CN107493526B

CN107493526B - Pickup equipment and headset

Info

Publication number: CN107493526B
Application number: CN201611021351.6A
Authority: CN
Inventors: 陈华
Original assignee: Beijing Kuzhi Technology Co ltd
Current assignee: Beijing Kuzhi Technology Co ltd
Priority date: 2016-11-15
Filing date: 2016-11-15
Publication date: 2023-08-15
Anticipated expiration: 2036-11-15
Also published as: CN107493526A

Abstract

The application provides sound pickup equipment and a headset, wherein the sound pickup equipment comprises a shell, a microphone and a longer hollow channel, the microphone is communicated with the outside of the shell through the hollow channel, sound can reach the microphone through the longer hollow channel after entering the shell, so that the sound can pass through a longer propagation path, sound pressure can become more stable due to the longer hollow channel in the propagation process, and therefore, the phenomenon of mark spraying caused by irregular sound pressure can be avoided, and a user can obtain good use experience.

Description

Pickup equipment and headset

Technical Field

The application relates to the technical field of acoustics, in particular to sound pickup equipment and a headset.

Background

With the rapid development of electronics, headsets have become a standard for many mobile devices through which users may entertain or communicate with other users. From the beginning of the headset, after solving the problem of being unable to make a call, attention is being paid more and more to pursuing high-quality call effects, wherein the performance of a sound pickup device on the headset, which comprises a microphone housing and electronic components enclosed in the microphone housing, plays a vital role in obtaining high-quality sound. The inventor finds that when a user uses the headset to talk or singe, the pickup device sometimes generates a mark spraying phenomenon, namely the problem that the sound obtained by the pickup device is unstable in sound generated after being restored and has airflow noise and the like, so that the use experience of the user is poor.

Disclosure of Invention

In view of the above, the present application provides a pickup apparatus and a headset for solving the problem that the pickup apparatus of the headset has a mark spraying phenomenon, so as to improve the use experience of a user.

In order to solve the above-described problems, the present application discloses a sound pickup apparatus including a housing, a microphone, and a hollow passage, wherein:

the microphone and the hollow channel are both arranged inside the shell;

one end of the hollow channel extends to the outside of the shell, the other end extends to the microphone, and the length of the hollow channel is far longer than the thickness of the shell.

Optionally, the microphone is an electret microphone or a MEMS microphone.

Optionally, the housing includes a first casing and a second casing, and an intermediate casing, a cover member, and an electronic circuit board are further disposed between the first casing and the second casing, wherein:

the electronic circuit board is fixed on one side of the middle shell;

the cover plate component is fixed on the other side of the middle shell, and forms a strip-shaped hollow channel with the middle shell, wherein the hollow channel starts from a through hole reserved on the middle shell and extends to one end of the middle shell;

the microphone is arranged on the electronic circuit board, penetrates through the through hole, faces the cover plate component and is separated from the cover plate component;

the second shell is connected with the middle shell at the edge part and is positioned on one side of the middle shell, on which the cover plate component is arranged;

the first shell is connected with the middle shell at the edge part and is positioned on one side of the middle shell, on which the electronic circuit board is arranged, the first shell and the second shell form a cladding cavity, and the cladding cavity is used for cladding the middle shell, the cover plate component, the electronic circuit board and the microphone.

Optionally, the cover component is a stainless steel cover.

Optionally, a groove is formed in the stainless steel cover plate, and the groove and the middle shell form the hollow channel.

Optionally, an end surface of the microphone facing the cover plate component is covered with damping cloth.

Optionally, a silica gel sleeve is arranged between the microphone and the through hole.

Optionally, the first housing and the second housing form an elongated microphone housing, wherein:

two ends of the microphone shell are respectively provided with an end cover part.

The middle cover plate and the middle shell are respectively combined with the first shell and the second shell in an ultrasonic welding mode.

A headset, the arrangement comprising a headset and a sound pick-up device as described above.

