WO2014196324A1

WO2014196324A1 - Non-reciprocal circuit element

Info

Publication number: WO2014196324A1
Application number: PCT/JP2014/062801
Authority: WO
Inventors: 勇樹中池; 礼滋中嶋; 敏弘牧野; 大輔大久保
Original assignee: 株式会社村田製作所
Priority date: 2013-06-07
Filing date: 2014-05-14
Publication date: 2014-12-11

Abstract

In order to achieve a lower height and a lower cost and improve the reliability of connection to a circuit board in a non-reciprocal circuit element, a non-reciprocal circuit element is provided with a ferrite-magnet assembly (10) in which on a ferrite (20) to which a direct-current magnetic field is applied by permanent magnets (31, 32), a first center conductor, a second center conductor, and a third center conductor are disposed so as to intersect each other while being insulated from each other. The ferrite (20) has a top surface and a bottom surface which face each other, and side surfaces orthogonal to the top surface and the bottom surface, and the direct-current magnetic field is applied to the first center conductor, the second center conductor, and the third center conductor by the first permanent magnet (31) disposed on the top surface side of the ferrite (20) and the second permanent magnet (32) disposed on the bottom surface side thereof. A plurality of external connection electrodes (41-46) are formed continuously from the side surfaces of the ferrite (20) to the side surfaces of the second permanent magnet (32) while being separate in a horizontal direction, and the respective ends of the first center conductor, the second center conductor, and the third center conductor are connected to the respective plurality of external connection electrodes (41-46).

Description

Non-reciprocal circuit element

The present invention relates to non-reciprocal circuit elements, and more particularly to non-reciprocal circuit elements such as isolators and circulators used in the microwave band.

Conventionally, nonreciprocal circuit elements such as isolators and circulators have a characteristic of transmitting a signal only in a predetermined specific direction and not transmitting in a reverse direction. Utilizing this characteristic, for example, an isolator is used in a transmission circuit unit of a mobile communication device such as a mobile phone.

As this type of non-reciprocal circuit element, Patent Document 1 describes a structure in which a ferrite provided with a central conductor and a permanent magnet are arranged in the thickness direction and these are built in a metal case. The ferrite is sandwiched between a pair of permanent magnets to make the magnetic field distribution of the DC magnetic field uniform. In addition, the metal case serves to improve the magnetic field distribution and to provide a shielding action that reduces the magnetic influence on the peripheral elements. However, in this non-reciprocal circuit element, it is necessary to provide an external connection electrode for mounting on a substrate outside the metal case because the metal case is provided with a high profile (thickness increases). There is a problem that the cost increases.

Japanese Patent Laid-Open No. 11-112208

An object of the present invention is to provide a non-reciprocal circuit device that can achieve a reduction in height and cost, and can improve connection reliability to a circuit board.

The non-reciprocal circuit device according to one aspect of the present invention is
In a non-reciprocal circuit device including a ferrite-magnet assembly in which a first central conductor, a second central conductor, and a third central conductor are arranged to intersect with each other in an insulated state to a ferrite to which a DC magnetic field is applied by a permanent magnet,
The ferrite has a top surface and a bottom surface facing each other, and a side surface orthogonal to the top surface and the bottom surface,
A DC magnetic field is applied to the first center conductor, the second center conductor, and the third center conductor by the first permanent magnet disposed on the top surface side of the ferrite and the second permanent magnet disposed on the bottom surface side,
A plurality of external connection electrodes are continuously formed from the side surface of the ferrite to the side surface of the second permanent magnet, and are divided in the horizontal direction.
The respective ends of the first center conductor, the second center conductor and the third center conductor are connected to the plurality of external connection electrodes;
It is characterized by.

In the nonreciprocal circuit device, since the ferrite having the central conductor disposed between the first and second permanent magnets, the magnetic field distribution of the DC magnetic field is made uniform, and a plurality of external connection electrodes are provided. Is formed continuously from the side surface of the ferrite to the side surface of the second permanent magnet, so that the plurality of external connection electrodes have the same action as the metal case (that is, improvement of magnetic field distribution and shielding action). Thus, since the metal case is not required, the nonreciprocal circuit element can be reduced in height and can be manufactured at low cost. In addition, since the external connection electrode is formed on the side surface of the ferrite, the connection reliability when the nonreciprocal circuit element is mounted on the circuit board using the external connection electrode is improved, and the low profile is impaired. There is no.

