WO2014132819A1 - Procédé de fabrication d'un filtre couleur et dispositif d'affichage à cristaux liquides - Google Patents

Procédé de fabrication d'un filtre couleur et dispositif d'affichage à cristaux liquides Download PDF

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Publication number
WO2014132819A1
WO2014132819A1 PCT/JP2014/053504 JP2014053504W WO2014132819A1 WO 2014132819 A1 WO2014132819 A1 WO 2014132819A1 JP 2014053504 W JP2014053504 W JP 2014053504W WO 2014132819 A1 WO2014132819 A1 WO 2014132819A1
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WIPO (PCT)
Prior art keywords
light
layer
color filter
pixel pattern
exposure
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Application number
PCT/JP2014/053504
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English (en)
Japanese (ja)
Inventor
大樹 速井
英俊 中川
淳子 梅澤
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堺ディスプレイプロダクト株式会社
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Publication of WO2014132819A1 publication Critical patent/WO2014132819A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography

Definitions

  • the present invention relates to a method of manufacturing a color filter for one screen by divided exposure using a photomask, and a liquid crystal display device including the color filter.
  • liquid crystal display panels using TFTs have been widely used for display devices that display video and images.
  • TFTs Thin Film Transistors
  • a photolithography technique is used in manufacturing a liquid crystal display panel, a semiconductor element, a printed circuit board, and the like.
  • a predetermined pattern to be transferred to the substrate is formed on the photomask using a light shielding member, and the predetermined pattern is formed on the substrate by irradiating the substrate with light that has passed through a portion other than the predetermined pattern. Is transferred to.
  • the color filter used in the liquid crystal display panel is formed using such a photolithography technique. With the recent increase in size of liquid crystal display panels, the size of manufactured color filters has also increased.
  • division exposure is employed in which the entire surface of the black matrix layer and the photoresist layer is exposed by dividing the glass substrate into several regions.
  • a photoresist layer containing a black pigment or dye is applied to the surface of the glass substrate to form a black matrix layer, and the entire surface of the black matrix layer is exposed by divided exposure.
  • a desired black matrix pattern is formed by removing a portion irradiated with light for exposure (or a portion not irradiated).
  • a photoresist layer containing a specific color pigment or dye is applied to form a photoresist layer, and a desired pixel pattern is formed on the photoresist layer by divided exposure and subsequent development steps.
  • the photoresist layer is formed on the black matrix (light-shielding layer)
  • non-uniformity in the thickness direction of the photoresist layer is caused in the plane of the display surface due to the difference in the amount of photoresist that runs on the black matrix. Occurs.
  • Such non-uniformity of the thickness of the photoresist layer becomes color unevenness and is visually recognized by the viewer.
  • color unevenness may be emphasized due to misalignment of the mask position of the light shielding layer and the colored layer at the same location in the plane (for example, the opening edge of the black matrix). There has been a problem that unevenness is easily visible to the viewer.
  • the present invention has been made in view of such circumstances, and a color filter manufacturing method and a liquid crystal display capable of reducing color unevenness as a whole while avoiding emphasis on color unevenness for each colored layer.
  • An object is to provide an apparatus.
  • the method for producing a color filter of the present application includes a step of applying a light-shielding photoresist layer or a light-transmitting photoresist layer on a light-transmitting substrate, and a photomask having a predetermined pixel pattern
  • the step of sequentially exposing the exposed areas exposed by the above and exposing the photoresist layer is sequentially repeated to manufacture a color filter having a light shielding layer formed according to the pixel pattern and two or more colored layers.
  • the pixel pattern of the photomask is different in each of the light shielding layer and the colored layer at a portion where a plurality of exposure regions in the display region are joined.
  • the color filter manufacturing method of the present application is characterized in that when forming the light-shielding layer and the colored layer of each color, the photoresist layer is exposed by overlapping a plurality of exposure regions to be joined together. .
