WO2014146365A1 - 曝光机的玻璃基板支撑机构 - Google Patents

曝光机的玻璃基板支撑机构 Download PDF

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Publication number
WO2014146365A1
WO2014146365A1 PCT/CN2013/077840 CN2013077840W WO2014146365A1 WO 2014146365 A1 WO2014146365 A1 WO 2014146365A1 CN 2013077840 W CN2013077840 W CN 2013077840W WO 2014146365 A1 WO2014146365 A1 WO 2014146365A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
exposure machine
adsorption
supporting mechanism
support
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PCT/CN2013/077840
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English (en)
French (fr)
Inventor
刘小成
Original Assignee
深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/112,943 priority Critical patent/US9352943B2/en
Publication of WO2014146365A1 publication Critical patent/WO2014146365A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Definitions

  • the present invention relates to the field of liquid crystal display technology, and more particularly to a glass substrate supporting mechanism for an exposure machine.
  • the light-aligning technique is further irradiated with UV (ultraviolet) light to cause a monomer of the polymer in the substrate to react, thereby achieving the purpose of liquid crystal alignment.
  • UV ultraviolet
  • the exposure machine supports the glass substrate from the bottom to the top.
  • the glass substrate is surrounded by Lift Bar (support rod) support, in order to prevent bending deformation in the middle position of the glass substrate, the middle position of the glass substrate is Lift Pin (support nail) support.
  • the first support mode of the glass substrate supporting mechanism of the conventional exposure machine adopts a method of supporting the glass substrate by two divisions.
  • the glass substrate supporting mechanism includes a susceptor 1, a support platform 2 mounted on the top of the susceptor 1, a plurality of support bars 3 for supporting the periphery of the glass substrate 10, and support pins 4.
  • the support nail 4 supports the glass substrate 10 through the susceptor 1 and the support platform 2.
  • the glass substrate supporting mechanism is provided with a set of support nails 4, and a set of support nails 4 are supported on the bisectors in the glass substrate 10.
  • the second support mode of the glass substrate supporting mechanism of the conventional exposure machine adopts a method of supporting the glass substrate by three divisions. Different from the glass substrate supporting mechanism of the first exposure machine, the glass substrate supporting mechanism is provided with two sets of supporting nails 4, and the two sets of supporting nails 4 are respectively supported on the three bisectors in the glass substrate 10.
  • the support platform 2 in the above-mentioned glass substrate supporting mechanism has a two-part or three-divided structure, and its poor overallity causes temperature unevenness, thereby affecting The effect of the HVA light alignment of the glass substrate 10 has a problem of generating Pin Mura (supporting nail spots) and affecting the quality of the product. Furthermore, the above When the two supporting modes of the glass substrate supporting mechanism are switched and used, the supporting platform 2 needs to be replaced, which is time consuming and laborious, and affects the production efficiency of the product.
  • the technical problem to be solved by the present invention is that the glass substrate supporting mechanism of the above-mentioned exposure machine of the prior art affects the light alignment effect of the glass substrate HVA. Further, the operation is time-consuming and labor-intensive, and a glass substrate supporting mechanism for an exposure machine which does not affect the light-aligning effect of the glass substrate HVA and which is easy to operate is provided.
  • the invention constructs a glass substrate supporting mechanism of an exposure machine, a susceptor, a support platform mounted on the top of the pedestal for supporting the glass substrate, and a support rod mounted around the pedestal for supporting the periphery of the bottom of the glass substrate; the glass of the exposure machine
  • the substrate supporting mechanism further includes at least one adsorption device mounted above the glass substrate; the adsorption device is configured to adsorb an upper surface of the glass substrate and be movable in a vertical direction and a horizontal direction.
  • the glass substrate supporting mechanism of the exposure machine when the glass substrate adopts a two-division support mode, There is one adsorption device.
  • the glass substrate supporting mechanism of the exposure machine when the glass substrate adopts a three-segment support mode, There are two adsorption devices.
  • the adsorption device comprises An adsorption body, a vacuum chuck mounted at the bottom of each of the adsorption bodies, and a driving device that controls the synchronous movement of each of the adsorption bodies in a vertical direction or a horizontal direction.
  • the adsorption device comprising at least one adsorption body.
  • the The vacuum chuck includes a suction cup body, a vacuum pump connected to the suction cup body, and a solenoid valve connected to the vacuum pump; a bottom of the suction cup body is provided with a sealing assembly.
