TW201703978A - Thermoforming apparatus and thermoforming method - Google Patents

Thermoforming apparatus and thermoforming method Download PDF

Info

Publication number
TW201703978A
TW201703978A TW105112295A TW105112295A TW201703978A TW 201703978 A TW201703978 A TW 201703978A TW 105112295 A TW105112295 A TW 105112295A TW 105112295 A TW105112295 A TW 105112295A TW 201703978 A TW201703978 A TW 201703978A
Authority
TW
Taiwan
Prior art keywords
frame
sheet
substrate
holding portion
space
Prior art date
Application number
TW105112295A
Other languages
Chinese (zh)
Other versions
TWI709476B (en
Inventor
寺本一典
Original Assignee
淺野研究所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 淺野研究所股份有限公司 filed Critical 淺野研究所股份有限公司
Publication of TW201703978A publication Critical patent/TW201703978A/en
Application granted granted Critical
Publication of TWI709476B publication Critical patent/TWI709476B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/12Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor of articles having inserts or reinforcements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26Component parts, details or accessories; Auxiliary operations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

A thermoforming apparatus mold-shaping a sheet with respect to a substrate or bonding the sheet to the substrate, the apparatus includes a lower frame having a frame circumferential wall portion and a bottom frame portion in which a vacuum vent is formed, the lower frame forming a space for accommodating the substrate; a heating plate having a heating surface and being configured to bring the heating surface into close contact with an upper edge portion of the frame circumferential wall portion; a base having a substrate holding portion which is capable of holding the substrate; a closed frame being provided to protrude from a base mounting surface of the frame bottom portion and surrounding an entire periphery of the substrate holding portion in a plan view; a sheet grip portion gripping the sheet over an outer peripheral edge of the sheet without a gap, the sheet grip portion being provided in the lower frame and being vertically movable between an elevated position in which the sheet is heated by the heating plate and a lowered position in which the sheet grip portion comes in close contact with the closed frame, wherein a sealed space which is surrounded by the sheet and the closed frame is formed when the sheet grip portion comes in close contact with an upper end of the closed frame, and the vacuum vent communicates with a space in the lower frame and at least penetrates the bottom frame portion in the closed frame to open into an upper surface inside the closed frame, the vacuum vent being configured to suction through the vacuum vent in a state in which the sealed space is formed.

Description

熱成形裝置及熱成形方法 Thermoforming device and thermoforming method 發明領域 Field of invention

本發明是有關於一種熱成形裝置及熱成形方法。 The present invention relates to a thermoforming apparatus and a thermoforming method.

發明背景 Background of the invention

一般,作為將表皮片材(以下稱為片材)接著於成形基材(以下稱為基材)的外表面的裝置,已知有於上下腔室內進行輻射加熱的真空壓製積層成形裝置、及進行熱板加熱的熱成形裝置等。 In general, as a device for attaching a skin sheet (hereinafter referred to as a sheet) to the outer surface of a molded substrate (hereinafter referred to as a substrate), a vacuum press laminate forming apparatus that performs radiant heating in the upper and lower chambers and A hot forming device that performs hot plate heating, and the like.

例如,日本國專利第3937231號公報(以下稱為專利文獻1)已揭示了一種具備可減壓的室箱的被覆裝置。並構成為對該室箱內供給芯材(基材)並減壓,且朝向芯材使已加熱、軟化的表皮材(片材)下降變位,將室箱內加壓而使表皮材按壓並被覆於下方位置的芯材。在室箱內加壓時,由於將已下降變位了的表皮材對位在下方位置的芯材按壓並被覆,所以芯材在下方位置受到壓力。因此,不需要比以往的成形裝置或被覆裝置大的耐壓強度。 For example, Japanese Patent No. 3,973,231 (hereinafter referred to as Patent Document 1) discloses a coating device including a chamber box capable of reducing pressure. The core material (substrate) is supplied to the chamber and decompressed, and the heated and softened skin material (sheet) is displaced toward the core material, and the chamber is pressurized to press the surface material. And covered with the core material in the lower position. When the inside of the chamber is pressurized, the core material that has been lowered and displaced is pressed against the core material at the lower position, and the core material is pressed at the lower position. Therefore, there is no need for a large compressive strength than the conventional molding apparatus or coating apparatus.

然而,在專利文獻1之被覆裝置中,使室箱內成 為真空,且在將表皮材被覆於芯材後僅進行加壓。因此,而有著捲入部分之芯材和表皮材的密著性降低之虞。 However, in the covering device of Patent Document 1, the inside of the chamber is made It is a vacuum and only pressurizes after the surface material is coated on the core material. Therefore, the adhesion between the core material and the skin material having the entangled portion is lowered.

發明概要 Summary of invention

本發明是鑒於上述情事而完成者,提供一種提高捲入部分之基材和片材之密著性的熱成形裝置及熱成形方法。 The present invention has been made in view of the above circumstances, and provides a thermoforming apparatus and a thermoforming method for improving the adhesion between a substrate and a sheet of a wound portion.

本發明之第一態樣的熱成形裝置,是對基材將片材進行模具賦形,或將前述片材接著於前述基材的熱成形裝置,包含:下框,具有框周壁部及形成有真空通氣孔之框底部,形成收容前述基材之空間;熱板,具有加熱面,構成為對前述框周壁部之上緣部密接前述加熱面;基台,具有可保持前述基材之基材保持部;密閉框,從前述框底部之基台設置面突出而設置,且於平面視是包圍前述基材保持部的全周;及片材固持部,可在藉由前述熱板加熱前述片材之上升位置、和密接於前述密閉框之上端的下降位置之間上下移動地,設於前述下框內,橫跨全周無間隙地固持前述片材之外周端,前述片材固持部在密接於前述密閉框之上端時,形成以前述片材及前述密閉框所圍的密閉空間,前述真空通氣孔是構成為連通於前述下框內之空間,且在前述密閉框之內側至少貫通前述框底部並朝密閉框內上表面開口,在形成了前述密閉空間的狀態下通過前述真空通氣孔進行吸引。 A thermoforming apparatus according to a first aspect of the present invention is a thermoforming apparatus for forming a sheet into a substrate or attaching the sheet to the substrate, comprising: a lower frame having a frame wall portion and forming a bottom portion of the frame having a vacuum vent hole for forming a space for accommodating the substrate; the hot plate having a heating surface configured to closely contact the heating surface of the upper edge portion of the frame peripheral wall portion; and the base having a base capable of holding the substrate a material holding portion; the sealing frame is provided to protrude from the base installation surface at the bottom of the frame, and is surrounded by the entire circumference of the substrate holding portion in plan view; and the sheet holding portion can be heated by the hot plate The rising position of the sheet and the falling position in close contact with the upper end of the sealing frame are vertically moved, and are provided in the lower frame, and the outer peripheral end of the sheet is held without a gap across the entire circumference, and the sheet holding portion is held. When it is in close contact with the upper end of the sealing frame, a sealed space surrounded by the sheet and the sealing frame is formed, and the vacuum vent is configured to communicate with a space in the lower frame, and is inside the sealing frame to Through the housing toward the bottom surface of the opening and closed on the frame, the vacuum suction through the vent hole is formed in a state where the closed space.

依據上述第一態樣之熱成形裝置,利用從真空通 氣孔吸引,且在氣密的空間內,使片材固持部從上升位置朝基材下降,而使片材接著於基材之表面。片材固持部到達下降位置時,形成以基台之側面、密閉框內上表面、密閉框之內側的側面、及片材所圍的密閉空間。通過真空通氣孔對密閉空間內進行吸引時,更提高密閉空間內的真空度。因此,片材從基材的下端通過基材和基台之基材保持部的邊界,而吸附於密閉框內上表面及朝密閉框之內側的側面連續並擴大的吸附面。藉由該吸附,不會使空氣或不純物侵入到基材和片材之間,片材到前述邊界及基材之底面(背面)側為止密著於基材。因此,在預定的位置到片材切離為止,或是基材從基台脫出而成為成形品為止,不會有捲入部分之表皮材和芯材之密著性降低之虞。藉此,防止氣泡或不純物朝基材和片材之間侵入,且使氣泡或不純物充分地被除去。 According to the first aspect of the thermoforming apparatus, the vacuum is used The pores are attracted, and in the airtight space, the sheet holding portion is lowered from the raised position toward the substrate, and the sheet is attached to the surface of the substrate. When the sheet holding portion reaches the lowered position, a side surface of the base, an upper surface inside the sealing frame, a side surface on the inner side of the sealing frame, and a sealed space surrounded by the sheet are formed. When the inside of the sealed space is sucked by the vacuum vent hole, the degree of vacuum in the sealed space is further increased. Therefore, the sheet is adhered to the upper surface of the sealing frame from the lower end of the base material and the substrate holding portion of the base, and is adsorbed on the upper surface of the sealing frame and the suction surface which is continuous and enlarged toward the inner side of the sealing frame. By this adsorption, air or impurities are not intruded between the substrate and the sheet, and the sheet adheres to the substrate to the boundary and the bottom surface (back surface) side of the substrate. Therefore, there is no possibility that the adhesion between the surface material and the core material of the entrained portion is lowered until the sheet is peeled off from the predetermined position or the substrate is released from the base. Thereby, air bubbles or impurities are prevented from intruding between the substrate and the sheet, and the bubbles or impurities are sufficiently removed.

