WO2014128884A1 - Système de communication et dispositif de montage de composant électronique - Google Patents

Système de communication et dispositif de montage de composant électronique Download PDF

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Publication number
WO2014128884A1
WO2014128884A1 PCT/JP2013/054350 JP2013054350W WO2014128884A1 WO 2014128884 A1 WO2014128884 A1 WO 2014128884A1 JP 2013054350 W JP2013054350 W JP 2013054350W WO 2014128884 A1 WO2014128884 A1 WO 2014128884A1
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WIPO (PCT)
Prior art keywords
image data
image
electronic component
unit
processing
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PCT/JP2013/054350
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English (en)
Japanese (ja)
Inventor
伸夫 長坂
神藤　高広
泰章 今寺
重元 廣田
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2015501157A priority Critical patent/JP6131315B2/ja
Priority to PCT/JP2013/054350 priority patent/WO2014128884A1/fr
Publication of WO2014128884A1 publication Critical patent/WO2014128884A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • the present invention relates to a communication system and an electronic component mounting apparatus using the communication system.
  • Patent Document 1 there is a communication system in which image data captured by a CCD camera or the like is transmitted (for example, Patent Document 1).
  • image data captured by a camera of a mobile phone is input to an image processing circuit and subjected to predetermined image processing.
  • the image processing circuit executes, for example, white balance adjustment processing.
  • the processed image data is transmitted to a wireless communication network through a network control unit (NCU).
  • NCU network control unit
  • mounting apparatus for mounting electronic components on a circuit board
  • image data captured by a camera is transmitted.
  • the mounting apparatus captures an image of a mounted component that is attracted to the tip of the suction nozzle and determines whether the component is normally sucked to the tip of the nozzle.
  • the mounting head and the apparatus main body are connected by wireless communication.
  • a configuration for transmitting data is conceivable.
  • the mounting device is different from a device in which an imaging unit (camera) and a communication unit (NCU) are integrally configured, such as the above-described mobile phone, and the imaging unit and the communication unit are configured as separate units and devices. It is preferred that What is configured as a separate unit or the like has an advantage that, for example, the versatility of a camera that can be mounted on the mounting device can be improved, or the convenience during maintenance can be improved.
  • the image processing for the image data acquired by the camera needs to be appropriately performed according to the camera model and information desired to be acquired from the image data. Therefore, a configuration of a communication system that can appropriately perform image processing while maintaining the above-described advantages is desirable.
  • the present invention has been made in view of the above-described problems, and is a communication system that transmits image data acquired by an imaging unit, and an arrangement in the system of an image processing unit that performs image processing on image data It is an object of the present invention to provide a communication system capable of optimizing the performance and an electronic component mounting apparatus using the communication system.
  • the communication system is provided with at least one of an imaging unit that images an object, and first image data input from the imaging unit and a processing result obtained by performing image processing on the first image data on a reception side.
  • a transmission unit that transmits to the control unit, and the transmission unit receives the first image data and outputs the second image data with a data amount reduced as a processing result compared to the first image data.
  • An image processing unit for executing processing is provided.
  • the electronic component mounting apparatus performs data transmission related to the mounting work on the substrate by the mounting head of the electronic component by the communication system according to the technique disclosed in the present application. That is, an imaging unit that images an electronic component held by the mounting head or a substrate on which the electronic component is mounted, and a transmission unit that transmits first image data input from the imaging unit to a control unit provided on the reception side, And the transmission unit includes a communication unit including an image processing unit that receives the first image data and outputs the second image data whose data amount is reduced as compared to the first image data. Transmit by system.
  • the communication system transmits image data acquired by the imaging unit, and the image processing unit executes image processing on the image data. It is possible to provide a communication system capable of optimizing the arrangement and an electronic component mounting apparatus using the communication system.
  • FIG. 1 It is a perspective view of the electronic component mounting apparatus to which the radio
  • the mounting device 10 includes a device main body 11, a pair of display devices 13 provided integrally with the device main body 11, and supply devices 15 and 16 provided detachably with respect to the device main body 11. Is provided.
