WO2014166038A1 - Appareil semi-conducteur organique - Google Patents

Appareil semi-conducteur organique Download PDF

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Publication number
WO2014166038A1
WO2014166038A1 PCT/CN2013/073835 CN2013073835W WO2014166038A1 WO 2014166038 A1 WO2014166038 A1 WO 2014166038A1 CN 2013073835 W CN2013073835 W CN 2013073835W WO 2014166038 A1 WO2014166038 A1 WO 2014166038A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic semiconductor
semiconductor device
encapsulation layer
organic
gel
Prior art date
Application number
PCT/CN2013/073835
Other languages
English (en)
Chinese (zh)
Inventor
刘大佼
杨之光
Original Assignee
Liu Tajo
Yang Chihkuang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liu Tajo, Yang Chihkuang filed Critical Liu Tajo
Priority to PCT/CN2013/073835 priority Critical patent/WO2014166038A1/fr
Publication of WO2014166038A1 publication Critical patent/WO2014166038A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a semiconductor device; and more particularly to an organic semiconductor device.
  • OLED organic light emitting diodes
  • PLED polymer light emitting diodes
  • O solar cells batteries
  • OPVs organic photovoltaics
  • thin solar cells thin fi lm photovoltaic
  • flexible liquid crystals Flexible LCD, electric paper, etc.
  • a gas barrier film (ga s barr i er film) is a recent and widely adopted improvement method for protecting components in organic electronic products from water oxygen and oxygen in the air. Interference, thereby maintaining their functionality and extending their useful life.
  • the two phases cannot be balanced in the process, or the surface quality of the substrate is uneven, resulting in a film. Poor surface roughness and defects in various sizes.
  • the present invention provides an organic semiconductor device comprising: a first encapsulation layer; a second encapsulation layer corresponding to the first encapsulation layer and defined between the first encapsulation layer An internal space; a substrate disposed in the internal space; an organic semiconductor component disposed on the substrate and located in the internal space; and a solid body filled in the internal space for mating
  • the first encapsulation layer and the second encapsulation layer seal the organic semiconductor element.
  • the first and second encapsulating layers of the gel are used to block moisture or gas from the external environment.
  • the first encapsulation layer and the second encapsulation layer are a substance having a plurality of static pores.
  • the gel is used to fill a portion of the plurality of static pores, wherein the gel is a substance having no static pores.
  • the gel is a liquid substance or a colloidal substance.
  • the liquid substance is a polar or non-polar liquid.
  • the liquid substance is a non-polar liquid.
  • the liquid substance may also be a non-volatile liquid, and the non-volatile liquid may be selected from the group consisting of a lubricating oil, a silicone oil, a glycerin, an ionic liquid, a non-edible soybean oil and a non-volatile organic alcohol. Group.
  • the gel is added with an anti-corrosion additive.
  • the first encapsulation layer and/or the second encapsulation layer are made of a polymer material. More specifically, the substrate is made of the same material as the first encapsulation layer and the second encapsulation layer.
  • the organic semiconductor component is one selected from the group consisting of an organic light emitting diode, a polymer light emitting diode, an organic solar cell, and an organic thin film transistor.
  • the organic semiconductor device of this embodiment further includes at least one lead connecting the organic semiconductor element and an external component.
  • the condensate is added with an anti-corrosion additive.
  • the at least one pin comprises a protective coating.
  • the first encapsulation layer and the second encapsulation layer are thermocompression bonded around the inner space. More specifically, a portion of the at least one pin is clamped to the thermal compression of the first encapsulation layer and the second encapsulation layer.
  • the organic semiconductor device further includes an adhesive for bonding between the first encapsulation layer and the second encapsulation layer, and defining the Internal space. Additionally, the at least one pin is connected to the outer component through the sealant.
  • the sealant comprises an ultraviolet curable resin or a solid material, and the solid material may be a metal material, an organic material or an inorganic material.
