WO2015029255A1

WO2015029255A1 - Information control device, mounting system, and information control method

Info

Publication number: WO2015029255A1
Application number: PCT/JP2013/073559
Authority: WO
Inventors: 中山　大輔
Original assignee: 富士機械製造株式会社
Priority date: 2013-09-02
Filing date: 2013-09-02
Publication date: 2015-03-05
Also published as: JP6262237B2; JPWO2015029255A1

Abstract

A mounting system (10) generates correspondence relationship information in which measurement information (a solder measurement value) relating to printing inspection processing by a printing inspection device (13), measurement information (a part measurement value) relating to mounting inspection processing by a mounting inspection device (15), and result information (an inspection result) relating to reflow inspection processing by a reflow inspection device (17) are associated. The mounting system (10) then sets a printing determination criterion for the printing inspection processing and a mounting determination criterion for the mounting inspection processing on the basis of the generated correspondence relationship information, and executes the printing inspection processing and the mounting inspection processing using the set printing determination criterion and mounting determination criterion. For example, the state of soldering, the state of disposition of a part, and the like are mutually related to a final state after reflow in some cases. The mounting system sets the determination criterions on the basis of the mutually related corresponding relationship information.

Description

Information control apparatus, mounting system, and information control method

The present invention relates to an information control device, a mounting system, and an information control method.

Conventionally, as an inspection device for mounting processing, a histogram of misregistration amounts measured by component misregistration inspection is created for each board with good and bad test results in the final soldering process. There has been proposed a method for initially setting a determination reference value for determining a determination range (see, for example, Patent Document 1). In this device, after setting the judgment reference value, the measurement value and final inspection result included in the “good” judgment range for the board having the final inspection result “defective” are changed to “good” while changing the judgment reference value. The process of obtaining the total sum of the measurement values included in the “defect” determination range for the substrate “” is repeated. Then, the optimal value is selected when the ratio of the total to the total number of substrates reaches the overlook rate or overlook rate specified by the user. For this reason, it is possible to easily set a determination criterion that allows the frequency of inconsistency between the inspection result in the intermediate process and the inspection result in the final process to be within the allowable value.

JP 2008-10666 A

However, in the apparatus described in Patent Document 1, only one of the intermediate processes is considered, and even if the inspection criteria can be easily set, it has not been sufficient. When the inspection results are inconsistent, there is a problem that the processing efficiency of the entire process of the mounting system is lowered, such as the necessity for the operator to check visually.

The present invention has been made in view of such problems, and a main object of the present invention is to provide an information control apparatus and an information control method that can further improve the processing efficiency of the mounting system.

The present invention adopts the following means in order to achieve the main object described above.

That is, the information control apparatus of the present invention
A printing apparatus that executes a printing process for printing solder on a substrate, a printing inspection apparatus that executes a printing inspection process for inspecting the state of the printed solder, and a mounting process for mounting components on the board A mounting processing apparatus, a mounting inspection apparatus for executing a mounting inspection process for inspecting a mounting state of the component subjected to the mounting process, a reflow apparatus for executing a reflow process for the board, and a reflow inspection for inspecting the board after the reflow. An information control device of a mounting system comprising a reflow inspection device for executing processing,
Information acquisition means for acquiring measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process;
Information generating means for generating correspondence information in which the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process are associated;
Reference setting means for setting at least one of a print determination standard of the print inspection process and a mounting determination standard of the mounting inspection process based on the generated correspondence information;
It is equipped with.

The information control apparatus acquires measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process, and acquires the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, Then, correspondence information that associates the result information of the reflow inspection process is generated. Next, the information control apparatus sets at least one of a print determination standard for the print inspection process and a mounting determination standard for the mounting inspection process based on the generated correspondence information. Then, the mounting system executes a print inspection process and a mounting inspection process using the set printing determination standard and mounting determination standard. The processing executed by the mounting system includes, for example, a printing process for printing solder on a board, a mounting process for placing components on a board on which solder is printed, and a reflow process for reflowing solder. For example, even if the solder formation position is shifted and the component placement position is shifted, the heated solder may be moved during the reflow process and the component may be in a normal position. As described above, the state of solder, the arrangement state of components, and the like may be related to the final state after reflow. The information control device generates correspondence information in which measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process are associated with each other, and sets a determination criterion based thereon. For this reason, it is possible to set a more appropriate determination criterion by using measurement information of each process related to each other, and it is possible to further suppress an operator's confirmation work performed by stopping the line. Therefore, the processing efficiency of the mounting system can be further increased. At this time, the information control apparatus of the present invention outputs the set print determination standard to the print inspection apparatus when the print determination standard is set, and outputs the set mounting determination standard when the mounting determination standard is set. Information output means for outputting to the mounting inspection apparatus may be provided.

In the information control apparatus of the present invention, the information generation means includes one or more types of solder measurement values as the measurement information of the print inspection process, one or more types of component measurement values as the measurement information of the mounting inspection process, and the reflow. The correspondence information is generated by associating the pass / fail result determined after the reflow of the component as the result information of the inspection process, and the solder measurement value includes the solder height, the solder area, and the solder volume (quantity). ) And the position of the solder, and the component measurement value is one of the component displacement amount with respect to the substrate, the component displacement amount with respect to the printed solder, and the rotation angle of the component. It is good also as what contains a seed or more. In this way, it is possible to further improve the processing efficiency of the mounting system using the solder measurement value, the component measurement value, the pass / fail result, and the like. At this time, one type of solder measurement value, one type of component measurement value, and a pass / fail result may be associated with each other. In this way, correspondence information can be generated with a relatively simple process. Alternatively, a plurality of types of solder measurement values, a plurality of types of component measurement values, and good / bad results may be associated with each other. In this way, more detailed correspondence information can be generated.

In the information control apparatus of the present invention, the information generating means is included in a predetermined range of the solder measurement value, a predetermined range of the component measurement value, a predetermined range of the solder measurement value, and a predetermined range of the component measurement value. The correspondence relationship information may be generated by associating the statistical values of the pass / fail results of the above parts with a plurality of the predetermined ranges. In this way, it is possible to further improve the processing efficiency of the mounting system by using the predetermined range of measurement values and statistical values. Here, the statistical value may be, for example, a defect rate.

In the information control apparatus according to the aspect of the invention, the reference setting unit may include the print determination standard and / or the statistical value of the pass / fail result satisfying a predetermined pass / fail value according to the range of the solder measurement value and the range of the component measurement value. Alternatively, the mounting determination criterion may be set. Here, the “predetermined pass / fail value” may be set to, for example, the maximum defect rate allowable by the user. At this time, the information generation unit sets the upper limit value of the range of the solder measurement value that satisfies the predetermined pass / fail statistical value as the print determination criterion, and the pass / fail statistical value is the predetermined pass / fail. The upper limit value of the component measurement value range that satisfies the value may be set as the mounting determination criterion.

In the information control apparatus according to the aspect of the invention, the information generation unit may include a solder measurement value that is a state of the solder at a specific position where the component is arranged as measurement information of the print inspection process, and measurement information of the mounting inspection process. A part measurement value indicating the state of the part at the specific position is associated with a plurality of the specific positions, as the result information of the reflow inspection process, the pass / fail result after the reflow of the part at the specific position is determined. The correspondence relationship information may be generated. In this way, it is possible to set a determination criterion for each specific position. At this time, the reference setting unit may set the print determination standard and / or the mounting determination standard for each specific position based on the correspondence information.

In the information control apparatus of the present invention, the information generation means may generate the correspondence information after executing a reflow process for a predetermined number of substrates. By doing this, it is possible to set a determination criterion with higher reliability, and thus it is possible to increase the processing efficiency of the mounting system more reliably. Here, the “predetermined number” may be determined empirically, for example, such that the result information of the reflow inspection process is a sufficiently reliable value. In the information control apparatus of the present invention, the reference setting unit may set the print determination criterion and / or the mounting determination criterion after executing a reflow process for a predetermined number of substrates.

The information control apparatus according to the present invention may further include a condition setting unit that sets at least one of a print execution condition of the print process and a mounting execution condition of the mounting process based on the generated correspondence relationship information. Good. In this information control apparatus, at least one of the print execution condition of the print process and the mount execution condition of the mount process is set based on the generated correspondence relationship information. For example, in a mounting system, there are a printing process for printing solder on a board, a mounting process for placing components on a board printed with solder, a reflow process for reflowing solder, and the like. For example, even if the solder formation position is shifted and the component placement position is shifted, the heated solder may be moved during solder reflow to bring the component to a normal position. As described above, the state of solder, the arrangement state of components, and the like may be related to the final state after reflow. The information control device generates correspondence information that associates the measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process, and based on this, the print execution condition and the mounting execution information are generated. Set conditions. For this reason, more appropriate execution conditions can be set, and as a result, the operator's confirmation work performed by stopping the line can be further suppressed. Therefore, the processing efficiency of the mounting system can be further increased. At this time, the information control apparatus of the present invention outputs the set print execution condition to the printing apparatus when the print execution condition is set, and outputs the set mount execution condition when the mount execution condition is set. The information output means for outputting to the apparatus may be provided.

In the information control apparatus of the present invention including a condition setting unit, the condition setting unit sets at least one of a printing speed and a printing pressure as the printing execution condition, and holds the holding force of the component as the mounting execution condition. At least one of the moving speeds of the parts may be set.

