WO2014135109A1 - Lamp filament board and lamp filament manufacturing method - Google Patents

Lamp filament board and lamp filament manufacturing method Download PDF

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Publication number
WO2014135109A1
WO2014135109A1 PCT/CN2014/073019 CN2014073019W WO2014135109A1 WO 2014135109 A1 WO2014135109 A1 WO 2014135109A1 CN 2014073019 W CN2014073019 W CN 2014073019W WO 2014135109 A1 WO2014135109 A1 WO 2014135109A1
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WO
WIPO (PCT)
Prior art keywords
substrate body
substrate
disposed
base board
board body
Prior art date
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PCT/CN2014/073019
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French (fr)
Chinese (zh)
Inventor
陈锡然
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北京优格莱照明科技有限公司
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Publication of WO2014135109A1 publication Critical patent/WO2014135109A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/047Box-like arrangements of PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Definitions

  • the invention relates to the field of electric lamps, in particular to a method for manufacturing a wick board and a wick.
  • the wick is an important part of the lighting equipment, and has been widely used in the prior art.
  • the prior art is mainly tungsten wire, LED, etc., but due to the complicated structure of the prior art, a lot of time is wasted in the production process and the assembly process, thereby Greatly reduce the efficiency of work.
  • the invention provides a manufacturing method of a wick board and a wick, which solves the problem that the working efficiency is reduced due to complicated structure in the prior art.
  • a wick board comprising:
  • a substrate comprising: a first substrate body and a second substrate body;
  • the first substrate body and the second substrate body are connected together;
  • a positive electrode connection point and a negative electrode connection point are disposed on the second substrate body;
  • N illuminating devices for illuminating after being energized, respectively disposed on the first substrate body and the second substrate body;
  • N is a positive integer greater than one.
  • the method further includes:
  • the heat dissipation slit is used for heat dissipation of the light emitting device, is disposed on the second substrate body, and divides the second substrate body into N substrate strips.
  • the method further includes: a fixing hole for connecting with the base of the wick board, and is disposed at one end of the second substrate body.
  • the substrate is specifically an aluminum substrate.
  • the first substrate body is substantially circular;
  • the light-emitting devices are specifically arranged on the first substrate at equal intervals.
  • the light emitting device is specifically an LED light emitting device.
  • the invention also discloses a method for manufacturing a wick, comprising the following steps:
  • the second substrate body is bent into a cylinder in a clockwise/counterclockwise direction according to a bisector
  • the illuminating device After bending, the illuminating device is placed on the outer surface of the column after bending;
  • the first substrate body is bent by using a joint of the first substrate body and the second substrate body as a bending line.
  • the second substrate body is equally divided by a heat dissipation slit.
  • the second substrate body is bent into a cylinder in a clockwise/counterclockwise direction according to the heat dissipation slit.
  • the design can save a lot of time in the assembly process, thereby improving work efficiency.
  • the substrate needs to be press-molded, and then the illuminating device and the conducting device are disposed on the substrate, that is, the wicking board is completed, which saves a lot of time compared with the prior art, and thus improves the time. Work efficiency;
  • the toughness and the deformation degree are very good. Therefore, when the formed wick plate is bent, it is not easy to be broken, and the shaft can be ensured that the current is good and the like is transmitted later. Its service life is enhanced.
  • FIG. 1 is a schematic structural view of a wick core before bending according to the present invention
  • FIG. 2 is a schematic structural view of a wick plate after bending according to the present invention.
  • FIG. 3 is a flow chart of a method of fabricating a wick of the present invention.
  • the first substrate body 2. The second substrate body; 3. The conduction device; 4. The positive electrode connection point; 5. The negative electrode connection point; 6. The light-emitting device; 101, the substrate strip; 7. The fixing hole.
  • a wick board of the present invention includes:
  • a substrate comprising: a first substrate body 1 and a second substrate body 2;
  • the first substrate body 1 and the second substrate body 2 are connected together;
  • the positive electrode connection point 4 and the negative electrode connection point 5 are disposed on the second substrate body 2;
  • N light-emitting devices 6 for emitting light after being energized, respectively disposed on the first substrate body 1 and the second substrate body 2;
  • N is a positive integer greater than one.
  • the design can save a lot of time in the assembly process, thereby improving work efficiency;
  • the substrate needs to be press-molded, and then the light-emitting device 6 and the conductive device 3 are disposed on the substrate, that is, the wick board is completed, which saves a lot of time compared with the prior art, and thus improves the time. Work efficiency.
