KR101452166B1 - Surface treatment method for base metal - Google Patents

Surface treatment method for base metal Download PDF

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KR101452166B1
KR101452166B1 KR1020140033473A KR20140033473A KR101452166B1 KR 101452166 B1 KR101452166 B1 KR 101452166B1 KR 1020140033473 A KR1020140033473 A KR 1020140033473A KR 20140033473 A KR20140033473 A KR 20140033473A KR 101452166 B1 KR101452166 B1 KR 101452166B1
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metal substrate
metal
passivation
layers
passive
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KR1020140033473A
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Korean (ko)
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윤주식
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주식회사 위스코하이텍
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/73—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/78—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The present invention relates a metal substrate applied to interior and exterior panels, an exterior case or a housing, a body, a pipe, etc. of mobile phones or laptops and various electronic devices, automobiles, airplanes, ships, etc. provided in metal, and a durability, a corrosion resistance, a coating adhesion, etc. of the product can be improved through a surface treatment, in which a passivation layer is formed with respect to the metal substrate, which is easily oxidized, such as magnesium, a magnesium alloy, aluminum, an aluminum alloy, etc. The method of processing a surface of a metal substrate of the present invention includes: heating a passivation liquid, which has pH of 6 to 8 and is filled in a water tank, from 60°C to a passivation processing temperature of a boiling range to process a surface of the metal substrate including any one among magnesium, a magnesium alloy, aluminum and an aluminum alloy; forming a passivation layer on the surface of the metal substrate by a reaction with the passivation liquid through depositing the metal substrate in the passivation liquid, which is heated to the passivation processing temperature for 1 to 30 minutes; and taking out the metal substrate, on which the passivation layer is formed, from the water tank and thermally processing the metal substrate at 40 to 200 °C.

Description

TECHNICAL FIELD [0001] The present invention relates to a surface treatment method for a metal substrate,

The present invention relates to an internal material, an exterior material, a case, a housing, a body, a pipe, and the like, which are made of metal such as a mobile phone, a notebook computer, (Hereinafter referred to as "metal substrate"), and more specifically, a dense passive layer (passive layer) is formed on the surface of a metal base easily oxidizable, such as magnesium or magnesium alloy or aluminum or aluminum alloy, To improve the durability and corrosion resistance of the product and the adhesion of the coating film to the surface.

Recently, magnesium or magnesium alloy materials have been widely used in various fields such as automobiles, airplanes, and ships as well as computers, notebooks, cameras, and mobile phones, including various electronic products and electronic devices, because they are lightweight and excellent in electromagnetic shielding and heat dissipation.

However, in order to put materials such as magnesium or magnesium alloy having high oxidation resistance and low corrosion resistance into practical use, it is necessary to perform surface treatment separately, so that durability can be ensured for various internal parts and external parts.

On the other hand, the 'processing solution for magnesium alloy, the surface treatment method, and the magnesium alloy substrate' (referred to as Document 1) disclosed in Korean Patent Publication No. 2002-0077150 (October 11, 2002) It is known.

In reference to the above-mentioned document 1, it has been found that a magnesium alloy containing a phosphoric acid ion and a permanganate ion as a means for imparting paint adhesion, corrosion resistance and rust preventive property to a magnesium alloy and having a pH of 1.5 to 7 Liquid and surface treatment methods.

However, in such conventional techniques, since the chemical conversion treatment solution is preferred to be in the pH range of 2.0 to 4.0, which is a strongly acidic treatment condition, if the pH of the chemical conversion solution exceeds 7, for example, As a result, sufficient durability and corrosion resistance of the product and coating film adhesion can not be obtained.

In order to solve the above-described problems, the present invention provides a method for manufacturing a passive layer (passive layer) using a nonvolatile passive liquid containing water or distilled water having a pH of 6 to 7 on a surface of a metal substrate, The present invention has been made in order to improve the durability, corrosion resistance, coating film adhesion,

As a method for solving the problems of the present invention as described above, a passive fluid having a pH of 6 to 8, which is filled in a water tank for surface treatment of a metal base material provided with any one of magnesium, magnesium alloy, aluminum and aluminum alloy, To a passive heat treatment temperature in the range of the boiling point to the boiling point.

