Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/20—Light sources comprising attachment means
  • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/20—Light sources comprising attachment means
  • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
  • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb

Definitions

• the present disclosure relates to the field of lamps. More particularly, the present disclosure relates to LED PAR lamps.
• Incandescent or halogen parabolic aluminized reflector lamps also known as PAR lamps, produce an intense pool of focused light, As a result, PAR lamps are commonly used in a variety of applications, including commercial and residential. Incandescent and halogen bulbs, however, may be less efficient and less effective than an LED bulbs, and are therefore commonly replaced with more efficient and more effective LED bulbs.
• An LED light source is more compact in size and the lumen output is more sensitive to operating temperature.
• An LED lamp may therefore require heat dissipating features for adequately dissipating heat to prevent the LED from overheating and failing, which an incandescent lamp may not require.
• a heat dissipating features such as a heat sink with fins surrounding the outside of the heat sink or surrounding the optic at the surface of the lamp, alters the appearance of the PAR lamp which may not be desirable.
• An LED lamp includes an LED assembly including a plurality of LEDs.
• the LED lamp includes a circular base plate in thermal communication with the LED assembly.
• the LED lamp includes an electrical module electrically coupled to the LED assembly and configured to supply power to the LED assembly.
• the LED lamp includes a lamp body coupled to and in thermal communication with the base plate at a first end and concealing at least a portion of the electrical module at a second end.
• the lamp body includes a substantially smooth surface extending from the base plate to the electrical module.
• the Led lamp includes an optic configured to disperse light generated by the LED assembly.
• the LED lamp includes a transparent optic holder surrounding the optic, coupled to the first end of the lamp body, and configured to support the optic.
• the transparent optic holder has an outer circumference substantially equal to a circumference of the first end of the lamp body and an inner circumference substantially equal to a circumference of the optic.
• a PAR lamp includes an LED module including a plurality of LEDs.
• the PAR lamp includes an electrical module configured to supply power to the LED module.
• the PAR lamp includes a heat sink assembly including a thermally conductive base and a smooth-surfaced thermally conductive body.
• the LED module is in thermal communication with and coupled to a first side of the thermally conductive base.
• the electrical module is coupled to a second side of the thermally conductive base, opposite the LED module.
• the smooth-surfaced thermally conductive body is configured to extend the length of the heat sink, from the thermally conductive base to the electrical module, and to conceal at least a portion of the electrical module.
• the PAR lamp also includes an optic module coupled to the first side of the smooth-surfaced thermally conductive body and having an outer circumference substantially equal to a circumference of the first side of the smooth-surfaced thermally conductive body.
• the optic module includes an optic configured to disperse light generated by the LED module and a transparent ring surrounding the optic.
• Fig. 1A illustrates a side view of an example smooth LED PAR lamp.
• Fig. IB illustrates a top view of an example smooth LED PAR lamp.
• FIG. 2. Illustrates an exploded isometric view of an example LED PAR lamp
• Figs. 1A illustrate a side view of an example smooth LED PAR lamp 100 (hereinafter referred to as lamp).
• Lamp 100 includes a lamp body 102 that extends from an electrical module 104 to an optic assembly 106.
• Lamp body 102 has a smooth surface, meaning it does not include any fins, ridges, or any other protruding elements.
• Lamp body may be constructed of thermo-plastic, plastic, aluminum, or other suitable material capable of dissipating heat away from lamp 100.
• Fig. 2B illustrates a top view of lamp 100 including optic assembly 106.
• Optic assembly 106 includes an optic 108 for dispersing light generated by lamp 100.
• Optic assembly 106 also includes an optic holder 110 that surrounds optic 108 and supports optic 108.
• Optic holder 110 is either transparent or semi-transparent.
• Optic holder 110 can be made of plastic, glass, or other suitable transparent or semi-transparent material.
• Optic assembly 106 covers the entire top surface of lamp 100. In other words, no fins, ridges or any other elements are exposed at the top of lamp 100, other than optic assembly 106. In addition, because optic holder 110 is either transparent or semi- transparent, optic assembly 106 covering the entire top surface of lamp 100 creates the appearance of light being dispersed across the entire surface of lamp 100, even though the center portion, or optic 108, is the only portion of optic assembly 106 is dispersing light.
• Optic holder 1 10 may be smooth or textured. Additionally, optic assembly 106 may be manufactured as a single structure including both optic 108 and optic holder 110 or optic assembly 106 may be manufactured as two independent pieces that fit together, as is illustrated in Fig. 2.
