WO2015041113A1

WO2015041113A1 - Coil component

Info

Publication number: WO2015041113A1
Application number: PCT/JP2014/073909
Authority: WO
Inventors: 利夫河端; 安史武田
Original assignee: 株式会社村田製作所
Priority date: 2013-09-20
Filing date: 2014-09-10
Publication date: 2015-03-26

Abstract

A coil component (100) comprises a plurality of magnetic body layers (1a-1w), a plurality of coil patterns (5c-5v), and conductor via holes (6c-6u). A laminated body (2) is constituted by the magnetic body layers (1a-1w) and the coil patterns (5c-5v). Coils (4a, 4b) are formed by connecting, in a prescribed order, the coil patterns (5c-5v) and the conductor via holes (6c-6u). The present invention is characterized in that the coils (4a, 4b) are formed so as to be arranged in a direction that is parallel to the lamination plane of the laminated body (2), the axis of the coils is parallel to the lamination plane of the laminated body (2), and the coils are mutually connected in series.

Description

Coil parts

The present invention relates to a coil component, and more particularly to a coil component having a low DC resistance and a high Q.

As a coil component that has been widely used conventionally, there is a coil component disclosed in Patent Document 1 (WO 2007/040029).

FIG. 15 shows a coil component 300 disclosed in Patent Document 1. However, FIG. 15 is an exploded perspective view of the coil component 300.

The coil component 300 includes a laminated body 103 in which a plurality of magnetic layers 101 and a plurality of coil patterns 102 are laminated.

Although not shown, a pair of external electrodes is formed on both ends of the laminate 103.
In the predetermined magnetic layer 101, a conductor via hole 104 is formed so as to penetrate between both main surfaces. The coil pattern 102 and the conductor via hole 104 are connected in a predetermined order to form a coil.

WO2007 / 040029 publication

There is a need for a coil component having a low DC resistance and a high Q.
In the coil component 300 shown in FIG. 15, as a method for reducing the direct current resistance and increasing the Q, for the coil pattern 102, a method of increasing the film thickness or a method of increasing the coil width can be considered. With regard to 104, a method of increasing the diameter or a method of increasing the number to be formed can be considered.

However, the method of increasing the film thickness of the coil pattern 102 has a problem that the surface of the multilayer body 103 is raised only by a portion where the coil pattern 102 is formed. That is, the appearance of the coil component 300 may be defective. There was also a risk that defects would occur in the internal structure. These problems become more serious when the coil component 300 is seen through in the plane direction and a plurality of coil patterns 102 are formed so as to overlap each other.

Further, the method of increasing the coil width of the coil pattern 102 has a problem that the inductance value of the coil component 300 is decreased. In particular, when the coil width of the coil pattern 102 becomes wider in the axial direction of the coil, there is a problem that the inductance value is greatly reduced. To reduce the inductance value, the coil length may be increased to increase the inductance value. However, in order to increase the coil length, the number of magnetic layers 101 may be increased, There is a problem that the size in the planar direction has to be increased, and the coil component 300 itself is increased in size.

The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a coil component in which the inductance value does not decrease even if the width of the coil pattern is increased.

As a means for this, the coil component of the present invention includes a plurality of laminated magnetic layers, a plurality of coil patterns formed between the layers of the magnetic layers, and at least one of the magnetic layers that penetrates between both main surfaces. And a conductor via hole formed, a laminated body is constituted by a magnetic layer and a coil pattern, and a coil is constituted by connecting the coil pattern and the conductor via hole in a predetermined order. A plurality of coils are formed so as to be aligned in a direction parallel to the laminate surface of the laminate, and each of the plurality of coils has an axial core parallel to the laminate surface of the laminate, and the plurality of coils are connected in series. It is characterized by.

In the coil component of the present invention, even if the width of the coil pattern (coil width) is increased and the direct current resistance is reduced, the inductance value is not greatly reduced.

For example, the number of coils can be two.
As the magnetic layer, a material formed of ferrite or a material obtained by coating a metal magnetic powder with an insulating material as a main material can be used.

In at least one of the magnetic layers, a non-magnetic via hole formed through both main surfaces may be further formed. In this case, the DC superposition characteristics of the coil are improved.

When a certain magnetic layer is viewed, a coil pattern disposed on one main surface side of the magnetic layer and a coil pattern disposed on the other main surface side are formed on the magnetic layer. Alternatively, they may be connected via a plurality of conductor via holes. In this case, the interlayer connection between the two coil patterns is made by a plurality of conductor via holes formed in the magnetic layer, and the DC resistance of the interlayer connection portion can be reduced. Moreover, it contributes to the improvement of the Q of the coil. In addition, the interlayer connection between two coil patterns may be made via a plurality of conductor via holes formed in one magnetic layer, or a plurality of conductors formed respectively in the plurality of magnetic layers. In some cases, this is done via a via hole.

Since the coil component according to the present invention has the above-described configuration, the DC resistance is small and the Q is high.

