may have various colors on the metal substrate 100. It may be formed by including a paint composed of a white or colored pigment material or the like as a means for imparting or enhancing the metal texture.
  • the pigment material has a resistance against strong ultraviolet rays by incorporating at least one or more mineral natural inorganic pigments such as gold, silver, copper, nickel, zinc, titanium, iron, and chromium in an environmentally friendly manner. It may be desirable to have a weather resistance that prevents the phenomenon of discoloration or discoloration along with the enhancement.
  • white pigments have stable chemical properties and are not toxic, and particularly include TiO 2 (titanium dioxide) having a strong refractive index of 2.50 to 2.75, which is resistant to acid or ancale, and has a strong hiding power. It should not be limited to the cases listed above.
  • colored pigments include ZrO 2 (zirconia), ZnO (zinc oxide), BiOCl (bismuth chloride chloride) having a refractive index of 1.8 or more, or SiO 2 (silicon dioxide) having a refractive index of 1.8 or less, MgF 2 (magnesium fluoride), It should be included alone or two or more selected from Al 2 O 2 (alumina), but also should not be limited to the cases listed above.
  • the colored pigments it is possible to realize various colors such as BLACK, RED, BLUE, PINK, VIOLET, YELLOW, etc., which are harmless and nontoxic to the human body, including carbon black or chromium oxide green. It may further comprise a pigment material present.
  • the above-mentioned coating material is a means for forming the coating protective layers 130-1a and 130-1b and the upper protective layers 130-2a and 130-2b. It is preferable to form uniformly by coating process by any one selected from electrodeposition coating method, synthetic resin coating method, powder coating method, and electrostatic coating method using ( ⁇ ⁇ ). Should not.
  • the thickness of the coating film protective layer (130-1a, 130-1b) and the top coating layer (130-2a, 130-2b) is formed to 0.2 ⁇ m or less
  • the thicknesses of the coating protective layers 130-1a and 130-1b and the upper coating layers 130-2a and 130-2b may be formed of a metal substrate 100, that is, a material provided with metal. Depending on the chemical and physical properties, the purpose or use of the same, and the product to be used, the thickness thereof may be appropriately selected and formed so as not to be too thin or thick in the range of 0.2 to 20 ⁇ m.
  • the passivation layer (120a, 120b) formed on the surface (100a, 100b) of the metal substrate 100 has a thickness of 0.2 to 20 ⁇ m coating film protective layer (130-1a) , 130-1b) corresponding to 0.005 to 0.5 times the thickness, that is, characterized in that the configuration to form a 0.00l to 10 ⁇ m.
  • the thickness of the passivation layers 120a and 120b is formed to be 0.001 ⁇ m or less, there is an advantage that the damage to the surfaces 100a and 100b of the metal substrate 100 is small. Corrosion resistance may deteriorate because the film (or sometimes referred to as an “oxide”) is too thin. On the other hand, when the thickness is formed to a thickness of 10 ⁇ m or more, the corrosion resistance is excellent but the surfaces 100a and 100b are not. It can be seriously damaged.
  • the passivation layer (120a, 120b) thickness of the passivation heat temperature (T1) and the passivation solution to be heated in the solution tank 300 which will be described later, including the material of the metal substrate 100 (200) That is, it may vary depending on the type or deposition time of the reactant, but it will be desirable to form the thickness of 0.001 to 10 ⁇ m.
  • the passivation solution 200 included in the means for forming the passivation layers 120a and 120b on the surfaces 100a and 100b of the metal substrate 100 that is, the reaction material for forming the oxide film.
  • the volatile alcohol (Alcohol) -based material mixed with one or two or more selected from ethanol, methanol, isopropyl alcohol, butyl alcohol, octyl alcohol It is formulated to include.
  • the passivation solution 200 is a volatile ketone system mixed with any one or two or more selected from acetone, methyl ethyl ketone, methyl isobutyl ketone, and the like. It can be composed of materials.
  • the passivation heat temperature T1 included in the means for forming the passivation layers 120a and 120b on the surfaces 100a and 100b of the metal substrate 100 is applied to the solution tank 300.
  • the passivation solution 200 of the filled alcohol-based or ketone-based material is heated to a boiling point of 40 ° C. to a boiling point (also referred to as a “boiling point”). It would be desirable to facilitate the reaction for the formation of 120a, 120b).
  • the passivation heat temperature (T1) by heating the passivation solution 200 of the alcohol (Alcohol) or ketone (Ketone) material filled in the solution tank 300 to 40 to 220 °C, due to the passive layer ( It would be desirable to facilitate the reaction for the formation of 120a, 120b).
  • the passivation heat temperature T1 when the passivation heat temperature T1 is set to 40 ° C. or lower, the reaction of the passivation solution 200 is lowered, and the passivation layer is formed on the surfaces 100a and 100b and the structure pattern 110 of the metal substrate 100. (120a, 120b) may not be formed densely.
  • the passivation heat temperature (T1) is set higher than the boiling point or 220 ° C or higher, the passivation composition composed of alcohol or ketone-based volatile substance This is because not only is it economically disadvantageous because the evaporation of the solution 200 is severe and loss occurs, and there is a possibility that the uniform passivation layers 120a and 120b may not be formed.
  • ethanol when looking at the boiling point ( ⁇ ) of the alcohol-based reactants contained in the passivating solution 200, ethanol is 78.3 °C, methanol is 64.65 °C, isopropyl alcohol is 82 °C, butyl alcohol 117.7 °C, octyl alcohol is 194.5 ° C., while the boiling point of the ketone-based reactants included in the passivation solution 200 is 56.5 ° C., methylethyl ketone is 79.6 ° C., and methyl isobutyl ketone is 115.9 ° C.
  • the passivation heat temperature (T1) is appropriately selected in the range of 40 ° C. to boiling point or in the range of 40 to 220 ° C. according to the kind of the reactant which is selected by the composition alone or by mixing two or more thereof. It would be desirable to give.
  • the passivating solution heated to the passivation heat temperature T1 included in the means for forming the passivation layers 120a and 120b on the surfaces 100a and 100b of the metal substrate 100 may vary depending on the type of alcohol-based or ketone-based reactant mentioned above, which is characterized by depositing in the range of 1 second to 30 minutes.
  • the present invention will be preferably selected in the range of 1 second to 30 minutes.
  • the passivation layers 120a and 120b of the present invention formed as described above are coated with coatings including dissimilar metal protective layers 130a and 130b with improved corrosion resistance to the metal substrate 100.
  • the present invention is sufficient to remove the foreign matter on the surface (100a, 100b) through a sufficient degreasing and cleaning process before immersing the above-mentioned metal substrate 100 in the solution tank 300 filled with the passivating solution 200 It may be desirable to remove it.
  • the passivation solution 200 is not uniformly buried as a result of surface tension, and thus, the dense and stable passivation layers 120a and 120b. ) Can adversely affect the formation of.
  • the present invention forms the passivation layers 120a and 120b by immersing the metal substrate 100 in the passivation solution 200 for 1 second to 30 minutes, and then from the solution bath 300. It may further comprise the step of taking out to dry.
  • the passivation solution 200 is a volatile material, it may be naturally dried at room temperature, but may be preferably dried by infrared rays or hot air at a temperature of 20 to 60 ° C.
  • the present invention forms the passivation layers 120a and 120b by immersing the metal substrate 100 in the passivation solution 200 for 1 second to 30 minutes and then removes it from the solution tank 300 to 40 to By further comprising a heat treatment step carried out at 200 °C, through this to the drying on the metal substrate 100, the passivation layer (120a, 120b), that is to fix or stabilize the (oxidation) to the oxide film It would be desirable.
  • 130-1a, 130-1b coating film protective layer
  • 130-2a, 130-2b top coat protective layer

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Abstract

The present invention is applied to exterior and interior materials, external cases, housings, and bodies, etc., made of metal, in cellular phones, laptop computers, various electronic devices, vehicles, aircrafts, and ships, etc., and is capable of improving durability, corrosion resistance and coating adhesion, etc. while increasing metallic texture through surface treatment of forming a passivation layer, a heterogeneous metallic protective layer, and a coating protective layer, etc. on the surface and structure pattern of an easily oxidized metal base such as magnesium, magnesium alloy, aluminum, aluminum alloy, titanium, titanium alloy, copper, copper alloy, silver, silver alloy, etc. The present invention relates to a surface treatment method for a metal base made of any one among magnesium, magnesium alloy, aluminum, and aluminum alloy, the surface treatment method comprising the steps of: heating an alcohol-based or ketone-based passivation solution at a heat temperature for passivation treatment; and forming a passivation layer on the surface of the metal base through a reaction with the passivation solution in the state that the metal base is dipped into the alcohol-based or ketone-based passivation solution heated at the heat temperature for passivation treatment.