In the information control apparatus of the present invention including a condition setting unit, the information generation unit includes a solder measurement value that is a state of the solder at a specific position where the component is arranged as measurement information of the print inspection process, and the mounting A plurality of the specific values including a component measurement value indicating the state of the component at the specific position as measurement information of the inspection process, and a pass / fail result determined as a result of reflow of the component at the specific position as the result information of the reflow inspection process The correspondence relationship information associated with a position is generated, and the condition setting unit sets the print execution condition and / or the mounting execution condition for each specific position based on the correspondence relationship information. Also good.

The mounting system of the present invention includes a printing apparatus that executes a printing process for printing solder on a substrate, a printing inspection apparatus that performs a printing inspection process for inspecting the state of the printed solder, and a component on the board. A mounting processing device for executing mounting processing to be mounted, a mounting inspection device for executing mounting inspection processing for inspecting a mounting state of the component subjected to mounting processing, a reflow device for executing reflow processing of the substrate, and the post-reflow A reflow inspection apparatus that executes a reflow inspection process for inspecting a substrate of the substrate, and the information control apparatus according to any one of the above, wherein the print inspection apparatus uses the set print determination criterion to perform the printing. An inspection process is executed, and the mounting inspection apparatus executes the mounting inspection process using the set mounting criterion.

This mounting system includes any of the information control devices described above. For this reason, it is possible to set a more appropriate determination criterion, and it is possible to further suppress the operator's confirmation work performed by stopping the line. Therefore, the processing efficiency of the mounting system can be further increased. Moreover, the effect of the information control apparatus mentioned above can be acquired according to the employ | adopted information control apparatus.

The information control method of the present invention includes:
A printing apparatus that executes a printing process for printing solder on a substrate, a printing inspection apparatus that executes a printing inspection process for inspecting the state of the printed solder, and a mounting process for mounting components on the board A mounting processing apparatus, a mounting inspection apparatus for executing a mounting inspection process for inspecting a mounting state of the component subjected to the mounting process, a reflow apparatus for executing a reflow process for the board, and a reflow inspection for inspecting the board after the reflow. An information control method for a mounting system comprising a reflow inspection device for executing processing,
(A) obtaining measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process;
(B) generating correspondence information associating the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process;
(C) setting at least one of a print determination standard for the print inspection process and a mounting determination standard for the mounting inspection process based on the generated correspondence information;
Is included.

Similar to the information control apparatus described above, this information control method generates correspondence information that associates measurement information of print inspection processing, measurement information of mounting inspection processing, and result information of reflow inspection processing. The criterion is set based on For this reason, it is possible to set a more appropriate determination criterion by using measurement information of each process related to each other, and it is possible to further suppress an operator's confirmation work performed by stopping the line. Therefore, the processing efficiency of the mounting system can be further increased. In this information control method, various aspects of the above-described information control apparatus may be adopted, and steps for realizing each function of the above-described information control apparatus may be added. At this time, the information control method of the present invention (d) outputs the set print determination standard to the print inspection apparatus when the print determination standard is set, and sets the mount determination when the mount determination standard is set. Outputting a reference to the mounting inspection apparatus.

Alternatively, the information control apparatus of the present invention is
A printing apparatus that executes a printing process for printing solder on a substrate, a printing inspection apparatus that executes a printing inspection process for inspecting the state of the printed solder, and a mounting process for mounting components on the board A mounting processing apparatus, a mounting inspection apparatus for executing a mounting inspection process for inspecting a mounting state of the component subjected to the mounting process, a reflow apparatus for executing a reflow process for the board, and a reflow inspection for inspecting the board after the reflow. An information control device of a mounting system comprising a reflow inspection device for executing processing,
Information acquisition means for acquiring measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process;
Information generating means for generating correspondence information in which the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process are associated;
Condition setting means for setting at least one of a print execution condition of the print process and a mounting execution condition of the mounting process based on the generated correspondence information;
It is good also as a thing provided.

The information control apparatus acquires measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process, and acquires the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, Then, correspondence information that associates the result information of the reflow inspection process is generated. Next, at least one of the print execution condition for the printing process and the mounting execution condition for the mounting process is set based on the generated correspondence information. Then, the mounting system executes print processing and mounting processing using the set print execution conditions and mounting execution conditions. The processing executed by the mounting system includes, for example, a printing process for printing solder on a board, a mounting process for placing components on a board on which solder is printed, and a reflow process for reflowing solder. For example, even if the solder formation position is shifted and the component placement position is shifted, the heated solder may be moved during solder reflow to bring the component to a normal position. As described above, the state of solder, the arrangement state of components, and the like may be related to the final state after reflow. The information control device generates correspondence information that associates measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process, and sets an execution condition based on the correlation information. For this reason, more appropriate execution conditions can be set. Therefore, the processing efficiency of the mounting system can be further increased. In this information control apparatus, various aspects of the above-described information control apparatus may be adopted, and steps for realizing each function of the above-described information control apparatus may be added. At this time, the information control apparatus of the present invention outputs the set print execution condition to the printing apparatus when the print execution condition is set, and outputs the set mount execution condition when the mount execution condition is set. The information output means for outputting to the apparatus may be provided.

1 is a schematic explanatory diagram of a mounting system 10. FIG. 1 is a schematic explanatory diagram of a printing apparatus 12. FIG. FIG. 2 is a schematic explanatory diagram of a mounting processing device 14. FIG. 2 is a block diagram showing the configuration of each device of the mounting system 10 Explanatory drawing of the functional block of the mounting system 10. FIG. The flowchart showing an example of a main routine. 6 is a flowchart illustrating an example of a print processing routine. 6 is a flowchart illustrating an example of a print inspection processing routine. The flowchart showing an example of a mounting process routine. The flowchart showing an example of a mounting inspection process routine. The flowchart showing an example of a reflow inspection process routine. The flowchart showing an example of a corresponding information generation condition setting process routine. Explanatory drawing of an example of the result information 85a. Explanatory drawing of an example of the defect rate matrix 85b. Explanatory drawing of an example of the mounting determination reference | standard 85d. An explanatory view of an example of statistics correspondence information 85e.

(First embodiment)
Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of the mounting system 10. FIG. 2 is a schematic explanatory diagram of the printing apparatus 12. FIG. 3 is a schematic explanatory diagram of the mounting processing device 14. FIG. 4 is a block diagram illustrating the configuration of each device of the mounting system 10. FIG. 5 is an explanatory diagram of functional blocks of the mounting system 10. The mounting system 10 includes a printing apparatus 12 that executes a printing process for printing solder on the substrate S, and a printing inspection apparatus 13 that executes a printing inspection process for inspecting the state of the printed solder. The mounting system 10 includes a mounting processing device 14 that executes a mounting process for mounting the component P on the substrate S, and a mounting inspection device 15 that performs a mounting inspection process for inspecting the mounting state of the component P that has been mounted. It has. The mounting system 10 also includes a reflow device 16 that executes a reflow process for the substrate S, a reflow inspection device 17 that executes a reflow inspection process that inspects the substrate S after reflow, and a management computer 80 that manages information. ing. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG. In the first embodiment, an aspect in which a mounting determination standard used for the inspection of the mounting inspection apparatus 15 is set using the defect rate matrix 85b will be mainly described.

As shown in FIG. 2, the printing apparatus 12 applies solder to the lower substrate S through the pattern hole by pressing the solder into the pattern hole formed in the screen mask M using the squeegees 29 and 29 (printing). ). The printing apparatus 12 includes a double squeegee that can reciprocate by reciprocating in the Y-axis direction. As shown in FIG. 4, the printing apparatus 12 performs bidirectional communication with a controller 20 that controls the entire apparatus, an HDD 21 that stores various types of information, and an external device connected to the LAN 18 such as a management computer 80. A communication unit 22 and an imaging unit 23 that images and confirms the position of the substrate S and the screen mask M are provided. Further, the printing apparatus 12 includes a substrate processing unit 24 that moves and fixes the substrate S, a mask unit 25 that positions and fixes the screen mask M that is fitted in the frame, and a squeegee 29. Is moved on the screen mask M, and a printing processing unit 26 for printing the solder is provided. The controller 20 is configured as a microprocessor centered on a CPU 20a, and includes a ROM 20b that stores various processing programs and a RAM 20c that temporarily stores data. The HDD 21 is a storage unit that has a large capacity and stores various data in a rewritable manner, and stores printing condition information 21 a including printing execution conditions such as a pressing force of the squeegee 29 and a moving speed of the squeegee 29. The printing condition information 21a is acquired from the management computer 80 and stored in the HDD 21. As shown in FIG. 2, the print processing unit 26 includes a print head 27, a head moving unit 28 that can move the print head 27 in the Y direction, and squeegees 29 and 29 that move the solder and execute print processing. ing. The print head 27 includes a piston rod that expands and contracts in the Z direction, and moves a squeegee 29 fixed to the piston rod in the Z-axis direction (vertical direction). The head moving unit 28 moves the print head 27 in the Y-axis direction by driving a moving motor, with the slider guided by a guide rail that is a guide member.