According to the present invention, the nonreciprocal circuit element can be reduced in height and cost, and the connection reliability to the circuit board is improved.

It is an equivalent circuit diagram which shows the nonreciprocal circuit element (3 port type circulator) which is 1st Example. It is a graph which shows the circularly polarized magnetic permeability with respect to the magnetic field in a ferrite. It is a disassembled perspective view which shows the structure of the center conductor in the nonreciprocal circuit device which is 1st Example. It is a disassembled perspective view which shows the nonreciprocal circuit device which is 1st Example. (A) is an external perspective view showing a non-reciprocal circuit device according to the first embodiment, and (B) is an external perspective view showing a mounting state (solder fillet formation state) on a circuit board. It is an external appearance perspective view which shows the nonreciprocal circuit element which is a modification of 1st Example. It is an external appearance perspective view which shows the nonreciprocal circuit element (3 port type circulator) which is 2nd Example. (A) is an external appearance perspective view which shows the nonreciprocal circuit element (3 port type circulator) which is 3rd Example, (B) is sectional drawing which shows the mounting state to a circuit board. It is an external appearance perspective view which shows the nonreciprocal circuit element (3 port type circulator) which is 4th Example. (A) is explanatory drawing which shows the 1st mounting form of the nonreciprocal circuit element which is 4th Example, (B) is explanatory drawing which shows the 2nd mounting form. (A), (B), (C) is a perspective view which shows the nonreciprocal circuit device which is a 5th Example, respectively.

Hereinafter, embodiments of the non-reciprocal circuit device according to the present invention will be described with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same member, and the overlapping description is abbreviate | omitted.

(Refer to the first embodiment, FIGS. 1 to 5)
The nonreciprocal circuit device 1A according to the first embodiment is a lumped constant type three-port circulator having the equivalent circuit shown in FIG. That is, the first central conductor 21 (L1), the second central conductor 22 (L2), and the third central conductor 23 (L3) are respectively insulated in the ferrite 20 to which a DC magnetic field is applied in the direction of arrow A by a permanent magnet. It is arranged to intersect at an angle of. One end of the first center conductor 21 is a first port P1, one end of the second center conductor 22 is a second port P2, and one end of the third center conductor 23 is a third port P3. The other ends of the

center conductors

21, 22, and 23 are connected to the ground. Furthermore, capacitive elements C1, C2, and C3 are connected in parallel to the

central conductors

21, 22, and 23, respectively.

Here, one end of the first center conductor 21 is an external connection electrode 41, the other end is an external connection electrode 44, one end of the second center conductor 22 is an external connection electrode 43, and the other end is an external connection electrode 46. The third center electrode 23 has one end as an external connection electrode 45 and the other end as an external connection electrode 42.

Specifically, the 3-port circulator composed of the above-described equivalent circuit is configured by a ferrite / magnet assembly 10 shown in FIG. This ferrite-magnet assembly 10 is a laminate of

insulating layers

11, 12, 13, 14 mainly composed of glass, various conductors, and various electrodes on the top and bottom surfaces of a rectangular microwave ferrite 20. Thus, the ferrite 20 is also provided with a plurality of through-hole conductors and a plurality of electrodes for connecting various conductors provided on the top surface side and the bottom surface side in a coil shape. Further, the first permanent magnet 31 is bonded and fixed to the top surface side of the ferrite 20, and the second permanent magnet 32 is bonded and fixed to the bottom surface side.

Specifically, the

conductors

21a, 21b, and 21c forming the first central conductor 21 (L1) are formed between the insulator layer 12 and the first permanent magnet 31, and the conductors 21d and 21e are formed of the insulator layer 13 and the ferrite 20. It is formed between. An end portion of the conductor 21a is an external lead portion 41a, and an end portion of the conductor 21c is an external lead portion 44a. The other end of the conductor 21a is connected to one end of the conductor 21d via the conductor 21f, and the other end of the conductor 21d is connected to one end of the conductor 21b via the conductor 21g. The other end of the conductor 21b is connected to one end of a conductor 21e via a conductor 21h, and the other end of the conductor 21e is connected to one end of a conductor 21c via a conductor 21i.

