WO2014135109A1 - Carte de source lumineuse et procédé de fabrication d'une source lumineuse - Google Patents

Carte de source lumineuse et procédé de fabrication d'une source lumineuse Download PDF

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Publication number
WO2014135109A1
WO2014135109A1 PCT/CN2014/073019 CN2014073019W WO2014135109A1 WO 2014135109 A1 WO2014135109 A1 WO 2014135109A1 CN 2014073019 W CN2014073019 W CN 2014073019W WO 2014135109 A1 WO2014135109 A1 WO 2014135109A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate body
substrate
disposed
base board
board body
Prior art date
Application number
PCT/CN2014/073019
Other languages
English (en)
Chinese (zh)
Inventor
陈锡然
Original Assignee
北京优格莱照明科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京优格莱照明科技有限公司 filed Critical 北京优格莱照明科技有限公司
Publication of WO2014135109A1 publication Critical patent/WO2014135109A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/047—Box-like arrangements of PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the invention relates to the field of electric lamps, in particular to a method for manufacturing a wick board and a wick.
  • the wick is an important part of the lighting equipment, and has been widely used in the prior art.
  • the prior art is mainly tungsten wire, LED, etc., but due to the complicated structure of the prior art, a lot of time is wasted in the production process and the assembly process, thereby Greatly reduce the efficiency of work.
  • the invention provides a manufacturing method of a wick board and a wick, which solves the problem that the working efficiency is reduced due to complicated structure in the prior art.
  • a wick board comprising:
  • a substrate comprising: a first substrate body and a second substrate body;
  • the first substrate body and the second substrate body are connected together;
  • a positive electrode connection point and a negative electrode connection point are disposed on the second substrate body;
  • N illuminating devices for illuminating after being energized, respectively disposed on the first substrate body and the second substrate body;
  • N is a positive integer greater than one.
  • the method further includes:
  • the heat dissipation slit is used for heat dissipation of the light emitting device, is disposed on the second substrate body, and divides the second substrate body into N substrate strips.
  • the method further includes: a fixing hole for connecting with the base of the wick board, and is disposed at one end of the second substrate body.
  • the substrate is specifically an aluminum substrate.
  • the first substrate body is substantially circular;
  • the light-emitting devices are specifically arranged on the first substrate at equal intervals.
  • the light emitting device is specifically an LED light emitting device.
  • the invention also discloses a method for manufacturing a wick, comprising the following steps:
  • the second substrate body is bent into a cylinder in a clockwise/counterclockwise direction according to a bisector
  • the illuminating device After bending, the illuminating device is placed on the outer surface of the column after bending;
  • the first substrate body is bent by using a joint of the first substrate body and the second substrate body as a bending line.
  • the second substrate body is equally divided by a heat dissipation slit.
  • the second substrate body is bent into a cylinder in a clockwise/counterclockwise direction according to the heat dissipation slit.
  • the design can save a lot of time in the assembly process, thereby improving work efficiency.
  • the substrate needs to be press-molded, and then the illuminating device and the conducting device are disposed on the substrate, that is, the wicking board is completed, which saves a lot of time compared with the prior art, and thus improves the time. Work efficiency;
  • the toughness and the deformation degree are very good. Therefore, when the formed wick plate is bent, it is not easy to be broken, and the shaft can be ensured that the current is good and the like is transmitted later. Its service life is enhanced.
  • FIG. 1 is a schematic structural view of a wick core before bending according to the present invention
  • FIG. 2 is a schematic structural view of a wick plate after bending according to the present invention.
  • FIG. 3 is a flow chart of a method of fabricating a wick of the present invention.
  • the first substrate body 2. The second substrate body; 3. The conduction device; 4. The positive electrode connection point; 5. The negative electrode connection point; 6. The light-emitting device; 101, the substrate strip; 7. The fixing hole.
  • a wick board of the present invention includes:
  • a substrate comprising: a first substrate body 1 and a second substrate body 2;
  • the first substrate body 1 and the second substrate body 2 are connected together;
  • the positive electrode connection point 4 and the negative electrode connection point 5 are disposed on the second substrate body 2;
  • N light-emitting devices 6 for emitting light after being energized, respectively disposed on the first substrate body 1 and the second substrate body 2;
  • N is a positive integer greater than one.
  • the design can save a lot of time in the assembly process, thereby improving work efficiency;
  • the substrate needs to be press-molded, and then the light-emitting device 6 and the conductive device 3 are disposed on the substrate, that is, the wick board is completed, which saves a lot of time compared with the prior art, and thus improves the time. Work efficiency.
  • the substrate is divided into a first substrate body 1 and a second substrate body 2, and the first substrate body 1 and the second substrate body 2 are connected together, in the first substrate body 1 and the second
  • the connection between the substrate body 2 is provided with a conduction device 3, and the conduction device 3 is also disposed on the second substrate body 2.
  • the conduction device 3 is specifically N.
  • the conduction device 3 is specifically on the second substrate.
  • the position and the number of the upper substrate body 2 are determined according to the number of bends of the second substrate body 2, that is, the turn-on device 3 is provided at each of the bends of the second substrate body 2, and is realized by the conduction device 3 at the first position.
  • the conduction of current or the like is ensured, and when the substrate is bent by the conduction device 3, the connection strength of the substrate at the bending portion is increased to avoid breaking during the bending process of the substrate.
  • the conduction device 3 not only the substrate and the conduction current can be protected, but also the connection between the conduction device 3 and the substrate is simple during the manufacturing process, the production speed is increased, and mass production can be realized, so that the manufacturing cost is reduced. ; positive connection 4 and the negative connection point 5 disposed at both ends of the second substrate main body 2, via the positive electrode and the negative connection point 4 point 5 and the wires, thus achieving the power supply is connected through a wire to the power supply wick plate;