  • the color filter manufacturing method of the present application is characterized in that the pixel pattern in a region where a part of the exposure region overlaps is an irregular pattern.
  • the pixel pattern in a region where a part of the exposure region overlaps is a coarse / dense pattern in which pixels change from dense to coarse as they move from the center to the end of the exposure region. It is characterized by that.
  • the liquid crystal display device of the present application includes a color filter manufactured by the above-described manufacturing method, and a liquid crystal panel that controls the amount of light transmitted through the color filter.
  • the pixel pattern of the photomask is a different pattern in each of the light shielding layer and the colored layer at the portion where the plurality of exposed regions in the display region are joined, for example, the exposure position of each colored layer
  • the photoresist will run on the light-shielding layer at the same location, and that the positional deviation of the light-shielding layer and the color layer may intensify. Will be less. For this reason, it is possible to avoid emphasizing color unevenness for each colored layer, and it is possible to reduce color unevenness as a whole.
  • FIG. 1 is a diagram showing an outline of a method for manufacturing a color filter according to the present embodiment.
  • the color filter according to the present embodiment is a color filter used in a liquid crystal display device.
  • the color filter is formed on a light-transmitting substrate 10 such as a glass substrate, and has a light shielding layer 20 (see FIG. 3) having an opening 20H corresponding to a desired pixel pattern, and is formed on the light shielding layer 20.
  • a light-transmitting substrate 10 such as a glass substrate
  • a light shielding layer 20 see FIG. 3
  • color layers 21 to 23 see FIG. 4 that transmit light of RGB colors are provided.
  • Photolithographic techniques can be used to form the light shielding layer 20 and the colored layers 21 to 23.
  • the photoresist layer 201 is formed by applying a photoresist containing a specific color (red) pigment or dye.
  • the entire surface of the photoresist layer 201 is exposed by exposing the surface in several regions.
  • the color layers 21 to 23 of a plurality of colors are formed by sequentially performing such divided exposure and subsequent development on the photoresist layers of the respective colors.
  • FIG. 1 first, the left side region 10L of the photoresist layer 201 formed on the substrate 10 is exposed using the photomask 301 (FIG. 1A), and then the photomask 301 is shifted in position to perform photo The right region 10R of the resist layer 201 is exposed (FIG. 1B).
  • divided exposure is performed by shifting the position of the photomask 301 so that adjacent exposure regions (the left region 10L and the right region 10R in the example shown in FIG. 1C) partially overlap (FIG. 1C). ).
  • An area where adjacent exposure areas partially overlap is hereinafter referred to as a mask joint 10C.
  • the photomask 301 is made of, for example, a transparent substrate such as glass or quartz, and a pixel pattern to be formed on the surface of the photoresist layer 201 is formed on one surface thereof with a light-shielding film such as chromium (Cr).
  • the photomask 301 is installed in the exposure apparatus so that the one surface side where the pixel pattern is formed faces the photoresist layer 201 to be exposed.
  • the exposure apparatus includes a light source that emits light to be irradiated onto the photoresist layer 201, a mirror that collects light from the light source, and the like, and a photomask 301 is provided on the surface of the photoresist layer 201 formed on the substrate 10.
  • the light for exposure is irradiated through.
  • the pixel pattern formed on the photomask 301 is projected onto the surface of the photoresist layer 201.
  • the part of the photoresist layer 201 irradiated with light by the exposure apparatus changes, for example, the solubility in the developer, and the part irradiated with light (or the part not irradiated with light) is removed in the subsequent development process.
  • a pixel pattern corresponding to the pattern of the photomask 301 is formed on the colored layer 21.
  • a light-shielding shutter is provided on the light source side to shield the non-exposure area from light. It is desirable to keep it.
  • a mark (alignment mark) indicating the reference of the exposure position is formed on the substrate 10, and the mask position for exposing each exposure region is determined and adjusted using this mark. .
