WO2014112415A1 - 積層膜付きガラス基板の製造方法 - Google Patents
積層膜付きガラス基板の製造方法 Download PDFInfo
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- WO2014112415A1 WO2014112415A1 PCT/JP2014/050138 JP2014050138W WO2014112415A1 WO 2014112415 A1 WO2014112415 A1 WO 2014112415A1 JP 2014050138 W JP2014050138 W JP 2014050138W WO 2014112415 A1 WO2014112415 A1 WO 2014112415A1
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- glass
- temperature
- glass ribbon
- glass substrate
- manufacturing
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B25/00—Annealing glass products
- C03B25/04—Annealing glass products in a continuous way
- C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
- C03B25/08—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
Definitions
- the present invention relates to a method for producing a glass substrate with a laminated film, and more particularly, to a method for producing a glass substrate with a laminated film in which a laminated film is formed on a glass ribbon in a slow cooling furnace by an on-line CVD (Chemical Vapor Deposition) method.
- CVD Chemical Vapor Deposition
- Patent Documents 1 to 3 As a method for forming a film on a glass ribbon by an on-line CVD method, for example, methods described in Patent Documents 1 to 3 are known.
- Patent Document 1 discloses that an oxide containing silicon and oxygen is formed on a glass ribbon in a float bath by a CVD method. In this case, it is disclosed that an unsaturated hydrocarbon compound and carbon dioxide are used as an oxygen source in order to prevent oxidation of molten metal in the float bath by oxygen gas.
- Patent Document 2 discloses a method of sequentially forming a silicon dioxide film and a tin oxide film on a glass ribbon at a coating station (injector) disposed in a float bath and a coating station disposed in a slow cooling furnace.
- Patent Document 3 discloses a method of forming a film on a glass ribbon by providing a nozzle (injector) in a region between the float bath outlet and the annealing furnace inlet.
- Patent Document 4 discloses a method of forming a conductive film made of fluorine-doped tin oxide or antimony-doped tin oxide on a glass substrate having a strain point of 525 ° C. or higher.
- the surroundings of the molten metal are usually in a non-oxidizing atmosphere to prevent oxidation of the molten metal.
- the glass ribbon is in a soft state in the float bath, and when the film is formed on the soft glass ribbon in the float bath by the CVD method, the glass ribbon is not easily warped or cracked due to a temperature difference.
- Patent Document 1 discloses that an unsaturated hydrocarbon compound and carbon dioxide are used as an oxygen gas source for preventing oxidation of molten metal in a float bath. This is because oxygen gas cannot be used when forming an oxide film in a non-oxidizing atmosphere, and a reaction gas containing oxygen molecules needs to be used. However, when an oxide containing silicon and oxygen is formed by this method, hydrocarbon or carbon dioxide (C) derived from carbon dioxide is mixed into the oxide film. As a result, the absorption of the film is increased, and the film has a reduced transmittance as compared with the film not containing carbon.
- C carbon dioxide
- Patent Document 2 when a coating station is provided in a slow cooling furnace, a problem arises because the temperature conditions for film formation are different from the temperature conditions for slow cooling of the glass ribbon, and a multilayer coating is formed. Points out that the problem is more complicated. For this reason, Patent Document 2 recommends that the premixed oxygen and the coating precursor are brought into contact with the glass ribbon in the float bath. However, this method requires a seal to seal the oxygen gas and complicates the apparatus. Also, when a coating station is provided in the slow cooling furnace and a metal oxide film is to be formed on the glass ribbon, the heat exchange between the glass ribbon and the injector causes a rapid heat removal from the glass ribbon compared to the case without the coating station.
- the glass ribbon may be deformed or scratches and cracks may occur.
- the greater the number of coating stations the greater the risk that scratches and cracks will occur, and the warped glass ribbon may come into contact with the coating stations and cause scratches and cracks with the glass.
