WO2015000331A1 - 一种led支架、led以及背光模组 - Google Patents

一种led支架、led以及背光模组 Download PDF

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Publication number
WO2015000331A1
WO2015000331A1 PCT/CN2014/076266 CN2014076266W WO2015000331A1 WO 2015000331 A1 WO2015000331 A1 WO 2015000331A1 CN 2014076266 W CN2014076266 W CN 2014076266W WO 2015000331 A1 WO2015000331 A1 WO 2015000331A1
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WO
WIPO (PCT)
Prior art keywords
led
housing
light
led chip
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/076266
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English (en)
French (fr)
Inventor
孟英利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Chatani Electronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Chatani Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Chatani Electronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US14/421,524 priority Critical patent/US9964287B2/en
Publication of WO2015000331A1 publication Critical patent/WO2015000331A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0075—Arrangements of multiple light guides
    • G02B6/0078—Side-by-side arrangements, e.g. for large area displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Definitions

  • the utility model belongs to the technical field of LED applications, and particularly relates to an LED bracket, an LED including the LED bracket and a backlight module. Background technique
  • LED Light-Emitting Diode
  • LEDs As a kind of illuminating light source, it has long service life, high brightness, low energy consumption, no ultraviolet and infrared radiation, and low heat generation. LEDs are widely used in lighting applications, such as LED lighting and LED backlighting, because they are effective in saving energy and can meet the current low-carbon, green, and environmentally-friendly development needs.
  • the conventional LED 11 includes an LED holder 6, an LED chip 1, an electrode 4, a gold wire 2, and a lead 3. Further, the LED holder 6 includes an opaque housing 7, and the housing 7 is provided with a light exit opening 5 for allowing the light emitted from the LED chip 1 to be emitted outward.
  • the LED chip 1 and the electrode 4 are located inside the casing 7, and the LED chip 1 is connected to the electrode 4 through the gold wire 2.
  • a lead 3 is provided outside the casing 7, and the electrode 4 in the casing 7 is connected to the lead 3 outside the casing 7 to be connected to an external circuit through the lead 3. Since the LED 11 is single-sided, the angle of illumination of the LED 11 is limited, resulting in limitations in the application of the LED 11.
  • the present invention provides an LED bracket, an LED including the LED bracket, and a backlight module, wherein the LED assembled by the bracket emits at least two-sided light, thereby increasing the LED
  • the angle of illumination broadens the range of applications for LEDs.
  • the technical solution adopted to solve the technical problem of the present invention is to provide an LED bracket, the bracket includes an opaque housing, and the inside of the housing is provided with a mounting surface for placing at least one LED chip, and the housing is disposed on the housing There are at least two light exit ports, such that light emitted by the LED chip can be emitted from the housing through the at least two light exit ports.
  • the housing is provided with two light exits, and the two light exits are oppositely disposed on the housing.
  • the mounting surface faces an inner wall of the housing that is not provided with a light exit inside the housing.
  • a light reflecting layer is disposed on a surface of an inner wall of the casing.
  • the LED holder further includes a pad disposed on the mounting surface inside the housing, and the pad is used for fixing the LED chip on the mounting surface.
  • the LED bracket further includes an electrode, the electrode is disposed on an inner wall of the housing, and the electrode is electrically connected to the LED chip.
  • the LED holder further includes a pin, the pin is disposed outside the housing, and the pin is electrically connected to the electrode.
  • the present invention also provides an LED comprising at least one LED chip, and further comprising the LED holder described above, the LED chip being disposed on the mounting surface.
  • the LED comprises a plurality of the LED chips, and the plurality of LED chips are arranged in an array of LED chips.
  • the present invention also provides a backlight module including at least one of the above LEDs.
  • the backlight module includes at least two light guiding mechanisms, and the LEDs are disposed between the sides of any two adjacent light guiding mechanisms, and two of the light exits of each of the LEDs are light-emitting.
  • the ports respectively correspond to the side faces of the adjacent light guiding mechanisms.
