WO2015032901A2 - Strahlungsemittierende vorrichtung und verfahren zur herstellung derselben - Google Patents
Strahlungsemittierende vorrichtung und verfahren zur herstellung derselben Download PDFInfo
- Publication number
- WO2015032901A2 WO2015032901A2 PCT/EP2014/068953 EP2014068953W WO2015032901A2 WO 2015032901 A2 WO2015032901 A2 WO 2015032901A2 EP 2014068953 W EP2014068953 W EP 2014068953W WO 2015032901 A2 WO2015032901 A2 WO 2015032901A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation
- emitting device
- contact elements
- optoelectronic
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/84—Parallel electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- Radiation-emitting devices in particular those which comprise organic light-emitting diodes (OLEDs), are suitable as large-area, thin light-emitting elements.
- OLEDs organic light-emitting diodes
- Luminous surface is emitted across.
- At least one object of certain embodiments is to specify a radiation-emitting device with a large luminous area which is as homogeneous as possible
- Radiation intensity has. In particular, it is one
- Process step can be produced.
- This task is performed by a radiation-emitting
- Radiation-emitting device comprises a
- Between two other layers or elements may be arranged and applied here and in the following meaning that the one layer or the one element is arranged directly in direct mechanical and / or electrical contact with the other layer or the other element.
- the one layer or the one element indirectly on or above the another layer or the other element is arranged.
- the optoelectronic components are arranged in rows, which run parallel to a preferred direction.
- Each of the optoelectronic components comprises a layer sequence suitable for generating electromagnetic radiation with at least one first electrode surface (which is designed, for example, as a cathode), at least one second one
- Electrode surface (which is formed, for example, as an anode) and at least one functional layer between the first electrode surface and the second electrode surface.
- the functional layer is suitable for generating electromagnetic radiation in an activated operating state.
- the radiation-emitting device comprises a cover member, which on the plurality of
- Optoelectronic components is arranged.
- the optoelectronic components are arranged between the substrate and the cover element, it being possible for the substrate and / or the cover element to be designed to accommodate the
- the cover element comprises a
- Cover carrier which preferably consists of glass or a polymer or contains one of these materials. Furthermore, an additional thin-layer encapsulation can be added between the optoelectronic components and the cover element
- the cover member includes a plurality of first ones
- Electrode surfaces for example, the cathode at least some of the optoelectronic devices (directly or indirectly) are electrically connected.
- the first contact elements are strip-shaped and
- the cover element furthermore comprises a multiplicity of second contact elements, which are respectively electrically conductively connected (indirectly or directly) to the second electrode surfaces (for example, the anodes) of at least some of the optoelectronic components.
- the second contact elements are strip-shaped and
- the second electrode surfaces of the optoelectronic components are preferably associated exclusively with a second polarity, for example, as anodes or act as anodes.
- the first contact elements are electrically conductively connected exclusively to the first electrode surfaces of at least some of the optoelectronic components and not to a second electrode surface of one
- the second contact elements are electrically connected exclusively to the second electrode surfaces of at least some of the optoelectronic components and not to have any first electrode surface of an optoelectronic component.
- first contact elements are exclusively with the cathodes of at least some of the optoelectronic ones
- the cover element has contact elements through which the electrode surfaces of the optoelectronic components are contacted, the optoelectronic components can be mounted on the original manufacturing substrate
- the radiation-emitting device is designed as a monolithic structure, in which the
- the typically designed as metallic structures contact elements ensure due to their comparatively low Resistance for reducing the voltage loss between the individual components.
- the connection of the individual components is not done by external
- Radiation-emitting device is provided that the layer sequence of the optoelectronic components in each case an organic functional layer, in particular a
- organic electroluminescent layer comprises.
- the optoelectronic components are thus as OLEDs
- the functional layers can in particular be an organic functional layer stack with an organic layer
- the organic functional layer stack can, for example, a
- Hole injection layer a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer and / or a
- Radiation-emitting device is provided that a length and / or width of each optoelectronic Component between 1 mm and 10 cm, preferably between 2 mm and 2 cm.
- Radiation-emitting device that a length and / or a width of the substrate and / or the
- Covering element between 10 mm and 5 m, preferably between 10 cm and 1 m. According to at least one embodiment of the
- a thickness of the substrate and / or the cover member is between 0.1 mm and 5 cm, preferably between 0.5 mm and 5 mm. According to at least one embodiment of the
- the first or second electrode surfaces are transparent.
