WO2014133239A1

WO2014133239A1 - Embossing mold and embossing mold device including same

Info

Publication number: WO2014133239A1
Application number: PCT/KR2013/009340
Authority: WO
Inventors: 류기택; 박형근
Original assignee: (주)파인테크
Priority date: 2013-02-26
Filing date: 2013-10-18
Publication date: 2014-09-04

Abstract

An embossing mold according to the present invention comprises: a lower plate having a blade and an air passage hole formed therein, the blade having a predetermined pattern to process an object to be processed, the air passage hole allowing air to flow therethrough to suck and discharge chips cut by the blade; an upper plate located above the lower plate to form an air channel together with the lower plate, the air channel serving as a passage through which air flows to or from the air passage hole; and an ejector-pin that moves upward to open the air passage hole according to an intake of air into the air channel from the air passage hole and moves downward to push and discharge chips to the outside and simultaneously close the air passage hole according to discharge of air out of the air channel to the air passage hole.

Description

Embossed mold and embossed mold device including the same

The present invention relates to an embossed mold and an embossed mold apparatus including the same, and more particularly, an embossed mold capable of directly adsorbing and discharging a chip generated by cutting a workpiece to minimize the occurrence of defects. It relates to an embossed mold apparatus.

The embossed mold refers to a mold using a blade formed by embossing to more precisely and stably cut a functional film and a double-sided tape of a precise and complicated shape, which were previously cut into a die and a die.

Such an embossed mold is typically produced by etching a thin iron plate from 0.6mm to 3mm according to the shape and then CNC precision machining, and Patent No. 10-607906 has been disclosed regarding the embossed mold.

Embossed molds are easy to mount, easy to use, can be applied to all presses, and are highly suitable for machining precision products.They do not have adhesive components attached to the punch and can remove chips at the same time. There are advantages.

Embossed molds have been applied to various fields such as flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials, liquid crystal displays, and protective films due to the aforementioned advantages.

The embossed mold processes the workpiece into blades with a specific pattern, in which chips are cut by the blades, which remain in the workpiece or are attached to the blade.

In the related art, the chip cut by the blade is manually removed by the operator, and this operation takes a considerable amount of time, and in the case of a small chip, the chip is not easily seen by the operator. Occurred.

In addition, when chips remain on the embossed mold, cutting defects on the workpieces followed by the remaining chips are generated, and these cutting defects result in problems leading to product defects.

[Preceding technical literature]

[Patent Documents]

(Patent Document 0001) Domestic Registered Patent No. 10-0607906 (July 26, 2006 registration)

(Patent Document 0002) Domestic registration proposal No. 20-0361855 (registered September 02, 2004)

The present invention is to cut the workpiece with the blade formed in the embossed mold, and to automatically absorb and discharge the chips cut by the blade, it is possible to streamline the process that the operator must remove the cut chips from the workpiece, In addition, it is to provide an embossed mold apparatus that can improve the yield by preventing product defects due to chips remaining in the workpiece due to the operator's mistakes.

Various problems to be solved by the present invention are not limited to the above-mentioned problems, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

The embossed mold according to the present invention comprises: a lower plate having a blade formed in a predetermined pattern for processing a workpiece, and an air access hole through which air enters and exits for adsorption and discharge of chips cut by the blade; An upper plate positioned on the lower plate to form an air passage, which is a passage of air entering and exiting the air access hole together with the lower plate; And opening the air access hole while moving upward as air is sucked into the air passage from the air access hole, and pushing the chip downward while moving air downward as air is discharged from the air passage to the air access hole. At the same time it comprises an ejector-pin for blocking the air access hole.

The lower plate, the first plate; And a second plate formed under the first plate, wherein the first plate has an air access hole and an air passage formed therein, and the second plate has a blade and an opening formed to protrude outward. have.

The air access hole may be drilled to communicate with the air passage and the opening hole.

