WO2015020445A1 - Photoresist resin composition for dry film photoresist - Google Patents

Abstract

The present invention relates to a photoresist resin composition to be contained in a dry film photoresist. More specifically, quality and productivity can be improved in the preparation of a printed circuit board (PCB) since the strip speed is rapid while remarkable fine line adhesion and resolution are maintained, the strip speed is rapid, and resistance against a plating solution is excellent.

Description

Photosensitive resin composition for dry film photoresist

The present invention relates to a photosensitive resin composition for dry film photoresist.

The photosensitive resin composition is used in the form of a dry film photoresist (DFR), a liquid photoresist ink, or the like used in a printed circuit board (PCB) or a lead frame. .

In addition to manufacturing printed circuit boards (PCBs) and lead frames, ITO electrodes, bus address electrodes and black matrix fabrication of rib barriers and other displays of plasma display panels (PDPs) Dry film photoresists are also widely used.

In general, dry film photoresists are widely used for lamination on copper clad laminates. In this regard, as an example of manufacturing a printed circuit board (PCB), a pretreatment process is first performed in order to laminate copper clad laminate, which is a raw material of the PCB. The pretreatment process is followed by drilling, deburring, and front in the outer layer process, and the front or pickling in the inner layer process. Bristle brush and jet pumice processes are mainly used in the frontal process, and the pickling may be subjected to soft etching and 5 wt% sulfuric acid pickling.

In order to form a circuit on the copper-clad laminate after the pretreatment process, a dry film photoresist (hereinafter referred to as DFR) is generally laminated on the copper layer of the copper-clad laminate. In this process, the photoresist layer of the DFR is laminated onto the copper surface while using a laminator to peel off the protective film of the DFR. Generally lamination speed is 0.5 ~ 3.5m / min, temperature 100 ~ 130 ℃, roller pressure heating roll pressure 10 ~ 90psi.

After the lamination process, the printed circuit board is left to stand for at least 15 minutes to stabilize the substrate, and then exposed to the photoresist of the DFR using a photomask having a desired circuit pattern. In this process, when the ultraviolet ray is irradiated to the photomask, the photoresist irradiated with the ultraviolet ray is polymerized by the photoantagonist contained at the irradiated portion. Initially, oxygen in the photoresist is consumed, and then the activated monomer is polymerized to cause a crosslinking reaction, and then a large amount of monomer is consumed to proceed with the polymerization reaction. On the other hand, the unexposed portion is present in a state where the crosslinking reaction does not proceed.

Next, a development process of removing unexposed portions of the photoresist is performed. In the case of alkaline developable DFR, an aqueous solution of potassium carbonate and sodium carbonate of 0.8 to 1.2 wt% is used as a developer. In this process, the photoresist of the unexposed portion is washed away by the saponification reaction of the developer polymer with the carboxylic acid of the binder polymer in the developer, and the cured photoresist remains on the copper surface.

Next, a circuit is formed through different processes depending on the inner layer and outer layer processes. In the inner layer process, a circuit is formed on the substrate through a corrosion and peeling process, and in the outer layer process, after the plating and tenting process, etching and solder peeling are performed to form a predetermined circuit.

Generally, the dry film photoresist exposed in the plating process is placed in a strong acid or strong alkaline liquid environment. For this reason, when the chemical resistance is insufficient, the phenomenon that the dry film photoresist is separated from the copper clad laminate occurs.

In particular, when the photosensitive resin composition of the dry film photoresist contaminates the plating solution, discoloration may occur on the appearance of the substrate to which the plating treatment is applied, or plating efficiency may be lowered, which may cause disconnection.

Moreover, the peeling characteristic after hardening of the photosensitive resin composition is calculated | required. When the peeling characteristic is insufficient, it is difficult to peel the resist between fine wirings in the resist stripping step after the plating treatment, and the peeling time increases, and the production efficiency decreases.

