TWM498432U - Acoustic metal membrane - Google Patents
Acoustic metal membrane Download PDFInfo
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- TWM498432U TWM498432U TW103215324U TW103215324U TWM498432U TW M498432 U TWM498432 U TW M498432U TW 103215324 U TW103215324 U TW 103215324U TW 103215324 U TW103215324 U TW 103215324U TW M498432 U TWM498432 U TW M498432U
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Description
本創作係有關於一種振膜領域技術，尤其是指一種能夠解決高頻問題使音質保持良好的聲學金屬振膜。 This creation is about a technology in the field of diaphragms, especially an acoustic metal diaphragm that can solve high frequency problems and maintain good sound quality.
按，振膜是耳塞、耳機、麥克風等各種聲學設備的重要組成零部件之間，現有的振膜通常是採用一種材料成型出單一層的振膜，聲學設備發出聲音時通常有高頻和低頻，為了解決聲學設備的高頻問題，傳統的解決方法是，在振膜上印花，以增強振膜的剛性，然而，單以該種方法不能使振膜的柔軟度和剛性兩者較好地兼顧，從而使得聲學設備的頻率回應不夠寬，音質不夠好，如第一圖所示，係現有振膜應用在小耳機上的頻響與異音曲線圖，由圖中曲線可明顯地看出，當聲音頻率達到10KHZ以上時，聲壓值呈直線下降趨勢，頻寬衰減非常快，從而使得音質效果大幅下降，尤其是，應用在小耳機上時，聲音會出現尖銳刺耳的問題。 According to the diaphragm, the diaphragm is an important component of various acoustic devices such as earplugs, earphones, and microphones. The existing diaphragm usually uses a material to form a single layer of diaphragm. When the acoustic device emits sound, there are usually high frequency and low frequency. In order to solve the high frequency problem of acoustic equipment, the conventional solution is to print on the diaphragm to enhance the rigidity of the diaphragm. However, in this method alone, the softness and rigidity of the diaphragm cannot be better. Taking into account, the frequency response of the acoustic device is not wide enough, and the sound quality is not good enough. As shown in the first figure, the frequency response and the abnormal sound curve of the existing diaphragm applied to the small earphone are clearly seen from the curve in the figure. When the sound frequency reaches 10KHZ or above, the sound pressure value decreases linearly, and the bandwidth attenuation is very fast, so that the sound quality effect is greatly reduced. In particular, when applied to a small earphone, the sound may be sharp and harsh.
爰此，針對現有技術存在之缺失，本創作主要目的是提供一種聲學金屬振膜，其能有效解決現有之振膜採用印花方式不能保持振膜柔軟度而使得聲學設備音質不夠好的問題。 Therefore, in view of the lack of the prior art, the main purpose of the present invention is to provide an acoustic metal diaphragm, which can effectively solve the problem that the existing diaphragm can not maintain the softness of the diaphragm and the sound quality of the acoustic device is not good.
本創作之聲學金屬振膜，包括有一振膜基材以及一金屬鍍膜，該金屬鍍膜透過一介質層黏結覆蓋於該振膜基材的表面上，該介質層夾設於該振膜基材和該金屬鍍膜之間，其中該金屬鍍膜為鈦鎂合金惰性金屬膜材質。 The acoustic metal diaphragm of the present invention comprises a diaphragm substrate and a metal coating, the metal coating is adhered to a surface of the diaphragm substrate through a dielectric layer, and the dielectric layer is sandwiched between the diaphragm substrate and The metal plating film is made of a titanium-magnesium alloy inert metal film material.
進一步，該金屬鍍膜的厚度為1微米(μm)至10微米。 Further, the metal plating film has a thickness of from 1 micrometer (μm) to 10 μm.
進一步，該振膜基材為薄膜。 Further, the diaphragm substrate is a film.
進一步，更包括有一銅環，該振膜基材的外緣、該介質層的外緣和該金屬鍍膜的外緣均與該銅環的內緣連接。 Further, a copper ring is further included, and an outer edge of the diaphragm substrate, an outer edge of the dielectric layer, and an outer edge of the metal coating are connected to an inner edge of the copper ring.