  • the substrate is divided into a first substrate body 1 and a second substrate body 2, and the first substrate body 1 and the second substrate body 2 are connected together, in the first substrate body 1 and the second
  • the connection between the substrate body 2 is provided with a conduction device 3, and the conduction device 3 is also disposed on the second substrate body 2.
  • the conduction device 3 is specifically N.
  • the conduction device 3 is specifically on the second substrate.
  • the position and the number of the upper substrate body 2 are determined according to the number of bends of the second substrate body 2, that is, the turn-on device 3 is provided at each of the bends of the second substrate body 2, and is realized by the conduction device 3 at the first position.
  • the conduction of current or the like is ensured, and when the substrate is bent by the conduction device 3, the connection strength of the substrate at the bending portion is increased to avoid breaking during the bending process of the substrate.
  • the conduction device 3 not only the substrate and the conduction current can be protected, but also the connection between the conduction device 3 and the substrate is simple during the manufacturing process, the production speed is increased, and mass production can be realized, so that the manufacturing cost is reduced. ; positive connection 4 and the negative connection point 5 disposed at both ends of the second substrate main body 2, via the positive electrode and the negative connection point 4 point 5 and the wires, thus achieving the power supply is connected through a wire to the power supply wick plate;
  • the light-emitting devices 6 are evenly spaced on the first substrate body 1 and the second substrate body 2, and in the present embodiment, the LED light-emitting device 6 is preferably used; as shown in FIG. 1 or FIG. 2, in the first substrate body 1
  • the light-emitting device 6 is annularly disposed on the first substrate body 1 in such a manner that the light emitted from the light-emitting device 6 is more uniform and the light-emitting device 6 is disposed on the first substrate body 1 by such an arrangement.
  • the number of the devices 6 is N, that is, according to the actual use size of the first substrate, in the embodiment, 15 light-emitting devices 6 are preferably disposed on the first substrate body 1;
  • the light-emitting device 6 on the main body 2 is provided according to a bending line for bending the second substrate body 2.
  • the second substrate body 2 is preferably divided into six parts, that is, the light-emitting devices 6 are respectively disposed at each of the equal parts.
  • N is disposed
  • the illuminating means 6, here also depends on the actual size of the aliquoted second substrate body 2. In the present embodiment, it is preferred to arrange the illuminating means 6 equidistantly in two rows and six illuminating means 6 per column.
  • the method further includes:
  • the heat dissipation slit is used for heat dissipation of the light-emitting device 6, is disposed on the second substrate body 2, and divides the second substrate body 2 into N substrate strips 101.
  • the heat dissipation slit is disposed on the second substrate body 2, and the heat dissipation is performed on the light-emitting device 6.
  • the heat dissipation slits are specifically N, and the second substrate body 2 is divided into N substrate strips 101, and the heat dissipation slits are specifically The number is specifically determined according to the size of the second substrate body 2 and the actual use.
  • five heat dissipation slits are preferably disposed, and the second substrate body 2 is divided into six substrate strips 101 according to the heat dissipation slit, that is, The second substrate body 2 is bent with the heat dissipation slit as an axis, and the light-emitting device 6 is disposed outside after bending; finally, the two ends of the second substrate body 2 are butted together to form a cylinder.
  • the fixing hole 7 is further connected to the base of the wick board and disposed at one end of the second substrate body 2.
  • a fixing hole 7 is disposed at one end of the second substrate body 2, and the fixing hole 7 is specifically disposed on each of the aliquoted second substrate bodies 2, when connected to the external base,
  • the base is softened by a laser or the like, and the softened base enters the fixing hole 7, and after cooling, a part of the base will fix each fixing hole 7, thereby preventing the second substrate body 2 and the external base. Separation avoids the detachment of the substrate body from the external base during later use.
  • the substrate is specifically an aluminum substrate.
  • the first substrate body 1 is specifically circular;
  • the light-emitting devices 6 are specifically arranged on the first substrate at equal intervals.
  • the illumination device 6 is specifically an LED illumination device 6.
  • the invention also discloses a method for manufacturing a wick, comprising the following steps:
  • the second substrate body 2 is bent into a cylinder in a clockwise/counterclockwise direction according to a bisector;
  • the illuminating device 6 After bending, the illuminating device 6 is ensured to be placed on the outer surface of the column after bending;
  • the first substrate body 1 is bent by taking a joint of the first substrate body 1 and the second substrate body 2 as a bending line.