The conductors 22a, 22b and 22c forming the second center conductor 22 (L2) are formed between the insulator layer 11 and the ferrite 20, and the

conductors

22d and 22e are formed between the insulator layer 14 and the second permanent magnet 32. Has been. An end portion of the conductor 22a is an external lead portion 43a, and an end portion of the conductor 22c is an external lead portion 46a. The other end of the conductor 22a is connected to one end of the conductor 22d via the conductor 22f, and the other end of the conductor 22d is connected to one end of the conductor 22b via the conductor 22g. The other end of the conductor 22b is connected to one end of a conductor 22e via a conductor 22h, and the other end of the conductor 22e is connected to one end of a conductor 22c via a conductor 22i.

The conductors 23a, 23b and 23c forming the third central conductor 23 (L3) are formed between the

insulator layers

11 and 12, and the conductors 23d and 23e are formed between the

insulator layers

13 and 14. An end portion of the conductor 23a is an external lead portion 42a, and an end portion of the conductor 23c is an external lead portion 45a. The other end of the conductor 23a is connected to one end of the conductor 23d through the conductor 23f, and the other end of the conductor 23d is connected to one end of the conductor 23b through the conductor 23g. The other end of the conductor 23b is connected to one end of a conductor 23e through a conductor 23h, and the other end of the conductor 23e is connected to one end of a conductor 23c through a conductor 23i.

The

center conductors

21, 22, and 23 can be formed as thin film conductors, thick film conductors, or conductor foils, and it is preferable to use a photosensitive metal paste. Insulator layers 11 to 14 are preferably made of photosensitive glass. Capacitance elements C1, C2, and C3 use chip parts.

Here, the external connection electrodes 41 to 46 will be described with reference to FIGS. The

external connection electrodes

41, 42, 43 are formed in the horizontal direction on the first side surface 10 a (the back side in FIG. 5) of the ferrite / magnet assembly 10, and the

external connection electrodes

44, 45, 46 are the first ones. The two side surfaces 10b (front side in FIG. 5) are formed by being divided into three in the horizontal direction. The

external connection electrodes

41, 43, 44, and 46 disposed at the four corners are also formed continuously on the third side surface 10c or the fourth side surface 10d, and the top surface of the first permanent magnet 31 or the second permanent magnet. It is also formed continuously on the lower surface of 32. The

external connection electrodes

42 and 45 arranged at the central position are also formed continuously on the upper surface of the first permanent magnet 31 and the lower surface of the second permanent magnet 32.

The external connection electrode 41 is connected to the external lead portion 41a which is one end of the conductor 21a of the first central conductor 21, and is formed side by side in the conductor 24a (see FIG. 3) formed on the ferrite 20 and in the vertical direction thereof. It is also connected to the existing conductor and is formed continuously over the surfaces of the

permanent magnets

31 and 32. The external connection electrode 42 is connected to the external lead portion 42a, which is one end of the conductor 23a of the third central conductor 23, and is formed side by side in the conductor 24b (see FIG. 3) formed on the ferrite 20 and in the vertical direction thereof. It is also connected to the existing conductor and is formed continuously over the surfaces of the

permanent magnets

31 and 32.

The external connection electrode 43 is connected to the external lead portion 43a which is one end of the conductor 22a of the second central conductor 22, and is formed side by side in the conductor 24c (see FIG. 3) formed on the ferrite 20 and in the vertical direction thereof. It is also connected to the existing conductor and is formed continuously over the surfaces of the

permanent magnets

31 and 32. The external connection electrode 44 is connected to the external lead portion 44a, which is one end of the conductor 21c of the first central conductor 21, and is formed side by side in the conductor 24d (see FIG. 3) formed on the ferrite 20 and in the vertical direction thereof. It is also connected to the existing conductor and is formed continuously over the surfaces of the

permanent magnets

31 and 32.