Description

금속기재의 표면처리방법Surface treatment method of metal base
본 발명은 휴대폰이나 노트북 및 각종 전자기기를 비롯한 자동차, 항공기, 선박 등의 금속으로 구비된 내외장재, 외장 케이스(Case)나 하우징(Housing), 바디(Body) 등(이하 "금속기재"라 한다.)에 적용되는 것으로, 좀 더 구체적으로는 마그네슘, 마그네슘 합금, 알루미늄, 알루미늄 합금, 티타늄, 티타늄 합금, 동, 동 합금, 은, 은 합금 등(이하 "금속"이라 한다.)과 같은 산화가 용이한 금속으로 구비된 기재의 표면에 대해 부동태층(不動態層)을 비롯한 이종(異種)금속 보호층, 도막(塗膜) 보호층 등을 형성시킨 표면처리를 통해서 금속 질감을 부여함과 함께 내구성, 내식성, 도막 밀착성 등을 향상시켜 줄 수 있도록 한 기술에 관한 것이다.The present invention is an interior and exterior materials, an exterior case (Case), a housing (Housing), a body (body) and the like (hereinafter referred to as "metal base material") provided with metals such as automobiles, aircrafts, ships, and the like including mobile phones, notebook computers, and various electronic devices. ), More specifically, easy to oxidize such as magnesium, magnesium alloy, aluminum, aluminum alloy, titanium, titanium alloy, copper, copper alloy, silver, silver alloy (hereinafter referred to as "metal"). It gives durability and gives metal texture through surface treatment by forming a passivation layer, a dissimilar metal protective layer, a coating protective layer, etc., on the surface of a substrate made of a metal. The present invention relates to a technique capable of improving corrosion resistance, coating adhesion, and the like.
근래 들어, 마그네슘이나 마그네슘 합금 소재는 경량이면서 전자파 차폐성 및 방열성 등이 우수하여 각종 전자제품이나 전자기기를 비롯한 컴퓨터, 노트북, 카메라, 휴대폰뿐만 아니라 자동차, 항공기, 선박 등 다양한 분야에 걸쳐 많이 사용되고 있다.In recent years, magnesium and magnesium alloy materials are lightweight and excellent in electromagnetic shielding and heat dissipation, and are widely used in various fields such as automobiles, aircrafts, ships, as well as computers, notebooks, cameras, mobile phones, and other electronic products and electronic devices.
하지만, 높은 산화성과 낮은 내식성 문제를 가진 마그네슘이나 마그네슘 합금 등과 같은 소재를 실용화하기 위해서는 필히, 별도의 표면처리를 하여야만 각종 내장부품 및 외장부품 등에 내구성을 확보할 수 있다.However, in order to practically use a material such as magnesium or magnesium alloy having high oxidative property and low corrosion resistance problem, it is necessary to separate surface treatment to secure durability to various interior parts and exterior parts.
한편, 한국공개특허 제2002-0077150호(2002년 10월 11일)로 공개된 '마그네슘합금용 화성처리액, 표면처리방법 및 마그네슘합금 기재'(이를 '문헌1'이라 한다.)가 이미 널리 알려져 있다.Meanwhile, the 'chemical treatment solution for magnesium alloy, surface treatment method and magnesium alloy base material' disclosed in Korean Laid-Open Patent Publication No. 2002-0077150 (October 11, 2002) (this is referred to as 'Document 1') is already widely used. Known.
상기 언급된 문헌1에 대해 살펴보면, 마그네슘 합금에 도장 밀착성, 내식성 및 녹 방지성을 부여하기 위한 수단으로 인산이온 및 과망간산 이온을 함유하고, pH가 1.5 내지 7인 것을 특징으로 하는 마그네슘 합금용 화성처리액과 표면처리방법을 제안하고 있다.Referring to the above-mentioned document 1, as a means for imparting paint adhesion, corrosion resistance, and rust prevention property to magnesium alloy, phosphate ions and permanganate ions are contained, and the pH is 1.5 to 7 for chemical conversion treatment. A solution and a surface treatment method are proposed.
하지만, 이와 같은 종래의 방법으로는 화성처리액이 강산성 처리 조건인 pH 2.0 내지 4.0 범위로 선호되어야 하기 때문에 예컨데, 화성처리액의 pH가 7을 초과하면 과망간산 이온의 산화력 저하로 인해 피막 석출량이 극단적으로 적어지게 되어, 피막의 재현 신뢰도가 떨어지기 때문에 충분한 내식성과 도막 밀착성 등을 얻을 수 없는 문제점을 가지고 있는 실정이다.However, in the conventional method, since the chemical treatment solution should be preferred in the range of pH 2.0 to 4.0, which is a strong acid treatment condition, for example, when the pH of the chemical treatment solution exceeds 7, the amount of film deposition due to the decrease in the oxidation power of permanganate ions is extremely high. Since it is reduced, the film has a problem in that sufficient corrosion resistance, coating adhesion, etc. cannot be obtained because of poor reliability of reproducing the film.
상기한 바와 같은 종래의 문제점을 해결하기 위한 본 발명은 산화가 용이한 금속으로 구비된 기재의 표면에 대해 부동태층(不動態層)을 비롯한 이종(異種)금속 보호층, 도막(塗膜) 보호층 등을 형성시켜 주는 표면처리를 통해서 내구성, 내식성, 도막 밀착성 등을 향상시켜 줄 수 있는 금속기재를 제공함에 그 목적이 있다.The present invention for solving the conventional problems as described above is a heterogeneous metal protective layer, such as a passivation layer, the coating film protection on the surface of the substrate provided with a metal that is easy to oxidize It is an object of the present invention to provide a metal substrate that can improve durability, corrosion resistance, coating film adhesion and the like through surface treatment for forming a layer or the like.
또한, 본 발명의 금속기재는 그 표면에 이종(異種)금속 보호층을 형성시켜, 이로 인해 금속(Metal) 질감을 높여 줄 수 있는 금속기재를 제공함에 또 다른 목적이 있다.In addition, the metal substrate of the present invention has another object to provide a metal substrate that can form a dissimilar metal protective layer on the surface, thereby increasing the metal texture.
상기한 바와 같은 본 발명의 과제를 해결하기 위한 방법으로는 마그네슘, 마그네슘 합금, 알루미늄, 알루미늄 합금 중에서 어느 하나로 구비된 금속기재의 표면처리방법에 있어서, 알코올(Alcohol)계 또는 케톤(Ketone)계의 부동태 용액을 부동태처리 열온도로 가열시켜 주는 단계가 구비된 것을 그 특징으로 한다.As a method for solving the problems of the present invention as described above, in the surface treatment method of a metal substrate provided with any one of magnesium, magnesium alloy, aluminum, aluminum alloy, alcohol (Alcohol) or ketone (Ketone) of It is characterized in that the step of heating the passivating solution to the passivation heat temperature.
그리고, 상기 부동태처리 열온도로 가열된 알코올계 또는 케톤계의 부동태 용액에 금속기재를 침적시킨 상태에서 상기 부동태 용액과의 반응에 의해 상기 금속기재의 표면에 부동태층(不動態層)을 형성시켜 주는 단계가 포함된 것을 그 특징으로 한다.In addition, a passivation layer is formed on the surface of the metal substrate by reaction with the passivation solution in a state in which the metal substrate is deposited in an alcohol or ketone passivation solution heated to the passivation heat temperature. It is characterized by the fact that the giving step.
한편, 본 발명의 과제를 해결하기 위한 또 다른 방법으로는 알코올(Alcohol)계 또는 케톤(Ketone)계의 부동태 용액을 부동태처리 열온도로 가열시켜 주는 단계가 구비된 것을 그 특징으로 한다.On the other hand, another method for solving the problem of the present invention is characterized in that the alcohol (Alcohol) or ketone (Ketone) -based passivating solution is heated to the passivation heat temperature.
그리고, 상기 부동태처리 열온도로 가열된 알코올계 또는 케톤계의 부동태 용액에 금속기재를 침적시킨 상태에서 상기 부동태 용액과의 반응에 의해 상기 금속기재의 표면에 부동태층(不動態層)을 형성시켜 주는 단계가 포함된 것을 그 특징으로 한다.In addition, a passivation layer is formed on the surface of the metal substrate by reaction with the passivation solution in a state in which the metal substrate is deposited in an alcohol or ketone passivation solution heated to the passivation heat temperature. It is characterized by the fact that the giving step.
이하, 본 발명이 해결하고자 하는 과제에 대한 구성수단 및 다양한 과정들은 첨부한 도면에 나타난 다양한 일실시사례들의 상세한 설명을 통해서 보다 더 명백하여 질 것이다.Hereinafter, the construction means and various processes for the problem to be solved by the present invention will become more apparent from the detailed description of the various embodiments shown in the accompanying drawings.
이와 같이 본 발명은 산화가 용이한 금속으로 구비된 기재의 표면에 대해 부동태층(不動態層)을 비롯한 이종(異種)금속 보호층, 도막(塗膜) 보호층 등을 형성시켜 주는 표면처리를 통해서 내구성, 내식성, 도막 밀착성 등을 향상시켜 주는 효과를 제공한다.As described above, the present invention provides a surface treatment for forming a dissimilar metal protective layer, a coating film protective layer, etc., including a passivation layer, on a surface of a substrate provided with an easily oxidized metal. It provides an effect of improving durability, corrosion resistance, coating film adhesion, and the like.
또한, 본 발명의 금속기재는 그 표면에 이종(異種)금속 보호층을 형성시켜 주는 것에 의해 금속(Metal) 질감을 한층 더 높여 주는 또 다른 효과를 제공한다.In addition, the metal base of the present invention provides another effect of further enhancing the metal texture by forming a dissimilar metal protective layer on the surface thereof.