  • the light-emitting devices 6 are evenly spaced on the first substrate body 1 and the second substrate body 2, and in the present embodiment, the LED light-emitting device 6 is preferably used; as shown in FIG. 1 or FIG. 2, in the first substrate body 1
  • the light-emitting device 6 is annularly disposed on the first substrate body 1 in such a manner that the light emitted from the light-emitting device 6 is more uniform and the light-emitting device 6 is disposed on the first substrate body 1 by such an arrangement.
  • the number of the devices 6 is N, that is, according to the actual use size of the first substrate, in the embodiment, 15 light-emitting devices 6 are preferably disposed on the first substrate body 1;
  • the light-emitting device 6 on the main body 2 is provided according to a bending line for bending the second substrate body 2.
  • the second substrate body 2 is preferably divided into six parts, that is, the light-emitting devices 6 are respectively disposed at each of the equal parts.
  • N is disposed
  • the illuminating means 6, here also depends on the actual size of the aliquoted second substrate body 2. In the present embodiment, it is preferred to arrange the illuminating means 6 equidistantly in two rows and six illuminating means 6 per column.
  • the method further includes:
  • the heat dissipation slit is used for heat dissipation of the light-emitting device 6, is disposed on the second substrate body 2, and divides the second substrate body 2 into N substrate strips 101.
  • the heat dissipation slit is disposed on the second substrate body 2, and the heat dissipation is performed on the light-emitting device 6.
  • the heat dissipation slits are specifically N, and the second substrate body 2 is divided into N substrate strips 101, and the heat dissipation slits are specifically The number is specifically determined according to the size of the second substrate body 2 and the actual use.
  • five heat dissipation slits are preferably disposed, and the second substrate body 2 is divided into six substrate strips 101 according to the heat dissipation slit, that is, The second substrate body 2 is bent with the heat dissipation slit as an axis, and the light-emitting device 6 is disposed outside after bending; finally, the two ends of the second substrate body 2 are butted together to form a cylinder.
  • the fixing hole 7 is further connected to the base of the wick board and disposed at one end of the second substrate body 2.
  • a fixing hole 7 is disposed at one end of the second substrate body 2, and the fixing hole 7 is specifically disposed on each of the aliquoted second substrate bodies 2, when connected to the external base,
  • the base is softened by a laser or the like, and the softened base enters the fixing hole 7, and after cooling, a part of the base will fix each fixing hole 7, thereby preventing the second substrate body 2 and the external base. Separation avoids the detachment of the substrate body from the external base during later use.
  • the substrate is specifically an aluminum substrate.
  • the first substrate body 1 is specifically circular;
  • the light-emitting devices 6 are specifically arranged on the first substrate at equal intervals.
  • the illumination device 6 is specifically an LED illumination device 6.
  • the invention also discloses a method for manufacturing a wick, comprising the following steps:
  • the second substrate body 2 is bent into a cylinder in a clockwise/counterclockwise direction according to a bisector;
  • the illuminating device 6 After bending, the illuminating device 6 is ensured to be placed on the outer surface of the column after bending;
  • the first substrate body 1 is bent by taking a joint of the first substrate body 1 and the second substrate body 2 as a bending line.
  • the second substrate body 2 is first halved in the axial direction.
  • the second substrate body 2 is preferably equally divided into six parts, of course, according to the size of the second substrate body 2.
  • the second substrate body 2 can be equally divided into 7 parts, 8 parts or more; in order to save space, the description will not be repeated in the present invention; the equally divided second substrate body 2 is bisector-oriented. Bending clockwise or counterclockwise, the second substrate body 2 is formed into a cylinder, and after the bending, the light-emitting device 6 is disposed on the outer surface of the cylinder, and then according to the first substrate body 1 and the second substrate body 2 The first substrate body 1 is bent at a joint by a bending line. After the bending, the first substrate body 1 is placed on the upper side of the cylinder formed by bending the second substrate body 2, so that when the light-emitting device 6 emits light, Ensure that the emitted light can be emitted to all sides.
  • the second substrate body 2 is equally divided by a heat dissipation slit.
  • the second substrate body 2 is bent into a cylinder in a clockwise/counterclockwise direction according to the heat dissipation slit.
  • the second substrate body 2 may be equally divided according to the heat dissipation slit, and the second substrate body 2 may be bent clockwise or counterclockwise according to the heat dissipation slit, and after the bending is formed, the body is formed.
  • the light-emitting device 6 or the like can be subjected to heat dissipation processing through the heat dissipation slit without affecting the light emission.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Carte de source lumineuse et procédé de fabrication d'une source lumineuse qui pallie le problème résidant dans le faible rendement résultant de structures complexes. Cette carte de source lumineuse comprend : une carte support comprenant un premier élément de carte support (1) et un second élément de carte support (2), le premier élément de carte support (1) étant connecté au second élément de carte support (2); N dispositifs conducteurs (3) destinés à conduire l'électricité après pliage du premier élément de carte support (1) et du second élément de carte support (2), disposés au niveau de la connexion entre le premier élément de carte support (1) et le second élément de carte support (2), ainsi que sur le second élément de carte support (2); un point de connexion d'anode (4) et un point de connexion de cathode (5) disposés sur le second élément de carte support (2); et N dispositifs électroluminescents (6) pour l'émission de lumière après mise sous tension, disposés sur le premier élément de carte support (1) et sur le second élément de carte support (2), N étant un entier positif supérieur à 1. Cette carte de source lumineuse et ce procédé de fabrication de source lumineuse permettent des économies de temps de production et d'assemblage et une augmentation du rendement.
PCT/CN2014/073019 2013-03-08 2014-03-07 Carte de source lumineuse et procédé de fabrication d'une source lumineuse WO2014135109A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310074187.5 2013-03-08
CN201310074187.5A CN103151345B (zh) 2013-03-08 2013-03-08 一种灯芯板及灯芯的制作方法

