WO2015008628A1 - Poudre d'alliage de cuivre recouverte d'argent et procédé de fabrication de cette dernière - Google Patents

Poudre d'alliage de cuivre recouverte d'argent et procédé de fabrication de cette dernière Download PDF

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Publication number
WO2015008628A1
WO2015008628A1 PCT/JP2014/067724 JP2014067724W WO2015008628A1 WO 2015008628 A1 WO2015008628 A1 WO 2015008628A1 JP 2014067724 W JP2014067724 W JP 2014067724W WO 2015008628 A1 WO2015008628 A1 WO 2015008628A1
Authority
WO
WIPO (PCT)
Prior art keywords
silver
copper alloy
alloy powder
coated copper
coated
Prior art date
Application number
PCT/JP2014/067724
Other languages
English (en)
Japanese (ja)
Inventor
井上　健一
江原　厚志
彰宏 浅野
山田　雄大
英幸 藤本
孝造 尾木
Original Assignee
Ｄｏｗａエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｄｏｗａエレクトロニクス株式会社 filed Critical Ｄｏｗａエレクトロニクス株式会社
Publication of WO2015008628A1 publication Critical patent/WO2015008628A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C09C1/627—Copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Selon la présente invention, une poudre d'alliage de cuivre recouverte d'argent, obtenue par revêtement d'une poudre d'alliage de cuivre qui présente une composition qui contient entre 1 et 50 % en masse de nickel et/ou de zinc, le reste comportant du cuivre et des impuretés inévitables, avec de 7 à 50 % en masse d'une couche contenant de l'argent (la couche comprenant de l'argent ou un composé d'argent), est réduite en particules individuelles, ce qui permet d'obtenir une poudre d'alliage de cuivre recouverte d'argent qui présente une densité après tassement égale ou supérieure à 5 g/cm3 et pour laquelle la proportion entre la densité après tassement et la densité réelle varie entre 55 et 70 %.
PCT/JP2014/067724 2013-07-16 2014-06-26 Poudre d'alliage de cuivre recouverte d'argent et procédé de fabrication de cette dernière WO2015008628A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-147198 2013-07-16
JP2013147198A JP6258616B2 (ja) 2013-07-16 2013-07-16 銀被覆銅合金粉末およびその製造方法

Publications (1)

Publication Number Publication Date
WO2015008628A1 true WO2015008628A1 (fr) 2015-01-22

Family

ID=52346097

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/067724 WO2015008628A1 (fr) 2013-07-16 2014-06-26 Poudre d'alliage de cuivre recouverte d'argent et procédé de fabrication de cette dernière

Country Status (2)

Country Link
JP (1) JP6258616B2 (fr)
WO (1) WO2015008628A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108213415A (zh) * 2018-01-11 2018-06-29 宁波广新纳米材料有限公司 耐腐蚀耐高温银铜包覆粉的生产方法
CN109689250A (zh) * 2016-08-31 2019-04-26 同和电子科技有限公司 银被覆合金粉末、导电性糊剂、电子部件及电气装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105118544A (zh) * 2015-07-24 2015-12-02 南通慧源塑胶有限公司 一种柔性导电薄膜
CN110280757B (zh) * 2019-07-09 2021-07-23 湖南省国银新材料有限公司 一种用于叠瓦导电胶的混合金属粉及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118424A (ja) * 1999-10-19 2001-04-27 Kawatetsu Mining Co Ltd 導電ペースト用銅合金粉
JP2003147316A (ja) * 2001-11-16 2003-05-21 Hitachi Chem Co Ltd 接着用樹脂ペースト組成物及びこれを用いた半導体装置
JP2006169559A (ja) * 2004-12-14 2006-06-29 Sumitomo Metal Mining Co Ltd 銅合金微粒子とその製造方法
WO2008059789A1 (fr) * 2006-11-17 2008-05-22 Nippon Mining & Metals Co., Ltd. Fine poudre de cuivre plaquée argent, pâte conductrice produite à partir d'une fine poudre de cuivre plaquée argent, et procédé pour produire une fine poudre de cuivre plaquée argent
JP2013108140A (ja) * 2011-11-22 2013-06-06 Nippon Steel & Sumikin Chemical Co Ltd 金属微粒子組成物及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5297344B2 (ja) * 2009-11-04 2013-09-25 京都エレックス株式会社 加熱硬化型導電性ペースト組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118424A (ja) * 1999-10-19 2001-04-27 Kawatetsu Mining Co Ltd 導電ペースト用銅合金粉
JP2003147316A (ja) * 2001-11-16 2003-05-21 Hitachi Chem Co Ltd 接着用樹脂ペースト組成物及びこれを用いた半導体装置
JP2006169559A (ja) * 2004-12-14 2006-06-29 Sumitomo Metal Mining Co Ltd 銅合金微粒子とその製造方法
WO2008059789A1 (fr) * 2006-11-17 2008-05-22 Nippon Mining & Metals Co., Ltd. Fine poudre de cuivre plaquée argent, pâte conductrice produite à partir d'une fine poudre de cuivre plaquée argent, et procédé pour produire une fine poudre de cuivre plaquée argent
JP2013108140A (ja) * 2011-11-22 2013-06-06 Nippon Steel & Sumikin Chemical Co Ltd 金属微粒子組成物及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109689250A (zh) * 2016-08-31 2019-04-26 同和电子科技有限公司 银被覆合金粉末、导电性糊剂、电子部件及电气装置
EP3508286A4 (fr) * 2016-08-31 2020-02-19 Dowa Electronics Materials Co., Ltd. Poudre d'alliage revêtue d'argent, pâte conductrice, composant électronique et dispositif électrique
US11041229B2 (en) 2016-08-31 2021-06-22 Dowa Electronics Materials Co., Ltd. Silver-coated alloy powder, electrically conductive paste, electronic part, and electric device
TWI741023B (zh) * 2016-08-31 2021-10-01 日商同和電子科技股份有限公司 被覆有銀之合金粉末、導電性糊膏、電子零件及電氣裝置
CN108213415A (zh) * 2018-01-11 2018-06-29 宁波广新纳米材料有限公司 耐腐蚀耐高温银铜包覆粉的生产方法

Also Published As

Publication number Publication date
JP6258616B2 (ja) 2018-01-10
JP2015021137A (ja) 2015-02-02

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