WO2015014292A1 - 一种自动化电镀系统 - Google Patents

一种自动化电镀系统 Download PDF

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Publication number
WO2015014292A1
WO2015014292A1 PCT/CN2014/083371 CN2014083371W WO2015014292A1 WO 2015014292 A1 WO2015014292 A1 WO 2015014292A1 CN 2014083371 W CN2014083371 W CN 2014083371W WO 2015014292 A1 WO2015014292 A1 WO 2015014292A1
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Prior art keywords
address block
cpu
wireless transceiver
electroplating
transceiver antenna
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PCT/CN2014/083371
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English (en)
French (fr)
Inventor
黄海
Original Assignee
Huang Hai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Huang Hai filed Critical Huang Hai
Priority to JP2016600064U priority Critical patent/JP3205423U/ja
Publication of WO2015014292A1 publication Critical patent/WO2015014292A1/zh

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation

Definitions

  • the invention relates to the technical field of electroplating devices, and in particular to an automatic electroplating system.
  • the existing automated electroplating production line is difficult to achieve high-end processing, such as soft board process and blind hole process, in the process of soft-pack plating, it is necessary to control the high jet pressure, too high pressure will cause soft pack Bending, the consequences are very serious, such as bending and hanging off the board; but too low jet pressure can not discharge the air or waste liquid in the tiny holes, so the plating quality of the micro-holes of the soft board is difficult to guarantee.
  • the pressure outside the hole is larger than the pressure in the hole due to the pressure of the jet flow, and the discharge of the waste liquid in the hole is also unsatisfactory.
  • the object of the present invention is to provide an automatic plating system which is simple in structure, flexible, stable, and has good electroplating quality and can realize high-end and complicated process processing in response to the deficiencies of the prior art.
  • An automatic plating system comprises a host computer main controller and a plating car, wherein the host computer main controller is provided with a first wireless transmitting and receiving antenna, and the electroplating car is provided with a second wireless transmitting and receiving antenna matched with the first wireless transmitting and receiving antenna, first
  • the wireless transceiver antenna is wirelessly connected with the second wireless transceiver antenna;
  • the electroplating vehicle is further provided with a CPU, an address block group, a data memory, a current regulation module and an electric execution component, and the electric execution component comprises a driving electroplating vehicle moving along the corresponding track.
  • Drive motor for controlling the lifting of the copper plate
  • vibration motor for controlling the vibration of the copper plate
  • electromagnet for holding the fixed copper plate, address block group, data memory, current adjustment module, drive motor, lift motor
  • the vibration motor and the electromagnet are electrically connected to the CPU, respectively.
  • the electroplating vehicle further includes an ultrasonic ranging module, and the ultrasonic ranging module is electrically connected to the CPU.
  • the electroplating car further includes an alarm module, and the alarm module is electrically connected to the CPU.
  • the electroplating car further includes a backup battery, and the backup battery is electrically connected to the CPU.
  • an automatic plating system comprising a host computer main controller and a plating car
  • the host computer main controller is provided with a first wireless transceiver antenna
  • the electroplating car is provided with a second wireless transceiver antenna
  • a CPU an address block group
  • a data memory a current regulating module
  • an electric actuator assembly the electric actuator assembly includes a drive motor, a lift motor, a vibration motor, and an electromagnet.
  • the address block group of the present invention includes a loading address block located at a loading station, a blanking address block at a blanking station, a falling address block and a rising address block located in the plating tank, the deplating tank, and each cleaning tank;
  • the host computer main controller sends the corresponding production data to the second wireless transmitting and receiving antenna through the first wireless transmitting and receiving antenna, and the second wireless transmitting and receiving antenna inputs the production data into the CPU and finally
  • the production data is stored in the data storage; then the CPU controls the driving motor, the lifting motor, the vibration motor, and the electromagnet to operate and complete the electroplating process according to the above-mentioned production data; the current adjustment module can effectively stabilize the current value during the electroplating process. In turn, the quality of the plating can be effectively ensured and controlled.
  • the present invention has the advantages of simple structure, flexibility, strong stability, good plating quality, and the ability to realize high-end, complex process processing.
  • Figure 1 is a schematic view of the structure of the present invention.
  • an automatic plating system includes a host computer main controller 1 and a plating car 2 .
  • the host computer main controller 1 is provided with a first wireless transceiver antenna 3
  • the electroplating car 2 is provided with the first wireless transceiver.
  • the second wireless transceiver antenna 4 is coupled to the second wireless transceiver antenna 4, and the first wireless transceiver antenna 3 is wirelessly connected to the second wireless transceiver antenna 4;
  • the electroplating vehicle 2 is further provided with a CPU 5, an address block group 6, a data memory 7, and a current adjustment module 8;
  • An electric actuator assembly including a drive motor 9 that drives the plating cart 2 to move along a corresponding rail, a lift motor 10 for controlling the lift of the copper plate, a vibration motor 11 for controlling the vibration of the copper plate, and a card holder
  • the electromagnet 12 to which the copper plate is fixed, the address block group 6, the data memory 7, the current adjustment module 8, the drive motor 9, the lift motor 10, the vibration motor 11, and the electromagnet 12 are electrically connected to the CPU 5, respectively.
  • the address block group 6 of the present invention includes a loading address block at a loading station, a blanking address block at a blanking station, a plating position in the plating tank, a deplating tank, and a feeding position of each cleaning tank.
  • the falling address block and the rising address block located in the plating bath, the deplating bath, and the discharge position of each cleaning tank.
  • the host computer main controller 1 transmits the corresponding production data to the second wireless transmitting and receiving antenna 4 through the first wireless transmitting and receiving antenna 3, and the second wireless transmitting and receiving antenna 4 inputs the above-mentioned production data.
  • the production data data is stored in the data memory 7 in the CPU 5, and the production data includes the current data, the plating speed data of the plating car 2, the processing time data, the vibration time data, and the like.
  • the CPU 5 controls the driving motor 9, the elevating motor 10, the vibration motor 11, and the electromagnet 12 to operate and complete the electroplating process in accordance with the above-described production data.
  • the current regulating module 8 of the present invention can effectively stabilize the current value in the electroplating process, and keep the current value in the electroplating process at the current value required by the above-mentioned production data, thereby effectively ensuring and controlling Plating quality.
  • the present invention has the advantages of simple structure, flexibility, strong stability, good plating quality, and the ability to realize high-end, complex process processing.
  • the electroplating car 2 further includes an ultrasonic ranging module 13 that is electrically connected to the CPU 5.
  • the present invention can maintain the front and rear two electroplating vehicles 2 at a certain distance; when the distance between the last two electroplating vehicles 2 is less than the set distance, the ultrasonic ranging module 13 transmits the distance signal to The CPU 5 and the CPU 5 control the rotational speed of the drive motor 9 to perform deceleration braking.
  • the electroplating car 2 further includes an alarm module 14, and the alarm module 14 is electrically connected to the CPU 5; when the electroplating car 2 has abnormal lifting, walking abnormality, abnormal current, abnormal vibration, abnormal clamping, and abnormal power supply, etc.
  • the alarm module 14 will promptly perform an alarm action and alert the operator; in addition, the CPU 5 receives the abnormal signal and stores the corresponding data in the data memory 7, and also sends the abnormal data through the second wireless transmitting and receiving antenna 4. To the upper machine main controller 1.
  • the electroplating car 2 further includes a backup battery 15 that is electrically connected to the CPU 5.
  • the backup battery 15 can function to stabilize the working voltage, thereby ensuring normal and smooth operation.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