  • the LED assembled by the bracket can realize at least double-sided illumination, thereby increasing the illumination angle of the LED, thereby broadening the application range of the LED.
  • the LED bracket increases the light exiting port of the LED assembled by the LED bracket, the number of times that the light emitted by the LED chip mounted on the LED bracket is reflected in the LED bracket is reduced, thereby greatly improving the light extraction efficiency.
  • FIG. 1 is a schematic structural view of an LED in the prior art
  • Figure 2 is a perspective view showing a schematic structure of an LED holder in Embodiment 1 of the present invention.
  • Figure 3 is a cross-sectional view of the LED holder in Embodiment 1 of the present invention.
  • FIG. 4 is a front elevational view of a barrier sheet used in a potting process in assembling an LED using an LED bracket in Embodiment 1 of the present invention
  • Figure 5 is a schematic structural view of an LED in Embodiment 3 of the present invention.
  • FIG. 6 is a schematic structural view of a backlight module in Embodiment 4 of the present invention
  • FIG. 7 is a schematic structural view of a backlight module in Embodiment 5 of the present invention.
  • the present embodiment provides an LED holder 6, which includes an opaque housing 7.
  • the interior of the housing 7 is provided with a mounting surface 9 for the placement of at least one LED chip 1.
  • the housing 7 is provided with at least two light exit openings 5 such that light emitted by the LED chips 1 can be emitted from the housing 7 through the at least two light exit openings 5.
  • two housings 5 are disposed on the housing 7 of the LED holder 6.
  • more than two light can be disposed on the housing 7 of the LED bracket 6
  • the LED bracket 6 in this embodiment can realize the double-sided illumination of the LED 11 assembled by the bracket, thereby increasing the illumination angle of the LED 11, thereby broadening the application range of the LED 11.
  • the LED holder 6 increases the light exit opening 5 of the LED 11 assembled by the LED holder 6, the number of times the light emitted from the LED chip 1 mounted on the LED holder 6 is reflected in the LED holder 6 is reduced, thereby greatly improving the light output. effectiveness.
  • the light emitted by the LED chip 1 is non-directional light. If the housing 7 of the LED holder 6 is provided with only one light exit opening 5, most of the light emitted by the LED chip 1 is reflected and absorbed several times in the housing 7 of the LED holder 6, in order to finally emit light through the housing 7. Mouth 5 is shot. If the housing 7 of the LED holder 6 is provided with at least two light exits 5, the number of reflections of light emitted from the LED chips 1 mounted in the LED holders 6 in the housing 7 can be greatly reduced, thereby shortening the optical path. The probability that the non-directional light emitted from the LED chip 1 is emitted from the casing 7 is greatly increased, and the light-emitting efficiency of the light emitted from the LED chip 1 in the LED holder 6 can be improved.
  • the two light exit openings 5 provided on the housing 7 of the LED holder 6 are disposed opposite each other on the housing 7.
  • the two light exit openings 5 are arranged on the opposite sides of the casing 7, the light rays emitted from the casing 7 are symmetrically distributed, thereby enhancing the uniformity of the light emitted by the LEDs 11 assembled by the brackets 6 as a light source.
  • the mounting surface 9 is located inside the housing 7 opposite an inner wall of the housing 7 where the light exit opening 5 is not provided.
  • the LED chip 1 is mounted on the mounting surface 9. Since the mounting surface 9 faces the inner wall of the housing 7 which is not provided with the optical opening 5 in the interior of the housing 7, that is, the light emitting surface of the LED chip 1 faces the inner wall of the housing 7 where the optical opening 5 is not provided, thus the LED is The light emitted by the chip 1 is not directly emitted directly from the inside of the casing 7, but most of the light is reflected inside the casing 7 and mixed to some extent, and then emitted from the light exit port 5 of the casing 7, Thereby, the uniformity of the light emitted from the LED 11 is improved.
  • a light reflecting layer is provided on the surface of the inner wall of the casing 7. Since the light emitted by the LED chip 1 is fan-shaped, the two light exit ports 5 provided on the casing 7 generally do not cover the entire sector-shaped irradiation region corresponding to the light emitted by the LED chip 1, so that the inner wall of the casing 7 is passed.