  • the adsorption device A buffer portion is further included; the buffer portion is coupled between the adsorption body and the vacuum chuck.
  • the The buffer portion is any one of a buffer cylinder, a spring, and a cushion.
  • each of the adsorption means can move the glass substrate in a vertical direction.
  • each of the adsorption means is movable away from the glass substrate in the horizontal direction.
  • the glass substrate supporting mechanism for implementing the exposure machine of the present invention has the following beneficial effects:
  • the glass substrate supporting mechanism adopts a structure supporting the platform, and has good integrity and uniform temperature, which is favorable for HVA light alignment of the glass substrate; further, the glass substrate supporting mechanism adopts the structure of the adsorption device in the two-division support mode and the three-division support mode. When switching between, it is easy to operate and work efficiently.
  • FIG. 1 is a schematic plan view showing a first supporting manner of a glass substrate supporting mechanism of an exposure machine in the prior art
  • Figure 2 is a cross-sectional view of the first support mode of the glass substrate supporting mechanism of the exposure machine taken along line A-A;
  • FIG. 3 is a schematic plan view showing a second supporting manner of a glass substrate supporting mechanism of the exposure machine in the prior art
  • Figure 4 is a cross-sectional view along line B-B of the second support mode of the glass substrate supporting mechanism of the exposure machine shown in Figure 3;
  • Figure 5 is a schematic view showing the structure of the support rod and the adsorption device supporting the glass substrate in the glass substrate supporting mechanism of the exposure machine according to the first preferred embodiment of the present invention. ;
  • Figure 6 is a schematic view showing the structure of the glass substrate supporting mechanism of the exposure machine shown in Figure 5 when the adsorption device is removed;
  • FIG. 7 is a schematic view showing the structure of a support rod and a suction device supporting a glass substrate in a glass substrate supporting mechanism of an exposure machine according to a second preferred embodiment of the present invention.
  • Fig. 8 is a view showing the structure of the glass substrate supporting mechanism of the exposure machine shown in Fig. 7 when the adsorption device is removed.
  • a first preferred embodiment of the present invention provides a glass substrate supporting mechanism for an exposure machine, which includes The base 1, the support platform 2, the support rod 3, and at least one adsorption device 5.
  • the support platform 2 is generally square in shape and is mounted on top of the base 1.
  • UV ultraviolet
  • the support platform 2 is for supporting the glass substrate 10.
  • the support platform 2 is a complete solid structure, and its integrity is good, and the temperature of the support platform 2 is uniform during the HVA light alignment, which is beneficial to The HVA light of the glass substrate 10 is aligned to improve the quality of the product.
  • the support rods 3 are provided in a plurality of places, which are installed around the base 1 and supported around the bottom of the glass substrate 10. When the glass substrate 10 is taken and placed, The support rod 3 moves upward to lift the glass substrate 10. At the same time, the adsorption device 5 is adsorbed on the upper surface of the glass substrate 10. The support rod 3 and the adsorption device 5 collectively support and hold the glass substrate 10. Under the joint action of the support rod 3 and the adsorption device 5, the glass substrate 10 is driven to perform a rising or falling motion in the vertical direction, and the glass substrate 10 can be prevented from being bent at an intermediate position. The adsorption device 5 can also be moved in the horizontal direction.
  • the adsorption device 5 when the glass substrate 10 is irradiated with ultraviolet (ultraviolet) light, the adsorption device 5 is moved out of the glass substrate 10 to the side surface of the glass substrate 10 so as not to block the ultraviolet (ultraviolet) light.
  • the adsorption device 5 is mounted above the glass substrate 10.
  • the glass substrate 10 adopts a two-division support mode.
  • the adsorption device 5 is provided with one, which includes at least one adsorption body 51, a vacuum chuck 52, and a driving device (not shown).
  • the adsorption main body 51 has a substantially rod-like structure, and a plurality of adsorption main bodies 51 are uniformly arranged in a line.
  • a vacuum chuck 52 is attached to the bottom of each of the adsorption bodies 51.
  • Each of the adsorption bodies 51 is mounted on a drive unit.
  • Each of the adsorption bodies 51 can be synchronously moved in the vertical direction or the horizontal direction by the action of the driving device.
  • the drive unit includes a horizontal rail, a horizontal screw, a horizontal motor, a vertical rail, a vertical screw, and a vertical motor.