The print inspection apparatus 13 is an apparatus that inspects the printed state of the solder formed on the printed substrate S based on the captured image, and as shown in FIG. 4, a controller 30 that controls the entire apparatus, An HDD 31 that stores various types of information and a communication unit 32 that performs bidirectional communication with an external device connected to the LAN 18 are provided. The print inspection apparatus 13 includes an inspection processing unit 34 that images the board S and measures the printed state of the solder. The controller 30 is configured as a microprocessor centered on a CPU 30a, and includes a ROM 30b that stores various processing programs and a RAM 30c that temporarily stores data. The HDD 31 is a storage unit that has a large capacity and stores various data in a rewritable manner, and print inspection condition information 31a including inspection conditions for print processing and print measurement value information 31b including solder measurement values as measurement results. Memorize etc. In addition, as a solder measured value, the height of solder, the area of solder, the volume (amount) of solder, the position of solder, etc. are mentioned, for example, Among these, 1 or more types are included. The print inspection condition information 31 a is acquired from the management computer 80 and stored in the HDD 31. The inspection processing unit 34 is disposed in the inspection head, and moves to move the inspection head along the XY plane (a surface parallel to the plate surface of the substrate S), which images the solder printed on the substrate S. Part 36. The inspection head includes a light source that irradiates slit light so that a grating is formed on the surface of the substrate S, and the imaging unit 35 images the grating of light formed on the surface of the substrate S obliquely from two directions. The line of light that constitutes the grating formed by the irradiated slit light shifts at the place where the solder is printed, with respect to the place where the solder is not printed. The amount of this shift varies depending on the thickness (height) of the solder. The print inspection apparatus 13 uses this principle to measure the height, area, volume, and position of the printed solder corresponding to each component position by processing the image data captured by the imaging unit 35. . The print inspection apparatus 13 determines whether or not the deviation between the normal position of the solder printed corresponding to each component position and the actual solder position is within an allowable range.

The mounting processing apparatus 14 is an apparatus that arranges (mounts) the component P supplied by the supply unit 45 at a predetermined position on the substrate S as shown in FIG. The mounting process includes a process of placing, mounting, inserting, joining, and adhering components on a substrate. As shown in FIG. 4, the mounting processing device 14 includes a controller 40 that controls the entire device, an HDD 41 that stores various types of information, a communication unit 42 that performs bidirectional communication with an external device connected to the LAN 18, and And an image pickup unit 43 that picks up and confirms the component P sucked by the suction nozzle 49. In addition, the mounting processing apparatus 14 includes a substrate processing unit 44 that moves and fixes the substrate S, a supply unit 45 that includes a tray and a reel that accommodates the component P, and a mounting process that sucks and moves the component P onto the substrate S. Unit 46. The controller 40 is configured as a microprocessor centered on the CPU 40a, and includes a ROM 40b that stores various processing programs and a RAM 40c that temporarily stores data. The HDD 41 is a storage unit that has a large capacity and stores various data in a rewritable manner, and stores mounting condition information 41 a including mounting execution conditions such as the moving speed of the mounting head 47 and the suction force of the suction nozzle 49. . The mounting condition information 41a is acquired from the management computer 80 and stored in the HDD 41. As shown in FIG. 3, the mounting processing unit 46 includes a mounting head 47, a head moving unit 48 that can move the mounting head 47 in the XY direction, and a suction nozzle 49 that is mounted on the mounting head 47 and sucks the component P. I have. The mounting head 47 moves the suction nozzle 49 in the Z-axis direction by adjusting a ball screw extending along the Z-axis with a Z-axis motor. The head moving unit 48 moves the mounting head 47 in the XY directions by driving a moving motor, with the slider guided by a guide rail that is a guide member.

The mounting inspection device 15 is a device that inspects the mounting state of the component P arranged on the printed board S based on the captured image, and as shown in FIG. 4, a controller 50 that controls the entire device. And an HDD 51 for storing various types of information, and a communication unit 52 for performing bidirectional communication with an external device connected to the LAN 18. Further, the mounting inspection apparatus 15 includes an inspection processing unit 54 that images the board S and measures the mounting state of the component P. The controller 50 is configured as a microprocessor centered on a CPU 50a, and includes a ROM 50b that stores various processing programs and a RAM 50c that temporarily stores data. The HDD 51 is a storage unit that has a large capacity and stores various data in a rewritable manner, and stores mounting inspection condition information 51a, mounting measurement value information 51b including component measurement values that are measurement results, and the like. The component measurement values include, for example, the positional deviation amount of the component P with respect to the substrate S, the positional deviation amount of the component P with respect to the printed solder, the rotation angle of the component P, and the like. The mounting inspection condition information 51 a is acquired from the management computer 80 and stored in the HDD 51. The inspection processing unit 54 is disposed on the inspection head, and moves the inspection head 55 along the XY plane (a surface parallel to the plate surface of the substrate S), which images the component P disposed on the substrate S. The moving part 56 is provided. The mounting inspection device 15 measures the positional deviation and the rotation angle of the component P based on the difference between the reference image in which the component P is arranged at the regular position and the captured image. The mounting inspection device 15 determines whether or not the deviation between the normal position of the component P arranged corresponding to each component position and the actual position of the component P is within an allowable range.

The reflow device 16 is a device that electrically connects and fixes each component P on the substrate S by melting the solder by heating the substrate S on which the component P is disposed on the solder, and then cooling it. As shown in FIG. 4, the reflow device 16 includes a reflow control unit 60 that controls the entire device, a communication unit 62 that performs bidirectional communication with an external device connected to the LAN 18, and a heating chamber 63 that houses the substrate S. And a heating unit 64 having a heater for heating the inside of the heating chamber 63.

The reflow inspection device 17 is a device that finally inspects the state of the component P on the reflowed substrate S based on the captured image. As shown in FIG. 4, the reflow inspection apparatus 17 includes a controller 70 that controls the entire apparatus, an HDD 71 that stores various types of information, and a communication unit 72 that performs bidirectional communication with external devices connected to the LAN 18. ing. Further, the reflow inspection device 17 includes an inspection processing unit 74 that images the board S and measures the mounting state of the component P. The controller 70 is configured as a microprocessor centered on a CPU 70a, and includes a ROM 70b that stores various processing programs and a RAM 70c that temporarily stores data. The HDD 71 is a storage unit that has a large capacity and stores various data in a rewritable manner, and stores inspection condition information 71a including inspection conditions for the substrate S after reflow, inspection result information 71b including final inspection results, and the like. To do. This inspection condition information 71 a is acquired from the management computer 80 and stored in the HDD 71. The inspection processing unit 74 is disposed in the inspection head, and an imaging unit 75 that images the reflowed component P disposed on the substrate S, and the inspection head along the XY plane (a surface parallel to the plate surface of the substrate S). And a moving unit 76 for moving the image. The reflow inspection device 17 measures the positional deviation and the rotation angle of the component P based on the difference between the reference image in which the component P is arranged at the regular position and the captured image. The reflow inspection device 17 determines whether or not the deviation between the normal position of the component P arranged corresponding to each component position and the actual position of the component P is within an allowable range.

The management computer 80 is a computer that manages information of each device of the mounting system 10. As shown in FIG. 1, the management computer 80 is composed of a CPU 82, a ROM 83, a RAM 84, and the like, which controls the entire apparatus, an HDD 85 that stores various application programs and various data files, and an external device connected to the LAN 18. A communication unit 86 that performs bidirectional communication with the device. In addition, the management computer 80 includes an input device 87 such as a keyboard and a mouse for an operator to input various commands, and a display 88 for displaying various information. The HDD 85 is a storage unit that has a large capacity and stores various data in a rewritable manner, and stores result information 85a, a defect rate matrix 85b, a print determination criterion 85c, a mounting determination criterion 85d, and the like. The result information 85a is data including a solder measurement value by the print inspection apparatus 13, a component measurement value by the mounting inspection apparatus 15, and an inspection result after reflow by the reflow inspection apparatus 17 (see FIG. 13 described later). The defect rate matrix 85b includes a predetermined range of solder measurement values, a predetermined range of component measurement values, and a failure rate included in the predetermined range of solder measurement values and the predetermined range of component measurement values for a plurality of predetermined ranges. The associated information (see FIG. 14 described later). The print determination standard 85c is a threshold value for determining whether or not the state of the solder printed on the substrate S is an acceptable state. The mounting determination reference 85d is a threshold value for determining whether or not the state of the component P arranged on the board S is an acceptable state.

Next, functional blocks provided in the management computer 80 will be described. As shown in FIG. 5, the management computer 80 includes an inspection data acquisition unit 90, a correspondence relationship generation unit 91, a correspondence relationship holding unit 92, a condition setting unit 93, and a condition command unit 94. The inspection data acquisition unit 90 executes processing for acquiring measurement information (solder measurement values) of print inspection processing, measurement information (component measurement values) of mounting inspection processing, and result information (inspection results) of reflow inspection processing. To do. The correspondence generation unit 91 executes processing for generating correspondence information (defective rate matrix 85b) in which the solder measurement values, the component measurement values, and the inspection results acquired by the inspection data acquisition unit 90 are associated with each other. The correspondence relationship holding unit 92 is a storage unit that stores the generated correspondence relationship information. The condition setting unit 93 executes a process of setting one or more of a print determination standard for the print inspection process, a mounting determination standard for the mounting inspection process, a print execution condition, and a mounting execution condition based on the generated correspondence information. The condition command unit 94 executes a process of outputting the set printing determination standard, mounting determination standard, printing execution condition, and mounting execution condition to the corresponding device.