上述第一態樣中,也可以是在前述密閉框之上端設有密封構件。 In the first aspect described above, a sealing member may be provided at an upper end of the sealing frame.

依據上述第一態樣之熱成形裝置,利用設有密封構件,使密閉框具有對移動到下降位置之片材固持部的緩衝機能,且片材固持部和密閉框透過片材構件密著,提高密閉空間之氣密性。 According to the thermoforming apparatus of the first aspect described above, the sealing member is provided with the sealing frame having the cushioning function for the sheet holding portion moved to the lowered position, and the sheet holding portion and the sealing frame are adhered to each other through the sheet member. Improve the air tightness of the confined space.

上述第一態樣中,也可以是前述密閉框內上表面形成於前述基材保持部和前述密閉框之間,且設於比前述基材保持部之外周上緣部及前述密閉框之上端還低的位置。 In the first aspect, the upper surface of the sealing frame may be formed between the substrate holding portion and the sealing frame, and may be provided on an outer peripheral edge portion of the outer periphery of the substrate holding portion and an upper end of the sealing frame. Still low position.

依據上述第一態樣之熱成形裝置,通過真空通氣孔對密閉空間內進行了吸引之際,片材被覆基材的表面,且保持朝基材保持部的外周上緣部下降的方向性,並且從基材保持部之外周上緣部連續於密閉框內上表面並抵接。藉此,片材接觸於基材之基材保持部的外周上緣部的位置,亦即到基材的底面(背面)惻外緣為止無間隙地被捲入。其結果,捲入部分之片材和基材的密著性變得更高。 According to the thermoforming apparatus of the first aspect, when the vacuum vent is sucked into the sealed space, the sheet covers the surface of the substrate and maintains the directivity toward the upper peripheral edge of the substrate holding portion. Further, the upper peripheral edge portion of the outer periphery of the substrate holding portion is continuous with the upper surface of the sealing frame and abuts. Thereby, the sheet is in contact with the position of the outer peripheral upper edge portion of the base material holding portion of the base material, that is, the outer surface of the base material (back surface) and the outer edge of the base material without any gap. As a result, the adhesion between the sheet and the substrate which are wound up becomes higher.

上述第一態樣中,也可以是前述基台朝前述基材保持部之外周側延伸,前述密閉框內上表面構成形成在前述基材保持部之外周側的凹部的上表面。 In the first aspect, the base may extend toward the outer peripheral side of the substrate holding portion, and the upper surface of the sealed frame may constitute an upper surface of the concave portion formed on the outer peripheral side of the substrate holding portion.

依據上述第一形態之熱成形裝置,凹部的上表面形成密閉框內上表面。因此,密閉空間成為以基台之側面、凹部的上表面、密閉框之內側的側面、及片材所圍的空間。由於凹部的上表面比框底部的上表面高,所以比起密閉框上表面作為框底部之上表面的情況,謀求了密閉空間的縮小化。因此,縮短了用以提高密閉空間內之真空度的所需時間。 According to the thermoforming apparatus of the first aspect described above, the upper surface of the concave portion forms the upper surface of the sealed frame. Therefore, the sealed space is a space surrounded by the side surface of the base, the upper surface of the recess, the side surface inside the sealing frame, and the sheet. Since the upper surface of the concave portion is higher than the upper surface of the bottom portion of the frame, the sealing space is reduced in comparison with the case where the upper surface of the sealing frame serves as the upper surface of the frame bottom. Therefore, the time required to increase the degree of vacuum in the sealed space is shortened.

本發明之第二態樣的熱成形方法,是使用熱成形裝置的熱成形方法,該熱成形裝置包含有:下框,具有框周壁部及形成有真空通氣孔之框底部,形成收容基材之空間;基台,具有可保持前述基材之基材保持部;密閉框,從前述框底部之基台設置面突出而設置,且於平面視是包圍前述基材保持部之全周;及片材固持部,可在藉由熱板加熱前述片材之上升位置、和密接於前述密閉框之上端的 下降位置之間上下移動地,設於前述下框內,橫跨全周無間隙地固持前述片材之外周端,該熱成形方法是:將前述基材保持於前述基材保持部,於前述密閉框的內側收容前述基材,利用前述片材固持部橫跨全周無間隙地固持前述片材的外周端,使前述熱板密接於前述框周壁部之上緣部,使前述片材固持部移動到前述上升位置,且藉由前述熱板將前述片材加熱,利用前述真空通氣孔進行真空吸引,以對前述下框內之空間減壓,且使前述片材固持部移動到前述下降位置為止,對前述片材固持部密接於前述密閉框之上端時所形成之前述片材及前述密閉框所圍的密閉空間,更透過前述真空通氣孔進行吸引。 A second aspect of the present invention is a thermoforming method using a thermoforming apparatus comprising: a lower frame having a frame wall portion and a frame bottom portion formed with a vacuum vent hole to form a receiving substrate a base having a substrate holding portion capable of holding the substrate; a sealing frame protruding from the base mounting surface at the bottom of the frame, and surrounding the substrate holding portion in a plan view; a sheet holding portion that can heat the raised position of the sheet by a hot plate and is in close contact with the upper end of the sealed frame The lowermost position of the sheet is fixed across the entire lower circumference in the lower frame, and the outer peripheral end of the sheet is held without gaps. The thermoforming method is: holding the substrate in the substrate holding portion, The substrate is housed inside the sealing frame, and the outer peripheral end of the sheet is held by the sheet holding portion across the entire circumference without gaps, and the hot plate is adhered to the upper edge portion of the frame peripheral wall portion to hold the sheet. Moving to the rising position, heating the sheet by the hot plate, vacuum suctioning the vacuum vent to decompress the space in the lower frame, and moving the sheet holding portion to the lowering At the position, the sheet and the closed space surrounded by the sealing frame formed by the sheet holding portion in close contact with the upper end of the sealing frame are sucked through the vacuum vent hole.

依據上述第二態樣之熱成形方法,在對片材固持部密接於框周壁部之上端時所形成之密閉空間更以真通通氣孔進行吸引的製程中,更提高密閉空間內的真空度,並使片材吸附於前述吸附面。藉此,捲入部分之片材和基材的密著性變高。又,到成形品完成為止,阻止空氣或不純物朝基材和片材之間侵入。 According to the second aspect of the hot forming method, in the process of attracting the sealed space formed by the sheet holding portion in close contact with the upper end of the frame peripheral wall portion, the vacuum is increased in the sealed space. The sheet is adsorbed to the aforementioned adsorption surface. Thereby, the adhesion of the sheet to which the portion is wound and the substrate becomes high. Further, air or impurities are prevented from entering between the substrate and the sheet until the molded article is completed.

上述第二態樣中,也可以是在通過前述真空通氣孔吸引前述密閉空間之際,對前述片材和前述熱板之間的空間進行加壓。 In the second aspect, the space between the sheet and the hot plate may be pressurized while sucking the sealed space through the vacuum vent hole.

依據上述第二態樣之熱成形方法,伴隨著加壓,片材從熱板側推壓到基材的表面,使片材和基材之密著性更進一層提高。 According to the above-described second aspect of the hot forming method, the sheet is pressed from the hot plate side to the surface of the substrate with pressurization, so that the adhesion between the sheet and the substrate is further improved.

依據本發明之上述各態樣之熱成形裝置及熱成 形方法,可提高捲入部分之片材和基材的密著性。其結果,可謀求成形品之品質提升。 Hot forming device and heat forming according to the above aspects of the present invention The shape method can improve the adhesion of the sheet and the substrate in the entrained portion. As a result, the quality of the molded article can be improved.