  • the mounting device 10 according to the present embodiment is based on the control of the control device 80 shown in FIG. 3, and electronic components (not shown) with respect to the circuit board 17 transported by the transport device 21 housed in the device main body 11. It is an apparatus which implements mounting work.
  • the direction in which the circuit board 17 is transported by the transport device 21 is the X-axis direction, and is horizontal to the transport direction of the circuit board 17.
  • a direction perpendicular to the direction is referred to as a Y-axis direction and will be described.
  • the device body 11 includes display devices 13 at both ends in the Y-axis direction on one end side in the X-axis direction. Each display device 13 is a touch panel type display device, and displays information related to an electronic component mounting operation. Further, the apparatus main body 11 includes supply devices 15 and 16 that are mounted so as to be sandwiched from both sides in the Y-axis direction.
  • the supply device 15 is a feeder-type supply device, and includes a plurality of tape feeders 15A that are housed in a state where various electronic components are taped and wound on a reel.
  • the supply device 16 is a tray-type supply device, and has a plurality of component trays 16A (see FIG. 2) on which a plurality of electronic components are placed.
  • FIG. 2 is a schematic plan view showing the mounting apparatus 10 from the upper (upper side in FIG. 1) viewpoint with the upper cover 11A (see FIG. 1) of the apparatus main body 11 removed.
  • the apparatus body 11 includes the transport device 21, a mounting head 22 for mounting electronic components on the circuit board 17, and a moving device 23 for moving the mounting head 22. Prepare for the top.
  • the base 20 has supply devices 15 and 16 connected to each side surface in the Y-axis direction. Each of the supply devices 15 and 16 can be attached to and detached from the base 20 in order to cope with a shortage of electronic components to be supplied, changes in the types of electronic components, and the like.
  • the transfer device 21 is provided in a substantially central portion of the base 20 in the Y-axis direction, and moves the pair of conveyor belts 31, the substrate holding device 32 held on the conveyor belt 31, and the substrate holding device 32.
  • an electromagnetic motor 33 The substrate holding device 32 holds the circuit board 17.
  • the output shaft of the electromagnetic motor 33 is drivingly connected to the conveyor belt 31.
  • the electromagnetic motor 33 is, for example, a servo motor that can accurately control the rotation angle.
  • the circuit board 17 moves in the X-axis direction together with the substrate holding device 32 when the conveyor belt 31 rotates based on the driving of the electromagnetic motor 33.
  • the mounting head 22 has a suction nozzle 41 that sucks electronic components on the lower surface facing the circuit board 17.
  • the suction nozzle 41 communicates with the negative pressure air and the positive pressure air passage via the positive / negative pressure supply device 42 shown in FIG. 3, and sucks and holds the electronic component with the negative pressure, so that a slight positive pressure is supplied. Remove the electronic parts held in step.
  • the mounting head 22 includes a nozzle lifting device 43 that lifts and lowers the suction nozzle 41 and a nozzle rotation device 44 that rotates the suction nozzle 41 about its axis. The position in the vertical direction and the holding posture of the electronic component are changed based on control from the control device 80.
  • the nozzle lifting device 43 includes an electromagnetic motor 43A as a drive source.
  • the mounting head 22 has a position detection sensor 45 for detecting the position of the electronic component to be held in the vertical direction.
  • the mounting head 22 has two imaging devices, a parts camera 46 and a mark camera 47.
  • the parts camera 46 and the mark camera 47 have built-in image sensors such as a CMOS sensor and a CCD sensor, for example.
  • the parts camera 46 is provided at a position where the tip of the suction nozzle 41 can be imaged from the side surface side (for example, the side surface viewed from the Y direction in FIG. 2).
  • the parts camera 46 images the electronic components sucked and held by the suction nozzles 41 from the supply devices 15 and 16.
  • the mark camera 47 is fixed at a position where the circuit board 17 can be imaged with the mark camera 47 facing downward of the mounting head 22.
  • the mark camera 47 images a reference position mark on the circuit board 17 and a mounting state of electronic components.
  • the suction nozzle 41 is detachable from the mounting head 22 and can be changed according to the size and shape of the electronic component. Further, the mounting head 22 may include a plurality of suction nozzles 41 so that the suction nozzles 41 can be changed according to the mounting state.