- Patent Document 2 discloses that when one or more coating stations are provided in a slow cooling furnace when forming a multilayer coating, there is a problem that different temperature control must be established. On the other hand, there is no specific disclosure of an appropriate temperature management method in the case where a plurality of coating stations are arranged in a slow cooling furnace.
- Patent Document 3 discloses that a nozzle (injector) is provided in an area between the float bath outlet and the annealing furnace inlet so as to cover the entire width of the glass.
- a nozzle injector
- the temperature of the glass ribbon is not controlled in the space between the float bath and the slow cooling furnace, and if a film is formed in the space between the float bath and the slow cooling furnace, the glass ribbon is rapidly changed due to heat exchange between the nozzle and the glass ribbon. There is a problem of heat removal.
- Patent Document 4 discloses that a conductive film is formed by an off-line CVD method, but there is a description that the on-line CVD method forms a film using the heat in a plate glass production line. However, no specific film forming method is disclosed.
- the present invention has been made paying attention to the above-mentioned problems.
- the glass ribbon having a high strain point of 550 ° C. or higher is appropriately controlled and provided in the slow cooling furnace.
- a glass manufacturing apparatus including a melting furnace for melting a glass raw material, a float bath for floating a molten glass on a molten metal to form a glass ribbon, and a slow cooling furnace for gradually cooling the glass ribbon is used.
- the laminated film is composed of two or more layers,
- the glass substrate has a strain temperature Ts (° C.) of 550 ° C.
- the laminated film is formed with Tg or less, A glass substrate with a laminated film, wherein a temperature drop K1 per unit length of the glass ribbon in a temperature region for forming all the layers of the laminated film is 0 ° C./m ⁇ K1 ⁇ 10° C./m A manufacturing method is provided.
- the glass substrate may have a linear expansion coefficient of 50 ⁇ 10 ⁇ 7 / K to 105 ⁇ 10 ⁇ 7 / K at 50 ° C. to 350 ° C. This is because the coefficient of thermal expansion is smaller than that of general glass such as soda lime glass, so that deformation is reduced when the same temperature change occurs, and the glass ribbon is less likely to warp or wave.
- the glass substrate may have a Young's modulus of 75 GPa or more. This is because the Young's modulus is higher than that of general glass such as soda lime glass, so that deformation is reduced when the same stress occurs, and the glass ribbon is less likely to warp or wave.
- the glass substrate is expressed in mass% based on oxide, SiO 2 55-72, Al 2 O 3 5-18, MgO 2-8, CaO 0-8, SrO 0-8, BaO 0-10, MgO + CaO + SrO + BaO 3.5-27, Na 2 O 0-15, K 2 O 0-12, ZrO 2 0-5, TiO 2 0-5, Including B 2 O 3 may have a substantially free composition of.
- the glass substrate is expressed in mass% based on oxide, ZrO 2 0.5-5 May be contained.
- the glass substrate is expressed in mass% based on oxide, Na 2 O + K 2 O 1-19 May be contained.
- the glass substrate is expressed in mass% based on oxide, MgO + CaO 5-15 May be contained.
- the glass substrate is expressed in mass% based on oxide, SiO 2 + Al 2 O 3 64 to 82 May be contained.
- the glass substrate is expressed in mass% based on oxide, Fe 2 O 3 0.005 to 0.1 May be contained.
- At least two layers of the laminated film may be formed at a temperature of 510 ° C. or higher.
- At least two layers of the laminated film may be formed at a temperature equal to or higher than Ts.
- At least one layer may be formed at a temperature lower than Ts.
- the temperature drop per unit length in the temperature range from 510 ° C. to the outlet temperature of the slow cooling furnace is the unit length of the glass ribbon in the temperature range from Tg to 510 ° C. It may be larger than the hit temperature drop.
- a heater may be provided between injectors adjacent to each other along the conveyance direction of the glass ribbon.