  • the horizontal screw is connected to the output shaft of the horizontal motor.
  • the vertical rail is mounted on the horizontal screw and movably mounted on the horizontal rail.
  • the vertical rail can be controlled to move along the horizontal rail by controlling the operation of the horizontal motor.
  • the vertical screw is drivingly connected to the output shaft of the vertical motor, and each of the adsorption bodies 51 is mounted on the horizontal screw and movably mounted on the vertical rail, and can be controlled by controlling the operation of the vertical motor
  • the absorbing body 51 moves along the vertical rail.
  • the existing controller can be used to control the rotational speed of the vertical motor so that the adsorption main body 51 and the support rod 3 move synchronously, that is, the adsorption body 51 and the support rod 3 move at the same speed in the vertical direction.
  • each of the vacuum chucks 52 is adsorbed on the bisector of the surface of the glass substrate 10, respectively.
  • the vacuum chuck 52 includes a suction cup body (not shown), a vacuum pump (not shown) connected to the suction cup body, and a solenoid valve (not shown) connected to the vacuum pump.
  • a sealing assembly is disposed at the bottom of the suction cup body.
  • the solenoid valve controls the vacuum pump to extract air between the sealing assembly and the glass substrate 10 to form a vacuum state, so that the sealing assembly is in close contact with the glass substrate 10 without falling off.
  • the seal assembly is made of rubber and does not cause damage to the surface of the workpiece.
  • the solenoid valve controls the vacuum pump to deflate, thereby detaching the vacuum chuck 52 from the glass substrate 10.
  • the adsorption device 5 is provided with nine adsorption bodies 51, and correspondingly nine vacuum suction cups 52 are provided. Nine vacuum chucks 52 are arranged in a row at equal intervals. It will be appreciated that depending on the size of the glass substrate 10, there may be other options for the number of adsorbent bodies 51 in the adsorption unit 5.
  • the adsorption device 5 further includes a buffer portion 53 in the present embodiment.
  • the buffer portion 53 is connected between the adsorption main body 51 and the vacuum chuck 52.
  • the buffer portion 53 can serve as a buffering effect, and the occurrence of crushing of the glass substrate 10 is effectively prevented.
  • the buffer portion 53 may be configured by a buffer cylinder, a spring, or a cushion. The existing buffer cylinder can absorb the impact caused by the inertia when the piston of the buffer cylinder stops at the end of the stroke, thereby effectively avoiding damage to the glass substrate 10.
  • the spring has good elasticity and can absorb the impact force generated during the movement of the adsorption device 5, thereby effectively avoiding damage to the glass substrate 10.
  • the cushion can be made of a foamed material, which also has good elasticity and can act as a buffer to effectively avoid damage to the glass substrate 10.
  • a second preferred embodiment of the present invention provides a glass substrate supporting mechanism of an exposure machine.
  • the glass substrate 10 adopts a three-segment support mode.
  • the vacuum chucks 52 of the two adsorption devices 5 are respectively adsorbed on the three bisectors of the surface of the glass substrate 10.
  • UV (ultraviolet) light is irradiated
  • the two adsorption devices 5 are respectively moved to both side faces of the glass substrate 10.
  • one adsorption device 5 can be separately controlled to adsorb on the bisector of the surface of the glass substrate 10, and the two adsorption devices 5 can be simultaneously controlled to be respectively adsorbed on the three bisector of the surface of the glass substrate 10. .
  • the glass substrate supporting mechanism needs to switch between the two-division support mode and the three-division support mode, the operation is simple and the work efficiency is high.