  • a light reflecting layer is disposed on the surface to reduce the light emitted by the LED chip 1. Energy loss during light transmission inside the casing 7.
  • the LED holder 6 further includes a pad, and the pad is disposed on the mounting surface 9 inside the housing 7.
  • the pads are used to fix the LED chip 1 to the mounting surface 9.
  • the LED chip 1 can be stably mounted in the casing 7 of the LED holder 6 through the pads, so that the electrical connection of the LED chips 1 can be effectively realized.
  • the LED holder 6 further includes an electrode 4, and the electrode 4 is disposed on an inner wall of the housing 7 to be electrically connected to the LED chip 1. More preferably, the electrode 4 is disposed on an inner wall of the housing 7 on which the LED chip 1 is mounted.
  • the LED chip 1 is connected to the electrode 4 by a bonding wire, so that an electrical connection is formed between the LED chip 1 and the electrode 4.
  • the wire is made of gold wire 2. The reason why the gold wire 2 is used is because the gold wire 2 has good stress resistance and good heat dissipation effect.
  • the phosphor 10 is spotted on the LED chip 1, and then the LED chip 1 and the gold wire 2 are dispensed to protect the LED chip 1 and the gold wire 2. It is then baked and sealed by a potting process.
  • the housing 7 of the LED holder 6 in this embodiment includes two light exits 5.
  • the encapsulant is filled by the potting process, it is necessary to place a baffle in the housing 7
  • the encapsulant 12 separates the two light exit openings 5 of the housing 7, and the two portions of the housing 7 that are separated are not connected.
  • the encapsulant is first filled in a portion of the housing 7 separated by the barrier sheets 12. After the end filling is completed and the encapsulant is cured, the baffle 12 is removed, and the encapsulant is filled in another portion of the casing 7. After the encapsulant is cured, the encapsulation of the LED chip 1 in the housing 7 of the LED holder 6 is completed, and finally the LED 11 is obtained.
  • the housing 7 of the LED holder 6 has a recessed portion 8 therein for supporting the spacer piece 12 during the filling.
  • the baffle 12 has a raised portion 13 to cooperate with the lower recess 8 of the housing 7, so that the baffle 12 can stand stably within the housing 7.
  • the mounting surface 9 of the LED chip 1 may be disposed at a central position of the bottom surface of the housing 7, and the lower recess 8 may be disposed in the vicinity of the mounting surface 9 of the LED chip 1 in the housing 7.
  • the LED holder 6 further includes a pin, the pin is disposed on the housing 7, and the pin is electrically connected to the electrode 4.
  • the LEDs 1 1 through which the LED holders 6 can be assembled are electrically connected to an external circuit board.
  • Example 2 The difference between this embodiment and the embodiment 1 is that the housing 7 of the LED holder 6 in the present embodiment is provided with three light exit openings 5, so that the light emitted by the LED chip 1 can be emitted to the housing 7 through the three light exit ports 5. external.
  • a light exit opening 5 is formed in each of the three sides of the housing 7 of the substantially rectangular parallelepiped LED holder 6.
  • one light exit opening 5 may be formed on any three sides of the housing 7 other than the side facing the mounting surface on which the LED chip 1 is mounted.
  • the LED bracket 6 can be used for lamps that require three-sided illumination, such as landscape lighting fixtures. Since the LED 11 assembled by the LED bracket 6 can realize three-sided illumination, the energy consumption is greatly reduced, the heat dissipation effect is good, and the volume is reduced, compared with the conventional three LEDs 1 1 spliced together.
  • Example 3
  • the present embodiment provides an LED 11 including at least one LED chip 1, and further includes the LED holder 6 in Embodiment 1 or Embodiment 2, and the LED chip 1 is disposed on the LED holder 6.
  • the interior of the housing 7 is mounted on the mounting surface 9.
  • the LED 11 includes a plurality of the LED chips 1, and the plurality of LED chips 1 are arranged in an array of LED chips.