- the center-to-center distance T INJ between the injectors adjacent in the transport direction is 1. It may be 0m ⁇ T INJ ⁇ 25 / N INJ m.
- the distance between the lower surface of the injector and the glass ribbon may be 30 mm or less.
- the method for manufacturing a glass substrate with a laminated film of the present invention in an on-line CVD method, appropriate temperature management is performed on a glass ribbon having a strain point of 550 ° C. or higher, and a plurality of injectors provided in a slow cooling furnace are provided.
- the manufacturing method of the glass substrate with a laminated film which uses and forms a laminated film on a glass ribbon is provided.
- film formation may include the formation of at least one layer of a laminated film.
- a glass manufacturing apparatus 50 includes a melting furnace 51 that melts a glass raw material, a float bath 52 that floats the molten glass on molten tin to form a flat glass ribbon, a lift-out After the glass ribbon is pulled out from the float bath 52 by the roll 53, the slow cooling furnace 54 that gradually cools the glass ribbon by gradually lowering the temperature of the glass ribbon is provided.
- the slow cooling furnace 54 slowly cools the glass ribbon conveyed by the conveying roller 55 to a temperature range close to room temperature by supplying a heat amount whose output is controlled by a combustion gas or an electric heater to a necessary position in the furnace. Thereby, it has the effect
- a plurality of injectors 60 are provided in the slow cooling furnace 54, and a laminated film is formed on the glass ribbon by a CVD method.
- the injector 60 is composed of six injectors 60a to 60f, and forms a laminated film on the glass ribbon to be conveyed.
- An electric heater 56 is provided between the injectors.
- the number of injectors 60 is not limited to this, and is preferably in the range of 2 to 9, and the electric heater can be increased or decreased as necessary. These electric heaters prevent the temperature of the glass ribbon from excessively decreasing from the inlet to the outlet in the slow cooling furnace.
- the heater installed between the injectors can heat the glass ribbon between the injectors, but since it does not heat the glass ribbon on the lower surface of the injector, it is cooled from the inlet to the outlet of the injector by the installation of this heater There is no effect on the temperature change of the glass ribbon.
- the injector 60 (60a to 60f) is disposed above the glass ribbon 70 on the opposite side of the conveying roller 55 with the glass ribbon 70 interposed therebetween.
- Each injector is provided with a slit-like air outlet 61 that is elongated in a direction perpendicular to the glass ribbon conveyance direction at a substantially central portion of the lower surface 65, and exhaust that extends in parallel with the air outlet 61 on both sides in the front-rear direction of the air outlet 61.
- a mouth 62 is provided.
- the first orifice 61a located in the center and the first orifice 61a are positioned in the front-rear direction so as to incline the flow path from the source gas supply source toward the first orifice 61a.
- the configured second and third orifices 61b and 61c are opened.
- the widths of these air outlets 61 and exhaust ports 62 are narrower than the width of the glass ribbon 70, and are set to be equal to or larger than the product width of the glass ribbon excluding the ears to be separated and recovered.
- Reference numerals 66a and 66b denote cooling ducts, which circulate a cooling medium such as cooling gas or oil, and maintain the injector 60 at an optimum temperature, for example, 100 ° C.
- the lower surface of the injector 60 is a surface in contact with the raw material gas. If the temperature is too high, the raw material gas in contact with the lower surface of the injector 60 reacts with heat and adheres to form an unnecessary film. For this reason, the upper limit is preferably 250 ° C. or less. On the other hand, if the temperature is too low, the amount of heat exchange with the glass ribbon increases, causing a rapid temperature drop of the glass ribbon. For this reason, the lower limit is desirably 100 ° C. or higher.
- the injector 60 is disposed above the glass ribbon 70 with an interval of 3 mm to 30 mm. Therefore, the lower surface 65 of the injector 60 is disposed to face the glass ribbon 70 conveyed into the slow cooling furnace 54 with a gap of 3 mm to 30 mm.