The step of immersing the metal substrate in the passivation solution heated to the passivation heat temperature for 1 to 30 minutes to form a passive layer (passivation layer) on the surface of the metal substrate by reaction with the passivation solution And is characterized in that it is provided.

The metal substrate having the passive layer formed thereon is taken out from the water bath and heat-treated at 40 to 200 ° C.

As another method for solving the problem of the present invention, a passive fluid having a pH of 6 to 8, which is filled in a water tank for surface treatment of a metal substrate made of any one selected from magnesium, magnesium alloy, aluminum, To 220 < [deg.] ≫ C. ≪ / RTI >

The step of immersing the metal substrate in the passivation solution heated to the passivation heat temperature for 1 to 30 minutes to form a passive layer (passivation layer) on the surface of the metal substrate by reaction with the passivation solution And is characterized in that it is provided.

The metal substrate having the passive layer formed thereon is taken out from the water bath and heat-treated at 40 to 200 ° C.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As described above, according to the present invention, the surface of a metal base which can be easily oxidized is immersed in a nonvolatile passivating liquid containing water or distilled water having a pH of 6 to 7 heated to a passivation treatment heat temperature to form a dense passive layer A dynamic layer) is formed on the surface of the substrate to improve the durability, corrosion resistance, and film adhesion of the product.

Further, since the present invention uses water or distilled water as a passive solution used as a reactive material in forming a passive layer, it is not only environmentally friendly, but also provides another economically advantageous effect.

FIG. 1 is a view showing a first embodiment of the present invention, which schematically shows the process of surface treatment of a metal substrate according to the present invention.
FIG. 2 is a view showing a second embodiment of the present invention, which schematically shows a process of surface-treating a metal substrate according to the present invention.
FIG. 3 is a view showing a third embodiment of the present invention, which schematically shows a process of surface-treating a metal substrate according to the present invention.
FIG. 4 is a view showing a fourth embodiment of the present invention, which schematically illustrates the process of surface treatment of a metal substrate according to the present invention.
FIG. 5 is a photograph of an embodiment showing a state in which a porous layer is formed on the surface of a metal substrate in FIGS. 1 to 4 according to the present invention. FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the preferred embodiments of the present invention, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of example at least one embodiment, And should not be construed as limiting the scope of the present invention.

It is to be noted that the same reference numerals are used to denote the same elements in the drawings of the present invention.

Hereinafter, a surface treatment method of a metal substrate according to the present invention will be described in detail with reference to the drawings shown in FIGS. 1 to 5 attached hereto.

The metal base 100 according to the present invention can be used as an internal or external material provided in a vehicle such as a mobile phone or a notebook computer or an electronic device such as an automobile, an aircraft or a ship, an external case, a housing, (Mg), a magnesium alloy, aluminum (Al), an aluminum alloy, and the like, which can be easily oxidized on the surface of the body (hereinafter referred to as " But of course the metal substrate 100 of the present invention should not be limited to the above-mentioned metals.

The metal substrate 100 according to the present invention may be formed by various processing methods such as die casting, injection, extrusion, rolling, pressing, or etching by utilizing the above-mentioned metal. .

In addition, the metal base 100 according to the present invention includes a passivation layer (also referred to as "passivation") 111a and 111b for the surfaces 101a and 101b, The protective layers 121a and 121b or the different types of metal layers 122a and 122b and the top protective layer 123a (also referred to as "top coat protective layer" , 123b, and the like, to improve the durability, the corrosion resistance, the salt resistance, the rust prevention, the film adhesion, and the like of the product to which the metal base 100 is applied.

In the present invention, when the thickness t1 of the metal base 100 is too thin, it is difficult to process a thin film through etching or the like, and the thickness of the passive layer 111a And 111b. On the other hand, if the thickness t1 is made too thick, the workability is easy, but not only the weight and the volume become large, but also unnecessarily increases the material cost when applied to a product have.

Accordingly, it is preferable that the thickness t1 of the metal substrate 100 is appropriately selected depending on the purpose and use of the metal substrate 100, including chemical and physical characteristics, workability, and the like.