Next, the operation of the mounting system 10 of the present embodiment configured as described above will be described. FIG. 6 is a flowchart illustrating an example of a main routine executed by the CPU 82 of the management computer 80. This routine is stored in the HDD 85 of the management computer 80, and is executed by a start instruction from the operator. In this routine, for example, the function of the test data acquisition unit 90, the correspondence generation unit 91, the correspondence relationship holding unit 92, the condition setting unit 93, and the condition command unit 94, which are functional blocks, and the CPU 82 using each unit are used. Shall be executed. When this routine is started, the CPU 82 first instructs the printing apparatus 12 to execute the printing process (step S100), and instructs the printing inspection apparatus 13 to execute the printing inspection process (step S110). Next, the CPU 82 instructs the mounting processing apparatus 14 to execute the mounting process (step S120), and instructs the mounting inspection apparatus 15 to execute the mounting inspection process (step S130). Subsequently, the CPU 82 instructs the reflow apparatus 16 to execute the reflow process (step S140), and instructs the reflow inspection apparatus 17 to execute the reflow inspection process (step S150). Then, the CPU 82 generates a defect rate matrix 85b (corresponding relationship information), executes a process for setting an inspection standard and a mounting process condition based on the generated corresponding relationship information (step S160), and ends this routine. Each process will be described below. Here, for convenience of explanation, it is mainly described that the print inspection process is performed using the volume value of the solder, and the mounting inspection process is performed using the displacement of the position of the component P with respect to the substrate S. Is mainly explained.

The printing apparatus 12 that has received the print processing command output in step S100 executes print processing. FIG. 7 is a flowchart illustrating an example of a print processing routine executed by the CPU 20a of the printing apparatus 12. This routine is stored in the HDD 21. When this routine is started, the CPU 20a acquires the printing condition information 21a from the management computer 80 (step S200), executes the transporting and fixing process of the substrate S (step S210), and executes the printing process (step S220). In the printing process, the CPU 20a prints the solder on the substrate S through the screen mask M by moving the squeegee 29 in a state where the substrate S and the screen mask M are overlapped at an appropriate position. At this time, the squeegee 29 is controlled by the pressing force and the moving speed included in the printing condition information 21a. Next, the CPU 20a discharges the printed substrate S (step S230), and determines whether or not the production is completed based on whether or not the printing process has been performed on all the planned substrates S (step S240). ). When the production is not completed, the CPU 20a executes the processes after step S210. On the other hand, when the production is completed, this routine is finished as it is. In this way, solder is formed on the substrate S.

The print inspection apparatus 13 that has received the print inspection process command output in step S110 executes the print inspection process. FIG. 8 is a flowchart illustrating an example of a print inspection processing routine executed by the CPU 30 a of the print inspection apparatus 13. This routine is stored in the HDD 31. When this routine is started, the CPU 30a acquires the print inspection condition information 31a from the management computer 80 (step S300), executes the transporting and fixing processing of the substrate S (step S305), and performs imaging processing of the inspection range (step S310). ). Next, the CPU 30a sets an inspection position (component mounting position, hereinafter also referred to as component position) (step S315). For example, the setting of the component positions is performed by reading the predetermined order of the component positions included in the print inspection condition information 31a. Next, the CPU 30a acquires a solder measurement value by performing image processing on the captured image, and stores the print measurement value information 31b including the acquired solder measurement value in the HDD 31 (step S320). The CPU 30a acquires the solder height, area, volume, position, and the like as the solder measurement values. In addition, when there are a plurality of pads at the corresponding component position, for example, a predetermined representative value such as a minimum volume pad, a minimum area pad, and a minimum height pad may be acquired as a solder measurement value. Good. Subsequently, the CPU 30a acquires a print determination criterion corresponding to the component position (step S325), and determines whether or not the solder measurement value is within an error range based on whether or not the print determination criterion is exceeded. (Step S330). As will be described in detail later, it is assumed that the print determination criterion is set by the management computer 80. This determination is performed using the measurement value of the solder volume value and the print determination standard. When the solder measurement value is within the error range, an abnormality display process is executed (step S335). Here, it is assumed that the CPU 30a displays an error on the display unit of the operation panel. Further, a process of excluding the board S determined as an error from the mounting line may be performed. After step S335 or when the solder measurement value is not in the error range in step S330, the CPU 30a determines whether or not the inspection of the current substrate S has been completed (step S340), and if not completed, the processing after step S315 is performed. Execute. On the other hand, when the inspection of the current substrate S is completed, the CPU 30a discharges the substrate S that has been inspected (step S345), and determines whether or not the inspection of all the substrates S has been completed (step S350). When the inspection of all the substrates S has not been completed, the CPU 30a executes the processing after step S305, and when the inspection of all the substrates S has been completed, this routine is finished as it is. In this way, the state of the solder formed on the substrate S is inspected, and the substrate S that is considered to have a defect in the subsequent process is specified.

The mounting processing device 14 that has received the mounting processing command output in step S120 executes mounting processing. FIG. 9 is a flowchart illustrating an example of a mounting process routine executed by the CPU 40a of the mounting processing apparatus 14. This routine is stored in the HDD 41. When this routine is started, the CPU 40a acquires the mounting condition information 41a from the management computer 80, stores it in the HDD 41 (step S400), and executes the transfer and fixing process of the substrate S (step S410). Next, the CPU 40a sets a component P to be mounted on the substrate S based on the contents of the mounting condition information 41a (step S420), and acquires the mounting execution condition of the set component P from the mounting condition information 41a (step S430). ). It is assumed that the mounting order of the parts P includes a predetermined order in the mounting condition information 41a. Further, the mounting condition information 41a includes a mounting execution condition of the component P for each component position, for example, the suction force of the suction nozzle 49 and the moving speed of the mounting head 47. Next, the CPU 40a performs the mounting process of the set component P based on the mounting execution condition (step S440). In the suction process of the mounting process, the CPU 40a performs a process of moving the mounting head 47 to the take-out position of the supply unit 45 in which the corresponding part is stored, and lowering the suction nozzle 49 to suck the part P onto the suction nozzle 49. Do. In the movement process of the mounting process, the CPU 40a performs a process of moving the mounting head 47 that has attracted the component P to the position of the component on the substrate S through the imaging unit 43. Subsequently, the CPU 40a determines whether or not the mounting process for the current substrate S has been completed (step S450), and when the mounting process for the current substrate S has not been completed, the processes after step S420 are executed. On the other hand, when the mounting process of the current board S is completed, the CPU 40a discharges the mounted board S (step S460), and has the mounting process been executed for all the boards S scheduled for completion of production? A determination is made based on whether or not (step S470). When the production is not completed, the CPU 40a executes the processes after step S410. On the other hand, when the production is completed, this routine is finished as it is. In this way, the component P is arranged on the substrate S.

The mounting inspection apparatus 15 that has received the mounting inspection processing command output in step S130 executes the mounting inspection processing. FIG. 10 is a flowchart showing an example of a mounting inspection processing routine executed by the CPU 50a of the mounting inspection device 15. This routine is stored in the HDD 51. When this routine is started, the CPU 50a acquires the mounting inspection condition information 51a from the management computer 80 (step S500), executes the transporting and fixing process of the substrate S (step S505), and performs imaging processing of the inspection range (step S510). ). Next, the CPU 50a sets an inspection position (component position) (step S515). For example, the setting of the component positions is performed by reading out a predetermined order of the component positions included in the mounting inspection condition information 51a. Next, the CPU 50a acquires a component measurement value by performing image processing on the captured image, and stores the acquired component measurement value in the mounting measurement value information 51b of the HDD 51 (step S520). It is assumed that the CPU 50a acquires, as the component measurement values, the positional deviation amount of the component P with respect to the substrate S, the positional deviation amount of the component P with respect to the solder, the rotation angle of the component P, and the like. Next, the CPU 50a acquires a solder measurement value corresponding to this component position (specific position) from the print inspection apparatus 13 (step S525). The acquired solder measurement value is, for example, a measurement value of solder volume. Subsequently, the CPU 50a acquires a mounting criterion corresponding to the component position (step S530), and determines whether or not the component measurement value is within an error range based on whether or not the component measurement value exceeds the mounting criterion. (Step S535). As will be described later in detail, it is assumed that the mounting criterion is acquired by the management computer 80 (see FIG. 15 to be described later), and the one selected by the acquired solder measurement value is used. In addition, this determination is performed using a measured value of the amount of displacement with respect to the substrate S and a mounting determination criterion. When the component measurement value is in the error range, an abnormality display process is executed (step S540). Here, it is assumed that the CPU 50a displays an error on the display unit of the operation panel. Further, a process of excluding the board S determined as an error from the mounting line may be performed. After step S540 or when the component measurement value is not in the error range in step S535, the CPU 50a determines whether or not the inspection of the current substrate S has been completed (step S545). Execute the process. On the other hand, when the inspection of the current substrate S is completed, the CPU 50a discharges the substrate S that has been inspected (step S550), and determines whether or not the inspection of all the substrates S has been completed (step S555). When the inspection of all the substrates S has not been completed, the CPU 50a executes the processing after step S505, and when the inspection of all the substrates S has been completed, this routine is finished as it is. In this way, the state of the component P arranged on the substrate S is inspected, and the substrate S that is considered to have a problem in the subsequent process is specified.

The reflow control unit 60 of the reflow device 16 that has received the reflow processing command output in step S140 controls the heating unit 64 to heat the inside of the heating chamber 63 to a predetermined temperature at which the solder melts, and the solder is printed. Then, the substrate S on which the component P is arranged is transferred to the heating chamber 63. In the process of passing through the inside of the heating chamber 63, the solder melts as the temperature rises, and the substrate S cools and solidifies as the temperature falls.