1‧‧‧熱成形裝置 1‧‧‧Thermal forming device

2‧‧‧下框 2‧‧‧ Lower frame

4‧‧‧熱板 4‧‧‧Hot board

4a‧‧‧上表面 4a‧‧‧ upper surface

4p‧‧‧加熱面 4p‧‧‧ heating surface

6‧‧‧基台 6‧‧‧Abutment

6c‧‧‧側面 6c‧‧‧ side

8‧‧‧片材固持部 8‧‧‧Sheet holding department

8A‧‧‧框上部 8A‧‧‧Box upper

8B‧‧‧框下部 8B‧‧‧ below the box

10‧‧‧密閉框 10‧‧‧Closed box

10a‧‧‧上端面(上端) 10a‧‧‧Upper end (upper end)

12‧‧‧框底部 12‧‧‧ bottom of the box

12a‧‧‧板面 12a‧‧‧ board

14‧‧‧框周壁部 14‧‧‧ frame wall

14a‧‧‧上端面 14a‧‧‧ upper end

16‧‧‧基材保持部 16‧‧‧Substrate retention department

16c‧‧‧側面 16c‧‧‧ side

18‧‧‧外周壁部 18‧‧‧outer wall

18d‧‧‧側面 18d‧‧‧ side

20‧‧‧基台設置面 20‧‧‧Base set surface

21‧‧‧凹部 21‧‧‧ recess

22‧‧‧升降機構 22‧‧‧ Lifting mechanism

24‧‧‧支持台 24‧‧‧Support desk

25‧‧‧軸部 25‧‧‧Axis

26‧‧‧移動部 26‧‧‧Mobile Department

27‧‧‧支持部 27‧‧‧Support Department

31‧‧‧加熱器 31‧‧‧heater

33‧‧‧通氣孔 33‧‧‧vents

36‧‧‧真空通氣孔 36‧‧‧vacuum vents

38‧‧‧密封構件 38‧‧‧ Sealing members

39‧‧‧密封構件 39‧‧‧ Sealing members

40a‧‧‧密閉框內上表面 40a‧‧‧ Upper surface inside the closed frame

42‧‧‧吸附面 42‧‧‧Adsorption surface

B‧‧‧基材 B‧‧‧Substrate

D1‧‧‧箭頭 D1‧‧‧ arrow

D2‧‧‧箭頭 D2‧‧‧ arrow

H‧‧‧片材 H‧‧‧Sheet

P1‧‧‧上升位置 P1‧‧‧ rising position

P2‧‧‧下降位置 P2‧‧‧ down position

R‧‧‧表面 R‧‧‧ surface

S2‧‧‧空間 S2‧‧‧ space

W‧‧‧密閉空間 W‧‧‧Confined space

x‧‧‧邊界 X‧‧‧ border

圖1是顯示本發明一實施形態之熱成形裝置中,使片材下降之前的狀態的斷面圖。 Fig. 1 is a cross-sectional view showing a state before a sheet is lowered in a thermoforming apparatus according to an embodiment of the present invention.

圖2是顯示本發明一實施形態之熱成形裝置中,使片材下降之前的狀態的平面圖。 Fig. 2 is a plan view showing a state before the sheet is lowered in the thermoforming apparatus according to the embodiment of the present invention.

圖3是顯示本發明一實施形態之熱成形裝置中,使熱板抵接於片材的狀態的斷面圖。 3 is a cross-sectional view showing a state in which a hot plate is brought into contact with a sheet in the thermoforming apparatus according to the embodiment of the present invention.

圖4是顯示本發明一實施形態之熱成形裝置中,就在使片材固持部下降到下降位置後的狀態的斷面圖。 Fig. 4 is a cross-sectional view showing a state in which the sheet holding portion is lowered to a lowered position in the thermoforming apparatus according to the embodiment of the present invention.

圖5是顯示本發明一實施形態之熱成形裝置中,使片材固持部下降到下降位置後已對密閉空間內進行吸引了的狀態的斷面圖。 FIG. 5 is a cross-sectional view showing a state in which the sheet holding portion is lowered to the lowered position and then sucked in the sealed space in the thermoforming apparatus according to the embodiment of the present invention.

1...熱成形裝置 1...hot forming device

2...下框 2...lower frame

4...熱板 4...hot plate

4p...加熱面 4p...heating surface

6...基台 6...abutment

8...片材固持部 8...sheet holding unit

10...密閉框 10...closed box

10a...上端面(上端) 10a... upper end (upper end)

12...框底部 12...bottom of the box

14...框周壁部 14...frame wall

16...基材保持部 16...substrate retention unit

20...基台設置面 20...Abutment setting surface

21...凹部 21...recess

36...真空通氣孔 36...vacuum vent

38...密封構件 38...sealing member

40a...密閉框內上表面 40a... upper surface inside the closed frame

B...基材 B...substrate

H...片材 H... sheet

P1...上升位置 P1...up position

P2...下降位置 P2...down position

較佳實施例之詳細說明 Detailed description of the preferred embodiment 較佳的實施形態 Preferred embodiment

以下,就有關本發明一實施形態之熱成形裝置及熱成形方法,參照圖面予以說明。而且,在以下的說明所使用的圖面是示意圖,長度、寬度及厚度的比率等不限於與實際的物品相同,可適宜地進行變更。 Hereinafter, a thermoforming apparatus and a thermoforming method according to an embodiment of the present invention will be described with reference to the drawings. Further, the drawings used in the following description are schematic views, and the ratios of the length, the width, and the thickness are not limited to the same as the actual articles, and can be appropriately changed.

(熱成形裝置) (thermoforming device)

圖1及圖2是本實施形態之熱成形裝置1的斷面圖及平面圖,顯示使片材下降之前的狀態。 Fig. 1 and Fig. 2 are a cross-sectional view and a plan view of the thermoforming apparatus 1 of the embodiment, showing a state before the sheet is lowered.

如圖1所示,熱成形裝置1具備有下框2、熱板4、基台6、片材固持部8、及密閉框10。 As shown in FIG. 1 , the thermoforming apparatus 1 includes a lower frame 2 , a hot plate 4 , a base 6 , a sheet holding portion 8 , and a sealing frame 10 .

下框2是熱成形裝置1的筐體,具備有框底部12、及框周壁部14。 The lower frame 2 is a casing of the thermoforming apparatus 1 and includes a framed bottom portion 12 and a frame peripheral wall portion 14.

框底部12是考慮熱成形裝置1的使用用途等而固定於預定的位置。又,也可以是具備有用以設置於預定位置的固定具等,也可以是用以接著於前述預定位置的接著部等。 The frame bottom portion 12 is fixed at a predetermined position in consideration of the use or the like of the thermoforming apparatus 1. Further, a fixture or the like that is provided to be installed at a predetermined position may be provided, or a follower or the like for following the predetermined position may be used.

下框2具有框底部12及框周壁部14所圍的空間S2。 The lower frame 2 has a space S2 surrounded by the frame bottom portion 12 and the frame peripheral wall portion 14.

框周壁部14是於接近框底部12之外周的位置,豎立設置於框底部12之其中一方的板面12a。框周壁部14之上端面14a設有密封構件39。密封構件39是在接下來說明之熱板4抵接於框周壁部14之上端面14a時,用以使熱板4之底面密接於框周壁部14的構件。作為密封構件38的材質,可舉例如苯乙烯-丁二烯橡膠等合成橡膠,然而並不特別限定。 The frame peripheral wall portion 14 is a plate surface 12a that is erected on one of the frame bottom portions 12 at a position close to the outer periphery of the frame bottom portion 12. A sealing member 39 is provided on the upper end surface 14a of the frame peripheral wall portion 14. The sealing member 39 is a member for adhering the bottom surface of the hot plate 4 to the frame peripheral wall portion 14 when the hot plate 4 described below abuts against the upper end surface 14a of the frame peripheral wall portion 14. The material of the sealing member 38 is, for example, a synthetic rubber such as styrene-butadiene rubber, but is not particularly limited.

熱板4是具有平滑的加熱面4p的平板形狀,且在平面視下形成比下框2還大的形狀。且,熱板4藉由不圖示的升降裝置朝著對配置於下方之下框2接近遠離的方向設成可升降。熱板4之加熱面4p於完成了朝下方移動的狀態,密接於下框2之框周壁部14的上端面14a而配置。 The hot plate 4 is a flat plate shape having a smooth heating surface 4p, and is formed in a shape larger than the lower frame 2 in plan view. Further, the hot plate 4 is set to be movable up and down in a direction in which it is disposed close to the lower frame 2 by a lifting device (not shown). The heating surface 4p of the hot plate 4 is placed in a state of being moved downward, and is in close contact with the upper end surface 14a of the frame peripheral wall portion 14 of the lower frame 2.

熱板4之上表面4a隔著預定的間隔設有複數個加熱器31、...、31。又,於熱板4隔著預定的間隔形成有朝加熱面4p開口之複數個通氣孔33、...、33。各個通氣孔33連接於具有真空吸引加熱面4p側之真空泵的真空槽(圖示 省略)、及儲存壓縮機所產生之壓縮空氣的加壓槽(圖示省略)。 The upper surface 4a of the hot plate 4 is provided with a plurality of heaters 31, ..., 31 at predetermined intervals. Further, a plurality of vent holes 33, ..., 33 opening to the heating surface 4p are formed in the hot plate 4 at predetermined intervals. Each of the vent holes 33 is connected to a vacuum chamber having a vacuum pump on the vacuum suction heating surface 4p side (illustration Omitted), and a pressurized tank (not shown) for storing compressed air generated by the compressor.