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Abstract

公开了一种曝光机的玻璃基板支撑机构，包括基座（1），安装在基座（1）顶部且用于支撑玻璃基板（10）的支撑平台（2）、安装在基座（1）四周，用于支撑玻璃基板（10）四周的支撑杆（3）、以及安装在玻璃基板（10）上方的至少一个吸附装置（5）；吸附装置（5）用于吸附玻璃基板（10）的上表面并可沿竖直方向运动与水平方向运动。该玻璃基板支撑机构采用支撑平台的结构，其整体性好、温度均匀，有利于玻璃基板的HVA光配向；再者，玻璃基板支撑机构采用吸附装置的结构在二分割支撑方式和三分割支撑方式之间切换时，其操作简便、工作效率高。

Description

曝光机的玻璃基板支撑机构 技术领域
本发明涉及液晶显示技术领域，更具体地说，涉及一种 曝光机的玻璃基板支撑机构 。
背景技术
HVA 光配向技术是指在给玻璃基板施加电压同时通过支撑平台给玻璃基板加热的情况下，再通过UV（紫外线）光照射使基板内高分子的单体反应，从而达到液晶配向的目的。
现有技术中， 曝光机均采用由下向上的方式支撑玻璃基板。其中，玻璃基板的四周采用Lift Bar（支撑杆）支撑，为了防止玻璃基板中间位置产生弯曲变形，玻璃基板的中间位置采用Lift pin（支撑钉）支撑。如图1、图2所示为常用的曝光机的玻璃基板支撑机构的第一种支撑方式，其采用二分割支撑玻璃基板的方式。玻璃基板支撑机构包括基座1、安装在基座1顶部的支撑平台2、用于支撑玻璃基板10四周的若干个支撑杆3、以及支撑钉4。支撑钉4穿过基座1与支撑平台2支撑玻璃基板10。该玻璃基板支撑机构设置有一组支撑钉4，且一组支撑钉4支撑在玻璃基板10中的二等分线上。
如图3、图4所示为常用的曝光机的玻璃基板支撑机构的第二种支撑方式，其采用三分割支撑玻璃基板的方式。与第一种曝光机的玻璃基板支撑机构所不同的是，该玻璃基板支撑机构设置有两组支撑钉4，且两组支撑钉4分别支撑在玻璃基板10中的三等分线上。
上述 玻璃基板支撑机构中的支撑平台2由于存在二分割或三分割结构，其整体性差导致温度不均匀，从而影响 玻璃基板10的HVA光配向的效果，存在产生Pin Mura（支撑钉斑）的问题而影响产品的品质。再者，上述 玻璃基板支撑机构的两种支撑方式在切换使用时，需要更换支撑平台2，该操作费时费力，影响产品的生产效率。
发明内容
本发明要解决的技术问题在于，针对现有技术的上述 曝光机的玻璃基板支撑机构影响 玻璃基板HVA光配向效果 且操作费时费力的 缺陷，提供一种不会影响 玻璃基板HVA光配向效果且操作简便的 曝光机的玻璃基板支撑机构 。
本发明解决其技术问题所采用的技术方案是：
本发明构造了一种 曝光机的玻璃基板支撑机构 ， 包括基座、安装在所述基座顶部且用于支撑玻璃基板的支撑平台、以及安装在所述基座四周，用于支撑在所述玻璃基板底部四周的支撑杆；所述曝光机的玻璃基板支撑机构还包括安装在所述玻璃基板上方的至少一个吸附装置；所述吸附装置用于吸附所述玻璃基板的上表面并可沿竖直方向与水平方向运动。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 所述玻璃基板采用二分割支撑方式时，所述 吸附装置设置有一个。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 所述玻璃基板采用三分割支撑方式时，所述 吸附装置设置有两个。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 所述吸附装置包括 吸附主体、安装在每个所述吸附主体底部的真空吸盘、以及控制每个所述吸附主体在竖直方向或水平方向同步运动的驱动装置。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 根据所述 玻璃基板的尺寸，所述吸附装置包括至少一个吸附主体。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 所述 真空吸盘包括吸盘本体、与所述吸盘本体连接的真空泵、以及与所述真空泵连接的电磁阀；所述吸盘本体的底部设置有密封组件。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 所述吸附装置 还包括缓冲部；所述缓冲部连接在所述吸附主体与所述真空吸盘之间。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 所述 缓冲部为缓冲气缸、弹簧、以及软垫中的任意一种。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 每个所述吸附装置可带动所述玻璃基板沿竖直方向运动。
