WO2014142031A1

WO2014142031A1 - Substrate processing device, method for controlling substrate processing device, cleaning method, method for manufacturing semiconductor device, and recording medium

Info

Publication number: WO2014142031A1
Application number: PCT/JP2014/055998
Authority: WO
Inventors: 浩小谷; 上田　立志
Original assignee: 株式会社日立国際電気
Priority date: 2013-03-13
Filing date: 2014-03-07
Publication date: 2014-09-18
Also published as: JP6290177B2; JPWO2014142031A1

Abstract

A substrate processing device provided with at least one processing chamber for processing a substrate, the substrate processing device provided with: a substrate loading unit for loading the substrate, the substrate loading unit being provided in the processing chamber; a reactive gas supply unit for supplying, to a plurality of regions, a reactive gas for removing a deposit deposited on at least the substrate loading unit by processing of the substrate; an inert gas supply unit for supplying an inert gas to the plurality of regions; and a control unit for controlling at least the reactive gas supply unit and the inert gas supply unit so as to adjust each of the supplied flow rate of the reactive gas and the supplied flow rate of the inert gas supplied to the plurality of regions in accordance with a film thickness value of the deposit deposited on the substrate loading unit during supply of the reactive gas to the plurality of regions and removal of the deposit.

Description

Substrate processing apparatus, substrate processing apparatus control method, cleaning method, semiconductor device manufacturing method, and recording medium

The present invention relates to a substrate processing apparatus for processing a substrate, a control method for the substrate processing apparatus, a cleaning method, a method for manufacturing a semiconductor device, and a recording medium.

One step of a manufacturing process of a semiconductor device such as a flash memory or a DRAM (Dynamic Random Access Memory) is performed by the substrate processing apparatus. In this substrate processing apparatus, a raw material gas is supplied into a processing chamber to perform a process for forming a film on a substrate. However, when a process for forming a film on the substrate is performed, for example, deposits adhere to the inner wall of the processing chamber, and the deposited deposits are peeled off from the inner wall of the processing chamber and foreign matter is generated in the processing chamber. There is a case. Therefore, it is necessary to periodically remove deposits adhering to the inner wall or the like in the processing chamber.

As a method for removing deposits on the inner wall of the processing chamber, for example, there is a wet cleaning method in which a member constituting the processing chamber is removed from the substrate processing apparatus and deposits adhered to the member in a cleaning tank such as an HF aqueous solution are removed. is there. However, in the wet cleaning method, since the constituent members and the like constituting the processing chamber are removed from the substrate processing apparatus, the operation rate of the apparatus is lowered.

Therefore, there is a case where a dry cleaning method is performed in which deposits attached to an inner wall or the like in the processing chamber are removed by etching by supplying a cleaning gas into the processing chamber. The dry cleaning method is expected to improve the operating rate of the apparatus because it is not necessary to remove the components constituting the processing chamber from the substrate processing apparatus. However, when a cleaning gas is supplied into the processing chamber and the processing chamber is uniformly etched, over-etching may occur in the processing chamber, causing damage to members constituting the processing chamber. That is, in a portion where the thickness of the deposit is small, the inner wall or the like of the processing chamber is eroded and damaged. For example, a metal member in the processing chamber is corroded to cause metal contamination.

The present invention provides a substrate processing apparatus, a substrate processing apparatus control method, a cleaning method, and a semiconductor device that can remove deposits attached to the constituent members and the like in the processing chamber so as not to cause damage to the constituent members that configure the processing chamber. A manufacturing method and a recording medium can be provided.

According to one aspect of the invention,
A substrate processing apparatus comprising at least one processing chamber provided with a plurality of regions for processing a substrate,
A substrate mounting portion provided in the processing chamber for mounting the substrate;
A reactive gas supply unit that supplies, to the plurality of regions, a reactive gas that removes at least deposits deposited on the substrate mounting unit by processing the substrate;
An inert gas supply unit for supplying an inert gas to the plurality of regions;
When the reactive gas is supplied to the plurality of regions and the deposit is removed, the supply flow rate of the reactive gas and the supply flow rate of the inert gas supplied to the plurality of regions are respectively set to the substrate mounting unit. There is provided a substrate processing apparatus comprising: a control unit that controls at least the reactive gas supply unit and the inert gas supply unit so as to adjust according to a film thickness value of the deposit deposited on the substrate.

According to another aspect of the invention,
A cleaning method executed by a substrate processing apparatus including at least one processing chamber provided with a plurality of regions for processing a substrate, wherein at least a reactive gas is supplied into the processing chamber, the supply to the plurality of regions Adjusting the supply flow rate of the reactive gas and the supply flow rate of the inert gas according to the film thickness value of the deposit deposited on the substrate mounting portion provided in the processing chamber, respectively. There is provided a method for cleaning a substrate processing apparatus having a removing step of removing deposits deposited on the substrate.

According to yet another aspect of the invention,
A substrate processing step for processing a substrate in a processing chamber provided with a plurality of regions, and at least a reactive gas is supplied into the processing chamber and is deposited on a substrate mounting portion provided in the processing chamber in the substrate processing step. When removing the deposited deposit, the supply flow rate of the reactive gas and the supply flow rate of the inert gas supplied to the plurality of regions are respectively in accordance with the film thickness value of the deposit deposited on the substrate platform. There is provided a method for manufacturing a semiconductor device, the method comprising adjusting and removing a deposit deposited on the substrate mounting portion.

According to still another aspect of the present invention, there is provided a recording medium in which a program executed by a substrate processing apparatus including at least one processing chamber provided with a plurality of regions for processing a substrate is recorded in a computer-readable manner, When supplying at least a reactive gas into the processing chamber, the supply flow rate of the reactive gas and the supply flow rate of the inert gas supplied to the plurality of regions are respectively deposited on the substrate mounting portion provided in the processing chamber. There is provided a computer-readable recording medium recording a program having a procedure of adjusting the film thickness of the deposit to remove the deposit deposited on the substrate platform.

According to still another aspect of the present invention, there is provided a method for controlling a substrate processing apparatus including at least one processing chamber for processing a substrate, the substrate mounting portion being provided in the processing chamber and mounting the substrate. A reactive gas supply unit that supplies the plurality of regions with a reactive gas that removes at least deposits deposited on the substrate mounting unit by processing the substrate; and an inert gas that supplies inert gas to the plurality of regions. An active gas supply unit; and a control unit that controls at least the reactive gas supply unit and the inert gas supply unit, and supplies the reactive gas to the plurality of regions to remove the deposits. A substrate processing apparatus that adjusts a supply flow rate of the reactive gas and a supply flow rate of the inert gas supplied to the plurality of regions according to a film thickness value of the deposit deposited on the substrate mounting unit, respectively. Provided by the control method It is.

According to the substrate processing apparatus, the control method of the substrate processing apparatus, the cleaning method, the manufacturing method of the semiconductor device, and the recording medium according to the present invention, each component in the processing chamber is provided so as not to cause damage to the components configuring the processing chamber. The deposit adhering to can be removed.

It is a schematic block diagram of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a schematic perspective view of the reaction container with which the processing chamber concerning one embodiment of the present invention is provided. It is a longitudinal section schematic diagram of a processing room concerning one embodiment of the present invention. It is a schematic explanatory drawing of the gas supply part which concerns on one Embodiment of this invention. It is a flowchart which shows the substrate processing process which concerns on one Embodiment of this invention. It is a schematic block diagram of the control means of the substrate processing apparatus used suitably by one Embodiment of this invention. It is a block diagram which shows the function structure of the control means of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a figure which shows an example of the operation screen displayed by the control means which concerns on one Embodiment of this invention, (a) shows an example of the edit screen of a process recipe, (b) is an example of the edit screen of a deposition ratio table Indicates. It is a figure which shows an example of the operation screen displayed by the control means which concerns on one Embodiment of this invention, (a) shows an example of the edit screen of a cleaning recipe, (b) is an example of the edit screen of an etching ratio table Indicates. It is a flowchart of the update process of the accumulated film thickness data which the control means which concerns on one Embodiment of this invention performs. It is a flowchart of the update process of the accumulated film thickness data which the control means which concerns on one Embodiment of this invention performs. (A) is a figure explaining an example of a mode that accumulated film thickness data is updated by the control means which concerns on one Embodiment of this invention, (b) is by the control means which concerns on one Embodiment of this invention. It is the figure which made the content of the cumulative film thickness table into a graph. It is a figure explaining an example of a mode that accumulated film thickness data is updated by the control means which concerns on one Embodiment of this invention. It is a figure explaining an example of a mode that accumulated film thickness data is updated by the control means which concerns on one Embodiment of this invention. It is a figure explaining an example of a mode that accumulated film thickness data is updated by the control means which concerns on one Embodiment of this invention. It is a figure explaining an example of a mode that accumulated film thickness data is updated by the control means which concerns on one Embodiment of this invention. It is a flowchart of the update process of the accumulated film thickness data which the control means which concerns on other embodiment of this invention performs. It is a figure explaining an example of a mode that accumulated film thickness data is updated by the control means which concerns on one Embodiment of this invention.

<Knowledge obtained by the inventors> First, knowledge obtained by the inventors will be described prior to the description of the embodiment of the present invention.

As a multi-wafer type substrate processing apparatus that performs a process of forming a thin film on a substrate, for example, a processing chamber for processing a substrate, a substrate mounting unit that is configured to freely rotate a plurality of substrates, and a substrate A partition unit that partitions the processing chamber so that the first processing region, the first purge region, the second processing region, and the second purge region are alternately arranged along the rotation direction of the mounting unit; A substrate processing apparatus provided has been proposed. Such a substrate processing apparatus supplies the first source gas to the first processing region and also supplies the second source gas to the second processing region, and the first purge region and the second purge region. It is comprised so that an inert gas may be supplied to. Then, by rotating the substrate platform, the substrate on the substrate platform passes through the first processing region, the first purge region, the second processing region, and the second purge region in this order. The thin film is formed on the substrate by alternately supplying the source gas and the inert gas to the substrate.

When a thin film is formed on a substrate by such a multi-wafer type substrate processing apparatus, it is a constituent member constituting the processing chamber (a member constituting the surface of the susceptor, the side surface of the partition portion, etc.) and the substrate surface Deposits including a thin film may adhere to other parts, for example, the inner wall of the processing chamber, the side surfaces of the partition part, the surface of the susceptor as the substrate mounting part, and the like. Such deposits are cumulatively deposited each time a process for forming a thin film on the substrate is performed. Then, the deposit is peeled off and dropped when the thickness exceeds a predetermined thickness, which becomes a factor in generating foreign matter in the processing chamber. Therefore, every time the film thickness of the deposit reaches a predetermined value, it is necessary to perform cleaning to remove the deposit deposited on each component (susceptor, partition, etc.) in the processing chamber.

By the way, since the susceptor including the heating unit is likely to become high temperature, deposits are more likely to adhere to the inner wall of the processing chamber. That is, the thickness of the deposit on the susceptor tends to be larger than the thickness of the deposit on the inner wall of the processing chamber. Further, the side surfaces of the partition portions constituting the first processing region and the second processing region to which the source gas is supplied are deposited as compared with the first purge region and the second purge region to which the inert gas is supplied. Objects are easy to adhere. That is, the film thickness of the deposit adhering to the partition portion facing the first processing region and the second processing region is the same as that of the deposit adhering to the partition portion facing the first purge region and the second purge region. It tends to be larger than the film thickness. Thus, the film thickness of the deposit deposited on each component in the processing chamber is hardly uniform in the processing chamber.

For this reason, if the processing chamber is uniformly etched by, for example, the dry cleaning method based on the thickness of the deposit on the susceptor, over-etching occurs in the processing chamber. That is, the partition wall and the inner wall of the processing chamber are eroded by the cleaning gas on the side surfaces of the partition portions constituting the first purge region and the second purge region where the deposit thickness is small and the inner walls of the processing chambers. For example, the metal member in the processing chamber may be corroded to cause metal contamination.

As described above, when the cleaning gas supply flow rate or the like is adjusted based only on the film thickness value of the deposit attached to a predetermined location in the processing chamber such as a susceptor, the components (partitions and the like) constituting the processing chamber May cause damage.

The present invention has been made based on such knowledge obtained by the inventors. Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

<One Embodiment of the Present Invention> (1) Configuration of Substrate Processing Apparatus First, the configuration of a substrate processing apparatus 10 according to the present embodiment will be described with reference mainly to FIG. FIG. 1 is a schematic configuration diagram of a substrate processing apparatus 10 according to the present embodiment. The substrate processing apparatus 10 according to the present embodiment is configured as a multi-leaf type apparatus that processes a plurality of wafers 200 as a substrate at a time. In the substrate processing apparatus 10 according to the present embodiment, a FOUP (Front Opening Unified Pod, hereinafter referred to as a pod) is used as a carrier for transporting the wafer 200. The transfer apparatus of the substrate processing apparatus 10 according to the present embodiment is divided into a vacuum side and an atmosphere side. In this specification, “vacuum” means an industrial vacuum. In the following description, front, rear, left and right are based on FIG. That is, with respect to the paper surface shown in FIG. 1, the front is below the paper surface, the back is above the paper surface, and the left and right are the left and right of the paper surface.

(Structure on the vacuum side) The substrate processing apparatus 10 includes a transfer chamber TM (Transfer Module) as a first transfer chamber capable of reducing the pressure to a pressure lower than atmospheric pressure (for example, 100 Pa) such as a vacuum state. The housing of the transfer chamber TM has a pentagonal shape in plan view and is formed in a box shape with both upper and lower ends closed.

Among the five side walls constituting the casing of the transfer chamber TM, one side wall located on the front side is provided with load lock chambers LM (Load Lock Module) 1 and LM2 as spare chambers via a gate valve. Each is provided so as to be able to communicate with the transfer chamber TM.

Among the other three side walls constituting the casing of the transfer chamber TM, two side walls located on the rear side are connected to a process chamber PM (Process Module) 1 as a first processing chamber via a gate valve. The process chamber PM2 as the second processing chamber is provided so as to be able to communicate with the transfer chamber TM. The process chambers PM1 and PM2 are provided with a gas supply unit 250 and an exhaust unit, which will be described later. The process chambers PM1 and PM2 are provided with susceptors ST1 and ST2 as substrate placement portions on which the wafer 200 is placed. As will be described later, in the process chambers PM1 and PM2, a plurality of processing regions and the like are formed in one reaction vessel 203, and a susceptor ST1 serving as a substrate mounting portion is rotated to rotate a wafer 200 as a substrate. Passes through a plurality of processing regions in order, so that a source gas or the like is sequentially supplied to the wafer 200 to form a thin film on the wafer 200, or the surface of the wafer 200 is oxidized, nitrided, carbonized, or the like. Various substrate processes such as a process and a process of etching the surface of the wafer 200 are performed.

In the transfer chamber TM, a transfer robot VR as a first transfer mechanism is provided. The transfer robot VR is configured to be able to transfer the wafer 200 between the load lock chamber LM1 as a first auxiliary chamber and the load lock chamber LM2 as a second auxiliary chamber and the process chambers PM1 and PM2. The transfer robot VR is configured to be movable up and down while maintaining the airtightness of the transfer chamber TM. The transfer robot VR has, for example, two arms as substrate holding units and is configured to be able to transfer two wafers 200. The arm of the transfer robot VR can be expanded and contracted in the horizontal direction, and is configured to rotate and move within the horizontal plane. Further, in the transfer chamber TM, in the vicinity of the gate valves of the load lock chambers LM1 and LM2 and the gate valves of the process chambers PM1 and PM2, a wafer presence / absence sensor as a substrate detection unit for detecting the presence / absence of the wafer 200 is provided. Is provided.

The load lock chambers LM1 and LM2 function as spare chambers for temporarily storing the wafers 200 loaded into the transfer chamber TM or unloaded from the transfer chamber TM. In the load lock chambers LM1 and LM2, buffer stages as substrate support portions for temporarily supporting the wafer 200 are provided. Each of the buffer stages may be configured as a multistage slot that holds a plurality of (for example, two) wafers 200.

Further, the load lock chambers LM1 and LM2 are configured in a load lock chamber structure capable of reducing the pressure to a pressure (negative pressure) less than atmospheric pressure such as a vacuum state. That is, the load lock chambers LM1 and LM2 are configured so that the inside thereof can be evacuated. In addition, a transfer chamber EFEM as a second transfer chamber is provided on the front side of the load lock chambers LM1 and LM2 via a gate valve. Therefore, after the gate valve on the transfer chamber EFEM side is closed and the load lock chambers LM1 and LM2 are evacuated, the gate valve on the transfer chamber TM side is opened, thereby maintaining the vacuum state of the transfer chamber TM and the load lock. The wafer 200 is configured to be transferred between the chambers LM1, LM2 and the transfer chamber TM.

(Configuration on the atmosphere side) A transfer chamber EFEM (Equipment Front End Module) as a second transfer chamber is provided on the atmosphere side of the substrate processing apparatus 10 and is used at a substantially atmospheric pressure. That is, the transfer chamber EFEM is provided on the front side of the load lock chambers LM1 and LM2 via the gate valve. The transfer chamber EFEM is provided so as to communicate with the load lock chambers LM1, LM2.

In the transfer chamber EFEM, for example, one transfer robot AR is provided as a second transfer mechanism for transferring the wafer 200. The transfer robot AR is configured to mutually transfer the wafer 200 between the load lock chambers LM1 and LM2 and load ports LP1 to LP3 described later. The transfer robot AR is configured to be movable up and down and configured to reciprocate in the left-right direction. The transfer robot AR has, for example, two arms and is configured to transfer two wafers. In addition, a wafer presence sensor as a substrate detection unit for detecting the presence or absence of the wafer 200 is provided in the vicinity of the gate valve of the transfer chamber EFEM.

Also, in the transfer chamber EFEM, a notch alignment device that performs the crystal orientation and alignment of the wafer 200 using the notch of the wafer 200 is provided as a device for correcting the position of the wafer 200. Instead of the notch aligning device, an orientation flat aligning device may be provided. The transfer chamber EFEM is provided with a clean air unit that supplies clean air into the transfer chamber EFEM.

On the front side of the housing of the transfer chamber EFEM, a substrate transfer port for transferring the wafer 200 into and out of the transfer chamber EFEM is provided. Load ports (I / O stages) LP1, LP2, LP3 as carrier mounting tables (carrier mounting units) are provided outside the transfer chamber EFEM across the substrate transfer port.

Each of the load ports LP1 to LP3 is configured to place carrier cassettes CA1 to CA3 as substrate storage containers for storing a plurality of (for example, 25) wafers 200 on the load ports LP1 to LP3, respectively. Yes. Each of the carrier cassettes CA1 to CA3 is assigned a carrier ID such as a barcode for identifying the carrier cassettes CA1 to CA3. Each of the load ports LP1 to LP3 is configured to read and store the carrier IDs assigned to the carrier cassettes CA1 to CA3 when the carrier cassettes CA1 to CA3 are placed.