The main object of the present invention is to provide a photosensitive resin composition for dry film photoresist that has a high peeling speed and excellent resistance to plating solution while maintaining excellent fine wire adhesiveness and resolution.

In order to achieve the above object, one embodiment of the present invention [A] photopolymerization initiator; [B] alkali developable binder polymers; And [C] a photopolymerizable compound, wherein the [C] photopolymerizable compound includes a compound represented by the following Formula 1, wherein the weight ratio of the [C] photopolymerizable compound to the alkali developable binder polymer is 1: It is 0.1-1, The photosensitive resin composition for dry film photoresists is provided.

<Formula 1>

In Formula 1, l + n is an integer of 2 or 3, and m is an integer of 12 to 18.

In a preferred embodiment of the present invention, the photosensitive resin composition is based on solids, the [A] photopolymerization initiator may include 2 to 10% by weight, the compound represented by Formula 1 may include 5 to 40% by weight.

In a preferred embodiment of the present invention, the photosensitive resin composition is based on solids, the [A] photopolymerization initiator may include 2 to 10% by weight, the compound represented by Formula 1 may include 10 to 35% by weight.

The photosensitive resin composition for a dry film photoresist according to the present invention can be improved in quality and productivity in PCB manufacturing due to the fast peeling speed and excellent resistance to plating solution while maintaining excellent thin wire adhesion and resolution.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In general, the nomenclature used herein is well known and commonly used in the art.

Throughout this specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding the other components unless otherwise stated.

The invention [A] photopolymerization initiator; [B] alkali developable binder polymers; And [C] a photopolymerizable compound, wherein the [C] photopolymerizable compound includes a compound represented by the following Formula 1, wherein the weight ratio of the [C] photopolymerizable compound to the alkali developable binder polymer is 1: It is 0.1-1, It is related with the photosensitive resin composition for dry film photoresists.

[Formula 1]

In Formula 1, l + n is an integer of 2 to 3, and m is an integer of 12 to 18.

The photosensitive resin composition for dry film photoresists according to the present invention comprises at least one or more compounds represented by the formula (1) in the [C] photopolymerizable compound, thereby maintaining a fine line adhesion and resolution of the excellent dry film photoresist while maintaining Is fast and can have excellent resistance to the plating liquid.

Hereinafter, the present invention will be described in more detail.

[A] photopolymerization initiator

The photopolymerization initiator included in the photosensitive resin composition for dry film photoresists according to the present invention is a material that initiates a chain reaction of the photopolymerizable monomer by UV and other radiation, and plays an important role in curing the dry film photoresist.

As a compound which can be used as said photoinitiator, Anthraquinone derivatives, such as 2-methyl anthraquinone and 2-ethyl anthraquinone; And benzoin derivatives such as benzoin methyl ether, benzophenone, phenanthrene quinone, and 4,4'-bis- (dimethylamino) benzophenone.

In addition to 2,2'-bis (2-chlorophenyl) -4,4'-5,5'-tetraphenylbisimidazole, 1-hydroxycyclohexylphenyl ketone, 2,2-dimethoxy-1,2- Diphenylethan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- [4-morph Polynophenyl] butan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 1- [4- (2- Hydroxymethoxy) phenyl] -2-hydroxy-2-methylpropan-1-one, 2,4-diethyl thioxanthone, 2-chlorothioxanthone, 2,4-dimethyl thioxanthone, 3, 3-dimethyl-4-methoxybenzophenone, benzophenone, 1-chloro-4-propoxycyxanthone, 1- (4-isopropylphenyl) 2-hydroxy-2-methylpropan-1-one, 1 -(4-dodecylphenyl) -2hydroxy-2-methylpropan-1-one, 4-benzoyl-4'-methyldimethylsulfide, 4-dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4- Dimethylaminobenzoate, Butyl 4-dimethylaminoben Zoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-isoamyl 4-dimethylaminobenzoate, 2,2-diethoxyacetophenone, benzylketone dimethylacetal, benzylketone β-methoxy diethylacetal, 1 -Phenyl-1,2-propyldioxime-o, o '-(2-carbonyl) ethoxyether, methyl o-benzoylbenzoate, bis [4-dimethylaminophenyl) ketone, 4,4'-bis ( Diethylamino) benzophenone, 4,4'-dichlorobenzophenone, benzyl, benzoin, methoxybenzoin, ethoxybenzoin, isopropoxybenzoin, n-butoxybenzoin, isobutoxybenzoin, tert -Butoxybenzoin, p-dimethylaminoacetophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, thioxanthone, 2-methyl thioxanthone, 2-isopropyl thioxanthone , A compound selected from dibenzosuberon, α, α-dichloro-4-phenoxyacetophenone, pentyl 4-dimethylaminobenzoate may be used as a photopolymerization initiator, In it not limited.