The reliability test conditions for the metal substrate 100 on which the passive layers 111a and 111b are formed are a constant temperature and humidity test conducted at a temperature of 60 DEG C and a humidity of 90% for 24 hours, , A cold thermal shock test conducted over 24 cycles from 30 minutes at 80 ° C for 30 minutes and a salt water test conducted for 48 hours at 5% What is more important than anything else.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout.

As shown in FIGS. 1 to 5, magnesium (Mg), magnesium alloy, aluminum (Al), aluminum (Al), and the like can be easily oxidized by the above- The pH of the water tank 300 filled in the water tank 300 by a separate heating means such as a burner or a heater as a means for performing a surface treatment on the metal substrate 100 provided with an aluminum alloy or the like (Also referred to as "heating") of the passive fluid 200 having an oxygen concentration of 6 to 8 at a passivation heat temperature T1 of 60 ° C to a boiling point, .

In another embodiment of the present invention, as described above, a means for performing a surface treatment on the metal substrate 100, which is easy to oxidize the surface, includes a burner, a heater The passive fluid 200 having a pH of 6 to 8 (which is also referred to as a "hydrogen ion index") filled in the water bath 300 by a separate heating means such as a heating means (Also referred to as "heating").

The passive solution 200 is immersed in the passive solution 200 heated to the passivation treatment temperature T1 for 1 to 30 minutes (this is also referred to as "dipping"), (Passivation layers) 111a and 111b on the surfaces 101a and 101b of the metal substrate 100 by a reaction with the metal layer 100. [

Meanwhile, in the present invention, the passive solution 200 includes non-volatile water or distilled water. In this case, the passive solution 200 preferably uses neutral pH 7, For example, a pH range of 6 to 8, inclusive.

The present invention is characterized by including a step of removing the metal substrate 100 on which the passivation layers 111a and 111b are formed from the water bath 300 and performing heat treatment at 40 to 200 ° C.

Of course, the passive solution 200 may be naturally dried at room temperature because it is water or distilled water, but it may be dried by infrared or hot air at a temperature of 20 to 60 ° C.

Alternatively, the present invention can be applied to the passivation layers 111a and 111b, that is, to fix the oxide layer to the oxide layer (solidification) with the drying of the metal substrate 100 through the heat treatment step performed at 40 to 200 ° C, Or stabilization of the reaction.

2, the present invention is a method for protecting the surfaces 101a and 101b of the metal base 100 on which the passive layers 111a and 111b are formed, The protective layers 121a and 121b may be formed on at least one or both sides with a coating film having a thickness of 0.2 to 20 占 퐉 depending on the type and the characteristics of the product to be applied, This improves the corrosion resistance, rust resistance, etc., including durability to the metal substrate 100, and further prevents the deterioration of the metal substrate 100 and the scratching of the surfaces 101a and 101b from strong ultraviolet rays, And the like.

3, it is possible to protect the surfaces 101a and 101b of the metal base 100 on which the passive layers 111a and 111b are formed and further improve durability and corrosion resistance, A different kind of metal layer 122a or 122b having a conductivity different from that of the metal base 100 is formed on either one of the passivation layers 111a and 111b or on both sides 111a and 111b of the passivation layers 111a and 111b, The dissimilar metal layers 122a and 122b may be formed in one or more layers depending on the type and characteristics of the applied product.

For example, the dissimilar metal layers 122a and 122b may be formed of a conductive metal such as Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, and Mo when the metal substrate 100 is formed of magnesium (Mg) , A Zn, Zr, Fe, Ca, Li, or Be alloy is formed by vapor deposition in a vacuum chamber of 10 -3 to 10 -6 Torr (also referred to as a "vacuum atmosphere" And the like.

The dissimilar metal layers 122a and 122b may be formed of a conductive metal such as Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, and Mo when the metal substrate 100 is made of aluminum , A Zn, Zr, Fe, Ca, Li, or Be alloy is formed by vapor deposition in a vacuum chamber of 10 -3 to 10 -6 Torr (also referred to as a "vacuum atmosphere" And the like.