The air access hole is to prevent the ejector-pin is separated from the outside of the lower plate, the stopper is formed so that the ejector-pin is fixed and seated downward as the air is discharged from the air flow path to the air access hole to be formed Can be.

The stopper may be formed such that its inner circumferential surface is tapered with a light beam narrowing structure.

The ejector-pin includes a body and a discharge pin, the diameter of the body may be formed larger than the diameter of the discharge pin.

Between the body and the discharge pin may be provided with a tapered shape departure prevention jaw is reduced in diameter toward the discharge pin in the body.

The tapered angle of the release prevention jaw may be smaller than the tapered angle of the stopper.

The upper surface of the ejector-pin may be formed with a groove-shaped pressing groove inwardly to increase the resistance of the air.

The air access hole may be formed in one or two or more per chip forming portion consisting of a closed curve of the blade forming one chip.

The discharge pin may be configured to be exposed below the blade when air is discharged from the air flow path to the air access hole.

In addition, the embossed mold apparatus according to the present invention, the lower module for holding the workpiece; An embossed mold for cutting and processing the workpiece; An upper module for fixing the embossed mold; And a pump for supplying air to the embossed mold or sucking air from the embossed mold for adsorption and discharge of the chip cut by the embossed mold, wherein the embossed mold is configured to process the workpiece. A lower plate having a blade formed in a predetermined pattern and an air access hole through which air enters and exits by driving of the pump; An upper plate positioned on the lower plate to form an air passage, which is a passage of air entering and exiting the air access hole together with the lower plate; And opening the air access hole while moving upward as air is sucked into the air passage from the air access hole, and pushing the chip downward while moving air downward as air is discharged from the air passage to the air access hole. At the same time it comprises an ejector-pin for blocking the air access hole.

The air access hole is to prevent the ejector-pin is separated from the outside of the lower plate, and as the air is discharged from the air flow path to the air access hole is formed a stopper to move the seat down fixedly seated Can be.

The embossed mold apparatus may further include an injector for injecting high-pressure air into the lower plate to remove the chips remaining on the lower plate after the embossed mold discharges the chip.

The embossed mold apparatus according to the present invention can streamline the process in which the operator must remove the chips cut from the workpiece, and also improve the yield by preventing product defects caused by chips remaining in the workpiece due to the operator's mistake. You can.

In addition, the embossed mold apparatus according to the present invention can improve the workability of the cutting operation by the embossed mold by preventing the cutting of the workpiece due to the chip remaining.

It will be fully understood that various embodiments of the inventive concept may provide various effects not specifically mentioned.

1 is a view showing an example of the workpiece of the form in which the base plate and the film layer are coalesced.

2 and 3 is a view schematically showing an embossed mold apparatus according to an embodiment of the present invention, Figure 2 shows the upper module and the lower module is placed in place for cutting the workpiece, Figure Figure 3 shows the horizontal movement of the upper module for chip evacuation after cutting on the workpiece.

4 and 5 are views showing the upper and lower surfaces of the lower plate 100 of the embossed mold 10 according to an embodiment of the present invention, respectively.

6 is a cross-sectional view showing a cross section taken along the line AA ′ of the embossed mold 10 of FIG. 4.

FIG. 7 is a cross-sectional view illustrating a cross section taken along line BB ′ of the embossed mold 10 of FIG. 4.

8 to 12 is a view showing a driving process of the embossed mold according to an embodiment of the present invention.

13 is a view schematically showing an embossed mold apparatus according to another embodiment of the present invention.

14 is a diagram illustrating a state in which high pressure air is injected by the injector in the embossed mold apparatus according to another embodiment of the present invention.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the present invention to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.

The terms top, bottom, top, bottom, or top, bottom, etc. are used to distinguish relative positions in the component. For example, in the case of naming the upper part on the drawing as the upper part and the lower part on the drawing for convenience, the upper part may be called the lower part and the lower part may be named the upper part without departing from the scope of the present invention. .

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the embossed mold and embossed mold apparatus including the same according to an embodiment of the present invention.