1 is a perspective view showing a coil component 100 according to a first embodiment. 2 is an exploded perspective view of a coil component 100. FIG. 2 to 6, one coil component 100 is configured. FIG. 3 is an exploded perspective view of the coil component 100 continued from FIG. 2. FIG. 4 is an exploded perspective view of the coil component 100 that is a continuation of FIG. 3. FIG. 5 is an exploded perspective view of the coil component 100 that is a continuation of FIG. 4. FIG. 6 is a continuation of FIG. 5 and is an exploded perspective view of the coil component 100. It is a top view of coil component 100 concerning a 1st embodiment. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. It is a perspective view which shows the coil component 200 which concerns on 2nd Embodiment. 2 is an exploded perspective view of a coil component 200. FIG. 11 to 13, one coil component 200 is configured. FIG. 11 is an exploded perspective view of the coil component 200, which is a continuation of FIG. FIG. 12 is an exploded perspective view of the coil component 200, which is a continuation of FIG. FIG. 13 is a continuation of FIG. 12 and an exploded perspective view of the coil component 200. It is a graph which shows the direct current superimposition characteristic of the coil component 100 which concerns on an Example, and the coil component 400 which concerns on a comparative example. It is a disassembled perspective view of the conventional coil component 300. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
1 and 2 to 6 show a coil component 100 according to a first embodiment of the present invention. However, FIG. 1 is a perspective view of the coil component 100. 2 to 6 are exploded perspective views of the coil component 100, and one coil component 100 is configured in FIGS.

The coil component 100 includes a rectangular parallelepiped laminate 2 in which 23 magnetic layers 1a to 1w are laminated in order from the top. In the present embodiment, the magnetic layers 1a to 1w are made of ferrite. However, the magnetic layers 1a to 1w may be formed by using, as a main material, for example, a metal magnetic powder such as Fe coated with an insulating material such as Si instead of ferrite. In addition, what coated metal magnetic substance powder with the insulating substance includes what formed the oxide film of the alloy component on the surface of Fe type alloy, for example.

The dimensions of the laminate 2 are, for example, a length of 2.1 mm, a width of 1.25 mm, and a height of 1.0 mm.

A pair of

external electrodes

3 a and 3 b are formed at both ends of the multilayer body 2.
A first coil 4a and a second coil 4b are formed in the laminated body 2 so as to be aligned in a direction parallel to the laminated surface of the laminated body 2, and the first coil 4a and the second coil 4b are formed. Are connected in series. In the present embodiment, the first coil 4 a and the second coil 4 b are arranged in the length L direction of the multilayer body 2.

Since the first coil 4a and the second coil 4b are in a point-symmetric relationship with respect to the center when the coil component 100 is viewed from the stacking direction, the first coil 4a is the center in the following description. The second coil 4b will be described supplementarily. In FIGS. 2 to 6, the reference numerals of the components of the second coil 4b may be omitted.

As shown in FIG. 2, the magnetic layer 1a laminated first from the top is a protective layer, and nothing is formed on both main surfaces. No conductor via hole or non-magnetic via hole is formed in the magnetic layer 1a.

The magnetic layer 1b laminated second from the top is also a protective layer, and nothing is formed on both main surfaces. In the magnetic layer 1b, neither a conductor via hole nor a non-magnetic via hole is formed.

In the magnetic layer 1c laminated third from the top, the components of the first coil 4a are formed on the front side of the drawing, and the components of the second coil 4b are formed on the back side of the drawing. .

That is, on one main surface of the magnetic layer 1c, the coil pattern 5c of the first coil 4a is formed on the front side of the drawing, and the coil pattern 5c of the second coil 4b is formed on the back side of the drawing. ing. The coil pattern 5c of the first coil 4a is connected to the first external electrode 3a, and the coil pattern 5c of the second coil 4b is connected to the second external electrode 3b.

A plurality of conductor via holes 6c are formed in one row at one end portion of the coil pattern 5c of the first coil 4a through the magnetic layer 1c, and one of the coil patterns 5c of the second coil 4b is formed. A plurality of conductor via holes 6c are formed in one row at the end portion.

Further, a plurality of non-magnetic via holes 7c are formed in one row outside the both sides of the coil pattern 5c of the first coil 4a through the magnetic layer 1c, and both sides of the second coil 4b are formed. A plurality of non-magnetic via holes 7c are formed in one row on the outside of the side.

The coil pattern 5c has, for example, Ag as a main component. The conductor via hole 6c has, for example, Ag as a main component. The nonmagnetic via hole 7c has, for example, Zn ferrite as a main component. These materials are formed in the magnetic layer 1d-1g, 1s-1v, the coil pattern formed in the magnetic layers 1d-1g, the conductor via holes formed in the magnetic layers 1d-1u, and the magnetic layers 1d-1v described below. The same applies to nonmagnetic via holes.

The film thickness of the coil pattern 5c is, for example, 30 μm. The diameter of the conductor via hole 6c is, for example, 20 μm. The diameter of the nonmagnetic via hole 7c is, for example, 20 μm. These dimensions are described below. Coil patterns formed in magnetic layers 1d to 1g and 1s to 1v, conductor via holes formed in magnetic layers 1d to 1u, and magnetic layers 1d to 1v. The same applies to nonmagnetic via holes.

The coil pattern 5c of the first coil 4a and the coil pattern 5c of the second coil 4b each have a coil width w.

If the film thickness is constant, the larger the coil width w, the smaller the DC resistance, which is desirable.
In the coil component 100 according to the present embodiment, the specific value of the coil width w of the coil pattern 5c is 850 μm.

Hereinafter, the magnetic layers 1d to 1w that are stacked from the top to the fourth will be described. However, as described above, the first coil 4a will be mainly described, and the second coil 4b may be used as necessary. Will be explained supplementarily. Further, as described above, in FIGS. 2 to 6, the reference numerals of the components of the second coil 4b may be omitted.