進一步，該銅環的橫截面呈方形。 Further, the copper ring has a square cross section.
進一步，該振膜基材、該介質層、該金屬鍍膜以及該銅環均呈圓形。 Further, the diaphragm substrate, the dielectric layer, the metal plating film, and the copper ring are all circular.
進一步，該振膜基材、該介質層、該金屬鍍膜以及該銅環均呈長方形。 Further, the diaphragm substrate, the dielectric layer, the metal plating film, and the copper ring each have a rectangular shape.
進一步，該振膜基材、該介質層、該金屬鍍膜以及該銅環均呈橢圓形。 Further, the diaphragm substrate, the dielectric layer, the metal plating film, and the copper ring are all elliptical.
本創作之功效在於：透過利用該介質層將該金屬鍍膜牢固黏結在該振膜基材的表面上，並配合採用鈦鎂合金惰性金屬膜材質製作該金屬鍍膜，不僅增加了該振膜基材的剛性，又保持了該振膜基材的柔軟度，令整個頻響特性聲音自然豐滿而有彈性，層次清晰圓順悅耳，不會有尖銳、刺耳的聲音效果，以期廣泛應用於耳機、耳塞、喇叭、麥克風等各種聲學設備中。 The effect of the creation is that the metal coating film is firmly bonded to the surface of the diaphragm substrate by using the dielectric layer, and the metal coating film is prepared by using the titanium-magnesium alloy inert metal film material, thereby not only increasing the diaphragm substrate. The rigidity of the diaphragm material maintains the softness of the diaphragm material, so that the sound of the entire frequency response is naturally full and flexible, the layer is clear and round, and there is no sharp and harsh sound effect, so as to be widely used in earphones and earplugs. , speakers, microphones and other acoustic equipment.
10‧‧‧振膜基材 10‧‧‧Densor substrate
20‧‧‧金屬鍍膜 20‧‧‧Metal coating
30‧‧‧介質層 30‧‧‧Media layer
40‧‧‧銅環 40‧‧‧Bronze ring
[第一圖]係為習知振膜應用在小耳機上的頻響與異音曲線圖。 [Picture 1] is a frequency response and an abnormal sound curve applied to a small earphone by a conventional diaphragm.
[第二圖]係為本創作之第一較佳實施例的俯視圖。 [Second figure] is a top view of the first preferred embodiment of the present invention.
[第三圖]係為本創作之第一較佳實施例的截面圖。 [Third Figure] is a cross-sectional view of the first preferred embodiment of the present invention.
[第四圖]係為本創作之第二較佳實施例的俯視圖。 [Fourth figure] is a plan view of a second preferred embodiment of the present invention.
[第五圖]係為本創作之第二較佳實施例的橫向截面圖。 [Fifth Figure] is a transverse cross-sectional view of a second preferred embodiment of the present invention.
[第六圖]係為本創作之第二較佳實施例的縱向截面圖。 [Sixth] is a longitudinal cross-sectional view of a second preferred embodiment of the present invention.
[第七圖]係為本創作之第三較佳實施例的俯視圖。 [Seventh] is a plan view of a third preferred embodiment of the present invention.
[第八圖]係為本創作之第三較佳實施例的橫向截面圖。 [Eighth image] is a transverse cross-sectional view of a third preferred embodiment of the present invention.
[第九圖]係為本創作之第三較佳實施例的縱向截面圖。 [9th] is a longitudinal cross-sectional view of a third preferred embodiment of the present invention.
[第十圖]係為本創作中採用鈦鎂合金應用在小耳機上的頻響與異音曲線。 [Tenth] is the frequency response and the abnormal sound curve of the titanium-magnesium alloy applied to the small earphones in this creation.
綜合上述技術特徵，本創作之聲學金屬振膜的主要功效將可於下述實施例清楚呈現。 In combination with the above technical features, the main effects of the acoustic metal diaphragm of the present invention will be clearly shown in the following embodiments.