  • FIG. 2 is an explanatory diagram for explaining a method of adjusting the position of the exposure region.
  • the alignment marks 11L and 11R can be formed in the same process as the process of forming the light shielding layer 20 on the substrate 10.
  • the light shielding layer 20 is composed of a black matrix formed by a photolithography technique using a black photoresist, and is formed by an exposure process and a development process using a photomask 300, similarly to the colored layer 21.
  • the photoresist layer 200 in the left region 10L is exposed using a photomask 300 and developed. By removing unnecessary portions, the light shielding layer 20 and the alignment mark 11L in the left region 10L are formed.
  • the photoresist layer 200 in the right region 10R is exposed using the photomask 300, and unnecessary portions are removed by development processing, thereby forming the light shielding layer 20 and the alignment mark 11R in the right region 10R. is doing. Note that the positions of the alignment marks 11L and 11R in FIG. 2 are merely examples.
  • the alignment marks 11L and 11R formed on the substrate 10 in the same process as the light shielding layer 20 are read by the camera on the exposure apparatus, and the photomask 301 for exposing the photoresist of the colored layer 21 (for example, red) is exposed. Determine and adjust the position.
  • FIG. 3 and FIG. 4 are schematic diagrams showing the manufacturing process of the light shielding layer 20 and the colored layers 21 to 23. 3 and 4 show the light shielding layer 20 and the colored layers 21 to 23 in the mask joint portion 10C.
  • a translucent substrate 10 such as a glass substrate
  • a photoresist layer 200 having a thickness of about 1 ⁇ m is formed by applying a black photoresist to one surface side of the substrate 10. (FIG. 3B).
  • the left region 10L (the left region of the photoresist layer 200) is exposed and developed, thereby opening corresponding to the pixel position. 20H is formed (FIG. 3C).
  • the right region 10R is preferably shielded from light by a light shielding shutter or the like.
  • the right region 10R (the region on the right side of the photoresist layer 200) is exposed and developed to form an opening 20H corresponding to the pixel position (FIG. 3D).
  • the portion where the light shielding layer 20 is formed does not transmit light from the back surface of the substrate 10, and the portion where the opening 20 ⁇ / b> H is provided transmits light from the back surface of the substrate 10.
  • a translucent pattern is formed.
  • the alignment marks 11L and 11R described above are formed on the substrate 10 together with the light shielding layer 20 by these exposure processing and development processing.
  • a photoresist of a specific color (for example, red) is applied to form a photoresist layer 201 with a thickness of about 1 ⁇ m on the entire surface of the substrate 10 on which the light shielding layer 20 is formed (FIG. 3E).
  • the photoresist layer 201 formed in the left region 10L is exposed and developed, whereby a specific color light is transmitted through a predetermined pixel pattern.
  • Layer 21 (pixel) is formed (FIG. 4A).
  • the photoresist layer 201 formed in the right region 10R is exposed and developed to transmit light of a specific color with a predetermined pixel pattern.
  • a colored layer 21 (pixel) is formed (FIG. 4B). At this time, the colored layer 21 is located in a predetermined opening 20H of the light shielding layer 20 and partially formed on the light shielding layer 20.
  • a photoresist layer 202 is formed with a thickness of about 1 ⁇ m on the entire surface of the substrate 10 by applying a photoresist of another color (for example, green) (FIG. 4C). Then, the photoresist layer 202 formed in the left region 10L is exposed and developed with reference to the position of the alignment mark 11L or 11R, and formed in the right region 10R with reference to the position of the alignment mark 11L or 11R. The exposed photoresist layer 202 is exposed and developed to form a colored layer 22 corresponding to the color on the substrate 10 (FIG. 4D). In the same process, a colored layer 23 corresponding to another color (for example, blue) can be formed on the substrate 10 (FIG. 4E).