According to the technical scheme, the pickup device comprises the shell, the microphone and the longer hollow channel, the microphone is communicated with the outside of the shell through the hollow channel, sound can reach the microphone through the longer hollow channel after entering the shell, so that the sound can pass through a longer propagation path, sound pressure can become more stable due to the longer hollow channel in the propagation process, the phenomenon of spraying marks caused by irregular sound pressure can be avoided, and a user can obtain good use experience.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a cross-sectional view of an embodiment of a sound pickup apparatus provided by the present application;

fig. 2 is a cross-sectional view of another embodiment of a sound pickup apparatus according to the present application

FIG. 3 is a perspective view of an intermediate housing provided by the present application;

FIG. 4 is a perspective view of a cover plate component provided by the present application;

fig. 5 is a cross-sectional view of still another embodiment of a sound pickup apparatus provided by the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The inventor finds that when the conventional common pickup device works, sound directly enters through a pickup hole arranged on a shell of the conventional common pickup device, a microphone in the shell is opposite to the pickup hole, and a user generally directly faces pickup Kong Fasheng with a mouth when using the pickup device, so that sound and irregular sound pressure directly act on the microphone to generate a spray mark phenomenon, wherein the irregular sound pressure is a main reason for generating the spray mark.

Example 1

Fig. 1 is a cross-sectional view of an embodiment of a sound pickup apparatus provided by the present application.

Referring to fig. 1, the pickup apparatus provided in this embodiment may be applied to an electronic apparatus such as a headset, and specifically includes a housing 10, a microphone 20, and a hollow passage 100 disposed inside the housing.

The microphone 20 is provided inside the housing 10, and the hollow passage 100 is also provided inside the housing 10, and has a long length, which is much longer than the thickness of the housing 10. One end of the hollow channel 100 is opened on the housing, and the other end extends to the microphone 20, so that when sound reaches the microphone 20 through the housing 10, the sound needs to pass through the longer hollow channel 100, and when the sound reaches the microphone 20, the microphone 20 can convert the sound into a corresponding electric signal, thereby completing pickup.

The microphone 20 may be an electret microphone or a MEMS microphone.

From the above technical scheme, it can be seen that this embodiment provides a pickup apparatus, this pickup apparatus includes shell, microphone and longer cavity passageway, and the microphone passes through the outside intercommunication of cavity passageway and shell, needs to pass through longer cavity passageway and just can reach on the microphone after the sound gets into the shell, thereby make the sound need pass through longer propagation path, sound pressure can become comparatively stable owing to longer cavity passageway in propagation process, thereby can avoid spouting the mark phenomenon because of irregular sound pressure produces, make the user obtain good use experience.

Example two

Fig. 2 is a cross-sectional view of another embodiment of a sound pickup apparatus provided by the present application.

Referring to fig. 2, the pickup apparatus provided in the present embodiment is applied to a headset, and specifically includes a housing including a first housing 11 and a second housing 12, and an intermediate housing 30, a cover member 50, an electronic circuit board 40, and a microphone 20 are further provided between the first housing 11 and the second housing 12.

When the sound pickup apparatus is laid flat on a plane, the first housing 11 is located at the uppermost side and the second housing 12 is located at the lowermost side, and the two housings form a closed cavity for encasing the intermediate housing 30, the cover member 50, the electronic circuit board 40, and the microphone 20 inside.

The intermediate housing 30 serves as a support with one side facing the first housing 11 and the other side facing the second housing 12. The electronic circuit board 40 is disposed on a side facing the first housing 11, and a through hole 31 is formed therein, and as shown in fig. 2, the cover member 50 is disposed on a side facing the second housing 12, and a gap is formed between the cover member 50 and the intermediate housing 30, so that the hollow passage 100 described in the previous embodiment is formed, and the hollow passage 100 starts from the through hole 31 and ends with an end 32 of the intermediate cover 30, at which a sound pickup hole (not shown) is formed.

The microphone 20 is disposed on the electronic circuit board 40, the electronic circuit board 40 is fixed to the side of the intermediate housing 30 facing the first housing 11, and the microphone 20 on the electronic circuit board 40 passes through the through hole 31 on the intermediate cover 30 to face the cover member 50. The distance between the microphone 20 and the cover member 50 is approximately equal to the width of the hollow passage 100, and the center axis of the microphone 20 is perpendicular to the direction of the hollow passage 100 when viewed from the placement position.