首先請一併參閱第二圖及第三圖所示，係本創作之第一較佳實施例的俯視圖與截面圖。本創作之聲學金屬振膜，係包括有一振膜基材10以及一金屬鍍膜20。其中，該振膜基材10為薄膜。該金屬鍍膜20透過一介質層30黏結覆蓋於該振膜基材10的表面上，該介質層30夾設於該振膜基材10和該金屬鍍膜20之間，且該金屬鍍膜20為鈦鎂合金惰性金屬膜材質製成。在本實施例中，該金屬鍍膜20是密閉空間內透過濺鍍的方式形成於該介質層30上，從而黏結覆蓋於該振膜基材10的表面上，如此使得該金屬鍍膜20牢固地黏結在該振膜基材10的表面上，可增加該振膜基材10的剛性，又保持該振膜基材10的柔軟度。並且，該金屬鍍膜20的厚度為1微米至10微米。 First, please refer to the second and third figures, which are top and cross-sectional views of the first preferred embodiment of the present invention. The acoustic metal diaphragm of the present invention comprises a diaphragm substrate 10 and a metal coating 20. The diaphragm substrate 10 is a film. The metal plating film 20 is adhered to the surface of the diaphragm substrate 10 through a dielectric layer 30. The dielectric layer 30 is interposed between the diaphragm substrate 10 and the metal plating film 20, and the metal plating film 20 is titanium. Magnesium alloy is made of inert metal film material. In the present embodiment, the metal plating film 20 is formed on the dielectric layer 30 by sputtering in a sealed space, so as to be adhered to the surface of the diaphragm substrate 10, so that the metal plating film 20 is firmly bonded. On the surface of the diaphragm substrate 10, the rigidity of the diaphragm substrate 10 can be increased, and the flexibility of the diaphragm substrate 10 can be maintained. Also, the metal plating film 20 has a thickness of 1 μm to 10 μm.
較佳的是，進一步包括有一銅環40，該銅環40的橫截面呈方形，該振膜基材10的外緣、該介質層30的外緣以及該金屬鍍膜20的外緣 均與該銅環40的內緣連接。此外，在本實施例中，該振膜基材10、該介質層30、該金屬鍍膜20和該銅環40均呈圓形。 Preferably, the copper ring 40 further includes a copper ring 40 having a square cross section, an outer edge of the diaphragm substrate 10, an outer edge of the dielectric layer 30, and an outer edge of the metal plating film 20. Both are connected to the inner edge of the copper ring 40. Further, in the present embodiment, the diaphragm substrate 10, the dielectric layer 30, the metal plating film 20, and the copper ring 40 are each circular.
再請參照第四圖至第六圖所示，其顯示出了本創作之第二較佳實施例的具體結構，係與前述第一較佳實施例的具體結構基本相同，其所不同的是：該振膜基材10、該介質層30、該金屬鍍膜20和該銅環40均呈長方形。 Referring to the fourth to sixth figures, the specific structure of the second preferred embodiment of the present invention is shown, which is basically the same as the specific structure of the first preferred embodiment, and the difference is The diaphragm substrate 10, the dielectric layer 30, the metal plating film 20, and the copper ring 40 are each rectangular.
再請參照第四圖至第六圖所示，其顯示出了本創作之第三較佳實施例的具體結構，係與前述第一較佳實施例的具體結構基本相同，其所不同的是：該振膜基材10、該介質層20、該金屬鍍膜20和該銅環40均呈橢圓形。依照本創作之精神，該振膜基材10、該介質層20、該金屬鍍膜20和該銅環40的形狀不以此為限。 Referring to the fourth to sixth figures, the specific structure of the third preferred embodiment of the present invention is shown, which is basically the same as the specific structure of the first preferred embodiment, and the difference is The diaphragm substrate 10, the dielectric layer 20, the metal plating film 20, and the copper ring 40 are all elliptical. According to the spirit of the present invention, the shape of the diaphragm substrate 10, the dielectric layer 20, the metal plating film 20, and the copper ring 40 are not limited thereto.