A coil pattern 5d of the first coil 4a is formed on one main surface of the magnetic layer 1d that is laminated fourth from the top.

A plurality of conductor via holes 6d are formed in two rows at one end portion of the coil pattern 5d through the magnetic layer 1d, and a plurality of conductor via holes 6d are formed in one row at the other end portion of the coil pattern 5d. ing. The coil pattern 5d is connected to one row of the two rows of conductor via holes 6d formed at one end portion. The coil pattern 5d is connected to a row of conductor via holes 6d formed at the other end portion.

Further, a plurality of nonmagnetic via holes 7d are formed in one row on the outer sides of both sides of the coil pattern 5d through the magnetic layer 1d.

Referring to FIG. 3, a coil pattern 5e of the first coil 4a is formed on one main surface of the magnetic layer 1e stacked fifth from the top.

A plurality of conductor via holes 6e are formed in three rows at one end portion of the coil pattern 5e through the magnetic layer 1e, and a plurality of conductor via holes 6e are formed in the other end portion of the coil pattern 5e. ing. The coil pattern 5e is connected to one row of the three rows of conductor via holes 6e formed at one end portion. The coil pattern 5e is connected to one row of the two rows of conductor via holes 6e formed at the other end portion.

Further, a plurality of non-magnetic via holes 7e are formed in one row on the outside of both sides of the coil pattern 5e through the magnetic layer 1e.

A coil pattern 5f of the first coil 4a is formed on one main surface of the magnetic layer 1f stacked sixth from the top.

A plurality of conductor via holes 6e are formed in four rows at one end portion of the coil pattern 5f through the magnetic layer 1f, and a plurality of conductor via holes 6f are formed in three rows at the other end portion of the coil pattern 5f. ing. The coil pattern 5f is connected to one of the four rows of conductor via holes 6f formed at one end portion. The coil pattern 5f is connected to one of the three rows of conductor via holes 6f formed at the other end.

Further, a plurality of nonmagnetic via holes 7f are formed in one row on the outer sides of both sides of the coil pattern 5f through the magnetic layer 1f.

The coil pattern 5g of the first coil 4a is formed on the front side of the drawing on the one main surface of the magnetic layer 1g that is laminated seventh from the top. A coil pattern 5g of the second coil 4b is also formed on the one main surface of the magnetic layer 1g on the back side of the drawing. The coil pattern 5g of the first coil 4a and the coil pattern 5g of the second coil 4b are connected. As described above, the first coil 4a and the second coil 4b are connected in series, but both are connected in this portion.

Hereinafter, the first coil 4a will be described again, and the second coil 4b will be supplementarily described as necessary.

A plurality of conductor via holes 6g are formed in four rows at one end portion of the coil pattern 5g through the magnetic layer 1g, and a plurality of conductor via holes 6g are formed in the other end portion of the coil pattern 5g. ing. The coil pattern 5g is not connected to the four rows of conductor via holes 6g formed at one end portion. The coil pattern 5g is connected to one of the four rows of conductor via holes 6g formed at the other end portion.

Further, a plurality of non-magnetic via holes 7g are formed in one row on the outside of both sides of the coil pattern 5g through the magnetic layer 1g.

Referring to FIG. 4, the coil pattern is not formed on the main surface of the magnetic layer 1h stacked eighth from the top.

Two sets of four rows of conductive via holes 6h penetrating through the magnetic layer 1h are formed in a total of eight rows.

Two rows of non-magnetic via holes 7h are formed so as to penetrate the magnetic layer 1h and sandwich the eight rows of conductor via holes 6h.

The 9th to 18th magnetic layers 1i to 1r stacked from the top have the same structure as the magnetic layer 1h, respectively. That is, the magnetic layers 1i to 1r are formed with conductor via holes 6i to 6r and non-magnetic via holes 7i to 7r, respectively. In FIG. 4, the illustration of the reference numerals of the conductor via holes 6i to 6r and the nonmagnetic via holes 7i to 7r is omitted for easy viewing.

Referring to FIG. 5, a coil pattern 5 s of the first coil 4 a is formed on one main surface of the magnetic layer 1 s that is stacked 19th from the top.

A plurality of conductor via holes 6s are formed in three rows at one end portion of the coil pattern 5s through the magnetic layer 1s, and a plurality of conductor via holes 6s are formed in three rows at the other end portion of the coil pattern 5s. ing. The coil pattern 5s is not connected to the three rows of conductor via holes 6s formed at one end portion, and is not connected to the three rows of conductor via holes 6s formed at one end portion.

Further, a plurality of nonmagnetic via holes 7s are formed in one row on the outer sides of both sides of the coil pattern 5s through the magnetic layer 1s.

A coil pattern 5t of the first coil 4a is formed on one main surface of the magnetic layer 1t stacked 20th from the top.

A plurality of conductor via holes 6t are formed in two rows at one end portion of the coil pattern 5t through the magnetic layer 1t, and a plurality of conductor via holes 6t are formed in two rows at the other end portion of the coil pattern 5t. ing. The coil pattern 5t is not connected to the two rows of conductor via holes 6t formed at one end portion, and is not connected to the two rows of conductor via holes 6t formed at one end portion.

Further, a plurality of non-magnetic via holes 7t are formed in one row on the outer sides of both sides of the coil pattern 5t through the magnetic layer 1t.