本发明公开了一种自动化电镀系统,其包括上位机主控制器、第一无线收发天线、第二无线收发天线、CPU、地址块组、数据存储器、电流调节模块、驱动马达、升降马达、振动马达及电磁铁。地址块组包括上料地址块、下料地址块及位于电镀槽、退镀槽及各清洗槽的下降地址块和上升地址块;当上料地址块被触碰时,上位机主控制器通过第一无线收发天线、第二无线收发天线将生产资料数据输入于CPU并存储于数据存储器内,且通过CPU控制驱动马达、升降马达、振动马达及电磁铁动作并按照上述生产资料数据完成电镀加工;电流调节模块起到稳定电流的作用。本发明具有结构简单、灵活、稳定性强、电镀质量好且能够实现高端、复杂工艺加工的需要的优点。

Description

一种自动化电镀系统 技术领域
本发明涉及电镀装置技术领域,尤其涉及一种自动化电镀系统。
背景技术
随着自动化技术不断地提高,自动化电镀生产线已广泛地应用于各电镀加工厂。然而,现有的自动化电镀生产线整体结构复杂,在生产装配过程中,必须依靠技艺娴熟的钳工技师来完成组装作业,且整线的工艺水平很大程度由钳工技师来决定;由于结构复杂,安装调试周期特别长且整线的稳定性较差,成本高;产能有限且工作效率较低;整线停产风险很高,现有的自动化电镀生产线采用往复步进的方式进行循环移动,每一步动作都彼此相关且环环相扣,一旦整线的局部出现故障都有可能造成整线停产。
技术问题
另外,现有的自动化电镀生产线很难实现高端工艺加工,例如软板工艺以及盲孔工艺等,在软包电镀的过程中,需要控制较高的喷流压力,太高的压力会造成软包弯曲,后果很严重,例如弯曲挂卡掉板;但太低的喷流压力无法对微小孔内的空气或者废液排出,所以对软板微孔的电镀质量难以保证。在盲孔电镀工艺中,因为喷流的压强,孔外压力大于孔内压力,孔内废液的排出同样不理想。
技术解决方案
本发明的目的在于针对现有技术的不足而提供一种自动化电镀系统,该自动化电镀系统结构简单、灵活、稳定性强、电镀质量好且能够实现高端、复杂工艺加工的需要。
为达到上述目的,本发明通过以下技术方案来实现。
一种自动化电镀系统,包括有上位机主控制器以及电镀车,上位机主控制器设置有第一无线收发天线,电镀车设置有与第一无线收发天线配合的第二无线收发天线,第一无线收发天线与第二无线收发天线无线通讯连接;电镀车还设置有CPU、地址块组、数据存储器、电流调节模块以及电动执行组件,电动执行组件包括有驱动电镀车沿着相应的轨道移动的驱动马达、用于控制镀铜板升降的升降马达、用于控制镀铜板振动的振动马达以及用于卡持固定镀铜板的电磁铁,地址块组、数据存储器、电流调节模块、驱动马达、升降马达、振动马达以及电磁铁分别与CPU电连接。
其中,所述电镀车还包括有超声波测距模块,超声波测距模块与所述CPU电连接。
其中,所述电镀车还包括有报警模块,报警模块与所述CPU电连接。
其中,所述电镀车还包括有后备电池,后备电池与所述CPU电连接。
有益效果
本发明的有益效果为:本发明所述的一种自动化电镀系统,其包括上位机主控制器以及电镀车,上位机主控制器设置第一无线收发天线,电镀车设置第二无线收发天线、CPU、地址块组、数据存储器、电流调节模块以及电动执行组件,电动执行组件包括驱动马达、升降马达、振动马达以及电磁铁。本发明的地址块组包括有位于上料工位的上料地址块、位于下料工位的下料地址块、位于电镀槽、退镀槽以及各清洗槽的下降地址块及上升地址块;当上料地址块被触碰时,上位机主控制器通过第一无线收发天线将相应的生产资料数据发送至第二无线收发天线,第二无线收发天线将上述生产资料数据输入于CPU并最终将上述生产资料数据存储于数据存储器内;而后CPU控制驱动马达、升降马达、振动马达以及电磁铁动作并按照上述生产资料数据完成电镀加工;电流调节模块能够有效地稳定电镀过程中的电流值,进而能够有效地保证并控制电镀质量。综合上述情况可知,本发明具有结构简单、灵活、稳定性强、电镀质量好且能够实现高端、复杂工艺加工的需要的优点。