熱形成裝置1是對收容於空間S2的基材B,將藉由熱板4進行加熱而軟化的片材H進行模具賦形,或是接著於基板B之表面R的裝置。 The heat forming apparatus 1 is a device that forms a mold on a substrate B accommodated in a space S2, and which is softened by heating the hot plate 4, or is attached to the surface R of the substrate B.

基材B是由例如聚丙烯系樹脂、成形品之聚乙烯系樹脂等之熱可塑性樹脂形成之本體。基材B的形狀雖無特別限制,然而基材B的高度尺寸是比框周壁部14的高度尺寸小。 The base material B is a body formed of a thermoplastic resin such as a polypropylene resin or a polyethylene resin of a molded article. The shape of the substrate B is not particularly limited, but the height dimension of the substrate B is smaller than the height dimension of the frame peripheral wall portion 14.

片材H是具有例如印刷層、設於印引刷層之表面的保護膜或是載體膜、及設於印刷層之背面的接著層之公知的多層片材。前述膜或層的材質只要是藉由抵接於熱板4之加熱面4p而被加熱,且具有可撓性及黏著性,並且於已被冷卻之際可被覆於基材B之表面R者,無特別限制。 The sheet H is a known multilayer sheet having, for example, a printing layer, a protective film or a carrier film provided on the surface of the printing brush layer, and an adhesive layer provided on the back surface of the printing layer. The material of the film or layer is heated by the heating surface 4p of the hot plate 4, and has flexibility and adhesiveness, and can be coated on the surface R of the substrate B when it is cooled. There are no special restrictions.

基台6是用以將基材B保持於空間S2內之構件,且是抵接於框底部12之板面12a的預定位置而設。亦即,框底部12的板面12a是基台設置面20。如圖2所示,以平面視觀之,於基台6的大略中央設有可保持基材B的基材保持部16。基材保持部16設置有基材B。基材保持部16之以平面視之的形狀是和基材B的底面之以平面視之的形狀相同。除此之外,以平面視觀之時,基材保持部16是形成比基材B的底面尺寸還小。藉此,片材H被覆在基材B的表面R時,可使片材H易於朝基材B的底面(背面)捲入。 The base 6 is a member for holding the base material B in the space S2, and is provided at a predetermined position abutting against the plate surface 12a of the frame bottom portion 12. That is, the board surface 12a of the frame bottom portion 12 is the base setting surface 20. As shown in FIG. 2, a substrate holding portion 16 for holding the substrate B is provided in the center of the base 6 in a plan view. The substrate holding portion 16 is provided with a substrate B. The shape of the substrate holding portion 16 in plan view is the same as the shape of the bottom surface of the substrate B in plan view. In addition, when the film is viewed in a plan view, the substrate holding portion 16 is formed to be smaller than the size of the bottom surface of the substrate B. Thereby, when the sheet H is coated on the surface R of the substrate B, the sheet H can be easily caught in the bottom surface (back surface) of the substrate B.

在本實施形態中,基台6朝基材保持部16的外周側延伸,基台6的延伸部分之從框底部12的板面12a起算的高度尺寸比基材保持部16小。又,從基材保持部16延伸的部分,即外周壁部18,是設置成對框底部12的板面12a豎起。藉由如此之構成,於基材保持部16的外周側設置凹部21。 In the present embodiment, the base 6 extends toward the outer peripheral side of the substrate holding portion 16, and the height of the extending portion of the base 6 from the plate surface 12a of the frame bottom portion 12 is smaller than that of the substrate holding portion 16. Further, the portion extending from the substrate holding portion 16, that is, the outer peripheral wall portion 18 is provided to stand up against the plate surface 12a of the frame bottom portion 12. With such a configuration, the concave portion 21 is provided on the outer peripheral side of the substrate holding portion 16.

片材固持部8是由框上部8A和框下部8B構成。框上部8A和框下部8B於平面視中,是以片材H的外周緣可配置於該等框之寬度方向的大略中央的方式,形成與片材H的形狀一致。也就是,以使片材H的外周緣位於框上部8A及框下部8B之框的外周緣與內周緣的中間的方式,形成框上部8A及框下部8B。藉此如圖1所示,使不鬆弛而伸張了的狀態之片材H的外周端橫跨全周無間隙地,夾持在框上部8A和框下部8B之間。 The sheet holding portion 8 is composed of a frame upper portion 8A and a frame lower portion 8B. In the plan view, the frame upper portion 8A and the frame lower portion 8B are formed so as to be aligned with the shape of the sheet H so that the outer peripheral edge of the sheet H can be disposed substantially at the center in the width direction of the frames. That is, the frame upper portion 8A and the frame lower portion 8B are formed such that the outer peripheral edge of the sheet H is positioned between the outer periphery of the frame upper portion 8A and the frame lower portion 8B and the inner peripheral edge. As a result, as shown in FIG. 1, the outer peripheral end of the sheet H in a state in which it is stretched without being loosened is sandwiched between the frame upper portion 8A and the frame lower portion 8B without a gap across the entire circumference.

片材固持部8藉由片材固持部升降機構(以下作為「升降機構」)22,而支持成可從利用熱板4加熱片材H之上升位置P1下降。升降機構22具備有支持台24、軸部25、移動台26及支持部27。支持台24抵接於基台6之側面6c,於平面視是以包圍基台6的方式,設於空間S2內之框底部12的板面12a上。軸部25是沿著片材H的升降方向豎立設置於支持台24的上表面。又,軸部25貫通移動部26。移動部26是作成可藉由未圖示之驅動部而沿著軸部25之軸線方向升降的環狀構件。支持部27與移動部26連續設置,且從移動部26沿著與框底部12之板面12a平行的方向朝空間S2內 突出而設置。支持部27之突出端部於平面視,是與抵接於基台6之支持台24的端部重疊。 The sheet holding portion 8 is supported by the sheet holding portion elevating mechanism (hereinafter referred to as "elevating mechanism") 22 so as to be lowered from the rising position P1 at which the sheet H is heated by the hot plate 4. The elevating mechanism 22 includes a support base 24, a shaft portion 25, a moving table 26, and a support portion 27. The support table 24 abuts against the side surface 6c of the base 6, and is disposed on the plate surface 12a of the frame bottom portion 12 in the space S2 so as to surround the base 6 in a plan view. The shaft portion 25 is erected on the upper surface of the support table 24 along the lifting direction of the sheet H. Further, the shaft portion 25 penetrates the moving portion 26. The moving portion 26 is an annular member that can be raised and lowered in the axial direction of the shaft portion 25 by a driving portion (not shown). The support portion 27 is continuously provided with the moving portion 26, and is moved from the moving portion 26 in a direction parallel to the plate surface 12a of the frame bottom portion 12 toward the space S2. Stand out and set. The protruding end portion of the support portion 27 overlaps the end portion of the support base 24 that abuts against the base 6 in a plan view.

在支持部27的上表面連續設置有片材固持部8的框下部8B。 A frame lower portion 8B of the sheet holding portion 8 is continuously provided on the upper surface of the support portion 27.

密閉框10是從框底部12的板面12a(亦即,基台設置面20)突出而設置。在本實施形態中,密閉框10是以從支持台24之上表面突出的方式,設在與升降機構22之支持台24的基台6相接的端部。因此,在平面觀視下,密閉框10之上端面10a與支持部27的突出端部重疊。從框底部12的板面12a起算之密閉框10的高度尺寸是和從板面12a起算之基台6之外周壁部18的高度尺寸同等。而且,從框底部12的板面12a起算之外周壁部18及密閉框10的高度尺寸,是比從板面12a起算之基台6的基材保持部16之上表面的高度尺寸大。 The sealing frame 10 is provided to protrude from the plate surface 12a of the frame bottom portion 12 (that is, the base installation surface 20). In the present embodiment, the sealing frame 10 is provided at an end portion that is in contact with the base 6 of the support base 24 of the elevating mechanism 22 so as to protrude from the upper surface of the support base 24. Therefore, the upper end surface 10a of the sealing frame 10 overlaps the protruding end portion of the support portion 27 in a plan view. The height dimension of the sealing frame 10 from the plate surface 12a of the frame bottom portion 12 is equal to the height dimension of the peripheral wall portion 18 other than the base 6 from the plate surface 12a. Moreover, the height dimension of the outer peripheral wall portion 18 and the sealing frame 10 from the plate surface 12a of the frame bottom portion 12 is larger than the height dimension of the upper surface of the base material holding portion 16 of the base 6 from the plate surface 12a.