  • the second substrate body 2 is first halved in the axial direction.
  • the second substrate body 2 is preferably equally divided into six parts, of course, according to the size of the second substrate body 2.
  • the second substrate body 2 can be equally divided into 7 parts, 8 parts or more; in order to save space, the description will not be repeated in the present invention; the equally divided second substrate body 2 is bisector-oriented. Bending clockwise or counterclockwise, the second substrate body 2 is formed into a cylinder, and after the bending, the light-emitting device 6 is disposed on the outer surface of the cylinder, and then according to the first substrate body 1 and the second substrate body 2 The first substrate body 1 is bent at a joint by a bending line. After the bending, the first substrate body 1 is placed on the upper side of the cylinder formed by bending the second substrate body 2, so that when the light-emitting device 6 emits light, Ensure that the emitted light can be emitted to all sides.
  • the second substrate body 2 is equally divided by a heat dissipation slit.
  • the second substrate body 2 is bent into a cylinder in a clockwise/counterclockwise direction according to the heat dissipation slit.
  • the second substrate body 2 may be equally divided according to the heat dissipation slit, and the second substrate body 2 may be bent clockwise or counterclockwise according to the heat dissipation slit, and after the bending is formed, the body is formed.
  • the light-emitting device 6 or the like can be subjected to heat dissipation processing through the heat dissipation slit without affecting the light emission.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A lamp filament board and a lamp filament manufacturing method that solve the problem in the prior art of low work efficiency caused by complex structures. The lamp filament board comprises: a base board comprising a first base board body (1) and a second base board body (2); the first base board body (1) is connected with the second base board body (2); N conduction devices (3), for conducting electricity after the first base board body (1) and the second base board body (2) are folded, are disposed at the connection between the first base board body (1) and the second base board body (2) and are disposed on the second base board body (2); an anode connection point (4) and a cathode connection point (5) are disposed on the second base board body (2); N light-emitting devices (6) for emitting light after being powered are disposed on the first base board body (1) and the second base board body (2); N is a positive integer greater than 1. The lamp filament board and the lamp filament manufacturing method conserve the generation and assembly time and enhance work efficiency.

Description

一种灯芯板及灯芯的制作方法  Method for manufacturing wick board and wick 技术领域Technical field
本发明涉及电灯领域,特别是指一种灯芯板及灯芯的制作方法。The invention relates to the field of electric lamps, in particular to a method for manufacturing a wick board and a wick.
背景技术Background technique
灯芯是照明设备的重要组成部分,现在已经被广泛应用,现有技术中主要为钨丝、LED等,但是由于现有技术结构复杂,导致在生产制作过程和组装过程中都浪费很多时间,从而大大的减低的工作效率。 The wick is an important part of the lighting equipment, and has been widely used in the prior art. The prior art is mainly tungsten wire, LED, etc., but due to the complicated structure of the prior art, a lot of time is wasted in the production process and the assembly process, thereby Greatly reduce the efficiency of work.
技术问题technical problem
本发明提出一种灯芯板及灯芯的制作方法,解决了现有技术中由于结构复杂导致工作效率降低的问题。 The invention provides a manufacturing method of a wick board and a wick, which solves the problem that the working efficiency is reduced due to complicated structure in the prior art.
技术解决方案Technical solution
本发明的技术方案是这样实现的: The technical solution of the present invention is implemented as follows:
一种灯芯板,包括:A wick board comprising:
基板,包括:第一基板本体和第二基板本体;a substrate comprising: a first substrate body and a second substrate body;
第一基板本体和第二基板本体连接在一起;The first substrate body and the second substrate body are connected together;
N个导通装置,用于在第一基板本体和第二基板本体折叠后进行电流导通,分别设置在第一基板本体和第二基板本体连接处以及第二基板本体上;N conducting means for conducting current conduction after the first substrate body and the second substrate body are folded, respectively disposed at the junction of the first substrate body and the second substrate body and the second substrate body;
正极连接点和负极连接点,设置在第二基板本体上;a positive electrode connection point and a negative electrode connection point are disposed on the second substrate body;
N个发光装置,用于通电后发光,分别设置第一基板本体和第二基板本体上;N illuminating devices for illuminating after being energized, respectively disposed on the first substrate body and the second substrate body;
N为大于1的正整数。N is a positive integer greater than one.