도 1은 본 발명에 따른 금속기재에 대한 표면처리가 이루어지는 과정을 개략적으로 나타낸 제1실시사례 도면이다.1 is a first exemplary diagram schematically showing a process of the surface treatment for the metal substrate according to the present invention.
도 2은 본 발명에 따른 금속기재에 대한 표면처리가 이루어지는 과정을 개략적으로 나타낸 제2실시사례 도면이다.2 is a diagram illustrating a second exemplary embodiment schematically showing a process of performing a surface treatment on a metal substrate according to the present invention.
도 3은 본 발명에 따른 금속기재에 대한 표면처리가 이루어지는 과정을 개략적으로 나타낸 제3실시사례 도면이다.3 is a third exemplary embodiment schematically showing a process of surface treatment for a metal substrate according to the present invention.
본 발명의 구체적인 실시사례를 설명함에 있어서, 본 발명의 도면에 의해 도시되어 있고, 이에 따른 구성수단과 동작들은 적어도 하나의 일실시 사례로써 설명되는 것이며, 이것에 의해서 본 발명의 기술적 사상과 그 핵심적인 구성수단 및 일실시 사례들이 제한받지는 않아야 할 것이다.In describing specific embodiments of the present invention, illustrated by the drawings of the present invention, the constituent means and operations are described as at least one embodiment, whereby the technical spirit and core of the present invention. It is to be understood that certain components and practices are not limited.
참고할 사항으로, 본 발명에서 설명되는 각 도면들에 부호를 표기함에 있어서 동일한 구성요소는 비록 다른 도면에 표기되더라도 동일한 부호를 부여하였음에 특히 유의하여야 할 것이다.For reference, in designating reference numerals in the drawings described in the present invention, it should be noted that the same components are given the same reference numerals even though they are shown in different drawings.
이하, 첨부된 도 1 내지 도 3에 나타낸 도면들을 참조하여 본 발명을 상세하게 설명하기로 한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings shown in FIGS. 1 to 3.
본 발명에 따른 금속기재(100)는 휴대폰이나 노트북 및 각종 전자기기를 비롯한 자동차, 항공기, 선박 등(이하 "실시대상 제품"이라 한다.)의 금속으로 구비된 내외장재, 외장 케이스(Case)나 하우징(Housing), 바디(Body) 등(이하 "금속기재"라 한다.)에 적용되는 것으로, 이는 표면 산화가 용이한 마그네슘, 마그네슘 합금을 포함하여 알루미늄, 알루미늄 합금, 티타늄, 티타늄 합금, 동, 동 합금, 은, 은 합금 등(이하 "금속"이라 한다.)과 같은 소재를 포함하는 것을 그 특징으로 하되, 물론 본 발명의 금속기재(100)는 위에 언급된 실시대상 제품 및 금속 소재들로 한정되어서는 아니 될 것이다.The metal substrate 100 according to the present invention includes an interior and exterior material, a case or a housing provided with a metal such as a mobile phone, a notebook computer, various electronic devices, an automobile, an aircraft, a ship, etc. It is applied to housing, body, etc. (hereinafter referred to as "metal base"), and it is applicable to aluminum, aluminum alloy, titanium, titanium alloy, copper, copper It is characterized by including a material such as alloy, silver, silver alloy (hereinafter referred to as "metal"), of course, the metal substrate 100 of the present invention is limited to the above-mentioned product and metal materials It should not be.
또한, 본 발명에 있어서 금속기재(100)는 상기 언급된 금속 소재를 활용하여 다이캐스팅(Die Casting)이나 사출, 압출, 압연, 프레스 또는 연마(Etching) 등과 같은 다양한 가공방식으로 그 형상이 구비되는 것을 그 특징으로 한다.In addition, in the present invention, the metal substrate 100 may be formed by various processing methods such as die casting, injection, extrusion, rolling, pressing, or etching using the above-mentioned metal materials. It is characterized by.
더불어, 본 발명에 따른 금속기재(100)는 그 표면(100a, 100b)에 대해 부동태층(不動態層 ; 이를 "부동태(不動態)"라고도 한다.)(120a, 120b)을 비롯한 이종(異種)금속 보호층(130a, 130b), 도막(塗膜) 보호층(130-1a, 130-1b) 등을 형성시켜 주는 표면처리를 통해서 상기 금속기재(100)로 하여금 금속(Metal) 질감을 높여줌과 함께 내구성, 내식성, 내염성, 방청성, 도막 밀착성 등을 향상시켜 줄 수 있도록 한 것을 그 특징으로 한다.In addition, the metal substrate 100 according to the present invention is heterogeneous including the passivation layer (also referred to as "floating behavior") 120a and 120b with respect to the surfaces 100a and 100b thereof. The metal substrate 100 enhances the metal texture through a surface treatment for forming the metal protective layers 130a and 130b and the coating protective layers 130-1a and 130-1b. In addition, it is characterized in that to improve the durability, corrosion resistance, flame resistance, rust resistance, coating film adhesion and the like.
아울러, 본 발명에 따른 금속기재(100)를 상기 언급된 실시대상 제품에 적용함에 있어서 표면(100a)은 상기 실시대상 제품의 외관 즉, 외측면 쪽을 의미하게 되고, 또 다른 표면(100b)은 상기 실시대상 제품의 내측면 쪽을 의미하게 된다.In addition, in applying the metal substrate 100 according to the present invention to the above-mentioned target product, the surface 100a means the outer surface of the target product, that is, the outer surface side, and the other surface 100b is It means the inner side of the product to be implemented.
한편, 본 발명에 있어서 상기 금속기재(100)는 마그네슘(Mg) 단독이거나 또는 마그네슘(Mg)에 Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 적어도 어느 하나 이상 선택된 마그네슘 합금을 포함하여 구성될 수 있다.On the other hand, in the present invention, the metal base 100 is magnesium (Mg) alone or in magnesium (Mg) Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be, and the like may be configured to include a magnesium alloy.
또한, 본 발명에 있어서 상기 금속기재(100)는 알루미늄(Al) 단독이거나 또는 알루미늄(Al)에 Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 적어도 어느 하나 이상 선택된 알루미늄 합금을 포함하여 구성될 수 있다.In addition, in the present invention, the metal base 100 may be aluminum (Al) alone or in aluminum (Al), Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be, and aluminum alloys may be included.
또한, 본 발명에 있어서 상기 금속기재(100)는 동(Cu) 단독이거나 또는 동(Cu)에 Mg, Al, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 적어도 어느 하나 이상 선택된 동 합금을 포함하여 구성될 수 있다.In addition, in the present invention, the metal substrate 100 may be copper (Cu) alone or copper (Cu) in Mg, Al, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be and copper alloys may be configured to be included.
또한, 본 발명에 있어서 상기 금속기재(100)는 티타늄(Ti) 단독이거나 또는 티타늄(Ti)에 Mg, Al, Cu, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 적어도 어느 하나 이상 선택된 티타늄 합금을 포함하여 구성될 수 있다.In addition, in the present invention, the metal substrate 100 is titanium (Ti) alone or titanium (Ti) Mg, Al, Cu, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca At least one selected from among Li, Be, and titanium alloys may be included.
또한, 본 발명에 있어서 상기 금속기재(100)는 은(Ag) 단독이거나 또는 은(Ag)에 Mg, Al, Cu, Ti, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 적어도 어느 하나 이상 선택된 은 합금을 포함하여 구성될 수 있다.In addition, in the present invention, the metal base 100 is silver (Ag) alone or silver (Ag) in Mg, Al, Cu, Ti, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca It may be configured to include a silver alloy selected from at least one selected from, Li, Be.
더 나아가서, 본 발명에 있어서 상기 금속기재(100)에 대한 두께(t1)는 너무 얇게 할 경우에는 연마(Etching) 등을 통한 박막(薄膜) 가공의 어려움을 비롯하여, 후술(後述)되는 부동태층(120a, 120b)의 형성에도 어려움이 따르게 되고, 반면에 그 두께(t1)를 너무 두껍게 하면 가공성은 용이하나 중량감이나 부피 등이 커질 뿐만 아니라 실시대상 제품에 적용시 소요 자재비를 불필요하게 증가시켜 주는 요인이 될 수 있다.Furthermore, in the present invention, when the thickness t1 of the metal substrate 100 is too thin, the passivation layer (which will be described later), including difficulty of thin film processing through etching or the like, may be difficult. 120a, 120b) is also difficult to form, while on the other hand, if the thickness (t1) is too thick, the processability is easy, but the weight and volume are not only large, but also a factor that unnecessarily increases the material cost when applied to the target product. This can be
따라서, 본 발명은 금속기재(100)의 화학적, 물리적인 특성 및 가공성 등을 비롯하여 이를 사용하는 목적이나 용도 및 실시대상 제품 등에 따라 그 두께(t1)를 선정하여 사용하는 것이 바람직할 것이다.Therefore, in the present invention, it may be preferable to select and use the thickness t1 according to the chemical, physical properties and workability of the metal substrate 100, the purpose, the use thereof, and the product to be used.