Mainly, the transfer chamber TM, the load lock chambers LM1 and LM2, and the transfer chamber EFEM constitute a transfer device of the substrate processing apparatus 10 according to the present embodiment.

A control unit 280 described later is electrically connected to each component of the transfer device of the substrate processing apparatus 10. And it is comprised so that operation | movement of each structure mentioned above may be controlled, respectively.

(Wafer Transfer Operation) Next, the wafer 200 transfer operation in the substrate processing apparatus 10 according to the present embodiment will be described. The operation of each component of each transport mechanism of the substrate processing apparatus 10 is controlled by the control unit 280 described later. The following operations are performed based on, for example, a transport recipe. The transfer recipe is used to transfer the wafer 200 in the substrate processing apparatus 10 and is used in combination with a substrate processing recipe for processing a substrate to realize a substrate processing process.

First, for example, carrier cassettes CA1 and CA2 containing 25 wafers 200 and an empty carrier cassette CA3 are mounted on the load port LP1, respectively, and the carrier IDs attached to the carrier cassettes CA1 to CA3 are read. Then, the substrate transfer port and the wafer entrance / exit of the carrier cassette CA1 or the carrier cassette CA2 are opened.

When the wafer entrance / exit of the carrier cassette CA1 or the carrier cassette CA2 is opened, the transfer robot AR installed in the transfer chamber EFEM picks up one wafer 200 from the carrier cassette CA1 or the carrier cassette CA2, for example, the load lock chamber LM1. Then, the wafer 200 is loaded. During the transfer operation of the wafer 200 by the transfer robot AR, the gate valve between the load lock chamber LM1 and the transfer chamber TM is closed, and the decompressed atmosphere in the transfer chamber TM is maintained. When the transfer of the wafer 200 into the load lock chamber LM1 by the transfer robot AR is completed, the inside of the load lock chamber LM1 is exhausted to a negative pressure by the exhaust device.

Thereafter, the transfer robot AR repeats the above-described operation. However, when the inside of the load lock chamber LM1 is in a negative pressure state, the transfer robot AR does not carry the wafer 200 into the load lock chamber LM1, but stops and waits at a position immediately before the load lock chamber LM1. The transfer robot AR may be configured to load the wafer 200 into the load lock chamber LM2.

When the pressure inside the load lock chamber LM1 is reduced to a preset pressure value (for example, 100 Pa), the gate valve between the load lock chamber LM1 and the transfer chamber TM is opened. Subsequently, the transfer robot VR provided in the transfer chamber TM picks up the wafer 200 from the load lock chamber LM1 and loads it into the transfer chamber TM.

After the transfer robot VR picks up the wafer 200 from the load lock chamber LM1, the gate valve between the load lock chamber LM1 and the transfer chamber TM is closed. Then, the inside of the load lock chamber LM1 is returned to the atmospheric pressure, and preparations for carrying the next wafer 200 into the load lock chamber LM1 are made. At the same time, for example, a gate valve between the process chamber PM1 and the transfer chamber TM at a predetermined pressure (for example, 100 Pa) is opened, and the wafer 200 is transferred into the process chamber PM1 by the transfer robot VR. This operation is repeated until an arbitrary number (for example, five) of wafers 200 is loaded into the process chamber PM1. After carrying in an arbitrary number (for example, five) of wafers 200 into the process chamber PM1 and closing the gate valve between the process chamber PM1 and the transfer chamber TM, the wafers 200 in the process chamber PM1. A predetermined process is performed.

When the predetermined processing is completed in the process chamber PM1, the gate valve between the process chamber PM1 and the transfer chamber TM is opened, and the processed wafer 200 is unloaded from the process chamber PM1 to the transfer chamber TM by the transfer robot VR. After unloading the wafer 200, the gate valve between the process chamber PM1 and the transfer chamber TM is closed.

Subsequently, the gate valve between the transfer chamber TM and the load lock chamber LM2 is opened, and the wafer 200 transferred from the process chamber PM1 is transferred into the load lock chamber LM2 by the transfer robot VR. Note that the load lock chamber LM2 is decompressed to a preset pressure value by the exhaust device. Then, after closing the gate valve between the transfer chamber TM and the load lock chamber LM2, for example, an inert gas is introduced from an inert gas supply unit connected to the load lock chamber LM2, and the pressure in the load lock chamber LM2 is increased. Is returned to atmospheric pressure.

When the pressure in the load lock chamber LM2 is returned to atmospheric pressure, the gate valve between the load lock chamber LM2 and the transfer chamber EFEM is opened. Subsequently, after the processed wafer 200 is unloaded from the load lock chamber LM2 into the transfer chamber EFEM by the transfer robot AR, the gate valve between the load lock chamber LM2 and the transfer chamber EFEM is closed. Thereafter, the transfer robot 124 stores the processed wafer 200 in, for example, an empty carrier cassette CA3 through the substrate transfer port 134 of the transfer chamber 121. Here, the processed wafer 200 may be returned to the original carrier cassette CA1 or carrier cassette CA2 from which the wafer 200 was unloaded without being stored in the carrier cassette CA3.

When the predetermined process is performed on all the wafers 200 in the carrier cassette CA1 or the carrier cassette CA2 by the above-described process, and all the 25 processed wafers 200 are stored in the predetermined carrier cassette CA3, the substrate transfer port 134 is closed. Thereafter, the carrier cassette CA3 is transported from the load port LP3 to the next process by the transport device. By repeating the above operation, 25 wafers 200 are sequentially processed.

(2) Configuration of Process Chamber Next, the configuration of the process chamber PM1 as the first processing chamber according to the present embodiment will be described mainly with reference to FIGS. FIG. 2 is a schematic perspective view of a reaction vessel provided in the processing chamber according to the present embodiment. FIG. 3 is a schematic vertical sectional view of the processing chamber according to the present embodiment. FIG. 4 is a schematic explanatory diagram of a gas supply unit according to the present embodiment. The process chamber PM2 is configured in the same manner as the process chamber PM1, and thus the description thereof is omitted.

(Reaction vessel) As shown in FIGS. 2 and 3, the process chamber PM1 as the first processing chamber includes a reaction vessel 203 which is a cylindrical airtight vessel. A processing space for the wafer 200 is formed in the reaction vessel 203. A partition plate 205 extending radially from the center is provided above the processing space in the reaction vessel 203, that is, on the ceiling side. The partition plate 205 is configured to partition the processing space in the reaction vessel 203 into a plurality of processing regions. Specifically, in the present embodiment, the reaction vessel 203 is configured to be partitioned into a first processing region 201a, a first purge region 204a, a second processing region 201b, and a second purge region 204b. Yes.

A first source gas is supplied into the first processing region 201a, a second source gas is supplied into the second processing region 201b, and the first purge region 204a and the second purge region 204b are supplied. Inside, it is comprised so that an inert gas may be supplied. Therefore, by rotating the susceptor ST1, the first source gas, the inert gas, the second source gas, and the inert gas are alternately supplied onto the wafer 200 in this order. The configurations of the susceptor ST1 and the gas supply unit 250 will be described later.

A gap having a predetermined width is provided between the end of the partition plate 205 and the side wall of the reaction vessel 203, and the gas can pass through the gap. By injecting an inert gas into the first processing region 201a and the second processing region 201b from the first purge region 204a and the second purge region 204b and the above-described gap, Intrusion of the first source gas and the second source gas into the first purge region 204a and the second purge region 204b can be suppressed. Thereby, reaction (and the production | generation of the foreign material by this) of 1st source gas and 2nd source gas can be prevented.

In the present embodiment, the angle between the partition plates 205 is 90 degrees, but the present invention is not limited to this. That is, in consideration of the supply time of various gases to the wafer 200, the angle may be changed as appropriate, for example, by increasing the angle between the two partition plates 205 forming the second processing region 201b. .

(Susceptor) サ A susceptor ST1 as a substrate mounting portion is provided below the partition plate 205, that is, at the bottom center in the reaction vessel 203. The susceptor ST1 has a center of a rotation shaft at the center of the reaction vessel 203 and is configured to be rotatable. The susceptor ST1 is formed of a non-metallic material such as aluminum nitride (AlN), ceramics, or quartz so that the metal contamination of the wafer 200 can be reduced. The susceptor ST1 is electrically insulated from the reaction vessel 203.

The susceptor ST1 is configured to support a plurality of (for example, five in this embodiment) wafers 200 in the reaction vessel 203 side by side on the same surface and on the same circumference. Here, the term “on the same plane” is not limited to a completely identical plane. When the susceptor ST1 is viewed from above, a plurality of wafers 200 are arranged so as not to overlap each other as shown in FIG. It only has to be.

Note that a circular recess 216 (see FIG. 1) may be provided at the mounting position of the wafer 200 on the surface of the susceptor ST1. The recess 216 may be configured so that its diameter is slightly larger than the diameter of the wafer 200. By placing the wafer 200 in the recess 216, the wafer 200 can be easily positioned, and also occurs when the wafer 200 jumps out of the susceptor ST1 due to the centrifugal force accompanying the rotation of the susceptor ST1. Can be prevented from being displaced.

The susceptor ST1 is provided with a lifting mechanism 268 that lifts and lowers the susceptor ST1. The susceptor ST1 has a plurality of through holes. In addition, a plurality of wafer push-up pins that push up the wafer 200 and support the back surface of the wafer 200 when the wafer 200 is loaded into and unloaded from the reaction vessel 203 are provided on the bottom surface of the reaction vessel 203. When the wafer push-up pin is raised or when the susceptor ST1 is lowered by the elevating mechanism 268, the wafer push-up pin and the wafer push-up pin pass through the through-hole in a state that is not in contact with the susceptor ST1. Are arranged with each other. *

The elevating mechanism 268 is provided with a rotating mechanism 267 that rotates the susceptor ST1. The rotation shaft of the rotation mechanism 267 is connected to the susceptor ST1, and the susceptor ST1 can be rotated by operating the rotation mechanism 267. A control unit 280 described later is connected to the rotation mechanism 267 via a coupling unit 266. The coupling portion 266 is configured as a slip ring mechanism that electrically connects the rotating side and the fixed side with a metal brush or the like. Thereby, it is comprised so that rotation of susceptor ST1 may not be prevented. The control unit 280 is configured to control the power supplied to the rotation mechanism 267 so that the susceptor ST1 is rotated at a predetermined speed for a predetermined time. As described above, by rotating the susceptor ST1, the wafer 200 placed on the susceptor ST1 causes the first processing region 201a, the first purge region 204a, the second processing region 201b, and the second purge. It moves between the areas 204b.

(Heating section) ヒータ A heater 218 as a heating section is integrally embedded in the susceptor ST1, and the wafer 200 can be heated. When power is supplied to the heater 218, the surface of the wafer 200 is heated to a predetermined temperature (eg, room temperature to about 1000 ° C.). Note that a plurality (for example, five) of heaters 218 may be provided on the same surface so as to individually heat the respective wafers 200 placed on the susceptor ST1.

The susceptor ST1 is provided with a temperature sensor 274. A temperature regulator 223, a power regulator 224, and a heater power source 225 are electrically connected to the heater 218 and the temperature sensor 274 via a power supply line 222. Based on the temperature information detected by the temperature sensor 274, the power supplied to the heater 218 is controlled.

(Gas supply unit) As shown in FIGS. 2 and 3, an opening 251a is formed above the reaction vessel 203 in the first processing region 201a. The opening 251a is provided with a first source gas supply unit 251 that supplies the first source gas into the first processing region 201a. That is, the downstream end of the first source gas supply pipe 232a is airtightly connected to the opening 251a. As shown in FIG. 4A, on the upstream side of the first source gas supply pipe 232a, in order from the upstream direction, a first source gas supply source 233a, a mass flow controller that is a flow rate controller (flow rate control unit). (MFC) 234a and a valve 235a which is an on-off valve are provided.

From the first source gas supply pipe 232a, for example, a silicon-containing gas is supplied as the first source gas into the first processing region 201a via the mass flow controller 234a, the valve 235a, and the opening 251a. . As the silicon-containing gas, for example, trisilylamine ((SiH ₃ ) ₃ N, abbreviation: TSA) gas or the like can be used. Note that the first source gas may be any of solid, liquid, and gas at normal temperature and pressure, but will be described as a gas here. In the case where the first source gas is liquid at normal temperature and pressure, a vaporizer may be provided between the first source gas supply source 233a and the mass flow controller 234a.

A downstream end of the first inert gas supply pipe 232b is connected to the downstream side of the valve 235a of the first source gas supply pipe 232a. On the upstream side of the first inert gas supply pipe 232b, in order from the upstream direction, a first inert gas supply source 233b, a mass flow controller (MFC) 234b that is a flow rate controller (flow rate control unit), and an on-off valve A valve 235b is provided. From the first inert gas supply pipe 232b, for example, N ₂ gas is supplied as an inert gas through the mass flow controller 234b, the valve 235b, the first source gas supply pipe 232a, and the opening 251a. It is supplied into the area 201a.

As shown in FIGS. 2 and 3, an opening 251b is formed on the upper side of the reaction vessel 203 in the second processing region 201b. The opening 251b is provided with a second source gas supply unit 253 that supplies a second source gas into the second processing region 201b. That is, the downstream end of the second source gas supply pipe 232c is airtightly connected to the opening 251b. As shown in FIG. 4 (b), on the upstream side of the second source gas supply pipe 232c, a mass flow controller that is a second source gas supply source 233c and a flow rate controller (flow rate control unit) in order from the upstream direction. (MFC) 234c and a valve 235c which is an on-off valve are provided.

From the second source gas supply pipe 232c, for example, oxygen (O ₂ ) gas, which is an oxygen-containing gas, is supplied as the second source gas via the mass flow controller 234c, the valve 235c, and the opening 252b. It is supplied into the processing area 201b. The oxygen gas that is the second source gas is brought into a plasma state by, for example, a remote plasma unit and supplied to the wafer 200. Note that the oxygen gas that is the second source gas may be activated by adjusting the temperature of the heater 218 and the pressure in the reaction vessel 203 within a predetermined range. Note that ozone (O ₃ ) gas or water vapor (H ₂ O) may be used as the oxygen-containing gas.

A downstream end of the second inert gas supply pipe 232d is connected to the downstream side of the valve 235c of the second source gas supply pipe 232c. On the upstream side of the second inert gas supply pipe 232d, in order from the upstream direction, a second inert gas supply source 233d, a mass flow controller (MFC) 234d as a flow rate controller (flow rate control unit), and an on-off valve A valve 235d is provided. From the second inert gas supply pipe 232d, for example, N ₂ gas is supplied as an inert gas via the mass flow controller 234d, the valve 235d, the second source gas supply pipe 232c, and the opening 251b. It is supplied into the area 201b.

The second source gas supply unit 253 is mainly configured by the second source gas supply pipe 232b, the mass flow controller 234b, and the valve 235b. Note that the second source gas supply source 233b may be included in the second source gas supply unit 253. In addition, a second inert gas supply unit 254 is mainly configured by the second inert gas supply pipe 232d, the mass flow controller 234d, and the valve 235d. Note that the second inert gas supply source 233d and the second source gas supply pipe 232c may be included in the second inert gas supply unit 254.

As shown in FIGS. 2 and 3, an opening is opened on the upper side of the reaction vessel 203 in the first purge region 204a. The opening is provided with a third inert gas supply unit 255 that supplies an inert gas into the first purge region 204a. That is, the downstream end of the third inert gas supply pipe 232e is airtightly connected to the opening formed in the reaction vessel 203 on the upper side of the first purge region 204a. As shown in FIG. 4C, on the upstream side of the third inert gas supply pipe 232e, there are a third inert gas supply source 233e and a flow rate controller (flow rate control unit) in order from the upstream direction. A mass flow controller (MFC) 234e and a valve 235e which is an on-off valve are provided.

The third inert gas supply unit 255 is mainly configured by the third inert gas supply pipe 232e, the mass flow controller 234e, and the valve 235e. The third inert gas supply source 233e may be included in the third inert gas supply unit 255.

As shown in FIGS. 2 and 3, an opening is opened above the reaction vessel 203 in the second purge region 204b. A fourth inert gas supply unit 256 that supplies an inert gas into the second purge region 204b is provided in the opening. That is, the downstream end of the fourth inert gas supply pipe 232f is airtightly connected to the opening formed in the reaction vessel 203 on the upper side of the second purge region 204b. As shown in FIG. 4D, on the upstream side of the fourth inert gas supply pipe 232f, there are a fourth inert gas supply source 233f and a flow rate controller (flow rate control unit) sequentially from the upstream direction. A mass flow controller (MFC) 234f and a valve 235f which is an on-off valve are provided.

The fourth inert gas supply unit 256 is mainly configured by the fourth inert gas supply pipe 232f, the mass flow controller 234f, and the valve 235f. Note that the fourth inert gas supply source 233f may be included in the fourth inert gas supply unit 256.

As shown in FIGS. 2 and 3, an opening 209 that penetrates the intersecting portion of the partition plate 205 in the vertical direction is formed at the intersecting portion (center portion) of the partition plate 205. In the opening 209, each region of the first processing region 201a, the second processing region 201b, the first purge region 204a, and the second purge region 204b (hereinafter also referred to as “each region in the reaction vessel 203”). .) Is provided with a reactive gas supply unit 257 for supplying a reactive gas as a cleaning gas. That is, the downstream end of the reactive gas supply pipe 232g is airtightly connected to the opening 209. As shown in FIG. 4E, on the upstream side of the reactive gas supply pipe 232g, in order from the upstream direction, the reactive gas supply source 233g, a mass flow controller (MFC) 234g which is a flow rate controller (flow rate control unit). , And a valve 235g which is an on-off valve is provided.

From the reactive gas supply pipe 232g, for example, fluorine-containing gas or chlorine-containing gas is supplied as reactive gas to each region in the reaction vessel 203 via the mass flow controller 234g, the valve 235g, and the opening 209. The As the fluorine-containing gas, for example, nitrogen trifluoride (NF ₃ ) gas, fluorine (F ₂ ) gas, chlorine trifluoride (ClF ₃ ) gas, or the like can be used. As the chlorine-containing gas, for example, hydrogen chloride (HCl) gas, chlorine (Cl ₂ ) gas, dichlorosilane (SiH ₂ Cl ₂ ), dichloroethylene (DCE), or the like can be used.

The reactive gas supply unit 257 is mainly configured by the reactive gas supply pipe 232g, the mass flow controller 234g, and the valve 235g. Note that the reactive gas supply source 233g may be included in the reactive gas supply unit 257.