优选的,还包括:Preferably, the method further includes:
散热缝,用于发光装置散热,设置在第二基板本体上,并将第二基板本体分为N个基板条。The heat dissipation slit is used for heat dissipation of the light emitting device, is disposed on the second substrate body, and divides the second substrate body into N substrate strips.
优选的,还包括:固定孔,用于与灯芯板底座连接,设置在第二基板本体的一端。Preferably, the method further includes: a fixing hole for connecting with the base of the wick board, and is disposed at one end of the second substrate body.
优选的,基板具体为铝基板。Preferably, the substrate is specifically an aluminum substrate.
优选的,第一基板本体具体为圆形;Preferably, the first substrate body is substantially circular;
发光装置具体为等间距环形设置在第一基板上。The light-emitting devices are specifically arranged on the first substrate at equal intervals.
优选的,发光装置具体为LED发光装置。Preferably, the light emitting device is specifically an LED light emitting device.
本发明中还公开了一种制作灯芯方法,包括如下步骤:The invention also discloses a method for manufacturing a wick, comprising the following steps:
将第二基板本体在轴向上进行等分;Dividing the second substrate body in the axial direction;
根据等分线将第二基板本体进行顺时针/逆时针方向弯折成柱体;The second substrate body is bent into a cylinder in a clockwise/counterclockwise direction according to a bisector;
弯折后保证发光装置置于弯折后的柱体外表面;After bending, the illuminating device is placed on the outer surface of the column after bending;
以第一基板本体和第二基板本体的连接处为弯折线,将第一基板本体进行弯折。The first substrate body is bent by using a joint of the first substrate body and the second substrate body as a bending line.
优选的,第二基板本体通过散热缝进行等分。Preferably, the second substrate body is equally divided by a heat dissipation slit.
优选的,根据散热缝将第二基板本体进行顺时针/逆时针方向弯折成柱体。Preferably, the second substrate body is bent into a cylinder in a clockwise/counterclockwise direction according to the heat dissipation slit.
有益效果Beneficial effect
本发明技术方案通过在将发光装置设置在基板上,并通过对基板的弯折,使其弯折成筒状的灯芯,通过这样的设计,组装的过程中能够节省大量时间,进而提高工作效率;另外,在生产阶段仅需要将基板压制成型再将发光装置和导通装置设置在基板上即对灯芯板制作完成,与现有技术中需要制作很多部件相比,时间节省了很多,进而提高了工作效率; According to the technical solution of the present invention, by arranging the light-emitting device on the substrate and bending it into a cylindrical wick by bending the substrate, the design can save a lot of time in the assembly process, thereby improving work efficiency. In addition, in the production stage, only the substrate needs to be press-molded, and then the illuminating device and the conducting device are disposed on the substrate, that is, the wicking board is completed, which saves a lot of time compared with the prior art, and thus improves the time. Work efficiency;
另外,由于采用铝基板,其韧度和变形度都非常好,因此在对成型了的灯芯板进行弯折时,不容易折断,且轴再后期能够保证电流等良好的传到的前提下使其使用寿命增强。In addition, since the aluminum substrate is used, the toughness and the deformation degree are very good. Therefore, when the formed wick plate is bent, it is not easy to be broken, and the shaft can be ensured that the current is good and the like is transmitted later. Its service life is enhanced.
附图说明DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。 In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any inventive labor.
图1为本发明一种灯芯板弯折前的结构示意图;1 is a schematic structural view of a wick core before bending according to the present invention;
图2为本发明一种灯芯板弯折后的结构示意图;2 is a schematic structural view of a wick plate after bending according to the present invention;
图3为本发明一种灯芯的制作方法的流程框图。3 is a flow chart of a method of fabricating a wick of the present invention.
图中:In the picture:
1、第一基板本体;2、第二基板本体;3、导通装置;4、正极连接点;5、负极连接点;6、发光装置;101、基板条;7、固定孔。1. The first substrate body; 2. The second substrate body; 3. The conduction device; 4. The positive electrode connection point; 5. The negative electrode connection point; 6. The light-emitting device; 101, the substrate strip; 7. The fixing hole.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
本发明的实施方式Embodiments of the invention
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动性前提下所获得的所有其他实施例,都属于本发明保护的范围。 The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without departing from the inventive scope are the scope of the present invention.
