WO2015032085A1 - Acoustic metal diaphragm - Google Patents
Acoustic metal diaphragm Download PDFInfo
- Publication number
- WO2015032085A1 WO2015032085A1 PCT/CN2013/083122 CN2013083122W WO2015032085A1 WO 2015032085 A1 WO2015032085 A1 WO 2015032085A1 CN 2013083122 W CN2013083122 W CN 2013083122W WO 2015032085 A1 WO2015032085 A1 WO 2015032085A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- diaphragm
- metal
- acoustic
- coating layer
- base material
- Prior art date
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/12—Non-planar diaphragms or cones
- H04R7/122—Non-planar diaphragms or cones comprising a plurality of sections or layers
- H04R7/125—Non-planar diaphragms or cones comprising a plurality of sections or layers comprising a plurality of superposed layers in contact
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/027—Diaphragms comprising metallic materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
- H04R7/22—Clamping rim of diaphragm or cone against seating
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
An acoustic metal diaphragm comprises a diaphragm base material (10) and a metal coating layer (20). The metal coating layer (20) covers the surface of the diaphragm base material (10), and the metal coating layer (20) is made of pure beryllium or beryllium alloy material; thereby the metal coating layer (20) is formed by evaporating the pure beryllium or beryllium alloy material on the surface of the diaphragm base material (10). Thus, both the rigidity of the diaphragm base material (10) is increased and the softness of the diaphragm base material (10) is maintained by using the metal coating layer (20). Moreover, the bandwidth is wide and the problem with respect to the high frequency is well resolved, and thereby the sound quality is better. The acoustic metal diaphragm is widely applied to various acoustic devices such as earphones, earplugs, loudspeakers, microphones, and so on.
Description
本发明涉及振膜领域技术,尤其是指一种声学金属振膜。 The invention relates to the field of diaphragm technology, in particular to an acoustic metal diaphragm.
振膜是耳塞、耳机、麦克风等各种声学设备的重要组成零部件之间,现有的振膜通常是采用一种材料成型出单一层的振膜,声学设备发出声音时通常有高频和低频,为了解决声学设备的高频问题,传统的解决方法是,在振膜上印花,以增强振膜的刚性,然而,单以该种方法不能使振膜的柔软度和刚性两者较好地兼顾,从而使得声学设备的频率响应不够宽,音质不够好。
The diaphragm is an important component between various acoustic devices such as earplugs, earphones, and microphones. The existing diaphragm usually uses a material to form a single layer of diaphragm. When the acoustic device emits sound, it usually has high frequency and Low frequency, in order to solve the high frequency problem of acoustic equipment, the traditional solution is to print on the diaphragm to enhance the rigidity of the diaphragm. However, in this way, the softness and rigidity of the diaphragm cannot be better. The balance of the ground, so that the frequency response of the acoustic device is not wide enough, the sound quality is not good enough.
有鉴于此,本发明针对现有技术存在之缺失,其主要目的是提供一种声学金属振膜,其能有效解决现有之振膜采用印花方式不能保持振膜柔软度而使得声学设备音质不够好的问题。In view of this, the present invention is directed to the absence of the prior art, and its main object is to provide an acoustic metal diaphragm, which can effectively solve the problem that the existing diaphragm can not maintain the softness of the diaphragm by the printing method, and the sound quality of the acoustic device is not enough. Good question.
为实现上述目的,本发明采用如下之技术方案:In order to achieve the above object, the present invention adopts the following technical solutions:
一种声学金属振膜,包括有振膜基材以及金属镀层,该金属镀层覆盖于振膜基材的表面上,该金属镀层为纯铍或铍合金材质。An acoustic metal diaphragm comprising a diaphragm substrate and a metal plating layer covering the surface of the diaphragm substrate, the metal plating layer being pure tantalum or niobium alloy material.
作为一种优选方案,所述振膜基材为薄膜。As a preferred embodiment, the diaphragm substrate is a film.
作为一种优选方案,进一步包括有铜环,该振膜基材的外缘和金属镀层的外缘均与该铜环的内缘连接。As a preferred solution, a copper ring is further included, and an outer edge of the diaphragm substrate and an outer edge of the metal plating layer are connected to an inner edge of the copper ring.
作为一种优选方案,所述铜环的横截面呈方形。As a preferred solution, the copper ring has a square cross section.
本发明与现有技术相比具有明显的优点和有益效果,具体而言,由上述技术方案可知:The present invention has obvious advantages and advantageous effects compared with the prior art. Specifically, it can be known from the above technical solutions:
通过采用纯铍或铍合金材质在振膜基材的表面上蒸镀形成金属镀层,如此,利用该金属镀层既增加了振膜基材的刚性,又保持了振膜基材的柔软度,而且频带宽,能够很好地解决高频问题,从而有利于使音质更好,广泛应用于耳机、耳塞、喇叭、麦克风等各种声学设备中。By depositing a metal plating layer on the surface of the diaphragm substrate by using a pure tantalum or niobium alloy material, the metal plating layer increases the rigidity of the diaphragm substrate and maintains the softness of the diaphragm substrate. The frequency bandwidth can solve the high frequency problem well, which is beneficial to the sound quality, and is widely used in various acoustic devices such as earphones, earplugs, speakers, and microphones.
图1是本发明之较佳实施例的俯视图;Figure 1 is a plan view of a preferred embodiment of the present invention;
图2是本发明之较佳实施例的截面图。Figure 2 is a cross-sectional view of a preferred embodiment of the present invention.