  • a photoresist layer 202 is formed with a thickness of about 1 ⁇ m on the entire surface of the substrate 10 by applying a photoresist of another color (for example, green) (FIG. 4C). The exposed photoresist layer 202 formed in the left region 10
  • the colored layers 21 to 23 in the left region 10L and the right region 10R can be formed in alignment with the opening 20H of the light shielding layer 20, but the light shielding layer 20 and There is basically an accuracy error in the alignment of the colored layers 21 to 23.
  • the effect of misalignment due to the alignment error is significant, and the light shielding layer is caused by the misalignment from the ideal coordinates caused by the alignment error accuracy of the photomasks 300 and 301 and the like.
  • the amount of color resist running on 20 differs between the left and right sides of the mask joint portion 10C.
  • FIG. 5 is an explanatory diagram for explaining the amount of color resist on the light shielding layer 20.
  • the colored layers 21 and 22 run on the light shielding layer 20 in the mask joint portion 10 ⁇ / b> C.
  • the colored layer 21 is formed by exposing and developing the left region 10L
  • the colored layer 22 is formed by exposing and developing the right region 10R.
  • the mask position of the light shielding layer 20 with respect to the substrate 10 is shifted to the right side and the light shielding layer 20 is shifted to the right side, or the mask position of the colored layer 22 in the right region 10R is shifted to the left side, and the colored layer 22 is shifted to the left side.
  • the amount of the color resist that the colored layer 22 in the right region 10R rides on the light shielding layer 20 is larger than that in the colored layer 21 in the left region 10L.
  • a film thickness difference occurs in the colored layer 21 in the mask joint portion 10C, and this may be visually recognized as color unevenness. In particular, when such color unevenness appears on a straight line in the display surface, it is easy for the viewer to visually recognize.
  • the pixel pattern on the mask in the mask joint portion 10C when forming the light shielding layer 20 and the colored layers 21 to 23 is configured by random density in units of one pixel, thereby enabling the viewer This reduces the degree to which the color unevenness is visually recognized.
  • FIG. 6 is a schematic diagram showing pixel patterns in the left region 10L and the right region 10R.
  • FIG. 6A and FIG. 6B show pixel patterns separately for the left region 10L and the right region 10R for convenience.
  • the pixel patterns of the mask joint portion 10C belonging to the left region 10L and the right region 10R each form a random pattern. However, when these patterns are joined at the mask joint portion 10C, a uniform pattern is obtained.
  • mutually complementary patterns are formed (FIG. 6C).
  • the pixel pattern is formed so that the right side is rough and the inner side is dense.
  • the pixel pattern is formed so that the left side is rough and the inner side is dense.
  • the alignment mark 11R on the right side is read with the camera of the exposure apparatus to align (mating) the photomask 301.
  • the alignment mark 11L on the left side may be read by the camera of the exposure apparatus to align the photomask 301.
  • the photomask 301 for the colored layer 21 is aligned with a mark (light shielding layer 20) on another exposure region, the positional deviation from the light shielding layer 20 formed immediately below the colored layer 21 is shifted. It is feared that will increase from the past.
  • FIG. 7 is a schematic diagram illustrating an example of a pixel pattern in the light shielding layer 20 and the colored layer 21.
  • 7A shows a part of the pixel pattern of the left region 10L in the light shielding layer 20
  • FIG. 7B shows a part of the pixel pattern of the right region 10R in the light shielding layer 20.
  • the pixel pattern is formed by random density in each region, and the left and right are complementary patterns.
  • FIG. 7C shows a pixel pattern of the left region in the colored layer 21 of a specific color (for example, red), and FIG. 7D shows a pixel pattern of the right region in the colored layer 21 of the same color (red).
  • the pixel pattern is configured by random density in each region, and the left and right are configured in a complementary pattern, similar to the light shielding layer 20, but each pixel pattern itself is different from the light shielding layer 20. Yes.
  • a pixel pattern different from the pixel pattern in the light shielding layer 20 and the red colored layer 21 is used. adopt.