- the smaller the gap the more advantageous the film thickness, film quality, and film formation speed during film formation.
- the gap fluctuates due to warping or vibration of the glass ribbon, the influence on the film thickness and film quality increases.
- the gap is large, the efficiency of the raw material during film formation is reduced.
- the gap is preferably 4 to 12 mm, more preferably 5 to 10 mm.
- a gas containing the main raw material of the compound that forms the oxide film is blown out. Further, a reactive gas (a gas that becomes an oxygen source) for forming the oxide film is blown out from the second and third orifices 61b and 61c.
- the exhaust port 62 exhausts excess gas after the CVD reaction.
- the composition of the glass ribbon is not particularly limited as long as it can finally obtain a high strain point glass substrate.
- high strain point glass means glass (substrate) having a strain temperature Ts of 550 ° C. or higher.
- the composition of the glass ribbon may be, for example, a composition that finally produces borosilicate glass or alkali-free glass.
- the glass ribbon (or the finally produced glass substrate, the same applies hereinafter), for example, in terms of mass% based on oxide, SiO 2 55-72, Al 2 O 3 5-18, MgO 2-8, CaO 0-8, SrO 0-8, BaO 0-10, MgO + CaO + SrO + BaO 3.5-27, Na 2 O 0-15, K 2 O 0-12, ZrO 2 0-5, TiO 2 0-5, Including B 2 O 3 may not be substantially contained.
- SiO 2 silicon oxide
- SiO 2 content is less than 55% by mass, the durability of the glass is lowered, and if it exceeds 72% by mass, it becomes difficult to melt the glass.
- the content of SiO 2 is preferably 57 to 72% by mass.
- Al 2 O 3 (aluminum oxide) is a component that improves the durability of the glass, so it is contained in an amount of 5% by mass or more. However, if it exceeds 18% by mass, melting of the glass becomes extremely difficult.
- the content of Al 2 O 3 is preferably 6 to 15% by mass, and more preferably 7.5 to 14% by mass.
- the total amount of SiO 2 and Al 2 O 3 is preferably 64% by mass or more in order to increase the chemical durability of the glass, and the glass melt can be stabilized. In order to ensure that the high-temperature viscosity does not become too high, it is preferably 82% by mass or less.
- Alkaline earth metal oxides that is, MgO (magnesium oxide), CaO (calcium oxide), SrO (strontium oxide) and BaO (barium oxide) improve the durability of the glass and the devitrification temperature during molding. Used to adjust viscosity.
- the total amount (RO) of the alkaline earth metal oxide is less than 3.5% by mass, the durability of the glass is lowered, and when it exceeds 27% by mass, the devitrification temperature is increased.
- the generation source of Cl in the tin oxide film is a tin chloride compound (SnCl 4 , SnHCl 3 , SnH 2 Cl 2 , SnH) used as a Sn raw material when forming the tin oxide film by the atmospheric pressure CVD method.
- tin chloride compound SnCl 4 , SnHCl 3 , SnH 2 Cl 2 , SnH
- inorganic tin compounds such as Cl, a monobutyltin trichloride, tin chloride compounds of organic, such as dibutyltin dichloride).
- the RO of the glass constituting the glass substrate is preferably 5 to 27% by mass.
- the total amount of MgO and CaO is preferably 2 to 16% by mass, and more preferably 5 to 15% by mass.
- Na 2 O (sodium oxide) and K 2 O (potassium oxide) are used as glass melting accelerators. However, if Na 2 O exceeds 15% by mass, the durability of the glass is lowered. Moreover, since K 2 O is more expensive than Na 2 O, it is not preferable to exceed 12% by mass.
- the total amount of Na 2 O and K 2 O (Na 2 O + K 2 O) is preferably 19% by mass or less, and acts as a glass dissolution accelerator. Therefore, it is preferable that Na 2 O + K 2 O is 1% by mass or more.