復請參閱第十圖所示，係本創作中採用鈦鎂合金應用在小耳機上的頻響與異音曲線圖。藉由比較本圖與第一圖可明顯地看出，頻率在150Hz以下(即低音)，聲壓豐滿、柔和而富有彈性；頻率在150Hz~500Hz(即中低音)，聲壓渾厚有力而不混濁；頻率在500Hz~5KHz(即中高音)，聲壓明亮透徹而不生硬；頻率在5KHz以上(即高音)，聲壓纖細、圓順而不尖銳刺耳。 Please refer to the tenth figure, which is the frequency response and the noise curve of the titanium-magnesium alloy applied to the small earphone. By comparing this figure with the first figure, it can be clearly seen that the frequency is below 150 Hz (ie, the bass), the sound pressure is full, soft and elastic; the frequency is between 150 Hz and 500 Hz (ie, the middle and low woofer), and the sound pressure is strong and not Turbid; frequency is between 500Hz and 5KHz (ie, mid-high pitch), the sound pressure is bright and transparent and not hard; the frequency is above 5KHz (ie, high-pitched), the sound pressure is slender, round and not sharp and harsh.
綜上所述，本創作透過利用該介質層將該金屬鍍膜牢固黏結在該振膜基材的表面上，並配合採用鈦鎂合金惰性金屬膜材質製作該金屬鍍膜，不僅增加了該振膜基材的剛性，又保持了該振膜基材的柔軟度，令整個頻響特性聲音自然豐滿而有彈性，層次清晰圓順悅耳，不會有尖銳、刺耳的聲音效果，以期廣泛應用於耳機、耳塞、喇叭、麥克風等各種聲學設備中。 In summary, the present invention uses the dielectric layer to firmly bond the metal coating on the surface of the diaphragm substrate, and uses the titanium-magnesium alloy inert metal film material to make the metal coating, which not only increases the diaphragm base. The rigidity of the material maintains the softness of the diaphragm substrate, so that the sound of the whole frequency response is naturally full and flexible, the layer is clear and round, and there is no sharp and harsh sound effect, so as to be widely used in headphones. Earphones, speakers, microphones and other acoustic equipment.
綜合上述實施例之說明，當可充分瞭解本創作之操作、使用及本創作產生之功效，惟以上所述實施例僅係為本創作之較佳實施例，當不能以此限定本創作實施之範圍，即依本創作申請專利範圍及創作說明內容所作簡單的等效變化與修飾，皆屬本創作涵蓋之範圍內。 In view of the above description of the embodiments, the above-described embodiments are merely a preferred embodiment of the present invention, and the implementation of the present invention is not limited thereto. The scope, that is, the simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the creation of the creation, are within the scope of this creation.
10‧‧‧振膜基材 10‧‧‧Densor substrate
20‧‧‧金屬鍍膜 20‧‧‧Metal coating
30‧‧‧介質層 30‧‧‧Media layer
40‧‧‧銅環 40‧‧‧Bronze ring
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103215324U TWM498432U (en) | 2014-08-27 | 2014-08-27 | Acoustic metal membrane |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103215324U TWM498432U (en) | 2014-08-27 | 2014-08-27 | Acoustic metal membrane |
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| Publication Number | Publication Date |
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| TWM498432U true TWM498432U (en) | 2015-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW103215324U TWM498432U (en) | 2014-08-27 | 2014-08-27 | Acoustic metal membrane |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10397717B2 (en) | 2017-05-24 | 2019-08-27 | Ming Chi University Of Technology | Acoustic diaphragm and speaker containing the same |
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2014
- 2014-08-27 TW TW103215324U patent/TWM498432U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10397717B2 (en) | 2017-05-24 | 2019-08-27 | Ming Chi University Of Technology | Acoustic diaphragm and speaker containing the same |
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