The content of the photopolymerization initiator is included in 2 to 10% by weight based on the total weight of the photosensitive resin composition. Sufficient sensitivity can be obtained when the content of the photopolymerization initiator is within the above range.

[B] Alkaline Developable Binder Polymer

The alkali developable binder polymer of the present invention is a copolymer of (meth) acrylic acid and (meth) acrylic acid ester. Specifically, methyl acrylate, methyl methacrylate, ethyl acrylate, methyl methacrylate, butyl acrylate, butyl methacrylate, acrylic acid, methacrylic acid, 2-hydroxy ethyl acrylate, 2-hydroxy ethyl Copolymerization of two or more monomers selected from linear acrylic acid polymers synthesized with methacrylate, 2-hydroxy propyl acrylate, 2-hydroxy propyl methacrylate, acrylamide, methacrylamide, styrene, α-methyl styrene Copolymer acrylic polymer obtained through.

The alkali developable binder polymer of the present invention has a weight average molecular weight of 30,000 to 150,000 and a glass transition temperature of 20 to 150 ° C. in consideration of the coating property of the dry film photoresist, the followability, and the mechanical strength of the resist itself after circuit formation. As the compound, it is preferable that the weight ratio of the photopolymerizable compound to the alkali developable binder polymer is included in the photosensitive resin composition in an amount of 1: 0.1 to 1. When the alkali developable binder polymer satisfies the weight ratio of the photopolymerizable compound, after the circuit formation, it is possible to obtain an effect of strengthening the fine wire adhesion.

Above or below, the weight average molecular weight was measured by using polystyrene in standard using Waters 450 GPC, Shodex 10 ⁵ , 10 ⁴ , 10 ³ , and glass transition temperature was measured using DSC 7 of Perkin Elmer. .

[C] photopolymerizable compounds

The photopolymerizable compound of the present invention may be used alone or in combination with a monomer including at least two ethylene groups at the terminal.

[Formula 1]

In Formula 1, l + n is an integer of 2 or 3, and m is an integer of 12 to 18.

The compound represented by Formula 1 may improve hydrophobicity of the photosensitive resin composition to significantly increase resistance to a developer and a plating solution, and may shorten a peeling time of the cured film. The excellent resistance to the plating liquid of the photosensitive resin composition means that the plating liquid is not contaminated and thus the effect on the form and color of the plating appearance is small.

In the present invention, it is preferable to include the compound represented by Formula 1 in 5 to 40% by weight based on the total weight of the photosensitive resin composition solids, more preferably 10 to 35% by weight.

If the content of the compound represented by the formula (1) is less than 5% by weight relative to the total weight of the photosensitive resin composition solids, the effect of the addition of the compound represented by the formula (1) is insufficient, and when the content exceeds 40% by weight The problem that time increases rapidly may occur.

The photopolymerizable compound of the present invention may include a monomer including at least two ethylene groups at the terminal in addition to the compound represented by Chemical Formula 1.