  • the mounting head 22 is moved to an arbitrary position on the base 20 by the moving device 23 shown in FIG. More specifically, the moving device 23 includes an X-axis direction slide mechanism 50 for moving the mounting head 22 in the X-axis direction, and a Y-axis direction slide mechanism 52 for moving the mounting head 22 in the Y-axis direction.
  • the X-axis direction slide mechanism 50 has an X-axis slider 54 provided on the base 20 so as to be movable in the X-axis direction, and an electromagnetic motor 56 as a drive source.
  • the X-axis slider 54 moves to an arbitrary position in the X-axis direction based on driving of the electromagnetic motor 56.
  • the Y-axis direction slide mechanism 52 has a Y-axis slider 58 provided on the side surface of the X-axis slider 54 so as to be movable in the Y-axis direction, and an electromagnetic motor 60 as a drive source.
  • the Y-axis slider 58 moves to an arbitrary position in the Y-axis direction based on driving of the electromagnetic motor 60.
  • the mounting head 22 is attached to the Y-axis slider 58 and moves to an arbitrary position on the base 20 as the moving device 23 is driven. Thereby, the mark camera 47 can image the surface of an arbitrary position of the circuit board 17 by moving the mounting head 22.
  • the mounting head 22 is attached to the Y-axis slider 58 via the connector 48 and can be attached and detached with a single touch, and can be changed to a different type of work head, for example, a dispenser head.
  • the mounting device 10 of the present embodiment uses optical wireless multiplexed communication for data communication between the control device 80 of the mounting device 10 and parts (various devices) other than the control device 80. It has become.
  • the configuration of the mounting apparatus 10 illustrated in FIG. 3 is an example in the case of applying a communication system, and is appropriately changed according to the type and number of apparatuses provided in the mounting apparatus 10.
  • the communication system of the present application is a system that can be applied to an automatic machine operating in various production lines in addition to the electronic component mounting apparatus exemplified by the mounting apparatus 10.
  • the control device 80 includes a controller 82 mainly composed of a computer including a CPU, an image board 84, a drive control board 85, and an I / O board 86.
  • the controller 82 controls the boards 84, 85, and 86 to execute data transmission with various devices.
  • the optical wireless devices 91 and 92 perform data transmission through a transmission path 95 established by optical wireless communication.
  • Each board 84, 85, 86 is connected to the optical wireless device 91, and input / output data of each board 84, 85, 86 is transmitted to the optical wireless device 92.
  • the optical wireless device 92 is built in the moving device 23, for example, and is connected to various devices (camera, motor, sensor, etc.). As shown in FIG.
  • the moving device 23 is provided with a light emitting / receiving unit 94 of the optical wireless device 92 facing the light emitting / receiving unit 93 of the optical wireless device 91 connected to the control device 80.
  • the light emitting / receiving unit 94 is fixed to the X-axis slider 54 of the moving device 23 so that the optical axis coincides with the light emitting / receiving unit 93 on the optical wireless device 91 side. Thereby, various information communication is enabled between the light emitting / receiving units 93 and 94 (optical wireless devices 91 and 92).
  • the image board 84 shown in FIG. 3 is a board that controls input / output of image data.
  • the parts camera 46 and the mark camera 47 of the mounting head 22 output the captured image data to the optical wireless device 92.
  • the optical wireless device 92 performs various image processing on the image data output from the parts camera 46 and the mark camera 47 by the image processing unit 71 (see FIG. 4) and executes the image data of the processing result as the image of the control device 80. Transmit to the board 84.
  • the drive control board 85 is a board that controls input / output of operation commands for the electromagnetic motor and information fed back from the electromagnetic motor in real time.
  • the controller 82 receives servo control information such as torque information and position information (vertical position of the electronic component held by the suction nozzle 41) acquired by the electromagnetic motor 43A via the drive control board 85.
  • the I / O board 86 is a board that controls an I / O signal such as an output signal of the position detection sensor 45.
  • Data input from these devices to the control device 80 is multiplexed by the optical wireless device 92 and transmitted through the transmission path 95 as an optical wireless signal.
  • the optical wireless device 91 performs a process of demultiplexing the transmitted multiplexed signal and separating it into individual data. Of the separated data, the optical wireless device 91 transfers image data to the image board 84, servo control information to the drive control board 85, and I / O signals to the I / O board 86.
  • the controller 82 processes each data received by the optical wireless device 91. For example, the controller 82 outputs a control signal for the electromagnetic motor 43 ⁇ / b> A based on the processing result to the optical wireless device 91 via the drive control board 85.
  • the optical wireless device 92 transmits a control signal transmitted from the optical wireless device 91 to the nozzle lifting / lowering device 43.
  • the electromagnetic motor 43A operates based on the control signal.
  • the controller 82 transmits a control signal for changing the display of the display device 13 to the display device 13 via the I / O board 86 and the optical wireless devices 91 and 92.
  • various types of information transmitted and received between the control device 80 and each device other than the control device 80 are transmitted and received as data multiplexed on the transmission path 95, for example, time division multiplexing (TDM) frame data.
  • TDM time division multiplexing
  • the data transfer rate is 3 GBPS
  • one frame is 8 nsec
  • the number of bits of one frame is 24 bits.
  • FIG. 4 is a schematic configuration diagram for explaining a part related to image processing of the communication system in the mounting apparatus 10.
  • the optical wireless device 92 includes an image processing unit 71, a buffer unit 72, an error processing unit 74, a multiplexing device 75, a detection / selection unit 76, and a memory unit 77.
  • the wireless device 91 includes a multiplexing device 78 and an error processing unit 79.
  • Image data hereinafter referred to as “first image data” picked up by each of the parts camera 46 and the mark camera 47 is temporarily stored in the buffer unit 72 and input to the image processing unit 71 with the timing adjusted.
  • the image processing unit 71 performs image processing on the first image data G 1 input from the buffer unit 72, and outputs processing result image data (hereinafter referred to as “second image data”) G 2 to the error processing unit 74. To do.
  • the amount of data of the second image data G2 is reduced compared to the first image data G1.
  • the image processing unit 71 performs edge detection processing, binarization processing, and the like on the first image data G1, so that the data amount of the second image data G2 is reduced compared to the first image data G1.
  • the edge detection process is a process for detecting a reference position mark on the circuit board 17 and an edge of an outer edge of an electronic component or the like.
  • the binarization processing is processing for detecting, for example, an area occupied by the captured electronic component and converting the first image data G1 into black and white binary two-dimensional image data.
  • appropriate detection and processing may not be possible because the sensitivity of each camera 46 and 47 differs depending on the model. This is because, if the models of the cameras 46 and 47 are different, the built-in image sensor such as a CMOS sensor may be different, and the sensitivity differs for each image sensor.
  • the image processing unit 71 performs pixel value conversion processing according to the sensitivity of the cameras 46 and 47 on the first image data G1 as preprocessing such as edge detection in the controller 82.
  • the image processing unit 71 converts, for example, each pixel value of the first image data G1 using a look-up table in which conversion data between input values and output values is set in advance, and gradation compression processing that performs bit compression Execute.
  • the image processing unit 71 converts the black and white first image data G1 having 10 bits per pixel into the second image data G2 having 8 bits per pixel using a lookup table.
  • the look-up table is configured so that each camera 46 is in an environment where the lighting device (not shown) that illuminates the tip of the suction nozzle 41 included in the mounting head 22 is driven, that is, in an environment where the brightness is close to the actual use environment.
  • 47 is preferably set in advance for each model. For this reason, it is preferable that the lookup table is set according to the combination of the model of each camera 46 and 47 and the lighting device.
  • the error processing unit 74 executes a process of adding an error correction code to the second image data G2 input from the image processing unit 71. Further, the error processing unit 74 receives torque information of the electromagnetic motor 43 ⁇ / b> A of the nozzle lifting / lowering device 43 and an I / O signal of the position detection sensor 45. The error processing unit 74 executes addition processing of an error correction code suitable for the data type of various apparatuses, for example, suitable for the amount of data and the certainty of required data. The output data of the error processing unit 74 is multiplexed by the multiplexing device 75 and then transmitted to the multiplexing device 78 provided in the optical wireless device 91 via the transmission path 95.