  • the array of LED chips can increase the intensity of light emitted by the LEDs 11.
  • the LED 11 further includes an encapsulant that encapsulates the LED chip 1 in the case 7.
  • Example 4
  • the embodiment provides a backlight module including at least one LED 11 as described in Embodiment 3.
  • the backlight module in this embodiment is a direct type backlight module.
  • the LEDs 11 are evenly arranged on the backing plate 14, and a light guide plate 15, a diffusion plate, a diffusion film, a prism film, and the like are disposed at a certain distance above the LED 11.
  • the light emitted from the LED chip 1 in each of the LEDs 11 is emitted outward from the respective light exits 5 of the LED holder 6, and then emitted to the outside of the backlight module through the light guide plate 15, the diffusion plate, the diffusion film, and the prism film, thereby forming uniformity. , no light shadow of the light surface.
  • the embodiment provides a backlight module including at least two light guiding mechanisms.
  • the LEDs 11 as described in Embodiment 3 are disposed between the sides of any two adjacent light guiding mechanisms.
  • the two light exit ports 5 of the light exit ports 5 of the LEDs 11 respectively correspond to the side faces of the adjacent light guides.
  • the light guiding mechanism includes a light guide plate 15 , and each LED 11 has two oppositely disposed light exit ports 5 , and the two light exit ports 5 respectively correspond to the respective two light guide plates 15 respectively.
  • Side 16 Since the LED 11 can emit light at least on both sides, one LED 11 can simultaneously serve as a light source for two adjacent light guiding mechanisms.
  • a large-sized backlight module can be formed by connecting a plurality of medium-sized light guiding mechanisms together. The LED 11 provides light to the light guide plate 15 from the side 16 of the light guide plate 15, which can reduce the thickness of the entire backlight module and reduce the energy consumption of the entire backlight module. Therefore, the backlight module is very suitable for the design of a large-sized backlight module.