如图1-图3所示,本发明的一种灯芯板,包括:As shown in FIG. 1 to FIG. 3, a wick board of the present invention includes:
基板,包括:第一基板本体1和第二基板本体2;a substrate comprising: a first substrate body 1 and a second substrate body 2;
第一基板本体1和第二基板本体2连接在一起;The first substrate body 1 and the second substrate body 2 are connected together;
N个导通装置3,用于在第一基板本体1和第二基板本体2折叠后进行电流导通,分别设置在第一基板本体1和第二基板本体2连接处以及第二基板本体2上; N conducting devices 3 for conducting current after the first substrate body 1 and the second substrate body 2 are folded, respectively disposed at the junction of the first substrate body 1 and the second substrate body 2 and the second substrate body 2 on;
正极连接点4和负极连接点5,设置在第二基板本体2上;The positive electrode connection point 4 and the negative electrode connection point 5 are disposed on the second substrate body 2;
N个发光装置6,用于通电后发光,分别设置第一基板本体1和第二基板本体2上;N light-emitting devices 6 for emitting light after being energized, respectively disposed on the first substrate body 1 and the second substrate body 2;
N为大于1的正整数。N is a positive integer greater than one.
通过在将发光装置6设置在基板上,并通过对基板的弯折,使其弯折成筒状的灯芯,通过这样的设计,组装的过程中能够节省大量时间,进而提高工作效率;另外,在生产阶段仅需要将基板压制成型再将发光装置6和导通装置3设置在基板上即对灯芯板制作完成,与现有技术中需要制作很多部件相比,时间节省了很多,进而提高了工作效率。By arranging the light-emitting device 6 on the substrate and bending the substrate into a cylindrical wick by bending the substrate, the design can save a lot of time in the assembly process, thereby improving work efficiency; In the production stage, only the substrate needs to be press-molded, and then the light-emitting device 6 and the conductive device 3 are disposed on the substrate, that is, the wick board is completed, which saves a lot of time compared with the prior art, and thus improves the time. Work efficiency.
本发明中的一个实施例中,基板分为第一基板本体1和第二基板本体2,并将第一基板本体1和第二基板本体2连接在一起,在第一基板本体1和第二基板本体2的连接处设置有导通装置3,导通装置3同样设置在第二基板本体2上,导通装置3具体为N个,在本实施例中导通装置3具体在第二基板上设置的位置和个数根据第二基板本体2的弯折数而定,即在第二基板本体2的每一个弯折处均设置有导通装置3,通过导通装置3实现在第一基板本体1或第二基板本体2弯折后保证电流等的导通,另外通过导通装置3还在基板进行弯折时提高弯折处基板的连接力度,避免在基板弯折过程中折断,且通过设置导通装置3,不仅能够保护基板和导通电流,而且在制作的过程中导通装置3与基板的连接简单,提高生产速度,进而能够实现大批量生产,使得制作成本得到了降低;正极连接点4和负极连接点5设置在第二基板本体2两端,通过正极连接点4和负极连接点5与导线连接,通过导线与电源连接进而实现电源为灯芯板供电;In one embodiment of the present invention, the substrate is divided into a first substrate body 1 and a second substrate body 2, and the first substrate body 1 and the second substrate body 2 are connected together, in the first substrate body 1 and the second The connection between the substrate body 2 is provided with a conduction device 3, and the conduction device 3 is also disposed on the second substrate body 2. The conduction device 3 is specifically N. In the embodiment, the conduction device 3 is specifically on the second substrate. The position and the number of the upper substrate body 2 are determined according to the number of bends of the second substrate body 2, that is, the turn-on device 3 is provided at each of the bends of the second substrate body 2, and is realized by the conduction device 3 at the first position. After the substrate body 1 or the second substrate body 2 is bent, the conduction of current or the like is ensured, and when the substrate is bent by the conduction device 3, the connection strength of the substrate at the bending portion is increased to avoid breaking during the bending process of the substrate. Moreover, by providing the conduction device 3, not only the substrate and the conduction current can be protected, but also the connection between the conduction device 3 and the substrate is simple during the manufacturing process, the production speed is increased, and mass production can be realized, so that the manufacturing cost is reduced. ; positive connection 4 and the negative connection point 5 disposed at both ends of the second substrate main body 2, via the positive electrode and the negative connection point 4 point 5 and the wires, thus achieving the power supply is connected through a wire to the power supply wick plate;