The embossed mold apparatus of the present invention is a device for cutting the workpiece 50 by using the blade 132 of the embossed mold 10, the workpiece 50 includes a film layer 54 to be processed. For example, the workpiece 50 may include a sticker, a double-sided tape, a flexible printed circuit board, a packing material, an insulator, a precision processing material, a liquid crystal display, and a protective film.

The workpiece 50 may have a form in which the base plate 52 and the film layer 54 are coalesced or formed only of the film layer 54. FIG. 1 is a view showing an example of the workpiece 50 in which the base plate 52 and the film layer 54 are combined, (a) shows before processing, and (b) shows after processing.

In addition, in the present invention, the chip 60 means a small piece (small piece) of the workpiece 50 cut and cut by the embossed mold 10.

Referring to Figures 2 to 7 will be described embossed mold apparatus according to an embodiment of the present invention.

2 and 3 is a schematic view showing the embossed mold apparatus according to an embodiment of the present invention, Figure 2 is a top module 500 and the lower module 400 is fixed for cutting the workpiece (50) FIG. 3 shows a state in which the upper module is horizontally moved for chip discharge after cutting of the workpiece 50. 4 and 5 are views showing the upper and lower surfaces of the lower plate 100 of the embossed mold 10 according to an embodiment of the present invention, respectively. 6 is a cross-sectional view showing a cross section taken along the line AA ′ of the embossed mold 10 of FIG. 4, and FIG. 7 is a cross section taken along a line BB ′ of the embossed mold 10 of FIG. 4. It is a cross-sectional view showing.

Embossed mold apparatus according to an embodiment of the present invention includes a lower module 400, the upper module 500, the embossed mold and the pump 700.

The lower module 400 is provided to fix and support the workpiece 50. The lower module 400 may be provided with a vacuum chuck, a magnetic chuck or various other fixing means to fix the workpiece 50. In addition, a moving means may be provided to unload the finished workpiece 50 and load the new workpiece 50.

The upper module 500 is provided to fix and support the embossed mold 10. The upper module 500 is provided with a moving means so that the embossed mold 10 is discharged from the correct position for the work after the embossed mold 10 finishes processing the workpiece 50. can do.

The lower module 400 or the upper module 500 may be provided with lifting means for vertically moving the embossed mold 10 to press and cut the workpiece 50.

The pump 700 is provided to supply air to the embossed mold 10 or to suck air from the embossed mold 10 for adsorption and discharge of the chip 60 cut by the embossed mold 10. do. The pump 700 provides the suction force to suck the chip 60 cut from the workpiece 50 to the embossed mold 10 by air pumping, while at the position where the workpiece 50 is to be discharged. When reached, the desorption force for desorbing the adsorbed chip 60 is provided to the embossed mold 10 by air pumping.

The pump 700 may be configured at a position adjacent to the upper module 500 or the upper module 500 to provide the upper module 500 with the adsorption force and the desorption force by air pumping, but is not limited thereto. It is not.

The pump 700 may be configured to provide both adsorption and desorption power in one device as in the present embodiment, but may be configured separately from the pump providing the adsorption force and the pump providing the desorption force. In addition, one or two or more pumps 700 may be provided in consideration of the size of the embossed mold 10.

The embossed mold 10 is provided to cut the workpiece 50 in a predetermined pattern. The embossed mold 10 includes a lower plate 100, an upper plate 300, and an ejector pin 200.

The lower plate 100 is in direct contact with the workpiece 50 to cut the workpiece 50 to have a predetermined pattern. The lower plate 100 includes a first plate 110 and a second plate 130. In the present embodiment, the lower plate 100 is configured to include the first plate 110 and the second plate 130, but may also be integrally formed.

The first plate 110 is provided to provide a movement passage of air for inflow or discharge of air provided by the pump 700, the air flow passage 114, the air access hole 112 and the stopper ( 116).