附图标识说明:Description of the figure:
10、振膜基材 20、金属镀层10. Diaphragm substrate 20, metal plating
30、铜环30, copper ring
请参照图1和图2所示,其显示出了本发明之较佳实施例的具体结构,包括有振膜基材10以及金属镀层20。Referring to Figures 1 and 2, there is shown a specific structure of a preferred embodiment of the present invention comprising a diaphragm substrate 10 and a metal coating 20.
该振膜基材10为薄膜。该金属镀层20覆盖于振膜基材10的表面上,在该金属镀层20为纯铍或铍合金材质,本实施例中,是通过金属蒸镀的方式在振膜基材10的表面覆盖形成前述金属镀层20,如此可增加振膜基材10的刚性,又保持振膜基材10的柔软度。The diaphragm substrate 10 is a film. The metal plating layer 20 is coated on the surface of the diaphragm substrate 10, and the metal plating layer 20 is made of pure tantalum or niobium alloy. In this embodiment, the surface of the diaphragm substrate 10 is covered by metal evaporation. The metal plating layer 20 as described above can increase the rigidity of the diaphragm substrate 10 and maintain the softness of the diaphragm substrate 10.
以及,在本实施例中,进一步包括有铜环30,该铜环30的横截面呈方形,该振膜基材10的外缘和金属镀层20的外缘均与该铜环30的内缘连接。In addition, in this embodiment, a copper ring 30 is further included, the copper ring 30 has a square cross section, and the outer edge of the diaphragm substrate 10 and the outer edge of the metal plating layer 20 are both opposite to the inner edge of the copper ring 30. connection.
本发明的设计重点在于:通过采用纯铍或铍合金材质在振膜基材的表面上蒸镀形成金属镀层,如此,利用该金属镀层既增加了振膜基材的刚性,又保持了振膜基材的柔软度,而且频带宽,能够很好地解决高频问题,从而有利于使音质更好,广泛应用于耳机、耳塞、喇叭、麦克风等各种声学设备中。The design of the present invention focuses on forming a metal plating layer on the surface of the diaphragm substrate by using a pure tantalum or niobium alloy material. Thus, the metal plating layer increases the rigidity of the diaphragm substrate and maintains the diaphragm. The softness of the substrate and the frequency bandwidth can solve the high frequency problem well, which is beneficial to the sound quality, and is widely used in various acoustic devices such as earphones, earplugs, speakers, and microphones.
以上所述,仅是本发明的较佳实施例而已,并非对本发明的技术范围作任何限制,故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments in accordance with the technical spirit of the present invention are still It is within the scope of the technical solution of the present invention.
Claims (4)
1、一种声学金属振膜,其特征在于:包括有振膜基材以及金属镀层,该金属镀层覆盖于振膜基材的表面上,该金属镀层为纯铍或铍合金材质。An acoustic metal diaphragm, comprising: a diaphragm substrate and a metal plating layer, the metal plating layer covering the surface of the diaphragm substrate, the metal plating layer being pure tantalum or niobium alloy material.
2、根据权利要求1所述的声学金属振膜,其特征在于:所述振膜基材为薄膜。The acoustic metal diaphragm according to claim 1, wherein the diaphragm substrate is a film.
3、根据权利要求1所述的声学金属振膜,其特征在于:进一步包括有铜环,该振膜基材的外缘和金属镀层的外缘均与该铜环的内缘连接。3. The acoustic metal diaphragm of claim 1 further comprising a copper ring, the outer edge of the diaphragm substrate and the outer edge of the metal coating being coupled to the inner edge of the copper ring.
4、根据权利要求3所述的声学金属振膜,其特征在于:所述铜环的横截面呈方形。4. Acoustic metal diaphragm according to claim 3, characterized in that the copper ring has a square cross section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2013/083122 WO2015032085A1 (en) | 2013-09-09 | 2013-09-09 | Acoustic metal diaphragm |
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PCT/CN2013/083122 WO2015032085A1 (en) | 2013-09-09 | 2013-09-09 | Acoustic metal diaphragm |
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PCT/CN2013/083122 WO2015032085A1 (en) | 2013-09-09 | 2013-09-09 | Acoustic metal diaphragm |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107854136A (en) * | 2017-11-24 | 2018-03-30 | 江门大诚医疗器械有限公司 | One kind is applied to stethoscopic metal vibration diaphragm structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515912B2 (en) * | 1975-04-30 | 1980-04-26 | ||
CN1159726A (en) * | 1995-12-08 | 1997-09-17 | 日本先锋公司 | Vibration membrane for loudspeaker |
CN1774954A (en) * | 2003-04-16 | 2006-05-17 | 法国劲浪公司 | Acoustic transducer |
CN103209372A (en) * | 2012-01-17 | 2013-07-17 | 深圳华宝利电子有限公司 | Collapse-free sound film |
CN203399277U (en) * | 2013-05-13 | 2014-01-15 | 东莞泉声电子有限公司 | Acoustic metal vibrating diaphragm |
-
2013
- 2013-09-09 WO PCT/CN2013/083122 patent/WO2015032085A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515912B2 (en) * | 1975-04-30 | 1980-04-26 | ||
CN1159726A (en) * | 1995-12-08 | 1997-09-17 | 日本先锋公司 | Vibration membrane for loudspeaker |
CN1774954A (en) * | 2003-04-16 | 2006-05-17 | 法国劲浪公司 | Acoustic transducer |
CN103209372A (en) * | 2012-01-17 | 2013-07-17 | 深圳华宝利电子有限公司 | Collapse-free sound film |
CN203399277U (en) * | 2013-05-13 | 2014-01-15 | 东莞泉声电子有限公司 | Acoustic metal vibrating diaphragm |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107854136A (en) * | 2017-11-24 | 2018-03-30 | 江门大诚医疗器械有限公司 | One kind is applied to stethoscopic metal vibration diaphragm structure |
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