The external connection electrode 45 is connected to the external lead portion 45a, which is one end of the conductor 23c of the third central conductor 23, and is formed side by side in the conductor 24e (see FIG. 3) formed on the ferrite 20 and in the vertical direction thereof. It is also connected to the existing conductor and is formed continuously over the surfaces of the

permanent magnets

31 and 32. The external connection electrode 46 is connected to the external lead portion 46a which is one end of the conductor 22c of the second central conductor 22, and is formed side by side in the conductor 24f (see FIG. 3) formed on the ferrite 20 and in the vertical direction thereof. It is also connected to the existing conductor and is formed continuously over the surfaces of the

permanent magnets

31 and 32.

The external connection electrodes 41 to 46 are formed of a magnetic material including, for example, Fe, Ni, Co, ferrite, and the like. Preferably, a conductive electrode material (paste) mainly composed of Ag and Cu is applied and baked, a Ni plating layer is formed on the surface, and a plating layer such as Au and Sn is further formed.

When the ferrite / magnet assembly 10 having the above configuration is mounted on the circuit board 50, as shown in FIGS. 4 and 5B, the solder 52 provided on the land 51 on the circuit board 50 is externally attached. The solder fillets are formed by wetting along the connection electrodes 41 to 46.

In the non-reciprocal circuit device 1A, since the ferrite 20 having the

central conductors

21, 22, and 23 disposed therebetween is sandwiched between the

permanent magnets

31 and 32, the magnetic field distribution of the DC magnetic field is naturally made uniform. Since the external connection electrodes 41 to 46 are formed continuously from the side surface of the ferrite 20 to the side surfaces of the

permanent magnets

31 and 32, the plurality of external connection electrodes 41 to 46 have an improved magnetic field distribution and a shielding action. As a result, the metal case used in Patent Document 1 is not necessary, so that the nonreciprocal circuit element 1A can be reduced in height and can be manufactured at low cost.

Moreover, since the thicknesses of the

permanent magnets

31 and 32 sandwiching the ferrite 20 up and down are the same, the magnetic field distribution of the DC magnetic field applied to the ferrite 20 can be made uniform. Moreover, since the entire top and bottom surfaces of the ferrite 20 are covered with the

permanent magnets

31 and 32, the magnetic field distribution is made more uniform.

Next, the operation of the 3-port circulator according to the first embodiment will be described. Here, the high frequency signal input from the second port P2 is output from the first port P1, the high frequency signal input from the first port P1 is output from the third port P3, and input from the third port P3. The high frequency signal is output from the second port P2.

The operation characteristics in the first embodiment will be described with reference to FIG. FIG. 2 shows changes in the circularly polarized magnetic permeability μ ± (H / m) with respect to the magnetic field (A / m). Here, μ + indicates positive circular polarization, and μ− indicates negative circular polarization. In this embodiment, the operation is performed in the low magnetic field region X1 surrounded by the dotted line in FIG. That is, a weak DC magnetic field is applied to the ferrite 20 so as to operate in a region where μ−> μ +> 0. On the other hand, the high magnetic field region X2 applies a strong DC magnetic field to the ferrite 20 so as to operate in a region where μ +> μ−. In the low magnetic field region X1 and the high magnetic field region X2, since the relationship between μ + and μ− is reversed, the flow of the high frequency signal is reversed when the magnetic field application direction is the same. However, when the application direction of the magnetic field is reversed, the transmission path of the high-frequency signal is switched. In other words, the insertion loss characteristic and the isolation characteristic are interchanged.

Here, the magnetic field region is defined as a region where the magnetic field is higher than the magnetic resonance point as a high magnetic field, a region where the magnetic field is lower than the magnetic resonance point, and the μ + circular polarization permeability is positive as a low magnetic field. Are used.

Incidentally, the circularly polarized magnetic permeability is expressed by the following equation (1).

Now, ignoring the loss term, the following equation (2) derived from the previous equation (1) indicates that μ + ′> 0 when the magnetic field strength is below the magnetic resonance point in FIG.