  • the pixel pattern on the mask in the mask joint portion 10C is changed for each of the light shielding layer 20 and the colored layers 21 to 23, it is directly below the exposure position alignment of the colored layers 21 to 23.
  • the alignment mark 11L or 11R other than the above is used, the possibility that the photoresist may run on the light shielding layer 20 may occur at the same location, and the positional deviation of the light shielding layer 20 and the color layers 21 to 23 may be misaligned. Are less likely to strengthen each other. For this reason, in the present embodiment, it is possible to avoid emphasizing color unevenness for each of the colored layers 21 to 23, and to reduce color unevenness as a whole.
  • a pixel pattern constituted by random density is used for each of the colored layers 21 to 23, but a regular pattern or a combination of a plurality of regular patterns may be used.
  • FIG. 8 is a schematic diagram showing another example of a pixel pattern.
  • the pixel pattern in FIG. 8A shows a checkered pattern in which colored pixels and non-colored pixels are alternately arranged.
  • the pixel pattern in FIG. 8B shows a pattern in which colored portions for two pixels and non-colored portions for one pixel are repeatedly arranged in the left-right direction.
  • the pixel pattern of FIG. 8C shows a pattern in which the lower left region in the pattern region is configured by pixels of the colored portion and the upper right region is configured by an image of the non-colored portion.
  • the pixel pattern in FIG. 8D shows a pattern in which patterns made up of pixels in the colored portion are repeatedly arranged.
  • each of these patterns is a regular pattern.
  • the pixel pattern is changed for each colored layer 21, for example, in the colored layer 21 of a specific color (for example, red)
  • the pixel pattern of FIG. 8A By adopting the pixel pattern of FIG. 8A, the pixel pattern of FIG. 8B in the colored layer 22 of another color (for example, green), and the pixel pattern of FIG. 8C in the colored layer 23 of another color (for example, blue).
  • the regularity of the pattern is reduced, and the color unevenness on the straight line is less likely to be visually recognized in the display surface.
  • FIG. 9 is a schematic diagram showing an example of a liquid crystal display device including the color filter according to the present embodiment.
  • the liquid crystal display device according to the present embodiment includes an LCD module including a TFT side glass substrate 110, a liquid crystal layer 120 formed by enclosing a liquid crystal substance, and a CF side glass substrate 130.
  • a pixel electrode 111 for forming a pixel On the one side of the TFT side glass substrate 110, a pixel electrode 111 for forming a pixel, a TFT 112 connected to the pixel electrode 111, and an alignment film 113 are laminated.
  • the color filter 131 including the light shielding layer 20 and the colored layers 21 to 23, the counter electrode 132, and the alignment film 133 are stacked on the one side of the CF side glass substrate 130.
  • the backlight unit 150, the diffusion plate 151, and the polarizing plate 152 are provided on the back side of the LCD module (the other side of the TFT side glass substrate 110).
  • a polarizing plate 134 and a protective glass 135 are provided on the front side of the LCD module (the other side of the CF side glass substrate 130).
  • the backlight unit 150 is, for example, an edge light type backlight having a light source that emits light to the light guide plate from the side and a light guide plate that emits light incident from the side to the LCD module side, or the TFT side It is comprised by the direct type
  • the polarizing plate 152 is disposed on the surface of the TFT side glass substrate 110, and the polarizing plate 134 is disposed on the surface of the CF side glass substrate 130.
  • the polarizing plates 134 and 152 are provided so as to transmit linearly polarized light orthogonal to each other.
  • the diffusion plate 151 is disposed between the polarizing plate 152 and the backlight unit 150, and has a function of diffusing light emitted from the backlight unit 150 in all directions.
  • the protective glass 135 is disposed on the surface of the polarizing plate 134 opposite to the side facing the CF side glass substrate 130 and has a function of protecting the LCD module.