The reflow inspection device 17 that has received the reflow inspection process command output in step S150 executes the reflow inspection process. FIG. 11 is a flowchart showing an example of a reflow inspection processing routine executed by the CPU 70a of the reflow inspection device 17. This routine is stored in the HDD 71. When this routine is started, the CPU 70a acquires the inspection condition information 71a from the management computer 80 (step S600), executes the transporting and fixing process of the substrate S (step S605), and performs imaging processing of the inspection range (step S610). . In the imaging process, depending on the size of the substrate S, the whole may be imaged once, or a plurality of areas may be imaged multiple times. Next, the CPU 70a performs image processing for obtaining a difference between pixel values of the image of the substrate S on which the component P is normally mounted and the captured image of the substrate S in a state where the substrate S is overlapped. The image data obtained is taken (step S615). It is determined whether or not there is a mounting abnormality on the substrate S based on whether or not there is an image area based on a missing part of the component P or a deviation outside the allowable range in the difference image data (step S620). Note that if the component P is normally mounted on the imaged substrate S, the difference image data has little variation in pixel values. When it is determined that there is a mounting abnormality on the substrate S, the CPU 70a identifies the component P corresponding to the mounting abnormality based on the component position on the substrate S (step S625), and executes an abnormality display process (step S630). . Here, it is assumed that the CPU 70a displays an error on the display unit of the operation panel. Moreover, you may perform the process which excludes the board | substrate S by which mounting abnormality was determined from the mounting line. Next, the CPU 70a stores information on the component P with the mounting abnormality in the HDD 71 as the inspection result information 71b (step S635). After step S635 or when there is no mounting abnormality on the substrate S in step S620, the CPU 70a determines whether or not the inspection of the current substrate S has been completed (step S640). Execute the process. On the other hand, when the inspection of the current substrate S is completed, the CPU 70a discharges the substrate S that has been inspected (step S645), and determines whether or not the inspection of all the substrates S has been completed (step S650). When the inspection of all the substrates S has not been completed, the CPU 70a executes the processes in and after step S605. When the inspection of all the substrates S has been completed, this routine is finished as it is. As described above, the state of the component P mounted on the substrate S is inspected, the substrate S in which the defect has occurred is specified, and the position of the component in which the defect has occurred and the information on the component are stored in the HDD 71 as the inspection result information 71b. is there.

Subsequently, the correspondence information generation condition setting process in step S160 of the main routine of FIG. 6 will be described. FIG. 12 is a flowchart illustrating an example of a correspondence information generation condition setting processing routine executed by the CPU 82 of the management computer 80. This routine is stored in the HDD 85. In this routine, a correspondence relationship such as a solder measurement value at each component position, a component measurement value, and a defect rate at the corresponding component position is acquired, and a mounting determination criterion used by the mounting inspection apparatus 15 is set based on this correspondence relationship. Process.

When this routine is started, the CPU 82 determines whether or not the number of substrates after the reflow process is equal to or greater than a predetermined number (step S700). This “predetermined number” can be determined empirically, for example, to a number (for example, 100 sheets or 500 sheets) at which the inspection result of the reflow inspection process becomes a sufficiently reliable value. The count of the number of substrates after the reflow process is reset when an affirmative determination is made in step S700. When the number of substrates after the reflow process is not equal to or greater than a predetermined number, the CPU 82 stands by as it is. That is, the CPU 82 waits until the inspection result of the reflow inspection process becomes a sufficiently reliable value. On the other hand, when the number of substrates after the reflow processing is equal to or larger than a predetermined number, the CPU 82 acquires the print measurement value information 31b including the solder measurement values from the print inspection apparatus 13 (step S705), and obtains the component measurement values. The mounting measurement value information 51b including it is acquired from the mounting inspection apparatus 15 (step S710), and the inspection result information 71b including the information of the inspection result is acquired from the reflow inspection apparatus 17 (step S715). FIG. 13 is an explanatory diagram of an example of the result information 85a. The result information 85a is information acquired in steps S705 to S715, and is information in which the solder measurement value, the component measurement value, and the inspection result in the reflow inspection process are associated with each component position, and this is summarized for each board. It is.

After step S715, the CPU 82 uses the result information 85a to determine a predetermined range of the solder measurement value, a predetermined range of the component measurement value, a defect rate included in the predetermined range of the solder measurement value and the predetermined range of the component measurement value, Is generated for a plurality of predetermined ranges (step S720). FIG. 14 is an explanatory diagram of an example of the defect rate matrix 85b. This defect rate matrix 85b shows the predetermined range of the solder volume ratio when the appropriate value is 100%, the predetermined range of the positional deviation amount of the component P with respect to the solder, and the number of mounting abnormal components included in this range. This is information in which the defect rate obtained by dividing by the total number of parts included in the range and multiplying by 100 is correlated. Here, it is assumed that a defect rate matrix 85b in which the solder measurement value, the component measurement value, and the defect rate at a specific component position are associated is generated for each specific component position. Here, the generation process of the defect rate matrix 85b will be described. First, the CPU 82 sets a part position for generating the defect rate matrix 85b. The setting of the component position is performed based on a preset order. Next, the CPU 82 uses the data of the result information 85a to determine the number of mounting abnormality components included in the predetermined range of the solder measurement value and the predetermined range of the component measurement value at the set component position, and the total number of components included in the predetermined range. Count. Subsequently, based on the count result, the CPU 82 obtains the defect rate of the parts included in the predetermined range, and associates the predetermined range of the solder measurement value with the predetermined range of the component measurement value and the defect rate. The CPU 82 performs this process on all the predetermined ranges of the solder measurement value and the component measurement value, and generates a defect rate matrix 85b at the current component position (see FIG. 14). Further, the CPU 82 performs the above processing on all the component positions of the substrate S, and generates a defect rate matrix 85b for all the component positions. In the defect rate matrix 85b, the predetermined range of the solder volume ratio is set every 20%, for example, 70% to 90%, 90% to 110%, 110% to 130%, and the like. Further, the predetermined range of the positional deviation amount is set every 50 μm, for example, 0 to 50 μm, 50 to 100 μm, 100 to 150 μm, and the like. In the defect rate matrix 85b shown in FIG. 14, for example, at a specific (arbitrary) part position, when the print inspection result is 25% less than the appropriate value and the solder volume ratio is 75%, the amount of misalignment of the part P It can be seen that a mounting abnormal state occurs after reflowing with a high probability of 13% or more unless it is arranged at 50 μm or less. Further, in the defect rate matrix 85b, when the print inspection result includes an appropriate value and the solder volume is 90% or more and less than 110%, the defect rate is 0.8% even when the positional deviation amount of the component P is close to 150 μm. It can be seen that the mounting abnormal state is reached after reflowing only with a low probability. If this defect rate matrix 85b is used, for example, if a user specifies a limit value (allowable value) of an acceptable defect rate, the CPU 82 uses the mounting determination standard for the amount of positional deviation of the component P according to the solder volume. A value that satisfies this allowable value can be set (see FIG. 15 described later). Alternatively, the CPU 82 can set the solder volume printing determination standard to a value that satisfies this allowable value in accordance with the positional deviation amount of the component P.

Next, the CPU 82 performs a process of setting a print determination standard for each specific component position (step S725). Here, it is assumed that the print determination criterion is set to a predetermined value. Next, the CPU 82 performs a process of setting a mounting determination criterion for each specific component position using the defect rate matrix 85b (step S730). FIG. 15 is an explanatory diagram of an example of the mounting determination reference 85d. It is assumed that the CPU 82 sets a mounting determination criterion that satisfies a limit value (allowable value) of an acceptable defect rate determined by the user for each specific component position. In addition, the CPU 82 sets the mounting determination criterion for the component measurement value to the upper limit value of the predetermined range of the component measurement value that satisfies this allowable value. In addition, in the defect rate matrix 85b, when it is not possible to set a mounting determination criterion that satisfies the above allowable value, the mounting determination criterion may be set to a predetermined value (initial value). Here, for example, a case where the allowable value is 3% will be described as a specific example. For example, as shown in FIG. 14, when the solder volume ratio is in the range of 70% or more and less than 90%, the positional deviation amount of the component that satisfies the defect rate of 3% or less (allowable value) is in the range of 0 to 50 μm. For this reason, the CPU 82 sets the mounting determination standard in the range where the solder volume ratio is 70% or more and less than 90% to 50 μm. Similarly, when the solder volume ratio is in the range of 90% or more and less than 110%, assuming that the amount of positional deviation of components satisfying the defect rate of 3% or less (allowable value) is in the range of 0 μm or more and less than 250 μm, the CPU 82 The mounting criterion in the range where the ratio is 90% or more and less than 110% is set to 250 μm. Similarly, when the solder volume ratio is in the range of 110% or more and less than 130%, the amount of misalignment of components satisfying the defect rate of 3% or less (allowable value) is in the range of 0 μm or more and less than 100 μm. The reference is set to 100 μm (see FIG. 15). In this way, the mounting determination reference value corresponding to each of the predetermined ranges of the solder measurement values is set.