- the electrode surfaces, which are arranged between the functional layers and the substrate, are transparent, so that light emitted from the functional layers can be emitted through the electrode surfaces and the substrate.
- the transparent electrode surfaces preferably comprise a transparent conductive oxide (TCO).
- TCO transparent conductive oxide
- Transparent conductive oxides are transparent, conductive materials, usually metal oxides, such as zinc oxide, tin oxide, cadmium oxide,
- Radiation-emitting device is provided that the substrate is transparent. In this case can through the substrate a radiation exit surface of
- the substrate is made of glass or a polymer or contains one of these materials.
- each of the second contact elements is arranged in each case over a region between two adjacent rows of optoelectronic components.
- Contact structures is connected, which are formed in areas between two adjacent in a row (adjacent) optoelectronic devices.
- Contact structures is connected, which are formed in areas between two adjacent optoelectronic devices of two adjacent rows.
- Radiation-emitting device is provided that at least some of the contact elements on at least some of Contact structures are attached via a conductive adhesive.
- the contact elements are formed by a structured metallization on one of the main surfaces of the cover carrier. It is preferably a laser-structured
- the area of the cover element not covered by the substrate preferably forms a contacting strip, which can be plugged, for example, into a corresponding separate socket, through which the radiation-emitting device can be inserted
- a further aspect of the invention relates to an (extended) radiation-emitting device, which comprises a first and a second (simple) radiation-emitting device, each of which is constructed as described above.
- the radiation-emitting device have a common cover carrier.
- the substrate of the first (simple) radiation-emitting device and the substrate of second (simple) radiation-emitting device are arranged on opposite sides of the common Abdecklas. This provides a device which emits radiation on both sides and which can be easily incorporated into a variety of possible configurations. More precisely, through the substrate of the first (simple) radiation-emitting device, a first radiation exit surface and, through the substrate of the second (simple) radiation-emitting device, a second radiation exit surface of the (extended)
- radiation-emitting device are formed by a structured metallization on a first major surface of the Abdeckanis and the contact elements of the second
- Another aspect of the invention relates to a method for producing a (simple) radiation-emitting
- the method comprises the following method steps:
- Layer sequence comprising at least a first electrode surface, at least one second electrode surface and at least one functional layer between the first electrode surface and the second electrode surface;
- Cover comprises a cover carrier and a plurality of first and second strip-shaped contact elements on a main surface of the cover carrier;
- Electrode surfaces of at least some of the optoelectronic devices and the plurality of second contact elements in each case with the second electrode surfaces of at least some of the optoelectronic devices indirectly or
- the cover can be glued to the plurality of optoelectronic devices.
- Preferred is the plurality of first and second
- Another aspect of the invention relates to a method for producing an (extended) radiation-emitting
- the method comprises the following method steps:
- optoelectronic components wherein the optoelectronic components are arranged in rows which extend parallel to a preferred direction and wherein each of the
- Electromagnetic radiation suitable layer sequence with at least a first electrode surface, at least one second electrode surface and at least one
- Functional layer between the first electrode surface and the second electrode surface comprises;
- optoelectronic components wherein the optoelectronic components are arranged in rows which extend parallel to a preferred direction and wherein each of the
- Electromagnetic radiation suitable layer sequence with at least a first electrode surface, at least one second electrode surface and at least one
- Functional layer between the first electrode surface and the second electrode surface comprises;
- Cover carrier and a second plurality of first and second strip-shaped contact elements comprises on a second major surface of the cover carrier
- Electrode surfaces of at least some of the first plurality of optoelectronic devices are electrically connected;
- Electrode surfaces of at least some of the second plurality of optoelectronic devices are electrically connected.
- FIG. 1 to 6 a method for producing a
- Radiation-emitting device according to the invention according to a first embodiment
- 7 shows a finished radiation-emitting device according to the invention according to the first embodiment
- FIGS. 8 and 9 are schematic sectional views of
- FIG. 14 shows a possible application of the radiation-emitting device 200 as a lighting device.
- identical, identical or identically acting elements can each be provided with the same reference numerals.
- the illustrated elements and their proportions with each other are not to be regarded as true to scale; Rather, individual elements, such as layers, components, components and areas may be disproportionately large for better representability and / or better understanding; This can affect individual dimensions or all
- FIGS. 1 to 6 show a method for producing a total of 100 according to the invention
- a substrate 2 which consists for example of glass and on which a plurality of optoelectronic components 4 are arranged in the form of organic light-emitting diodes.