在本发明所述的 曝光机的玻璃基板支撑机构 中， 每个所述吸附装置可脱离所述玻璃基板沿水平方向运动。
实施本发明的曝光机的玻璃基板支撑机构，具有以下有益效果： 玻璃基板支撑机构采用支撑平台的结构，其整体性好、温度均匀，有利于玻璃基板的HVA光配向；再者，玻璃基板支撑机构采用吸附装置的结构在二分割支撑方式和三分割支撑方式之间切换时，其操作简便、工作效率高。
附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图 1是现有技术中 曝光机的玻璃基板支撑机构的第一种支撑方式的平面示意图；
图 2是图1所示的 曝光机的玻璃基板支撑机构的第一种支撑方式 沿A-A线的剖面示意图；
图 3是现有技术中 曝光机的玻璃基板支撑机构的第二种支撑方式的平面示意图；
图 4是图3所示的 曝光机的玻璃基板支撑机构的第二种支撑方式 沿B-B线的剖面示意图；
图5是本发明第一个较佳实施例提供的 曝光机的玻璃基板支撑机构中的支撑杆与吸附装置支撑玻璃基板时的结构示意图 ；
图6是图5所示的 曝光机的玻璃基板支撑机构中吸附装置移开时的结构示意图；
图7是本发明第二个较佳实施例提供的 曝光机的玻璃基板支撑机构中的支撑杆与吸附装置支撑玻璃基板时的结构示意图 ；
图8是图7所示的 曝光机的玻璃基板支撑机构中吸附装置移开时的结构示意图。
具体实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
如图5、图6所示，本发明的第一个较佳实施例 提供一种 曝光机的玻璃基板支撑机构 ，其包括 基座1、支撑平台2、支撑杆3、以及至少一个吸附装置5。支撑平台2大致为方形结构，其安装在基座1的顶部。 玻璃基板10在用UV（紫外线）光照射时， 支撑平台2用于支撑 玻璃基板10。 支撑平台2为一完整的实体结构，其整体性好，在HVA光配向时支撑平台2的温度均匀，有利于 玻璃基板10的HVA光配向，从而提高产品的品质。
支撑杆3设置有若干个，其安装在基座1的四周，并支撑在玻璃基板10底部的四周。 在取放玻璃基板10操作时， 支撑杆3向上运动将玻璃基板10顶起。与此同时，吸附装置5吸附在玻璃基板10的上表面。支撑杆3和吸附装置5共同支撑并夹持玻璃基板10。在支撑杆3和吸附装置5的共同作用下，带动玻璃基板10在竖直方向上实现上升或下降运动，可防止玻璃基板10在中间位置处产生弯曲变形。该吸附装置5也可在水平方向运动。如图6所示，当 UV（紫外线）光照射 玻璃基板10时，为了不遮挡UV （紫外线） 光，将吸附装置5脱离玻璃基板10移动至玻璃基板10的侧面。
吸附装置5安装在玻璃基板10的上方。 本实施例中， 玻璃基板10采用二分割的支撑方式， 吸附装置5设置有一个，其包括至少一个吸附主体51、真空吸盘52、以及驱动装置（图未示）。吸附主体51大致为杆状结构，若干个吸附主体51均匀地排成一列。且每个吸附主体51的底部都安装有真空吸盘52。每个吸附主体51均安装在驱动装置上。在驱动装置的作用下，每个吸附主体51可在竖直方向或水平方向同步运动。
该实施例中，驱动装置包括水平导轨、水平螺杆、水平电机、竖直导轨、竖直螺杆以及竖直电机。水平螺杆与水平电机的输出轴传动连接，竖直导轨安装在该水平螺杆上，并可移动地安装在水平导轨上，通过控制水平电机的运作即可控制竖直导轨沿着水平导轨运动。竖直螺杆与竖直电机的输出轴传动连接，每个所述吸附主体51均安装在所述水平螺杆上，并可移动地安装在竖直导轨上，通过控制竖直电机的运作即可控制吸附主体51沿着竖直导轨运动。再者，可以采用现有的控制器以控制竖直电机的转速，使吸附主体51与支撑杆3同步运动，即吸附主体51和支撑杆3在竖直方向上升或下降运动的速度相同。