The air passage 114 is a passage through which air supplied from the pump 700 or sucked by the pump 700 flows, and is formed in a groove shape that is recessed to a predetermined depth inside the first plate 110.

Air is introduced or discharged through the air outlet pipe 750 connected to the pump 700, and a distribution hole 760 is formed in the first plate 110 for delivery to the air flow path 114.

The air access hole 112 is a passage formed to transfer the adsorption and desorption force transmitted from the air flow passage 114 to the chip, and may be formed by being drilled at regular intervals on the air flow passage 114.

The air access hole 112 communicates with the opening hole 134 of the second plate 110 to be described below, and serves as a passage connecting the air flow passage 114 and the opening hole 134.

One or two air access holes 112 may be formed in each chip forming unit 136. Here, the chip forming unit 136 is divided into a closed curve of the blade 132 and refers to a region forming one chip 60. The number of air access holes 112 formed in the chip forming unit 136 may be appropriately selected in consideration of the size of the chip forming unit 136.

The stopper 116, in order to prevent the ejector-pin 200, which will be described later, from being separated out of the lower plate 100, and to allow the ejector-pin 200 to be fixedly seated upon discharge of air, It is formed in the air access hole 112.

The stopper 116 has an inner circumferential surface that is tapered with a light beam narrowing structure, thereby preventing the ejector pin 200 from being separated in the lower direction of the first plate 110.

The second plate 130 is positioned below the first plate 110, and a blade 132 and an opening hole 134 are formed.

The blade 132 is a blade for cutting the workpiece 50 is formed to protrude to the outside of the second plate 130 to the outside, the corresponding pattern to process the workpiece 50 in the desired pattern It is configured to have.

The opening hole 134 is formed in the second plate 130 to communicate with the air access hole 112 so that the inflow and outflow of air from the air access hole 112 is transmitted.

The upper plate 300 is located on the lower plate 100 to serve to seal the air flow passage 114 formed in the lower plate 100. The upper plate 300 may be screwed with the first plate 110 to be firmly fastened with the first plate 110.

In this embodiment, the air passage 114 is formed in the lower plate 100, but the air passage 114 may be formed in the upper plate 100, and the upper plate 100 and the lower plate ( 100 may be formed at the same time.

The ejector-pin 200 moves in the air access hole 112 according to the inflow and outflow of air, opens and closes the inflow and outflow of air through the air access hole 112, and discharges the cut chip 60. The ejector-pin 200 includes a body 216, a discharge pin 218, a release prevention jaw 212 and a pressing groove 214.

The body 216 is moved up and down in the air access hole 112 while being guided by the wall surface of the air access hole 112 along the inflow and outflow of air.

The discharge pin 218 is formed to protrude in the lower portion of the body 216, and has a smaller diameter than the body 216 to pass through the opening hole 134. The discharge pin 218 is formed to a length that is exposed to the end or the bottom of the blade 132 so that the air moves downward as the air pressurizes the body 216 to completely discharge the chip 60 when the air is discharged It is preferable.

The release prevention jaw 212 is formed between the body 216 and the discharge pin 218 so that the ejector-pin 200 is caught on the stopper 116 when the air is discharged. The release prevention jaw 212 is tapered to decrease in diameter toward the discharge pin 218 from the body 216, in particular, the tapered angle is preferably formed smaller than the tapered angle of the stopper 116. Here, the tapered angle refers to the degree to which the tapered surface is inclined with respect to the vertical axis. By the above configuration, as the air presses the ejector pin 200 upward, the airtight force between the separation prevention jaw 212 and the stopper 116 may be further strengthened.

The ejector-pin 200 is formed with a pressurized groove 214 having a recessed groove shape inwardly in order to increase resistance of the air flowing through the air flow passage 114 on the upper surface.

Hereinafter, a method of driving an embossed mold according to an embodiment of the present invention will be described in more detail with reference to FIGS. 8 to 12.