• FIG. 2 illustrates an exploded isometric view of the example lamp 100 of Figs. 1A and IB.
• Lamp 100 has an LED assembly 112 which includes a group of LEDs 114 for generating light.
• LED assembly 1 12 is secured to a base plate 1 16 at a first side, or at a top side.
• LED assembly 1 12 is secured to base plate 116 using mounting hardware 1 18 in the example illustrated, it should be understood that LED assembly 112 may be secured to base plate 116 using an adhesive or with other suitable means.
• the example base plate 1 16 is illustrated as being circular, base plate 116 may include other suitable shapes.
• Base plate 1 16 is made of a material that can dissipate heat into surrounding air, such as a thermo plastic, aluminum or other suitable material. Accordingly, base plate 1 16 is in thermal communication with LED assembly 1 12 and acts to dissipate heat away from LED assembly 1 12 when in contact with LED assembly 112.
• base plate 1 16 has a flat center region 120 and a sloping outer region 122.
• Flat center region 120 may have hardware holes 122 for receiving mounting hardware 118.
• Base plate 1 16 also has one or more wire holes 124 for receiving wires 126 and other suitable electrical connections made between electrical module 104 and LED assembly 1 12.
• electrical module 104 includes mounting holes 128 for receiving mounting hardware 118. Accordingly, electrical module 104 may be secured to an end of base plate 1 16, opposite to LED assembly 112. In another example, electrical module 104 may be configured to snap in to lamp body 102.
• Lamp body 102 is connected to base plate 116 at a first end of lamp body 102.
• Base plate 116 has a circumference substantially equal to the circumference of a top end of the lamp body 102. Accordingly, lamp body 102 and base plate 116 form a tight fit, or connection, so that heat is transferred from base plate 116 to lamp body 102, and thereafter dissipated to surrounding air.
• base plate 116 is configured to snap into the lamp body 102 and securely connect to lamp body 102 without additional hardware or adhesive material.
• hardware may be used (not shown) or adhesive material may be applied (not shown) to secure base plate 1 16 to lamp body 102.
• lamp body 102 and base plate 116 are manufactured as a single structure, and therefore a mechanical connection is not required.
• lamp body 102 is cone-shaped meaning that the circumference of the first end of lamp body 102, or the top, is greater than the circumference of the second end of lamp body 102, or the bottom. It another example, lamp body 102 may be cylindrical shaped such that the circumference at the top is the substantially the same as the circumference at the bottom.
• Lamp body 102 conceals wires 126 and other suitable electrical connections made between electrical module 104 and LED assembly 112.
• Lamp body 102 has a circumference at the bottom that is substantially the same as the circumference of the electrical module 104.
• Lamp body 102 overlaps with and conceals at least a portion of electrical module 104.
• Lamp body 102 also overlaps with and conceals at least a portion of base plate 116.
• the smooth surface of lamp body 102 extends from base plate 116 to electrical module 104, giving lamp 100 a smooth appearance without any fins, ridges, or other elements protruding from lamp 100.
• flat center region 118 is depressed, or indented into the hollow center of lamp body 102. This indentation provides sufficient room for positioning optic 108 above LED assembly 112 so that optic 108 may disperse light generated by LEDs 114.
• LEDs 114 of LED assembly 112 are arranged right up against one another or adjacent to one another. Positioning LED's closely together reduces the surface area of the LED assembly 112 which reduces the depth requirement of optic 108.
• Lamp 100 includes a transparent optic ring, or holder 1 10 surrounding optic 108 and coupled to the first end, or the top of lamp body 102.
• Transparent optic holder 1 10 supports optic 108.
• optic 108 may be snapped in to connect to transparent optic holder 110 or may be secured to transparent optic holder 110 using other suitable fastening means such as an adhesive or hardware (not shown).
• Transparent optic holder 110 has an outer circumference substantially equal to a circumference of the first end or top of lamp body 102 and an inner circumference substantially equal to a circumference of optic 108.
• optic 108 and transparent optic holder 110 are manufactured as a single assembly and therefore do not require coupling.

Landscapes

• Engineering & Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Optics & Photonics (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)
• Led Device Packages (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Priority Applications (4)

Applications Claiming Priority (2)

Publications (1)

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Citations (6)

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• 2013
  • 2013-04-19 US US13/866,577 patent/US9033544B2/en active Active
• 2014
  • 2014-04-18 JP JP2016509120A patent/JP6283409B2/ja active Active
  • 2014-04-18 GB GB1516788.5A patent/GB2527692A/en not_active Withdrawn
  • 2014-04-18 CN CN201480022104.0A patent/CN105247648B/zh active Active
  • 2014-04-18 CA CA2908317A patent/CA2908317C/en active Active
  • 2014-04-18 WO PCT/US2014/034616 patent/WO2014172614A1/en not_active Ceased

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