发光装置6均匀等间距的设置在第一基板本体1和第二基板本体2上,在本实施例中优选的使用LED发光装置6;如图1或图2所示,在第一基板本体1优选为圆形,发光装置6等间距组成环形设置在第一基板本体1上,通过这样的设置,能够在使发光装置6在散发出的光更加均匀,设置在第一基板本体1上的发光装置6根据的具体个数为N个,即根据第一基板的实际使用大小而定,本实施例中优选的在第一基板本体1上设置15个发光装置6;另外,设置在第二基板本体2上的发光装置6根据使第二基板本体2弯折的弯折线而设置,本实施例中优选的将第二基板本体2等分成6份,即发光装置6分别设置在每个被等分的第二基板本体2上,即在一个被等分的第二基板本体2上设置有N 个发光装置6,这里同样是根据被等分的第二基板本体2实际尺寸而定,在本实施例中优选的将发光装置6等距设置成两列,而每列6个发光装置6。The light-emitting devices 6 are evenly spaced on the first substrate body 1 and the second substrate body 2, and in the present embodiment, the LED light-emitting device 6 is preferably used; as shown in FIG. 1 or FIG. 2, in the first substrate body 1 Preferably, the light-emitting device 6 is annularly disposed on the first substrate body 1 in such a manner that the light emitted from the light-emitting device 6 is more uniform and the light-emitting device 6 is disposed on the first substrate body 1 by such an arrangement. The number of the devices 6 is N, that is, according to the actual use size of the first substrate, in the embodiment, 15 light-emitting devices 6 are preferably disposed on the first substrate body 1; The light-emitting device 6 on the main body 2 is provided according to a bending line for bending the second substrate body 2. In the present embodiment, the second substrate body 2 is preferably divided into six parts, that is, the light-emitting devices 6 are respectively disposed at each of the equal parts. On the second substrate body 2, that is, on a divided second substrate body 2, N is disposed The illuminating means 6, here also depends on the actual size of the aliquoted second substrate body 2. In the present embodiment, it is preferred to arrange the illuminating means 6 equidistantly in two rows and six illuminating means 6 per column.
本发明的另一个实施例中,优选的,还包括:In another embodiment of the present invention, preferably, the method further includes:
散热缝,用于发光装置6散热,设置在第二基板本体2上,并将第二基板本体2分为N个基板条101。The heat dissipation slit is used for heat dissipation of the light-emitting device 6, is disposed on the second substrate body 2, and divides the second substrate body 2 into N substrate strips 101.
其中,在第二基板本体2上设置有散热缝,通过散热缝实现对发光装置6的散热,散热缝具体为N个,并将第二基板本体2分成N个基板条101,散热缝的具体个数具体的根据第二基板本体2的尺寸和实际的使用情况而定,本实施例中优选的设置5条散热缝,并根据散热缝将第二基板本体2分成6个基板条101,即以散热缝为轴线对第二基板本体2进行弯折,并在弯折后使发光装置6设置在外侧;最终是第二基板本体2的两端对接在一起,形成一个柱体。The heat dissipation slit is disposed on the second substrate body 2, and the heat dissipation is performed on the light-emitting device 6. The heat dissipation slits are specifically N, and the second substrate body 2 is divided into N substrate strips 101, and the heat dissipation slits are specifically The number is specifically determined according to the size of the second substrate body 2 and the actual use. In the embodiment, five heat dissipation slits are preferably disposed, and the second substrate body 2 is divided into six substrate strips 101 according to the heat dissipation slit, that is, The second substrate body 2 is bent with the heat dissipation slit as an axis, and the light-emitting device 6 is disposed outside after bending; finally, the two ends of the second substrate body 2 are butted together to form a cylinder.
本发明的再一个实施例中,优选的,还包括:固定孔7,用于与灯芯板底座连接,设置在第二基板本体2的一端。In still another embodiment of the present invention, preferably, the fixing hole 7 is further connected to the base of the wick board and disposed at one end of the second substrate body 2.