The middle shell 30 is connected with the cover plate component 50 through an adhesive, such as 3M glue, the first shell 11 is connected with the middle shell 30 at the edge part of the two, and the two can be welded together in an ultrasonic welding mode; the intermediate housing 30 and the second housing 12 can also be welded together by ultrasonic welding at the edges of the two.

As can be seen from the above technical solutions, the present embodiment provides a sound pickup apparatus applied to a headset, including a first housing, a second housing, a middle housing, a cover member, an electronic circuit board, and a microphone. The first shell, the electronic circuit board, the middle shell, the cover plate component and the second shell are sequentially connected in sequence, so that the first shell and the second shell form a cladding cavity, the electronic circuit board, the middle shell and the cover plate component are clad, wherein a hollow channel formed by the cover plate component and the middle shell is used as a channel for entering sound, and due to the slender structure, sound pressure becomes more stable when reaching a microphone positioned at the tail end of the hollow channel, and therefore a spraying mark phenomenon caused by irregular sound pressure can be avoided, and a user obtains good use experience.

The cover member 50 in this embodiment is generally made of stainless steel, i.e., a stainless steel cover plate, and a groove 51 is provided in the middle of the cover member 50, i.e., the groove 51 and the middle housing 30 form the hollow passage 100 as a sound passage.

In addition, one end cap member 33 is provided at each end of the sound pickup apparatus. So that the first housing 11 and the second housing 12 form a complete closed cavity.

MEMS microphones are microphones based on MEMS (microelectromechanical systems) technology, simply a capacitor integrated on a micro-silicon wafer, which can be fabricated using surface mount technology, can withstand very high reflow temperatures, are easily integrated with CMOS processes and other audio circuits, and have improved noise cancellation performance and good RF and EMI suppression. The full potential of MEMS microphones remains to be exploited, but products employing this technology have shown many advantages in a variety of applications, particularly in mid-high end mobile phone applications.

Example III

Fig. 5 is a cross-sectional view of another embodiment of a sound pickup apparatus provided by the application.

Referring to fig. 5, the pickup apparatus according to the present embodiment is provided with a damping cloth 70 and a silicone cover 80 added to the above embodiment.

The damping cloth 70 covers the surface of the microphone 20 to make the sound soft and beautiful, and also to prevent dust from entering the microphone 20 through the hollow passage 100.

The silica gel sleeve 80 is used for wrapping around the microphone 20, so that the microphone 20 can be tightly sleeved in the through hole of the middle shell 30, and vibration is avoided.

Example IV

This embodiment provides a headset, and this headset is provided with the pickup equipment that above embodiment provided, because this pickup is around utilizing apron part and middle casing to form hollow channel to can avoid producing the phenomenon of spouting mark, can make the user obtain good use experience.

In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the application.

Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or terminal device comprising the element.

The foregoing has outlined rather broadly the more detailed description of the application in order that the detailed description of the application that follows may be better understood, and in order that the present principles and embodiments may be better understood; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims

1. A pickup apparatus comprising a housing, a microphone, and a hollow passage, wherein:

the microphone and the hollow channel are both arranged inside the shell; the microphone is an electret microphone or an MEMS microphone;

one end of the hollow channel extends to the outside of the shell, the other end extends to the microphone, and the length of the hollow channel is far longer than the thickness of the shell;

the shell includes first casing and second casing still be provided with intermediate casing, apron part and electronic circuit board between first casing with the second casing, wherein:

the electronic circuit board is fixed on one side of the middle shell;

2. The pickup apparatus of claim 1, wherein the cover member is a stainless steel cover.

3. The pickup apparatus of claim 2, wherein the stainless steel cover plate is provided with a groove, and the groove and the intermediate housing form the hollow passage.

4. The sound pickup apparatus according to claim 1, wherein an end surface of the microphone facing the cover member is covered with a damping cloth.

5. The pickup apparatus as claimed in claim 1, wherein a silicone sleeve is provided between the microphone and the through hole.

6. The pickup apparatus according to claim 1, wherein the first housing and the second housing form an elongated microphone housing, wherein:

7. The pickup apparatus as claimed in claim 1, wherein the cover member and the intermediate housing are joined together with the first housing and the second housing, respectively, by ultrasonic welding.

8. A headset comprising an earphone, characterized by further comprising a sound pickup apparatus as claimed in any one of claims 1 to 7.