WO2014131218A1

WO2014131218A1 - Cutting method of single-layer array glass substrate and cutting system

Info

Publication number: WO2014131218A1
Application number: PCT/CN2013/073598
Authority: WO
Inventors: 吴俊纬; 刘翔; 李禹奉; 王刚
Original assignee: 京东方科技集团股份有限公司
Priority date: 2013-02-27
Filing date: 2013-04-02
Publication date: 2014-09-04
Also published as: CN103121794B; CN103121794A

Abstract

A cutting method of a single-layer array glass substrate comprises: providing a simulated glass substrate material, assembling a single-layer array glass substrate material that is formed with an array unit with the simulated glass substrate material into a double-glass simulated substrate material through an alignment and attaching process, cutting the double-glass simulated substrate material to form a double-glass simulated substrate, and separating the double-glass simulated substrate to obtain a single-layer array glass substrate. A cutting apparatus used for the single-layer array glass substrate comprises an alignment and attaching machine, a cutting machine and a substrate separating machine.

Description

Cutting method and cutting system for single-layer array glass substrate

The invention relates to a single layer array glass substrate cutting method and a cutting system. Background technique

At present, the most common is the cutting process for a double-glazed substrate, such as an LCD substrate, for the field of cutting a glass substrate for a display device. For double-glazed substrates, cutting is usually performed by a cutter using a suspended cutting mode. Since the double-layer glass plate can effectively protect various components installed inside, it can effectively prevent the splashed glass particles generated by the two-wheel cutting device from scratching the internal components. Moreover, when it is gripped by the chuck on the transfer table, the glass substrate located on the upper layer can effectively prevent the chuck from physically damaging the internal components.

And if the single-layer array glass substrate is cut by the suspension cutting mode, for example

TOUCH or OLED substrates are obviously not suitable and will result in low yield of finished products. The main reason is that the array unit of the single-layer array glass substrate is disposed on the glass substrate, that is to say, when the two-wheel cutting device performs the opposite-direction cutting, the glass particles which are easily splashed are scratched by the array unit. Moreover, if the wheelbase between the cutting wheels of the existing two-wheel cutting device is not adjusted, it is easy to cause an unfavorable phenomenon due to the double wheel holding. Specifically, only the upper cutting wheel performs cutting, and the lower cutting wheel does not contact the glass substrate due to the long distance, so that the opposite cutting of the glass substrate cannot be formed. This causes the slits of the glass substrate to be irregular or even broken, thereby increasing the defective rate of the single-layer array glass substrate. Moreover, since the single-layer array glass substrate is covered and protected by the chuck on the transfer table, it is obvious that the chuck is easily physically damaged.

For the above reasons, the existing cutting process for a single-layer array glass substrate mostly adopts a non-suspended cutting mode, which can cut the glass substrate by a single cutting wheel, thereby avoiding the problem of damage of the glass substrate slit, but When the single-wheel cutting device is cut, the splashed glass particles are also generated, thereby causing scratches on the array unit; at the same time, the damage to the array unit when the chuck is gripped cannot be avoided. Summary of the invention

According to an embodiment of the present invention, a method for cutting a single-layer array glass substrate is provided, which The method comprises: providing a simulated glass substrate; assembling a single-layer array glass substrate formed with an array unit and the provided simulated glass substrate into a double-glass simulated substrate by a matching process; cutting the double-glass simulated substrate to form a double A glass-simulated substrate; and a separation process of the double-glass dummy substrate to obtain a single-layer array glass substrate.

In some embodiments, the assembling into a double glass dummy substrate by a joining process may include: coating a sealant on the single layer array glass substrate or the simulated glass substrate; And the single-layer array glass substrate is mounted in pairs to form a double-glass dummy substrate in an uncured state; and the sealant in the uncured state double-glass dummy substrate is semi-cured to form the double Glass simulated substrate.

Preferably, the cutting method may further comprise the step of performing a sanding process on the double glass dummy substrate after forming the double glass dummy substrate and before performing the separation process on the double glass dummy substrate.

Preferably, the cutting method may further comprise the step of performing a cleaning process on the polished double glass dummy substrate prior to performing the separation process on the dual glass dummy substrate.

Preferably, the cutting method may further comprise the step of encapsulating the separated single-layer array glass substrate.

Preferably, the cutting method may further comprise the step of pre-laying a mask for shielding the array unit in the single-layer array glass substrate on the simulated glass substrate before assembling the double-glass dummy substrate by a joining process. .