但是,使基材保持部16之側面16c的高度尺寸確保某一程度是重要的。是故,也可以是從框底部12之板面12a起算之外周壁部18及密閉框10的高度尺寸,比從同面起算之基台6之基材保持部16的上表面的高度尺寸小,也可以是同等。而且,基材保持部16和密閉框10之間的密閉框內上表面40a是設置在比基材保持部16之外周上緣部(相當於圖4及圖5所示之邊界x)及前述密閉框之上端低的位置。 However, it is important to ensure the height dimension of the side surface 16c of the substrate holding portion 16 to a certain extent. Therefore, the height dimension of the outer peripheral wall portion 18 and the sealing frame 10 from the plate surface 12a of the frame bottom portion 12 may be smaller than the height of the upper surface of the substrate holding portion 16 of the base 6 from the same side. It can also be equal. Further, the inner surface 40a of the sealing frame between the substrate holding portion 16 and the sealing frame 10 is provided on the outer peripheral edge portion (corresponding to the boundary x shown in FIGS. 4 and 5) of the outer periphery of the substrate holding portion 16 and the aforementioned The lower end of the closed frame.

於如上述之構成中,支持片材固持部8之支持部27透過移動部26而沿著軸部25之軸線方向下降時,會在密 閉框10之上端面10a卡止。亦即,片材固持部8在藉由熱板4加熱片材H之上升位置P1和密接於密閉框10之上端面(上端)10a之下降位置P2之間設成可上下移動。 In the above configuration, when the support portion 27 of the support sheet holding portion 8 passes through the moving portion 26 and descends in the axial direction of the shaft portion 25, it is dense. The end face 10a above the closed frame 10 is locked. In other words, the sheet holding portion 8 is provided to be movable up and down between the raised position P1 at which the sheet H is heated by the hot plate 4 and the lowered position P2 which is in close contact with the upper end surface (upper end) 10a of the sealing frame 10.

密閉框10之上端面10a設有密封構件38。密封構件38是用以使藉由升降機構22而下降到密閉框10之上端面10a的支持部27的底面密接於密閉框10的構件,且是考量支持部27的材質等而以適切的材質形成。作為密封構件38的材質例如可舉苯乙烯-丁二烯橡膠等合成橡膠,然而並未特別限定。 A sealing member 38 is provided on the upper end surface 10a of the sealing frame 10. The sealing member 38 is a member for adhering the bottom surface of the support portion 27 which is lowered to the upper end surface 10a of the sealing frame 10 by the elevating mechanism 22 to the sealing frame 10, and is made of a material suitable for the material of the support portion 27. form. The material of the sealing member 38 is, for example, a synthetic rubber such as styrene-butadiene rubber, but is not particularly limited.

熱成形裝置1中,形成有連通於下框2內之空間S2且在密閉框10之內側至少貫通框底部12的真空通氣孔36。真空通氣孔36之與朝空間S2開口之端部為相反側的端部,連接有未圖示之真空泵等。 In the thermoforming apparatus 1, a vacuum vent hole 36 that communicates with the space S2 in the lower frame 2 and penetrates at least the frame bottom portion 12 inside the sealing frame 10 is formed. An end portion of the vacuum vent hole 36 opposite to the end portion opening to the space S2 is connected to a vacuum pump or the like (not shown).

可以是真空通氣孔36至少形成一個,然而真空通氣孔36的數量未被限制。 It is possible that at least one of the vacuum vent holes 36 is formed, but the number of the vacuum vent holes 36 is not limited.

作為密封構件38、39以外之熱成形裝置1的構成要素的材質,例如可舉不銹鋼(SUS)等,然而並未特別限定。 The material of the components of the thermoforming apparatus 1 other than the sealing members 38 and 39 is, for example, stainless steel (SUS), but is not particularly limited.

(熱成形方法) (thermoforming method)

接著,就有關使用熱成形裝置1之熱成形方法進行說明。本實施形態之熱成形方法是對基材B將利用加熱而軟化了的片材H進行模具賦形或接著於基材B的方法。 Next, a description will be given of a thermoforming method using the thermoforming apparatus 1. The thermoforming method of the present embodiment is a method of forming a mold for forming a sheet H which is softened by heating on the substrate B or adhering to the substrate B.

詳細來說,本實施形態之熱成形方法至少具備有以下說明之第一製程到第五製程。 In detail, the thermoforming method of the present embodiment includes at least the first to fifth processes described below.

[第一製程] [First Process]

在本製程中,將基材B保持於基台6之基材保持部16,且將基材B收容於密閉框10的內側。 In the present process, the substrate B is held by the substrate holding portion 16 of the base 6, and the substrate B is housed inside the sealing frame 10.

詳細來說是如圖1所示,使熱板4相對於框周壁部14朝上方分離。又,將固持片材H之前的片材固持部8配置於比上升位置P1還下方。然後,將如此之狀態作為初期狀態。 Specifically, as shown in FIG. 1, the hot plate 4 is separated upward with respect to the frame peripheral wall portion 14. Moreover, the sheet holding portion 8 before the sheet H is held is disposed below the rising position P1. Then, such a state is taken as an initial state.

接著,將基材B設置於基材保持部16。此時,為了將基材B更安定地保持,也可以是從基材保持部16的上表面吸引基材B。 Next, the substrate B is placed on the substrate holding portion 16 . At this time, in order to hold the base material B more stably, the base material B may be attracted from the upper surface of the base material holding portion 16 .

[第二製程] [Second process]

在本製程中,以片材固持部8橫跨全周無間隙地固持片材H的外周端。 In the present process, the sheet holding portion 8 holds the outer peripheral end of the sheet H without a gap across the entire circumference.

亦即,在平面觀視下,片材H之外周緣配置於框下部8B之框的寬度方向內。也就是,將片材H配置在框下部8B上,以使片材H的外周緣位在框下部8B之外周緣與內周緣之間。然後,從片材H的上表面使框上部8A與框下部8B的位置一致而配置,藉由框上部8A與框下部8B將片材H夾入。藉此,如圖1所示,在使片材H不鬆弛地拉伸的狀態下夾持於框上部8A與框下部8B之間。 That is, the outer periphery of the sheet H is disposed in the width direction of the frame of the lower portion 8B of the frame in a plan view. That is, the sheet H is placed on the lower portion 8B of the frame such that the outer periphery of the sheet H is positioned between the outer periphery and the inner periphery of the lower portion 8B of the frame. Then, the frame upper portion 8A and the frame lower portion 8B are aligned from the upper surface of the sheet H, and the sheet H is sandwiched by the frame upper portion 8A and the frame lower portion 8B. As a result, as shown in FIG. 1, the sheet H is sandwiched between the frame upper portion 8A and the frame lower portion 8B in a state where the sheet H is stretched without being loose.

[第三製程] [Third Process]

在本製程中,使熱板4密接於框周壁部14之上端面(框上緣部)14a,使片材固持部8移動至上升位置P1,並藉由熱板4加熱片材H。 In the present process, the hot plate 4 is brought into close contact with the upper end surface (frame upper edge portion) 14a of the frame peripheral wall portion 14, the sheet holding portion 8 is moved to the raised position P1, and the sheet H is heated by the hot plate 4.

圖3是本實施形態中之熱成形裝置1的斷面圖,顯示使熱板4密接於片材H的狀態。 Fig. 3 is a cross-sectional view showing the thermoforming apparatus 1 of the embodiment, showing a state in which the hot plate 4 is adhered to the sheet H.

詳細來說,使熱板4從圖1所示的位置朝下方(亦即,朝圖3所示之箭頭D2方向)移動,如圖3所示,使加熱面4p的外周部抵接於框周壁部14的上端面14a。此時,片材H的上表面沿著熱板4之加熱面4p配置成大略接觸了的狀態。在此階段,空間S2藉由下框2之框底部12及框周壁部14、熱板4而被密閉。 Specifically, the hot plate 4 is moved downward from the position shown in FIG. 1 (that is, in the direction of the arrow D2 shown in FIG. 3), and as shown in FIG. 3, the outer peripheral portion of the heating surface 4p is brought into contact with the frame. The upper end surface 14a of the peripheral wall portion 14. At this time, the upper surface of the sheet H is placed in a state of being largely in contact with the heating surface 4p of the hot plate 4. At this stage, the space S2 is sealed by the frame bottom portion 12 of the lower frame 2, the frame peripheral wall portion 14, and the hot plate 4.

接著,對熱板4和片材H之間進行減壓,使片材H吸附於加熱面4p並進行加熱。具體來說,藉由加熱器31加熱熱板4且使圖示省略之真空槽開放,透過通氣孔33將片材H朝向熱板4之加熱面4p移動的方向進行真空吸引。藉此,使片材H吸附於熱板4之加熱面4p,並對吸附了的片材H加熱。 Next, the pressure between the hot plate 4 and the sheet H is reduced, and the sheet H is adsorbed on the heating surface 4p and heated. Specifically, the hot plate 4 is heated by the heater 31, and the vacuum chamber (not shown) is opened, and the sheet H is vacuum-drawn in the direction in which the sheet H is moved toward the heating surface 4p of the hot plate 4 through the vent hole 33. Thereby, the sheet H is adsorbed to the heating surface 4p of the hot plate 4, and the adsorbed sheet H is heated.