Monomers containing at least two ethylene groups at the terminals include ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, and tetraethylene glycol dimethacrylate. , Propylene glycol dimethacrylate, propylene glycol dimethacrylate, polypropylene glycol dimethacrylate, butylene glycol dimethacrylate, neopentyl glycol dimethacrylate (neopentyl glycol dimethacrylate) ), 1,6-hexane glycol dimethacrylate (1,6-hexane glycol dimethacrylate), trimethylolpropane trimethacrylate, trimethyolpropane triacrylate, glycerin dimethacrylate (glycerin dimethacrylate), pentaerythritol dimetha Pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, dipentaerythritol pentamethacrylate, 2,2-bis (4-methacryloxydiethoxyphenyl) propane , 2-bis (4-methacryloxydiethoxyphenyl) propane), 2,2-bis (4-methacryloxypolyethoxyphenyl) propane (2,2-bis (4-methacryloxypolyethoxyphenyl) propane), 2-hydroxy-3- Methacryloyloxypropyl methacrylate (2-hydroxy-3-methacryloyloxypropyl methacrylate), ethylene glycol diglycidyl ether dimethacrylate, ethylene glycol diglycidyl ether dimethacrylate, diethylene glycol diglycidyl ether dimethacryl Diethylene glycol diglycidyl ether dimethacrylate, phthalic acid diglycidyl ester dimethacrylate, glycerin polyglycidyl ether polymethacrylate lycidyl ether polymethacrylate), polyfunctional (meth) acrylate containing a urethane group, etc. are mentioned.

Moreover, it is preferable that the weight ratio of the [C] photopolymerizable compound with respect to the said [B] alkali developable binder polymer is 1: 0.1-1. When the weight ratio of the photopolymerizable compound is within the above range, an effect of enhancing light sensitivity, resolution, adhesion, and the like can be obtained.

[D] solvents and other additives

As a solvent of the photosensitive resin composition of the present invention, a solvent selected from methyl ethyl ketone (MEK), methanol, THF, toluene and acetone is generally used and is not particularly limited to the above solvent. The content is also a photopolymerization initiator and alkali developability. It can be contained according to the content of the binder polymer and the photopolymerizable compound.

In addition, the photosensitive resin composition of the present invention may further include other additives as necessary, and other additives include, as plasticizers, dibutyl phthalate, diheptyl phthalate, dioctyl phthalate, diallyl phthalate in the form of phthalic acid ester; Triethylene glycol diacetate, tetraethylene glycol diacetate in the glycol ester form; P-toluene sulfonamide, benzenesulfonamide, n-butylbenzenesulfonamide in acid amide form; Triphenyl phosphate and the like can be used.

In order to improve the handleability of the photosensitive resin composition in this invention, you may add a leuco dye and a coloring substance. Examples of the leuco dyes include tris (4-dimethylamino-2-methylphenyl) methane, tris (4-dimethylamino-2methylphenyl) methane, fluorane dye and the like. Especially, when a leuco crystal violet is used, contrast is favorable and preferable. As for content in the case of containing a leuco dye, 0.1-10 weight% is preferable in the photosensitive resin composition. 0.1 weight% or more is preferable from a viewpoint of contrast expression, and 10 weight% or less is preferable from a viewpoint of maintaining storage stability.

Examples of the coloring substance include toluenesulfonic acid monohydrate, fuxin, phthalocyanine green, oramin base, paramagenta, crystal violet, methyl orange, nile blue 2B, victorian blue, malachite green, diamond green, basic blue 20, and the like. Can be mentioned. As for the addition amount in the case of containing the said coloring substance, 0.001 to 1 weight% is preferable in the photosensitive resin composition. The content of 0.001% by weight or more has the effect of improving handleability, and the content of 1% by weight or less has the effect of maintaining storage stability.

In addition, other additives may further include a thermal polymerization inhibitor, a dye, a discoloring agent, an adhesion promoter, and the like.

In the present invention, the photosensitive resin composition having the composition as described above may be prepared as a photosensitive resin composition for dry film photoresist, and has a thickness of 5 to 200 μm using a conventional coating method on a conventional base film such as polyethylene terephthalate. The photosensitive resin layer may be coated and then dried, and the dried photosensitive resin layer may be laminated on an upper surface thereof using a conventional protective film such as polyethylene to prepare a dry film. The dry film thus prepared is subjected to exposure and development by a method of evaluating the respective physical properties.