한편, 본 발명에 따른 금속기재(100)에 대한 신뢰성 테스트 조건으로는 온도 60℃, 습도 90%에서 240시간 동안 실시되는 항온항습 테스트를 비롯하여, 온도 -40℃의 30분에서 80℃의 30분 동안까지 100사이클(Cycle)에 걸쳐 실시되는 냉온 열충격 테스트, 그리고 염수 5%에서 120시간 동안 실시되는 내염수 테스트에서 변형이나 변질이 없어야 하기 때문에 그 표면처리 기술이 무엇보다 중요시되고 있는 실정이다.On the other hand, the reliability test conditions for the metal substrate 100 according to the present invention, including a constant temperature and humidity test carried out for 240 hours at a temperature of 60 ℃, humidity 90%, 30 minutes at a temperature of -40 ℃ 30 minutes at 80 ℃ The surface treatment technology is of paramount importance because there must be no deformation or deterioration in the cold / hot thermal shock test conducted over 100 cycles and the saline test conducted for 5 hours at 5% of saline.
이와 같은 본 발명에 따른 과제를 해결하기 위한 금속기재(100)의 구성수단 및 표면처리방법에 대해 첨부된 도면들을 참조하여 그 일실시사례를 구체적으로 살펴보기로 한다.With reference to the accompanying drawings for the constituent means and the surface treatment method of the metal substrate 100 for solving the problems according to the present invention will be described in detail one embodiment.
먼저, 첨부된 도 1 내지 도 3에 나타낸 바와 같이 본 발명의 일실시사례에 대해 살펴보면, 예컨데 상기 언급된 가공방식에 의해 구비된 금속기재(100)는 버너(Burner), 히터(Heater) 등과 같은 별도의 가열수단에 의해 용액조(300)에서 알코올(Alcohol)계 또는 케톤(Ketone)계의 부동태 용액(200)을 부동태처리 열온도(T1)로 가열(또는 "히팅(Heating)"이라고도 한다.)시켜 주는 단계가 구비된다.First, referring to an embodiment of the present invention as shown in Figures 1 to 3 attached, for example, the metal substrate 100 provided by the above-described processing method is a burner (Burner), a heater (Heater), etc. The alcohol (Alcohol) or ketone (Pa) -based passivation solution 200 in the solution tank 300 is heated (or referred to as "heating") by the passivation heat temperature T1 by separate heating means. Step) is provided.
그리고, 상기 부동태처리 열온도(T1)로 가열된 알코올계 또는 케톤계의 부동태 용액(200)에 금속기재(100)를 침적(이를 "디핑(Dipping)"이라고도 한다.)시켜, 상기 부동태 용액(200)과의 반응에 의해 상기 금속기재(100)의 표면(100a, 100b)에 부동태층(不動態層)(120a, 120b)을 형성시켜 주는 단계를 포함하여 구비된 것을 그 특징으로 한다.In addition, the metal substrate 100 is deposited (also referred to as "dipping") in the alcohol- or ketone-based passivation solution 200 heated to the passivation heat temperature T1, thereby providing the passivation solution ( And forming a passivation layer (120a, 120b) on the surface (100a, 100b) of the metal substrate 100 by the reaction with the (200).
한편, 첨부된 도 1에 나타낸 바와 같이 상기 부동태층(120a, 120b)이 형성된 금속기재(100)의 표면(100a, 100b)을 보호하고, 더 나아가서는 내구성 및 내식성 등의 향상은 물론 금속(Metal) 질감을 높여 주기 위한 수단으로 상기 부동태층(120a, 120b)의 적어도 어느 한쪽(120a) 또는 양쪽(120a, 120b) 위에는 금속기재(100)와는 도전율이 다른 이종(異種)금속 보호층(130a, 130b)을 형성시켜 주는 단계를 포함하되, 상기 이종(異種)금속 보호층(130a, 130b)은 실시대상 제품의 종류나 특성에 따라 한층 또는 다층으로 형성시켜 주는 것이 바람직할 것이다.Meanwhile, as shown in FIG. 1, the surfaces 100a and 100b of the metal substrate 100 on which the passivation layers 120a and 120b are formed may be protected, and further, the durability and the corrosion resistance may be improved. A dissimilar metal protective layer 130a having a different conductivity from that of the metal base 100 on at least one side 120a or both sides 120a and 120b of the passivation layers 120a and 120b. 130b), but the dissimilar metal protective layers 130a and 130b may be preferably formed in one or multiple layers according to the type or characteristics of the target product.
예컨데, 상기 이종(異種)금속 보호층(130a, 130b)은 금속기재(100)가 마그네슘(Mg) 또는 마그네슘 합금으로 구비될 경우에는 도전성 금속 즉, Al이나 Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 혼합하여 10-3 내지 10-6 Torr의 진공 챔버(Chamber)(이를 "진공 분위기"라고도 한다.)에서 증착 형성시켜 주는 것을 그 특징으로 한다.For example, the dissimilar metal protective layers 130a and 130b may be formed of a conductive metal, that is, Al, Cu, Ti, Ag, Ni, Si, or the like when the metal substrate 100 is made of magnesium (Mg) or a magnesium alloy. Any one or two or more selected from Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be and a mixture thereof are mixed to form a vacuum chamber of 10 -3 to 10 -6 Torr (this is also referred to as a "vacuum atmosphere"). It is characterized in that the vapor deposition formed in the).
또한, 상기 이종(異種)금속 보호층(130a, 130b)은 금속기재(100)가 알루미늄(Al) 또는 알루미늄 합금으로 구비될 경우에는 도전성 금속 즉, Mg나 Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 혼합하여 10-3 내지 10-6 Torr의 진공 챔버(Chamber)(이를 "진공 분위기"라고도 한다.)에서 증착 형성시켜 주는 것을 그 특징으로 한다.In addition, the dissimilar metal protective layers 130a and 130b may be formed of conductive metals such as Mg, Cu, Ti, Ag, Ni, Si, when the metal substrate 100 is made of aluminum (Al) or an aluminum alloy. Any one or two or more selected from Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be and a mixture thereof are mixed to form a vacuum chamber of 10 -3 to 10 -6 Torr (this is also referred to as a "vacuum atmosphere"). It is characterized in that the vapor deposition formed in the).
그리고, 상기 이종(異種)금속 보호층(130a, 130b)을 형성시켜 주기 위한 증착 수단으로는 플라즈마(Plasma)에 의한 스퍼터링(Sputtering) 증착법을 비롯하여 전자빔(Electron Beam) 증착법, 열(Thermal) 증착법, 이온플레이팅(Ion Plating) 증착 법 등을 사용하여 이루어지는 것이 바람직하나, 이는 앞에서 열거한 사례들로 제한받지는 않아야 할 것이다.The deposition means for forming the dissimilar metal protective layers 130a and 130b may include a sputtering deposition method using plasma, an electron beam deposition method, a thermal deposition method, It is preferable to use an ion plating deposition method or the like, but this should not be limited to the examples listed above.
또한, 상기 이종(異種)금속 보호층(130a, 130b)은 금속기재(100)가 마그네슘(Mg) 또는 마그네슘 합금으로 구비될 경우에 있어서 도전성 금속 즉, Al이나 Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 혼합하여 대기 중에서 습식 도금으로 형성시켜 주는 것을 그 특징으로 한다.In addition, the dissimilar metal protective layers 130a and 130b may be formed of conductive metals such as Al, Cu, Ti, Ag, Ni, and Si when the metal substrate 100 is made of magnesium (Mg) or a magnesium alloy. , Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be, any one or two or more selected from the mixture is characterized in that it is formed by wet plating in the atmosphere.
또한, 상기 이종(異種)금속 보호층(130a, 130b)은 금속기재(100)가 알루미늄(Al) 또는 알루미늄 합금으로 구비될 경우에 있어서 도전성 금속 즉, Mg나 Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 혼합하여 대기 중에서 습식 도금으로 형성시켜 주는 것을 그 특징으로 한다.In addition, the dissimilar metal protective layers 130a and 130b may be formed of conductive metals such as Mg, Cu, Ti, Ag, Ni, and Si when the metal substrate 100 is made of aluminum (Al) or an aluminum alloy. , Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be, any one or two or more selected from the mixture is characterized in that it is formed by wet plating in the atmosphere.
더불어, 상기 이종(異種)금속 보호층(130a, 130b) 위에는 첨부된 도 2에 나타낸 바와 같이 두께 0.2 내지 20㎛의 도막(塗膜)으로 상도막(上塗膜) 보호층(130-2a, 130-2b) 을 형성시켜 주는 단계를 포함하여, 이로 인해 금속기재(100)를 강한 자외선으로부터 변질을 보호함과 함께 표면(100a, 100b)의 긁힘을 방지하고, 더 나아가서 내지문성과 함께 내구성, 내식성 및 방청성 등을 향상시켜 주는 기능을 하게 된다.In addition, on the dissimilar metal protective layers 130a and 130b, a top coat protective layer 130-2a may be formed as a coating film having a thickness of 0.2 to 20 μm, as shown in FIG. 2. 130-2b), thereby preventing the metal substrate 100 from being deformed from strong ultraviolet rays and preventing scratches of the surfaces 100a and 100b, and furthermore, with durability, It will function to improve corrosion resistance and rust resistance.