  • the invention utilizes a liquid or gel-like gel to encapsulate the organic semiconductor component in the first and second encapsulation layers, so that the gel fills the first and second packages on the interface with the encapsulation layer
  • the plurality of static pores of the layer portion thereby blocking moisture of the organic semiconductor element by moisture or gas blocking the external environment. Accordingly, the present invention achieves the object of the present invention by merely forming a solid-liquid interface to effectively block the erosion of the organic semiconductor element by moisture or gas in the external environment.
  • FIG. 1 is a cross-sectional view showing an organic semiconductor device according to a preferred embodiment of the present invention
  • FIG. 2 is a schematic plan view of the organic semiconductor device of FIG. 1;
  • 3 is a cross section of an organic semiconductor device according to another preferred embodiment of the present invention. detailed description
  • FIG. 1 is a cross-sectional view of an organic semiconductor device in accordance with a preferred embodiment of the present invention.
  • the organic semiconductor device 10 of the present invention includes a first encapsulation layer 120, a second encapsulation layer 140, a substrate 150, an organic semiconductor device 160, and a conden s ed mater 180.
  • the second encapsulation layer 140 is disposed corresponding to the first encapsulation layer 120, and defines an internal space 130 between the first encapsulation layer 120 and the first encapsulation layer 120.
  • the first encapsulation layer 120 and/or the second encapsulation layer 140 are made of a polymer material.
  • the first encapsulation layer 120 and the second encapsulation layer 140 are made of the same material.
  • the present invention is not limited thereto, and the first encapsulation layer 120 and the second encapsulation layer 140 may also be two different materials.
  • the first encapsulation layer 120 and the second encapsulation layer 140 are made of a flexible material, which may be polyethylene (PE), polyethylene terephthalate (PET), or polypropylene. (PP), polyvinyl chloride (PVC), etc.
  • PET and PE materials are often used, and because PET materials are cheaper and have certain cost advantages, they are more commonly used for soft electronic products.
  • the material has a transmittance of more than 85%.
  • the substrate 150 is disposed in the internal space 130 formed by the first encapsulation layer 120 and the second encapsulation layer 140.
  • the substrate 150 is made of the same material as the first encapsulation layer 120 and the second encapsulation layer 140, for example, a flexible polymer material.
  • the organic semiconductor device 160 is disposed on the substrate 150 and located inside the substrate Between 130. Further, the organic semiconductor device 160 is selected from the group consisting of an organic light emitting diode (OLED), a polymer light emitting diode (PLED), an organic solar cell (PVC), and an organic thin film transistor (OFFF). One of the groups.
  • OLED organic light emitting diode
  • PLED polymer light emitting diode
  • PVC organic solar cell
  • OFFF organic thin film transistor
  • the organic semiconductor device 160 is an organic light emitting diode having a multilayer structure such as an anode, a cathode, a hole transport layer, a light emitting layer and an electron transport layer, which are well known to those skilled in the art (not shown). , I will not repeat them here.
  • the substrate 150 is of the same material as the first encapsulation layer 120 and the second encapsulation layer 140, for example, a flexible polymer material.
  • the body 180 is filled in the internal space 130 for sealing the organic semiconductor element 160 with the first encapsulation layer 120 and the second encapsulation layer 140. Accordingly, the condensed body 180 cooperates with the first encapsulation layer 120 and the second encapsulation layer 140 to block the external environment from moisture or gas from eroding the organic semiconductor device 160.
  • the uppermost and lowermost layers of the organic semiconductor device 160 are electrodes.
  • the uppermost layer is aluminum and the lowermost layer is an IT0 transparent electrode, and the uppermost layer electrode contacts the gel 180.
  • the lowermost layer electrode also contacts the gel due to the lead wire being closed. 180.
  • the condensed body 180 may be added with an anti-corrosion additive to further prevent corrosion or aging of the surface electrode of the organic semiconductor element 160, such as: an antioxidant, or for a specific metal (eg, : Corrosion inhibitor of aluminum electrode) makes the surface electrode of organic semiconductor element 160 extremely resistant to oxidation or metal ion elution, and electrochemical cell reaction does not occur.