Hereinafter, preferred examples and comparative examples of the present invention will be described. However, the following examples are only preferred embodiments of the present invention, and the present invention is not limited to the following examples.

[Production Example 1]

A four-neck round bottom flask was equipped with a mechanical stirrer and reflux, and then purged inside the flask with nitrogen. 90 g of MEK (Methyl Ethyl Ketone) and 10 g of Propylene Glycol Monomehtyl Ether Acetate (PGMEA) were added to the flask purged with nitrogen, followed by 0.8 g of azobisisobutyronitrile (AIBN) to completely dissolve the flask. 20 g of methyl methacrylate, 70 g of methyl methacrylate, and 10 g of a monomer of styrene monomer were added thereto, and the temperature was raised to 80 ° C., followed by polymerization for 6 hours to prepare an alkali developable binder polymer.

[Production Examples 2 to 4]

The compound represented by Formula 1 of the present invention was prepared by the following method.

1) Synthesis of PEO-PPO-PEO block copolymer

Put KOH [6g] with poly (propylene glycol) [40 mmol] and a basic catalyst in an autoclave, heat to 120 ° C. under N2 atmosphere, and then prepare an ethylene oxide solution [132 mL for Production Examples 2 to 3, 88 mL for Preparation Example 4]. Dropwise dropwise to synthesize the PEO-PPO-PEO block copolymer, and after completion of the reaction to remove the solvent and water by filtration under reduced pressure.

Table 1 shows the poly (propylene glycol) used in Preparation Examples 2 to 4.

Table 1

Type of poly (propylene glycol)
Preparation Example 2	a = 18
Preparation Example 3	a = 15
Preparation Example 4	a = 12

2) Synthesis of Pluronic Diacrylate

Place a round-bottomed flask equipped with a funnel and nitrogen inlet in an ice bath, and then synthesize the PEO-PPO-PEO block copolymer (30 mmol), triethylamine (71.4 mmol, 7.22 g) and methylene chloride (150). mL) was added. Then, methacryloyl chloride (73.78 mmol, 7.71 g) was added dropwise over 3 hours, and the reaction was allowed to react for another 20 hours. In the meantime, the inside of the flask continued to purge nitrogen, maintaining the temperature of 0 degreeC-25 degreeC. Filtration under reduced pressure to remove by-products in salt form and lyophilized to remove water.

Table 2 below shows the compounds represented by Formula 1 prepared according to Preparation Examples 2 to 4.

TABLE 2

Preparation Example 2	m = 18, l + n = 3 (Mw = 1300)
Preparation Example 3	m = 15, l + n = 3 (Mw = 1150)
Preparation Example 4	m = 15, l + n = 3 (Mw = 1150)

3) The molecular weight of the compound prepared according to Preparation Examples 2 to 4 was measured by GPC as follows.

<Method of measuring molecular weight through GPC>

Polystyrene reduced weight average molecular weight (Mw) was determined by gel permeation chromatography (GPC) (Waters Alliance e2695 + Waters 2414 RI Detector). The polymer to be measured was dissolved in tetrahydrofuran to a concentration of 0.2%, filtered through a 0.45 μm PTFE syringe filter, and 10 μL was injected into the GPC. The mobile phase of GPC used tetrahydrofuran and was introduced at a flow rate of 1.0 mL / min and the analysis was performed at 30 ° C. The column connected two Agilent Plgel Mixed D in series. As a detector, it measured at 40 degreeC using the RI detector. The calibration curve was prepared by dissolving polystyrene standard in THF at a concentration of 0.1%.