- the Optoelectronic components are arranged in parallel rows 8-1, 8-2, 8-3, which run parallel to a preferred direction 6.
- first contact structures 10 In regions between two optoelectronic components 4, which are juxtaposed in each case in a row 8-1, 8-2, 8-3, there are first contact structures 10
- Rows are second
- Contact structures 12 are provided, which connect the (also not shown) anodes of the adjacent optoelectronic components 4 together.
- a cover element 14 is provided with a cover carrier 16 and a plurality of first and second strip-shaped contact elements 18, 20 (FIG. 2).
- Strip-shaped contact elements 18, 20 are formed by laser structuring of a metallization 22 on one of the main surfaces of the cover carrier 16. More specifically, the metallization 22 is along by a laser
- a conductive adhesive 26 is applied to the first and second contact structures 10, 12, for example, in small, not
- an adhesive 28 is applied to the first contact elements 18 in areas adjacent to the individual optoelectronic
- Components 4 are to be attached, applied, as shown in Figure 5.
- Optoelectronic devices 4 adhered to the cover 14, so that the radiation-emitting device 100 according to the invention arises.
- Cover element 14 protrudes here in the preferred direction 6 beyond the substrate 2 and thereby forms a
- FIG. 7 shows the finished invention
- Embodiment whose Kunststoff istsological 30 can be inserted into a corresponding separate socket 32.
- the main surface of the substrate 2 facing away from the cover element 14 forms a radiation exit surface of the device 100, wherein radiation exits only in the regions which comprise the optoelectronic on the substrate 2
- Components 4 are opposite. By doing that
- FIGS. 8 and 9 show schematic sectional views of the radiation-emitting device 100, wherein the section in FIG. 8 is taken along the line AA and the section in FIG. 9 along the line BB in FIG.
- each of the optoelectronic components 4 comprises a transparent anode 34, a cathode 38 and an organic functional layer 36 arranged therebetween.
- the section shown in FIG. 8 extends through one of the rows 8-1, 8-2, 8- shown in FIG. third
- the cathodes 38 of two adjacent optoelectronic components 4 are connected to one another via the first contact structures 10. These are conductively connected via the conductive adhesive 26 to the first contact element 18.
- the first contact element 18 with the cathodes 38 of the optoelectronic components of a row is at least
- the optoelectronic components 4 are separated from one another by insulating resistance elements 40.
- FIG. 9 shows a section perpendicular to the preferred direction 6 in FIG. 1 and thus over adjacent rows 8-1, 8-2 and 8-3 (see FIG. 1). Also in this section, the optoelectronic components 4 by insulating
- the transparent anode 34 runs uninterruptedly on the substrate 2 in this sectional view and is in areas between adjacent optoelectronic components 4 with the second
- Contact structures 12 conductively connected, which in turn are electrically conductively connected via the conductive adhesive 26 to the second contact elements 20.
- the anodes of the optoelectronic components are electrically conductively connected at least indirectly to the second contact elements.
- Figures 10-13 show a radiation emitter
- a metallization 221, 222 is provided on both main surfaces of the cover carrier 16 during manufacture. Both sides of the cover carrier 16 are then structured such that a first plurality of first and second
- a second plurality of first and second contact elements 182, 202 are provided.