  • an anti-corrosion additive such as: an antioxidant, or for a specific metal (eg, : Corrosion inhibitor of aluminum electrode) makes the surface electrode of organic semiconductor element 160 extremely resistant to oxidation or metal ion elution, and electrochemical cell reaction does not occur.
  • anion is added to the gel 180.
  • Surfactant such as: Hexadecyl sulphate sodium salt, Dodecy 1 benzene sulfonate sodium salt, or Additional hexavalent ion (eg, heavy acid salt) to form Chromate conversion coatings on aluminum metal surfaces , can protect the surface of the semiconductor element 160 aluminum electrode.
  • a protective coating may be formed on the surface electrode of the organic semiconductor element 160 in advance for protection. Since IT0 itself is more resistant to aluminum metal corrosion, no special anti-corrosion scheme is required, but as the composition of the gel 180 is different, a corrosion inhibitor for ICO corrosion can be added as needed.
  • the first encapsulation layer and the second encapsulation layer are a substance having a plurality of static pores, and the static pores may be a free volume between molecules or a defect in its structure.
  • the solid body 180 forms a junction with the first encapsulation layer 120 and the second encapsulation layer 140 around the inner space 130, and the gel 180 is used to fill the plurality of static apertures adjacent to the junction portion. , in order to form a junction of high barrier performance.
  • the foregoing condensed body 180 is formed of a substance which is not solid or has a continuous phase, such as a liquid substance or a colloidal substance. Therefore, the solid body 180 can fill a portion of the static pores of the first and second encapsulation layers 120, 140 close to the junction. Thereby, when the moisture or gas of the external environment (especially oxygen) passes through the path of the static pores in the first and second encapsulating layers 120, 140, a high concentration gradient is formed near the barrier interface, It is not conducive to the diffusion phenomenon required for moisture or gas to enter the condensed body 180, and thus the moisture or gas of the external environment is more difficult to enter the condensed body 180.
  • the gel 180 is a substance having no static pores.
  • the condensed body 180 is a liquid substance or a colloidal substance, wherein the liquid substance is a pole A non-polar liquid, preferably a non-polar liquid.
  • the solid body 180 of the present invention mainly utilizes the continuity of the liquid to achieve the effect of blocking water and gas.
  • the liquid selected for the gel 180 can be a volatile liquid, a non-volatile liquid or a flowable colloid.
  • the thickness of the gel 180 is between 10 and 100 ⁇ .
  • the condenser 180 is preferably a non-volatile liquid, and the non-volatile liquid may be selected from the group consisting of a lubricating oil, a silicone oil, a glycerin, an ionic liquid, a non-edible soybean oil, and a non-volatile organic alcohol.
  • the gel 180 of the present invention may also be a volatile liquid or a flowable colloid, and substantially the material used for the gel 180 may be the same as the first encapsulation layer 120 and the second package.
  • Layer 140 The material has good compatibility, and the invention is not limited to the above materials.
  • the invention is not limited to practice with only non-polar liquids.
  • the gel 180 may further comprise or add polar molecules.
  • Polar molecules may include hydrogen bonding molecules, compliant functional group molecules or charged ions.
  • the effect of the barrier can be further improved, and there is a strong force between the gas molecules and the liquid molecules, so that moisture or gas (especially oxygen is adsorbed to the first and second encapsulating layers 120, 140 and the gel) 180 barrier surfaces are formed, and due to the aforementioned strong force, the gas or gas (especially oxygen) is not easily separated from the interface, which is not conducive to the diffusion of moisture or gas (especially oxygen) and its absorption by the gel 180. That is, the diffusion phenomenon is thus greatly reduced. Therefore, according to the polar molecules in the foregoing embodiments of the present invention, the effect of the moisture or gas of the external environment on the erosion of the organic semiconductor element 160 can be further reduced.