[Examples 1 to 13 and Comparative Examples 1 to 3]

The photosensitive resin composition for dry film photoresist was evaluated by combining and coating according to the composition shown in Table 3 and Table 4. First, photopolymerization initiators were dissolved in methyl ethyl ketone (MEK) as a solvent, and then the photopolymerizable compound and the alkali developable binder polymer of Preparation Example 1 were added and mixed for about 1 hour using a mechanical stirrer to obtain a photosensitive resin composition. . The obtained photosensitive resin composition was coated on a 40 μm PET film using a coating bar. The coated photosensitive resin composition layer was dried using a hot air oven, wherein the drying temperature was 80 ° C., the drying time was 5 minutes, and the thickness of the photosensitive resin composition layer after drying was 40 μm. The dried film was laminated using a protective film (polyethylene) on the photosensitive resin layer.

TABLE 3

Component (wt%)		Example 1	Example 2	Example 3	Example 4	Example 5	Comparative Example 1	Comparative Example 2	Comparative Example 3
Photopolymerization initiator	EAB (1)	0.5	0.5	0.5	0.5	0.5	0.5	0.5	0.5
	BCIM (2)	1.5	1.5	1.5	1.5	1.5	1.5	1.5	1.5
Alkaline Developable Binder Polymer *		52	52	52	52	52	52	52	37
Photopolymerizable compound	Preparation Example 2 (3)	25	15	15	10	5	-	-	40
	M-2053 (4)			10			25
	BPE-500 (5)		10		15	20		25
additive	Toluene Sulfoic Acid Monohydrate	0.5	0.5	0.5	0.5	0.5	0.5	0.5	0.5
	Ruico Crystal Violet (6)	0.3	0.3	0.3	0.3	0.3	0.3	0.3	0.3
	Diamond Green GH (7)	0.2	0.2	0.2	0.2	0.2	0.2	0.2	0.2
solvent	Methyl ethyl ketone (MEK)	20	20	20	20	20	20	20	20
(1) EAB: 4,4- (bisdiethylamino) benzophenone (Aldrich Chemical) (2) BCIM: 2,2-bis- (2-chlorofetyl-4,5,4,5-tetra Phenylbisimidazole (Aldrich Chemical) * methylmethacrylic acid / methylmethacrylate / styrene monomer (20:70:10 weight ratio) Weight average molecular weight 60,000 (3) Preparation Example 2: In Chemical Formula 1 of the present invention, l + n is 3, m is 18 (4) M-2053: In the general formula (1) of the present invention, l + n is 6 and m is 12 (mione specialty chemical) (5) BPE-500: 2, 2-bis [4- (methacryloxypolyethoxy) phenyl] propane (Shinkakamura) (6) Ruiko Crystal Violet: Japan Hodogaya Co. (7) Diamond Green GH: Japan Hodogaya Co.

Table 4 shows the contents of the photopolymerizable compounds carried out in Examples 6 to 13, respectively. Except for the photopolymerizable compound, the remaining composition is the same as in Example 1.

Table 4

Photopolymerizable compound	Example (content% by weight)
	6	7	8	9	10	11	12	13
Preparation Example 3	25	15	15	10
Preparation Example 4					25	15	15	10
M-2053			10				10
BEP-500		10		15		10		15

The dry film photoresist prepared using the photosensitive resin composition prepared by the above composition was performed by the following process.

<Lamination>

The dry film photoresist is brush-polished 1.6 mm thick copper clad laminate with a substrate preheat roll temperature of 120 ° C., laminator roll temperature of 115 ° C., roll pressure of 4.0 kgf / cm 2 and roll speed of 2.5 min / m. Lamination was performed using 610i.

<Development and Resolution>

The dry film photoresist laminated on the copper clad laminate was left to stand for 20 minutes after irradiating ultraviolet rays at an exposure dose of 40 mJ using a Perkin-Elmer OB7120 (parallel light exposure machine) using a photomask for circuit evaluation. Then, development was carried out under the development conditions of the spray injection method with 1.0 wt% aqueous solution of Na ₂ CO ₃ . The time required for the dry film photoresist of the unexposed portion on the copper clad laminate to be completely washed in the developer was measured using a stopwatch (minimum development time). The product was fixed at a break point of 50% (2 of minimum development time). stomach).