The first source gas supply unit 251 is mainly configured by the first source gas supply pipe 232a, the mass flow controller 234a, and the valve 235a. The first source gas supply source 233a may be included in the first source gas supply unit 251. Further, a first inert gas supply unit 252 is mainly configured by the first inert gas supply pipe 232b, the mass flow controller 234b, and the valve 235b. The first inert gas supply source 233b and the first source gas supply pipe 232a may be included in the first inert gas supply unit 252.

The source gas supply unit is mainly configured by the first source gas supply unit 251 and the second source gas supply unit 253. Further, the inert gas supply is mainly performed by the first inert gas supply unit 252, the second inert gas supply unit 254, the third inert gas supply unit 255, and the fourth inert gas supply unit 256. The part is composed. Further, the gas supply unit 250 is mainly configured by the source gas supply unit, the inert gas supply unit, and the reactive gas supply unit 257.

(Exhaust part) The reaction vessel 203 is provided with an exhaust pipe 231 for exhausting the atmosphere in the

processing regions

201a and 201b and the

purge regions

204a and 204b. The exhaust pipe 231 includes a flow rate adjusting valve 245 for adjusting the flow rate when the atmosphere in the reaction vessel 203 (in the

processing regions

201a and 201b and the

purge regions

204a and 204b) is discharged, and a pressure regulator (pressure adjusting unit). A vacuum pump 246 as an evacuation device is connected via an APC (Auto Pressure Controller) valve 243 as a evacuator so that the pressure in the reaction vessel 203 becomes a predetermined pressure (degree of vacuum). It is configured. The APC valve 243 is an open / close valve that can open and close the valve to stop evacuation and evacuation in the reaction vessel 203, and further adjust the valve opening to adjust the pressure. An exhaust section is mainly configured by the exhaust pipe 231, the APC valve 243, and the flow rate adjustment valve 245. The vacuum pump 246 may be included in the exhaust part.

(Control Unit) A control unit (controller) 280 as control means is electrically connected to the substrate processing apparatus 10. The control unit 280 is configured to control the heater 218, the mass flow controllers 234a to 234g, the valves 235a to 235g, the APC valve 243, the vacuum pump 246, and the like. The configuration and operation of the control unit 280 will be described later.

(3) Substrate Processing Step Next, as one step of the semiconductor manufacturing process according to the present embodiment, a substrate processing step performed using the process chamber PM1 including the reaction vessel 203 described above will be mainly described with reference to FIG. explain. FIG. 5 is a flowchart showing a substrate processing process according to this embodiment. Such a substrate processing step is repeatedly executed based on a process recipe for performing a predetermined process on the wafer 200. In addition, a process recipe may include a plurality of steps. In the following description, the operation of each part constituting the process chamber PM1 of the substrate processing apparatus 10 is controlled by the control unit 280.

Here, trisilylamine (TSA), which is a silicon-containing gas, is used as the source gas, oxygen gas, which is an oxygen-containing gas, is used as the reaction gas, and a silicon oxide film (SiO ₂ film, which is an insulating film) on the wafer 200. Hereinafter, an example of forming an SiO film will be described.

(Substrate Loading / Placing Step (S10)) First, the wafer push-up pin is raised to the transfer position of the wafer 200, and the wafer push-up pin is passed through the through hole of the susceptor ST1. As a result, the wafer push-up pins are projected from the surface of the susceptor ST1 by a predetermined height. Subsequently, the gate valve between the process chamber PM1 and the transfer chamber TM is opened, and a predetermined number (for example, five) of wafers 200 is loaded into the reaction vessel 203 using the transfer robot VR. Then, the wafers 200 are placed on the same surface of the susceptor ST1 so that the wafers 200 do not overlap with each other about the rotation axis of the susceptor ST1. Thereby, the wafer 200 is supported in a horizontal posture on the wafer push-up pins protruding from the surface of the susceptor ST1.

When the wafer 200 is loaded into the reaction vessel 203, the transfer robot VR is moved out of the reaction vessel 203, and the gate valve between the process chamber PM1 and the transfer chamber TM is closed to seal the reaction vessel 203 inside. Thereafter, the wafer push-up pins are lowered to place the wafer 200 on the susceptors 217 on the bottom surfaces of the first processing area 201a, the first purge area 204a, the second processing area 201b, and the second purge area 204b. To do.

When the wafer 200 is carried into the reaction vessel 203, N ₂ gas as a purge gas may be supplied from the inert gas supply unit into the reaction vessel 203 while the reaction vessel 203 is exhausted by the exhaust unit. . That is, the vacuum pump 246 is operated to open the APC valve 243 to evacuate the inside of the reaction vessel 203. For example, the valve 235a of the first inert gas supply unit 252 is opened to supply N ₂ gas into the reaction vessel 203. Good. Thereby, it is possible to suppress the intrusion of particles into the

processing regions

201 a and 201 b and the adhesion of particles onto the wafer 200. Here, the inert gas is not limited to the case where the inert gas is supplied from the first inert gas supply unit 252, and the inert gas is supplied from at least one of the first to fourth inert

gas supply units

252, 254, 255, and 256. Can be supplied.

(Temperature / Pressure Adjustment Step (S20)) Next, power is supplied to the heater 218 embedded in the susceptor ST1, and the surface of the wafer 200 has a predetermined temperature (for example, 200 ° C. or more and 400 ° C. or less). Heat to At this time, the temperature of the heater 218 is adjusted by controlling the power supplied to the heater 218 based on the temperature information detected by the temperature sensor 274.

The inside of the reaction vessel 203 is evacuated by a vacuum pump 246 so that the inside of the reaction vessel 203 has a desired pressure (for example, 0.1 Pa to 300 Pa, preferably 20 Pa to 40 Pa). At this time, the pressure in the reaction vessel 203 is measured by a pressure sensor, and the opening degree of the APC valve 243 is feedback-controlled based on the measured pressure information.

Further, while the wafer 200 is heated, the rotation mechanism 267 is operated to start the rotation of the susceptor ST1. At this time, the rotation speed of the susceptor ST1 is controlled by the control unit 280. The rotation speed of the susceptor ST1 is, for example, 1 rotation / second. The susceptor ST1 is always rotated until the film forming step (S30) described later is completed. By rotating the susceptor ST1, the wafer 200 starts moving in the order of the first processing region 201a, the first purge region 204a, the second processing region 201b, and the second purge region 204b, and each region is moved to the wafer. 200 will pass.

(Film Formation Step (S30)) Next, TSA gas as the first source gas is supplied into the first processing region 201a, and oxygen gas as the second source gas is supplied into the second processing region 201b. By supplying, a step of forming a SiO film on the wafer 200 is performed. In the following description, the TSA gas supply, the oxygen gas supply, and the inert gas supply are performed in parallel.

When the wafer 200 is heated to reach a desired temperature and the susceptor ST1 reaches a desired rotation speed, at least the

valves

235a, 235c, 235e, and 235f are opened, and the first source gas, the second source gas, and the non-source gas are discharged. Supply of the active gas to the

processing regions

201a and 201b and the

purge regions

204a and 204b is started. That is, the valve 235a is opened to start supplying TSA gas into the first processing region 201a, the valve 235c is opened to start supplying oxygen gas into the second processing region 201b, and the valve 235e is opened to open the first gas. starts the supply of the N ₂ gas is an inert gas into the first purge region 204a, starts supplying N ₂ gas is an inert gas to the second purge region 204b by opening the valve 235f. At this time, at least the APC valve 243 is appropriately adjusted so that the pressure in the reaction vessel 203 is, for example, a pressure in the range of 10 Pa to 1000 Pa. At this time, the temperature of the heater 218 is set to such a temperature that the temperature of the wafer 200 becomes a temperature in the range of 200 ° C. to 400 ° C., for example.

That is, the valve 235a is opened, and the exhaust gas is exhausted from the exhaust pipe 231 while supplying the TSA gas from the first source gas supply pipe 232a to the first processing region 201a through the opening 251a. At this time, the mass flow controller 234a is adjusted so that the flow rate of the TSA gas becomes a predetermined flow rate. Note that the TSA gas supply flow rate controlled by the mass flow controller 234a is, for example, a flow rate in the range of 100 sccm to 5000 sccm.

When supplying the TSA gas into the first processing region 201a, the valve 235b is opened, and N ₂ gas as a carrier gas or a dilution gas is supplied from the first inert gas supply pipe 232b into the first processing region 201a. It is good to supply to. Thereby, supply of TSA gas into the 1st processing field 201a can be promoted.

Further, the valve 235a is opened, and the valve 235c is further opened, and the exhaust gas is exhausted from the exhaust pipe 231 while oxygen gas is supplied from the second source gas supply pipe 232c into the second processing region 201b through the opening 252b. At this time, the mass flow controller 234c is adjusted so that the flow rate of the oxygen gas becomes a predetermined flow rate. Note that the supply flow rate of the oxygen gas controlled by the mass flow controller 234c is, for example, a flow rate in the range of 1000 sccm to 10,000 sccm. The oxygen gas is brought into a plasma state by, for example, a remote plasma unit before being supplied to the second processing region 201b.

When supplying oxygen gas into the second processing region 201b, the valve 235d is opened, and N ₂ gas as a carrier gas or a dilution gas is supplied from the second inert gas supply pipe 232d into the second processing region 201b. It is good to supply to. Thereby, supply of oxygen gas into the 2nd processing field 201b can be promoted.

Further, the

valves

235a and 235c are opened, and the

valves

235e and 235f are further opened, and N ₂ gas, which is an inert gas as a purge gas, is supplied to the third inert gas supply pipe 232e and the fourth inert gas supply pipe. The gas is exhausted from the exhaust pipe 231 while being supplied from 232f to the first purge region 204a and the second purge region 204b. At this time, the

mass flow controllers

234e and 234f are respectively adjusted so that the flow rate of the N ₂ gas becomes a predetermined flow rate. A gap is provided between the end of the partition plate 205 and the side wall of the reaction vessel 203. By injecting an inert gas into the first processing region 201a and the second processing region 201b from the first purge region 204a, the second purge region 204b, and the gaps described above, the first Intrusion of the first source gas and the second source gas into the purge region 204a and the second purge region 204b can be suppressed.

As described above, by rotating the susceptor ST1, the wafer 200 repeatedly moves in the order of the first processing region 201a, the first purge region 204a, the second processing region 201b, and the second purge region 204b. Therefore, TSA gas supply, N ₂ gas supply (purge), plasma oxygen gas supply, and N ₂ gas supply (purge) are performed on wafer 200 as one cycle, and this cycle is performed a predetermined number of times. Will be.

First, TSA gas is supplied to the surface of the wafer 200 that has passed through the first processing region 201 a, and a silicon-containing layer is formed on the wafer 200.

Next, the wafer 200 on which the silicon-containing layer is formed passes through the first purge region 204a. At this time, N ₂ gas which is an inert gas is supplied to the wafer 200.

Next, oxygen gas is supplied to the wafer 200 that has passed through the second processing region 201b, and a silicon oxide layer (SiO layer) is formed on the wafer 200. That is, the oxygen gas reacts with a part of the silicon-containing layer formed on the wafer 200 in the first processing region 201a. As a result, the silicon-containing layer is oxidized and modified into a SiO layer containing silicon and oxygen.

Then, the wafer 200 on which the SiO layer is formed in the second processing region 201b passes through the second purge region 204b. At this time, N ₂ gas which is an inert gas is supplied to the wafer 200.

In this way, one rotation of the susceptor ST1 is defined as one cycle, that is, one cycle is the passage of the wafer 200 through the first processing region 201a, the first purge region 204a, the second processing region 201b, and the second purge region 204b. By performing this cycle at least once, a SiO film having a predetermined thickness can be formed on the wafer 200.

After the SiO film having a desired thickness is formed on the wafer 200, at least the valve 234a and the valve 235c are closed, and the supply of the TSA gas and the oxygen gas to the first processing region 201a and the second processing region 201b is stopped. Then, the film forming step (S30) is completed.

It should be noted that the conditions such as the temperature of the wafer 200, the pressure in the reaction vessel 203, the flow rate of each gas, the processing time, etc. in the substrate loading / mounting step (S10) to the film forming step (S30) are subject to modification. It is arbitrarily adjusted depending on the material and film thickness of the film.

(Pressure Adjustment / Substrate Unloading Step (S40)) したら After the film formation step (S30) is completed, the opening of the APC valve 243 is adjusted to set the pressure in the reaction vessel 203 to a predetermined pressure (pressure adjustment). Then, the wafer push-up pins are raised, and the wafer 200 is supported on the wafer push-up pins protruded from the surface of the susceptor ST1. At this time, the wafer 200 is supported at a height that is not affected by the heater 218. Thereafter, the gate valve between the process chamber PM1 and the transfer chamber TM is opened, and the wafer 200 is unloaded from the process chamber PM1 (outside the reaction vessel 203) using the transfer robot VR.

(Cumulative film thickness value update step (S50)) 後 After the film formation step (S30) is completed, the above described film formation step (S30) causes the susceptor ST1 and the susceptor ST1 by the cumulative film thickness value update function 285 of the control unit 280 described later. A film thickness value deposited on each partition portion facing each region in the reaction vessel 203 is calculated for each region in the susceptor ST1 and the reaction vessel 203. Then, the calculated film thickness value is added to the accumulated film thickness value of the deposits of the partition portions facing the respective regions in the susceptor ST1 and the reaction vessel 203, and the accumulated film thickness value is updated. In addition, the calculation method of the film thickness value to add is mentioned later.

(Cleaning step (S60)) After the accumulated film thickness value updating step (S50) is finished, if the accumulated film thickness value exceeds a predetermined value, the above-described film formation step (S30) is performed in each region in the reaction vessel 203. A cleaning process (S60) is performed to etch away particles deposited on (deposit on) the facing partition and the susceptor ST1 and by-products generated in the reaction vessel 203. In the cleaning step (S60) according to the present embodiment, the deposits are sequentially removed from the region where the film thickness value of the deposit is the smallest (minimum film thickness region) (the film thickness value of the deposit is 0 (zero)). ). Here, the cleaning process is preferably executed when a predetermined threshold value is exceeded based on the accumulated film thickness value of the susceptor ST1. This is because the susceptor ST1 has the highest cumulative film thickness because the susceptor ST1 includes a heater among the partitions and susceptors ST1 facing each region in the reaction vessel 203. However, the present invention is not limited to this, and it goes without saying that the threshold value may be set based on the film thickness value of the deposit adhering to the partition facing the region where the film thickness value is the smallest (minimum film thickness region). Yes.

[Reactive Gas Supply Time Calculation Step (S61)] First, based on the film thickness value of the region where the film thickness value of the deposit is the smallest (minimum film thickness region) among the regions in the susceptor ST1 or the reaction vessel 203. The reactive gas supply time is calculated as described later. Note that the film thickness value in the minimum film thickness region is not 0 (zero). Needless to say, the supply time of the reactive gas may be calculated for each region in the susceptor ST1 or the reaction vessel 203, respectively. Although details will be described later, if the supply flow rates of the reactive gas and the inert gas supplied to each region are adjusted, the susceptor ST1 or the reaction vessel 203 is deposited on the partition facing each region. Reactive gas supply to the region with the largest deposit film thickness value (maximum film thickness region) when the supply time calculated for each region differs because the deposit thickness values are different Can be timed.

[Cleaning Gas Supply Step (S62)] Next, power is supplied to the heater 218 embedded in the susceptor ST1, and the reaction vessel 203 is heated to a predetermined temperature. At this time, the temperature of the heater 218 is adjusted by controlling the power supplied to the heater 218 based on the temperature information detected by the temperature sensor 274.

Also, while rotating the inside of the reaction vessel 203, the rotation mechanism 267 is operated to start the rotation of the susceptor ST1. At this time, the rotation speed of the susceptor ST1 is controlled by the controller 221. The rotation speed of the susceptor ST1 is, for example, 1 rotation / second. The susceptor ST1 is preferably rotated until the cleaning gas supply step (S62) is completed. Further, a dummy substrate may be placed on the susceptor ST1.

When the inside of the reaction vessel 203 is heated and reaches a desired temperature, at least one of the first cleaning gas supply unit 253 and the second cleaning gas supply unit 254 enters the reaction vessel 203 with three gases as cleaning gas. Supply of nitrogen fluoride (NF ₃ ) gas is started. At this time, the APC valve 243 is appropriately adjusted so that the pressure in the reaction vessel 203 is, for example, a pressure in the range of 10 Pa to 1000 Pa.

When the inside of the reaction vessel 203 reaches a desired pressure and a desired temperature, supply of a reactive gas as a cleaning gas from the reactive gas supply unit 257 to each region in the reaction vessel 203 is started. That is, the valve 235g is opened, and the first processing region 201a, the second processing region 201b, the first purge region 204a, or the second purge region is controlled from the reactive gas supply pipe 232g by the mass flow controller 234g. Reactive gas is supplied to at least one of 204b. For example, nitrogen trifluoride (NF ₃ ) is used as the reactive gas, and the reactive gas supplied from the reactive gas supply unit 257 is supplied into the reaction vessel 203 in a plasma state in advance by, for example, a remote plasma mechanism. The supply flow rate of the reactive gas controlled by the mass flow controller 234g is preferably a flow rate in the range of 100 sccm to 5000 sccm, for example.

When supplying at least the reactive gas from the reactive gas supply unit 257 to each region in the reaction vessel 203, each region is determined based on the film thickness value of the deposit in the partition facing each region in the reaction vessel 203. The supply flow rates of the reactive gas and the inert gas to be supplied are adjusted. That is, an inert gas is supplied to a region where the film thickness value is 0 (for example, a region where the removal of deposits has been completed) so that the reactive gas is not supplied. For example, when the film thickness value of the deposit in the first purge region 204a is 0 (zero), the valve 235e is opened so that the reactive gas is not supplied to the first purge region 204a, and the flow rate is controlled by the mass flow controller 234f. An inert gas (eg, N ₂ gas) is supplied to the first purge region 204a while being controlled. In this way, the gas supplied to the region where the film thickness value of the deposit is 0 (zero) by the reactive gas (cleaning gas) is switched from the reactive gas to the inert gas.

When the calculated reaction gas supply time has elapsed, at least the valve 235 g is closed, and the supply of the reactive gas to each region in the reaction vessel 203 is stopped. Then, the opening of the APC valve 243 is adjusted to set the pressure in the reaction vessel 203 to a predetermined pressure. Note that the gas supplied to each region may be switched from a reactive gas to an inert gas as described above. In this way, the reactive gas is prevented from being supplied to the region where the film thickness value of the deposit is 0 (zero) by the reactive gas (cleaning gas). Here, the supply flow rate of the inert gas supplied to the region where the film thickness value of the deposit is 0 (zero) is made larger than the supply flow rate of the inert gas and the supply flow rate of the reactive gas supplied to the other regions. You may comprise.