而且,於本製程中,宜以使連接於真空通氣孔36之真空槽作動,讓空間S2內事先開始進行真空吸引以成為預定之真空度。 Further, in the present process, it is preferable to operate the vacuum chamber connected to the vacuum vent hole 36, and the vacuum suction is started in the space S2 to be a predetermined degree of vacuum.

[第四製程] [Fourth process]

在本製程中,利用真空通氣孔36進行吸引以使下框2內之空間S2減壓,且使片材固持部8移動到下降位置P2為止。 In the present process, suction is performed by the vacuum vent hole 36 to decompress the space S2 in the lower frame 2, and the sheet holding portion 8 is moved to the lowered position P2.

詳細來說,首先使連接於真空通氣孔36之真空槽作動,透過真空通氣孔36,朝著使片材H向下方移動的方向進行真空吸引。藉此,片材H之下方的空間S2的空氣 被朝圖1所示之箭頭D1方向吸引,空間S2被減壓而成為高真空狀態。 Specifically, first, the vacuum chamber connected to the vacuum vent hole 36 is actuated, and the vacuum vent hole 36 is passed through to vacuum suction in a direction in which the sheet H is moved downward. Thereby, the air in the space S2 below the sheet H It is attracted to the direction of the arrow D1 shown in FIG. 1, and the space S2 is decompressed to a high vacuum state.

在此狀態下,藉由未圖示之驅動部使升降機構22的移動部26朝下方移動,以適切的速度使片材固持部8從上升位置P1移動到下降位置P2為止。於高真空狀態之空間S2,於片材H藉由來自熱板4之加熱而發現可撓性及黏著性,所以伴隨片材固持部8的下降,片材H從上表面朝下表面被覆於基材B的表面R。 In this state, the moving portion 26 of the elevating mechanism 22 is moved downward by a driving portion (not shown), and the sheet holding portion 8 is moved from the rising position P1 to the falling position P2 at an appropriate speed. In the space S2 in the high vacuum state, the sheet H is found to have flexibility and adhesiveness by heating from the hot plate 4, so that the sheet H is covered from the upper surface toward the lower surface along with the lowering of the sheet holding portion 8. The surface R of the substrate B.

[第五製程] [Fifth Process]

在本製程中,片材固持部8密接於密閉框10之上端面10a時,將藉由片材H及密閉框10所圍的密閉空間W以真空通氣孔36進一步進行吸引。 In the present process, when the sheet holding portion 8 is in close contact with the upper end surface 10a of the sealing frame 10, the sealed space W surrounded by the sheet H and the sealing frame 10 is further sucked by the vacuum vent hole 36.

圖4是本實施形態之熱成形裝置1的斷面圖,且顯示就在剛將片材固持部8下降到下降位置P2後的狀態。 Fig. 4 is a cross-sectional view of the thermoforming apparatus 1 of the embodiment, and shows a state immediately after the sheet holding portion 8 is lowered to the lowered position P2.

片材固持部8到達下降位置P2時,如圖4所示,形成以基台6之基材保持部16的側面16c、密閉框內上表面40a、外周壁部18之內側的側面18d、及片材H的底面所圍的密閉空間W。換言之,密閉空間W被凹部21的內壁面和片材H的底面圍繞而形成。 When the sheet holding portion 8 reaches the lowering position P2, as shown in FIG. 4, the side surface 16c of the base material holding portion 16 of the base 6, the inner surface 40a of the sealing frame, the side surface 18d of the inner side of the outer peripheral wall portion 18, and A sealed space W surrounded by the bottom surface of the sheet H. In other words, the sealed space W is formed by being surrounded by the inner wall surface of the concave portion 21 and the bottom surface of the sheet H.

接著,藉由真空通氣孔36吸引密閉空間W內,而更提高密閉空間W內的真空度。 Then, the inside of the sealed space W is sucked by the vacuum vent hole 36, and the degree of vacuum in the sealed space W is further increased.

圖5是本實施形態之熱成形裝置1的斷面圖,且顯示使片材固持部8下降到下降位置P2後吸引了密閉空間W內的狀態。 FIG. 5 is a cross-sectional view of the thermoforming apparatus 1 of the present embodiment, and shows a state in which the sheet holding portion 8 is lowered to the lowered position P2 and then sucked into the sealed space W.

密閉空間W內藉由真空通氣孔36吸引時,如圖5所示,片材H被朝下方吸引,而吸附於吸附面42。吸附面42是形成為從基材B的下端,通過基材B和基台6之基材保持部16的邊界x,朝密閉框內上表面40a及外周壁部18之內側的側面18d連續而擴大。 When the sealed space W is sucked by the vacuum vent hole 36, as shown in FIG. 5, the sheet H is sucked downward and adsorbed to the adsorption surface 42. The adsorption surface 42 is formed so as to be continuous from the lower end of the base material B, through the boundary x of the base material holding portion 16 of the base material B and the base 6, and to the side surface 18d of the inner surface 40a of the closed frame and the inner side of the outer peripheral wall portion 18 expand.

在本製程中,也可以是對片材H和熱板4之加熱面4p之間的密閉空間S2進行加壓。 In the present process, the sealed space S2 between the sheet H and the heating surface 4p of the hot plate 4 may be pressurized.

藉此,片材H更強力地密著於吸附面42。 Thereby, the sheet H is more strongly adhered to the adsorption surface 42.

進行了從上述說明之第一製程到第五製程後,以圖未示之切斷裝置等於邊界x將片材H切斷。 After the first process to the fifth process described above is performed, the sheet H is cut by a cutting device not shown, which is equal to the boundary x.

接著,使熱板4朝上方移動,並進而朝橫向方向移動。然後,使被覆及接著片材H的基材B,亦即使成形品從基台6之基材保持部16卸除,並從空間S2取出。 Next, the hot plate 4 is moved upward and further moved in the lateral direction. Then, the base material B covering the sheet and the subsequent sheet H is removed from the substrate holding portion 16 of the base 6 and taken out from the space S2.

藉由以上的作業,完成成形品,並完成一連串的熱成形動作。 By the above work, the molded article is completed, and a series of thermoforming operations are completed.

(熱成形裝置1及熱成形方法的作用效果) (The effect of the thermoforming apparatus 1 and the thermoforming method)

如上述說明般,依據本實施形態之熱成形裝置1,從真空通氣孔36進行真空吸引,在氣密的空間S2內,於片材固持部8到達下降位置P2時,便形成密閉空間W。透過真空通氣孔36對密閉空間W內進行吸引時,密閉空間W內的真空度便更為提高,使片材H吸附於吸附面42。藉由片材H之朝吸附面42的吸附,可提高捲入部分之基材B和片材H的密著性。因此,不會使空氣或不純物侵入到基材B和片材H之間,而可提高成形品之氣泡或不純物的除 去效果。 As described above, according to the thermoforming apparatus 1 of the present embodiment, vacuum suction is performed from the vacuum vent hole 36, and when the sheet holding portion 8 reaches the lowering position P2 in the airtight space S2, the sealed space W is formed. When the inside of the sealed space W is sucked through the vacuum vent hole 36, the degree of vacuum in the sealed space W is further increased, and the sheet H is adsorbed to the adsorption surface 42. By the adsorption of the sheet H toward the adsorption surface 42, the adhesion between the substrate B and the sheet H in the entrained portion can be improved. Therefore, air or impurities are not intruded between the substrate B and the sheet H, and the removal of bubbles or impurities of the molded article can be improved. Go to the effect.

又,依據本實施形態之熱成形裝置1,可藉由密封構件38,使密閉框10具有對移動到下降位置P2之片材固持部8的緩衝機能,且可使片材固持部8和密閉框10密著,而提高密閉空間W的氣密性。 Further, according to the thermoforming apparatus 1 of the present embodiment, the sealing member 10 can have the buffering function for the sheet holding portion 8 moved to the lowered position P2 by the sealing member 38, and the sheet holding portion 8 and the sealing portion can be sealed. The frame 10 is dense, and the airtightness of the sealed space W is improved.

又,依據本實施形態之成形裝置1,密閉框內上表面40a設於比基材保持部16之外周上緣部及密閉框10之上端面10a還低的位置。因此,可使片材H被覆到邊界x及基材B的底面(背面)外緣部並捲入。 Further, according to the molding apparatus 1 of the present embodiment, the inner surface 40a of the sealing frame is provided at a position lower than the outer peripheral edge portion of the outer periphery of the substrate holding portion 16 and the upper end surface 10a of the sealing frame 10. Therefore, the sheet H can be applied to the outer edge portion of the bottom surface (back surface) of the boundary x and the substrate B and can be wound up.