  • Known components such as a diffusion plate, a diffusion film, and a prism film may be provided on the LED 11 and the light guiding mechanism. Since the LED 11 has a small volume and is emitted outward by the same LED 11, the light emitted by the LED 11 can be uniformly mixed in the entire backlight module to avoid splicing line spots between the two light guiding mechanisms. It is to be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, but the present invention is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention. These modifications and improvements are also considered to be within the scope of the invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Planar Illumination Modules (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

公开了一种LED支架，该支架（6）包括不透明的壳体（7）。所述壳体（7）的内部设置有用于放置至少一个LED芯片的安装面（9）。所述壳体（7）上设置有至少两个出光口（5），使得所述LED芯片发出的光能够通过所述至少两个出光口（5）从所述壳体（7）射出。该LED支架可以实现由该支架组装的LED至少双面发光，因此增大了LED的发光角度，从而拓宽了LED的应用范围。同时，由于该LED支架使得由其组装的LED的出光口增多，因此减少了安装在LED支架上的LED芯片发出的光在LED支架内反射的次数，从而大大提高了出光效率。

Description

一种 LED支架、 LED以及背光模组 技术领域
本实用新型属于 LED应用技术领域， 具体涉及一种 LED支架、 包括该 LED支架的 LED以及背光模组。 背景技术
随着传统能源的日益短缺和地球环境的恶化， 在照明领域中更 多地需要低能耗、 高环保性能的照明装置。 LED ( Light-Emitting Diode, 发光二极管） 作为一种发光光源具有使用寿命长、 亮度高、 能耗低、无紫外和红外辐射、发热量低等特点。 由于 LED在节约能源 方面效果显著， 能够满足当前低碳、 绿色、 环保的发展需求， 故 LED 广泛应用于照明领域， 比如 LED照明、 LED背光等。
如图 1所示， 传统的 LED 11包括 LED支架 6、 LED芯片 1、 电极 4、 金线 2和引线 3。 另外， 该 LED支架 6包括不透明的壳体 7， 且壳 体 7设置有一个使得 LED芯片 1发出的光可向外发射的出光口 5。LED 芯片 1和电极 4位于壳体 7内部， LED芯片 1通过金线 2与电极 4连 接。 在壳体 7外部设置有引线 3， 壳体 7内的电极 4与壳体 7外部的 引线 3连接， 以通过该引线 3连接到外部电路。 由于该 LED 11为单 面发光， 因此限制了 LED 11的发光角度， 导致 LED 11的应用受到 了局限。 比如说， 在广告牌照明、 家居装饰等场所， 为了增加装饰效 果， 需要增加发光角度， 单面发光的 LED 11则无法满足需要。 另外， LED中的 LED芯片 1的 P/N结区发出的光子是非定向的。单面发光造 成多数光经多次反射而被吸收， 从而出光效率降低。