(Cumulative film thickness update process (S70)) After the cleaning process (S60) is completed, the susceptor ST1 and the reaction container are processed by the above-described cleaning process (S60) by the cumulative film thickness update function 285 of the control unit 280 described later. The film thickness value of the deposit removed by etching from the partition portion facing each region in 203 is calculated for each partition portion facing the region in susceptor ST1 and reaction vessel 203. Then, the calculated film thickness value is subtracted from the accumulated film thickness value of the deposits of the partition portions facing the respective regions in the susceptor ST1 and the reaction vessel 203, and the accumulated film thickness value is updated. A method for calculating the film thickness value to be subtracted will be described later.

In the above-described cleaning step (S60) and cumulative film thickness value updating step (S70), the deposits are sequentially removed from the minimum film thickness region among the regions in the reaction vessel 203 (the film thickness value of the deposit is set to 0). This is repeated until the film thickness values of the partitions facing all the regions in the susceptor ST1 and the reaction vessel 203 become zero. When the film thickness values of the partition portions facing all regions in the susceptor ST1 and the reaction vessel 203 become 0, the substrate processing process according to the present embodiment is finished.

(4) Configuration of Control Unit Next, the control unit 280 as a control unit that controls the substrate processing apparatus 10 will be described mainly with reference to FIG. FIG. 6 is a schematic configuration diagram of the control unit 280 of the substrate processing apparatus suitably used in the present embodiment. The process chamber PM2 is configured in the same manner as the process chamber PM1, and thus the description thereof is omitted.

As shown in FIG. 6, the control unit 280 includes an operation unit controller 236, a switching hub (SW Hub) 239h connected to the operation unit controller 236, and a transport controller 239t as a transport control unit connected to the switching hub 239h. And a process chamber controller 239p as a processing control unit connected to the switching hub 239h. The transfer controller 239t and the process chamber controller 239p are electrically connected to the operation unit controller 236 via the switching hub 239h via the communication network 20 such as a LAN (so that data can be exchanged). In addition, a robot controller 11 that controls the transfer robot VR included in the transfer chamber TM and the transfer robot AR included in the transfer chamber EFEM is connected to the operation unit controller 236 via the communication network 20 via the switching hub 239h. Yes. The operation unit controller 236 is connected to a customer's host computer 237u via a switching hub 239h.

The control unit 280 as a control unit is provided inside the substrate processing apparatus 10 and is configured to control each unit of the substrate processing apparatus 10 by including a transfer controller 239t and a process chamber controller 239p. Note that the transfer controller 239t and the process chamber controller 239p may be provided outside the substrate processing apparatus 10.

(Operation Unit Controller) 操作 The operation unit controller 236 includes, for example, a central processing unit (CPU). The operation unit controller 236 is an interface with an operator, and is configured to accept an operation by the operator via an operation terminal 236s including an input / output unit, a display unit, and the like. That is, for example, a mouse, a keyboard, and the like are connected to the operation terminal 236s as an input / output unit. In addition, a display unit such as a display is connected to the operation terminal 236s. The operation terminal 236s is configured to display, for example, an operation input reception screen such as a touch panel, accumulated film thickness data in which accumulated film thickness values of deposits in each region in the susceptor ST1 and the reaction vessel 203 are described, and the like. Has been.

The operation unit controller 236 includes a storage unit 236m such as a storage device including a flash memory, an HDD (Hard Disk Drive), a CD-ROM, and the like. In the storage unit 236m, a control program for controlling the operation of the substrate processing apparatus 100, a process recipe in which, for example, processing procedures and conditions for forming a thin film on the wafer 200, and deposits in the processing chamber PM1 are stored. A cleaning recipe that describes the procedure and conditions of the cleaning process to be removed, a recipe that includes a transfer recipe that describes the transfer procedure and conditions of the wafer 200, and various parameters that are used when executing these recipes. , Stored in a readable manner.

Also, a deposition rate is set in the process recipe. The deposition rate is a rate of deposits deposited on the susceptor ST1 per unit time, for example, by performing a film forming process in which a raw material gas is supplied into the process chamber PM1 to form a thin film on the wafer 200. . The film thickness value of the deposit deposited on the susceptor ST1 is calculated by multiplying the deposition rate by the supply time of the source gas. For example, when a film forming process in which the set value of the deposition rate is 10 nm / min and the supply time of the source gas is 1 minute is performed, the film thickness value of the deposit deposited on the susceptor ST1 is 10 nm. The unit of the deposition rate unit time is not limited to minutes, and may be, for example, seconds.

Also, the etching rate is set in the cleaning recipe. The etching rate refers to, for example, a susceptor ST1 per unit time by supplying a reactive gas (cleaning gas) into the process chamber PM1 and performing a process (removal process) for removing deposits in the process chamber PM1. The rate of deposits removed from above. The film thickness value of the deposit removed from the susceptor ST1 is calculated by multiplying the etching rate by the supply time of the reactive gas. For example, when a removal process in which the set value of the etching rate is 10 nm / min and the supply time of the reactive gas is 1 minute is executed, the film thickness value of the deposit etched from above the susceptor ST1 becomes 10 nm. The unit of the etching rate time is not limited to minutes, and may be, for example, seconds.

In the storage unit 236m, a deposition ratio table file and an etching ratio table file are stored so as to be readable. The deposition ratio table file is associated with the process recipe. When a plurality of deposition ratio tables are stored in the storage unit 236m, for example, when setting each step of the process recipe, the deposition ratio table file to be used is specified by specifying the deposition ratio table number. It is configured. The etching ratio table file is associated with the cleaning recipe. When a plurality of etching ratio tables are stored in the storage unit 236m, for example, when setting each step of the cleaning recipe, by specifying an etching ratio table number, an etching ratio table file to be used is specified. It is configured.

Here, the deposition ratio table is a table in which the deposition ratio of each region in the susceptor ST1 and the reaction vessel 203 is described. The deposition ratio is a process recipe of a film thickness value of deposits deposited on the surface of the partition 205 that faces each region in the susceptor ST1 and the reaction vessel 203 when the process recipe associated with the deposition ratio table is executed. It is the ratio to the deposition rate set within. The etching ratio table is a table in which the etching ratios of the respective regions in the susceptor ST1 and the reaction vessel 203 are described. The etching ratio is set in the cleaning recipe of the film thickness value of the deposit removed from each of the regions in the susceptor ST1 and the reaction vessel 203 when the cleaning recipe associated with the etching ratio table is executed. It is a ratio to the etching rate.

The operation unit controller 236 is not limited to being configured as a dedicated computer, but may be configured as a general-purpose computer. In this case, an external storage device storing the above-described program (for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or DVD, a magneto-optical disk such as an MO, a semiconductor memory such as a USB memory or a memory card) ) And installing the program in a general-purpose computer using such an external storage device, the process chamber controller 239p and the transfer controller 239t can be configured. Note that the means for supplying the program to the computer is not limited to supplying the program via the external storage device described above. For example, the program may be supplied using communication means such as the Internet or a dedicated line without using the external storage device described above. Note that the storage device or the external storage device as the storage unit 236m is configured as a computer-readable recording medium. Hereinafter, these are collectively referred to simply as a recording medium. Note that when the term “recording medium” is used in this specification, it may include only a single storage device, only a single external storage device, or both.

(Transfer Controller) 搬送 The transfer controller 239t is mainly configured to control transfer of the wafer 200. The transport controller 239t is composed of, for example, a central processing unit (CPU). The transport controller 239t is connected to a digital signal line 30 such as DeviceNet, and the on / off of the valve digital I / O 13 for controlling the supply of the source gas and the reactive gas and the on / off of the exhaust valve, and various switches (SW). SW digital I / Os 14 are connected to each other via the sequencer 12. That is, the transport controller 239t is connected to, for example, the transport robot VR, the transport robot AR, the susceptor ST1, the rotation mechanism 267, the lifting mechanism 268, and the like. The transfer controller 239t, for example, transmits control data (control instruction) when transferring the wafer 200 based on the contents of the transfer recipe created or edited by the operator via the operation unit controller 236, the transfer robot VR, the transfer robot It is configured to output to the AR, the susceptor ST1, the rotation mechanism 267, the lifting mechanism 268, etc., and to control the transfer operation of the wafer 200.

Further, the transport controller 239t has a storage unit 16 in which barcodes 1, 2, 3,... Indicating carrier IDs for identifying the carrier cassettes CA1 to CA3 mounted on the load ports LP1 to LP3 are stored. For example, it is connected through a serial line 40.

(Process Chamber Controller) The process chamber controller 239p is configured to control processing of the wafer 200 in the process chamber PM1. The process chamber controller 239p is composed of, for example, a central processing unit (CPU). The process chamber controller 239p includes a storage device such as a flash memory, an HDD (Hard Disk Drive), a CD-ROM, or the like. In the storage device, the control program and, for example, the susceptor ST1 in the processing chamber PM1 and the film thickness value of deposits deposited in each region (hereinafter also referred to as accumulated film thickness data) are stored in a readable manner. Has been.

The process chamber controller 239p is connected to a digital signal line 30 such as DeviceNet to supply a source gas and a reactive gas and to control on / off of a valve for exhaust, on / off of various switches (SW) and the like. SW digital I / Os 14 for controlling the turn-off are connected to each other via the sequencer 12. The process chamber controller 239p, for example, the control data (control instruction) when processing the wafer 200 based on the content of the process recipe created or edited by the operator via the operation unit controller 236, the pressure controller 15, Outputs to valves 235a to 235g, 243, various switches, mass flow controllers 234a to 234g, heater 218, etc. are configured to control the processing of wafer 200 in process chamber PM1.

The pressure controller 15 is connected to the process chamber controller 239p via the serial line 40, for example. The pressure controller 15 is connected to a pressure sensor for controlling the pressure in the process chamber PM1, an APC valve 243, a vacuum pump 246, and the like. The pressure controller 15 is configured to control the APC valve 243 and the vacuum pump 246 so that the pressure in the process chamber PM1 becomes a predetermined pressure at a predetermined timing based on the pressure value detected by the pressure sensor. Has been. *

(5) Functional Configuration of Control Unit Next, the functional configuration of the control unit 280 as the control unit will be described mainly with reference to FIG. FIG. 7 is a block diagram illustrating a functional configuration of the control unit 280 according to the present embodiment. The process chamber PM2 is configured in the same manner as the process chamber PM1, and thus the description thereof is omitted.

As shown in FIG. 7, the operation unit controller 236 reads and executes a program stored in the storage device as the storage unit 236m, thereby executing a recipe start function 281, a recipe editing function 282, and a cumulative film thickness display function. 283 and the like are realized. The process chamber controller 239p is configured to realize a recipe execution function 284, an accumulated film thickness value update function 285, and the like by reading and executing a program stored in the storage unit 236m. Needless to say, the process recipe in the operation unit controller 236 is downloaded in advance and stored in a storage device included in the process chamber controller 239p.

(Recipe start function) レシピ The recipe start function 281 receives input of recipe specifying information from the input / output unit, for example, when the operator inputs a recipe name in the input field. When the recipe start function 281 receives input of recipe specifying information from the input / output unit, the recipe start function 281 transmits an instruction to start executing the recipe to the recipe execution function 284 of the process chamber controller 239p described later.

(Recipe editing function) レシピ The recipe editing function 282 displays, for example, input fields for inputting recipe specifying information for specifying a process recipe and a cleaning recipe, table specifying information for specifying a deposition ratio table and an etching ratio table, and the like on the display unit. . The recipe editing function 282 accepts input of recipe specifying information and table specifying information from the input / output unit, for example, when an operator inputs a recipe name and a table name in an input field. When the recipe editing function 282 receives input of recipe specifying information or table specifying information from the input / output unit, the recipe editing function 282 is specified by the process recipe or cleaning recipe specified by the recipe specifying information from the storage unit 236m, or table specifying information. The deposition ratio table and the etching ratio table are read out. The recipe editing function 282 displays a process recipe editing screen, a cleaning recipe editing screen, a deposition rate table editing screen, and an etching rate table editing screen read from the storage unit 236m on the display unit. Note that the recipe editing function 282 may display a plurality of editing screens on a display unit included in the operation terminal 236s when receiving input of a plurality of recipe specifying information and table specifying information from the input / output unit.

Here, an example of the edit screen displayed on the display unit (operation screen) of the operation terminal 236s is shown in FIGS. FIG. 8 is a diagram illustrating an example of an operation screen displayed by the control unit 280 according to the present embodiment. FIG. 8A illustrates an example of a process recipe editing screen, and FIG. 8B illustrates a deposition ratio table editing screen. An example is shown. FIG. 9 is a diagram illustrating an example of an operation screen displayed by the control unit 280 according to the present embodiment. FIG. 9A illustrates an example of a cleaning recipe editing screen. FIG. 9B illustrates an etching ratio table editing screen. An example is shown. The process chamber PM2 is configured in the same manner as the process chamber PM1, and thus the description thereof is omitted. That is, for example, as shown in FIG. 8A, the process recipe file name, the deposition rate setting value, the deposition ratio table number (deposition ratio table name) associated with the process recipe, etc. An input field for inputting is displayed. Further, for example, as shown in FIG. 8B, on the edit screen of the deposition ratio table, an input field for inputting the deposition ratio table number, the deposition ratio of each region in the susceptor ST1 and the reaction vessel 203, and the like. Is displayed. Also, for example, as shown in FIG. 9A, the cleaning recipe editing screen includes a cleaning recipe file name, an etching rate setting value, an etching ratio table number (etching ratio table name) related to the cleaning recipe, and the like. An input field for inputting is displayed. Further, for example, as shown in FIG. 9B, the etching ratio table edit screen has an input field for inputting the etching ratio table number, the etching ratio of each region in the susceptor ST1 and the reaction vessel 203, and the like. A check box for designating the minimum film thickness area is displayed.

Further, the process recipe editing screen shown in FIG. 8A and the cleaning recipe editing screen shown in FIG. 9A include, for example, a film forming process and a processing temperature of the cleaning process, a source gas, a reactive gas, Input fields for entering settings such as the supply flow rate of inert gas, valve opening and closing, pressure in the process chamber PM1, mechanism operation, radio frequency (RF) output, and monitoring method for deviation alarm from monitor value Etc. may be displayed.

The recipe editing function 282 receives update information of the set value from the input / output unit, for example, when an operator inputs set values such as a deposition rate, an etching rate, a deposition rate, and an etching rate in a predetermined input field. When the recipe editing function 282 receives update information of setting values from the input / output unit, the recipe editing function 282 updates the setting values of the process recipe, cleaning recipe, deposition rate table, and etching rate table, and updates the updated process recipe, cleaning recipe, and deposition rate. The table and the etching ratio table are stored in the storage unit 236m so as to be readable.

Here, in the process chamber PM1 described above, the first processing region 201a and the second processing region 201b are separated from the first purge region 204a and the second purge region 204b by the partition portions facing these regions. As the amount of deposits deposited on the substrate increases, the film thickness value of the deposits increases. In addition, the first processing region 201a to which a TSA gas called a precursor, for example, is supplied as the first source gas is a second processing region 201b to which, for example, oxygen (O ₂ ) gas is supplied as the second source gas. In comparison, the amount of deposits deposited on the partition facing this region increases. Further, as described above, for example, nitrogen (N ₂ ) gas is supplied to each of the first purge region 204a and the second purge region 204b as an inert gas. The amount of deposits deposited in the purge region 204a may be different from the amount of deposits deposited in the second purge region 204b.

Therefore, the recipe editing function 282 is configured to edit and update the set values of the deposition rate and the etching rate for each region in the susceptor ST1 and the reaction vessel 203. Specifically, for example, as shown in FIG. 8B, for example, an operator sets the setting value of the deposition ratio of the susceptor ST1 to 100%, sets the setting value of the deposition ratio of the first processing region 201a to 80%, The predetermined input is 60% for the deposition ratio setting value of the

second processing region

201b, 30% for the

first purge region

204a, and 40% for the second purge region 204b. By inputting in the column, the set value of the deposition ratio can be edited for each region in the susceptor ST1 and the reaction vessel 203. For example, as shown in FIG. 9B, the operator sets the etching ratio setting value of the susceptor ST1 to 100%, sets the etching ratio setting value of the first processing region 201a to 50%, In the predetermined input field, the etching ratio setting value of the processing area 201b is 50%, the etching ratio setting value of the first purge area 204a is 50%, and the etching ratio setting value of the second purge area 204b is 50%. By inputting, the set value of the etching ratio can be edited for each region in the susceptor ST1 and the reaction vessel 203. The deposition ratio or etching ratio can be appropriately set in consideration of the rotation speed and rotation direction of the susceptor ST1, the type of source gas and reactive gas, the film formation temperature, the etching temperature, the pressure, and the like. Further, the deposition ratio or the etching ratio may be appropriately set according to, for example, experimental results or experience values.

(Cumulative Film Thickness Display Function) 累積 The cumulative film thickness display function 283 receives, for example, cumulative film thickness data updated by a cumulative film thickness value update function 285 included in the process chamber controller 239p described later from the process chamber controller 239p. The cumulative film thickness display function 283 displays the received cumulative film thickness data on the display unit provided in the operation terminal 236s.

(Recipe execution function) レシピ When the recipe execution function 284 receives an instruction to start executing a recipe from the above-described recipe start function 281, the recipe execution function 284 sends a process recipe or cleaning recipe transmission request specified by the recipe specification information received by the input / output unit. Output to the operation unit controller 236. The recipe execution function 284 receives and acquires the process recipe or cleaning recipe specified by the recipe specifying information from the operation unit controller 236, and stores it in, for example, a storage device included in the process chamber controller 239p.

In addition, the recipe execution function 284 operates a transmission request for a related deposition ratio table file or etching ratio table file when a deposition ratio table file or an etching ratio table file is associated with the acquired process recipe or cleaning recipe. To the controller 236. The recipe execution function 284 automatically receives and acquires the deposition ratio table file or the etching ratio table file from the operation unit controller 236, and stores it in, for example, a storage device provided in the process chamber controller 239p. After acquiring the etching ratio table file, the recipe execution function 284 transmits the etching ratio table file acquisition information to the cumulative film thickness value update function 285 described later.

The recipe execution function 284 reads the contents of the process recipe acquired from the operation unit controller 236, controls the valve digital I / O 13 and the SW digital I / O 14 so as to follow the contents of the process recipe, and executes the process recipe. When the recipe execution function 284 finishes executing the process recipe, the recipe execution function 284 transmits information on the completion of the process recipe execution to the cumulative film thickness value update function 285 described later.