藉此,可防止成形後之片材H剝落,並更提高成形品之氣泡或不純物之除去效果。 Thereby, it is possible to prevent the sheet H after the formation from peeling off, and to further improve the effect of removing bubbles or impurities of the molded article.

再者,在本實施形態之熱成形裝置1中,基台6朝基材保持部16之外周側延伸,且於基材保持部16之外周形成凹部21。又,凹部21之外周壁部18設於密閉框10之內側。因此,比起框底部12的板面12a,凹部21的底面較高的情況,又,外周壁部18之內側的側面18d相較密閉框10之內側的側面位在內側的情況,可使密閉空間W縮小,而縮短用以提高密閉空間W內之真空度的所需時間。 In the thermoforming apparatus 1 of the present embodiment, the base 6 extends toward the outer peripheral side of the substrate holding portion 16, and the concave portion 21 is formed on the outer periphery of the substrate holding portion 16. Moreover, the outer peripheral wall portion 18 of the recessed portion 21 is provided inside the sealing frame 10. Therefore, when the bottom surface of the recessed portion 21 is higher than the plate surface 12a of the frame bottom portion 12, and the side surface 18d on the inner side of the outer peripheral wall portion 18 is located inside the side surface of the inner side of the airtight frame 10, the airtight portion can be sealed. The space W is reduced, and the time required to increase the degree of vacuum in the sealed space W is shortened.

又,依據本實施形態之熱成形方法,於第五製程中,更提高密閉空間W內的真空度,使片材H吸附於吸附面42。藉此,提高基材B和片材H的密著性,到成形品完成為止,可確實地防止空氣或不純物朝基材B和片材H之間侵入。 Further, according to the hot forming method of the present embodiment, in the fifth process, the degree of vacuum in the sealed space W is further increased, and the sheet H is adsorbed to the adsorption surface 42. Thereby, the adhesion between the substrate B and the sheet H is improved, and it is possible to reliably prevent intrusion of air or impurities between the substrate B and the sheet H until the molded article is completed.

又,依據本實施形態之熱成形方法,於第五製 程中,利用對片材H和熱板4之加熱面4p之間的密閉空間S2進行加壓,可更一層地提高基材B和片材H的密著性。 Moreover, according to the hot forming method of the embodiment, in the fifth system In the process, by applying pressure to the sealed space S2 between the sheet H and the heating surface 4p of the hot plate 4, the adhesion between the substrate B and the sheet H can be further improved.

以上,雖就有關本發明之較佳實施形態進行詳述,然而本發明並未限定於特定的實施形態,在申請專利範圍內所記載之本發明的要旨的範圍內,可進行種種的變更。 The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments, and various modifications can be made within the scope of the invention as set forth in the appended claims.

例如,也可以是基台6之外周壁部18的上端面設置密封構件38,外周壁部18兼作密閉框10。 For example, the sealing member 38 may be provided on the upper end surface of the outer peripheral wall portion 18 of the base 6, and the outer peripheral wall portion 18 may also serve as the sealing frame 10.

又,也可以是基台6不朝基材保持部16的外周側延伸,基台6由基材保持部16構成。於此情況,在框底部12之板面12a上從基材保持部16離開而設置密閉框10。進而,密閉框內上表面40a是藉由基材保持部16的側面16c、夾在基材保持部16和密閉框10之間的框底部12的板面12a、及密閉框10之內側的側面構成。 Further, the base 6 may not extend toward the outer peripheral side of the substrate holding portion 16, and the base 6 may be constituted by the substrate holding portion 16. In this case, the sealing frame 10 is provided on the plate surface 12a of the frame bottom portion 12 away from the substrate holding portion 16. Further, the inner surface 40a of the sealing frame is the side surface 16c of the substrate holding portion 16, the plate surface 12a of the frame bottom portion 12 sandwiched between the substrate holding portion 16 and the sealing frame 10, and the side surface inside the sealing frame 10. Composition.

又,升降機構22的構成並不限於上述說明之構成。亦即,升降機構22也可以是由移動部26和支持部27構成,移動部26連接於框周壁部14,並作成可沿框周壁部14升降,也可作成再另外的形態。 Further, the configuration of the elevating mechanism 22 is not limited to the configuration described above. That is, the elevating mechanism 22 may be constituted by the moving portion 26 and the supporting portion 27, and the moving portion 26 may be connected to the frame peripheral wall portion 14 and may be formed to be movable up and down along the frame peripheral wall portion 14, or may be formed in still another form.

1‧‧‧熱成形裝置 1‧‧‧Thermal forming device

2‧‧‧下框 2‧‧‧ Lower frame

4‧‧‧熱板 4‧‧‧Hot board

4a‧‧‧上表面 4a‧‧‧ upper surface

4p‧‧‧加熱面 4p‧‧‧ heating surface

6‧‧‧基台 6‧‧‧Abutment

6c‧‧‧側面 6c‧‧‧ side

8‧‧‧片材固持部 8‧‧‧Sheet holding department

8A‧‧‧框上部 8A‧‧‧Box upper

8B‧‧‧框下部 8B‧‧‧ below the box

10‧‧‧密閉框 10‧‧‧Closed box

10a‧‧‧上端面(上端) 10a‧‧‧Upper end (upper end)

12‧‧‧框底部 12‧‧‧ bottom of the box

12a‧‧‧板面 12a‧‧‧ board

14‧‧‧框周壁部 14‧‧‧ frame wall

14a‧‧‧上端面 14a‧‧‧ upper end

16‧‧‧基材保持部 16‧‧‧Substrate retention department

16c‧‧‧側面 16c‧‧‧ side

18‧‧‧外周壁部 18‧‧‧outer wall

18d‧‧‧側面 18d‧‧‧ side

20‧‧‧基台設置面 20‧‧‧Base set surface

21‧‧‧凹部 21‧‧‧ recess

22‧‧‧升降機構 22‧‧‧ Lifting mechanism

25‧‧‧軸部 25‧‧‧Axis

26‧‧‧移動部 26‧‧‧Mobile Department

27‧‧‧支持部 27‧‧‧Support Department

31‧‧‧加熱器 31‧‧‧heater

33‧‧‧通氣孔 33‧‧‧vents

36‧‧‧真空通氣孔 36‧‧‧vacuum vents

38‧‧‧密封構件 38‧‧‧ Sealing members

39‧‧‧密封構件 39‧‧‧ Sealing members

40a‧‧‧密閉框內上表面 40a‧‧‧ Upper surface inside the closed frame

42‧‧‧吸附面 42‧‧‧Adsorption surface

B‧‧‧基材 B‧‧‧Substrate

H‧‧‧片材 H‧‧‧Sheet

P1‧‧‧上升位置 P1‧‧‧ rising position

P2‧‧‧下降位置 P2‧‧‧ down position

R‧‧‧表面 R‧‧‧ surface

S2‧‧‧空間 S2‧‧‧ space

W‧‧‧密閉空間 W‧‧‧Confined space

x‧‧‧邊界 X‧‧‧ border

Claims (7)