As the deposition means for forming the dissimilar metal layers 122a and 122b, a sputtering deposition method using a plasma, an electron beam deposition method, a thermal deposition method, an ion plating Plating) deposition method, etc. However, this should not be limited to the above-mentioned cases.

The dissimilar metal layers 122a and 122b may be formed of a conductive metal such as Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, or the like when the metal substrate 100 is made of magnesium (Mg) Mo, Zn, Zr, Fe, Ca, Li, or Be is formed by wet plating in the air.

The dissimilar metal layers 122a and 122b may be formed of a conductive metal such as Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn, Zr, Fe, Ca, Li, or Be is formed by wet plating in the air.

In addition, top protective layers 123a and 123b may be formed on the dissimilar metal layers 122a and 122b as a coating film having a thickness of 0.2 to 20 μm as shown in FIG. (100a) and (100b) in order to protect the metal substrate (100) from deterioration from strong ultraviolet rays and to prevent scratching of the surfaces (100a, 100b), and furthermore, And various functions that improve durability, corrosion resistance, and rustproofing performance are provided.

The protective layers 121a and 121b and the top protective layers 123a and 123b of the present invention may be paints formed by using a transparent or colored resin (also referred to as a "color resin & ) May be formed.

The protective layers 121a and 121b and the top protective layers 123a and 123b of the present invention may be used as means for imparting various colors to the metal substrate 100 or for increasing the metal texture, Or a paint (paint) composed of a colored pigment material or the like.

The pigment material may include at least one or more mineral inorganic pigments such as gold, silver, copper, nickel, zinc, titanium, iron, chromium and the like in an environmentally friendly manner so that the metal substrate 100 is protected from strong ultraviolet rays It is desirable to further enhance the resistance and to have weatherability that prevents discoloration or discoloration.

For example, among the above pigment materials, white pigments include TiO 2 (titanium dioxide) having a chemical property stable and not toxic, particularly a refractive index and coloring power against an acid or ancholy, and a refractive index ranging from 2.50 to 2.75, It should not be limited to the materials mentioned above.

Of the pigment materials, ZrO 2 (zirconia), ZnO (zinc oxide), BiOCl (bismuth oxide chloride) having a refractive index of 1.8 or more, SiO 2 (silicon dioxide) having a refractive index of 1.8 or less, MgF 2 (magnesium fluoride) Al 2 O 2 (alumina), which should not be limited to the materials listed above.

Among the above-mentioned colored pigments, carbon black, chromium oxide green and the like, which are harmless to the human body and are non-toxic, for example, black, red, blue, ), Violet (Violet), yellow (Yellow), and the like.

As the means for forming the protective layers 121a and 121b and the top protective layers 123a and 123b as described above, the above-mentioned coating material may be used for electrodeposition coating, synthetic resin coating, powder coating, It is preferable to uniformly form the coating film by any one selected from coating methods, but this should also not be limited to the above-mentioned examples.

In the present invention, when the thickness of the protective layers 121a and 121b and the top protective layers 123a and 123b is set to 0.2 μm or less, the metal texture is advantageously used. However, This is because the thickness of the coating film is too thin, which may deteriorate the protective property. On the other hand, when the thickness of the coating film is thicker than 20 탆, durability and corrosion resistance are excellent but the metal texture may be deteriorated.

Therefore, the thicknesses of the protective layers 121a and 121b and the top protective layers 123a and 123b may vary depending on the chemical and physical characteristics of the metal substrate 100, It is preferable to suitably select and form it so that it is not too thin or thick in the range of 0.2 to 20 mu m.

In the present invention, the passivation layers 111a and 111b formed on the surfaces 101a and 101b of the metal substrate 100 may have a thickness of 0.2 to 20 μm, The thickness of the protective layers 123a and 123b is 0.005 to 0.5 times the thickness of the protective layers 123a and 123b, that is, 0.001 to 10 mu m.