[Reactive Gas Supply Time Calculation] レシピ Recipe execution function 284, when receiving the acquisition information of the etching ratio table file, reads the accumulated film thickness data stored in the storage device provided in process chamber controller 239p. The recipe execution function 284 displays the read accumulated film thickness data on the display unit provided in the operation terminal 236s. The cumulative film thickness value update function 285 displays an input field or the like for inputting an etching ratio table number (name of the etching ratio table) on the display unit provided in the operation terminal 236s.

The recipe execution function 284 accepts the input of the etching ratio table specifying information from the input / output unit, for example, when the operator inputs the etching ratio table number in the input field. When receiving the input of the etching ratio table specifying information, the recipe execution function 284 reads the etching ratio table specified by the etching ratio table specifying information from the etching ratio table file stored in the storage unit 236m. The recipe execution function 284 displays the read etching ratio table on the display unit provided in the operation terminal 236s as shown in FIG. 9B, for example.

The recipe execution function 284, for example, allows the operator to check the accumulated film thickness data displayed on the display unit provided with the operation terminal 236s and check the minimum film thickness area check box to input the minimum film thickness from the input / output unit. The input of the minimum film thickness area specifying information for specifying the thickness area is received. When the recipe execution function 284 receives input of the minimum film thickness region specifying information, the film thickness value (cumulative film thickness value) and the etching ratio of the minimum film thickness region described in the cumulative film thickness data, and the storage unit 236m The etching rate described in the stored cleaning recipe is read and acquired.

Then, the recipe execution function 284 divides the acquired film thickness value of the minimum film thickness region by the product of the etching rate and the etching ratio of the minimum film thickness region (the cumulative film thickness value of the minimum film thickness region / (etching). (Rate × Etching ratio of minimum film thickness region))) to calculate the reactive gas supply time.

Here, a specific example of the calculation of the reactive gas supply time will be described with reference to FIG. In FIG. 9B, for example, the first purge region 204a is designated as the minimum film thickness region. Further, the etching ratio of the first purge region 204a described in the etching ratio table is 50%. The film thickness value (cumulative film thickness value) of the first purge region 204a described in the cumulative film thickness data is 100 nm, and the etching rate is 10 nm / min. At this time, the recipe execution function 284 calculates the reactive gas supply time by dividing the cumulative film thickness value of the first purge region 204a by the product of the etching rate and the etching ratio of the first purge region 204a. That is, the reactive gas supply time calculated by the recipe execution function 284 is 100 nm ÷ (10 nm / min × 50%) = 20 minutes.

When the calculation of the reactive gas supply time is completed, the recipe execution function 284 reads the content of the cleaning recipe acquired from the operation unit controller 236, and adjusts the valve digital I so as to follow the content of the cleaning recipe and the calculated reactive gas supply time. / O13 and SW digital I / O14 are controlled to execute a cleaning recipe.

When the execution of the cleaning recipe is completed, the recipe execution function 284 transmits the calculated reactive gas supply time to the cumulative film thickness value update function 285 described later.

In addition, when a plurality of processing steps (for example, a film forming step and an etching step) are included in the process recipe and the cleaning recipe, the recipe execution function 284 terminates execution of one processing step when one processing step ends. Is transmitted to the cumulative film thickness update function 285 described later. When the recipe execution function 284 receives information on the completion of the update of the accumulated film thickness data from the later-described accumulated film thickness value update function 285, if there is another process step in the process recipe or the cleaning recipe, the process step Is read, the read processing step is executed, and information on the end of execution of the processing step is transmitted to the cumulative film thickness value update function 285 described later. The recipe execution function 284 repeats this operation until execution of all processing steps in the process recipe or the cleaning recipe is completed.

(Cumulative film thickness value update function) 累積 The cumulative film thickness value update function 285 includes a cumulative film thickness value addition function and a cumulative film thickness value subtraction function as follows.

[Cumulative film thickness value addition function] 累積 When the cumulative film thickness value update function 285 receives information on the completion of process recipe execution from the recipe execution function 284, the accumulation described in the process recipe stored in the storage unit 236m. Read rate. The cumulative film thickness update function 285 reads the source gas supply time described in the process recipe. The cumulative film thickness value update function 285 calculates a reference additional film thickness value by multiplying the deposition rate by the source gas supply time.

The cumulative film thickness value update function 285 reads the deposition ratio table number described in the process recipe. The cumulative film thickness value update function 285 reads a deposition ratio table that matches the read deposition ratio table number from the deposition ratio table file stored in the storage device included in the process chamber controller 239p. The cumulative film thickness value update function 285 multiplies the reference added film thickness value calculated as described above by the deposition ratio described in the deposition ratio table, respectively, so that each of the regions in the susceptor ST1 and the reaction vessel 203 can be used. The added film thickness value is calculated.

The cumulative film thickness update function 285 reads the cumulative film thickness data stored in the storage device provided in the process chamber controller 239p. The accumulated film thickness value update function 285 adds the calculated added film thickness value to each accumulated film thickness value described in the read accumulated film thickness data, and updates the accumulated film thickness data. That is, the cumulative film thickness value update function 285 adds the calculated additional film thickness values to the cumulative film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 described in the read cumulative film thickness data. The accumulated film thickness data is updated. Then, the cumulative film thickness value update function 285 transmits the updated cumulative film thickness data to the cumulative film thickness display function 283 described above.

[Cumulative film thickness subtraction function] 累積 When the cumulative film thickness update function 285 receives the reactive gas supply time from the recipe execution function 284, the cumulative film thickness update function 285 calculates the etching rate described in the cleaning recipe stored in the storage unit 236m. read out. The cumulative film thickness update function 285 calculates a reference subtracted film thickness by multiplying the etching rate by the reactive gas supply time.

The cumulative film thickness value update function 285 reads the etching ratio table number described in the cleaning recipe. The cumulative film thickness update function 285 reads an etching ratio table that matches the read etching ratio table number from the etching ratio table file stored in the storage device provided in the process chamber controller 239p. The cumulative film thickness update function 285 reads the cumulative film thickness data stored in the storage device provided in the process chamber controller 239p. The cumulative film thickness value update function 285 multiplies the reference subtracted film thickness value calculated as described above by the etching ratio described in the etching ratio table, so that each of the regions in the susceptor ST1 and the reaction vessel 203 has the respective values. Subtract film thickness value is calculated.

The cumulative film thickness update function 285 reads the cumulative film thickness data stored in the storage device provided in the process chamber controller 239p. The cumulative film thickness value update function 285 updates the cumulative film thickness data by subtracting the subtracted film thickness values calculated from the respective cumulative film thickness values described in the read cumulative film thickness data. That is, the cumulative film thickness value update function 285 subtracts the calculated subtracted film thickness value from the cumulative film thickness value of each region in the susceptor ST1 and the reaction vessel 203 described in the read cumulative film thickness data. The accumulated film thickness data is updated. Then, the cumulative film thickness value update function 285 transmits the updated cumulative film thickness data to the cumulative film thickness display function 283 described above.

When a plurality of processing steps are included in the process recipe or the cleaning recipe, the accumulated film thickness value update function 285, when the update of the accumulated film thickness data is completed, uses the updated accumulated film thickness data as the accumulated film thickness data. The information is transmitted to the display function 283, and information on the end of updating the accumulated film thickness data is transmitted to the recipe execution function 284.

(6) Operation of Control Unit Next, the operation of the control unit 280 according to the present embodiment will be described mainly using FIG. 10 and FIG. Such an operation is performed as one step of the manufacturing process of the semiconductor device. Here, a case where a plurality of processing steps are included in each of the process recipe and the cleaning recipe will be described. 10 and 11 are flowcharts of the cumulative film thickness data update process executed by the control unit 280 according to the present embodiment.

(Cumulative film thickness addition process) [Process Recipe Execution Step] As shown in FIG. 10, when the input / output unit receives an input of recipe specifying information for specifying a process recipe, the recipe start function 281 causes the recipe execution function 284 to Send instructions to start recipe execution. When the recipe execution function 284 receives an instruction to start executing the recipe, the recipe execution function 284 receives and acquires the process recipe specified by the recipe specifying information from the storage unit 236m included in the operation unit controller 236.

The recipe execution function 284 reads the acquired process recipe and determines whether there is a deposition ratio table file associated with the process recipe. When there is a deposition ratio table file associated with the process recipe, the deposition ratio table file is automatically received and acquired from the storage unit 236m provided in the operation unit controller 236.

The recipe execution function 284 controls the mass flow controllers 234a to 234g, the valves 235a to 235g, the heater 218, the APC valve 243 and the like so as to follow the contents of one processing step included in the process recipe. Execute. When the execution of the processing step is completed, the recipe execution function 284 transmits information on the end of execution of the processing step to the cumulative film thickness value update function 285 provided in the process chamber controller 239p.

[Cumulative film thickness value addition process] When the cumulative film thickness value update function 285 receives information on the end of execution of the processing step, the cumulative film thickness value update function 285 displays the deposition described in the process recipe (executed processing step). The rate is read, and it is determined whether or not the read deposition rate is greater than 0 (zero).

The cumulative film thickness update function 285 reads the raw material gas supply time described in the process recipe (executed processing step) when it is determined that the deposition rate is greater than zero. The accumulated film thickness value update function 285 calculates the film thickness value (reference added film thickness value) (A) of the deposit deposited on the susceptor ST1 by multiplying the read deposition rate by the source gas supply time.

If the cumulative film thickness value update function 285 determines that the deposition rate is 0, the cumulative film thickness data update completion information is transmitted to the recipe execution function 284, and the recipe execution function 284 transmits all information in the process recipe. It is determined whether there is a processing step.

The cumulative film thickness value update function 285 determines whether or not the deposition ratio table number described in the executed processing step (process recipe) is zero. Here, the deposition ratio table number being 0 (deposition ratio table number = 0) means that the deposition ratio table is not associated with the process recipe.

When the accumulated film thickness value update function 285 determines that the deposition ratio table number is 0, the accumulated reference film thickness value (A) is used for the accumulated film thickness of each region in the susceptor ST1 and the reaction vessel 203. The added film thickness value (B) is added to each value.

When the accumulated film thickness value update function 285 determines that the deposition ratio table number is not 0, the deposition ratio table that matches the deposition ratio table number described in the executed processing step (process recipe) is displayed. Read from file. The cumulative film thickness value update function 285 refers to the read deposition ratio table and acquires the deposition ratio of each region in the susceptor ST1 and the reaction vessel 203. Then, the cumulative film thickness value update function 285 multiplies the above-mentioned reference additional film thickness value (A) by the respective deposition ratios, and adds the respective additional film thickness values (B of each region in the susceptor ST1 and the reaction vessel 203). ) Is calculated.

Then, the cumulative film thickness value update function 285 reads cumulative film thickness data describing the cumulative film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 from the storage device of the process chamber controller 239p. The accumulated film thickness value update function 285 adds the calculated added film thickness value (B) to the accumulated film thickness value of each region in the susceptor ST1 and the reaction vessel 203 described in the read accumulated film thickness data. The accumulated film thickness data is updated.

When the update of the cumulative film thickness table is completed, the cumulative film thickness update function 285 transmits the updated cumulative film thickness table to the cumulative film thickness display function 283 provided in the operation unit controller 236. The cumulative film thickness display function 283 displays the received cumulative film thickness table on the display unit provided in the operation terminal 236s. Further, the cumulative film thickness value update function 285 transmits information on the completion of the cumulative film thickness data update to the recipe execution function 284.

The recipe execution function 284 determines whether or not all the processing steps included in the process recipe have been executed when the cumulative film thickness data update end information is transmitted from the cumulative film thickness update function 285. When it is determined that the recipe execution function 284 has not executed all the processing steps included in the process recipe, the recipe execution function 284 performs the above-described process recipe execution process and cumulative film thickness value addition process in the process recipe. Repeat until all included processing steps have been executed.

(Cumulative film thickness addition process) [Reactive gas supply time calculation step] また Also, as shown in FIG. 11, when the input / output unit receives input of recipe specifying information for specifying a cleaning recipe, the recipe start function 281 displays the recipe. An instruction to start executing the recipe is transmitted to the execution function 284. When the recipe execution function 284 receives an instruction to start executing the recipe, the recipe execution function 284 receives and acquires the cleaning recipe specified by the recipe specifying information from the storage unit 236m included in the operation unit controller 236.

The recipe execution function 284 reads the acquired cleaning recipe and determines whether there is an etching ratio table file associated with the cleaning recipe. If there is an etching ratio table file associated with the cleaning recipe, the etching ratio table file is automatically received and acquired from the storage unit 236m included in the operation unit controller 236.

Then, the recipe execution function 284 reads the etching rate described in the cleaning recipe (processing step to be executed), and determines whether or not the read etching rate is 0 (zero).

If the recipe execution function 284 determines that the etching rate is 0, the recipe execution function 284 ends the execution of the cleaning recipe.

When the recipe execution function 284 determines that the etching rate is not 0, the recipe terminal reads out the accumulated film thickness data stored in the storage device included in the process chamber controller 239p, and the operation terminal 236s includes the read accumulated film thickness data. Display on the display. When the input / output unit receives the input of the etching rate table specifying information for specifying the etching rate table, the recipe execution function 284 uses the etching rate table specifying information from the etching rate table file stored in the storage unit 236m. The specified etching ratio table is read and displayed on the display unit provided in the operation terminal 236s.

In addition, when the input / output unit receives input of the minimum film thickness region specifying information, the recipe execution function 284 displays the cumulative film thickness value described in the cumulative film thickness data of the region specified by the minimum film thickness region specifying information and The etching ratio described in the etching ratio table is read out. The recipe execution function 284 calculates the reactive gas supply time by dividing the accumulated film thickness value in the minimum film thickness region by the product of the etching rate and the etching ratio.

[Cleaning Recipe Execution Step] レシピ The recipe execution function 284 determines whether or not the calculated reactive gas supply time is zero. When it is determined that the reactive gas supply time calculated by the recipe execution function 284 is not 0, the recipe execution function 284 follows the content of one processing step included in the acquired cleaning recipe and the calculated reactive gas supply time. As described above, the processing steps are executed by controlling the mass flow controllers 234a to 234g, the valves 235a to 235g, the heater 218, the APC valve 243, and the like. When the execution of the processing step is completed, the recipe execution function 284 transmits information on the completion of the execution of the processing step and information on the reactive gas supply time to the cumulative film thickness value update function 285 provided in the process chamber controller 239p.

[Cumulative film thickness value subtraction process] 累積 When the cumulative film thickness value update function 285 receives the information on the completion of the processing step and the reactive gas supply time from the recipe execution function 284, the cumulative film thickness value update function 285 Read the etching rate described in the cleaning recipe (executed processing step), multiply the read etching rate by the received reactive gas supply time, and the thickness value of the deposit removed by etching from above the susceptor ST1 ( Reference subtracted film thickness value (C) is calculated.

The accumulated film thickness value update function 285 determines whether or not the etching ratio table number described in the executed process step (cleaning recipe) is zero. Here, the etching ratio table number of 0 (etching ratio table number = 0) means that no etching ratio table is associated with the cleaning recipe.

When the cumulative film thickness update function 285 determines that the etching ratio table number is 0, the cumulative film thickness update function 285 uses the calculated reference subtracted film thickness value (C) in the susceptor ST1 and the reaction vessel 203. A subtracted film thickness value (D) to be subtracted from each accumulated film thickness value in each region.

When the cumulative film thickness update function 285 determines that the etching ratio table number is not 0, the cumulative film thickness update function 285 matches the etching ratio table number described in the executed processing step (cleaning recipe). The etching ratio table is read from the etching ratio table file. The cumulative film thickness update function 285 refers to the read etching ratio table and acquires the etching ratios of the respective regions in the susceptor ST1 and the reaction vessel 203. Then, the cumulative film thickness value update function 285 multiplies the above-mentioned reference subtracted film thickness value (C) by the respective etching ratios to obtain the respective subtracted film thickness values (D ) Is calculated.

Then, the cumulative film thickness value update function 285 reads cumulative film thickness data describing the cumulative film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 from the storage device of the process chamber controller 239p. The accumulated film thickness value update function 285 calculates subtracted film thickness values (D) calculated from the accumulated film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 described in the read accumulated film thickness data. The accumulated film thickness data is updated by subtraction.

When the recipe execution function 284 receives the information about the completion of the cumulative film thickness data update from the cumulative film thickness update function 285, the recipe execution function 284 determines whether all the processing steps included in the cleaning recipe have been executed. When it is determined that the recipe execution function 284 has not executed all the processing steps included in the cleaning recipe, the recipe execution function 284 performs a reactive gas supply time calculation process, a cleaning recipe execution process, and a cumulative film thickness value subtraction process. Is repeated until the execution of all the processing steps included in the cleaning recipe is completed.

[Example] Here, an example in which the added film thickness value is calculated by the cumulative film thickness value update function 285 and the cumulative film thickness data is updated will be mainly described with reference to FIG. FIG. 12A is a diagram for explaining an example of how the cumulative film thickness update function 285 calculates the added film thickness value and updates the cumulative film thickness table, and FIG. It is the figure which graphed the susceptor described in the cumulative film thickness table updated by the value update function 285, and the cumulative film thickness value of each area | region.

12, for example, it is assumed that a process recipe for forming a thin film (forming a film) on the wafer 200 is executed by the recipe execution function 284. This process recipe describes a deposition rate of 10 nm / min and a source gas supply time of 1 minute. The process recipe is associated with a deposition ratio table having a deposition ratio table number “1”. In this deposition ratio table, the deposition ratio of the first processing area 201a is 80%, the deposition ratio of the second processing area 201b is 60%, the deposition ratio of the first purge area 204a is 30%, and the second purge area It is described that the deposition ratio of the region 204b is 40% and the deposition ratio of the susceptor ST1 is 100%. Accordingly, the additional film thickness value calculated by the cumulative film thickness value update function 285 is 8 nm for the partition plate 205 facing the

first processing region

201a, 6 nm for the partition plate 205 facing the second processing region 201b, The partition plate 205 facing the first purge region 204a is 3 nm, the partition plate 205 facing the second purge region 204b is 4 nm, and the susceptor ST1 is 10 nm. When this process recipe is executed 1000 times, for example, the cumulative film thickness of the partition plate 205 facing the first processing region 201a is 8 μm, and the cumulative film thickness of the partition plate 205 facing the second processing region 201b is 6 μm. The cumulative film thickness of the partition plate 205 facing the first purge region 204a is 3 μm, the cumulative film thickness of the partition plate 205 facing the second purge region 204b is 4 μm, and the cumulative film thickness of the susceptor ST1 is 10 μm.

Further, an example of calculating the subtracted film thickness value by the cumulative film thickness value update function 285 and updating the cumulative film thickness data will be described mainly with reference to FIGS. FIGS. 13 to 16 are diagrams showing how the cumulative film thickness update function 285 calculates the subtracted film thickness and updates the cumulative film thickness table.

In this embodiment, a description will be given of a case where a cleaning recipe having four processing steps is executed as a cleaning recipe for etching and removing deposits accumulated in the process chamber PM1 by the recipe execution function 284. The first processing step is etching step 1 (FIG. 13), the second processing step is etching step 2 (FIG. 14), the third processing step is etching step 3 (FIG. 15), and the fourth processing step is performed. Let it be etching step 4 (FIG. 16). That is, in the present embodiment, the deposits are sequentially removed from the regions in the susceptor ST1 and the reaction vessel 203 where the deposit thickness is small (the portion where the deposit thickness is small). A case where the deposits in the respective regions in the susceptor ST1 and the reaction vessel 203 are removed from the accumulated film thickness value shown in FIG.

First, as shown in FIG. 13, the recipe of the etching step 1 is executed by the recipe execution function 284. In the recipe of this etching step 1, the etching rate is described as 200 nm / min. In addition, an etching ratio table having an etching ratio table number “1” is associated with this recipe. In the etching ratio table, the etching ratios of the first processing region 201a, the second processing region 201b, the first purge region 204a, and the second purge region 204b are 50%, and the etching rate of the susceptor ST1 is 100%. It is described. The first purge region 204a is designated as the minimum film thickness region.

Therefore, the recipe execution function 284 calculates the reactive gas supply time in the etching step 1 based on the accumulated film thickness value and the etching ratio in the first purge region 204a. That is, the reactive gas supply time calculated by the recipe execution function 284 is the cumulative film thickness value of the first purge region 204a / (etching rate × deposition ratio of the first purge region 204a) = 3 (μm) / ( 200 (nm / min) × 50 (%)) and 30 minutes.

The recipe execution function 284 executes a cleaning recipe based on the calculated reactive gas supply time. That is, in the etching step 1, the valves 235a to 235f shown in FIG. 4 are closed, the valve 235g is opened, and a reactive gas is supplied to each region for 30 minutes. At this time, the susceptor ST1 is rotated. Accordingly, the susceptor ST1, the partition plate 205 facing the first processing region 201a, the partition plate 205 facing the second processing region 201b, the partition plate 205 facing the first purge region 204a, and the second purge region. Each of the partition plates 205 facing 204b is etched. Note that the etching rates of the partition plates 205 facing the first processing region 201a, the second processing region 201b, the first purge region 204a, and the second purge region 204b are the same.

After the execution of the recipe in etching step 1, the reference subtracted film thickness value calculated by the cumulative film thickness value update function 285 is 6 μm when the etching rate × reactive gas supply time = 200 nm / min × 30 minutes. With reference to the etching ratio table, the subtracted film thicknesses of the first processing region 201a, the second processing region 201b, the first purge region 204a, and the second purge region 204b calculated by the cumulative film thickness value update function 285. Each value is 3 μm, and the subtracted film thickness value of the susceptor ST1 is 6 μm.

The cumulative film thickness value update function 285 subtracts each subtracted film thickness value calculated from the cumulative film thickness data shown in FIG. 12B, and updates the cumulative film thickness data as shown in FIG. As a result, the accumulated film thickness value (remaining film thickness value) of each region is 5 μm for the

first processing region

201a, 3 μm for the

second processing region

201b, 0 μm for the first purge region 204a, and the second purge region. 204b is 1 μm, and the susceptor ST1 is 4 μm.

Note that, as described above, the susceptor ST1 includes the heater 218 as a heating unit. For this reason, the temperature of the susceptor ST1 is the temperature in each of the first processing region 201a, the second processing region 201b, the first purge region 204a, and the second purge region 204b (reaction vessel 203 constituting each region). The temperature of the inner wall and ceiling of the wall, the temperature of the side surface of the partition plate 205, and the like is often high. Therefore, in this embodiment (FIG. 13), the etching ratio of the susceptor ST1 is set to double that of each region.

After the execution of the recipe of etching step 1 is completed, the recipe of etching step 2 is executed by the recipe execution function 284 as shown in FIG. In the recipe of this etching step 2, the etching rate is described as 200 nm / min. In addition, an etching ratio table with an etching ratio table number “2” is associated with this recipe. In this etching ratio table, the etching ratio of the first processing area 201a, the second processing area 201b, and the second purge area 204b is 50%, and the etching ratio of the first purge area 204a is 0%. ing. Further, the etching rate of the susceptor ST1 is described as 75%. This is because, since the susceptor ST1 is rotated, the deposit on the susceptor ST1 is not etched while the susceptor ST1 passes through the first purge region 204a. Further, the second purge region 204b is designated as the minimum film thickness region.

Therefore, the recipe execution function 284 calculates the reactive gas supply time in the etching step 2 based on the accumulated film thickness value and the etching ratio in the second purge region 204b. That is, the reactive gas supply time calculated by the recipe execution function 284 is the cumulative film thickness value of the second purge region 204b / (etching rate × deposition ratio of the second purge region 204b) = 1 (μm) / ( 200 (nm / min) × 50 (%)) and 10 minutes.

The recipe execution function 284 executes a cleaning recipe based on the calculated reactive gas supply time. That is, in the etching step 2, the valves 235a to 235d and 235f shown in FIG. 4 are closed, the valve 235g is opened, and the reactive gas is supplied for 10 minutes. At this time, the valve 235g is opened and the valve 235e is opened so that the reactive gas is not supplied to the first purge region 204a, and the inert gas is supplied to the first purge region 204a. Further, the susceptor ST1 is rotated. Thus, the deposits deposited on the susceptor ST1, the partition plate 205 facing the first processing region 201a, the partition plate 205 facing the second processing region 201b, and the partition plate 205 facing the second purge region 204b, respectively. Each object is etched.

After the execution of the recipe in the etching step 2, the reference subtracted film thickness value calculated by the cumulative film thickness value update function 285 is 2 μm when the etching rate × reactive gas supply time = 200 nm / min × 10 minutes. With reference to the etching ratio table, the subtracted film thickness values of the first processing region 201a, the second processing region 201b, and the second purge region 204b calculated by the cumulative film thickness value update function 285 are 1 μm and first, respectively. The subtracted film thickness value of the purge region 204a is 0 μm, and the subtracted film thickness value of the susceptor ST1 is 1.5 μm.

The accumulated film thickness value update function 285 subtracts each subtracted film thickness value calculated from the accumulated film thickness data shown in FIG. 13, and updates the accumulated film thickness data as shown in FIG. As a result, the accumulated film thickness value (remaining film thickness value) of each region is 4 μm for the

first processing region

201a, 2 μm for the

second processing region

201b, 0 μm for the first purge region 204a, and the second purge region. 204b is 0 μm, and the susceptor ST1 is 2.5 μm.

After the execution of the recipe in the etching step 2 is completed, the recipe in the etching step 3 is executed by the recipe execution function 284 as shown in FIG. In the recipe of the etching step 3, the etching rate is described as 200 nm / min. In addition, an etching ratio table having an etching ratio table number “3” is associated with this recipe. In this etching ratio table, the etching ratio of the first processing area 201a and the second processing area 201b is 50%, and the etching ratio of the first purge area 204a and the second purge area 204b is 0%, respectively. Has been. Further, the etching rate of the susceptor ST1 is described as 50%. This is because, since the susceptor ST1 is rotated, deposits on the susceptor ST1 are not etched while the susceptor ST1 passes through the first purge region 204a and the second purge region 204b. Further, the second processing area 201b is designated as the minimum film thickness area.

Therefore, the recipe execution function 284 calculates the reactive gas supply time in the etching step 3 based on the accumulated film thickness value and the etching ratio of the second processing region 201b. That is, the reactive gas supply time calculated by the recipe execution function 284 is the cumulative film thickness value of the second processing region 201b / (etching rate × deposition ratio of the second processing region 201b) = 2 (μm) / ( 200 (nm / min) × 50 (%)) and 20 minutes.

The recipe execution function 284 executes a cleaning recipe based on the calculated reactive gas supply time. That is, in the etching step 3, the valves 235a to 235d shown in FIG. 4 are closed, the valve 235g is opened, and the reactive gas is supplied for 20 minutes. At this time, the valve 235g is opened and the valve 235e and the valve 235f are opened so that the reactive gas is not supplied to the first purge region 204a and the second purge region 204b, and the first purge region 204a and the second purge region 204b are opened. An inert gas is supplied to the second purge region. Further, the susceptor ST1 is rotated. Thus, the deposits deposited on the susceptor ST1, the partition plate 205 facing the first processing region 201a, and the partition plate 205 facing the second processing region 201b are etched.

After the execution of the recipe in etching step 3, the reference subtracted film thickness value calculated by the cumulative film thickness value update function 285 is 4 μm when the etching rate × reactive gas supply time = 200 nm / min × 20 minutes. With reference to the etching ratio table, the subtracted film thickness values of the first processing region 201a, the second processing region 201b, and the susceptor ST1 calculated by the cumulative film thickness value update function 285 are 2 μm and the first purge region 204a, respectively. The subtracted film thickness values of the second purge region 204b are each 0 μm.

The cumulative film thickness value update function 285 subtracts each subtracted film thickness value calculated from the cumulative film thickness data shown in FIG. 14 and updates the cumulative film thickness data as shown in FIG. As a result, the accumulated film thickness value (remaining film thickness value) of each region is 2 μm for the

first processing region

201a, 0 μm for the

second processing region

201b, 0 μm for the first purge region 204a, and the second purge region. 204b is 0 μm, and the susceptor ST1 is 0.5 μm.

After the execution of the recipe in the etching step 3 is completed, the recipe in the etching step 4 is executed by the recipe execution function 284 as shown in FIG. In the recipe of the etching step 4, the etching rate is described as 200 nm / min. In addition, an etching ratio table having an etching ratio table number “4” is associated with this recipe. In this etching ratio table, the etching ratio of the first processing region 201a is 50%, and the etching ratios of the second processing region 201b, the first purge region 204a, and the second purge region 204b are each 0%. ing. Further, the etching rate of the susceptor ST1 is described as 25%. This is because, since the susceptor ST1 is rotated, deposits on the susceptor ST1 are not etched while the susceptor ST1 passes through the second processing region 201b, the first purge region 204a, and the second purge region 204b. It is. Further, the first processing area 201a is designated as the minimum film thickness area.

Therefore, the recipe execution function 284 calculates the reactive gas supply time in the etching step 4 based on the accumulated film thickness value and the etching ratio of the first processing region 201a. That is, the reactive gas supply time calculated by the recipe execution function 284 is the cumulative film thickness value of the first processing region 201a / (etching rate × deposition ratio of the first processing region 201a) = 2 (μm) / ( 200 (nm / min) × 50 (%)) and 20 minutes.

The recipe execution function 284 executes a cleaning recipe based on the calculated reactive gas supply time. That is, in the etching step 4, the valves 235a to 235c shown in FIG. 4 are closed, the valve 235g is opened, and the reactive gas is supplied for 20 minutes. At this time, the valve 235g is opened and the valve 235d, the valve 235e, and the valve 235f are set so that the reactive gas is not supplied to the second processing region 201b, the first purge region 204a, and the second purge region 204b. The inert gas is supplied to the second processing region 201b, the first purge region 204a, and the second purge region 204b. Further, the susceptor ST1 is rotated. Thereby, the deposits deposited on the partition plate 205 facing the susceptor ST1 and the first processing region 201a are respectively etched.

After the execution of the recipe in etching step 4, the reference subtracted film thickness value calculated by the cumulative film thickness value update function 285 is 4 μm when the etching rate × reactive gas supply time = 200 nm / min × 20 minutes. With reference to the etching ratio table, the subtracted film thickness value of the first processing region 201a calculated by the cumulative film thickness value update function 285 is 2 μm, the second processing region 201b, the first purge region 204a, and the second The subtracted film thickness value of the purge region 204b is 0 μm, and the subtracted film thickness value of the susceptor ST1 is 1 μm.

The cumulative film thickness value update function 285 subtracts each subtracted film thickness value calculated from the cumulative film thickness data shown in FIG. 15, and updates the cumulative film thickness data as shown in FIG. As a result, the accumulated film thickness value (remaining film thickness value) of each region is 0 μm for the

first processing region

201a, 0 μm for the

second processing region

201b, 0 μm for the first purge region 204a, and the second purge region. 204b is 0 μm, and susceptor ST1 is 0 μm.

In this embodiment, the susceptor ST1 is overetched by 0.5 μm. In this case, for example, the etching ratio between the domain and the susceptor can be tuned from 50: 100 to 50:95 by changing the processing conditions such as the processing temperature of the cleaning recipe, the supply flow rate of the reactive gas, and the pressure. It is. As a result, the amount of overetching generated in the susceptor ST1 can be corrected to an extremely small value.

(7) Effects according to the present embodiment According to the present embodiment, the following one or more effects are achieved.

(A) According to the present embodiment, distribution is performed to each region in the reaction vessel 203 (that is, the first processing region 201a, the second processing region 201b, the first purge region 204a, and the second purge region 204b). Thus, a reactive gas supply unit for supplying the reactive gas is provided. In addition, a first inert gas supply unit 252 that supplies an inert gas into the first processing region 201a, a second inert gas supply unit 254 that supplies an inert gas into the second processing region 201b, A third inert gas supply unit 255 that supplies an inert gas into the first purge region 204a and a fourth inert gas supply unit 256 that supplies an inert gas into the second purge region 204b are provided. Yes. And when supplying reactive gas to each area | region in the reaction container 203, according to the film thickness value of each deposit of the partition plate 205 which faces each area | region in the reaction container 203, each in the reaction container 203 The supply flow rate of the inert gas supplied to the region is adjusted. That is, for example, when the film thickness value of the deposit on the partition plate 205 facing the first purge region 204a is 0 (zero), the reactive gas is not supplied into the first purge region 204a. The supply amount of the inert gas supplied into one purge region 204a is adjusted. Thereby, it can suppress that overetching generate | occur | produces in each component in the reaction container 203, and the damage which arises in each component in process chamber PM1 can be reduced.

(B) According to the present embodiment, the deposits are sequentially removed from the regions in the susceptor ST1 and the reaction vessel 203 in the order of the thickness of the deposits. That is, the deposit is removed so that the thickness value of the deposit becomes 0 (zero) in order from the minimum thickness region. Thereby, it can suppress more that overetching generate | occur | produces in each component in the reaction container 203. FIG.

(C) According to the present embodiment, the control unit 280 determines the thickness value of the minimum film thickness region of each region in the susceptor ST1 or the reaction vessel 203 as the etching rate and the etching ratio of the minimum film thickness region. The reactive gas supply time is calculated by dividing by the product. Thereby, it can suppress more that overetching generate | occur | produces in each component in the reaction container 203. FIG.

(D) According to this embodiment, when the reactive gas is supplied from the reactive gas supply unit 257 to each region in the reaction vessel 203, the reactive gas is not supplied to the region where the deposit is not deposited. In addition, the supply flow rate of the inert gas is adjusted. That is, the inert gas is supplied from the inert gas supply unit to the region where the deposit removal is completed (the region where the accumulated film thickness value of the deposit is 0 (zero)), and the reactive gas is not supplied. I have to. Thereby, it can suppress that overetching generate | occur | produces in the area | region where the deposit is not deposited. Therefore, it is possible to further suppress the occurrence of overetching in each component in the reaction vessel 203.

(E) According to the present embodiment, the cumulative film thickness value of at least one deposit on the partition plate 205 facing each region in the susceptor ST1 and the reaction vessel 203 is equal to the cumulative film thickness of the deposit in other locations. It is different from the value. Thus, even if the film thickness values of the deposits are different in each region in the susceptor ST1 and the reaction vessel 203, cleaning is performed by the dry cleaning method without causing overetching in each component in the reaction vessel 203. Can do. Therefore, the operating efficiency of the apparatus can be improved as compared with the case of cleaning by the conventional wet cleaning method.

(F) According to the present embodiment, the control unit 280 multiplies the deposition rate at which deposits are deposited by the supply time of the source gas supplied from the source gas supply unit, so that the deposits deposited on the susceptor ST1 The film thickness value is calculated. In addition, the control unit 280 multiplies the film thickness value of the deposit deposited on the susceptor ST1 by a predetermined deposition ratio, so that the film thickness value of the deposit deposited on the partition plate 205 facing each region in the reaction vessel 203 is obtained. Are calculated respectively. Further, the control unit 280 calculates the thickness value of the deposit removed from the susceptor ST1 by multiplying the etching rate for removing the deposit by the supply time of the reactive gas. Further, the control unit 280 multiplies the film thickness value of the deposit removed from the susceptor ST1 by a predetermined etching ratio, thereby removing the deposit film removed from the partition plate 205 facing each region in the reaction vessel 203. Each thickness value is calculated. Thereby, the cumulative film thickness of the partition plate 205 facing each region in the susceptor ST1 and the reaction vessel 203 can be managed more reliably. Therefore, it is possible to further suppress the occurrence of overetching in each component in the reaction vessel 203.

(G) According to the present embodiment, the deposition ratio table describing the deposition ratio of each region in the susceptor ST1 and the reaction vessel 203, and the etching ratio table describing the etching ratio of each region in the susceptor ST1 and the reaction vessel 203, respectively. Is stored in the storage unit 236m included in the control unit 280 so as to be readable. Then, by specifying, for example, a deposition ratio table number or an etching ratio table number in the process recipe or the cleaning recipe, the deposition ratio table or the etching ratio table is associated with the process recipe or the cleaning recipe. Thereby, the deposition ratio table and the etching ratio table can be shared by a plurality of process recipes and cleaning recipes. That is, one deposition ratio table or etching ratio table can be associated from different process recipes and cleaning recipes.

<Other Embodiments of the Present Invention> The embodiments of the present invention have been specifically described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. is there.

In the above-described embodiment, the recipe execution function 284 calculates the reactive gas supply time based on the film thickness value of the region specified by the minimum film thickness region specifying information, but is not limited to this. That is, for example, the recipe execution function 284 calculates the reactive gas supply time based on the film thickness values of the partition plate 205 facing each region in the susceptor ST1 and the reaction vessel 203, and the calculated reactive gas supply time. The reactive gas supply unit 257 may be controlled based on the shortest supply time.