在本实施例中,在第二基板本体2的一端设置有固定孔7,而固定孔7具体设置在被等分的第二基板本体2的每一个上,当与外部的底座进行连接时,是通过激光等将底座进行软化,软化后的底座会进入到固定孔7中,进而在冷却后,底座的一部分会将每个固定孔7固定住,进而防止第二基板本体2与外部底座的分离,避免了在后期使用的过程中基板本体与外部底座的脱离。In this embodiment, a fixing hole 7 is disposed at one end of the second substrate body 2, and the fixing hole 7 is specifically disposed on each of the aliquoted second substrate bodies 2, when connected to the external base, The base is softened by a laser or the like, and the softened base enters the fixing hole 7, and after cooling, a part of the base will fix each fixing hole 7, thereby preventing the second substrate body 2 and the external base. Separation avoids the detachment of the substrate body from the external base during later use.
优选的,基板具体为铝基板。Preferably, the substrate is specifically an aluminum substrate.
优选的,第一基板本体1具体为圆形;Preferably, the first substrate body 1 is specifically circular;
发光装置6具体为等间距环形设置在第一基板上。The light-emitting devices 6 are specifically arranged on the first substrate at equal intervals.
优选的,发光装置6具体为LED发光装置6。Preferably, the illumination device 6 is specifically an LED illumination device 6.
本发明中还公开了一种制作灯芯方法,包括如下步骤:The invention also discloses a method for manufacturing a wick, comprising the following steps:
将第二基板本体2在轴向上进行等分;Dividing the second substrate body 2 in the axial direction;
根据等分线将第二基板本体2进行顺时针/逆时针方向弯折成柱体;The second substrate body 2 is bent into a cylinder in a clockwise/counterclockwise direction according to a bisector;
弯折后保证发光装置6置于弯折后的柱体外表面;After bending, the illuminating device 6 is ensured to be placed on the outer surface of the column after bending;
以第一基板本体1和第二基板本体2的连接处为弯折线,将第一基板本体1进行弯折。The first substrate body 1 is bent by taking a joint of the first substrate body 1 and the second substrate body 2 as a bending line.
如图3所示,在本发明中先将第二基板本体2在轴向上进行等分,本发明中优选的将第二基板本体2等分成6份,当然根据第二基板本体2的尺寸的不同也可以将第二基板本体2等分成7份、8份或更多;为节省篇幅本发明中对此不再赘述;将等分好的第二基板本体2以等分线为轴进行顺时针或逆时针进行弯折,使第二基板本体2成为柱体,且在弯折后使发光装置6设置在柱体的外表面,再根据第一基板本体1和第二基板本体2的连接处为弯折线将第一基板本体1进行弯折,弯折后使第一基板本体1处于第二基板本体2弯折后形成的柱体的上侧,以便在发光装置6进行发光时能够保证散发出的光可以向各面进行散出。As shown in FIG. 3, in the present invention, the second substrate body 2 is first halved in the axial direction. In the present invention, the second substrate body 2 is preferably equally divided into six parts, of course, according to the size of the second substrate body 2. The second substrate body 2 can be equally divided into 7 parts, 8 parts or more; in order to save space, the description will not be repeated in the present invention; the equally divided second substrate body 2 is bisector-oriented. Bending clockwise or counterclockwise, the second substrate body 2 is formed into a cylinder, and after the bending, the light-emitting device 6 is disposed on the outer surface of the cylinder, and then according to the first substrate body 1 and the second substrate body 2 The first substrate body 1 is bent at a joint by a bending line. After the bending, the first substrate body 1 is placed on the upper side of the cylinder formed by bending the second substrate body 2, so that when the light-emitting device 6 emits light, Ensure that the emitted light can be emitted to all sides.
优选的,第二基板本体2通过散热缝进行等分。Preferably, the second substrate body 2 is equally divided by a heat dissipation slit.
优选的,根据散热缝将第二基板本体2进行顺时针/逆时针方向弯折成柱体。Preferably, the second substrate body 2 is bent into a cylinder in a clockwise/counterclockwise direction according to the heat dissipation slit.
在本发明中,还可以根据散热缝将第二基板本体2进行等分,等分后根据散热缝将第二基板本体2进行顺时针或逆时针进行弯折,已达到在弯折形成主体后能够再不影响发光的前提下,通过散热缝可以对发光装置6等进行散热处理。In the present invention, the second substrate body 2 may be equally divided according to the heat dissipation slit, and the second substrate body 2 may be bent clockwise or counterclockwise according to the heat dissipation slit, and after the bending is formed, the body is formed. The light-emitting device 6 or the like can be subjected to heat dissipation processing through the heat dissipation slit without affecting the light emission.
以上仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalents, improvements, etc., which are within the spirit and scope of the present invention, should be included in the scope of the present invention. within.