According to the present invention, there is also provided a cutting system for a single-layer array glass substrate, comprising: a matching machine for assembling a single-layer array glass substrate formed with an array unit and a simulated glass substrate into a double a glass simulated substrate; a cutting machine for cutting a double glass dummy substrate into a double glass dummy substrate; and a substrate separator for separating the double glass dummy substrate.

In some embodiments, the coupler may include: a gluing device for applying a sealant on a single-layer array glass substrate or a simulated glass substrate; a flip-over device for simulating a glass substrate Interposed with a single-layer array of glass substrates; and a sealant curing machine configured to semi-cure the sealant in a dual glass simulated substrate.

Preferably, the cutting system may further comprise a sanding polisher for sanding the double glass analog substrate.

Preferably, the cutting system may further comprise a substrate cleaning machine for pairing the polished double Glass simulation substrate for cleaning, the drawing

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below. It is obvious that the drawings in the following description relate only to some embodiments of the present invention, rather than to the present invention. limit.

1 is a schematic flow block diagram of a cutting method in accordance with an embodiment of the present invention.

2 is a schematic structural view (cross-sectional view) of a double glass dummy substrate according to an embodiment of the present invention. detailed description

1 is a schematic flow block diagram of a single layer array glass substrate cutting method in accordance with an embodiment of the present invention. As shown in FIG. 1, the cutting method includes:

Step 1: Provide a simulated glass substrate;

Step 2: assembling the single-layer array glass substrate on which the array unit is formed and the provided simulated glass substrate into a double glass dummy substrate by a matching process;

Step 3: cutting the double glass dummy substrate to form a double glass dummy substrate; and Step 4: separating the double glass dummy substrate to obtain a single layer array glass substrate. The simulated glass substrate described in this embodiment may be a common glass substrate.

The dual glass dummy substrate described in this example comprises a simulated glass substrate and a single layer array glass substrate. For example, a simulated glass substrate can be on the upper layer and a single layer array glass substrate can be on the lower layer. A plurality of array elements arranged according to design requirements are distributed on the single-layer array glass substrate. The simulated glass substrate and the single layer array glass substrate are joined by a sealant coated between the two to provide excellent protection of the array unit within the dual glass dummy substrate. The coating of the sealer can be distributed in a dotted manner. A glued area line is pre-labeled on the single layer array glass substrate or the simulated glass substrate for dot coating of the sealant.

According to an embodiment of the present invention, a method of mounting the simulated glass substrate on a single-layer array glass substrate is employed to simulate a cutting process of a double-layer glass substrate. By protecting the array unit by simulating the glass substrate, it can effectively avoid the scratch caused by the glass splash in the suspension cutting mode or the non-suspended cutting mode, and can solve the double wheel in the suspension cutting mode. The problem of adaptability between the pitch and the thickness of the single-layer array glass substrate saves the process of adjusting the track. In addition, it can effectively avoid physical damage to the array unit when the chuck is gripped, and improve the cutting quality. It proves the quality of the finished product and reduces the bad product rate.

According to some embodiments, the matching process may include the following steps:

(1) Applying a sealant to the single-layer array glass substrate or the simulated glass substrate. Preferably, the sealant is applied in a dot pattern along the glue application area provided on the single layer array glass substrate. The sealant may be, for example, a frame sealant for use in the field of liquid crystal displays in which glass fiber (glass fiber) is mixed. The sealant may have a coating thickness of, for example, 50 μm, which serves to support the thickness of the case. The use of point-like spray sealant technology provides a strong guarantee for the separation process. Since the simulated glass substrate and the single-layer array glass substrate are connected by a multi-point sealant, the simulated glass substrate and the single-layer array glass can be easily used. The substrate is separated; at the same time, the difficulty of removing the sealant after separation is reduced.

(2) The simulated glass substrate and the single-layer array glass substrate are vacuum-fitted together by a sealant to form a double-glass dummy substrate in an uncured state. The uncured state described in the present embodiment means a state in which the sealant is not condensed. At this time, the connection between the simulated glass substrate at the upper end and the single-layer array glass substrate at the lower end of the double glass dummy substrate is not sufficiently stable, and the connection stability between the two is insufficient to support the double glass dummy substrate for cutting. . Therefore, a sealant curing process is required to provide a dual glass simulated substrate with sufficient support and stability to support its cutting.