Next, the CPU 82 outputs the set print determination standard 85c to the print inspection apparatus 13, and outputs the set mount determination standard 85d to the mount inspection apparatus 15 (step S735). The output of the print determination standard 85c and the mounting determination standard 85d may be performed based on a request from the print inspection apparatus 13 or the mounting inspection apparatus 15. The print inspection apparatus 13 executes the print inspection process using the acquired print determination reference 85c. Further, the mounting inspection device 15 executes the mounting inspection process using the acquired mounting determination reference 85d. Here, the mounting inspection process of the mounting inspection apparatus 15 will be described in detail. The CPU 50a of the mounting inspection apparatus 15 performs the processing of steps S500 to S520 of the mounting inspection routine of FIG. 10, and then acquires the solder measurement value of the component position to be inspected in step S515, and in step S530, The set mounting criterion 85d is acquired. Next, the CPU 50a selects a predetermined range of the mounting determination standard 85d including the acquired solder measurement value (here, solder volume ratio), and selects a mounting determination standard associated with the predetermined range of the solder measurement value. To do. Specifically, when the solder measurement value at this component position is 120% in terms of the solder volume ratio, the CPU 50a sets the mounting determination criterion for the positional deviation amount to 100 μm (see FIG. 15). Subsequently, the CPU 50a performs the process of step S530 for determining whether or not the component measurement value acquired in step S520 is within the error range based on whether or not the selected mounting determination criterion is exceeded. In this way, in the board S that is currently inspected for mounting, a more appropriate determination criterion is set by using the solder measurement value of the component position to be inspected for mounting and the mounting criterion determined based on the defect rate matrix 85b. It can be done.

After step S735, the CPU 82 performs processing for setting the print execution condition and the mounting execution condition for each specific component position (step S740). First, the change of the print execution condition will be described. For example, if it is estimated that the amount of component misalignment exceeds 100 μm under the current mounting execution conditions, assuming that the defect rate is 3%, the defect rate is the allowable value in the defect rate matrix 85b (FIG. 14). In order to satisfy the requirement, the solder volume needs to be 90 to 110%. In this case, the CPU 82 may change the print execution condition so as to reduce the moving speed of the squeegee 29 at the corresponding part position in order to stabilize the solder volume, or the pressing force of the squeegee 29 at the corresponding part position. The print execution condition may be changed so as to increase the value. On the other hand, if it is estimated that the amount of component misalignment will be less than 50 μm under the current mounting execution conditions, the defect rate matrix 85b ( In FIG. 14), the defect rate satisfies the allowable value. In this case, the CPU 82 may change the print execution condition so as to increase the moving speed of the squeegee 29 at the relevant part position, or the print execution condition so as to reduce the pressing force of the squeegee 29 at the relevant part position. May be changed. When changing the printing execution condition, in changing the moving speed of the squeegee 29 at the corresponding part position, for example, the CPU 82 sets a plurality of moving speed stages and changes the moving speed by one stage. Also good. Alternatively, in changing the moving speed of the squeegee 29, the CPU 82 may add or subtract a predetermined moving speed from the current moving speed.

Next, the change of implementation execution conditions will be explained. As the mounting execution condition, for example, one or more of the moving speed of the mounting head 47, the acceleration of the mounting head 47, the vertical speed of the suction nozzle 49, the vertical acceleration of the suction nozzle 49, and the suction force of the suction nozzle 49 are changed. Also good. Specifically, when the solder volume ratio of the acquired solder measurement value is 70 to 90%, assuming that the defect rate 3% is an allowable value, the position of the component is required to satisfy the allowable value in the defect rate matrix 85b. The amount of deviation needs to be less than 50 μm. In this case, the CPU 82 may change the mounting execution condition so as to reduce the moving speed of the component P to the corresponding component position in order to reduce the displacement amount of the component, or the component to the corresponding component position. The mounting execution condition may be changed to increase the P adsorption force. In this way, it is possible to further stabilize the mounting process of the component P. On the other hand, when the solder volume ratio of the acquired solder measurement value is 90 to 110%, assuming that the defective rate is 3%, the defective rate satisfies the allowable value even if the positional deviation amount of the component is 150 μm in the defective rate matrix 85b. . In this case, the CPU 82 may change the mounting execution condition so as to increase the moving speed of the component P to the corresponding component position, or the mounting execution may be performed so as to reduce the adsorption force of the component P at the corresponding component position. Conditions may be changed. In changing the moving speed of the mounting head 47, for example, a plurality of moving speed stages may be set, and the CPU 82 may change this moving speed by one stage. Alternatively, the CPU 82 may change the predetermined movement speed from the current movement speed. In changing the suction force of the suction nozzle 49, for example, a plurality of suction force stages may be set, and the CPU 82 may change the suction force by one stage. Alternatively, the CPU 82 may change the suction force of the suction nozzle 49 by adding or subtracting a predetermined suction force to the current suction force. The CPU 82 stores in the HDD 85 printing condition information including the set printing execution condition and mounting condition information including the set mounting execution condition. Subsequently, the CPU 82 outputs the set printing condition information to the printing apparatus 12, and outputs the set mounting condition information to the mounting processing apparatus 14 (step S745). Note that the printing condition information and the mounting condition information may be output based on a request from the printing apparatus 12 or the mounting processing apparatus 14.

Then, the CPU 82 determines whether or not the production is completed based on whether or not the scheduled reflow processing of all the substrates S is completed (step S750). When the production is not completed, the CPU 82 executes the processes after step S700. That is, in step S700, the CPU 82 determines whether or not the number of substrates after the reflow processing has newly increased to a predetermined number or more, and when the measured value and the defect rate are accumulated more than the predetermined number, as described above. Then, the defect rate matrix 85b is generated (updated), and the printing determination reference 85c, the mounting determination reference 85d, the printing condition information, the mounting condition information, and the like are updated. On the other hand, when the production is completed in step S750, this routine is finished as it is. As described above, the correspondence determination information is used to change the print determination reference 85c, the mounting determination reference 85d, the printing condition information, the mounting condition information, and the like to more appropriate values.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The inspection data acquisition unit 90 of this embodiment corresponds to the information acquisition unit of the present invention, the correspondence generation unit 91 corresponds to the information generation unit, the condition setting unit 93 corresponds to the reference setting unit and the condition setting unit, and management The computer 80 corresponds to the information control device. In the present embodiment, an example of the information control method of the present invention is also clarified by describing the operation of the mounting system 10.

According to the management computer 80 of the first embodiment described above, the measurement information (solder measurement value) of the print inspection process, the measurement information (component measurement value) of the mounting inspection process, and the result information (inspection result) of the reflow inspection process ) And a defect rate matrix 85b (correspondence information) in which the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process are associated with each other. Next, the management computer 80 sets a mounting determination criterion for mounting inspection processing based on the generated correspondence information. Then, the mounting inspection apparatus 15 performs a mounting inspection process using the set mounting determination standard. The processing executed by the mounting system includes, for example, a printing process for printing solder on the board S, a mounting process for placing the component P on the board S printed with solder, and a reflow process for reflowing solder. For example, even if the solder formation position is shifted and the placement position of the component P is shifted, the solder heated during the reflow process may move and the component P may be in a normal position. As described above, the state of the solder and the arrangement state of the component P may be related to the final state after the reflow. The management computer 80 generates correspondence information in which the measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process are associated with each other, and the determination criterion is set based on the correspondence information. For this reason, the management computer 80 can set more appropriate determination criteria using the measurement information of the processes related to each other, and as a result, the work of checking the substrate S of the worker performed by stopping the line, etc. Can be further suppressed. Therefore, the mounting system 10 can further increase the processing efficiency.

The management computer 80 also determines a predetermined range of the solder measurement value, a predetermined range of the component measurement value, a defect rate of the component P included in the predetermined range of the solder measurement value and the predetermined range of the component measurement value (statistic value of the pass / fail result). ) Are associated with a plurality of predetermined ranges. For this reason, the management computer 80 can further improve the processing efficiency by using the predetermined range of measurement values and the defect rate. Furthermore, since the management computer 80 sets a mounting determination standard that satisfies the predetermined allowable value of the defect rate, the processing efficiency of the mounting system 10 can be further increased within the predetermined allowable value range. Furthermore, since the management computer 80 generates the defect rate matrix 85b in which the solder measurement values, the component measurement values, and the quality results after reflow are associated with a plurality of specific positions, the management computer 80 is more appropriate for each specific position. It is possible to set various mounting criteria.

In addition, since the management computer 80 generates the defect rate matrix 85b after executing the reflow processing of the predetermined number of substrates S, it is possible to set a determination criterion with higher reliability, and more reliably process the mounting system. Efficiency can be increased. Furthermore, since the management computer 80 sets the printing execution condition of the printing process and the mounting execution condition of the mounting process based on the defect rate matrix 85b, it is possible to set a more appropriate execution condition, and thus stop the line. Thus, it is possible to further suppress the confirmation work of the worker. Therefore, the processing efficiency of the mounting system can be further increased. Furthermore, since the management computer 80 uses the defect rate matrix 85b in which one type of solder measurement value and one type of component measurement value are associated with the defect rate, the correspondence computer generates the correspondence information by a relatively simple process. Can do.

Generally, in the mounting system, the print inspection standard and the mounting standard are set to stricter values in the print inspection device 13 and the mounting inspection device 15 so that the mounting abnormality does not occur after reflow. However, for example, even if the printing position of the solder is shifted or the arrangement position of the component is shifted, the heated solder may be moved during the reflow process and the component may be in a normal position. Here, the print determination standard and the mounting determination standard can be set to more gradual values using the correspondence relationship between the measurement value of the print inspection apparatus 13, the measurement value of the mounting inspection apparatus 15, and the defect rate.

(Second Embodiment)
Next, a second embodiment for carrying out the present invention will be described. In the second embodiment, the print determination standard and the mounting determination standard are set using the deviation of the measurement data of the print inspection process, the deviation of the measurement data of the mounting inspection process, and the defect rate matrix 85b at each component position. The aspect to perform is mainly demonstrated. In the second embodiment, the configuration of the mounting system 10 is the same as that of the first embodiment, and only the processing contents of the management computer 80 are different. Therefore, the same configuration and processing as those of the first embodiment described above. The same reference numerals and step numbers are assigned to the contents, and a specific description thereof is omitted.