目前市场上， 通常通过增加同等数量的单面 LED 以便在两个方 向上各布置一个单面 LED来实现双面发光。该方法增加了 LED的使用 数量，从而提高了成本，而且通过该方法制成的 LED发光设备中散热 效果受到不利影响， 因此减少了 LED的使用寿命。 实用新型内容 针对现有技术中存在的上述不足， 本实用新型提供了一种 LED 支架、包括该 LED支架的 LED以及背光模组， 其中， 由该支架组装的 LED至少双面发光， 因此增大了 LED的发光角度， 从而拓宽了 LED的 应用范围。
解决本实用新型技术问题所采用的技术方案是提供一种 LED支 架，该支架包括不透明的壳体，所述壳体的内部设置有用于放置至少 一个 LED芯片的安装面，所述壳体上设置有至少两个出光口，使得所 述 LED芯片发出的光能够通过所述至少两个出光口从所述壳体射出。
优选的是， 所述壳体上设置有两个出光口， 所述两个出光口在 所述壳体上相对设置。
优选的是， 所述安装面在所述壳体内部正对着所述壳体的未设 置出光口的一个内壁。
优选的是， 所述壳体的内壁的表面上设置有光反射层。
优选的是， 所述的 LED支架还包括焊盘， 所述焊盘设置于所述 壳体内部的所述安装面上，所述焊盘用于将 LED芯片固定于所述安装 面上。
优选的是， 所述的 LED支架还包括电极， 所述电极设置于所述 壳体的内壁上， 所述电极与 LED芯片电连接。
优选的是， 所述的 LED支架还包括引脚， 所述引脚设置于所述 壳体外， 所述引脚与所述电极电连接。
本实用新型还提供一种 LED,包括至少一个 LED芯片，还包括上 述的 LED支架， 将所述 LED芯片设置在所述安装面上。
优选的是， 所述 LED包括多个所述 LED芯片， 该多个 LED芯片 排布成 LED芯片阵列。
本实用新型还提供一种背光模组， 包括至少一个上述的 LED。 优选的是， 所述的背光模组， 包括至少两个导光机构， 所述 LED 设置于任意两个相邻的导光机构的侧面之间，每个所述 LED的出光口 中的两个出光口分别对应所述相邻的导光机构的侧面。
本实用新型中的 LED支架， 可以实现由该支架组装的 LED至少 双面发光，因此增大了 LED的发光角度，从而拓宽了 LED的应用范围。 同时， 由于该 LED支架使得由其组装的 LED的出光口增多， 因此减少 了安装在 LED支架上的 LED芯片发出的光在 LED支架内反射的次数， 从而大大提高了出光效率。 附图说明
图 1是现有技术中的 LED的结构示意图；
图 2是本实用新型实施例 1中的 LED支架的示意性结构的透视 图；
图 3是本实用新型实施例 1中的 LED支架的剖面图；
图 4是本实用新型实施例 1中使用 LED支架组装 LED过程中的 灌胶工艺所使用的隔挡片的正视图；
图 5是本实用新型实施例 3中的 LED的结构示意图；
图 6是本实用新型实施例 4中的背光模组的结构示意图； 图 7是本实用新型实施例 5中的背光模组的结构示意图。
图中： 1-LED芯片； 2_金线； 3_引线； 4_电极； 5 -出光口； 6-LED 支架; 7-壳体； 8-下凹部； 9-安装面； 10-荧光粉； 1 1-LED; 12-隔挡 片； 13-凸起部； 14-背板； 15-导光板； 16-导光板侧面。 具体实施方式
为使本领域技术人员更好地理解本实用新型的技术方案， 下面 结合附图和具体实施方式对本实用新型作进一步详细描述。 实施例 1
如图 2至图 4所示，本实施例提供一种 LED支架 6，该支架包括 不透明的壳体 7。所述壳体 7的内部设置有用于放置至少一个 LED芯 片 1的安装面 9。 根据本实用新型， 所述壳体 7上设置有至少两个出 光口 5，使得所述 LED芯片 1发出的光能够通过所述至少两个出光口 5从所述壳体 7射出。
本实施例中， LED支架 6的壳体 7上设置有两个出光口 5。当然， 在其他实施例中， LED支架 6的壳体 7上也可以设置两个以上的出光 本实施例中的 LED支架 6， 可以实现由该支架组装的 LED 11双 面发光， 因此增大了 LED 11的发光角度， 从而拓宽了 LED 11的应用 范围。 同时， 由于该 LED支架 6使得由其组装的 LED 11的出光口 5 增多， 因此减少了在 LED支架 6上安装的 LED芯片 1发出的光在 LED 支架 6内反射的次数， 从而大大提高了出光效率。
LED芯片 1发出的光线为非定向的光线。如果 LED支架 6的壳体 7仅设置有一个出光口 5， 那么 LED芯片 1发出的大多数光在 LED支 架 6的壳体 7内要经过若干次反射和吸收，才能最后经壳体 7的出光 口 5射出。 如果 LED支架 6的壳体 7设置有至少两个出光口 5， 那么 可以极大减少安装在 LED支架 6内的 LED芯片 1发出的光线在壳体 7 内的反射次数， 从而缩短光程。 LED芯片 1发出的非定向光线从壳体 7射出的机率会极大提高，进而可以提高在该 LED支架 6内的 LED芯 片 1发出的光线的出光效率。