한편, 본 발명은 상기 부동태층(120a, 120b)이 형성된 금속기재(100)의 표면(100a, 100b)을 보호하기 위한 수단으로 첨부된 도 3에 나타낸 바와 같이 상기 부동태층(120a, 120b)의 적어도 어느 한쪽(120a) 또는 양쪽(120a, 120b) 위에는 두께 0.2 내지 20㎛의 도막(塗膜) 보호층(130-1a, 130-1b)을 실시대상 제품의 종류나 특성에 따라 한층 또는 다층으로 형성시켜 주는 단계를 포함하되, 이는 앞에서 언급된 바와 같이 금속기재(100)에 대한 금속(Metal) 질감을 높여 줌과 함께 내구성, 내식성 및 방청성 등을 향상시켜 주고, 더 나아가서 강한 자외선으로부터 금속기재(100)의 변질과 표면(100a, 100b)의 긁힘을 방지하여 주는 다양한 기능을 하게 된다.On the other hand, the present invention as shown in Figure 3 attached as a means for protecting the surface (100a, 100b) of the metal substrate 100, the passivation layer (120a, 120b) is formed of the passivation layer (120a, 120b) On at least one side 120a or both sides 120a and 120b, the coating protective layers 130-1a and 130-1b of thickness 0.2-20 micrometers are made into one layer or multiple layers according to the kind or characteristic of a product to be implemented. Forming step, which, as mentioned above, improves the metal (Metal) texture for the metal substrate 100, and improves durability, corrosion resistance and rust resistance, and further, from the strong ultraviolet light It will have a variety of functions to prevent the deterioration of the 100) and the scratching of the surface (100a, 100b).
이때, 상기 도막(塗膜) 보호층(130-1a, 130-1b) 위에는 두께 0.2 내지 20㎛의 도막(塗膜)으로 상도막(上塗膜) 보호층(130-2a, 130-2b)을 추가로 형성시켜 주는 단계를 포함하여 줌으로써, 상기 금속기재(100)를 강한 자외선으로부터 변질을 보호함과 함께 표면(100a, 100b)의 긁힘을 방지하고, 더 나아가서 내지문성을 비롯한 내구성, 내식성 및 방청성 등을 더욱 향상시켜 주는 기능을 하게 된다.At this time, the upper protective film (130-2a, 130-2b) with a coating film of 0.2 to 20㎛ thickness on the coating film (130-1a, 130-1b) By further comprising the step of preventing the scratches of the surface (100a, 100b) while protecting the metal substrate 100 from deterioration from strong ultraviolet rays, and furthermore, durability, corrosion resistance and It will function to further improve the rust resistance.
이와 같은 본 발명의 도막(塗膜) 보호층(130-1a, 130-1b), 상도막(上塗膜) 보호층(130-2a, 130-2b)은 투명 또는 유색수지(이를 "칼라(Color)수지"라고도 한다.) 등으로 구성된 도료(塗料)를 포함하여 형성될 수 있다.The coating protective layers 130-1a and 130-1b and the upper protective layers 130-2a and 130-2b of the present invention are transparent or colored resins. Color), or the like. &Quot;
또한, 본 발명의 도막(塗膜) 보호층(130-1a, 130-1b), 상도막(上塗膜) 보호층(130-2a, 130-2b)은 금속기재(100)에 다양한 색상을 부여하거나 또는 금속 질감을 높여 주기 위한 수단으로 백색 또는 유색의 안료물질 등으로 구성된 도료(塗料)를 포함하여 형성될 수 있다.In addition, the coating film protective layers 130-1a and 130-1b and the top coating layers 130-2a and 130-2b of the present invention may have various colors on the metal substrate 100. It may be formed by including a paint composed of a white or colored pigment material or the like as a means for imparting or enhancing the metal texture.
상기 안료물질에는 친환경 차원에서 금, 은, 구리, 니켈, 아연, 티타늄, 철, 크롬 등과 같은 광물성의 천연 무기안료를 적어도 1종 이상 포함시켜 주는 것에 의해 금속기재(100)로 하여금 강한 자외선으로부터 저항력을 강화시켜 줌과 함께 탈색이나 변색되는 현상을 방지하여 주는 내후성을 가질 수 있도록 하는 것이 바람직할 것이다.The pigment material has a resistance against strong ultraviolet rays by incorporating at least one or more mineral natural inorganic pigments such as gold, silver, copper, nickel, zinc, titanium, iron, and chromium in an environmentally friendly manner. It may be desirable to have a weather resistance that prevents the phenomenon of discoloration or discoloration along with the enhancement.
예컨데, 상기 안료물질 중에서 백색안료에는 화학적 성질이 안정되고 독성이 없으며, 특히 산이나 안칼리에 대한 저항성 및 착색력, 은폐력이 강한 굴절율이 2.50 내지 2.75 범위의 TiO2(이산화티타늄)를 포함하되, 이는 앞에서 열거된 사례들로 제한받지는 않아야 할 것이다.For example, among the pigment materials, white pigments have stable chemical properties and are not toxic, and particularly include TiO 2 (titanium dioxide) having a strong refractive index of 2.50 to 2.75, which is resistant to acid or ancale, and has a strong hiding power. It should not be limited to the cases listed above.
또한, 상기 안료물질 중에서 유색안료에는 굴절율이 1.8 이상인 ZrO2(지르코니아), ZnO(산화아연), BiOCl(산화염화비스무스) 또는 굴절율이 1.8 이하인 SiO2(이산화규소), MgF2(불화마그네슘), Al2O2(알루미나) 중에서 선택된 단독 또는 2종 이상 포함하되, 이 또한 앞에서 열거된 사례들로 제한받지는 않아야 할 것이다.Further, among the pigment materials, colored pigments include ZrO 2 (zirconia), ZnO (zinc oxide), BiOCl (bismuth chloride chloride) having a refractive index of 1.8 or more, or SiO 2 (silicon dioxide) having a refractive index of 1.8 or less, MgF 2 (magnesium fluoride), It should be included alone or two or more selected from Al 2 O 2 (alumina), but also should not be limited to the cases listed above.
더불어, 상기 유색안료 중에는 카본블랙(Carbon Black)이나 크롬 옥사이드 그린(Chromium Oxide Green) 등을 비롯한 인체에 무해하고 무독성을 가진 예컨데 BLACK, RED, BLUE, PINK, VIOLET, YELLOW 등과 같은 다양한 색상을 구현할 수 있는 안료물질들을 더 포함하여 구성될 수 있다.In addition, among the colored pigments, it is possible to realize various colors such as BLACK, RED, BLUE, PINK, VIOLET, YELLOW, etc., which are harmless and nontoxic to the human body, including carbon black or chromium oxide green. It may further comprise a pigment material present.
이와 같이 상기 도막(塗膜) 보호층(130-1a, 130-1b), 상도막(上塗膜) 보호층(130-2a, 130-2b)을 형성시켜 주기 위한 수단으로는 상기 언급된 도료(塗料)를 사용하여 전착 도장법이나 합성수지 도장법, 분체 도장법, 정전 도장법 중에서 선택된 어느 하나에 의해 도막(塗膜)처리로 균일하게 형성시켜 주는 것이 바람직하나, 이 또한 앞에서 열거된 사례들로 제한받지는 않아야 할 것이다.As described above, the above-mentioned coating material is a means for forming the coating protective layers 130-1a and 130-1b and the upper protective layers 130-2a and 130-2b. It is preferable to form uniformly by coating process by any one selected from electrodeposition coating method, synthetic resin coating method, powder coating method, and electrostatic coating method using (이 料). Should not.
더불어, 본 발명에 있어서 상기 도막 보호층(130-1a, 130-1b), 상도막(上塗膜) 보호층(130-2a, 130-2b)의 두께를 0.2㎛ 이하로 형성할 경우에는 금속 질감을 잘 살려 주는 장점은 있으나, 이는 도막의 두께가 너무 얇기 때문에 보호성이 떨어질 우려가 있고, 반면에 그 두께를 20㎛ 이상으로 두껍게 형성할 경우에는 내구성 및 내식성 등은 우수하나 금속 질감을 저하시 킬 우려가 있을 수 있다.In addition, in the present invention, when the thickness of the coating film protective layer (130-1a, 130-1b) and the top coating layer (130-2a, 130-2b) is formed to 0.2㎛ or less Although there is an advantage of utilizing the texture well, this is because the thickness of the coating film is too thin, there is a risk of falling protection, while when the thickness is formed thicker than 20㎛ excellent durability and corrosion resistance, but deteriorates the metal texture There may be concern.
따라서, 상기 도막 보호층(130-1a, 130-1b), 상도막(上塗膜) 보호층(130-2a, 130-2b)의 두께는 금속기재(100) 즉, 금속으로 구비된 소재의 화학적, 물리적인 특성을 비롯하여 이를 사용하는 목적이나 용도 및 실시대상 제품 등에 따라 그 두께를 0.2 내지 20㎛ 범위에서 너무 얇거나 두껍지 않도록 적합하게 선택하여 형성시켜 주는 것이 바람직할 것이다.Therefore, the thicknesses of the coating protective layers 130-1a and 130-1b and the upper coating layers 130-2a and 130-2b may be formed of a metal substrate 100, that is, a material provided with metal. Depending on the chemical and physical properties, the purpose or use of the same, and the product to be used, the thickness thereof may be appropriately selected and formed so as not to be too thin or thick in the range of 0.2 to 20 μm.