A coil pattern 5u of the first coil 4a is formed on one main surface of the magnetic layer 1u that is laminated 21st from the top.

A plurality of conductor via holes 6u are formed in one row at one end portion of the coil pattern 5u through the magnetic layer 1u, and a plurality of conductor via holes 6u are formed in one row at the other end portion of the coil pattern 5u. ing. The coil pattern 5u is not connected to one row of conductor via holes 6u formed at one end portion, and is not connected to one row of conductor via holes 6u formed at one end portion.

Further, a plurality of non-magnetic via holes 7u are formed in one row on the outside of both sides of the coil pattern 5u through the magnetic layer 1u.

Referring to FIG. 6, the coil pattern 5v of the first coil 4a is formed on the one main surface of the magnetic layer 1v that is laminated 22nd from the top.

No conductor via hole is formed in the magnetic layer 1v.
A plurality of nonmagnetic via holes 7v are formed in one row on the outer sides of both sides of the coil pattern 5v so as to penetrate the magnetic layer 1v.

The magnetic layer 1w laminated on the 23rd from the top, that is, the bottom is a protective layer, and nothing is formed on both main surfaces. No conductor via hole or non-magnetic via hole is formed in the magnetic layer 1w.

The magnetic layers 1a to 1w have been described above with the first coil 4a as the center. However, the second coil 4b is a point with the center when the first coil 4a and the coil component 100 are viewed from the stacking direction. They are symmetrical and have the same components.

A first coil 4a and a second coil 4b are formed in the laminate 2 in which the magnetic layers 1a to 1w are laminated. The first coil 4a and the second coil 4b are connected in series. It is connected to the. In addition, as for the 1st coil 4a and the 2nd coil 4b, the axial center of a coil is parallel to the lamination surface of the laminated body 2, respectively.

The first coil 4a includes an external electrode 3a, a coil pattern 5c, via conductors 6c to 6u, a coil pattern 5v, via conductors 6u to 6d, a coil pattern 5d, via conductors 6d to 6t, a coil pattern 5u, and via conductors 6t to 6e. The coil pattern 5e, the via conductors 6e to 6s, the coil pattern 5t, the via conductors 6s to 6f, the coil pattern 5f, the via conductors 6f to 6r, the coil pattern 5s, the via conductors 6r to 6g, and the coil pattern 5g are connected in order. It is composed of things.

The second coil 4b includes an external electrode 3b, a coil pattern 5c, via conductors 6c to 6u, a coil pattern 5v, via conductors 6u to 6d, a coil pattern 5d, via conductors 6d to 6t, a coil pattern 5u, and via conductors 6t to 6e. The coil pattern 5e, the via conductors 6e to 6s, the coil pattern 5t, the via conductors 6s to 6f, the coil pattern 5f, the via conductors 6f to 6r, the coil pattern 5s, the via conductors 6r to 6g, and the coil pattern 5g are connected in order. It is composed of things.

Non-magnetic via holes 7c to 7v are connected inside the laminate 2. The non-magnetic via holes 7c to 7v are formed in four rows, and are formed on the outer side of both side surfaces of the first coil 4a and the outer side of both side surfaces of the second coil 4b and the first coil 4a, respectively. The non-magnetic via holes 7c to 7v play a role of improving the DC superposition characteristics of the coil.

FIG. 7 shows the coil component 100 as viewed from above. FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. FIG. 8 corresponds to a cross-sectional view of the first coil 4a cut along the way. As shown in FIG. 8, the first coil 4 a is configured to have a spiral shape by connecting a coil pattern disposed in each magnetic layer and a conductor via hole. If attention is paid to the upper part of FIG. 8, the

coil patterns

5c, 5d, 5e, 5f, and 5g are arranged in order toward the inside of the spiral shape, and the length as the conductor pattern visible in the sectional view becomes shorter in this order. Yes. If attention is paid to the lower part of FIG. 8, the

coil patterns

5v, 5u, 5t, 5s are arranged in order toward the inner side of the spiral shape, and the length as the conductor pattern visible in the sectional view is shortened in this order.

As the coil component according to the first embodiment of the present invention, it can be said that it is preferable that the coil pattern and the via conductor form a spiral shape when seen from the side surface adjacent to the laminated surface of the laminated body 2. Since the coil has such a spiral shape, the inductance value can be increased.

The coil component 100 according to the first embodiment having the above structure is manufactured by, for example, the following method.

First, in order to produce NiZnCu ferrite, a predetermined amount of oxide raw materials are mixed and calcined at 800 ° C. for 1 hour to produce a calcined ferrite body.

Next, the calcined ferrite body is pulverized with a ball mill and dried to prepare a ferrite powder having an average particle diameter of 2 μm.

Next, the ferrite powder is mixed with a solvent, a binder, and a dispersant, and a green sheet for a magnetic layer having a thickness of 35 μm is prepared by a doctor blade method. The magnetic layer green sheet is a mother green sheet, and a large number of magnetic layers can be obtained from each magnetic layer green sheet.

Next, a 20 μm via hole necessary for forming a conductor via hole or a non-magnetic via hole is formed on the magnetic layer green sheet depending on which of the magnetic layers 1a to 1w is used. If not necessary, no via hole is formed in the magnetic layer green sheet.

Next, a conductive paste mainly composed of Ag prepared in advance is applied to the green sheet for the magnetic layer depending on which of the magnetic layers 1a to 1w is used, and the coil pattern and the conductor via hole are applied. And form. At this time, the film thickness of the coil pattern was 30 μm. In addition, a coil pattern and a conductor via hole are not formed in the unnecessary green sheet for a magnetic layer.