First, the lower module 400 loaded with the workpiece 50 and the upper module 500 having the embossed mold 10 fixed thereto face each other, and the upper module 500 or the lower module 400 is vertically positioned. The blade 132 of the embossed mold 10 moves to press the workpiece 50 to cut the film layer 54 (FIG. 8).

At this time, the eject pin 218 of the eject-pin 200 is pushed by the workpiece 50 to move upward, and thus the stopper 116 which is in close contact with the stopper 116 moves upward, thereby stopping the stopper 116. Separated from. In addition, while the air is sucked by the pump 700, the chip 60 is attached to the chip forming portion 136 formed by the blade 132.

Next, according to the upward movement of the upper module 500 or the downward movement of the lower module 400, the blade 132 and the workpiece 50 are separated while the chip 60 is coupled to the chip forming unit 136. (Fig. 9).

Next, the upper module 500 moves out of a fixed position for processing the workpiece 50 to a position for discharging the chip 60.

Next, the air is discharged by the pump 700, the air passage 114, the air access hole 112, the opening hole 134, and then the pressure of the air are transferred to the chip 60, the pump 700. When the air discharged by the pressure is applied to the chip 60, the chip 60 is discharged from the chip forming portion 136 of the blade 132 (Fig. 10).

When the chip 60 is discharged by air discharge, the chip 60 may be discharged from the chip forming unit at the same time, but some of the chips 60 may be discharged first and then the remaining chips 60 may be discharged later (FIG. 11). And FIG. 12). In this case, in the region where the chip 60 is discharged first, the ejector pin 200 moves downward to block the air access hole 112 so that the pressure of the air discharged from the pump 700 discharges the chip 60. In the area where the chip 60 is not discharged, a greater air pressure is applied to the area where the chip 60 is not discharged, so that the chip 60 is discharged more easily. If the ejector-pin is not used, when some chips 60 are ejected first, all the air leaks into the air access hole 112 and the opening hole 134 in the area, and the pressure of the air to the remaining area. This takes less and makes the chip 60 more difficult to eject.

When the chip 60 is finished discharging, the upper module 500 moves to the right position for processing the workpiece 50 and repeats the same process as described above.

When the upper module 500 for discharging the chip 60 is moved, the work 50 is completed and the new work 50 is loaded into the lower module 400. 400 may move from the home position to the position for replacing the workpiece 50 and then return to the home position.

13 is a view schematically showing an embossed mold apparatus according to another embodiment of the present invention, Figure 14 is a state in which the high pressure air is injected by the injection device 600 in the embossed mold apparatus according to another embodiment of the present invention Is a diagram illustrating.

13 and 14, the embossed mold apparatus according to another embodiment of the present invention further includes an injection apparatus 600. The injection device 600 is configured to remove the chip 60 remaining without being separated from the embossed mold 10 in the chip 60 discharge process.

When the chip 60 remains in the embossed mold 10, the chip 60 is coupled to another workpiece 50 again in a subsequent process, thereby causing defects. Therefore, the chip 60 may be removed from the embossed mold 10. It must be removed completely. Embossed mold apparatus according to the present invention by receiving the pressure of the air to the ejector-pin 200 to remove the chip 60, it is possible to minimize the residual chip 60. However, there is a possibility that the remaining chip 60 may occur, such as the chip 60 is attached to an area outside the chip forming portion 136 of the second plate 130 by the frictional force, or is attached to the end of the blade 132. Therefore, the chip 60 may be more completely removed by using the injection apparatus 600.

The injector 600 is configured to inject high pressure air toward the embossed mold 10, and the spraying direction of the high pressure air is directed toward the bottom of the embossed mold 10 for efficient removal of the chip 60. Can be sprayed at an angle.

As described above, the embossed mold 10 of the present invention cuts the workpiece 50 to have a predetermined pattern, and simultaneously removes the chip 60 cut by itself on the workpiece 50. Therefore, it is possible to maximize the productivity by improving the process that the operator had to remove the chip 60 by hand one by one, it is possible to minimize the defects that had to occur due to the nature of the manual work.