한편, 본 발명에 있어서 상기 금속기재(100)의 표면(100a, 100b)에 형성되는 부동태층(120a, 120b)의 두께는 0.2 내지 20㎛로 형성되는 도막(塗膜) 보호층(130-1a, 130-1b) 두께의 0.005 내지 0.5배에 해당하는 즉, 0.00l 내지 10㎛로 형성시켜 주는 구성을 그 특징으로 한다.On the other hand, in the present invention, the passivation layer (120a, 120b) formed on the surface (100a, 100b) of the metal substrate 100 has a thickness of 0.2 to 20㎛ coating film protective layer (130-1a) , 130-1b) corresponding to 0.005 to 0.5 times the thickness, that is, characterized in that the configuration to form a 0.00l to 10㎛.
다시 말해서, 본 발명은 상기 부동태층(120a, 120b)의 두께를 0.001㎛ 이하로 얇게 형성시켜 줄 경우에는 금속기재(100)의 표면(100a, 100b)에 대한 훼손이 적은 장점은 있으나, 이는 산화 피막(또는 "산화막"이라고도 한다.)이 너무 얇게 형성되기 때문에 내식성이 떨어질 우려가 있고, 반면에 그 두께를 10㎛ 이상으로 두껍게 형성시켜 줄 경우에는 내식성은 우수하나 상기 표면(100a, 100b)이 심하게 훼손될 우려가 있을 수 있다.In other words, when the thickness of the passivation layers 120a and 120b is formed to be 0.001 μm or less, there is an advantage that the damage to the surfaces 100a and 100b of the metal substrate 100 is small. Corrosion resistance may deteriorate because the film (or sometimes referred to as an “oxide”) is too thin. On the other hand, when the thickness is formed to a thickness of 10 μm or more, the corrosion resistance is excellent but the surfaces 100a and 100b are not. It can be seriously damaged.
따라서, 본 발명에 있어서 상기 부동태층(120a, 120b)의 두께는 금속기재(100)의 재질을 비롯하여 후술(後述)되는 용액조(300)에서 가열시켜 주는 부동태처리 열온도(T1) 및 부동태 용액(200) 즉, 반응물질의 종류나 침적시간 등에 따라 달라질 수 있으나, 그 두께를 0.001 내지 10㎛로 형성시켜 주는 것이 바람직할 것이다.Therefore, in the present invention, the passivation layer (120a, 120b) thickness of the passivation heat temperature (T1) and the passivation solution to be heated in the solution tank 300, which will be described later, including the material of the metal substrate 100 (200) That is, it may vary depending on the type or deposition time of the reactant, but it will be desirable to form the thickness of 0.001 to 10㎛.
한편, 본 발명에 있어서 상기 금속기재(100)의 표면(100a, 100b)에 부동태층(120a, 120b)을 형성시켜 주기 위한 수단에 포함된 부동태 용액(200) 즉, 산화 피막 형성을 위한 반응 물질에는 에탄올(Ethanol), 메탄올(Methanol), 이소프로필알코올(Isopropyl Alcohol), 부틸알코올(Butyl Alcohol), 옥틸알코올(Octyl alcohol) 중에서 선택된 어느 하나 또는 두 가지 이상 혼합시킨 휘발성의 알코올(Alcohol)계 물질을 포함하여 조성된다.Meanwhile, in the present invention, the passivation solution 200 included in the means for forming the passivation layers 120a and 120b on the surfaces 100a and 100b of the metal substrate 100, that is, the reaction material for forming the oxide film. The volatile alcohol (Alcohol) -based material mixed with one or two or more selected from ethanol, methanol, isopropyl alcohol, butyl alcohol, octyl alcohol It is formulated to include.
더불어, 상기 부동태 용액(200)으로는 아세톤(Acetone), 메틸에틸케톤(Methyl Ethyl Ketone), 메틸이소부틸케톤(Methyl Isobutyl Ketone) 중에서 선택된 어느 하나 또는 두 가지 이상 혼합시킨 휘발성의 케톤(Ketone)계 물질을 포함하여 조성될 수 있다.In addition, the passivation solution 200 is a volatile ketone system mixed with any one or two or more selected from acetone, methyl ethyl ketone, methyl isobutyl ketone, and the like. It can be composed of materials.
한편, 본 발명에 있어서 상기 금속기재(100)의 표면(100a, 100b)에 부동태층(120a, 120b)을 형성시켜 주기 위한 수단에 포함된 부동태처리 열온도(T1)는 용액조(300)에 채워진 알코올(Alcohol)계 또는 케톤(Ketone)계 물질의 부동태 용액(200)을 40℃ 내지 비점(沸點)(이를 "비등점(沸騰點)"이라고도 한다.) 범위로 가열하여, 이로 인해 부동태층(120a, 120b)의 형성을 위한 반응이 용이하도록 하는 것이 바람직할 것이다.Meanwhile, in the present invention, the passivation heat temperature T1 included in the means for forming the passivation layers 120a and 120b on the surfaces 100a and 100b of the metal substrate 100 is applied to the solution tank 300. The passivation solution 200 of the filled alcohol-based or ketone-based material is heated to a boiling point of 40 ° C. to a boiling point (also referred to as a “boiling point”). It would be desirable to facilitate the reaction for the formation of 120a, 120b).
또한, 상기 부동태처리 열온도(T1)는 용액조(300)에 채워진 알코올(Alcohol)계 또는 케톤(Ketone)계 물질의 부동태 용액(200)을 40 내지 220℃로 가열하여, 일 인해 부동태층(120a, 120b)의 형성을 위한 반응이 용이하도록 하는 것이 바람직할 것이다.In addition, the passivation heat temperature (T1) by heating the passivation solution 200 of the alcohol (Alcohol) or ketone (Ketone) material filled in the solution tank 300 to 40 to 220 ℃, due to the passive layer ( It would be desirable to facilitate the reaction for the formation of 120a, 120b).
예컨데, 상기 부동태처리 열온도(T1)를 40℃ 이하로 낮게 설정할 경우에는 부동태 용액(200)의 반응이 저하되어 금속기재(100)의 표면(100a, 100b) 및 구조물 패턴(110)에 부동태층(120a, 120b)이 치밀하게 형성되지 않을 우려가 있고, 반면에 부동태처리 열온도(T1)를 비점(沸點) 또는 220℃ 이상으로 높게 설정하게 되면 알코올계 또는 케톤계의 휘발성 물질로 조성된 부동태 용액(200)의 증발이 심하여 손실이 발생되기 때문에 경제적으로 불리할 뿐만 아니라, 균일한 부동태층(120a, 120b)이 형성되지 않을 우려가 있기 때문이다.For example, when the passivation heat temperature T1 is set to 40 ° C. or lower, the reaction of the passivation solution 200 is lowered, and the passivation layer is formed on the surfaces 100a and 100b and the structure pattern 110 of the metal substrate 100. (120a, 120b) may not be formed densely. On the other hand, if the passivation heat temperature (T1) is set higher than the boiling point or 220 ° C or higher, the passivation composition composed of alcohol or ketone-based volatile substance This is because not only is it economically disadvantageous because the evaporation of the solution 200 is severe and loss occurs, and there is a possibility that the uniform passivation layers 120a and 120b may not be formed.
다시 말해서, 상기 부동태 용액(200)에 포함된 알코올계 반응물질 중에서 그 비점(沸點)을 살펴보면 에탄올은 78.3℃, 메탄올은 64.65℃, 이소프로필알코올은 82℃, 부틸알코올은 117.7℃, 옥틸알코올은 194.5℃이고, 반면에 부동태 용액(200)에 포함된 케톤계 반응물질 중에서 비점(沸點)을 살펴보면 아세톤은 56.5℃, 메틸에틸케톤은 79.6℃, 메틸이소부틸케톤은 115.9℃이기 때문에 본 발명에서는 그 어느 하나를 단독으로 선택하여 조성하거나 또는 두 가지 이상 혼합하여 조성되는 반응물질의 종류에 따라 부동태처리 열온도(T1)를 40℃ 내지 비점(沸點) 범위 또는 40 내지 220℃ 범위에서 적합하게 선택하여 주는 것이 바람직할 것이다.In other words, when looking at the boiling point (알코올) of the alcohol-based reactants contained in the passivating solution 200, ethanol is 78.3 ℃, methanol is 64.65 ℃, isopropyl alcohol is 82 ℃, butyl alcohol 117.7 ℃, octyl alcohol is 194.5 ° C., while the boiling point of the ketone-based reactants included in the passivation solution 200 is 56.5 ° C., methylethyl ketone is 79.6 ° C., and methyl isobutyl ketone is 115.9 ° C. The passivation heat temperature (T1) is appropriately selected in the range of 40 ° C. to boiling point or in the range of 40 to 220 ° C. according to the kind of the reactant which is selected by the composition alone or by mixing two or more thereof. It would be desirable to give.