(3) Semi-curing the sealant in the uncured dual glass dummy substrate to form a double glass dummy substrate. The semi-cured irradiation refers to controlling the degree of curing so that the sealant is cured to a semi-condensed state. For example, a UV-curable sealant may be employed, and a UV curing machine may be used to semi-cure the sealant. Specifically, the UV curing machine is controlled to cure the colloid of the sealant to a semi-condensed state by ultraviolet light irradiation. The connection between the simulated glass substrate of the semi-cured dual glass simulated substrate and the single layer array glass substrate is relatively stable, but the two are not completely fixed. The degree of semi-curing can be chosen such that the connection stability between the simulated glass substrate and the single-layer array glass substrate allows the double-glass simulated substrate to withstand the degree of cutting force; while providing a separation process for the dual glass simulated substrate The relatively convenient conditions make the separation of the simulated glass substrate of the double glass dummy substrate and the single layer array glass substrate relatively easier, and the progress of the production of the single layer array glass substrate is not affected by the adhesion being too strong to be separated. The UV (ultraviolet light) curing machine may include an ultraviolet light irradiation device, a conveying device, a ventilation device, a detection result unit, and a system control unit. In the curing process, in order to avoid strong ultraviolet light from illuminating the array unit of the double glass dummy substrate, the double glass dummy substrate is first placed on the base of the light leakage detecting substrate and the light leakage detecting device, and then on the double glass dummy substrate. Set a mask, such as a UVmask film (UV mask), for occlusion and protection The double glass simulates the array unit of the substrate; at the same time, the sealant is exposed to, for example, strong ultraviolet light for curing. By controlling parameters such as ultraviolet light intensity and internal temperature, for example, the irradiation amount is adjusted from 5000 mW/cm ² (milliwatts/cm ² ) used in the complete curing to between 1000 and 2000 mW/cm ² to seal The agent cures to a semi-cured state. Although the UV curing mechanism and the UV curing machine are specifically mentioned herein, the invention is not limited thereto, and other known or future embodiments suitable for curing the sealant to a semi-cured state may be employed in other embodiments of the invention. Developed technologies and devices.

In order to perform a cutting process on a double glass dummy substrate to form a double glass dummy substrate, a cutter dedicated to cutting a glass display substrate may be employed. The cutter can automatically cut the dual glass dummy substrate in either a suspended cut mode or a non-suspended cut mode. The suspended cutting mode refers to: placing a double glass dummy substrate on a transfer table for transfer; when the cutting position on the double glass dummy substrate travels to the position of the two-wheel cutting device, through the two-wheel cutting device The upper and lower wheels press the double glass dummy substrate in the middle, at which time the end of the double glass simulated substrate to be cut is in a suspended state; the lower cutting wheel of the double wheel cutting device applies a cutting force upward, and the upper cutting wheel applies a cutting force downward. , cooperate with each other to cut the double glass analog substrate into a piece of double glass analog substrate. The non-suspended cutting mode refers to: placing a double glass simulated substrate on a transfer table for transfer; when the cutting position on the double glass simulated substrate travels to the position of the single wheel cutting device, through the single wheel cutting device The upper cutting wheel presses the double glass dummy substrate on the transfer table, at which time the end of the double glass simulated substrate to be cut is located on the transfer table in a non-suspended state; the upper cutting wheel applies a cutting force and a transfer downward. The table cooperates to cut the double glass dummy substrate into a piece of double glass analog substrate.

Preferably, the double glass dummy substrate is subjected to a sanding process after forming the double glass dummy substrate and before performing the separation process on the double glass dummy substrate. The sanding process can be accomplished using a sanding polisher that includes a base and a frame mounted on the base on which the polishing shaft is mounted. A translation stage is disposed below the polishing shaft, and a locking device for fixing the double glass dummy substrate is disposed on the translation stage. The polishing shaft is provided with a soft brush member. The polishing shaft is connected with a rotary driving motor (not shown), and the shifting table is connected with a displacement driving motor; the rotating driving motor drives the polishing shaft to rotate to complete the polishing and polishing work on the double glass analog substrate; The motor drives the translation stage to perform horizontal displacement to achieve all-round polishing of the double glass analog substrate. Although a specific sanding and polishing machine construction, known or future developed sanding and polishing machine is described above. Double-glass analog substrate using the above polishing and polishing machine When polishing and polishing, the double glass dummy substrate, especially the edge incision, is polished and polished by a soft brush to make it smoother. The use of the polished and polished double glass analog substrate effectively improves the quality of the substrate cutting process and improves the product quality.