  • Multiplexer 78 outputs the individual data that has been demultiplexed to error processor 79.
  • the error processing unit 79 performs error detection / correction processing according to the type of input data. Note that the same processing is performed for error processing of data from the optical wireless device 91 to the optical wireless device 92, and thus the description thereof is omitted.
  • the error processing unit 79 outputs various processed data to the boards 84, 85, 86. For example, the second image data G ⁇ b> 2 transmitted from the image processing unit 71 is output to the image board 84.
  • the optical wireless device 92 includes a detection selection unit 76 and a memory unit 77.
  • the detection selection unit 76 acquires the identification information SI from the parts camera 46 and the mark camera 47.
  • the identification information SI is information relating to, for example, the camera model and the data amount / format of the first image data G1. Further, the identification information SI may be information according to the type of the illumination device that illuminates the tip of the suction nozzle 41 or the combination of the camera 46, 47 model and the illumination device.
  • the memory unit 77 stores a plurality of correction tables corresponding to identification information SI that are candidates for the parts camera 46 and the mark camera 47 that can be mounted on the mounting head 22.
  • the memory unit 77 includes, for example, a plurality of look-up tables for gradation-compressing pixel values of the first image data G1 for each model of the part camera 46 and the mark camera 47.
  • the detection selection unit 76 acquires the identification information SI from the part camera 46 and the mark camera 47 when the optical wireless device 92 is activated, and obtains a lookup table corresponding to the model of the identification information SI from the memory unit 77 to the image processing unit 71. Execute the process to read out.
  • the optical wireless device 92 may be configured such that the correction table stored in the memory unit 77 can be updated.
  • the optical wireless device 92 may be configured such that the correction table in the memory unit 77 is updated based on data from the external input terminal.
  • the optical wireless device 92 may be configured to output the correction table from the control device 80 to the memory unit 77 via the optical wireless device 91 and the transmission path 95 without storing the correction table in the memory unit 77 in advance.
  • an electronic component is mounted by the mounting head 22 on the circuit board 17 held by the board holding device 32 (see FIG. 3).
  • the controller 82 drives the transport device 21 to transport the circuit board 17 to the working position, stops the electromagnetic motor 33, and holds the circuit board 17 in a fixed manner.
  • the controller 82 drives the moving device 23 to move the mounting head 22 onto the circuit board 17 and images the circuit board 17 with the mark camera 47.
  • the image processing unit 71 performs image processing (for example, gradation compression processing or edge detection processing) on the first image data G1 output from the mark camera 47, and outputs the processing result as second image data G2.
  • the controller 82 acquires the type of the circuit board 17 and the error of the holding position of the circuit board 17 based on the second image data G2 transmitted from the mark camera 47 via the image processing unit 71. Next, the controller 82 drives the supply devices 15 and 16 to which electronic components are supplied in accordance with the determination result for the type of substrate, and performs control to send the corresponding electronic components to the supply position to the mounting head 22. The controller 82 drives the moving device 23 to suck and hold the electronic component conveyed to the supply position by the suction nozzle 41 of the mounting head 22.
  • the mounting head 22 images the state of the electronic component held by the suction nozzle 41 by the parts camera 46 based on the control from the controller 82.
  • the image processing unit 71 performs image processing on the first image data G ⁇ b> 1 output from the parts camera 46.
  • the image processing unit 71 binarizes the first image data G1 of the part camera 46 as binary two-dimensional image data of gray scale or black and white. More specifically, for example, the image processing unit 71 sets a predetermined value below the tip of the suction nozzle 41 in an image obtained by imaging the tip of the suction nozzle 41 from the side (for example, one pixel has 10 bits). Set the rectangular area.
  • the image processing unit 71 performs a binarization process for determining whether or not the object to be adsorbed (electronic component) is an image of each pixel in the rectangular area. That is, a process for compressing the data of each pixel from 10 bits to 2 bits is executed.
  • the controller 82 calculates the area of the image occupied by the object to be adsorbed in the rectangular area with respect to the second image data G2 in which each pixel output from the image processing unit 71 is binarized by 2 bits.
  • the area calculation process is calculated based on, for example, the number of pixels of the image occupied by the object to be adsorbed and the resolution (distance between the pixels).
  • the controller 82 has dimensions of each electronic component set in advance, and the electronic component is placed in the suction nozzle 41 based on the calculated image area occupied by the object to be sucked and the size of the component corresponding to the electronic component. It is determined whether or not it is normally adsorbed.
  • the memory unit 77 preferably stores, as a correction table, setting information necessary for binarization processing according to the models of the cameras 46 and 47.
  • the detection / selection unit 76 executes a process of reading setting information optimum for the binarization process from the memory unit 77 to the image processing unit 71 based on the identification information SI.
  • the content of the binarization processing by the image processing unit 71 is not limited to the above content.
  • the binarization processing is performed on all the pixel values of the first image data G1 without setting a rectangular area.
  • the setting may be such that the first image data G1 of one frame after processing is transmitted to the control device 80.
  • the controller 82 acquires an error in the holding position of the electronic component when it is determined that the electronic component is normally held, for example.
  • the controller 82 moves the mounting head 22 to the mounting position on the circuit board 17 and moves or rotates the suction nozzle 41 in accordance with the error in the mutual holding position between the circuit board 17 and the electronic component, and then corrects the holding position.
  • Electronic components are mounted on the circuit board 17.
  • the controller 82 transmits a control signal S for changing the processing content of the image processing to the image processing unit 71. Based on the control signal S, the image processing unit 71 changes the processing content from, for example, binarization processing to processing for outputting first image data G1 before image processing.
  • the case where the electronic component is not normally held by the suction nozzle 41 means that the electronic component held at the tip of the suction nozzle 41 has an incorrect vertical or horizontal orientation, a suction direction, or the like. There are various cases such as not being sucked by the suction nozzle 41. For this reason, the user of the mounting apparatus 10 needs to check the actual image of the tip of the suction nozzle 41 when the controller 82 detects an abnormality in the holding state. However, the actual image at the tip of the suction nozzle 41 is the first image data G1, and the amount of data is larger than the binarized second image data G2 transmitted at normal time.
  • the mounting apparatus 10 changes the processing content of the image processing unit 71 and determines the first image data G1 acquired by the parts camera 46 when it is determined that the electronic component is not normally held. Is transmitted to the controller 82.
  • the controller 82 may be configured to transmit a control signal S for starting the binarization processing to the image processing unit 71 when an operation for confirming the actual image is performed by the user. .
  • the image processing unit 71 may perform setting so that the first image data G1 is subjected to gradation compression processing and transmitted based on the control signal S received in the event of an abnormality.
  • the control device 80 may be configured to perform processing for accumulating the first image data G1 received in the event of an abnormality in the external storage device so that the user can check the generation time later.
  • the mounting apparatus 10 of this embodiment includes a parts camera 46 that images the electronic components held by the mounting head 22 and a mark camera 47 that images the circuit board 17 on which the electronic components are mounted.
  • the first image data G ⁇ b> 1 captured by the parts camera 46 and the mark camera 47 is transmitted from the optical wireless device 92 to the optical wireless device 91.
  • the optical wireless device 91 includes an image processing unit 71 that executes edge detection processing and binarization processing on the first image data G1 and outputs the processing result as second image data G2.
  • the second image data G2 processed by the image processing unit 71 has a data amount reduced as compared with the first image data G1.
  • the mounting apparatus 10 is configured such that the mounting head 22 including the parts camera 46 and the mark camera 47 can be attached to and detached from the Y-axis slider 58 via the connector 48. This is because, for example, it is possible to improve the convenience of maintenance such that the mounting head 22 can be replaced for each unit when a failure occurs.
  • the model of the parts camera 46 mounted on the mounting head 22 after replacement may be different from the model before replacement due to a design change or the like. That is, in the mounting device 10, the convenience of maintenance is improved, while the models of the part camera 46 and the mark camera 47 may be changed with respect to the optical wireless device 92 built in the moving device 23.
  • the mounting apparatus 10 changes the correction table (such as a look-up table for gradation compression processing) required for image processing according to the model of each camera 46 and 47 newly mounted on the mounting head 22 and changes the sensitivity. Need to be adjusted.