Next, a nonmagnetic paste prepared in advance is applied to the green sheet for the magnetic layer depending on which of the magnetic layers 1a to 1w is used, thereby forming a nonmagnetic via hole. Note that a non-magnetic via hole is not formed in the unnecessary magnetic layer green sheet.

Next, the magnetic layer green sheets are laminated in a predetermined order, thermocompression-bonded, and then cut into individual unfired laminates.

Next, the unfired laminate was subjected to binder removal treatment at 400 ° C. for 3 hours, then fired at 900 ° C. for 2 hours, further chamfered with a barrel, length 2.0 mm, width 1. A laminate 2 having a height of 25 mm and a height of 1.0 mm is produced.

Next, a conductive paste mainly composed of Ag is applied to both end portions of the laminate 2 so that the dimension of the folded portion is 0.5 mm, and baking is performed at 800 ° C., followed by barrel plating. Then, Ni plating and Sn plating are formed, and further washed and dried to complete the coil component 100.

The coil component 100 according to the first embodiment manufactured by the above method has an inductance of 0.84 μH and a DC resistance of 29 mΩ. In the coil component 100, since the film thickness of each of the coil patterns 5c to 5v was as small as 30 μm, no defect occurred in the appearance of the laminate 2. Also, even within the laminate 2, there is no delamination or cracks in the magnetic layers 1a to 1w, and the internal structures such as the coil patterns 5c to 5v, the conductor via holes 6c to 6u, and the nonmagnetic via holes 7c to 7v are provided. There was no deformation or the like.

[Second Embodiment]
9 and 10 to 13 show a coil component 200 according to the second embodiment of the present invention. However, FIG. 9 is a perspective view of the coil component 200. 10 to 13 are exploded perspective views of the coil component 200, and one coil component 200 is configured in FIGS.

The coil component 200 includes a rectangular parallelepiped laminated body 12 in which eleven magnetic layers 11a to 1k are laminated in order from the top. In this embodiment, the magnetic layers 11a to 11k are mainly formed by coating a metal magnetic material powder containing Fe as a main component with an insulating material such as Si. In addition, what coated metal magnetic substance powder with the insulating substance includes what formed the oxide film of the alloy component on the surface of Fe type alloy, for example.

The dimensions of the laminate 12 are, for example, a length of 1.6 mm, a width of 0.8 mm, and a height of 0.8 mm.

A pair of

external electrodes

13 a and 13 b are formed at both ends of the multilayer body 12.
A first coil 14a and a second coil 14b are formed inside the laminated body 12 so as to be aligned in a direction parallel to the laminated surface of the laminated body 12, and the first coil 14a and the second coil 14b are formed. Are connected in series. In the present embodiment, the first coil 14 a and the second coil 14 b are arranged in the width S direction of the multilayer body 12.

As shown in FIG. 10, the magnetic layer 11a stacked first from the top is a protective layer, and nothing is formed on both main surfaces. No conductor via hole is formed in the magnetic layer 11a.

The magnetic layer 11b that is stacked second from the top is formed with the components of the first coil 14a on the front side of the drawing and the components of the second coil 14b on the back side of the drawing. .

That is, on one main surface of the magnetic layer 11b, a coil pattern 15b of the first coil 14a is formed on the front side of the drawing, and a coil pattern 15b of the second coil 14b is formed on the back side of the drawing. ing.

Conductive via holes 16b are formed in both end portions of the coil pattern 15b of the first coil 14a through the magnetic layer 11b, and conductive via holes 16b are formed in both end portions of the coil pattern 15b of the second coil 14b. Are formed respectively. The coil patterns 15b are connected to the conductor via holes 16b at both ends.

The coil pattern 15b is mainly composed of Cu, for example. The conductor via hole 16b has, for example, Cu as a main component. These materials are the same for the coil patterns formed in the magnetic layers 11c to 11k and the conductor via holes formed in the magnetic layers 11c to 11j described below.

The film thickness of the coil pattern 15b is, for example, 30 μm. The conductor via hole 16b has a rectangular shape of 90 μm × 90 μm, for example. These dimensions are the same for the coil patterns and conductor via holes formed in the magnetic layers 11c to 11j described below.

The coil pattern 15b of the first coil 14a and the coil pattern 15b of the second coil 14b each have a coil width w.

If the film thickness is constant, the larger the coil width w, the smaller the DC resistance, which is desirable.
A coil pattern 15c of the first coil 14a and a coil pattern 15c of the second coil 14b are formed on one main surface of the magnetic layer 11c stacked third from the top.

Two conductor via holes 16c are formed at both ends of the coil pattern 15c of the first coil 14a through the magnetic layer 11c. Further, two conductor via holes 16c are formed in both end portions of the coil pattern 15c of the second coil 14b so as to penetrate the magnetic layer 11c. Each of the coil patterns 15c is connected to one of the two conductor via holes 16c at both end portions.

Referring to FIG. 11, a coil pattern 15d of the first coil 14a and a coil pattern 15d of the second coil 14b are formed on one main surface of the magnetic layer 11d stacked fourth from the top. ing.