该实施例中，每个真空吸盘52分别吸附在玻璃基板10表面的二等分线上。真空吸盘52包括吸盘本体（图未示）、与该吸盘本体连接的真空泵（图未示）、以及与该真空泵连接的电磁阀（图未示）。吸盘本体的底部设置有密封组件。当真空吸盘52需要吸附玻璃基板10时，电磁阀控制真空泵抽取密封组件与玻璃基板10之间的空气，以形成真空状态，使得密封组件与玻璃基板10紧贴，而不会脱落。该密封组件采用橡胶制品，不会对工件表面造成损坏。当真空吸盘52需要与玻璃基板10分离时，电磁阀控制真空泵放气，从而使真空吸盘52与玻璃基板10脱离。该实施例中，吸附装置5设置有九个吸附主体51，相对应地设置有九个真空吸盘52。九个真空吸盘52等间距地布置成一列。可以理解的是，根据不同尺寸的玻璃基板10，吸附装置5中吸附主体51的数量可以有其他的选择。
为了防止吸附装置5在竖直向下运动过程中，由于冲击力过大而压碎玻璃基板10，本实施例中，吸附装置5还包括缓冲部53。该缓冲部53连接在吸附主体51与真空吸盘52之间。当吸附装置5与玻璃基板10接触时，缓冲部53能够起到缓冲作用，有效地避免了压碎玻璃基板10的情况发生。该实施例中，缓冲部53可以采用缓冲气缸、弹簧、或软垫等结构。采用现有的缓冲气缸可以吸收当缓冲气缸的活塞在行程末端处停下来时的惯性引起的冲击，有效避免损坏玻璃基板10。弹簧具有良好的弹性，可吸收吸附装置5运动过程中产生的冲击力，有效避免损坏玻璃基板10。软垫可由发泡材料制成，其同样具有良好的弹性，能够起到缓冲作用从而有效避免损坏玻璃基板10。
如图7、图8所示，本发明的第二个较佳实施例 提供一种 曝光机的玻璃基板支撑机构 ，与第一个较佳实施例所不同的是，该实施例中， 玻璃基板10采用三分割的支撑方式， 吸附装置5设置有两个。两个吸附装置5中的真空吸盘52分别吸附在玻璃基板10表面的三等分线上。如图8所示，当 UV（紫外线）光照射 玻璃基板10时，为了不遮挡UV （紫外线） 光，将两个吸附装置5分别移动至玻璃基板10的两侧面。采用两个吸附装置5，可单独控制一个吸附装置5吸附在玻璃基板10表面的二等分线上，也可同时控制两个吸附装置5运作分别吸附在玻璃基板10表面的三等分线上。当该玻璃基板支撑机构需要在二分割支撑方式和三分割支撑方式之间切换时，其操作简便、工作效率高。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，这些均属于本发明的保护之内。

Claims (10)

  1. 一种曝光机的玻璃基板支撑机构，包括基座、安装在所述基座顶部且用于支撑玻璃基板的支撑平台、以及安装在所述基座四周，用于支撑在所述玻璃基板底部四周的支撑杆；其中：所述曝光机的玻璃基板支撑机构还包括安装在所述玻璃基板上方的至少一个吸附装置；每个所述吸附装置用于吸附所述玻璃基板的上表面并可沿竖直方向与水平方向运动。
  2. 根据权利要求1所述的曝光机的玻璃基板支撑机构，其中：所述玻璃基板采用二分割的支撑方式时，所述吸附装置设置有一个。
  3. 根据权利要求1所述的曝光机的玻璃基板支撑机构，其中：所述玻璃基板采用三分割的支撑方式时，所述吸附装置设置有两个。
  4. 根据权利要求1所述的 曝光机的玻璃基板支撑机构，其中：所述吸附装置包括吸附主体、安装在所述吸附主体底部的真空吸盘、以及控制所述吸附主体在竖直方向或水平方向同步运动的驱动装置。
  5. 根据权利要求4所述的曝光机的玻璃基板支撑机构，其中：根据所述玻璃基板的尺寸，所述吸附装置包括至少一个吸附主体。
  6. 根据权利要求4所述的曝光机的玻璃基板支撑机构，其中：所述真空吸盘包括吸盘本体、与所述吸盘本体连接的真空泵、以及与所述真空泵连接的电磁阀；所述吸盘本体的底部设置有密封组件。
  7. 根据权利要求4所述的曝光机的玻璃基板支撑机构，其中：所述吸附装置还包括缓冲部；所述缓冲部连接在所述吸附主体与所述真空吸盘之间。
  8. 根据权利要求7所述的曝光机的玻璃基板支撑机构，其中：所述缓冲部为缓冲气缸、弹簧、以及软垫中的任意一种。
  9. 根据权利要求1所述的曝光机的玻璃基板支撑机构，其中：每个所述吸附装置可带动所述玻璃基板沿竖直方向运动。
  10. 根据权利要求1所述的曝光机的玻璃基板支撑机构，其中：每个所述吸附装置可脱离所述玻璃基板沿水平方向运动。
PCT/CN2013/077840 2013-03-19 2013-06-25 曝光机的玻璃基板支撑机构 WO2014146365A1 (zh)

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