附图说明
下面利用附图来对本发明进行进一步的说明,但是附图中的实施例不构成对本发明的任何限制。
图1为本发明的结构示意图。
在图1中包括有:
1——上位机主控制器 2——电镀车
3——第一无线收发天线 4——第二无线收发天线
5——CPU 6——地址块组
7——数据存储器 8——电流调节模块
9——驱动马达 10——升降马达
11——振动马达 12——电磁铁
13——超声波测距模块 14——报警模块
15——后备电池。
本发明的最佳实施方式
下面结合具体的实施方式来对本发明进行说明。
如图1所示,一种自动化电镀系统,包括有上位机主控制器1以及电镀车2,上位机主控制器1设置有第一无线收发天线3,电镀车2设置有与第一无线收发天线3配合的第二无线收发天线4,第一无线收发天线3与第二无线收发天线4无线通讯连接;电镀车2还设置有CPU5、地址块组6、数据存储器7、电流调节模块8以及电动执行组件,电动执行组件包括有驱动电镀车2沿着相应的轨道移动的驱动马达9、用于控制镀铜板升降的升降马达10、用于控制镀铜板振动的振动马达11以及用于卡持固定镀铜板的电磁铁12,地址块组6、数据存储器7、电流调节模块8、驱动马达9、升降马达10、振动马达11以及电磁铁12分别与CPU5电连接。
需进一步解释,本发明的地址块组6包括有位于上料工位的上料地址块、位于下料工位的下料地址块、位于电镀槽、退镀槽以及各清洗槽的入料位置的下降地址块以及位于电镀槽、退镀槽以及各清洗槽的出料位置的上升地址块。
当上料地址块被触碰时,上位机主控制器1通过第一无线收发天线3将相应的生产资料数据发送至第二无线收发天线4,第二无线收发天线4将上述生产资料数据输入于CPU5并最终将上述生产资料数据存储于数据存储器7内,其中,上述生产资料数据包括有电流数据、电镀车2移动速度数据、处理时间数据以及振动时间数据等。
当电镀车2接收到上位机主控制所发送至的生产资料数据后,CPU5控制驱动马达9、升降马达10、振动马达11以及电磁铁12动作并按照上述生产资料数据完成电镀加工。
需进一步解释,本发明的电流调节模块8能够有效地稳定电镀过程中的电流值,并使得电镀过程中的电流值时刻保持在上述生产资料数据所要求的电流值,进而能够有效地保证并控制电镀质量。
综合上述情况可知,本发明具有结构简单、灵活、稳定性强、电镀质量好且能够实现高端、复杂工艺加工的需要的优点。
作为优选的实施方式,电镀车2还包括有超声波测距模块13,超声波测距模块13与CPU5电连接。通过增设超声波测距模块13,本发明能够使得前后两辆电镀车2保持一定的距离;当前后两辆电镀车2之间的距离小于设定距离时,超声波测距模块13将距离信号传输至CPU5,CPU5在控制驱动马达9的转速并进行减速刹车。
作为优选的实施方式,电镀车2还包括有报警模块14,报警模块14与CPU5电连接;当电镀车2出现升降异常、行走异常、电流异常、振动异常、夹持异常以及电源异常等的情况时,报警模块14会及时地进行报警动作并提醒操作人员;另外,CPU5在接收上述异常信号并将相应数据储存于数据存储器7内,同时也会将上述异常数据通过第二无线收发天线4发送至上位机主控制器1。
作为优选的实施方式,电镀车2还包括有后备电池15,后备电池15与CPU5电连接。当电镀车2在电镀过程中出现接触不良时,后备电池15能够起到稳定工作电压的作用,进而保证工作正常平稳进行。
以上内容仅为本发明的较佳实施例,对于本领域的普通技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,本说明书内容不应理解为对本发明的限制。