Three conductor via holes 16d are formed in both end portions of the coil pattern 15d of the first coil 14a through the magnetic layer 11d. Further, three conductor via holes 16d are formed in both end portions of the coil pattern 15d of the second coil 14b through the magnetic layer 11d. Each of the coil patterns 15d is connected to one of the three conductor via holes 16d at both end portions.

A coil pattern 15e of the first coil 14a and a coil pattern 15e of the second coil 14b are formed on one main surface of the magnetic layer 11e laminated fifth from the top.

Four conductor via holes 16e are formed in both end portions of the coil pattern 15e of the first coil 14a so as to penetrate the magnetic layer 11e. Further, four conductor via holes 16e are formed in both end portions of the coil pattern 15e of the second coil 14b so as to penetrate the magnetic layer 11e. Each of the coil patterns 15e is connected to one of the four conductor via holes 16e at both ends.

The coil pattern is not formed on the main surface of the magnetic layer 11f stacked sixth from the top.

Four conductor via holes 16f of the first coil 14a are formed on both the left and right sides on the front side of the magnetic layer 11f through the magnetic layer 11f. Further, four conductor via holes 16f of the second coil 14b are formed on both the left and right sides on the back side of the magnetic layer 11f through the magnetic layer 11f.

Referring to FIG. 12, the coil pattern 15g of the first coil 14a is formed on the front side of the drawing on the one main surface of the magnetic layer 11g that is laminated seventh from the top. A coil pattern 15g of the second coil 14b is also formed on the one main surface of the magnetic layer 11g on the back side of the drawing. The coil pattern 15g of the first coil 14a and the coil pattern 15g of the second coil 14b are connected. As described above, the first coil 14a and the second coil 14b are connected in series, but both are connected in this portion.

Through the magnetic layer 11g, three conductor via holes 16g are formed at one end portion of the coil pattern 15g of the first coil 14a, and four conductor via holes 16g are formed at the other end portion. Further, three conductor via holes 16g are formed at one end portion of the coil pattern 15g of the second coil 14b through the magnetic layer 11g, and four conductor via holes 16g are formed at the other end portion. None of the coil patterns 15g is connected to the conductor via hole 16g.

A coil pattern 15h of the first coil 14a and a coil pattern 15h of the second coil 14b are formed on one main surface of the magnetic layer 11h stacked eighth from the top.

Through the magnetic layer 11h, two conductor via holes 16h are formed at one end portion of the coil pattern 15h of the first coil 14a, and three conductor via holes 16h are formed at the other end portion. Further, two conductor via holes 16h are formed in one end portion of the coil pattern 15h of the second coil 14b and three conductor via holes 16h are formed in the other end portion, penetrating the magnetic layer 11h. None of the coil patterns 15h are connected to the conductor via hole 16h.

A coil pattern 15i of the first coil 14a and a coil pattern 15i of the second coil 14b are formed on one main surface of the magnetic layer 11i that is laminated ninth from the top.

One conductor via hole 16i is formed at one end portion of the coil pattern 15i of the first coil 14a and two conductor via holes 16i are formed at the other end portion, penetrating the magnetic layer 11i. Further, two conductor via holes 16i are formed at one end portion of the coil pattern 15i of the second coil 14b and one conductor via hole 16i is formed at the other end portion, penetrating the magnetic layer 11i. None of the coil patterns 15i are connected to the conductor via hole 16i.

Referring to FIG. 13, a coil pattern 15j of the first coil 14a and a coil pattern 15j of the second coil 14b are formed on one main surface of the magnetic layer 11j laminated tenth from the top. ing.

One conductor via hole 16j is formed in one end portion of the coil pattern 15j of the first coil 14a through the magnetic layer 11j. Further, one conductor via hole 16j is formed at one end portion of the coil pattern 15j of the second coil 14b so as to penetrate the magnetic layer 11j. None of the coil patterns 15j is connected to the conductor via hole 16j.

A coil pattern 15k of the first coil 14a and a coil pattern 15k of the second coil 14b are formed on one main surface of the magnetic layer 11k that is stacked eleventh from the top. The coil pattern 15k of the first coil 14a is connected to the external electrode 13a, and the coil pattern 15k of the second coil 14b is connected to the external electrode 13a.

A first coil 14a and a second coil 4b are formed in the laminated body 12 in which the magnetic layers 11a to 11k are laminated. As described above, the first coil 14a and the second coil 4b are formed. The coil 14b is connected in series. In addition, as for the 1st coil 14a and the 2nd coil 14b, the axial center of a coil is parallel to the lamination surface of the laminated body 12, respectively.

The first coil 14a includes an external electrode 13a, a coil pattern 15k, via conductors 6j to 6b, a coil pattern 15b, via conductors 16b to 16i, a coil pattern 15j, via conductors 16i to 16c, a coil pattern 15c, and via conductors 16c to 16h. The coil pattern 15i, the via conductors 16h to 16d, the coil pattern 15d, the via conductors 16d to 16g, the coil pattern 15h, the via conductors 16g to 16e, the coil pattern 15e, the via conductors 16e to 6f, and the coil pattern 15g are connected in order. It is composed of things.

The second coil 14b includes an external electrode 13b, a coil pattern 15k, via conductors 6j to 6b, a coil pattern 15b, via conductors 16b to 16i, a coil pattern 15j, via conductors 16i to 16c, a coil pattern 15c, and via conductors 16c to 16h. The coil pattern 15i, the via conductors 16h to 16d, the coil pattern 15d, the via conductors 16d to 16g, the coil pattern 15h, the via conductors 16g to 16e, the coil pattern 15e, the via conductors 16e to 6f, and the coil pattern 15g are connected in order. It is composed of things.