더불어, 본 발명에 있어서 상기 금속기재(100)의 표면(100a, 100b)에 부동태층(120a, 120b)을 형성시켜 주기 위한 수단에 포함된 예컨데, 부동태처리 열온도(T1)로 가열된 부동태 용액(200)에 금속기재(100)를 침적시켜 주는 시간은 앞에서 언급된 알코올계 또는 케톤계 반응물질의 종류에 따라 달라질 수 있으나, 이는 1초 내지 30분 범위에서 침적시켜 주는 것을 그 특징으로 한다.In addition, in the present invention, for example, the passivating solution heated to the passivation heat temperature T1 included in the means for forming the passivation layers 120a and 120b on the surfaces 100a and 100b of the metal substrate 100. The time for depositing the metal base 100 on the 200 may vary depending on the type of alcohol-based or ketone-based reactant mentioned above, which is characterized by depositing in the range of 1 second to 30 minutes.
예컨데, 상기 부동태 용액(200)에 금속기재(100)를 침적시켜 주는 시간을 1초 이하로 너무 짧게 설정할 경우에는 부동태 용액(200)의 반응이 저하되어 금속기재(100)의 표면(100a, 100b)에 부동태층(120a, 120b)이 치밀하게 형성되지 않을 우려가 있고, 반면에 30분 이상으로 길게 설정할 경우에는 부동태층(120a, 120b)의 치밀도가 높아지는 장점은 있으나, 상기 부동태층(120a, 120b)의 형성 즉, 부동태처리를 위한 공정시간이 불필요하게 길어지게 되어 경제적인 낭비 요인으로 작용할 우려가 있기 때문에 본 발명은 1초 내지 30분 범위에서 적합하게 선택하는 것이 바람직할 것이다.For example, when the time for depositing the metal substrate 100 in the passivation solution 200 is set too short to less than 1 second, the reaction of the passivation solution 200 is lowered, so that the surfaces 100a and 100b of the metal substrate 100 are reduced. ), There is a fear that the passivation layers 120a and 120b are not formed densely. On the other hand, when the passivation layers 120a and 120b are set longer than 30 minutes, the passivation layers 120a and 120b have an advantage of increasing the density. , 120b), that is, the process time for the passivation process is unnecessarily long, so it may act as an economical waste factor. Therefore, the present invention will be preferably selected in the range of 1 second to 30 minutes.
이와 같이 형성된 본 발명의 부동태층(120a, 120b)은 금속기재(100)에 대한 내식성의 향상과 함께 이종(異種)금속 보호층(130a, 130b)을 비롯한 도장(塗裝)을 기반으로 하는 도막(塗膜) 보호층(130-1a, 130-1b), 상도막(上塗膜) 보호층(130-2a, 130-2b ) 등의 형성시에 이종(異種)금속이나 도막(塗膜)의 흡착력 즉, 도막 밀착성을 향상시켜 주는 작용을 하게 된다.The passivation layers 120a and 120b of the present invention formed as described above are coated with coatings including dissimilar metal protective layers 130a and 130b with improved corrosion resistance to the metal substrate 100. (Iii) dissimilar metals or coating films at the time of formation of the protective layers 130-1a and 130-1b and the top coat protective layers 130-2a and 130-2b. It is to act to improve the adsorption force of, i.e., coating film adhesion.
한편, 본 발명은 상기 언급된 금속기재(100)를 부동태 용액(200)이 채워진 용액조(300)에 침적시켜 주기 전에 충분한 탈지 및 세정공정을 거쳐서 그 표면(100a, 100b)에 묻은 이물질을 충분하게 제거시켜 주는 것이 바람직할 것이다.On the other hand, the present invention is sufficient to remove the foreign matter on the surface (100a, 100b) through a sufficient degreasing and cleaning process before immersing the above-mentioned metal substrate 100 in the solution tank 300 filled with the passivating solution 200 It may be desirable to remove it.
다시 말해서, 상기 금속기재(100)의 표면(100a, 100b)에 이물질이 묻어 있을 경우에는 표면장력으로 인해 부동태 용액(200)이 전체적으로 균일하게 묻지 않기 때문에 결국, 치밀하고 안정된 부동태층(120a, 120b)의 형성에 나쁜 영향을 미치게 될 수 있는 것이다.In other words, when foreign matter is deposited on the surfaces 100a and 100b of the metal substrate 100, the passivation solution 200 is not uniformly buried as a result of surface tension, and thus, the dense and stable passivation layers 120a and 120b. ) Can adversely affect the formation of.
이어서, 본 발명은 앞에서 언급된 바와 같이 상기 금속기재(100)를 부동태 용액(200)에 1초 내지 30분간 침적에 의해 부동태층(120a, 120b)을 형성시켜 준 다음 이를 용액조(300)로부터 꺼내어 건조시켜 주는 단계를 더 포함할 수 있다.Subsequently, as described above, the present invention forms the passivation layers 120a and 120b by immersing the metal substrate 100 in the passivation solution 200 for 1 second to 30 minutes, and then from the solution bath 300. It may further comprise the step of taking out to dry.
예컨데, 상기 부동태 용액(200)이 휘발성 물질이기 때문에 상온에서 자연 건조시켜 주는 것도 가능하나, 20 내지 60℃의 열온도에서 실시되는 적외선 또는 열풍으로 건조시켜 주는 것이 바람직할 것이다.For example, since the passivation solution 200 is a volatile material, it may be naturally dried at room temperature, but may be preferably dried by infrared rays or hot air at a temperature of 20 to 60 ° C.
또한, 이와는 달리 본 발명은 상기 금속기재(100)를 부동태 용액(200)에 1초 내지 30분간 침적에 의해 부동태층(120a, 120b)을 형성시켜 준 다음 이를 용액조(300)로부터 꺼내어 40 내지 200℃에서 실시되는 열처리 단계를 더 포함하여 줌으로써, 이를 통해 상기 금속기재(100)에 대한 건조와 함께 상기 부동태층(120a, 120b) 즉, 산화 피막에 대한 고착화(固着化) 내지는 안정화를 시켜주는 것이 바람직할 것이다.Alternatively, the present invention forms the passivation layers 120a and 120b by immersing the metal substrate 100 in the passivation solution 200 for 1 second to 30 minutes and then removes it from the solution tank 300 to 40 to By further comprising a heat treatment step carried out at 200 ℃, through this to the drying on the metal substrate 100, the passivation layer (120a, 120b), that is to fix or stabilize the (oxidation) to the oxide film It would be desirable.
이상 설명한 내용을 통해 당업자라면 본 발명의 기술적 사상을 벗어나지 아니하는 범위에서 다양한 변경과 수정 등이 가능함을 자명하게 알 수 있을 것이다.It will be apparent to those skilled in the art that various changes, modifications, and the like can be made without departing from the technical spirit of the present invention through the above description.
따라서, 본 발명의 기술적 범위는 언급된 바와 같은 다양한 일실시사례들에 기재된 내용으로 한정되는 것이 아니라, 본 발명의 특허청구 범위에 의하여 정해져야 함이 바람직할 것이다.Therefore, the technical scope of the present invention should not be limited to the contents described in various exemplary embodiments as mentioned, but should be defined by the claims of the present invention.
[부호의 설명][Description of the code]
100 : 금속기재100: metal base
100a, 100b : 표면100a, 100b: surface
120a, 120b : 부동태층120a, 120b: Passive layer
130a, 130b : 이종(異種)금속 보호층130a, 130b: dissimilar metal protective layer
130-1a, 130-1b : 도막(塗膜) 보호층130-1a, 130-1b: coating film protective layer
130-2a, 130-2b : 상도막(上塗膜) 보호층130-2a, 130-2b: top coat protective layer
200 : 부동태 용액200: Passive Solution
300 : 용액조300: solution bath

Claims (20)

  1. 마그네슘, 마그네슘 합금, 알루미늄, 알루미늄 합금 중에서 어느 하나로 구비된 금속기재(100)를 포함하고,It includes a metal base 100 provided with any one of magnesium, magnesium alloy, aluminum, aluminum alloy,
    알코올(Alcohol)계의 부동태 용액(200)을 40℃ 내지 비점(沸點) 범위의 부동태처리 열온도(T1)로 가열시켜 주는 단계;Heating the alcohol-based passivation solution 200 to a passivation heat temperature T1 in the range of 40 ° C. to boiling point;
    상기 부동태처리 열온도(T1)로 가열된 상기 부동태 용액(200)에 상기 금속기재(100)를 침적시켜, 상기 부동태 용액(200)과의 반응에 의해 상기 금속기재(100)의 표면(100a, 100b)에 부동태층(不動態層)(120a, 120b)을 형성시켜 주는 단계를 포함한 것을 특징으로 하는 금속기재의 표면처리방법.The metal substrate 100 is deposited on the passivation solution 200 heated to the passivation heat temperature T1, and the surface 100a of the metal substrate 100 is reacted with the passivation solution 200. A passivation layer (120a, 120b) is formed in 100b).
  2. 제1항에 있어서, The method of claim 1,
    상기 부동태층(120a, 120b)의 적어도 어느 한쪽(120a) 또는 양쪽(120a, 120b) 위에는 상기 금속기재(100)와는 도전율이 다른 이종(異種)금속 보호층(130a, 130b)을 형성시켜 주는 단계를 더 포함한 것을 특징으로 하는 금속기재의 표면처리방법.Forming dissimilar metal protective layers 130a and 130b on at least one side 120a or both sides 120a and 120b of the passivation layers 120a and 120b, the conductivity of which is different from that of the metal base 100. Surface treatment method of a metal base further comprising.