In other words, when the thickness of the passivation layers 111a and 111b is made as thin as 0.001 탆 or less, the present invention is advantageous in that the surfaces 101a and 101b of the metal substrate 100 are less damaged, The corrosion resistance may be deteriorated because the coating film (or the oxide film) is too thin. On the other hand, when the thickness of the coating film (or the oxide film) is set to 10 m or more, There is a possibility of serious damage.

The thickness of the passive layers 111a and 111b in the present invention is determined by the passive processing heat temperature of the passive fluid 200 heated in the water tank 300 to be described later including the material of the metal base 100 T1) and the immersion time, it is preferable that the thickness is set to 0.001 to 10 mu m.

In the present invention, the passivation heat temperature T1 included in the means for forming the passivation layers 111a and 111b on the surfaces 101a and 101b of the metal substrate 100 is the temperature The passive fluid 200 is heated to a temperature ranging from 60 ° C to a boiling point (also referred to as a "boiling point"), or the passive fluid 200 is heated to 60 to 220 ° C It is preferable that the reaction for forming the passivation layers 111a and 111b is facilitated.

In other words, when the passivation heat temperature T1 is set to a low temperature of 60 占 폚 or less, the reaction of the passivation solution 200 is lowered and the passive layers 111a and 111b are formed on the surfaces 101a and 101b of the metal substrate 100, If the passivation treatment heat temperature T1 is set to a boiling point range or higher than 220 deg. C, evaporation of the passive solution 200 is serious and loss is generated. The passive heat treatment temperature T1 according to the present invention is in the range of 60 ° C to the boiling point or in the range of 60 ° C to 220 ° C in the range of 60 ° C to 220 ° C because the passivation layer 111a and 111b may not be formed, As shown in FIG.

The present invention is also applicable to another embodiment of the passive solution 200 included in the means for forming more dense and rigid passive layers 111a and 111b on the surfaces 101a and 101b of the metal base 100 Examples include ethanol with 78.3 ° C boiling point, methanol at 64.65 ° C, isopropyl alcohol at 82 ° C, butyl alcohol at 117.7 ° C, octyl at 194.5 ° C Octyl alcohol, or a mixture of acetone having a boiling point of 56.5 ° C and methyl ethyl ketone having a boiling point of 56.5 ° C, (Methyl ethyl ketone), and 115.9 ° C (methyl isobutyl ketone). The ketone-based material may be a volatile ketone-based material prepared by mixing at least one selected from the group consisting of methyl ethyl ketone and methyl isobutyl ketone at 115.9 ° C.

In addition, in the present invention, for example, a water tank (not shown) which is included in the means for forming the passivation layers 111a and 111b on the surfaces 101a and 101b of the metal substrate 100, 300 is immersed in the immersion liquid 200 in the range of 1 to 30 minutes as described above.

For example, when the time for immersing the metal substrate 100 in the passive solution 200 is set to be too short as 1 minute or less, the reaction of the passive solution 200 is lowered and the surfaces 101a and 101b of the metal substrate 100 The passive layers 111a and 111b may not be densely formed on the first passivation layer 111a and 111b while the passive layers 111a and 111b are formed on the passive layer 111a and 111b, , 111b, that is, the process time for the passivation process becomes unnecessarily long, which may cause an economical waste. Therefore, it is preferable that the present invention is suitably selected within the range of 1 to 30 minutes.

The passivation layers 111a and 111b of the present invention thus formed are improved in corrosion resistance against the metal base 100 and protected by a protective layer including different kinds of metal layers 122a and 122b 121a and 121b and the top protective layers 123a and 123b and the like in order to improve the adhesion of the metal or the coating film to the coating film.

Meanwhile, the present invention can sufficiently remove foreign substances adhering to the surfaces 101a and 101b through a sufficient degreasing and cleaning process before immersing the metal substrate 100 in the water bath 300 filled with the passive solution 200 It would be desirable to remove it.

In other words, when foreign substances are present on the surfaces 101a and 101b of the metal substrate 100, the passive liquid 200 is not uniformly applied to the passive surface due to the surface tension, 111b may be adversely affected.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention.

Therefore, the technical scope of the present invention should be defined by the claims of the present invention, rather than being limited to those described in various exemplary embodiments as mentioned above.