γ: Magnetic rotation ratio μo: Vacuum permeability Hin: Internal magnetic field Ms: Saturation magnetization ω: Angular frequency

Therefore, a lumped constant type circulator that operates in a low magnetic field can be realized by setting the internal magnetic field Hin and the saturation magnetization Ms so as to satisfy the expression (2). By operating with a low magnetic field, the magnetic field applied by the

permanent magnets

31 and 32 can be small, and the

magnets

31 and 32 can be reduced in size. Moreover, since it operates at a position away from the magnetic resonance point, magnetic loss is reduced.

The size of the ferrite 20 is sufficiently smaller than λ / 2 because the conventional waveguide type needs to have a λ / 2 size, whereas the lumped constant type has only to form a necessary inductance. Therefore, it may be λ / 4 or less.

Further, since the operation is low magnetic field, a configuration in which each of the

central conductors

21, 22 and 23 is wound around the ferrite 20 by a plurality of turns is employed in order to ensure necessary inductance. Since the line-shaped conductors 21a to 21e, 22a to 22e, and 23a to 23e formed in each layer are formed in a coil shape via the interlayer connection conductor, each center conductor can be changed by changing the position of the interlayer connection conductor. The length (inductance value) of 21, 22, and 23 can be changed. In addition, by dividing the conductors 21a to 21e, 22a to 22e, and 23a to 23e into the respective layers, the

central conductors

21, 22, and 23 can be arranged at equal distances from the ferrite 20, and the application of the magnetic field becomes uniform. . The insertion loss characteristic and the isolation characteristic can be adjusted by changing the laminated arrangement of the conductors 21a to 21e, 22a to 22e, and 23a to 23e.

In particular, since the ferrite 20 is arranged in a horizontal direction with respect to the circuit board and operated with a low magnetic field, a required applied magnetic field can be reduced, and as a result, the

permanent magnets

31 and 32 can be made thin. it can.

In the first embodiment, the external connection electrodes 41 to 46 are formed continuously over the side surface of the first permanent magnet 31 in addition to the side surface of the second permanent magnet 32, and further, the first permanent magnet 31. The second permanent magnet 32 extends from the side surface to the surface opposite to the ferrite 32. That is, in the first embodiment, since the external connection electrodes 41 to 46 are formed on the side surfaces of the ferrite 20, the connection reliability when the nonreciprocal circuit device 1A is mounted on the circuit board is improved, and the low There is no loss of inversion. Further, since the external connection electrodes 41 to 46 are continuously formed over the side surface of the first permanent magnet 31, the connection strength when mounted on the circuit board is improved.

However, the external connection electrodes 41 to 46 may be formed continuously from at least the side surface of the ferrite 20 to the side surface of the second permanent magnet 32 while being connected to the lead portions 41a to 46a, respectively. Such a nonreciprocal circuit device 1A ′ is shown in FIG. 6 as a modification of the first embodiment.

(Refer to the second embodiment, FIG. 7)
As shown in FIG. 7, the nonreciprocal circuit device 1 </ b> B according to the second embodiment is thinner than the second permanent magnet 31 disposed on the top surface side with the second permanent magnet 32 disposed on the bottom surface side of the ferrite 20. is doing. Other configurations in the second embodiment are the same as those in the first embodiment. Therefore, the operation and effect of the second embodiment is the same as that of the first embodiment. In addition, by making the second permanent magnet 32 on the bottom side thinner, the parasitic inductance generated in the external connection electrodes 41 to 46 is reduced. In addition, the height of the non-reciprocal circuit device 1A of the first embodiment is reduced.

(Refer to the third embodiment, FIG. 8)
As shown in FIG. 8A, the non-reciprocal circuit device 1C according to the third embodiment has the ferrite-magnet assembly 10 disposed upside down in the vertical direction as compared with the first embodiment, Both side portions of the arranged second permanent magnet 32 are notched, and the external connection electrodes 41 to 46 are formed by folding back to the top surface side of the ferrite 20 so that the folded portion is exposed to the peripheral portion of the ferrite 20. Is.