Claims (4)

  1. 一种自动化电镀系统,其特征在于:包括有上位机主控制器(1)以及电镀车(2),上位机主控制器(1)设置有第一无线收发天线(3),电镀车(2)设置有与第一无线收发天线(3)配合的第二无线收发天线(4),第一无线收发天线(3)与第二无线收发天线(4)无线通讯连接;电镀车(2)还设置有CPU(5)、地址块组(6)、数据存储器(7)、电流调节模块(8)以及电动执行组件,电动执行组件包括有驱动电镀车(2)沿着相应的轨道移动的驱动马达(9)、用于控制镀铜板升降的升降马达(10)、用于控制镀铜板振动的振动马达(11)以及用于卡持固定镀铜板的电磁铁(12),地址块组(6)、数据存储器(7)、电流调节模块(8)、驱动马达(9)、升降马达(10)、振动马达(11)以及电磁铁(12)分别与CPU(5)电连接。
  2. 根据权利要求1所述的一种自动化电镀系统,其特征在于:所述电镀车(2)还包括有超声波测距模块(13),超声波测距模块(13)与所述CPU(5)电连接。
  3. 根据权利要求2所述的一种自动化电镀系统,其特征在于:所述电镀车(2)还包括有报警模块(14),报警模块(14)与所述CPU(5)电连接。
  4. 根据权利要求3所述的一种自动化电镀系统,其特征在于:所述电镀车(2)还包括有后备电池(15),后备电池(15)与所述CPU(5)电连接。
PCT/CN2014/083371 2013-08-01 2014-07-31 一种自动化电镀系统 WO2015014292A1 (zh)

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CN2013103329035A CN103436946A (zh) 2013-08-01 2013-08-01 一种自动化电镀系统
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