  • the linearly polarized light transmitted through the polarizing plate 152 out of the light emitted from the backlight unit 150 passes through the liquid crystal layer 120 and enters the polarizing plate 134.
  • the polarization state of the light transmitted through the liquid crystal layer 120 can be changed by a voltage applied to the liquid crystal layer 120. Therefore, a voltage corresponding to the video signal is applied to the pixel electrode 111 and the counter electrode 132, and an electric field is applied to the liquid crystal layer 120, thereby changing the polarization state of the light passing through the liquid crystal layer 120 and passing through the polarizing plate 134.
  • An optical image can be formed by controlling the amount of light to be emitted.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
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Abstract

La présente invention concerne un procédé de fabrication d'un filtre couleur et un dispositif d'affichage à cristaux liquides, l'irrégularité de couleur due à des erreurs d'alignement d'un motif de pixels pouvant être réduite. La présente invention concerne un procédé de fabrication d'un filtre couleur doté de deux couches colorées ou plus et d'une couche de blocage de la lumière conformément à un motif de pixels, par la répétition dans l'ordre d'une étape permettant d'appliquer une couche de photoréserve pour bloquer la lumière ou une couche de photoréserve pour transmettre la lumière d'une couleur spécifique sur un substrat transparent, puis d'une étape permettant d'épisser une région d'exposition pour une exposition à la lumière par un photomasque possédant un motif prédéfini de pixels et d'exposer la couche de photoréserve à la lumière, le motif de pixels du photomasque étant différent entre la couche de blocage de la lumière et les couches colorées dans une zone où une pluralité de régions d'exposition sont épissées dans une région d'affichage.
PCT/JP2014/053504 2013-02-26 2014-02-14 Procédé de fabrication d'un filtre couleur et dispositif d'affichage à cristaux liquides WO2014132819A1 (fr)

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JP2013035977 2013-02-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117031A1 (fr) * 2015-01-20 2016-07-28 堺ディスプレイプロダクト株式会社 Procédé de production d'affichage à cristaux liquides et masque d'exposition
CN115793313A (zh) * 2022-10-25 2023-03-14 福州京东方光电科技有限公司 显示面板、电子设备及显示面板的制作方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH06324474A (ja) * 1993-05-10 1994-11-25 Nikon Corp フオトマスク及び露光方法
JP2006235258A (ja) * 2005-02-25 2006-09-07 Toppan Printing Co Ltd フォトマスク及び液晶表示装置用カラーフィルタの製造方法
WO2009037965A1 (fr) * 2007-09-19 2009-03-26 Sharp Kabushiki Kaisha Procédé de fabrication de panneau d'affichage à cristaux liquides et photomasque

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06324474A (ja) * 1993-05-10 1994-11-25 Nikon Corp フオトマスク及び露光方法
JP2006235258A (ja) * 2005-02-25 2006-09-07 Toppan Printing Co Ltd フォトマスク及び液晶表示装置用カラーフィルタの製造方法
WO2009037965A1 (fr) * 2007-09-19 2009-03-26 Sharp Kabushiki Kaisha Procédé de fabrication de panneau d'affichage à cristaux liquides et photomasque

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117031A1 (fr) * 2015-01-20 2016-07-28 堺ディスプレイプロダクト株式会社 Procédé de production d'affichage à cristaux liquides et masque d'exposition
JPWO2016117031A1 (ja) * 2015-01-20 2017-10-26 堺ディスプレイプロダクト株式会社 液晶表示装置の製造方法及び露光マスク
US10234712B2 (en) 2015-01-20 2019-03-19 Sakai Display Products Corporation Method for producing liquid crystal display apparatus with a uniform cell gap
CN115793313A (zh) * 2022-10-25 2023-03-14 福州京东方光电科技有限公司 显示面板、电子设备及显示面板的制作方法
CN115793313B (zh) * 2022-10-25 2024-05-03 福州京东方光电科技有限公司 显示面板、电子设备及显示面板的制作方法

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