  • the selected colloid 180 may further comprise or add at least one chemical molecule, the chemical molecule comprising a specific functional group for use in moisture Water molecules produce hydrogen bonds or produce polar molecules.
  • the chemical molecule may also include a specific functional group for oxygen molecules in oxygen, and the following figure is an example of a coordination compound with oxygen molecules (for example, Heme Heme):
  • the selected body 180 may further include or add a plurality of polar molecules.
  • the moisture or gas (especially oxygen) is adsorbed to the selected colloid 180, and due to the aforementioned strong force, the diffusion coefficient thereof is lowered, and the transmittance of the control gas molecules is lowered.
  • the present invention can control the formulation to control the penetration of different gas molecules, and thus in embodiments of the invention, the package structure has different transmittance characteristics for at least two gas molecules.
  • the package structure provided by the present invention can be manufactured by a wet coating process, but the invention realizes the use of the junction between the first and second encapsulation layers 120, 140 and the gel to form a barrier.
  • the wet coating process may be a wire bar coating process, a blade coating process, a roller coating process, a dip coating process, a rotary coating process, or a precision slit coating process.
  • Any coating method such as a curtain coating process or a slant-plate coating is produced in the form of a sheet-to-sheet (pi ec e by pie ce ) or a roll-to-roll (ro llto ro ll ).
  • a gel is applied to the first and second encapsulating layers 120 and 140 by a wet coating process, which is suitable for mass production because of low cost.
  • the object of the present invention can be achieved by forming at least one joint surface to effectively block moisture or gas from the external environment.
  • FIG. 1 and FIG. 2 are schematic plan views of the organic semiconductor device of FIG. 1.
  • the first encapsulation layer 120 and the second encapsulation layer 140 are thermocompression bonded around the inner space 130, thereby forming a rectangular inner space 130 as shown in FIG.
  • the organic semiconductor device 10 of the present embodiment further includes at least one pin 190 that connects the organic semiconductor device 160 and an external component (not shown).
  • the pins 190 are respectively connected to the anode and the cathode of the organic semiconductor element 160 implemented by the OLED, thereby providing power required for light emission.
  • the pin 190 is preferably a very thin copper foil, such that a portion of the at least one pin 190 is hot pressed by the first encapsulation layer 120 and the second encapsulation layer 140. Cohesive without affecting the tightness of hot pressing.
  • the gel 180 may be added with an anti-corrosion additive to further prevent the metal pin 190 from being rusted or aged, taking into account the reliability of the overall assembly, such as: An oxidant, or a corrosion inhibitor for a specific metal (eg, copper in copper), causes the metal pin 190 to be less susceptible to oxidation or metal ions to form an electrochemical cell reaction and rust.
  • an oxidant, or a corrosion inhibitor for a specific metal eg, copper in copper
  • inorganic additives such as: chromate Cr04 2 — , molybdate Mo04 2 — and tetraborate B407 2 — may be used.
  • Azoles such as: 2_amino_5_ethyl_l, 3, 4_thiadiazole and 5-phenyl-tetrazole
  • Amines such as:
  • the at least one pin 190 can further comprise a protective coating that can be protected in advance by a protective coating on the metal pin 190.
  • FIG. 3 is a cross-sectional view showing an organic semiconductor device according to another preferred embodiment of the present invention
  • FIG. 4 is a third view.
  • the organic semiconductor device 20 of another preferred embodiment of the present invention includes a first encapsulation layer 120; a second encapsulation layer 140 corresponding to the first encapsulation layer 120 and between the first encapsulation layer 120 An internal space 130 is defined; a substrate 150 is disposed in the internal space 130; an organic semiconductor element 160 is disposed on the substrate 150 and located in the internal space 130; and a solid body 180 is filled in the In the internal space 130, the organic semiconductor device 160 is sealed by the first encapsulation layer 120 and the second encapsulation layer 140.
  • the same components as those in the above embodiment are described in the foregoing, and will not be described herein.
  • the organic semiconductor device 20 of the further preferred embodiment further includes a sealant 210 for bonding the first encapsulation layer 120 and the second encapsulation layer 140.