  3. 제2항에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 마그네슘(Mg) 또는 마그네슘 합금으로 구비되면 Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 진공 증착으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.According to claim 2, wherein the dissimilar metal protective layer (130a, 130b) is Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo when the metal base 100 is provided with magnesium (Mg) or magnesium alloy , Zn, Zr, Fe, Ca, Li, Be any one or two or more selected from a metal substrate surface treatment method characterized in that formed by vacuum deposition.
  4. 제2에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 알루미늄(Al) 또는 알루미늄 합금으로 구비되면 Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 진공 증착으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 2, wherein the dissimilar metal protective layers 130a and 130b include Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, when the metal substrate 100 is made of aluminum (Al) or an aluminum alloy. Surface treatment method of a metal substrate, characterized in that any one or two or more selected from Zn, Zr, Fe, Ca, Li, Be formed by vacuum deposition.
  5. 제2항에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 마그네슘(Mg) 또는 마그네슘 합금으로 구비되면 Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 습식 도금으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.According to claim 2, wherein the dissimilar metal protective layer (130a, 130b) is Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo when the metal base 100 is provided with magnesium (Mg) or magnesium alloy , Zn, Zr, Fe, Ca, Li, Be any one or two or more selected from the surface of the metal substrate, characterized in that formed by wet plating.
  6. 제2항에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 알루미늄(Al) 또는 알루미늄 합금으로 구비되면 Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 습식 도금으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.According to claim 2, wherein the dissimilar metal protective layer (130a, 130b) is Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo when the metal substrate 100 is provided with aluminum (Al) or aluminum alloy , Zn, Zr, Fe, Ca, Li, Be any one or two or more selected from the surface of the metal substrate, characterized in that formed by wet plating.
  7. 제2항에 있어서, 상기 이종금속 보호층(130a, 130b) 위에는 두께 0.2 내지 20㎛의 도막(塗膜)으로 상도막(上塗膜) 보호층(130-2a, 130-2b)을 형성시켜 주는 단계를 포함한 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 2, wherein the top protective film (130-2a, 130-2b) is formed on the dissimilar metal protective layer (130a, 130b) by a coating film of 0.2 to 20㎛ thickness Surface treatment method of a metal substrate comprising the step of giving.
  8. 제1항에 있어서, 상기 금속기재(100)를 알코올(Alcohol)계의 부동태 용액(110)에 1초 내지 30분간 침적시켜 주는 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 1, wherein the metal substrate is immersed in an alcohol-based passivating solution for 1 second to 30 minutes.
  9. 제1항에 있어서, 상기 부동태처리 열온도(T1)는 알코올계의 부동태 용액(110)을 40 내지 200℃ 범위로 가열한 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 1, wherein the passivation heat temperature (T1) is a metal-based surface treatment method characterized in that the alcohol-based passivating solution (110) is heated in the range of 40 to 200 ℃.
  10. 제1항에 있어서, 상기 금속기재(100)가 침적되는 알코올(Alcohol)계의 부동태 용액(200)은 에탄올(Ethanol), 메탄올(Methanol), 이소프로필알코올(Isopropyl Alcohol), 부틸알코올(Butyl Alcohol), 옥틸알코올(Octyl Alcohol) 중에서 선택된 어느 하나 또는 두 가지 이상 혼합하여 조성된 휘발성 물질인 것을 특징으로 하는 금속기재의 표면처리방법.According to claim 1, wherein the alcohol-based passivating solution 200, the metal base 100 is ethanol (Ethanol), methanol (Methanol), isopropyl alcohol (Isopropyl Alcohol), Butyl alcohol (Butyl Alcohol ), Octyl alcohol (Octyl Alcohol) A surface treatment method of a metal substrate, characterized in that any one or two or more selected from volatiles composed of a composition.
  11. 마그네슘, 마그네슘 합금, 알루미늄, 알루미늄 합금 중에서 어느 하나로 구비된 금속기재(100)를 포함하고,It includes a metal base 100 provided with any one of magnesium, magnesium alloy, aluminum, aluminum alloy,
    케톤(Ketone)계의 부동태 용액(200)을 40℃ 내지 비점(沸點) 범위의 부동태처리 열온도(T1)로 가열시켜 주는 단계;Heating the ketone-based passivation solution 200 to a passivation heat temperature T1 in the range of 40 ° C. to boiling point;
    상기 부동태처리 열온도(T1)로 가열된 상기 부동태 용액(200)에 상기 금속기재(100)를 침적시켜, 상기 부동태 용액(200)과의 반응에 의해 상기 금속기재(100)의 표면(100a, 100b)에 부동태층(不動態層)(120a, 120b)을 형성시켜 주는 단계를 포함한 것을 특징으로 하는 금속기재의 표면처리방법.The metal substrate 100 is deposited on the passivation solution 200 heated to the passivation heat temperature T1, and the surface 100a of the metal substrate 100 is reacted with the passivation solution 200. A passivation layer (120a, 120b) is formed in 100b).
  12. 제11항에 있어서,The method of claim 11,
    상기 부동태층(120a, 120b)의 적어도 어느 한쪽(120a) 또는 양쪽(120a, 120b) 위에는 상기 금속기재(100)와는 도전율이 다른 이종(異種)금속 보호층(130a, 130b)을 형성시켜 주는 단계를 더 포함한 것을 특징으로 하는 금속기재의 표면처리방법.Forming dissimilar metal protective layers 130a and 130b on at least one side 120a or both sides 120a and 120b of the passivation layers 120a and 120b, the conductivity of which is different from that of the metal base 100. Surface treatment method of a metal base further comprising.
  13. 제12항에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 마그네슘(Mg) 또는 마그네슘 합금으로 구비되면 Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 진공 증착으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 12, wherein the dissimilar metal protective layer (130a, 130b) is Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo when the metal substrate 100 is provided with magnesium (Mg) or magnesium alloy , Zn, Zr, Fe, Ca, Li, Be any one or two or more selected from a metal substrate surface treatment method characterized in that formed by vacuum deposition.
  14. 제12항에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 알루미늄(Al) 또는 알루미늄 합금으로 구비되면 Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 진공 증착으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 12, wherein the dissimilar metal protective layer (130a, 130b) is Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo when the metal base 100 is provided with aluminum (Al) or aluminum alloy , Zn, Zr, Fe, Ca, Li, Be any one or two or more selected from a metal substrate surface treatment method characterized in that formed by vacuum deposition.
  15. 제12항에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 마그네슘(Mg) 또는 마그네슘 합금으로 구비되면 Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 습식 도금으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 12, wherein the dissimilar metal protective layer (130a, 130b) is Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo when the metal substrate 100 is provided with magnesium (Mg) or magnesium alloy , Zn, Zr, Fe, Ca, Li, Be any one or two or more selected from the surface of the metal substrate, characterized in that formed by wet plating.
  16. 제12항에 있어서, 상기 이종금속 보호층(130a, 130b)은 금속기재(100)가 알루미늄(Al) 또는 알루미늄 합금으로 구비되면 Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, Be 중에서 선택된 어느 하나 또는 둘 이상을 습식 도금으로 형성시킨 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 12, wherein the dissimilar metal protective layer (130a, 130b) is Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo when the metal base 100 is provided with aluminum (Al) or aluminum alloy , Zn, Zr, Fe, Ca, Li, Be any one or two or more selected from the surface of the metal substrate, characterized in that formed by wet plating.
  17. 제12항에 있어서, 상기 이종금속 보호층(130a, 130b) 위에는 두께 0.2 내지 20㎛의 도막(塗膜)으로 상도막(上塗膜) 보호층(130-2a, 130-2b)을 형성시켜 주는 단계를 포함한 것을 특징으로 하는 금속기재의 표면처리방법.The method of claim 12, wherein the top protective film (130-2a, 130-2b) is formed on the dissimilar metal protective layer (130a, 130b) by a coating film of 0.2 to 20㎛ thickness Surface treatment method of a metal substrate comprising the step of giving.
  18. 제11항에 있어서, 상기 금속기재(100)를 케톤(Ketone)계의 부동태 용액(110)에 1초 내지 30분간 침적시켜 주는 것을 특징으로 하는 금속기재의 표면처리방법.12. The method of claim 11, wherein the metal substrate is immersed in a ketone passivation solution for 1 second to 30 minutes.
  19. 제11항에 있어서, 상기 부동태처리 열온도(T1)는 케톤계의 부동태 용액(110)을 40 내지 200℃ 범위로 가열한 것을 특징으로 하는 금속기재의 표면처리방법.12. The method of claim 11, wherein the passivation heat temperature (T1) is a ketone-based passivation solution (110) is heated to a range of 40 to 200 ℃ metal substrate surface treatment method.
  20. 제11항에 있어서, 상기 금속기재(100)가 침적되는 케톤(Ketone)계의 부동태 용액(200)은 아세톤(Acetone), 메틸에틸케톤(Methyl Ethyl Ketone), 메틸이소부틸케톤(Methyl Isobutyl Ketone) 중에서 선택된 어느 하나 또는 두 가지 이상 혼합하여 조성된 휘발성 물질인 것을 특징으로 하는 금속기재의 표면처리방법.The ketone-based passivation solution 200 in which the metal substrate 100 is deposited is acetone, methyl ethyl ketone, methyl isobutyl ketone. Surface treatment method of a metal base, characterized in that the volatile material formed by mixing any one or two or more selected from.
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