The physical properties of the dry film photoresist prepared using the photosensitive resin compositions prepared in Examples 1 to 13 and Comparative Examples 1 to 3 were measured by the following methods, and the results are shown in Table 5 below.

<Wire adhesion (unit: μm)>

After development, the minimum line width of independent resist was measured by ZEISS AXIOPHOT Microscope.

<Resolution (Unit: µm)>

The space between the circuit line and the circuit line was measured at 1: 1 and measured with a ZEISS AXIOPHOT Microscope.

Pollution Assessment for Plating

The dry film photoresist made of the photosensitive resin composition was cut to a size of 40 cm × 50 cm, the protective film was removed, the exposure was performed at an exposure amount of 20 steps, and then the PET film was peeled off to obtain a cured film. This cured film was immersed in 1 L of plating liquid of copper sulfate / sulfuric acid aqueous solution for 3 days. Electrolytic copper plating was performed on a copper plate for 15 minutes at a current of 2 A using a Halssel test bath (manufactured by the Quality Test Laboratory).

When plating with the plating solution immersed in the cured film with reference to the plating solution without immersing the cured film, the appearance of plating is visually observed. If there is an abnormality in the plating appearance or discoloration occurs, X is the same as the reference. Judging

<Peeling rate (unit: second)>

The peeling rate was removed by removing the PE film of the photosensitive dry film resist, and then laminated on a copper plate using a heat-compression roller, the photosensitive resin composition was exposed and developed to produce a photocured film having a size of 50mm x 50mm. And it peeled using 3% sodium hydroxide aqueous solution (temperature 50 degreeC). The evaluation of the peeling speed measured the time when the photocured film fell from the copper plate.

Table 5

	Example													Comparative example
	One	2	3	4	5	6	7	8	9	10	11	12	13	One	2	3
Fine wire adhesion * 1	30	25	30	25	25	35	30	35	30	35	33	35	30	30	25	-
Resolution * 2	30	33	33	33	33	30	33	33	33	30	33	33	33	33	33	-
Contamination for plating	O	O	O	O	O	O	O	O	O	O	O	O	O	X	O	-
Peeling Speed	40	60	50	60	75	45	60	55	65	50	65	60	65	55	80	-
* 1 Cesene adhesion is the minimum line width where independent line widths survive after development. * 2 Resolution is a value measured with a space of 1: 1 between a circuit line and a circuit line.

As shown in Table 5, Examples 1 to 13 was compared to Comparative Examples 1 to 3 while maintaining a similar level of thin line adhesion and resolution, it was found that the peeling rate is fast, the resistance to the plating solution is remarkably excellent. In particular, in the case of Comparative Example 3, the lamination step could not be performed because the photosensitive resin composition layer was too sticky and did not properly maintain the film form.

All simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

Claims (3)

1. [A] photopolymerization initiator; [B] alkali developable binder polymers; And [C] a photopolymerizable compound, wherein the [C] photopolymerizable compound includes a compound represented by the following Formula 1, wherein the weight ratio of the [C] photopolymerizable compound to the alkali developable binder polymer is 1: It is 0.1-1, The photosensitive resin composition for dry film photoresists.

   [Formula 1]

   

   In Formula 1, l + n is an integer of 2 or 3, m is an integer of 12 to 18.
2. The dry film photoresist of claim 1, wherein the photosensitive resin composition comprises 2 to 10 wt% of the [A] photopolymerization initiator and 5 to 40 wt% of the compound represented by Formula 1 based on a solid content. Photosensitive resin composition for.
3. The dry film photoresist of claim 1, wherein the photosensitive resin composition comprises 2 to 10 wt% of the photopolymerization initiator [A] and 10 to 35 wt% of the compound represented by Formula 1, based on a solid content. Photosensitive resin composition for.