  • the internal space 130 is defined and defined.
  • the sealant 210 comprises an ultraviolet curable resin or a solid material, and the solid material may be a metal material, an organic material or an inorganic material.
  • the organic semiconductor device 20 of this other preferred embodiment includes at least one pin 190 that connects the organic semiconductor device 160 and an external component (not shown).
  • the at least one reference The foot 190 is connected to the outer component through the sealant 190.
  • the present invention does not limit the specific location of the pins 190 in the encapsulant 190 through the encapsulant 190.
  • the present invention utilizes a liquid or gel-like gel 180 to encapsulate the organic semiconductor component 160 in the first and second encapsulation layers 120, 140 such that the gel 180 is bonded to the encapsulation layer. And filling the plurality of static pores of the first and second encapsulation layers 120, 140, thereby eroding the organic semiconductor element 160 by moisture or gas blocking the external environment. Accordingly, the present invention can achieve the object of the present invention by merely forming a solid-liquid interface to effectively block the erosion of the organic semiconductor element 160 by moisture or gas in the external environment.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un appareil semi-conducteur organique comprenant une première couche d'encapsulation, une seconde couche d'encapsulation, une plaque de base, un élément semi-conducteur organique et un gel. La seconde couche d'encapsulation est disposée en correspondance avec la première couche d'encapsulation, définissant un espace intérieur entre celles-ci. La plaque de base est disposée à l'intérieur de l'espace intérieur. L'élément semi-conducteur organique est disposé sur la plaque de base et à l'intérieur de l'espace intérieur. Le gel remplit l'espace intérieur et est utilisé pour mettre en prise la première couche d'encapsulation et la seconde couche d'encapsulation afin de sceller l'élément semi-conducteur organique, en vue de bloquer de façon efficace l'humidité ou le gaz présent dans l'environnement extérieur.
PCT/CN2013/073835 2013-04-07 2013-04-07 Appareil semi-conducteur organique WO2014166038A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2013/073835 WO2014166038A1 (fr) 2013-04-07 2013-04-07 Appareil semi-conducteur organique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2013/073835 WO2014166038A1 (fr) 2013-04-07 2013-04-07 Appareil semi-conducteur organique

Publications (1)

Publication Number Publication Date
WO2014166038A1 true WO2014166038A1 (fr) 2014-10-16

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PCT/CN2013/073835 WO2014166038A1 (fr) 2013-04-07 2013-04-07 Appareil semi-conducteur organique

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1599517A (zh) * 2003-09-19 2005-03-23 鸿富锦精密工业（深圳）有限公司 有机发光二极管的封装结构及其方法
CN101728413A (zh) * 2008-10-29 2010-06-09 三星移动显示器株式会社 发光显示器及其制造方法
US7906906B2 (en) * 2005-03-25 2011-03-15 Lg Display Co., Ltd. Light emitting device having spacer for protecting light emission unit from moisture absorbent
CN102138100A (zh) * 2008-07-28 2011-07-27 康宁股份有限公司 将液体密封于玻璃封装中的方法及所得到的玻璃封装
CN102810519A (zh) * 2011-05-31 2012-12-05 刘大佼 气阻膜及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1599517A (zh) * 2003-09-19 2005-03-23 鸿富锦精密工业（深圳）有限公司 有机发光二极管的封装结构及其方法
US7906906B2 (en) * 2005-03-25 2011-03-15 Lg Display Co., Ltd. Light emitting device having spacer for protecting light emission unit from moisture absorbent
CN102138100A (zh) * 2008-07-28 2011-07-27 康宁股份有限公司 将液体密封于玻璃封装中的方法及所得到的玻璃封装
CN101728413A (zh) * 2008-10-29 2010-06-09 三星移动显示器株式会社 发光显示器及其制造方法
CN102810519A (zh) * 2011-05-31 2012-12-05 刘大佼 气阻膜及其制造方法

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