The CPU 82 of the management computer 80 executes a correspondence information generation condition setting processing routine shown in FIG. When this routine is started, the CPU 82 executes the processes of steps S700 to S720. That is, after waiting until the inspection result of the reflow inspection process has a sufficiently reliable value, the defect rate matrix 85b is generated. Next, using the result information 85a, the CPU 82 obtains the average value and standard deviation of the solder measurement values at the specific part position and the average value and standard deviation of the component measurement values, and associates them with statistical correspondence information 85e. Is generated. FIG. 16 is an explanatory diagram of an example of the statistical correspondence information 85e. As shown in FIG. 16, the statistical correspondence information 85e includes the component position (coordinates), the component type, the solder height as the solder measurement value, the solder area, the solder volume and the displacement amount, and the position with respect to the substrate as the component measurement value. This is information in which an average value and a standard deviation such as a deviation amount, a positional deviation amount with respect to solder, and a rotation angle are associated with each component position. In the statistical correspondence information 85e, the solder tends to be printed properly at a specific component position, or the mounting state tends to be small at a specific position with a small amount of displacement of the component P. It is possible to grasp the tendency of the state of solder and the positional deviation of parts.

Subsequently, in step S725, the CPU 82 performs a process of setting the print determination reference 85c for each specific component position using the defect rate matrix 85b and the statistical correspondence information 85e. For example, based on the statistical correspondence information 85e, the CPU 82 can change the print determination criterion for the solder volume to a loose value when the amount of component displacement is small at a specific component position. Specifically, in the statistical correspondence information 85e, if 99.7% of the data exists in the range of the average value ± 3σ (standard deviation), the average value of the amount of positional deviation of the parts is 5 μm, and 3σ is 40 μm, The amount of deviation is expected to be 45 μm. At this time, when the defective rate 3% is set as an allowable value, the CPU 82 refers to the defective rate matrix 85b (FIG. 14), and the component misalignment amount is less than 50 μm, for example, the solder volume ratio is 70% or more. The print criterion 85c can be set within a range of less than 130%. On the other hand, the CPU 82 can change the print determination criterion for the solder volume to a strict value when the displacement amount of the component is large and the defect rate is large at a specific component position. Specifically, if it is predicted from the average value and standard deviation of the statistical correspondence information 85e that the amount of positional deviation of the component is 120 μm, the CPU 82 determines that the defective rate 3% is an allowable value, and the CPU 82 determines the defective rate matrix 85b (FIG. 14). ), It is possible to set the print determination standard 85c in the range where the solder volume ratio is 90% or more and less than 110% corresponding to the range where the amount of positional deviation of the component is less than 150 μm.

Subsequently, in step S730, the CPU 82 performs a process of setting the mounting determination reference 85d for each specific component position using the defect rate matrix 85b and the statistical correspondence information 85e. The CPU 82 continues to perform good solder printing at a specific component position. For example, when the solder volume ratio is stable near 100%, the mounting determination criterion for the positional deviation amount is set to a loose value. Can be changed. Specifically, in the same manner as described above, when the defect rate 3% is an allowable value and the solder volume ratio is predicted to be less than 110% from the average value and standard deviation of the statistical correspondence information 85e, the CPU 82 With reference to 85b (FIG. 14), it is possible to set a mounting determination reference 85d corresponding to a range in which the solder volume ratio is 90% or more and less than 110% and whose component displacement is less than 150 μm. On the other hand, when the solder printing is unstable at a specific component position, for example, when the solder volume ratio is 70% or less or exceeds 130%, the CPU 82 changes the mounting judgment standard of the positional deviation amount to a strict value. Can do. Specifically, when the defective rate 3% is an allowable value and the solder volume ratio is predicted to be 120% from the average value and standard deviation of the statistical correspondence information 85e, the CPU 82 uses the defective rate matrix 85b (FIG. 14). With reference to this, it is possible to set the mounting determination standard 85d corresponding to a range in which the solder volume ratio is 70% or more and less than 130% and the component displacement amount is less than 50 μm. Alternatively, when the defective rate is low regardless of the solder printing state at the specific component position, the CPU 82 can change the printing determination criterion for the solder volume to a loose value. Further, when the defect rate is low regardless of the amount of misalignment at a specific component position, the CPU 82 can change the mounting criterion for the misalignment amount to a loose value. As described above, when changing the print determination criterion or the mounting determination criterion, the CPU 82 uses the defect rate matrix 85b or the statistical correspondence information 85e to satisfy the print determination criterion 85c or the mounting determination so as to satisfy the allowable value of the defect rate. The reference 85d is set.

Then, the processing of steps S735 to S750 is performed, and this routine is finished. The print inspection apparatus 13 that has acquired the print determination reference 85c executes print inspection processing for each component position using the print determination reference 85c. Moreover, the mounting inspection apparatus 15 which acquired the mounting determination reference | standard 85d performs the mounting inspection process of each component position using this mounting determination reference | standard 85d.

According to the management computer 80 of the second embodiment described above, the measurement information (solder measurement value) of the print inspection process, the measurement information (component measurement value) of the mounting inspection process, and the result information (inspection result) of the reflow inspection process ), And a defect rate matrix 85b and statistical correspondence information 85e (corresponding relationship information) in which the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process are associated with each other. Generate. Next, the management computer 80 sets a printing determination standard for the print inspection process and a mounting determination standard for the mounting inspection process based on the generated correspondence information. Therefore, the management computer 80 can set more appropriate determination criteria by using the measurement information of the processes related to each other. As a result, the operator can confirm the substrate S by stopping the line. It can be suppressed more. Therefore, the mounting system 10 can further increase the processing efficiency.

Further, the management computer 80 uses the statistical correspondence information 85e to set the mounting determination reference 85d using the defect rate matrix 85b when the solder printing state is stable, and the placement state of the component P is stabilized. Since the print determination standard 85c is set using the defect rate matrix 85b when the printer is in the middle, the more appropriate print determination standard 85c and mounting determination standard 85d can be set.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the CPU 82 generates the defect rate matrix 85b corresponding to a specific component position. However, the present invention is not particularly limited thereto. For example, the same component P is spread over a plurality of locations at different component positions. In the case of arrangement, a defect rate matrix may be generated for each component type. If the parts P have the same size and weight, the defect rate matrix may have the same tendency. In this way, the defect rate matrix 85b can be simplified.

In the above-described embodiment, the CPU 82 sets the mounting determination standard to the upper limit value of the predetermined range of the component measurement values using the defect rate matrix 85b, but is not particularly limited thereto. For example, the CPU 82 may set an intermediate value (75 μm when 50 ≦ n <100 μm in FIG. 14) as a mounting determination reference using the defect rate matrix 85b as a mounting determination criterion. The lower limit value of the predetermined range (50 μm when 50 ≦ n <100 μm in FIG. 14) may be set as the mounting criterion.

In the above-described embodiment, the determination criteria (print determination criteria 85c and mounting determination criteria 85d) of the print inspection device 13 and the mounting inspection device 15 are set, and the execution conditions (print condition information 21a) of the printing device 12 and the mounting processing device 14 are set. However, only one of them may be set, and other settings may be omitted. Specifically, the management computer 80 may set one or more determination criteria (print determination criteria 85c and mounting determination criteria 85d) of the print inspection device 13 and the mounting inspection device 15 based on the defect rate matrix 85b. . Alternatively, the mounting system may set one or more execution conditions (printing condition information 21a and mounting condition information 41a) of the printing device 12 and the mounting processing device 14 based on the defect rate matrix 85b. Even in this case, the mounting system can further increase the processing efficiency by using the correspondence information.

In the embodiment described above, the defect rate matrix 85b is correspondence information in which the solder volume as the solder measurement value, the positional deviation amount as the component measurement value, and the defect rate are associated with each other, but is not particularly limited thereto. . For example, the correspondence relationship information may be obtained by associating one or more types of solder measurement values, one or more types of component measurement values, and an inspection result after reflow. In this way, more detailed correspondence information can be generated. The solder measurement value may include one or more of the solder height, the solder area, the solder volume (amount), and the solder position. In addition, the component measurement value may include one or more of a component displacement amount with respect to the substrate, a component displacement amount with respect to the printed solder, and a component rotation angle. In addition, the component measurement value may include the area of the component P that contacts the printed solder.

In the above-described embodiment, the management computer 80 transmits the print determination reference 85c, the mounting determination reference 85d, the print condition information 21a, and the mount condition information 41a via the LAN 18 to the printing device 12, the print inspection device 13, the mounting processing device 14, and the like. Although output to the mounting inspection apparatus 15 is not particularly limited, the work instruction may be displayed on the display 88 of the management computer 80.

In the embodiment described above, the management computer 80 waits until the inspection result of the reflow inspection process becomes a sufficiently reliable value in step S700. However, for example, an appropriate defect rate matrix 85b is obtained by an experiment or the like. If it is to be generated, this processing may be omitted.

In the embodiment described above, the defect rate matrix 85b in which the measurement value of the print inspection process, the measurement value of the mounting inspection process, and the result information of the reflow inspection process are generated for each specific component position is generated. However, it is not particularly limited to this. For example, a defect rate matrix in which the measurement values of the print inspection process for the entire substrate S, the measurement values of the mounting inspection process, and the result information of the reflow inspection process are associated with each other may be generated. Even in this way, it is possible to grasp the tendency of the printed state, the mounted state, etc. in the entire substrate S, and as a result, the processing efficiency of the mounting system can be further improved.