  • the mounting apparatus 10 may include a correction table necessary to correspond to the camera model and the like in advance by including the image processing unit 71 in the optical wireless device 92 to which the mounting head 22 is connected. Therefore, the versatility of the camera that can be mounted on the mounting head 22 can be improved.
  • the image processing unit 71 executes gradation compression processing, edge detection processing, and binarization processing on the first image data G1, and outputs the processing result as second image data G2. Accordingly, the data amount of the first image data G1 can be reduced in the optical wireless device 92 on the transmission side.
  • the memory unit 77 of the optical wireless device 92 includes a plurality of look-up tables for associating each pixel value of the first image data G1 with a pixel value as a result of the gradation compression processing, the parts camera 46 and the mark Stored for each model of the camera 47.
  • the detection / selection unit 76 detects the identification information SI of each camera 46, 47, executes a process of selecting a lookup table corresponding to the detected identification information SI from the memory unit 77 and reading it into the image processing unit 71.
  • the image processing unit 71 can execute a gradation compression process suitable for the model and use environment of the cameras 46 and 47.
  • the controller 82 transmits a control signal S for changing the processing content of the image processing to the image processing unit 71.
  • the image processing unit 71 changes the processing content from edge detection processing or binarization processing to processing for outputting the first image data G1 before image processing.
  • the image processing unit 71 transmits the first image data G ⁇ b> 1 acquired by the parts camera 46 to the controller 82.
  • the user can visually recognize the actual image of the suction nozzle 41 at the time of abnormality, and can optimize the data amount of the second image data G2 transmitted from the image processing unit 71 during normal time and abnormal time. As a result, it is possible to reduce the transfer rate in the transmission path 95 between the optical wireless devices 91 and 92.
  • this invention is not limited to said embodiment, It cannot be overemphasized that various improvement and change are possible within the range which does not deviate from the meaning of this invention.
  • communication by optical wireless has been described as an example.
  • the present application is not limited to this, and can be applied to wireless communication using various electromagnetic waves in addition to infrared rays and visible light.
  • multiplexed wireless communication has been described as an example.
  • the present application is not limited to this, and may be applied to wireless communication that does not use multiplexing.
  • the present application may be applied to, for example, optical communication via an optical fiber network, or may be applied to other communication having a transmission / reception device facing a transmission side and a reception side.
  • the electronic component mounting apparatus 10 for mounting an electronic component on a circuit board has been described.
  • the present application is not limited to this, and the present invention can be applied to automatic machines operating in various other production lines. it can.
  • the present invention may be applied to a communication system in which an assembly part held by a mounting head or an arm is an object to be imaged by an imaging unit and image data and processing result data are transmitted.
  • the present invention may be applied to a solder inspection machine (SPI) that images the printed state of solder on the circuit board 17 as an object.
  • SPI solder inspection machine
  • the present invention may be applied to a board appearance inspection machine (AOI) that images a mounted electronic component as an object and inspects the mounting state.
  • AOI board appearance inspection machine
  • the automatic machine is not limited to one that performs mounting or assembly, and may be applied to a machine tool that performs cutting or the like, for example.
  • the object to be imaged may be a workpiece to be cut, a gear after machining, or the like.
  • the imaging device (parts camera 46 and mark camera 47) is connected to the optical wireless device 92.
  • the imaging device is connected to both the wireless devices of the optical wireless devices 91 and 92, and the image data is bidirectional. It is good also as a structure which transmits / receives.
  • the wireless device 91 has the same configuration as the optical wireless device 92.
  • the configuration relating to the image processing (the image processing unit 71, the detection selection unit 76, etc.) is provided in the optical wireless device 92, but the receiving side optical wireless device 91 that receives the second image data G2 is provided. It is good also as a structure provided with the structure which concerns on an image process. Even in such a configuration, the versatility of the camera that can be mounted on the mounting head 22 can be improved.
  • the processing content of the image processing unit 71 in the above embodiment is an example and may be changed as appropriate.
  • the image processing unit 71 may be configured to perform only one of edge detection processing, binarization processing, and gradation compression processing.