Further, preferably, the cleaning process of the polished double glass dummy substrate is performed before the separation process of the double glass dummy substrate. For the cleaning, a known or future developed cleaning machine suitable for cleaning the glass substrate may be employed.

The double glass dummy substrate is separated by a substrate separator to obtain a single layer array glass substrate. 2 is a schematic view showing the structure of a double glass dummy substrate according to an embodiment of the present invention. Referring to FIG. 2, the dual glass dummy substrate includes a dummy glass substrate 101 shown as being located on the upper layer, and a single-layer array glass substrate 102 shown as being located on the lower layer, and the array unit is disposed on the single-layer array glass substrate. 103. The dummy glass substrate and the single-layer array glass substrate are joined by a sealant 104 coated between the two, thereby well protecting the array unit in the double glass dummy substrate. Separation is carried out using a substrate separator. Since the sealant is in a semi-cured state at this time, the dummy glass substrate can be easily removed to obtain a single-layer array glass substrate.

Sealing agent removal is performed on the separated single-layer array glass substrate. In this embodiment, the sealant can be removed by using a chemical reagent (for example, alcohol) to make the single-layer array glass substrate clearer and ensure product quality. At the same time, the separated simulated glass substrate is subjected to sealant removal. The sealant can be removed with chemical reagents to make the simulated glass substrate clearer and provide a guarantee for recycling.

Preferably, a mask may be pre-disposed on the simulated glass substrate for shielding and protecting the array elements in the single-layer array substrate during the curing of the sealant. The mask is, for example, a UV mask. In the embodiment, the UV mask is distributed according to the design position of the array unit; the step of pre-installing the UV mask can be used to compress the cutting process, so that the uncured double glass simulated substrate can be directly and directly sent into the UV curing. The machine performs a semi-curing process of the sealant. In this way, the progress is accelerated and the production efficiency is improved.

According to further embodiments of the present invention, a cutting system for a single layer array glass substrate is also provided. The cutting system comprises: a matching machine for assembling a single-layer array glass substrate formed with an array unit and a simulated glass substrate into a double glass dummy substrate; and a cutting machine for cutting the double glass dummy substrate into A double glass analog substrate; a substrate separator for separating the double glass dummy substrate.

In the cutting system, the combination of the machine, the cutting machine and the substrate separator can be passed separately Strap connection. The cutting machine can be a suspended cutter or a non-suspended cutter for suspending or non-suspending cutting of a double glass simulated substrate.

Preferably, the coupler may comprise a gluing device for applying a sealant on a single-layer array glass substrate or a simulated glass substrate; a flip-over device for using a simulated glass substrate and a single-layer array glass Substrate facing installation; Sealant curing machine for semi-curing of uncured dual glass simulated substrates. The sealant curing machine can be, for example, a UV curing machine. The gluing device, the flipping device and the sealant curing machine may be connected by a conveyor belt, respectively.

Preferably, the cutting system may further comprise a sanding polisher for sanding the dual glass dummy substrate. The sanding and polishing machine can be coupled to the sealant curing machine via a conveyor belt.

Preferably, the cutting system may further comprise a substrate cleaning machine for cleaning the polished double glass dummy substrate. Both ends of the substrate cleaning machine may be connected to the polishing and polishing machine and the substrate separator by a conveyor belt, respectively.

In the embodiment of the present invention, the matching machine, the cutting machine, the UV curing machine, the polishing machine, the substrate cleaning machine and the substrate separating machine may adopt any suitable known or future developed technologies and configurations.

In the single-layer array glass substrate cutting method and cutting system according to the embodiment of the present invention, the cutting process of the double-glazed substrate was simulated by using a method of mounting a simulated glass substrate on a single-layer array glass substrate. In this aspect, the array unit is protected by simulating the glass substrate, which effectively avoids the scratch caused by the glass splash on the array unit during cutting and the physical damage to the array unit when the chuck is gripped; on the other hand, the suspension can be omitted. In the cutting mode, it is necessary to adjust the pitch of the two wheels to suit the thickness of the single-layer array glass substrate, and the tube operation can save time. Therefore, the cutting quality is improved, the quality of the finished product is ensured, and the production efficiency is improved.

In the single-layer array glass substrate cutting method and cutting system according to an embodiment of the present invention, the separation process can be facilitated by a technique using a dot-like spray sealant. Since the simulated glass substrate and the single-layer array glass substrate are connected at a multi-point by a sealant, the simulated glass substrate and the single-layer array glass substrate can be easily separated, and the difficulty in removing the sealant after separation is reduced.

In the single-layer array glass substrate cutting method and cutting system according to an embodiment of the present invention, the connection between the simulated glass substrate and the single-layer array glass substrate can be achieved by curing the sealant to a semi-cured (semi-condensed) state. Relatively stable, but the two are not completely fixed. This between the two The connection stability allows the double glass dummy substrate to withstand the degree of cutting force to provide relatively convenient conditions for the separation process of the dual glass simulated substrate, while at the same time making the simulated glass substrate and the single layer array glass of the double glass dummy substrate The separation of the substrate is relatively easy, and the progress of the separation process is accelerated by not affecting the progress of the single-layer array glass substrate due to the adhesion being too strong to be separated.

In the single-layer array glass substrate cutting method and the cutting system according to the embodiment of the present invention, the double-glass dummy substrate can be smoothed by polishing and polishing the double-glass dummy substrate, especially the edge of the slit, thereby effectively improving the substrate cutting process. Quality, improve product quality.

In the single-layer array glass substrate cutting method and cutting system according to an embodiment of the present invention, the cutting process can be barreled by previously setting a mask in accordance with the design position of the array unit. The uncured double glass dummy substrate can be quickly and directly fed into the sealant curing machine for the semi-curing process of the sealant, which speeds up the process and improves production efficiency.

The technical solutions of the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings. It is apparent that the described embodiments are part of the embodiments of the invention, rather than all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present invention without departing from the scope of the invention are within the scope of the invention.

Claims

claims

1. A method for cutting a single-layer array glass substrate, wherein the method includes: providing a simulated glass substrate;

Assemble the single-layer array glass substrate with the array unit formed on it and the provided simulated glass substrate into a double glass simulated substrate through a joining process;

Cutting the double glass simulation substrate to form a double glass simulation substrate; and performing a separation process on the double glass simulation substrate to obtain a single layer array glass substrate.

2. The cutting method of the single-layer array glass substrate according to claim 1, wherein the assembly of the double glass simulation substrate through the inlay process includes:

Apply a sealant on the single-layer array glass substrate or the simulated glass substrate; and install the simulated glass substrate and the single-layer array glass substrate together to form a double-glass simulation in an uncured state. base material;

The sealant in the uncured double-glass simulated base material is semi-cured to form the double-glass simulated base material.

3. The cutting method of the single-layer array glass substrate according to claim 1 or 2, further comprising the step of performing a polishing process on the double glass simulated substrate after forming the double glass simulated substrate and before performing a separation process on the double glass simulated substrate. .

4. The method for cutting a single-layer array glass substrate according to claim 3, further comprising the step of performing a cleaning process on the polished double-glass simulation substrate before performing a separation process on the double-glass simulation substrate.

5. The method for cutting the single-layer array glass substrate according to any one of claims 1 to 4, further comprising the step of removing the sealant from the separated single-layer array glass substrate.

6. The method for cutting a single-layer array glass substrate according to any one of claims 1 to 5, further comprising pre-arranging a shield on the simulated glass substrate before assembling it into a double-glass simulated substrate through a joining process. The steps of masking the array units in the single-layer array glass substrate are described.

7. A cutting system for single-layer array glass substrates, including:

A laminating machine is used to assemble the single-layer array glass substrate formed with the array unit and the simulated glass substrate into a double glass simulated substrate;

A cutting machine for cutting the double glass simulated substrate into a double glass simulated substrate; and Substrate separator, used to separate double glass simulation substrates.

8. The cutting system for the single-layer array glass substrate according to claim 7, wherein the stacking machine includes:

Gluing device, used to apply sealant on single-layer array glass substrate or simulated glass substrate;

A flip-up coupling device for coupling and installing the simulated glass substrate and the single-layer array glass substrate; and

Sealant curing machine, set up to semi-cure the sealant in the double glass simulated substrate.

9. The cutting system for the single-layer array glass substrate according to claim 7 or 8, further comprising a grinding and polishing machine for performing a grinding process on the double-glass simulated substrate.

10. The cutting system of the single-layer array glass substrate according to claim 9, further comprising a substrate cleaning machine for cleaning the polished double glass simulation substrate.