As shown in FIG. 8B, the circuit board 50 has a recess 55 formed therein. The recess 55 has a slightly larger area than the ferrite / magnet assembly 10, and lands 51 are arranged at positions corresponding to the external connection electrodes 41 to 46. The nonreciprocal circuit element 1C is mounted on the circuit board 50 by connecting the external connection electrodes 41 to 46 to the lands 51 with solder 52 in a state where the second permanent magnet 32 is embedded in the recess 55. Since the second permanent magnet 32 is embedded in the circuit board 50, the reduction in the height of the nonreciprocal circuit element 1C during mounting is further promoted.

(Refer to the fourth embodiment, FIGS. 9 and 10)
As shown in FIG. 9, the nonreciprocal circuit device 1D according to the fourth embodiment has external connection electrodes 41 to 46 extending from both side surfaces of the ferrite / magnet assembly 10 to the upper surface of the permanent magnet 31 and the lower surface of the permanent magnet 32. The other configurations are the same as those of the first embodiment. In the fourth embodiment (as in the other embodiments), three external connection electrodes 41 to 46 are provided on the first and second side surfaces of the ferrite magnet assembly 10 facing each other. It is formed at a rotationally symmetric position of 180 degrees.

More specifically, the external connection electrode 41 connected to the port P1 of the first central conductor 21 and the external connection electrode 44 connected to the ground port are arranged at a rotationally symmetric position of 180 degrees (see FIG. 10). ). The external connection electrode 43 connected to the port P2 of the second center conductor 22 and the external connection electrode 46 connected to the ground port are arranged at a rotationally symmetric position of 180 degrees. Further, the external connection electrode 45 connected to the port P3 of the third central conductor 23 and the external connection electrode 42 connected to the ground port are disposed at a rotationally symmetric position of 180 degrees.

According to the above electrode arrangement, when the nonreciprocal circuit element 1D is mounted on the circuit board in the state of FIG. 10A, one end of the external capacitive elements C1, C2, C3 is connected to the

electrodes

41, 43, 45. When the other end is connected to the ground and the

electrodes

42, 44, 46 are connected to the ground, the

electrodes

41, 43, 45 are on the hot side, and the

electrodes

42, 44, 46 are on the ground side. At this time, the signal flows from the electrode 41 (port P1) to the electrode 45 (port P3) and from the electrode 45 (port P3) to the electrode 43 (port P2). However, if the application direction of the DC magnetic field is reversed, the signal flow is reversed.

On the other hand, when this nonreciprocal circuit device 1D is mounted on a circuit board by rotating 180 degrees in plan view as shown in FIG. 10B, the combination of the

electrodes

41, 44 and 43, 46 and 42, 45 is Although not changed, the

electrodes

42, 44, and 46 are on the hot side, and the

electrodes

41, 43, and 45 are on the ground side. In this case, the signal flows from the electrode 44 (port P1) to the electrode 42 (port P3) and from the electrode 42 (port P3) to the electrode 46 (port P2). That is, since the direction of signal flow seen from the circuit board including the capacitive elements C1, C2, and C3 does not change, the nonreciprocal circuit element 1D is rotated by 180 degrees and the circuit shown in FIG. 10A or FIG. Regardless of the mounting direction, the signal flow is the same.

Therefore, the nonreciprocal circuit element 1D functions as a circulator with the same signal flow regardless of the orientation on the circuit board. Since the function as a circulator does not change even if it is mounted in any direction, it is not necessary to align the direction of the nonreciprocal circuit element 1D in the mounting process, and the cost during mounting can be reduced.

(Refer to the fifth embodiment, FIG. 11)
As shown in FIGS. 11A, 11B, and 11C, the nonreciprocal circuit device 1E according to the fifth embodiment includes a conductive material (for example, Cu) on the external connection electrodes 41 to 46. Terminals 51 to 56 made of a metal material as a main component) are joined via a solder material or the like. By providing the metal terminals 51 to 56, the connection reliability of the circuit board to the land is improved.

The terminals 51 to 56 shown in (A) are straight plate-like bodies. With such a shape, the manufacturing cost of the metal terminals can be suppressed. Terminals 51 to 56 shown in (B) are bent outward on the same plane as the lower surface of the ferrite / magnet assembly 10 at the bottom. With such a shape, the nonreciprocal circuit element can be more firmly mounted on the substrate. Terminals 51 to 56 shown in (C) are bent at the lower part so as to wrap around the lower surface of the ferrite / magnet assembly 10. With such a shape, the nonreciprocal circuit element can be firmly mounted on the substrate with a smaller area as compared with the shape of the metal terminal shown in FIG.