  • part of the processing content performed on the controller 82 side in the above embodiment may be performed by the image processing unit 71.
  • the image processing unit 71 may execute a process of calculating the area of the image occupied by the electronic component in the rectangular area for the data obtained by binarizing the first image data G1. Further, the image processing unit 71 may perform other processing that can reduce the data amount of the first image data G1.
  • the image processing unit 71, the error processing unit 74, the detection selection unit 76, and the like included in the optical wireless device 92 are not configured by individual processing circuits such as a processor. It may be composed of programmable logic devices such as Field Programmable) Gate Array.
  • the configuration of the mounting device 10 of the above embodiment is an example, and is changed as appropriate.
  • the mounting device 10 includes the pair of optical wireless devices 91 and 92, but may include two or more.
  • the mounting apparatus 10 is an example of the positions and connections of the optical wireless apparatuses 91 and 92, and may be configured so that the arrangement is appropriately changed to other movable parts and the like.
  • the apparatus main body 11 may be configured to include a plurality of moving devices 23.
  • a configuration in which a plurality of mounting devices 10 are drivingly connected in the transport direction may be employed.
  • the electronic component mounting apparatus 10 is an example of an electronic component mounting apparatus
  • the circuit board 17 is an example of a board and an object
  • the mounting head 22 is an example of a mounting head
  • a parts camera 46 and a mark camera 47 are imaging units.
  • the image processing unit 71 is an example of an image processing unit
  • the detection selection unit 76 is an example of a detection selection unit
  • the control device 80 and the controller 82 are an example of a control unit.
  • a look-up table for gradation compression processing and setting information for binarization processing are examples of a correction table
  • first image data G1 is an example of first image data.
  • the data G2 is an example of the second image data
  • the control signal S is an example of the control signal
  • the identification information SI is an example of the identification information
  • the electronic component is the object It is mentioned as examples.

Abstract

L'invention porte sur un système de communication qui transporte des données d'image acquises par une unité de capture d'image, le système de communication étant apte à une optimisation de placement à l'intérieur de celui-ci d'une unité de traitement d'image qui réalise un traitement d'image concernant des données d'image. L'invention porte également sur un dispositif de montage de composant électronique qui utilise le système de communication. Le dispositif de montage de composant électronique comporte un appareil photo de pièce (46) qui capture une image d'un composant électronique retenu par une tête de montage, et un appareil photo de marquage (47) qui capture une image d'une carte à circuits sur laquelle est monté le composant électronique. Des premières données d'image (G1) capturées par l'appareil photo de pièce (46) et l'appareil photo de marquage (47) sont émises par un dispositif sans fil optique (92) vers un dispositif sans fil optique (91). Le dispositif sans fil optique (91) comporte une unité de traitement d'image (71) qui réalise un traitement de binarisation et analogue concernant les premières données d'image (G1) et délivre le résultat de traitement en tant que secondes données d'image (G2). Les secondes données d'image (G2) traitées par l'unité de traitement d'image (71) sont réduites en volume de données par comparaison aux premières données d'image (G1).
PCT/JP2013/054350 2013-02-21 2013-02-21 Système de communication et dispositif de montage de composant électronique WO2014128884A1 (fr)

Priority Applications (2)

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JP2015501157A JP6131315B2 (ja) 2013-02-21 2013-02-21 通信システム及び電子部品装着装置
PCT/JP2013/054350 WO2014128884A1 (fr) 2013-02-21 2013-02-21 Système de communication et dispositif de montage de composant électronique

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EP3471528A4 (fr) * 2016-06-13 2020-01-08 Fuji Corporation Système de montage de composants
CN114128417A (zh) * 2019-07-26 2022-03-01 株式会社富士 对基板作业系统

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JPH0883998A (ja) * 1994-09-09 1996-03-26 Sanyo Electric Co Ltd 電子部品自動装着装置
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EP3471528A4 (fr) * 2016-06-13 2020-01-08 Fuji Corporation Système de montage de composants
US11229150B2 (en) 2016-06-13 2022-01-18 Fuji Corporation Component mounting system
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CN114128417B (zh) * 2019-07-26 2024-03-12 株式会社富士 对基板作业系统

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