In the above-described embodiment, the management computer 80 includes the information control device of the present invention. However, the present invention is not limited to this, and the printing device 12, the print inspection device 13, the mounting processing device 14, the mounting inspection device 15, and reflow. Any one of the device 16 and the reflow inspection device 17 may have the function of the information control device of the present invention. Or a mounting system is good also as what equips one or more of the said apparatuses with the function of the information control apparatus of this invention, and is provided.

In the above-described embodiment, it has been described that the defect rate matrix 85b is updated every time the number of substrates subjected to reflow processing reaches a predetermined number in the correspondence information generation condition setting processing routine. You may change the number. For example, the CPU 82 may reduce or increase the predetermined number for the second and subsequent times with respect to the predetermined number for the first time. Further, the CPU 82 may generate the defect rate matrix 85b only once.

In the above-described embodiment, it is assumed that the management computer 80 outputs an execution command to the printing device 12, the print inspection device 13, the mounting processing device 14, the mounting inspection device 15, the reflow device 16, and the reflow inspection device 17 in the main routine. However, the present invention is not particularly limited to this, and each device may perform processing.

In the above-described embodiment, the management computer 80 provided with the function of the information control apparatus of the present invention has been described.

The present invention can be used in the technical field of mounting processing in which components are placed on solder printed on a substrate and then the solder is reflowed.

10 mounting system, 12 printing device, 13 printing inspection device, 14 mounting processing device, 15 mounting inspection device, 16 reflow device, 17 reflow inspection device, 18 LAN, 20 controller, 20a CPU, 20b ROM, 20c RAM, 21 HDD, 21a printing condition information, 22 communication unit, 23 imaging unit, 24 substrate processing unit, 25 mask unit, 26 print processing unit, 27 print head, 28 head moving unit, 29 squeegee, 30 controller, 30a CPU, 30b ROM, 30c RAM , 31 HDD, 31a printing inspection condition information, 31b printing measurement value information, 32 communication unit, 34 inspection processing unit, 35 imaging unit, 36 moving unit, 40 controller, 40a CPU, 40b ROM, 40c RAM, 41 HDD, 41a mounting condition information, 42 communication unit, 43 imaging unit, 44 substrate processing unit, 45 supply unit, 46 mounting processing unit, 47 mounting head, 48 head moving unit, 49 suction nozzle, 50 controller, 50a CPU 50b ROM, 50c RAM, 51 HDD, 51a mounting inspection condition information, 51b mounting measurement value information, 52 communication unit, 54 inspection processing unit, 55 imaging unit, 56 moving unit, 60 reflow control unit, 62 communication unit, 63 heating Room, 64 heating unit, 70 controller, 70a CPU, 70b ROM, 70c RAM, 71 HDD, 71a inspection condition information, 71b inspection result information, 72 communication unit, 74 inspection processing unit, 75 imaging unit, 76 moving unit, 80 management Con Computer, 82 CPU, 83 ROM, 84 RAM, 85 HDD, 85a result information, 85b defect rate matrix, 85c printing judgment standard, 85d mounting judgment standard, 85e statistical correspondence information, 86 communication unit, 87 input device, 88 display, 90 Inspection data acquisition unit, 91 correspondence generation unit, 92 correspondence relationship holding unit, 93 condition setting unit, 94 condition command unit, M screen mask, P component, S substrate.

Claims

A printing apparatus that executes a printing process for printing solder on a substrate, a printing inspection apparatus that executes a printing inspection process for inspecting the state of the printed solder, and a mounting process for mounting components on the board A mounting processing apparatus, a mounting inspection apparatus for executing a mounting inspection process for inspecting a mounting state of the component subjected to the mounting process, a reflow apparatus for executing a reflow process for the board, and a reflow inspection for inspecting the board after the reflow. An information control device of a mounting system comprising a reflow inspection device for executing processing,
Information acquisition means for acquiring measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process;
Information generating means for generating correspondence information in which the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process are associated;
Reference setting means for setting at least one of a print determination standard of the print inspection process and a mounting determination standard of the mounting inspection process based on the generated correspondence information;
An information control device comprising:
The information generation means includes at least one type of solder measurement value as measurement information of the print inspection process, at least one type of component measurement value as measurement information of the mounting inspection process, and the component as result information of the reflow inspection process. Generating the correspondence relationship information that correlates with the pass / fail result determined by pass / fail after the reflow,
The solder measurement value includes one or more of a solder height, a solder area, a solder volume, and a solder position,
2. The information control according to claim 1, wherein the component measurement value includes at least one of a displacement amount of the component with respect to the substrate, a displacement amount of the component with respect to the printed solder, and a rotation angle of the component. apparatus.
The information generation means includes the predetermined range of the solder measurement value, the predetermined range of the component measurement value, the predetermined result range of the solder measurement value, and the pass / fail result of one or more parts included in the predetermined range of the component measurement value. The information control apparatus according to claim 2, wherein the correspondence relationship information in which a statistical value is associated with a plurality of the predetermined ranges is generated.
The reference setting means sets the print determination criterion and / or the mounting determination criterion in which the statistical value of the pass / fail result satisfies a predetermined pass / fail value according to the range of the solder measurement value and the range of the component measurement value. The information control apparatus according to claim 2 or 3.
The information generation means sets the upper limit value of the solder measurement value range in which the statistical value of the pass / fail result satisfies a predetermined pass / fail value as the print criterion, and the statistical value of the pass / fail result satisfies a predetermined pass / fail value The information control apparatus according to claim 4, wherein an upper limit value of the component measurement value range is set as the mounting determination reference.
The information generation means includes a solder measurement value that is a state of the solder at a specific position where the component is arranged as measurement information of the print inspection process, and a state of the component at the specific position as measurement information of the mounting inspection process. The correspondence information is generated by associating the component measurement value indicating the quality and the quality result after the reflow of the component at the specific position as the result information of the reflow inspection process with the plurality of specific positions. The information control apparatus according to any one of claims 1 to 5.
The information control apparatus according to claim 6, wherein the reference setting unit sets the print determination criterion and / or the mounting determination criterion for each specific position based on the correspondence information.
8. The information control apparatus according to claim 1, wherein the information generation unit generates the correspondence information after executing a reflow process for a predetermined number of substrates.
The information control device according to any one of claims 1 to 8,
An information control apparatus comprising: condition setting means for setting at least one of a print execution condition for the print process and a mounting execution condition for the mounting process based on the generated correspondence information.
The condition setting means sets at least one of a printing speed and a printing pressure as the printing execution condition, and sets at least one of a holding force of the component and a moving speed of the component as the mounting execution condition. Item 10. The information control device according to Item 9.
The information generation means includes a solder measurement value that is a state of the solder at a specific position where the component is arranged as measurement information of the print inspection process, and a state of the component at the specific position as measurement information of the mounting inspection process. The correspondence information is generated by associating the component measurement value indicating the quality and the quality result after the reflow of the component at the specific position as the result information of the reflow inspection process with the specific position. ,
The information control apparatus according to claim 10, wherein the condition setting unit sets the print execution condition and / or the mounting execution condition for each specific position based on the correspondence information.
A printing apparatus that executes a printing process for printing solder on a substrate;
A print inspection apparatus for executing a print inspection process for inspecting the state of the printed solder;
A mounting processing apparatus for executing a mounting process for mounting a component on the board;
A mounting inspection apparatus for executing a mounting inspection process for inspecting a mounting state of the component subjected to the mounting process;
A reflow apparatus for performing reflow processing of the substrate;
A reflow inspection apparatus for executing a reflow inspection process for inspecting the substrate after the reflow;
An information control device according to any one of claims 1 to 11,
The print inspection apparatus performs the print inspection process using the set print determination criterion,
The mounting inspection apparatus performs the mounting inspection processing using the set mounting determination criterion.
A printing apparatus that executes a printing process for printing solder on a substrate, a printing inspection apparatus that executes a printing inspection process for inspecting the state of the printed solder, and a mounting process for mounting components on the board A mounting processing apparatus, a mounting inspection apparatus for executing a mounting inspection process for inspecting a mounting state of the component subjected to the mounting process, a reflow apparatus for executing a reflow process for the board, and a reflow inspection for inspecting the board after the reflow. An information control method for a mounting system comprising a reflow inspection device for executing processing,
(A) obtaining measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process;
(B) generating correspondence information associating the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process;
(C) setting at least one of a print determination standard for the print inspection process and a mounting determination standard for the mounting inspection process based on the generated correspondence information;
Including an information control method.
A printing apparatus that executes a printing process for printing solder on a substrate, a printing inspection apparatus that executes a printing inspection process for inspecting the state of the printed solder, and a mounting process for mounting components on the board A mounting processing apparatus, a mounting inspection apparatus for executing a mounting inspection process for inspecting a mounting state of the component subjected to the mounting process, a reflow apparatus for executing a reflow process for the board, and a reflow inspection for inspecting the board after the reflow. An information control device of a mounting system comprising a reflow inspection device for executing processing,
Information acquisition means for acquiring measurement information of the print inspection process, measurement information of the mounting inspection process, and result information of the reflow inspection process;
Information generating means for generating correspondence information in which the acquired measurement information of the print inspection process, the measurement information of the mounting inspection process, and the result information of the reflow inspection process are associated;
Condition setting means for setting at least one of a print execution condition of the print process and a mounting execution condition of the mounting process based on the generated correspondence information;
An information control device comprising: