WO2015021640A1 - 电路板结构及具有该电路板结构的电源模块 - Google Patents

电路板结构及具有该电路板结构的电源模块 Download PDF

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WO2015021640A1
WO2015021640A1 PCT/CN2013/081573 CN2013081573W WO2015021640A1 WO 2015021640 A1 WO2015021640 A1 WO 2015021640A1 CN 2013081573 W CN2013081573 W CN 2013081573W WO 2015021640 A1 WO2015021640 A1 WO 2015021640A1
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circuit board
rigid
flexible circuit
flexible
rigid circuit
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PCT/CN2013/081573
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English (en)
French (fr)
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薛信燊
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深圳市众明半导体照明有限公司
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Priority to PCT/CN2013/081573 priority Critical patent/WO2015021640A1/zh
Publication of WO2015021640A1 publication Critical patent/WO2015021640A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component

Definitions

  • the present invention relates to a circuit board structure, and more particularly to a circuit board structure composed of a rigid circuit board and a flexible circuit board, and a power module having the same.
  • LED lighting products have the advantages of low energy consumption, long life, energy saving and environmental protection, and are gradually adopted.
  • most of the current LED lighting products are built into the lamp body.
  • the current lamp power supply is installed at the bottom of the lamp holder, and the volume is large, which affects the light-emitting surface of the lamp, and the light-emitting surface of the product is too small.
  • Another example The power supply of the LED tube is placed at both ends of the tube. Due to the large size of the power module, the overall volume of the product is not too large, and it is impossible to achieve a large luminous surface like the conventional lamp. Due to the large volume of the power supply, the overall light-emitting effect of the LED light source after being installed in the interior of the lamp has a large deficiency compared with the traditional fluorescent lamp, which affects its promotion and use in the market.
  • the technical problem to be solved by the present invention is to provide a small-sized, compact circuit board structure and a power supply module having such a circuit board structure in view of the above-described drawbacks of the prior art.
  • the technical solution adopted by the present invention to solve the technical problem thereof is to propose a circuit board structure, including:
  • the flexible circuit board at least partially wraps the rigid circuit board, and one end of the flexible circuit board is electrically connected to the rigid circuit board.
  • the flexible circuit board encases at least two faces of the rigid circuit board.
  • the flexible circuit board covers the left side, the upper side, and the right side of the rigid circuit board to enclose electronic components on the rigid circuit board in the space formed by the hard circuit board.
  • one end of the flexible circuit board is electrically connected to the rigid circuit board through a snap-on connector provided on the rigid circuit board.
  • one end of the flexible circuit board is electrically connected to the rigid circuit board by a pin connection.
  • one end of the flexible circuit board is soldered to the rigid circuit board for electrical connection with the rigid circuit board.
  • the circuit board structure further includes an insulating tape layer disposed between the rigid circuit board and the flexible circuit board and wrapped around the periphery of the rigid circuit board.
  • the flexible circuit board is a single panel or a double panel.
  • the present invention further provides a power module including a housing, and a circuit board structure as described above disposed in the housing.
  • the circuit board structure of the present invention is formed by a flexible circuit board provided with a small volume and a patch electronic component, and a rigid circuit board of a large-sized and plug-in electronic component is disposed and electrically connected through a connector to form a compact whole.
  • the circuit board structure fully and reasonably utilizes the space, which greatly reduces the volume of the circuit board. Therefore, the power module adopting the circuit board structure also achieves the purpose of reducing the volume, and is suitable for the built-in power supply of the LED lighting product.
  • such a circuit board structure is also applicable to various electronic products that are desired to be miniaturized and circuits that cannot achieve partial functions due to volume limitations.
  • FIG. 1 is a schematic structural diagram of a circuit board structure of a power module according to an embodiment of the present invention
  • Figure 2 is a front elevational view of the circuit board structure shown in Figure 1;
  • Figure 3 is a schematic view showing the structure of a connector in one embodiment of the present invention.
  • FIG. 1 shows a schematic structural view of a circuit board structure 10 of a power module of one embodiment of the present invention
  • FIG. 2 shows a front view of the circuit board structure 10.
  • the power module carries the circuit components through the circuit board structure 10 shown in FIG. 1, and packages the circuit board structure 10 through a casing (not shown) to form a separate module for various desired small sizes.
  • the electronic product and the circuit that cannot realize part of the function due to the volume limitation are used, for example, as a built-in power source for the aforementioned LED lighting product.
  • the circuit board structure 10 includes a rigid circuit board 11 and a flexible circuit board 12.
  • the rigid circuit board 11 can be a variety of rigid PCB boards, and some large-volume and plug-in electronic components are disposed thereon, as indicated by reference numeral 111 in the figure.
  • the flexible circuit board (PFC) 12 can be a single panel or a dual panel with some small volume and patch electronic components disposed thereon, as indicated by reference numeral 121 in the figure.
  • the hard circuit board 11 is provided with electronic components such as a transformer, an electrolytic capacitor, an X capacitor, a Y capacitor, an inductor, a polyester capacitor, a MOS transistor, and the like
  • the flexible circuit board 12 is provided with, for example, a chip resistor and a chip capacitor. , SMD diodes, ICs, rectifier bridges and other electronic components.
  • the flexible circuit board 12 wraps the rigid wiring board 11 from the periphery of the rigid circuit board 11. Specifically, the flexible circuit board 12 covers the left side, the upper side, and the right side of the rigid circuit board 11, and the electronic components on the rigid circuit board 11 are wrapped in the space formed therein. Moreover, the flexible circuit board 12 is electrically connected to the rigid circuit board 11 through the connector 13, thereby forming a compact overall circuit board structure, which can utilize the space reasonably and greatly reduce the volume of the circuit board. According to various embodiments of the present invention, the flexible circuit board 12 only needs to partially wrap the rigid circuit board 11, so that a compact circuit board structure can be realized. For example, the flexible circuit board 12 wraps both sides of the rigid circuit board 11 to save Space, shrinking board size.
  • a snap-type connector 13 is disposed on the lower side of the rigid circuit board 11, and one end of the flexible circuit board 12 is bent to the lower side of the rigid circuit board 11 and inserted into the connector 13, Electrical connection of the flexible circuit board 12 to the rigid circuit board 11 is achieved.
  • the snap-on connector 13 is soldered to the rigid circuit board 11 through the pins 131, and the golden finger of the flexible circuit board 12 is inserted into the connector 13 and the pressing piece thereon is fastened to be flexible.
  • the gold fingers of the circuit board 12 are in intimate contact with the internal contacts 132 of the connector 13 to form an electrical connection.
  • the flexible circuit board 12 can be electrically connected to the rigid circuit board 11 in a variety of ways.
  • one end of the flexible circuit board 12 can be electrically connected to the rigid circuit board 11 by a pin connection.
  • one end of the flexible circuit board 12 can be directly soldered to the rigid circuit board 11 and electrically connected to the rigid circuit board 11.
  • an insulating tape layer is further disposed between the rigid circuit board and the flexible circuit board. That is to say, firstly wrap a layer of insulating tape (preferably insulating temperature-resistant tape) on the periphery of the rigid circuit board, expose only the connector for connecting the flexible circuit board, and then wrap the flexible circuit board around the outer layer of the insulating tape layer. Therefore, the purpose of insulating the rigid circuit board from the flexible circuit board can be achieved.
  • insulating tape preferably insulating temperature-resistant tape
  • circuit board structure of the present invention has been described above in connection with the embodiment of the power module, but it is obvious that the circuit board structure of the present invention can also be applied to various other electronic products which are desired to realize miniaturization and various kinds thereof.
  • circuit module In the circuit module.
  • the above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板结构（10）和具有电路板结构的电源模块。电路板结构包括：一硬性电路板（11），硬性电路板上设置大体积及插件电子元器件（111）；一柔性电路板（12），柔性电路板上设置小体积及贴片电子元器件（121）；柔性电路板至少部分地包裹硬性电路板，且柔性电路板的一端与硬性电路板电气连接。电路板结构通过设置小体积及贴片电子元器件的柔性电路板包裹设置大体积及插件电子元器件的硬性电路板来形成一个紧凑型的整体电路板结构，充分的利用空间，缩小了电路板的体积，适用于各种期望小型化的电子产品及因体积限制而无法实现部分功能的电路中。

Description

电路板结构及具有该电路板结构的电源模块 技术领域
本发明涉及电路板结构，尤其涉及一种由硬性电路板和柔性电路板构成的电路板结构以及具有该种电路板结构的电源模块。
背景技术
LED照明产品具有低能耗、寿命长、节能环保的优点，被逐渐采用。但目前LED照明产品多为电源内置于灯体内。例如目前灯泡电源安装于灯座底部，体积较大，影响灯泡的发光面，造成产品发光面过小。又如 LED灯管的电源分置于灯管的两端，由于电源模块体积较大，不仅使得产品整体体积过大，而且无法真正做到与传统灯具一样实现较大的发光面。因电源体积较大导致LED光源在装入灯具内部后整体的发光效果与人体视觉感受与传统的荧光灯具相比存在较大的不足，影响其在市场上的推广和使用。
因而，急需有一种小体积的电源用于LED照明产品。
发明内容
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种小体积、紧凑型的电路板结构以及具有这种电路板结构的电源模块。
本发明解决其技术问题所采用的技术方案是：提出一种电路板结构，包括：
一硬性电路板，所述硬性电路板上设置大体积及插件电子元器件；
一柔性电路板，所述柔性电路板上设置小体积及贴片电子元器件；
所述柔性电路板至少部分地包裹所述硬性电路板，且所述柔性电路板的一端与所述硬性电路板电气连接。
一个实施例中，所述柔性电路板包裹硬性电路板的至少两个面。
一个实施例中，所述柔性电路板覆盖于所述硬性电路板的左侧、上侧和右侧，以将硬性电路板上的电子元器件包裹于其所形成的空间内。
一个实施例中，所述柔性电路板的一端通过设于所述硬性电路板上的搭扣式连接器与所述硬性电路板电气连接。
一个实施例中，所述柔性电路板的一端通过插针连接方式与所述硬性电路板电气连接。
一个实施例中，所述柔性电路板的一端焊接在所述硬性电路板上以与所述硬性电路板电气连接。
一个实施例中，所述电路板结构还包括一绝缘胶布层，所述绝缘胶布层设于所述硬性电路板和柔性电路板之间且包裹于硬性电路板的外围。
一个实施例中，所述柔性电路板为单面板或双面板。
本发明为解决其技术问题还提出一种电源模块，包括壳体，还包括设置在所述壳体内的如上所述的电路板结构。
本发明的电路板结构通过设置小体积及贴片电子元器件的柔性电路板包裹设置大体积及插件电子元器件的硬性电路板并通过连接器实现二者的电气连接，形成一个紧凑型的整体电路板结构，充分合理的利用空间，大大缩小了电路板的体积，因而采用该电路板结构的电源模组也达到减小体积的目的，适用于LED照明产品的内置电源。而且，这种电路板结构也适用于各种期望小型化的电子产品及因体积限制而无法实现部分功能的电路中。
附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是本发明一个实施例的电源模块的电路板结构的结构示意图；
图2是图1所示的电路板结构的正视图；
图3是本发明一个实施例中的连接器的结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
图1示出了本发明一个实施例的电源模块的电路板结构10的结构示意图，图2示出了该电路板结构10的正视图。电源模块通过图1所示的电路板结构10来承载电路元件，并通过壳体（图中未示出）将该电路板结构10进行封装，形成独立的模组，以用于各种期望小型化的电子产品及因体积限制而无法实现部分功能的电路中，例如用作前述的LED照明产品的内置电源。
具体如图1所示，电路板结构10包括一硬性电路板11和一柔性电路板12。其中，硬性电路板11可以是各种硬性PCB板，其上设置一些大体积以及插件电子元器件，如图中标号111所示。柔性电路板（PFC）12可以是单面板或双面板，其上设置一些小体积以及贴片电子元器件，如图中标号121所示。一个具体示例中，硬性电路板11上设置例如变压器、电解电容、X电容、Y电容、电感、聚酯电容、MOS管等电子元器件，柔性电路板12上设置例如贴片电阻、贴片电容、贴片二极管、IC、整流桥等电子元器件。
进一步如图1和图2所示，柔性电路板12从硬性电路板11的外围包裹住硬性线路板11。具体来说，柔性电路板12覆盖于硬性电路板11的左侧、上侧和右侧，将硬性电路板11上的电子元器件包裹于其所形成的空间内。并且，柔性电路板12通过连接器13与硬性电路板11电气连接，从而形成一个紧凑型的整体电路板结构，能够合理利用空间，大大缩小电路板的体积。根据本发明的不同实施例中，柔性电路板12只需要部分包裹硬性电路板11，便能实现紧凑型的电路板结构，例如柔性电路板12包裹硬性电路板11的两个面，便能节省空间，缩小电路板体积。
进一步如图1和图2所示，在硬性电路板11的下侧设置一搭扣式连接器13，柔性电路板12的一端弯折到硬性电路板11的下侧并插入连接器13中，实现柔性电路板12与硬性电路板11的电气连接。具体如图3所示，搭扣式连接器13通过针脚131焊接于硬性电路板11上，将柔性电路板12的金手指插入该连接器13中并扣紧其上的压片便可将柔性电路板12的金手指与连接器13的内部触点132紧密接触形成电气连接。
根据本发明的不同实施例中，柔性电路板12可以通过各种方式实现与硬性电路板11的电气连接。例如一个实施例中，柔性电路板12的一端可通过插针连接方式与硬性电路板11电气连接。另一实施例中，柔性电路板12的一端可直接焊接在硬性电路板11上，与硬性电路板11电气连接。
根据本发明的另一个优选实施例的电路板结构中，在硬性电路板和柔性电路板之间还设有一绝缘胶布层。也就是说，先在硬性电路板的外围包裹一层绝缘胶布（优选绝缘耐温胶布），仅将用于连接柔性电路板的连接器露出，然后再将柔性电路板包裹在绝缘胶布层的外围，从而可以达到硬性电路板与柔性电路板之间相互绝缘的目的。
以上结合电源模块的实施例来介绍了本发明的电路板结构，但是很显然的是，本发明的这种电路板结构还可以应用于各种其它的期望实现小型化的电子产品及其各种电路模块中。以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. 一种电路板结构，其特征在于，包括：
    一硬性电路板，所述硬性电路板上设置大体积及插件电子元器件；
    一柔性电路板，所述柔性电路板上设置小体积及贴片电子元器件；
    所述柔性电路板至少部分地包裹所述硬性电路板，且所述柔性电路板的一端与所述硬性电路板电气连接。
  2. 根据权利要求1所述的电路板结构，其特征在于，所述柔性电路板包裹硬性电路板的至少两个面。
  3. 根据权利要求2所述的电路板结构，其特征在于，所述柔性电路板覆盖于所述硬性电路板的左侧、上侧和右侧，将硬性电路板上的电子元器件包裹于其所形成的空间内。
  4. 根据权利要求1所述的电路板结构，其特征在于，所述柔性电路板的一端通过设于所述硬性电路板上的搭扣式连接器与所述硬性电路板电气连接。
  5. 根据权利要求1所述的电路板结构，其特征在于，所述柔性电路板的一端通过插针连接方式与所述硬性电路板电气连接。
  6. 根据权利要求1所述的电路板结构，其特征在于，所述柔性电路板的一端焊接在所述硬性电路板上以与所述硬性电路板电气连接。
  7. 根据权利要求1所述的电路板结构，其特征在于，还包括一绝缘胶布层，所述绝缘胶布层设于所述硬性电路板和柔性电路板之间且包裹于硬性电路板的外围。
  8. 根据权利要求1所述的电路板结构，其特征在于，所述柔性电路板为单面板或双面板。
  9. 一种电源模块，包括壳体，其特征在于，还包括设置在所述壳体内的如权利要求1-8中任一项所述的电路板结构。
PCT/CN2013/081573 2013-08-15 2013-08-15 电路板结构及具有该电路板结构的电源模块 WO2015021640A1 (zh)

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CN113676573B (zh) * 2021-08-09 2023-08-29 Oppo广东移动通信有限公司 电子设备

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