- ZrO 2 zirconium oxide
- the alkaline earth metal oxide has the effect of reducing the Cl concentration in the tin oxide film formed on the glass substrate, so it can be contained up to 5% by mass. it can. If the content of ZrO 2 exceeds 5% by mass, the nucleation sites on the glass substrate are decreased, and the crystallinity of the tin oxide film formed is considered to be decreased. As a result, it is considered that the Cl concentration in the tin oxide film increases and the mobility of the tin oxide film decreases.
- the content of ZrO 2 is more preferably 0.5 to 5% by mass.
- TiO 2 titanium oxide
- TiO 2 titanium oxide
- the glass constituting the glass substrate is a composition that is substantially free.
- the glass constituting the glass substrate can contain 0.005 to 0.1% by mass of Fe 2 O 3 (iron oxide).
- the content of Fe 2 O 3 is less than 0.005% by mass, the heat ray transmittance of the glass becomes high. Therefore, during glass production, the temperature distribution in the melting tank is difficult to occur, and convection of the molten glass is difficult to occur. Therefore, it is difficult to obtain a homogeneous glass.
- the content of Fe 2 O 3 is more than 0.1% by mass, the heat ray transmittance of the glass is lowered, so that the battery efficiency of the solar cell produced using the substrate with a transparent conductive film is lowered, which is not preferable.
- the content of Fe 2 O 3 is more preferably 0.007 to 0.08 mass%.
- the glass substrate composed of glass having the above composition has a strain point of 550 ° C. or higher.
- the film forming temperature can be increased when forming a tin oxide film, which is a transparent conductive film, on the glass substrate by atmospheric pressure CVD. High-speed film formation is possible.
- the strain point of the glass substrate is preferably 565 ° C. or higher.
- the strain point is a strain point (strain point) measured in accordance with “JIS R3103-2”.
- the glass substrate produced from the glass ribbon having the above composition has an average coefficient of thermal expansion of 50 ⁇ 10 ⁇ 7 to 105 ⁇ 10 ⁇ 7 / ° C. at 50 to 300 ° C.
- the average thermal expansion coefficient of the glass substrate at 50 to 300 ° C. is preferably 54 ⁇ 10 ⁇ 7 to 100 ⁇ 10 ⁇ 7 / ° C.
- the thickness of the glass ribbon can be selected as appropriate, and the glass thickness is preferably 0.1 to 6.0 mm.
- the glass thickness is preferably 0.1 to 6.0 mm.
- the temperature difference between the front and back is less likely to occur, so there is little warpage on the injector side, but because the glass itself is light, the glass that has warped once on the injector side does not return warp due to its own weight.
- Thick glass tends to cause a temperature difference between the front and back, but because of its own weight, it works to reduce warpage. For this reason, even if the glass thickness changes between 0.1 and 6.0 mm, the warpage amount itself does not change so much.
- one or more thin films may be formed on the surface of the glass ribbon in advance in the step prior to the slow cooling furnace within a range not impairing the effects of the present invention.
- a base layer may be formed on the surface of the glass ribbon in a float bath.
- the type, configuration, and the like of the laminated film to be formed are not particularly limited and can be appropriately selected.
- an example of forming a transparent conductive film for a solar cell will be described.
- Examples of uses other than the transparent conductive film for solar cells include an antireflection film and a heat ray reflective film.
- FIG. 3 is a cross-sectional view of an embodiment of a transparent conductive substrate for a solar cell manufactured by the method for manufacturing a glass substrate with a laminated film of the present invention. It is illustrated so that the incident light side of the transparent conductive substrate for solar cell is located on the lower side of FIG.
- the transparent conductive substrate 10 for a solar cell includes a titanium oxide layer 14, a silicon oxide layer 16, and a first film as a laminated film 13 on the glass substrate 12 from the glass substrate 12 side. It has the tin oxide layer 18 and the 2nd tin oxide layer 20 in this order.