In the fifth embodiment, a resin material is filled between the

terminals

51 and 52 and between the

terminals

52 and 53 to integrate the

terminals

51, 52 and 53 in advance. The

terminals

54, 55, 56 may be integrated in advance by filling a resin material between the

terminals

55, 56, respectively. In this way, if the

terminals

51, 52, 53 and the

terminals

54, 55, 56 integrated with the resin material are used, the process for fixing the terminals 51 to 56 to the ferrite / magnet assembly 10 is simplified. The

(Other examples)
The nonreciprocal circuit device according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof.

For example, the configuration and shape of the central conductor are arbitrary. Further, the capacitive element or the like may be constituted by a conductor built in the circuit board in addition to being mounted on the circuit board as a chip type.

As described above, the present invention is useful for non-reciprocal circuit elements, and is particularly excellent in that it can achieve a reduction in height and cost, and improve the reliability of connection to a circuit board.

DESCRIPTION OF SYMBOLS 1A-1E ... Nonreciprocal circuit element 10 ... Ferrite magnet assembly 20 ... Ferrite 21 ... 1st center conductor 22 ... 2nd center conductor 23 ...

3rd center conductor

31, 32 ... Permanent magnet 41-46 ... External connection electrode 50 ... Circuit boards 51 to 56 ... Terminals P1, P2, P3 ... Ports

Claims

In a non-reciprocal circuit device including a ferrite-magnet assembly in which a first central conductor, a second central conductor, and a third central conductor are arranged to intersect with each other in an insulated state to a ferrite to which a DC magnetic field is applied by a permanent magnet,
The ferrite has a top surface and a bottom surface facing each other, and a side surface orthogonal to the top surface and the bottom surface,
A DC magnetic field is applied to the first central conductor, the second central conductor, and the third central conductor by the first permanent magnet disposed on the top surface side of the ferrite and the second permanent magnet disposed on the bottom surface side,
A plurality of external connection electrodes are continuously formed from the side surface of the ferrite to the side surface of the second permanent magnet, and are divided in the horizontal direction.
The respective ends of the first center conductor, the second center conductor and the third center conductor are connected to the plurality of external connection electrodes;
A nonreciprocal circuit device characterized by the above.
The nonreciprocal circuit device according to claim 1, wherein the external connection electrode is formed continuously over a side surface of the first permanent magnet.
The nonreciprocal circuit device according to claim 1 or 2, wherein the first permanent magnet and the second permanent magnet have the same thickness.
The nonreciprocal circuit device according to claim 1 or 2, wherein the second permanent magnet is thinner than the first permanent magnet.
5. The nonreciprocal circuit device according to claim 1, wherein the top and bottom surfaces of the ferrite are entirely covered with a first permanent magnet and a second permanent magnet.
5. The nonreciprocal circuit according to claim 1, wherein the second permanent magnet is cut out so as to expose the plurality of external connection electrodes to a peripheral edge portion of the ferrite. 6. element.
The external connection electrode is extended from a side surface of the first permanent magnet or the second permanent magnet to a surface opposite to the ferrite, according to any one of claims 1 to 6. Non-reciprocal circuit element.
Three external connection electrodes are formed on the first side surface and the second side surface of the ferrite / magnet assembly facing each other in plan view,
The external connection electrodes connected to the respective input / output ports of the first central conductor, the second central conductor, and the third central conductor and the external connection electrodes connected to the respective ground ports are 180 degree rotationally symmetric positions, respectively. Being placed in the
The nonreciprocal circuit device according to any one of claims 1 to 7, wherein
The ferrite magnet assembly has an internal magnetic field and saturation magnetization set so as to satisfy the following formula:

The nonreciprocal circuit device according to claim 1, wherein: γ: magnetic rotation ratio μo: vacuum permeability Hin: internal magnetic field Ms: saturation magnetization ω: angular frequency