In the above-described embodiment, the control unit 280 calculates the reactive gas supply time based on the minimum film thickness region among the regions in the reaction vessel 203, and sets the film thickness value to 0 in order from the minimum film thickness region. Although the case where the deposits in each region in the susceptor ST1 and the reaction vessel 203 are removed has been described as (zero), the present invention is not limited to this. That is, for example, the control unit 280 calculates the reactive gas supply time based on the maximum film thickness region, and reacts according to the film thickness values of the deposits deposited in each region in the susceptor ST1 and the reaction vessel 203, respectively. The concentration of the reactive gas may be adjusted in each region in the container 203, and the deposits in each region in the susceptor ST1 and the reaction container 203 may be removed. Specifically, when the reactive gas is supplied, the flow rate of the inert gas supplied into the reaction vessel 203 is adjusted according to the film thickness values of the deposits in each region in the susceptor ST1 and the reaction vessel 203. The deposits may be removed from each region in the susceptor ST1 and the reaction vessel 203. Hereinafter, an example of the case where the control unit 280 according to the present embodiment calculates the reactive gas supply time based on the maximum film thickness region and updates the accumulated film thickness data will be described with reference mainly to FIGS. 17 and 18. explain.

As shown in FIG. 17, when the recipe execution function 284 receives an instruction to start execution of a cleaning recipe, the recipe execution function 284 reads the cleaning recipe specified by the recipe specifying information from the storage unit 236m included in the operation unit controller 236. Is received, the etching rate described in the cleaning recipe (processing step to be executed) is read, and it is determined whether or not the read etching rate is 0 (zero).

When the recipe execution function 284 determines that the etching rate is 0, the recipe execution function 284 ends the cleaning recipe.

When the recipe execution function 284 determines that the etching rate is not 0, the recipe execution function 284 reads the accumulated film thickness data stored in the storage device included in the process chamber controller 239p, and the read accumulated film thickness data is read out. The information is displayed on a display unit included in the operation terminal 236s. When the input / output unit receives input of maximum film thickness region specifying information for specifying a region having the largest film thickness (maximum film thickness region) among the regions in the susceptor ST1 or the reaction vessel 203, the recipe execution function Reference numeral 284 reads out the cumulative film thickness value described in the cumulative film thickness data of the area specified by the maximum film thickness area specifying information. The recipe execution function 284 calculates the reactive gas supply time by dividing the accumulated film thickness value in the maximum film thickness region by the etching rate.

Next, the recipe execution function 284 obtains cumulative film thickness values in regions other than the maximum film thickness region, and divides the obtained cumulative film thickness value by the product of the calculated reactive gas supply time and the etching rate. Thus, the etching ratio of the region other than the maximum film thickness region is calculated. That is, the recipe execution function 284 calculates the etching ratio of the area other than the maximum film thickness area when the etching ratio of the maximum film thickness area is 100%, and creates an etching ratio table.

The recipe execution function 284 controls the inert gas supply unit so as to follow the contents of the created etching ratio table when the reactive gas is supplied to each region in the reaction vessel 203. That is, the recipe execution function 284 controls the mass flow controllers 234c to 234f so as to follow the contents of the created etching ratio table, respectively, so that the first processing area 201a, the second processing area 201b, and the first purge are performed. The flow rate of the inert gas supplied to the region 204a and the first purge region 204b is adjusted. For example, the recipe execution function 284 indicates that in the first purge region 204a and the second purge region 204b having a low etching ratio, the concentration of the reactive gas in the first purge region 204a or the second purge region 204b is low. The inert gas supply unit is controlled so as to increase the supply flow rate of the inert gas so as to decrease.

The recipe execution function 284 controls the mass flow controllers 234a to 234g, the valves 235a to 235g, the heater 218, the APC valve 243, and the like so as to follow the contents of the acquired cleaning recipe and the calculated reactive gas supply time. Perform processing steps.

When the execution of the processing step is finished, the recipe execution function 284 transmits information on the reactive gas supply time and information on the etching ratio table to the cumulative film thickness value update function 285, respectively. When the cumulative film thickness update function 285 receives the reactive gas supply time information and the etching ratio table information from the recipe execution function 284, the cumulative film thickness update function 285 refers to the acquired etching ratio table, Subtracted film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 are calculated. That is, the cumulative film thickness value update function 285 calculates the subtracted film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 by multiplying the reactive gas supply time, the etching rate, and the etching ratio, respectively.

Then, the cumulative film thickness value update function 285 reads cumulative film thickness data describing the cumulative film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 from the storage device of the process chamber controller 239p. The accumulated film thickness value update function 285 subtracts the calculated subtracted film thickness value (D) from the accumulated film thickness value of each region in the susceptor ST1 and the reaction vessel 203 described in the read accumulated film thickness data. The accumulated film thickness data is updated. In the present embodiment, when the cleaning recipe is normally completed, the cumulative film thickness value of each region in the susceptor ST1 and the reaction container 203 described in the cumulative film thickness data updated by the cumulative film thickness value update function 285 is , 0 (zero).

Here, an example of calculating the reactive gas supply time from the maximum film thickness region by the recipe execution function 284 and updating the accumulated film thickness data will be mainly described with reference to FIG. In this example, a case will be described in which deposits in each region in the susceptor ST1 and the reaction vessel 203 are removed from the accumulated film thickness values in each region in the susceptor ST1 and the reaction vessel 203 shown in FIG. An example of how the reactive gas supply time is calculated from the accumulated film thickness data and the accumulated film thickness data is updated will be described.

Suppose that the recipe of etching step 1 is executed by the recipe execution function 284. In the recipe of the etching step 1, the etching rate is described as 150 nm / min. The recipe execution function 284 refers to the accumulated film thickness data shown in FIG. 12 and acquires the accumulated film thickness value of the susceptor ST1 which is the maximum film thickness area among the areas in the susceptor ST1 and the reaction vessel 203. Then, the recipe execution function 284 calculates the supply time of the reactive gas by dividing the cumulative film thickness value of the susceptor ST1 by the etching rate. That is, the reactive gas supply time calculated by the recipe execution function 284 is 66.6 minutes when the cumulative film thickness value of the susceptor ST1 / etching rate = 10 (μm) / 150 (nm / min).

Based on the calculated reactive gas supply time, the recipe execution function 284 is a region other than the maximum film thickness region shown in FIG. 12 (that is, the first processing region 201a, the second processing region 201b, the first purge region 204a). The etching ratio of the second purge region 204b) is calculated, and an etching ratio table is created. The etching ratio of each region calculated by the recipe execution function 284 is 80% for the

first processing region

201a, 60% for the

second processing region

201b, 30% for the first purge region 204a, and the second purge region. 204b is 40%.

The recipe execution function 284 opens the valve 235g based on the calculated reactive gas supply time, starts supplying cleaning gas to each region in the reaction vessel 203, and starts executing the cleaning recipe. At this time, the recipe execution function 284 controls the inert gas supply unit so as to follow the contents of the created etching ratio table. That is, the recipe execution function 284 controls the mass flow controllers 234c to 234f, respectively, so that the etching rate of the first processing region 201a is 80%, the etching rate of the second processing region 201b is 60%, and the first purge is performed. The flow rate of the inert gas supplied to each region in the reaction vessel 203 is adjusted so that the etching rate of the region 204a is 30% and the etching rate of the first purge region 204b is 40%.

After the execution of the recipe in etching step 1, the subtracted film thickness value of the first processing region 201a calculated by the cumulative film thickness value update function 285 is 8 μm, the subtracted film thickness value of the second processing region 201b is 6 μm, The subtracted film thickness value of the first purge region 204a is 3 μm, the subtracted film thickness value of the second purge region 204b is 4 μm, and the subtracted film thickness value of the susceptor ST1 is 10 μm. The cumulative film thickness value update function 285 subtracts each subtracted film thickness value calculated from the cumulative film thickness data shown in FIG. 12, and updates the cumulative film thickness data as shown in FIG. As a result, the accumulated film thickness value (remaining film thickness value) in each region is 0 μm in each region in the susceptor ST1 and the reaction vessel 203.

Thus, the reactive gas supply time is calculated based on the film thickness value of the maximum film thickness region of each region in the susceptor ST1 or the reaction vessel 203, and the partition plate facing each region in the susceptor ST1 and the reaction vessel 203. Based on the film thickness value 205, the flow rate of the inert gas supplied into each region in the susceptor ST1 and the reaction vessel 203 is adjusted, and the concentration of the reactive gas is adjusted, so that the susceptor ST1 and the reaction vessel 203 are adjusted. You may make it remove a deposit from the partition plate 205 which faces each area | region inside. Also by this, generation | occurrence | production of overetching can be suppressed and the damage which each member in the reaction container 203 receives can be suppressed.

In the above-described embodiment, the case where the process recipe and the cleaning recipe are normally completed has been described. However, the present invention is not limited to this. In other words, even if the process recipe or the cleaning recipe ends abnormally due to some trouble, the above-described embodiment can be applied. A case where the cleaning recipe ends abnormally will be described with reference to FIG.

As described above, in the etching step 1 shown in FIG. 13, the reactive gas supply time calculated by the recipe execution function 284 is 30 minutes. However, when the supply of the reactive gas is terminated abnormally 10 minutes after starting the supply of the reactive gas, the recipe execution function 284 transmits information on the abnormal end of the recipe and the execution time of the recipe to the cumulative film thickness value update function 285. When the cumulative film thickness update function 285 receives information on the abnormal end of the recipe and the execution time of the recipe from the recipe execution function 284, the cumulative film thickness value update function 285 calculates the reference subtracted film thickness value by multiplying the execution time of the recipe by the etching rate. The cumulative film thickness value update function 285 multiplies the reference subtracted film thickness value by the etching ratio of each region in the susceptor ST1 and the reaction vessel 203, and subtracts the film thickness in each region in the susceptor ST1 and the reaction vessel 203. Each value is calculated. In this embodiment, the reference subtracted film thickness value is 2 μm, the subtracted film thickness value of the susceptor ST1 is 2 μm, and the subtracted film thickness value of each region in the reaction vessel 203 is 1 μm. Then, the cumulative film thickness value update function 284 updates the cumulative film thickness data by subtracting each calculated subtracted film thickness value from the cumulative film thickness data shown in FIG. The updated accumulated film thickness values (remaining film thickness values) are 8 μm for the susceptor ST1, 8 μm for the first processing region 201a, 5 μm for the second processing region 201b, and the first purge. The region 204a is 2 μm, and the second purge region 204b is 3 μm.

When the cumulative film thickness value update function 285 finishes updating the cumulative film thickness data, the cumulative film thickness data update function 285 transmits information on the completion of the cumulative film thickness data update to the recipe execution function 284. The recipe execution function 284 calculates the reactive gas supply time based on the updated accumulated film thickness in the minimum film thickness region when receiving the information about the completion of the accumulated film thickness data update from the accumulated film thickness update function 285, You can do the following recipe.

As described above, even when the process recipe or the cleaning recipe ends abnormally, the cumulative film thickness value update function 285 does not add the film thickness values of the respective regions in the susceptor ST1 and the reaction vessel 203 until the abnormal end. A subtracted film thickness value can be calculated. Therefore, the cumulative film thickness value described in the cumulative film thickness data can be managed appropriately. As a result, the occurrence of unexpected overetching can be suppressed.

In the above-described embodiment, one or more deposition ratio tables are stored in the deposition ratio table file, and one or more etching ratio tables are stored in the etching ratio table file. The recipe execution function 284 is operated by the operation unit controller 236. Although the case where the deposition ratio table or the etching ratio table file is acquired from the storage unit 236m provided using the deposition ratio table file or the etching ratio table file has been described, the present invention is not limited to this. That is, for example, the storage unit 236m included in the operation unit controller 236 stores the information in units of the deposition rate table and the etching rate table, and the recipe execution function 284 receives information specifying the deposition rate table and information specifying the etching rate table. Thus, the deposition ratio table or the etching ratio table may be acquired from the storage unit 236m. At this time, the recipe execution function 284 is configured to acquire all the deposition ratio tables or etching ratio tables from the operation unit controller 236 when there are a plurality of deposition ratio tables or etching ratio tables related to the process recipe or the cleaning recipe. Has been.

In the above-described embodiment, the deposition rate is the rate of deposits deposited on the susceptor ST1, but is not limited thereto. That is, for example, the rate of deposits deposited in the first processing region 201a or the like may be used. Similarly, the etching rate is not limited to the rate of deposits etched from the susceptor ST1, and may be, for example, the rate of deposits removed from the first processing region 201a or the like.

Further, the present invention can be applied to the case where a film forming process for forming various films such as an oxide film, a nitride film, and a metal film is performed, as well as a diffusion process, an annealing process, an oxidation process, a nitriding process, a lithography process, The present invention can also be applied when performing the substrate processing. In addition to the thin film forming apparatus, the present invention includes an etching apparatus, an annealing apparatus, an oxidation apparatus, a nitriding apparatus, an exposure apparatus, a coating apparatus, a molding apparatus, a developing apparatus, a dicing apparatus, a wire bonding apparatus, a drying apparatus, and a heating apparatus. The present invention can also be applied to other substrate processing apparatuses such as apparatuses and inspection apparatuses. In the present invention, these devices may be mixed. In the present invention, not only the vertical substrate processing apparatus 100 but also a horizontal substrate processing apparatus and various single-wafer type substrate processing apparatuses may be used, and these apparatuses may be mixed.

Further, the present invention is not limited to a semiconductor manufacturing apparatus that processes a semiconductor wafer such as the substrate processing apparatus 10 according to the present embodiment, but also to a substrate processing apparatus such as an LCD (Liquid Crystal Display) manufacturing apparatus that processes a glass substrate. Is also applicable. *

<Preferred Aspects of the Present Invention> 好ましい Hereinafter, preferred aspects of the present invention will be described.

[Supplementary Note 1] According to one aspect of the present invention,
A substrate processing apparatus comprising at least one processing chamber for processing a substrate,
A substrate mounting portion provided in the processing chamber for mounting a substrate;
A partition for partitioning the processing chamber into a plurality of regions;
A reactive gas supply unit that supplies the region with a reactive gas that removes deposits deposited on the substrate placement unit and the partition unit by processing the substrate;
An inert gas supply unit for supplying an inert gas to the region;
When at least the reactive gas is supplied to the region and the deposit is removed, the supply flow rate of the reactive gas and the supply flow rate of the inert gas supplied to the region are respectively set to the substrate mounting portion and the partition. There is provided a substrate processing apparatus comprising: a control unit that controls at least the reactive gas supply unit and the inert gas supply unit so as to adjust according to a film thickness value of the deposit deposited on the unit.

[Appendix 2] The substrate processing apparatus of Appendix 1, preferably,
The controller is
The process of calculating the supply time of the reactive gas based on the region where the film thickness value of the deposit is the smallest among the substrate mounting portion or the plurality of regions, and the deposition when supplying the reactive gas The process of adjusting the supply flow rate of the inert gas is repeated a predetermined number of times so that the reactive gas is not supplied to the region where the object is not deposited, and the region is deposited on the substrate platform and the plurality of regions. The deposited deposit is removed.

[Appendix 3] The substrate processing apparatus of Appendix 1, preferably,
The controller is
A process of calculating a supply time of the reactive gas based on the film thickness value of each of the deposits of the substrate placement unit and the partition unit facing the plurality of regions, and the calculated supply time of the reactive gas When the reactive gas is supplied, an inert gas is supplied so that the reactive gas is not supplied to the substrate platform and the region where the removal of the deposit is completed, and the deposition is performed. A process of adjusting a supply flow rate of the reactive gas and the inert gas so as to supply the reactive gas to the substrate platform and the region where removal of an object has not been completed a predetermined number of times. By repeating, the deposits deposited on the substrate placement unit and the partition unit facing the plurality of regions are removed.

[Appendix 4] The substrate processing apparatus of Appendix 1, preferably,
The controller is
Supplied to the region so that the concentration of the reactive gas in the region is adjusted according to the film thickness value of the deposit deposited on each of the substrate placement unit and the partition unit facing the plurality of regions The inert gas supply flow rate is adjusted.

[Supplementary Note 5] The substrate processing apparatus of Supplementary Note 4, preferably,
The controller is
Reactive gas supply time is calculated based on the substrate mounting portion or the region having the largest film thickness value of the deposit in the plurality of regions, and the etching ratio of the substrate mounting portion and the plurality of regions Are calculated respectively.

[Appendix 6] The substrate processing apparatus according to any one of Appendixes 1 to 5, preferably,
The film thickness value of the deposit in at least one of the substrate placement unit and the partition unit facing each region is different from the film thickness value of the deposit in other places.

[Appendix 7] The substrate processing apparatus according to any one of Appendixes 1 to 6, preferably,
A source gas supply unit for supplying source gas to the substrate;
The controller is
By multiplying the deposition rate at which the deposit is deposited on the substrate platform by the supply time of the source gas supplied from the source gas supply unit, the film thickness value of the deposit deposited on the substrate platform is obtained. calculate.

[Supplementary Note 8] The substrate processing apparatus of Supplementary Note 7, preferably,
The controller is
The film thickness value of the deposit deposited on the partition facing the region is calculated by multiplying the film thickness value of the deposit deposited on the substrate mounting portion by a predetermined deposition ratio.

[Supplementary Note 9] The substrate processing apparatus according to any one of Supplementary notes 1 to 8, preferably,
The controller is
The film thickness value of the deposit removed from the substrate mounting portion is calculated by multiplying the etching rate for removing the deposit by the supply time of the reactive gas.

[Appendix 10] The substrate processing apparatus of Appendix 9, preferably,
The controller is
The film thickness value of the deposit removed from the partition facing the region is calculated by multiplying the film thickness value of the deposit removed from the substrate mounting portion by a predetermined etching ratio.

[Appendix 11] The substrate processing apparatus according to any one of Appendixes 1 to 10, preferably,
The reactive gas supply unit is a cleaning gas that removes deposits deposited on the partitioning portions from the center of the partitioning portion.

[Supplementary Note 13] The substrate processing apparatus according to any one of Supplementary notes 1 to 12, preferably,
The cleaning gas is a fluorine-containing gas, a chlorine-containing gas, or a mixed gas in which a fluorine-containing gas or a chlorine-containing gas and an inert gas are mixed.

[Appendix 14] The substrate processing apparatus according to any one of Appendixes 1 to 13, preferably,
The control unit includes at least a process recipe, a cleaning recipe, a deposition ratio table, a storage unit storing an etching ratio table, and at least the deposits of the substrate placement unit and the partition unit facing the plurality of regions. And a display unit for displaying the accumulated film thickness value.

[Supplementary Note 15] According to another aspect of the present invention,
A cleaning method executed in a substrate processing apparatus including at least one processing chamber for processing a substrate, wherein at least a reactive gas is supplied into the processing chamber partitioned into a plurality of regions by a partitioning portion. The supply flow rate of the reactive gas and the supply flow rate of the inert gas to be supplied are adjusted according to the film thickness value of the deposit deposited on the substrate mounting portion and the partition portion provided in the processing chamber, respectively. There is provided a cleaning method including a removing step of removing deposits deposited on the substrate mounting portion and deposits deposited on the partition portion.