As the second embodiment of the present invention, the example in which the first coil 14a and the second coil 14b are arranged in the width S direction of the stacked body 12 has been described. The coil component according to the second embodiment of the present invention further includes

external electrodes

13a and 13b on side surfaces adjacent to each other and facing each other on the laminated surface of the laminated body 12, and a direction perpendicular to the direction in which the

external electrodes

13a and 13b face each other. It can be said that it is preferable that a plurality of coils are formed so as to line up. In this way, by configuring a plurality of coils so that they are arranged in a direction perpendicular to the direction in which the external electrodes face each other, magnetic flux generated from the coils does not pass through the external electrodes, and eddy currents are generated in the external electrodes. Therefore, a high Q value can be obtained.

The coil component 200 according to the second embodiment having the above structure is manufactured by, for example, the following method.

Prepare 11 magnetic sheets with copper foil attached to the surface. The magnetic material sheet is formed mainly by coating a metal magnetic material powder containing Fe as a main component with an insulating substance such as Si. The magnetic sheet is a mother sheet, and a large number of magnetic layers are produced from each magnetic sheet.

First, the copper foils on the surface of the nine magnetic sheets for the magnetic layers 11b to 11e and the magnetic layers 11g to 11k are etched to form coil patterns 15b to 15e having a predetermined shape, and coil patterns, respectively. 15g to 15k are formed. In addition, as the magnetic material sheet for the magnetic material layer 11a and the magnetic material layer 11f, a magnetic material sheet having no copper foil formed on the surface is prepared separately from the beginning.

Next, the magnetic material sheet for the magnetic material layer 11j is stacked on the magnetic material sheet for the magnetic material layer 11k and pressure-bonded.

Next, a hole for forming the conductor via hole 16j is formed in the magnetic material sheet for the magnetic material layer 11j.

Next, the hole formed in the magnetic material sheet for the magnetic material layer 11j is plated to form a conductor via hole 16j. Each conductor via hole 16j is connected to a coil pattern 15k.

Next, the magnetic sheet for the magnetic layer 11i is overlaid and pressure-bonded on the magnetic sheet for the magnetic layer 11j.

Next, a hole for forming the conductor via hole 16i is formed in the magnetic material sheet for the magnetic material layer 11i.

Next, the hole formed in the magnetic material sheet for the magnetic material layer 11i is plated to form a conductor via hole 16i. Conductive via hole 16i is connected to either coil pattern 15j or conductive via hole 16j, respectively.

Next, the magnetic sheet for the magnetic layer 11h is stacked on the magnetic sheet for the magnetic layer 11i and pressure-bonded.

Next, a hole for forming the conductor via hole 16h is formed in the magnetic material sheet for the magnetic material layer 11h.

Next, the hole formed in the magnetic sheet for the magnetic layer 11h is plated to form a conductor via hole 16h. The conductor via hole 16h is connected to either the coil pattern 15i or the conductor via hole 16i.

Next, a magnetic sheet for the magnetic layer 11g is overlaid on the magnetic sheet for the magnetic layer 11h, and pressure-bonded.

Next, a hole for forming the conductor via hole 16g is formed in the magnetic material sheet for the magnetic material layer 11g.

Next, the inside of the hole formed in the magnetic material sheet for the magnetic material layer 11g is plated to form a conductor via hole 16g. The conductor via hole 16g is connected to either the coil pattern 15h or the conductor via hole 16h.

Next, the magnetic material sheet for the magnetic material layer 11f is stacked on the magnetic material sheet for the magnetic material layer 11g and pressure-bonded.

Next, a hole for forming the conductor via hole 16f is formed in the magnetic material sheet for the magnetic material layer 11f.

Next, the hole formed in the magnetic material sheet for the magnetic material layer 11f is plated to form a conductor via hole 16f. The conductor via hole 16f is connected to either the coil pattern 15g or the conductor via hole 16g.

Next, the magnetic sheet for the magnetic layer 11e is overlaid on the magnetic sheet for the magnetic layer 11f and pressure-bonded.

Next, a hole for forming the conductor via hole 16e is formed in the magnetic material sheet for the magnetic material layer 11e.

Next, the hole formed in the magnetic material sheet for the magnetic material layer 11e is plated to form the conductor via hole 16e. The conductor via hole 16e is connected to the conductor via hole 16f.

Next, the magnetic sheet for the magnetic layer 11d is overlaid on the magnetic sheet for the magnetic layer 11e, and pressure-bonded.

Next, a hole for forming the conductor via hole 16d is formed in the magnetic material sheet for the magnetic material layer 11d.

Next, the inside of the hole formed in the magnetic material sheet for the magnetic material layer 11d is plated to form the conductor via hole 16d. The conductor via hole 16d is connected to either the coil pattern 15e or the conductor via hole 16e.

Next, the magnetic material sheet for the magnetic material layer 11c is stacked on the magnetic material sheet for the magnetic material layer 11d and pressure-bonded.

Next, a hole for forming the conductor via hole 16c is formed in the magnetic sheet for the magnetic layer 11c.

Next, the hole formed in the magnetic material sheet for the magnetic material layer 11c is plated to form a conductor via hole 16c. Conductive via hole 16c is connected to either coil pattern 15d or conductive via hole 16d.