As mentioned above, although an exemplary embodiment of the present invention has been described with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may realize the present invention in another specific form without changing its technical spirit or essential features. It will be appreciated that it may be practiced. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

A lower plate having a blade formed in a predetermined pattern for processing the workpiece, and an air access hole through which air enters and exits for adsorption and discharge of the chip cut by the blade;

An upper plate positioned on the lower plate to form an air passage, which is a passage of air entering and exiting the air access hole together with the lower plate; And

As the air is sucked into the air passage from the air access hole, the air access hole is opened while the air access hole is opened. As the air is discharged from the air passage to the air access hole, the chip is pushed out while moving downward, and discharged to the outside. Embossed mold comprising an ejector-pin for blocking the air access hole.
The method of claim 1,

The lower plate,

First plate; And

Including a second plate formed below the first plate,

The first plate is formed with the air access hole and the air flow path,

The second plate is embossed mold, characterized in that the lower blade formed to protrude outwards and the opening is formed.
The method of claim 2,

The air access hole is embossed, characterized in that the perforated to communicate with the air passage and the opening hole.
The method of claim 3, wherein

The air access hole is a stopper for preventing the ejector-pin is separated from the outside of the lower plate, the ejector-pin is moved downwardly fixed as the air is discharged from the air flow path to the air access hole is formed Embossed mold characterized by.
The method of claim 4, wherein

The stopper is embossed mold, characterized in that the inner circumferential surface is formed to be tapered in the upper and lower narrow structure.
The method of claim 1,

The ejector-pin includes a body and a discharge pin,

Embossed mold, characterized in that the diameter of the body is formed larger than the diameter of the discharge pin.
The method of claim 6,

Embossed mold, characterized in that between the body and the discharge pin is provided with a tapered shape departure prevention jaw is reduced in diameter toward the discharge pin in the body.
The method of claim 7, wherein

The tapered angle of the release prevention jaw is embossed mold, characterized in that formed smaller than the tapered angle of the stopper.
The method of claim 7, wherein

Embossed mold, characterized in that the upper surface of the ejector-pin is formed with a groove-shaped pressing groove inwardly to increase the resistance of the air.
The method of claim 1,

The air hole is embossed mold, characterized in that formed one or two or more per chip forming portion consisting of a closed curve of the blade forming one chip.
The method of claim 7, wherein

The discharge pin is embossed mold, characterized in that configured to be exposed under the blade when the air is discharged from the air passage to the air access hole.
A lower module which fixes and supports the workpiece;

An embossed mold for cutting and processing the workpiece;

An upper module for fixing the embossed mold; And

In order to adsorb and discharge chips cut by the embossing mold, the pump comprises air to the embossed mold, or a pump for sucking air from the embossed mold,

The embossed mold,

A lower plate having a blade formed in a predetermined pattern for processing the workpiece and an air access hole through which air enters and exits by driving of the pump;

An upper plate positioned on the lower plate to form an air passage, which is a passage of air entering and exiting the air access hole together with the lower plate; And

As the air is sucked into the air passage from the air access hole, the air access hole is opened while the air access hole is opened. As the air is discharged from the air passage to the air access hole, the chip is pushed out while moving downward, and discharged to the outside. Embossed mold apparatus comprising an ejector-pin for blocking the air access hole.
The method of claim 12,

The lower plate,

First plate; And

Including a second plate formed below the first plate,

The first plate is formed with the air access hole and the air flow path,

The second plate is embossed mold apparatus, characterized in that the lower blade formed to protrude outwards and the opening is formed.
The method of claim 13,

The air access hole is a stopper that prevents the ejector-pin is separated from the outside of the lower plate, the ejector-pin is moved downwardly fixed as the air is discharged from the air flow path to the air access hole is formed Embossed mold device characterized in that.
The method of claim 12,

The embossed mold apparatus further comprises an injector for injecting a high pressure air to the lower plate to remove the chips remaining on the lower plate after the embossed mold discharges the chip.