一種熱成形裝置,對基材將片材進行模具賦形,或將前述片材接著於前述基材,該熱成形裝置包含:下框,具有框周壁部及形成有真空通氣孔之框底部,並形成收容前述基材之空間;熱板,具有加熱面,構成為對前述框周壁部之上緣部密接前述加熱面;基台,具有可保持前述基材之基材保持部;密閉框,從前述框底部之基台設置面突出而設置,且於平面視是包圍前述基材保持部的全周;及片材固持部,可在藉由前述熱板加熱前述片材之上升位置、和密接於前述密閉框之上端的下降位置之間上下移動地設於前述下框內,且橫跨全周無間隙地固持前述片材之外周端,前述片材固持部在密接於前述密閉框之上端時,形成以前述片材及前述密閉框所圍的密閉空間,前述真空通氣孔是構成為連通於前述下框內之空間,且在前述密閉框之內側至少貫通前述框底部並朝密閉框內上表面開口,在形成了前述密閉空間的狀態下通過前述真空通氣孔進行吸引。 A thermoforming apparatus for forming a sheet of a substrate onto a substrate or attaching the sheet to the substrate, the thermoforming apparatus comprising: a lower frame having a frame wall portion and a frame bottom portion formed with a vacuum vent hole, And forming a space for accommodating the substrate; the hot plate having a heating surface configured to closely contact the heating surface of the upper edge portion of the frame peripheral wall portion; the base having a substrate holding portion capable of holding the substrate; and a sealing frame; Provided to protrude from the base installation surface at the bottom of the frame, and to surround the entire circumference of the substrate holding portion in a plan view; and the sheet holding portion, the rising position of the sheet can be heated by the hot plate, and The outer peripheral end of the sheet is fixed to the lower frame so as to be vertically moved between the lowering positions of the upper end of the sealing frame, and the outer peripheral end of the sheet is fixed without a gap across the entire circumference, and the sheet holding portion is in close contact with the sealing frame. At the upper end, a sealed space surrounded by the sheet and the sealing frame is formed, and the vacuum vent hole is configured to communicate with a space in the lower frame, and at least penetrates the frame bottom inside the sealing frame It is drawn through the vacuum vent opening toward the upper surface and the lower sealed box, in the closed space formed state. 如請求項1之熱成形裝置,其中在前述密閉框之上端設有密封構件。 A thermoforming apparatus according to claim 1, wherein a sealing member is provided at an upper end of said sealing frame. 如請求項1或2之熱成形裝置,其中前述密閉框內上表面 形成於前述基材保持部和前述密閉框之間,且設於比前述基材保持部之外周上緣部及前述密閉框之上端還低的位置。 A thermoforming apparatus according to claim 1 or 2, wherein said upper surface of said sealed frame The substrate holding portion and the sealing frame are formed between the substrate holding portion and the outer peripheral edge portion of the substrate holding portion and the upper end of the sealing frame. 如請求項1或2之熱成形裝置,其中前述基台朝前述基材保持部之外周側延伸,前述密閉框內上表面構成形成在前述基材保持部之外周側的凹部的上表面。 The thermoforming apparatus according to claim 1 or 2, wherein the base extends toward the outer peripheral side of the substrate holding portion, and the upper surface of the sealed frame constitutes an upper surface of the concave portion formed on the outer peripheral side of the substrate holding portion. 如請求項3之熱成形裝置,其中前述基台朝前述基材保持部之外周側延伸,前述密閉框內上表面構成形成在前述基材保持部之外周側的凹部的上表面。 The thermoforming apparatus according to claim 3, wherein the base extends toward the outer peripheral side of the substrate holding portion, and the upper surface of the sealed frame constitutes an upper surface of a concave portion formed on the outer peripheral side of the substrate holding portion. 一種熱成形方法,是使用熱成形裝置,該熱成形裝置包含有下框,具有框周壁部及形成有真空通氣孔之框底部,並形成收容基材之空間;基台,具有可保持前述基材之基材保持部;密閉框,從前述框底部之基台設置面突出而設置,且於平面視是包圍前述基材保持部的全周;及片材固持部,可在藉由前述熱板加熱前述片材之上升位置、和密接於前述密閉框之上端的下降位置之間上下移動地設於前述下框內,且橫跨全周無間隙地固持前述片材之外周端,該熱成形方法是:將前述基材保持於前述基材保持部,於前述密閉框的內側收容前述基材,利用前述片材固持部橫跨全周無間隙地固持前述 片材的外周端,使前述熱板密接於前述框周壁部之上緣部,使前述片材固持部移動到前述上升位置,且藉由前述熱板將前述片材加熱,利用前述真空通氣孔進行真空吸引,以對前述下框內之空間減壓,且使前述片材固持部移動到前述下降位置為止,進而透過前述真空通氣孔對前述片材固持部密接於前述密閉框之上端時所形成之前述片材及前述密閉框所圍的密閉空間進行吸引。 A thermoforming method is a thermoforming apparatus comprising a lower frame having a frame wall portion and a frame bottom portion formed with a vacuum vent hole, and forming a space for accommodating the substrate; and a base having a base capable of maintaining the base The substrate holding portion of the material; the sealing frame is provided to protrude from the base installation surface at the bottom of the frame, and is surrounded by the entire circumference of the substrate holding portion in plan view; and the sheet holding portion can be heated by the heat The plate is heated in the lower frame between the rising position of the sheet and the lowering position of the upper end of the sealing frame, and the outer peripheral end of the sheet is held without a gap across the entire circumference. In the molding method, the substrate is held in the substrate holding portion, and the substrate is housed inside the sealing frame, and the sheet holding portion is held by the entire circumference without a gap. An outer peripheral end of the sheet, the heat plate is adhered to the upper edge portion of the frame peripheral wall portion, the sheet holding portion is moved to the raised position, and the sheet is heated by the hot plate to utilize the vacuum vent hole Vacuum suction is performed to decompress the space in the lower frame, and the sheet holding portion is moved to the lowering position, and the sheet holding portion is in close contact with the upper end of the sealing frame through the vacuum vent hole. The formed sheet and the sealed space surrounded by the sealed frame are sucked. 如請求項6之熱成形方法,其中通過前述真空通氣孔吸引前述密閉空間之際,對前述片材和前述熱板之間的空間進行加壓。 The thermoforming method according to claim 6, wherein the space between the sheet and the hot plate is pressurized while the suction space is sucked by the vacuum vent hole.
TW105112295A 2015-04-21 2016-04-20 Thermoforming apparatus and thermoforming method TWI709476B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-086724 2015-04-21
JP2015086724A JP5791842B1 (en) 2015-04-21 2015-04-21 Thermoforming apparatus and thermoforming method

Publications (2)

Publication Number Publication Date
TW201703978A true TW201703978A (en) 2017-02-01
TWI709476B TWI709476B (en) 2020-11-11

Family

ID=54346176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105112295A TWI709476B (en) 2015-04-21 2016-04-20 Thermoforming apparatus and thermoforming method

Country Status (3)

Country Link
JP (1) JP5791842B1 (en)
TW (1) TWI709476B (en)
WO (1) WO2016171175A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111791468A (en) * 2019-04-04 2020-10-20 本田技研工业株式会社 Resin molding apparatus and resin molding method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7268855B2 (en) * 2019-07-04 2023-05-08 株式会社浅野研究所 thermoforming method
JP7317410B1 (en) 2022-08-05 2023-07-31 株式会社浅野研究所 thermoforming equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3777258D1 (en) * 1986-07-02 1992-04-16 Gen Motors Corp PRODUCTION OF BODY PARTS WITH LACQUERED CARRIER FILMS APPLIED TO IT.
JPH0516218A (en) * 1991-07-15 1993-01-26 Hitachi Chem Co Ltd Vacuum mold for formed article with skin
JP3253654B2 (en) * 1991-11-14 2002-02-04 大日本印刷株式会社 Vacuum press lamination molding method
JPH0811200A (en) * 1994-06-30 1996-01-16 Dainippon Printing Co Ltd Vacuum press laminate molding method and apparatus
JP3937231B2 (en) * 2004-03-16 2007-06-27 布施真空株式会社 Core material coating apparatus and method
FR2902105B1 (en) * 2006-06-13 2008-09-12 Essilor Int METHOD FOR BONDING A FILM TO A CURVED SUBSTRATE
JP2012096416A (en) * 2010-10-31 2012-05-24 Fuse Shinku Kk Vacuum molding machine, substrate for vacuum molding machine, and vacuum molding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111791468A (en) * 2019-04-04 2020-10-20 本田技研工业株式会社 Resin molding apparatus and resin molding method
CN111791468B (en) * 2019-04-04 2022-06-17 本田技研工业株式会社 Resin molding apparatus and resin molding method

Also Published As

Publication number Publication date
WO2016171175A1 (en) 2016-10-27
TWI709476B (en) 2020-11-11
JP5791842B1 (en) 2015-10-07
JP2016203466A (en) 2016-12-08

Similar Documents

Publication Publication Date Title
US9364992B2 (en) Thermoforming device and thermoforming method using hot plate heating
TW201720624A (en) Thermoforming apparatus
EP3138682A1 (en) Thermoforming apparatus
JP5957131B1 (en) Thermoforming apparatus and thermoforming method
TW201703978A (en) Thermoforming apparatus and thermoforming method
US10173361B2 (en) Vacuum forming method
JPH0531743A (en) Vacuum press laminate molding method and its device
TWI645951B (en) Resin molding method and resin molding mold
JP6787251B2 (en) Manufacturing method of film decorative parts and their sticking equipment
TW201934457A (en) Vacuum suction method and vacuum suction device prevents wrinkles from being generated when the flexible sheet is adsorbed
JPH03286835A (en) Method of decorating molded object
JP6871107B2 (en) Thermoforming equipment and thermoforming method
TWI754344B (en) Film laminator and film lamination method
JP7268855B2 (en) thermoforming method
JP2013107322A (en) Forming method
JP6769781B2 (en) Decorative molding equipment, manufacturing method of decorative molded products and molding jigs
KR20180086802A (en) Chamber and method for adhering thermal transfer film
JP5680782B1 (en) Thermoforming apparatus and thermoforming method
JPS61242826A (en) Laminating device for decorative sheet
JPH0737197B2 (en) Manufacturing method of painted products