100: metal substrate
101a, 101b: surface
111a, 111b: passivation layer (passivation layer)
121a, 121b: protective layer
122a and 122b: a heterogeneous metal layer
123a and 123b: a top protective layer
200: Passive solution
300: aquarium

Claims (11)

In a surface treatment method of a metal base material comprising any one of magnesium, a magnesium alloy, aluminum, and an aluminum alloy,
Heating the passive fluid 200 having a pH of 6 to 8 selected from non-volatile water or distilled water filled in the water tank 300 to a passivation heat temperature T1 of 60 ° C to a boiling point;
The metal substrate 100 is immersed in the passive solution 200 heated to the passivation heat temperature T1 for 1 to 30 minutes to react with the surface 200 of the metal substrate 100 (101a, 101b); forming a passivation layer (111a, 111b) on the passivation layer;
Removing the metal substrate 100 on which the passive layers 111a and 111b are formed from the water bath 300 and heat treating the metal substrate 100 at 40 to 200 ° C. In a surface treatment method of a metal base material comprising any one selected from the group consisting of magnesium, a magnesium alloy, aluminum, and an aluminum alloy,
Heating the passive fluid 200 having a pH of 6 to 8 selected from non-volatile water or distilled water filled in the water tank 300 to a passivation heat temperature T1 in the range of 60 to 220 占 폚;
The metal substrate 100 is immersed in the passive solution 200 heated to the passivation heat temperature T1 for 1 to 30 minutes to react with the surface 200 of the metal substrate 100 (101a, 101b); forming a passivation layer (111a, 111b) on the passivation layer;
Removing the metal substrate 100 on which the passive layers 111a and 111b are formed from the water bath 300 and heat treating the metal substrate 100 at 40 to 200 ° C. delete delete delete The method of manufacturing a semiconductor device according to any one of claims 1 to 7, wherein a different kind of metal layer (122a) having different conductivity from the metal base material (100a) is formed on one or both of the passive layers (111a, 111b) , 122b) on the surface of the metal substrate (10). 7. The method of claim 6, wherein the dissimilar metal layers 122a and 122b are formed of a metal such as Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn , Zr, Fe, Ca, Li and Be, and is deposited and formed in a vacuum atmosphere of 10 -3 to 10 -6 Torr. The method of claim 6, wherein the dissimilar metal layers (122a, 122b) are formed of a metal such as Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn , Zr, Fe, Ca, Li and Be, and is deposited and formed in a vacuum atmosphere of 10 -3 to 10 -6 Torr. 7. The method of claim 6, wherein the dissimilar metal layers 122a and 122b are formed of a metal such as Al, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn , Zr, Fe, Ca, Li, and Be, and is formed by wet plating in the air. The method of claim 6, wherein the dissimilar metal layers (122a, 122b) are formed of a metal such as Mg, Cu, Ti, Ag, Ni, Si, Cr, Mn, Mo, Zn , Zr, Fe, Ca, Li, and Be, and is formed by wet plating in the air. The method of claim 6, further comprising forming top protective layers (123a, 123b) on the dissimilar metal layers (122a, 122b) with a coating film having a thickness of 0.2 to 20 占 퐉 (2).
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KR101601513B1 (en) * 2014-10-24 2016-03-08 주식회사 위스코하이텍 Method for manufacturing of base metal

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JP2006063392A (en) * 2004-08-26 2006-03-09 Seiko Epson Corp Oxide film formation method, oxide film, parts and electronic equipment
KR20090036133A (en) * 2006-07-25 2009-04-13 바스프 에스이 Method of passivating metallic surfaces by means of copolymers having phosphoric and/or phosphonic acid groups

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JP2006063392A (en) * 2004-08-26 2006-03-09 Seiko Epson Corp Oxide film formation method, oxide film, parts and electronic equipment
KR20090036133A (en) * 2006-07-25 2009-04-13 바스프 에스이 Method of passivating metallic surfaces by means of copolymers having phosphoric and/or phosphonic acid groups

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101601513B1 (en) * 2014-10-24 2016-03-08 주식회사 위스코하이텍 Method for manufacturing of base metal

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