优选的是， LED支架 6的壳体 7上设置的两个出光口 5在所述壳 体 7上相对设置。当两个出光口 5布置在壳体 7的相对侧上时，从壳 体 7发出的光线对称分布， 因此增强了由该支架 6组装的 LED 11作 为光源发出的光线的一致性。
优选的是， 所述安装面 9在所述壳体 7 内部正对着所述壳体 7 的未设置出光口 5的一个内壁。 当通过 LED支架 6组装 LED 11时， 将 LED芯片 1安装在安装面 9上。由于安装面 9在壳体 7内部正对着 壳体 7的未设置出光口 5的内壁，也就是 LED芯片 1的出光面正对着 壳体 7的未设置出光口 5的内壁，因此从 LED芯片 1发出的光并没有 全部直接从壳体 7内部直射出来，而是大部分光在壳体 7内部经过反 射并进行了一定程度的混光，再从壳体 7上的出光口 5射出，从而提 高了 LED 11出射光的均匀性。
优选的是， 所述壳体 7 的内壁的表面上设置有光反射层。 由于 LED芯片 1发出的光为扇形辐照，壳体 7上设置的两个出光口 5—般 不会覆盖 LED芯片 1发出光所对应的整个扇形辐照区域，所以通过在 壳体 7的内壁的表面上设置光反射层，可以减少 LED芯片 1发出的光 在壳体 7内部进行光传输时的能量损失。
优选的是， 所述 LED支架 6还包括焊盘， 所述焊盘设置于所述 壳体 7内部的所述安装面 9上。所述焊盘用于将所述 LED芯片 1固定 于所述安装面 9上。 通过焊盘可以将 LED芯片 1稳定地安装于 LED 支架 6的壳体 7内， 从而可以有效地实现 LED芯片 1的电连接。
如图 5所示， 优选的是， 所述 LED支架 6还包括电极 4， 所述电 极 4设置于所述壳体 7的内壁上， 以与所述 LED芯片 1电连接。更优 选地，所述电极 4设置在所述壳体 7的安装有所述 LED芯片 1的内壁 上。 利用焊线将 LED芯片 1与电极 4相连， 使得 LED芯片 1与电极 4 之间形成电路连接。 本实施中焊线采用金线 2。 之所以采用金线 2是 因为金线 2 具有良好的抗应力作用和良好的散热效果。 然后在 LED 芯片 1上点荧光粉 10， 再在 LED芯片 1和金线 2上点胶以对 LED芯 片 1和金线 2进行保护。 随后进行烘烤， 并通过灌胶工艺进行封胶。
如图 2〜4所示， 本实施例中的 LED支架 6的壳体 7包括两个出 光口 5。 在通过灌胶工艺灌注封装胶时， 需要在壳体 7内放置隔挡片
12来将壳体 7的两个出光口 5分隔开， 且壳体 7被分隔开的两部分 不连通。 先在被隔挡片 12分隔开的壳体 7的一部分中灌注封装胶。 待这端灌胶完成且封装胶固化后， 拆除隔挡片 12， 再在壳体 7的另 外一部分中灌注封装胶。 待封装胶固化后完成了 LED芯片 1在 LED 支架 6的壳体 7内的封装， 最终得到 LED 11。 LED支架 6的壳体 7 内有一个下凹部 8，该下凹部 8用于灌胶时支撑隔挡片 12。该隔挡片 12有一个凸起部 13， 以与壳体 7的下凹部 8相配合， 从而使得隔挡 片 12能够在壳体 7内稳定站立。本实施例中， LED芯片 1的安装面 9 可以设置于壳体 7的底面的中心位置处，并且该下凹部 8可以设置于 壳体 7内的 LED芯片 1的安装面 9的近旁。
优选的是， 所述的 LED支架 6还包括引脚， 所述引脚设置于所 述壳体 7夕卜， 所述引脚与所述电极 4 电连接。 通过引脚能够将 LED 支架 6组装成的 LED 1 1与外部的电路板电连通。 实施例 2 本实施例与实施例 1的区别在于， 本实施中的 LED支架 6的壳 体 7上设置有三个出光口 5，使得 LED芯片 1发出的光能够通过三个 出光口 5射出到壳体 7的外部。例如， 在大体上呈长方体结构的 LED 支架 6的壳体 7的任意三个侧面上各开设一个出光口 5。优选地， 可 以在壳体 7的除了与安装有 LED芯片 1的安装面正对着的侧面以外的 任意三个侧面上各开设一个出光口 5。
该 LED支架 6可以用于需要三面发光的灯具， 比如景观装饰灯 具。 由于该 LED支架 6组装成的 LED 11可以实现三面发光， 因此相 比于传统的三个 LED 1 1拼接在一起的灯具而言， 大大降低了能耗， 散热效果好， 并且体积减小。 实施例 3
如图 5所示， 本实施例提供一种 LED 11， 包括至少一个 LED芯 片 1， 还包括上述实施例 1或实施例 2中的 LED支架 6， 所述 LED芯 片 1设置在所述 LED支架 6的壳体 7内部的安装面 9上。