- a first substrate 203 with optoelectronic devices (not shown) disposed thereon and a second substrate 204 thereon are disposed thereon
- the arrangement of the optoelectronic components on the first substrate 203 and the second substrate 204 in this case correspond to the above-described corresponding arrangement according to the first embodiment. It creates a
- Device 200 which includes a first (simple) radiation-emitting device 400 according to the first
- Lighting device on a table 300 Here are a plurality of radiation-emitting devices 200 in different orientations on a table top
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020167005687A KR20160055142A (ko) | 2013-09-09 | 2014-09-05 | 복사선 방출 장치 및 그 제조 방법 |
DE112014004123.8T DE112014004123A5 (de) | 2013-09-09 | 2014-09-05 | Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung derselben |
US14/909,104 US20160181326A1 (en) | 2013-09-09 | 2014-09-05 | Radiation-Emitting Apparatus and Method for Producing Same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013109822.3 | 2013-09-09 | ||
DE102013109822.3A DE102013109822A1 (de) | 2013-09-09 | 2013-09-09 | Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung derselben |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2015032901A2 true WO2015032901A2 (de) | 2015-03-12 |
WO2015032901A3 WO2015032901A3 (de) | 2015-06-18 |
Family
ID=51492335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2014/068953 WO2015032901A2 (de) | 2013-09-09 | 2014-09-05 | Strahlungsemittierende vorrichtung und verfahren zur herstellung derselben |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160181326A1 (de) |
KR (1) | KR20160055142A (de) |
DE (2) | DE102013109822A1 (de) |
WO (1) | WO2015032901A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016037925A1 (de) * | 2014-09-08 | 2016-03-17 | Osram Oled Gmbh | Strahlungsemittierende vorrichtung und verfahren zur herstellung derselben |
US10520782B2 (en) | 2017-02-02 | 2019-12-31 | James David Busch | Display devices, systems and methods capable of single-sided, dual-sided, and transparent mixed reality applications |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005235403A (ja) * | 2004-02-17 | 2005-09-02 | Hitachi Displays Ltd | 有機・el表示装置 |
TWI315163B (en) * | 2005-10-11 | 2009-09-21 | Au Optronics Corporatio | A double-sided organic light-emitting diode display |
TWI296895B (en) * | 2005-12-02 | 2008-05-11 | Au Optronics Corp | Encapsulation structure of dual emission organic electroluminescence device and method of fabricating the same |
KR20080002338A (ko) * | 2006-06-30 | 2008-01-04 | 엘지.필립스 엘시디 주식회사 | 유기 전계발광 표시장치와 그의 제조 방법 |
DE102006059509B4 (de) * | 2006-12-14 | 2012-05-03 | Novaled Ag | Organisches Leuchtbauelement |
EP2122243B1 (de) * | 2007-02-12 | 2016-04-20 | Philips Intellectual Property & Standards GmbH | Modulares elektrisches system |
US7923924B2 (en) * | 2007-04-03 | 2011-04-12 | Tsinghua University | Organic electroluminescent display/source with anode and cathode leads |
DE102008049057B4 (de) * | 2008-09-26 | 2019-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organisches opto-elektrisches Bauelement und ein Verfahren zur Herstellung eines organischen opto-elektrischen Bauelements |
US8198109B2 (en) * | 2010-08-27 | 2012-06-12 | Quarkstar Llc | Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination |
DE102010042132A1 (de) * | 2010-10-07 | 2012-04-26 | Ledon Oled Lighting Gmbh & Co.Kg | Leuchtelement mit OLED-Modulen |
WO2013035574A1 (ja) * | 2011-09-05 | 2013-03-14 | コニカミノルタホールディングス株式会社 | 有機el照明装置およびその製造方法 |
-
2013
- 2013-09-09 DE DE102013109822.3A patent/DE102013109822A1/de not_active Withdrawn
-
2014
- 2014-09-05 KR KR1020167005687A patent/KR20160055142A/ko not_active Application Discontinuation
- 2014-09-05 WO PCT/EP2014/068953 patent/WO2015032901A2/de active Application Filing
- 2014-09-05 US US14/909,104 patent/US20160181326A1/en not_active Abandoned
- 2014-09-05 DE DE112014004123.8T patent/DE112014004123A5/de not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016037925A1 (de) * | 2014-09-08 | 2016-03-17 | Osram Oled Gmbh | Strahlungsemittierende vorrichtung und verfahren zur herstellung derselben |
US20170256592A1 (en) * | 2014-09-08 | 2017-09-07 | Osram Oled Gmbh | Radiation-emitting apparatus and method for producing same |
US10418419B2 (en) | 2014-09-08 | 2019-09-17 | Osram Oled Gmbh | Radiation-emitting apparatus having an outer optoelectronic device surrounding an inner optoelectronic device and methods for producing the same |
US10520782B2 (en) | 2017-02-02 | 2019-12-31 | James David Busch | Display devices, systems and methods capable of single-sided, dual-sided, and transparent mixed reality applications |
Also Published As
Publication number | Publication date |
---|---|
WO2015032901A3 (de) | 2015-06-18 |
US20160181326A1 (en) | 2016-06-23 |
KR20160055142A (ko) | 2016-05-17 |
DE112014004123A5 (de) | 2016-07-21 |
DE102013109822A1 (de) | 2015-03-12 |
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