[Supplementary Note 16] According to still another aspect of the present invention,
A substrate processing step for processing the substrate in the processing chamber;
At least a reactive gas is supplied into the processing chamber partitioned into a plurality of regions by the partitioning unit, and a substrate placement unit provided in the processing chamber in the substrate processing step and a deposit deposited on the partitioning unit When removing, the supply flow rate of the reactive gas supplied to the region and the supply flow rate of the inert gas are adjusted according to the film thickness values of the deposits deposited on the substrate mounting portion and the partition portion, respectively. There is provided a method for manufacturing a semiconductor device, comprising: a deposit deposited on the substrate mounting portion; and a removing step of removing the deposit deposited on the partition portion.

[Supplementary Note 17] The method of manufacturing a semiconductor device according to Supplementary Note 16, preferably,
The removing step is performed when the accumulated film thickness value of the deposit deposited on the substrate placement unit or the partition unit facing each region exceeds a predetermined value.

[Supplementary Note 18] According to still another aspect of the present invention, there is provided a recording medium in which a program executed by a substrate processing apparatus including at least one processing chamber for processing a substrate is recorded in a computer-readable manner,
When at least a reactive gas is supplied into the processing chamber partitioned into a plurality of regions by the partitioning portion and the deposits deposited on the substrate mounting portion and the partitioning portion provided in the processing chamber are removed, The reactive gas supply flow rate and the inert gas supply flow rate supplied to the region are adjusted in accordance with the film thickness of the deposit deposited on the substrate mounting portion and the partition portion, respectively, and provided in the processing chamber. There is provided a program for causing a computer to execute a deposit deposited on a substrate platform on which the substrate is placed and a procedure for removing the deposit deposited on each of the regions.

[Supplementary Note 19] According to still another aspect of the present invention, there is provided a recording medium in which a program executed by a substrate processing apparatus including at least one processing chamber for processing a substrate is recorded so as to be readable by a computer. At least a reactive gas is supplied into the processing chamber partitioned into a plurality of regions, and the substrate placement unit provided in the processing chamber and the deposits accumulated in the partitioning portion are removed and supplied to the region. The substrate provided in the processing chamber by adjusting the supply flow rate of the reactive gas and the supply flow rate of the inert gas according to the film thickness of the deposit deposited on the substrate mounting portion and the partition portion, respectively. There is provided a computer-readable recording medium recording a program having deposits deposited on a substrate platform on which the program is placed and a procedure for removing deposits deposited in each of the regions. It is.

[Supplementary Note 20] According to still another aspect of the present invention,
A procedure for processing a substrate by supplying a source gas into the region from a source gas supply unit into a processing chamber provided with a substrate mounting unit for mounting a substrate and partitioned into a plurality of regions by a partition unit;
Deposition deposited on the substrate platform by multiplying a deposition rate of deposits deposited on the substrate platform by processing the substrate by a supply time of a source gas supplied from the source gas supply unit A procedure for calculating a reference added film thickness value which is a film thickness value of an object;
A cumulative film thickness management program comprising: a step of multiplying the reference additional film thickness value by a predetermined deposition ratio to calculate an additional film thickness value that is a film thickness value of a deposit deposited for each region. Is provided.

[Supplementary Note 21] According to still another aspect of the present invention,
Out of each region in the processing chamber partitioned into a plurality of regions by the partitioning unit and a substrate mounting unit for mounting the substrate provided in the processing chamber, the partitioning unit and the substrate mounting unit facing each region The film thickness value of the deposit at the place where the film thickness value of the deposited material is the smallest (minimum film thickness region) is set to the etching rate of the deposit removed from the substrate mounting portion and the predetermined minimum film thickness region. Dividing by the product of the etching ratio of, and calculating the reactive gas supply time,
Based on the reactive gas supply time, a reactive gas is supplied from the reactive gas supply unit into each region, and the deposits on the substrate mounting unit and the partition unit facing each region are removed. And the steps to
A procedure for calculating a reference subtracted film thickness value that is a film thickness value of the deposit removed from the substrate mounting portion by multiplying the etching rate by the reactive gas supply time;
A procedure for calculating a subtracted film thickness value, which is a film thickness value of a deposit removed from the partition portion facing each region, by multiplying the reference subtracted film thickness value by a predetermined etching ratio, A cumulative film thickness management program is provided.

[Supplementary Note 22] According to still another aspect of the present invention,
The thickness values of deposits deposited on each of the partition unit facing each region in the processing chamber divided into a plurality of regions by the partition unit and the substrate mounting unit on which the substrate provided in the processing chamber is mounted , A procedure for respectively calculating the reactive gas supply time by dividing by the product of the etching rate of the deposit removed from the substrate mounting portion and a predetermined etching ratio,
A procedure of supplying a reactive gas into each of the regions based on the shortest time among the reactive gas supply times to remove the deposits on the substrate platform and the partition;
A procedure for calculating a reference subtracted film thickness value that is a film thickness value of the deposit removed from the substrate mounting portion by multiplying the etching rate by the reactive gas supply time;
A cumulative film thickness management comprising: calculating a subtracted film thickness value, which is a film thickness value of each deposit removed from the partition portion, by multiplying the reference subtracted film thickness value by a predetermined etching ratio. A program is provided.

[Supplementary Note 23] According to still another aspect of the present invention,
Out of each region in the processing chamber partitioned into a plurality of regions by the partitioning unit and a substrate mounting unit for mounting the substrate provided in the processing chamber, the partitioning unit and the substrate mounting unit facing each region A procedure for calculating the reactive gas supply time by dividing the film thickness value of the deposit at the place where the film thickness value of the deposited material is the largest by the etching rate of the deposit removed from the substrate mounting portion When,
The film thickness value of the deposit on the substrate platform and the partition is divided by the product of the reactive gas supply time and the etching rate, respectively, and the etching rate of the substrate platform and each region is calculated. The procedure to calculate,
When the reactive gas is supplied from the reactive gas supply unit into each region, the amount of the inert gas supplied to each region is adjusted based on the etching ratio, and the reaction in each region is performed. Adjusting the concentration of the reactive gas, respectively, and removing the deposits on the substrate mounting part and the partition part;
By removing the reactive gas supply time, the etching rate, and the etching ratio of the partition portion facing the substrate mounting portion and the regions, respectively, the substrate is removed from the substrate mounting portion and the partition portion, respectively. And a cumulative film thickness management program having a procedure for calculating a subtracted film thickness value, which is a film thickness value of the deposited material.

[Supplementary Note 24] According to still another aspect of the present invention, there is provided a method for controlling a substrate processing apparatus including at least one processing chamber for processing a substrate, the substrate being provided in the processing chamber and mounting the substrate A reaction unit that supplies a reactive gas to the region to remove the deposits deposited on the substrate placement unit and the partition unit by processing the substrate; A reactive gas supply unit; an inert gas supply unit that supplies an inert gas to the region; and a control unit that controls at least the reactive gas supply unit and the inert gas supply unit. When the gas is supplied to the region and the deposit is removed, the reactive gas supply flow rate and the inert gas supply flow rate supplied to the region are deposited on the substrate mounting portion and the partition portion, respectively. Control method of a substrate processing apparatus for adjusting in response to the film thickness value of the deposit was is provided.

[Supplementary Note 25] The substrate processing apparatus according to Supplementary Note 24, further comprising a rotation mechanism that rotates the substrate platform, and preferably, when the deposit is removed, the substrate platform is rotated by the rotation mechanism. A method is provided.

[Supplementary Note 26] Further, a transport mechanism for transporting the substrate to the substrate platform is preferably provided. Preferably, a pseudo substrate (dummy substrate) that is not a product substrate among the substrates is transferred to the substrate platform by the transport mechanism. The method for controlling a substrate processing apparatus according to appendix 24, which is configured to remove the deposit after being placed, is provided.

[Supplementary Note 27] According to still another aspect of the present invention, there is provided a substrate processing apparatus including at least one processing chamber provided with a plurality of regions for processing a substrate, the substrate processing apparatus being provided in the processing chamber, A substrate placement section to be placed; a reactive gas supply section for supplying a reactive gas for removing at least deposits deposited on the substrate placement section by processing of the substrate; and the plurality of areas. An inert gas supply unit that supplies an inert gas to the plurality of regions, and a supply flow rate of the reactive gas that is supplied to the plurality of regions when the reactive gas is supplied to the plurality of regions and the deposit is removed. Control for controlling at least the reactive gas supply unit and the inert gas supply unit so that the supply flow rate of the inert gas is adjusted according to the film thickness value of the deposit deposited on the substrate mounting unit. And the Obtaining a substrate processing apparatus is provided.

[Supplementary Note 28] According to still another aspect of the present invention, there is a cleaning method executed in a substrate processing apparatus including at least one processing chamber provided with a plurality of regions for processing a substrate. At least when the reactive gas is supplied, the reactive gas supply flow rate and the inert gas supply flow rate supplied to the plurality of regions are respectively set on the substrate placement portion provided in the processing chamber. There is provided a cleaning method for a substrate processing apparatus, which includes a removing step of removing deposits deposited on the substrate mounting portion by adjusting according to a film thickness value.

[Supplementary Note 29] According to still another aspect of the present invention, a substrate processing step of processing a substrate in a processing chamber provided with a plurality of regions;
At least reactive gas is supplied into the processing chamber, and the reactive material is supplied to the plurality of regions when removing deposits deposited on a substrate mounting portion provided in the processing chamber in the substrate processing step. A removal step of adjusting the gas supply flow rate and the inert gas supply flow rate according to the film thickness value of the deposit deposited on the substrate platform, respectively, to remove the deposit deposited on the substrate platform. A method for manufacturing a semiconductor device is provided.

[Supplementary Note 30] According to still another aspect of the present invention, a computer-readable recording medium recording a program executed in a substrate processing apparatus including at least one processing chamber provided with a plurality of regions for processing a substrate. When at least reactive gas is supplied into the processing chamber, the reactive gas supply flow rate and the inert gas supply flow rate supplied to the plurality of regions are respectively mounted on the substrate provided in the processing chamber. There is provided a computer-readable recording medium having recorded thereon a program having a procedure of adjusting the film thickness of the deposit deposited on the placement unit to remove the deposit deposited on the substrate placement unit .

[Supplementary Note 31] In the substrate processing apparatus of Supplementary Note 27, preferably, the control unit includes the deposit film among the constituent members constituting the processing chamber facing the plurality of regions including the substrate mounting unit. The step of calculating the supply time of the reactive gas based on the constituent member having the smallest thickness value, and the gas supplied to the region facing the constituent member after the supply time elapses from the reactive gas to the inert gas. By repeating the switching step a predetermined number of times, the deposit deposited on the constituent member is removed.

[Supplementary Note 32] In the substrate processing apparatus of Supplementary Note 27, preferably, the control unit is configured to form the deposit film of each of the constituent members constituting the processing chamber facing the plurality of regions including the substrate mounting unit. The step of calculating the supply time of the reactive gas based on the thickness value, and the constituent member after the removal of the deposit is completed when the reactive gas is supplied based on the calculated supply time of the reactive gas An inert gas is supplied to the region facing the substrate so that the reactive gas is not supplied, and the reactive gas is supplied to a region facing the component member where removal of the deposit is not completed And adjusting the supply flow rates of the reactive gas and the inert gas to remove the deposits deposited on the constituent members.

[Appendix 33] In the substrate processing apparatus of Appendix 27, preferably
The control unit may adjust the concentration of the reactive gas in the region according to the film thickness value of the deposit deposited on each of the components facing the region. The supply flow rate of the inert gas to be supplied is adjusted.

[Supplementary Note 34] In the substrate processing apparatus of Supplementary Note 33, preferably, the control unit is configured to control the reactive gas based on a region facing a constituent member having a largest film thickness value of the deposit among the plurality of regions. A supply time is calculated, and an etching ratio of each of the plurality of regions is calculated.

[Supplementary Note 35] Furthermore, preferably, a source gas supply unit that supplies source gas to the substrate is provided, and the control unit includes:
Item 27. The substrate processing according to appendix 27, wherein the film thickness value of the deposit deposited on the component facing the region is calculated by multiplying the film thickness value of the deposit deposited on the substrate platform by a predetermined deposition ratio. An apparatus is provided.

[Appendix 36] In the substrate processing apparatus of Appendix 35, preferably, the control unit includes:
The film thickness value of the deposit removed from the substrate mounting portion is calculated by multiplying the removal ratio for removing the deposit by the supply time of the reactive gas.

[Appendix 37] According to still another aspect of the present invention, there is provided a method for controlling a substrate processing apparatus including at least one processing chamber for processing a substrate, the substrate being provided in the processing chamber and mounting the substrate A mounting unit; a reactive gas supply unit that supplies a reactive gas that removes at least deposits deposited on the substrate mounting unit by processing the substrate; and an inert gas that is supplied to the plurality of regions. An inert gas supply unit that supplies at least the reactive gas supply unit and a control unit that controls the inert gas supply unit, and supplies the reactive gas to the plurality of regions. When removing an object, the supply flow rate of the reactive gas and the supply flow rate of the inert gas supplied to the plurality of regions are adjusted in accordance with the film thickness value of the deposit deposited on the substrate platform, respectively. Control of substrate processing equipment A method is provided.

The present invention can be applied to a substrate processing apparatus that includes a processing chamber for processing a substrate and removes deposits deposited on members constituting the processing chamber.

This application claims the benefit of priority based on Japanese Patent Application No. 2013-0505559 filed on Mar. 13, 2013, the entire disclosure of which is incorporated herein by reference.

10: Substrate processing equipment PM1, PM2, Process chamber (processing room) ST1, ST2, Susceptor (substrate mounting part) ２０５ 205, Partition plate (partition part) 257, Reactive gas supply part 254-256 Inert gas control part

Claims

A substrate processing apparatus comprising at least one processing chamber provided with a plurality of regions for processing a substrate,
A substrate mounting portion provided in the processing chamber for mounting the substrate;
A reactive gas supply unit that supplies, to the plurality of regions, a reactive gas that removes at least deposits deposited on the substrate mounting unit by processing the substrate;
An inert gas supply unit for supplying an inert gas to the plurality of regions;
When the reactive gas is supplied to the plurality of regions and the deposit is removed, the supply flow rate of the reactive gas and the supply flow rate of the inert gas supplied to the plurality of regions are respectively set to the substrate mounting unit. A substrate processing apparatus comprising: a control unit that controls at least the reactive gas supply unit and the inert gas supply unit so as to adjust according to a film thickness value of the deposit deposited on the substrate.
A cleaning method executed by a substrate processing apparatus including at least one processing chamber provided with a plurality of regions for processing a substrate, wherein at least a reactive gas is supplied into the processing chamber, the supply to the plurality of regions Adjusting the supply flow rate of the reactive gas and the supply flow rate of the inert gas according to the film thickness value of the deposit deposited on the substrate mounting portion provided in the processing chamber, respectively. A method for cleaning a substrate processing apparatus, comprising a removing step of removing deposits deposited on the substrate.
A substrate processing step of processing a substrate in a processing chamber provided with a plurality of regions;
At least reactive gas is supplied into the processing chamber, and the reactive material is supplied to the plurality of regions when removing deposits deposited on a substrate mounting portion provided in the processing chamber in the substrate processing step. A removal step of adjusting the gas supply flow rate and the inert gas supply flow rate according to the film thickness value of the deposit deposited on the substrate platform, respectively, to remove the deposit deposited on the substrate platform. A method for manufacturing a semiconductor device.
A recording medium in which a program executed by a substrate processing apparatus including at least one processing chamber provided with a plurality of regions for processing a substrate is recorded in a computer-readable manner, and at least a reactive gas is supplied into the processing chamber In this case, the reactive gas supply flow rate and the inert gas supply flow rate supplied to the plurality of regions are adjusted according to the film thickness of the deposit deposited on the substrate mounting portion provided in the processing chamber, respectively. And a computer-readable recording medium having recorded thereon a program having a procedure of removing deposits deposited on the substrate mounting portion.
The control unit supplies reactive gas based on a constituent member having the smallest film thickness value of the deposit among constituent members constituting the processing chamber facing the plurality of regions including the substrate placement unit. The process of calculating the time and the process of switching the gas supplied to the region facing the structural member from the reactive gas to the inert gas after the supply time has passed are repeated a predetermined number of times. The substrate processing apparatus according to claim 1, wherein the deposited deposit is removed.
The control unit calculates a supply time of the reactive gas based on a film thickness value of each deposit of each of the constituent members constituting the processing chamber facing the plurality of regions including the substrate mounting unit. When the reactive gas is supplied based on the process and the calculated supply time of the reactive gas, the reactive gas is not supplied to the region facing the component member after the removal of the deposit is completed. The reactive gas and the inert gas supply flow rate so as to supply the reactive gas to the region facing the component member where the inert gas is supplied to the component member and the removal of the deposit is not completed. The substrate processing apparatus according to claim 1, further comprising a step of removing the deposits deposited on the constituent members by adjusting.
The control unit controls the plurality of regions so that the concentration of the reactive gas in the region is adjusted according to the film thickness value of the deposit deposited on each of the constituent members facing the plurality of regions. The substrate processing apparatus according to claim 1, wherein a supply flow rate of the supplied inert gas is adjusted.
The control unit calculates a supply time of the reactive gas based on a region facing a constituent member having the largest film thickness value of the deposit among the plurality of regions, and sets an etching ratio of each of the plurality of regions. The substrate processing apparatus according to claim 7 to calculate.
A source gas supply unit configured to supply a source gas to the substrate;
The film thickness value of the deposit deposited on the component facing the region is calculated by multiplying the film thickness value of the deposit deposited on the substrate platform by a predetermined deposition ratio, respectively. Substrate processing equipment.
The controller is
The substrate processing apparatus according to claim 9, wherein a film thickness value of the deposit removed from the substrate mounting unit is calculated by multiplying a removal ratio for removing the deposit by a supply time of the reactive gas.
A method for controlling a substrate processing apparatus including at least one processing chamber for processing a substrate, the substrate mounting portion being provided in the processing chamber and mounting the substrate, and at least the substrate mounting by processing the substrate A reactive gas supply unit that supplies the plurality of regions with a reactive gas that removes deposits deposited on the unit, an inert gas supply unit that supplies an inert gas to the plurality of regions, and at least the reactive gas A control unit that controls the supply unit and the inert gas supply unit, and supplies the reactive gas to the plurality of regions and supplies the plurality of regions to the plurality of regions when removing the deposits. A control method for a substrate processing apparatus, wherein a gas supply flow rate and an inert gas supply flow rate are adjusted in accordance with a film thickness value of the deposit deposited on the substrate platform.