Next, the magnetic material sheet for the magnetic material layer 11b is stacked on the magnetic material material sheet for the magnetic material layer 11c and pressure-bonded.

Next, a hole for forming the conductor via hole 16b is formed in the magnetic sheet for the magnetic layer 11b.

Next, the hole formed in the magnetic material sheet for the magnetic material layer 11b is plated to form a conductor via hole 16b. The conductor via hole 16b is connected to either the coil pattern 15c or the conductor via hole 16c.

Next, the magnetic sheet for the magnetic layer 11a is overlaid on the magnetic sheet for the magnetic layer 11b, and pressure bonded.

Further, pressure is applied to the magnetic sheet laminate in which the magnetic sheets for the magnetic layers 11k to 11a are laminated to integrate the whole.

Next, the magnetic sheet laminate is cut to produce individual laminates 12.
Next, a conductive resin paste is applied to both ends of the laminate 12 to form the

external electrodes

13a and 13b, and the coil component 200 is completed.

The coil component 200 according to the second embodiment manufactured by the above method is also a coil component having a low DC resistance and a high Q.

Experimental example

In order to confirm the effectiveness of the present invention, the examples and comparative examples were compared.
As an example, the coil component 100 according to the first embodiment was prepared.

The external dimensions of the coil component 100 are 2.1 mm in length, 1.25 mm in width, and 1.0 mm in height.

The film thickness of the coil patterns 5d to 5v of the coil component 100 is 30 μm.
The coil width of the coil patterns 5d to 5v of the coil component 100 is 850 μm.

Other details of the coil component 100 are as described above.
The inductance value of the coil component 100 was 0.84 μH.

The DC resistance of the coil component 100 was 29 mΩ.
The DC superposition characteristics of the coil component 100 are shown in FIG.

Meanwhile, a coil component 400 was prepared as a comparative example. The basic structure of the coil component 400 is the same as that of the conventional coil component 300 shown in FIG. 15, but the details are as follows.

The external dimensions of the coil component 400 are a length of 2.0 mm, a width of 1.25 mm, and a height of 0.85 mm.

The coil component 400 includes a laminated body composed of eight layers in which seven dielectric layers and one nonmagnetic layer inserted in the middle are laminated. The nonmagnetic layer is inserted in order to improve the direct current superposition characteristics.

In the coil component 400, the upper and lower outermost magnetic layers of the laminate are protective layers, and no coil pattern is formed.

The coil component 400 has a coil pattern formed on five magnetic layers excluding the protective layer and one non-magnetic layer, and a 5.5-turn coil as a whole.

The film thickness of the coil pattern is 30 μm and the coil width is 200 μm.
The inductance of the coil component 400 was 0.81 μH.

The DC resistance of the coil component 400 was 66 mΩ.
The DC superposition characteristics of the coil component 400 are shown in FIG.

The inductance value of the coil component 100 according to the example is 0.84 μH, the inductance value of the coil component 400 according to the comparative example is 0.81 μH, and both are close to each other.

On the other hand, the DC resistance is 29 mΩ for the coil component 100 and 66 mΩ for the coil component 400, and the coil component 100 is much smaller than the coil component 400.

Further, as can be seen from FIG. 14, the coil component 100 is superior to the coil component 400 also in the DC superposition characteristics.

From the above, the effectiveness of the present invention was found.

The present invention can be used for coil parts.

1a to 1w, 11a to 11k magnetic layer, 2,12 laminate, 3a, 3b, 13a, 13b external electrode, 4a, 14a first coil, 4b, 14b second coil, 5e to 5g, 5s to 5v , 15b to 15e, 15g to 15k, coil pattern, 6c to 6u, 16b to 16j, conductor via hole, 7c to 7v, non-magnetic via hole, 100, 200 coil parts.

Claims

A plurality of laminated magnetic layers;
A plurality of coil patterns formed between the magnetic layers;
At least one of the magnetic layers is provided with a conductor via hole formed between both main surfaces,
A laminate is configured by the magnetic layer and the coil pattern,
In the coil component in which the coil pattern and the conductor via hole are connected in a predetermined order to form a coil,
In the laminate, a plurality of the coils are formed so as to be arranged in a direction parallel to the laminate surface of the laminate,
Each of the plurality of coils has an axis parallel to the laminated surface of the laminated body,
The coil component, wherein the plurality of coils are connected in series.
2. The coil component according to claim 1, wherein the plurality of coils are two coils.
3. The coil according to claim 1, wherein the coil has a spiral shape formed by the coil pattern and the via conductor when viewed from a side surface adjacent to a stacked surface of the stacked body. Coil parts.
Further comprising external electrodes on the side surfaces adjacent to each other and facing each other on the laminate surface of the laminate,
4. The coil component according to claim 1, wherein a plurality of the coils are formed so that the external electrodes are arranged in a direction perpendicular to a direction in which the external electrodes are opposed to each other.
5. The magnetic material layer according to claim 1, wherein the magnetic material layer is formed of ferrite, or a metal material powder coated with an insulating material as a main material. 6. Coil parts.
The at least one of the magnetic layers is further formed with a non-magnetic via hole formed so as to penetrate between both main surfaces. 6. Coil parts.
The coil pattern disposed on one main surface side of the magnetic layer and the coil pattern disposed on the other main surface side pass through the plurality of conductor via holes formed in the magnetic layer. The coil component according to any one of claims 1 to 6, wherein the coil component is connected to each other.