工业实用性Industrial applicability
序列表自由内容Sequence table free content

Claims (9)

  1. 一种灯芯板,其特征在于,包括:  A wick board, comprising:
    基板,包括:第一基板本体(1)和第二基板本体(2);a substrate comprising: a first substrate body (1) and a second substrate body (2);
    所述第一基板本体(1)和所述第二基板本体(2)连接在一起;The first substrate body (1) and the second substrate body (2) are connected together;
    N个导通装置(3),用于在所述第一基板本体(1)和所述第二基板本体(2)折叠后进行电流导通,分别设置在所述第一基板本体(1)和所述第二基板本体(2)连接处以及所述第二基板本体(2)上;N conducting devices (3) for conducting current conduction after folding of the first substrate body (1) and the second substrate body (2), respectively disposed on the first substrate body (1) And the second substrate body (2) connection and the second substrate body (2);
    正极连接点(3)和负极连接点(5),设置在所述第二基板本体(2)上;a positive electrode connection point (3) and a negative electrode connection point (5) are disposed on the second substrate body (2);
    N个发光装置(6),用于通电后发光,分别设置所述第一基板本体(1)和所述第二基板本体(2)上;N illuminating devices (6) for illuminating after energization, respectively disposed on the first substrate body (1) and the second substrate body (2);
    N为大于1的正整数。N is a positive integer greater than one.
  2. 如权利要求1所述的灯芯板,其特征在于,还包括:The wick plate of claim 1 further comprising:
    散热缝,用于所述发光装置(6)散热,设置在所述第二基板本体(2)上,并将所述第二基板本体(2)分为N个基板条(101)。a heat dissipation slit for dissipating heat from the light emitting device (6), disposed on the second substrate body (2), and dividing the second substrate body (2) into N substrate strips (101).
  3. 如权利要求2所述的灯芯板,其特征在于,还包括:固定孔(7),用于与灯芯板底座连接,设置在所述第二基板本体(2)的一端。The wick plate according to claim 2, further comprising: a fixing hole (7) for connecting to the wick plate base and disposed at one end of the second substrate body (2).
  4. 如权利要求3所述的灯芯板,其特征在于,所述基板具体为铝基板。The wick plate according to claim 3, wherein the substrate is specifically an aluminum substrate.
  5. 如权利要求4所述的灯芯板,其特征在于,所述第一基板本体(1)具体为圆形;The wick plate according to claim 4, wherein the first substrate body (1) is specifically circular;
    所述发光装置(6)具体为等间距环形设置在所述第一基板上。The light-emitting devices (6) are specifically arranged on the first substrate at equal intervals.
  6. 如权利要求5所述的灯芯板,其特征在于,所述发光装置(6)具体为LED发光装置(6)。A wick plate according to claim 5, characterized in that the illuminating device (6) is in particular an LED illuminating device (6).
  7. 一种根据权利要求2-6任一项所述的灯芯板制作灯芯方法,其特征在于,包括如下步骤:A method for manufacturing a wick according to any one of claims 2-6, comprising the steps of:
    将所述第二基板本体(2)在轴向上进行等分;Dividing the second substrate body (2) in the axial direction;
    根据等分线将所述第二基板本体(2)进行顺时针/逆时针方向弯折成柱体;弯折后保证所述发光装置(6)置于弯折后的柱体外表面;The second substrate body (2) is bent into a cylinder in a clockwise/counterclockwise direction according to a bisector; after the bending, the light-emitting device (6) is placed on the outer surface of the bent column;
    以所述第一基板本体(1)和所述第二基板本体(2)的连接处为弯折线,将所述第一基板本体(1)进行弯折。The first substrate body (1) is bent at a joint of the first substrate body (1) and the second substrate body (2) as a bending line.
  8. 如权利要求7所述方法,其特征在于,所述第二基板本体(2)通过所述散热缝进行等分。The method of claim 7 wherein said second substrate body (2) is equally divided by said heat dissipation slit.
  9. 如权利要求7所述方法,其特征在于,根据所述散热缝将所述第二基板本体(2)进行顺时针/逆时针方向弯折成柱体。The method according to claim 7, wherein said second substrate body (2) is bent into a cylinder in a clockwise/counterclockwise direction according to said heat dissipation slit.
PCT/CN2014/073019 2013-03-08 2014-03-07 Lamp filament board and lamp filament manufacturing method WO2014135109A1 (en)

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