优选的是， 所述 LED 11包括多个所述 LED芯片 1， 该多个 LED 芯片 1排布成 LED芯片阵列。 该 LED芯片阵列可以使得 LED 11发出 的光的强度增强。
优选的是， 所述 LED 11还包括将所述 LED芯片 1封装在所述壳 体 7内的封装胶。 实施例 4
如图 6所示， 本实施例提供一种背光模组， 包括至少一个如实 施例 3中所述的 LED 11。 本实施例中的背光模组为直下式背光模组。 所述 LED 11均匀排布在背板 14上， 且在 LED 11上方一定距离处设 置有导光板 15、 扩散板、 扩散膜和棱镜膜等。 每个 LED 11中的 LED 芯片 1发出的光从 LED支架 6的各个出光口 5向外射出，然后通过导 光板 15、 扩散板、 扩散膜和棱镜膜等射出到背光模组外部， 从而形 成均匀、 无灯影的出光面。 实施例 5
如图 7所示， 本实施例提供一种背光模组， 包括至少两个导光 机构， 如实施例 3中所述的 LED 11设置于任意两个相邻的导光机构 的侧面之间。 所述 LED 11的出光口 5中的两个出光口 5分别对应所 述相邻的导光机构的侧面。
本实施例中，如图 7所示，导光机构包括导光板 15，每个 LED 11 具有两个相对布置的出光口 5，两个出光口 5分别对应相邻的两个导 光板 15各自的侧面 16。 由于该 LED 11至少能够双面发光， 所以一 个 LED 11可以同时作为相邻的两个导光机构的光源。 通过将多个中 尺寸的导光机构连接在一起可形成大尺寸的背光模组。 该 LED 11从 导光板 15的侧面 16为导光板 15提供光， 可以降低整个背光模组的 厚度， 而且可以降低整个背光模组的能耗。 因此， 该背光模组非常适 合用于大尺寸的背光模组的设计。
在 LED 11和导光机构上还可以设置有扩散板、 扩散膜和棱镜膜 等公知部件。 由于该 LED 11的体积较小， 且由同一个 LED 11向外发 光， 所以 LED 11发出的光在整个背光模组内可以均匀混光， 避免出 现两个导光机构之间的拼接线斑。 可以理解的是， 以上实施方式仅仅是为了说明本实用新型的原 理而采用的示例性实施方式，然而本实用新型并不局限于此。对于本 领域内的普通技术人员而言，在不脱离本实用新型的精神和实质的情 况下，可以做出各种变型和改进，这些变型和改进也视为本实用新型 的保护范围。

Claims

权利要求
1. 一种 LED支架， 该支架包括不透明的壳体， 所述壳体的内部 设置有用于放置至少一个 LED芯片的安装面，所述 LED支架的特征在 于，所述壳体上设置有至少两个出光口，使得所述 LED芯片发出的光 能够通过所述至少两个出光口从所述壳体射出。
2. 根据权利要求 1所述的 LED支架， 其特征在于， 所述壳体上 设置有两个出光口， 所述两个出光口在所述壳体上相对设置。
3. 根据权利要求 1所述的 LED支架， 其特征在于， 所述安装面 在所述壳体内部正对着所述壳体的未设置出光口的一个内壁。
4. 根据权利要求 1所述的 LED支架， 其特征在于， 所述壳体的 内壁的表面上设置有光反射层。
5. 根据权利要求 1所述的 LED支架，其特征在于，还包括焊盘， 所述焊盘设置于所述壳体内部的所述安装面上，所述焊盘用于将 LED 芯片固定于所述安装面上。
6. 根据权利要求 1所述的 LED支架，其特征在于，还包括电极， 所述电极设置于所述壳体的内壁上， 所述电极与 LED芯片电连接。
7. 根据权利要求 6所述的 LED支架，其特征在于，还包括引脚， 所述引脚设置于所述壳体外， 所述引脚与所述电极电连接。
8. —种 LED, 包括至少一个 LED芯片， 所述 LED的特征在于， 还包括权利要求广 7任意一项所述的 LED支架，并且将所述 LED芯片 设置在所述安装面上。
9. 根据权利要求 8所述的 LED,其特征在于，包括多个所述 LED 芯片， 该多个 LED芯片排布成 LED芯片阵列。
10. 一种背光模组， 其特征在于， 包括至少一个根据权利要求 8 或 9所述的 LED。
11. 根据权利要求 10所述的背光模组， 其特征在于， 包括至少 两个导光机构，所述至少一个 LED设置于任意两个相邻的导光机构的 侧面之间，每个所述 LED的出光口中的两个出光口分别对应所述相邻 的导光机构的侧面。
PCT/CN2014/076266 2013-07-04 2014-04-25 一种led支架、led以及背光模组 Ceased WO2015000331A1 (zh)

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