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Publication Number Publication Date
WO2014135109A1 true WO2014135109A1 (fr) 2014-09-12

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PCT/CN2014/073019 WO2014135109A1 (fr) 2013-03-08 2014-03-07 Carte de source lumineuse et procédé de fabrication d'une source lumineuse

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WO (1) WO2014135109A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151345B (zh) * 2013-03-08 2016-08-03 北京优格莱照明科技有限公司 一种灯芯板及灯芯的制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030214817A1 (en) * 2002-04-12 2003-11-20 Osram Opto Semiconductors Gmbh LED module
CN102095172A (zh) * 2009-12-15 2011-06-15 富士迈半导体精密工业（上海）有限公司 发光二极管灯具
CN102478175A (zh) * 2010-11-25 2012-05-30 展晶科技(深圳)有限公司 发光二极管灯条及发光二极管灯条组件
CN102889480A (zh) * 2012-07-19 2013-01-23 王定锋 三维发光的led灯泡模组和制造方法
CN103151345A (zh) * 2013-03-08 2013-06-12 北京优格莱照明科技有限公司 一种灯芯板及灯芯的制作方法
CN203150542U (zh) * 2013-03-08 2013-08-21 北京优格莱照明科技有限公司 一种灯芯板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102437148A (zh) * 2011-12-16 2012-05-02 苏州晶品光电科技有限公司 柔性电路基板led二维阵列光源

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030214817A1 (en) * 2002-04-12 2003-11-20 Osram Opto Semiconductors Gmbh LED module
CN102095172A (zh) * 2009-12-15 2011-06-15 富士迈半导体精密工业（上海）有限公司 发光二极管灯具
CN102478175A (zh) * 2010-11-25 2012-05-30 展晶科技(深圳)有限公司 发光二极管灯条及发光二极管灯条组件
CN102889480A (zh) * 2012-07-19 2013-01-23 王定锋 三维发光的led灯泡模组和制造方法
CN103151345A (zh) * 2013-03-08 2013-06-12 北京优格莱照明科技有限公司 一种灯芯板及灯芯的制作方法
CN203150542U (zh) * 2013-03-08 2013-08-21 北京优格莱照明科技有限公司 一种灯芯板

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CN103151345B (zh) 2016-08-03

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