- the material of the glass substrate 12 is not particularly limited as long as it is a high strain point glass, and may be, for example, borosilicate glass or alkali-free glass.
- the thickness of the glass substrate 12 is preferably 0.1 to 6.0 mm. Within the above range, the balance between mechanical strength and translucency is excellent.
- a titanium oxide layer 14 is formed on the glass substrate 12.
- the aspect having the titanium oxide layer 14 between the glass substrate 12 and the silicon oxide layer 16 is the glass substrate 12 and tin oxide generated due to the difference in refractive index between the glass substrate 12 and the tin oxide layers 18 and 20. Since reflection at the interface with the layers 18 and 20 can be suppressed, this is one of preferred embodiments.
- the titanium oxide is formed on the glass ribbon by the first injector 60a.
- the layer 14 is formed, the silicon oxide layer 16 is formed by the second injector 60b, the first tin oxide layer 18 is formed by the third injector 60c, and the second is formed by the fourth to sixth injectors 60d to 60f.
- the tin oxide layer 20 is formed.
- vaporized tetraisopropoxy titanium is blown from the first orifice 61a, and nitrogen gas is blown from the second and third orifices 61b and 61c.
- tetraisopropoxy titanium undergoes a thermal decomposition reaction on the glass ribbon, and a titanium oxide layer 14 is formed on the surface of the glass ribbon being conveyed.
- silane gas is blown from the first orifice 61a, and oxygen gas is blown from the second and third orifices 61b and 61c.
- silane gas and oxygen gas are mixed and reacted on the titanium oxide 14 layer of the glass ribbon, and the silicon oxide layer 16 is formed on the surface of the titanium oxide layer 14 of the glass ribbon being conveyed.
- tin tetrachloride is blown from the first orifice 61a, and water vapor is blown from the second and third orifices 61b and 61c.
- tin tetrachloride and water are mixed and reacted on the silicon oxide layer 16 of the glass ribbon, and the surface of the silicon oxide layer 16 of the glass ribbon being conveyed is not doped with fluorine.
- a tin oxide layer 18 is formed.
- tin tetrachloride is blown from the first orifice 61a, and hydrogen fluoride vaporized from water vapor is emitted from the second and third orifices 61b and 61c. Is sprayed. Thereby, tin tetrachloride, water, and hydrogen fluoride are mixed and reacted on the first tin oxide layer 18 of the glass ribbon, and the surface of the first tin oxide layer 18 of the glass ribbon in a state of being conveyed. A second tin oxide layer 20 doped with fluorine is formed.
- the glass ribbon on which the second tin oxide layer 20 is formed is discharged from the slow cooling furnace 54 while being transported, cooled to near room temperature, cut into a desired size, and carried out as the transparent conductive substrate 10 for solar cells.
- an oxide material such as titanium oxide, silicon oxide, or tin oxide in the film formation in the slow cooling furnace. This is because the atmosphere in the slow cooling furnace is air, and it is easy to supply oxygen molecules such as oxygen gas when forming oxides.
- the surface temperature Tin of the glass ribbon when passing through the inlet of the slow cooling furnace 54 is defined as Tin, and the surface temperature of the glass ribbon when passing through the outlet of the slow cooling furnace 54 is defined as Tout.
- the glass transition temperature of a glass ribbon be Tg, and let it be glass distortion temperature Ts.
- the surface temperature of the glass ribbon to be formed is Tg or less. If the surface temperature of the glass ribbon is higher than Tg, the glass ribbon is liable to cause “not-engraved marks” or planar defects. In addition, in the temperature region where the surface temperature of the glass ribbon is higher than Tg, the temperature is too high, and the vapor phase growth of the film forming raw material is increased, and the film forming rate is decreased, and film defects due to powder generation are likely to occur. Become.
- the lower limit of the surface temperature of the glass ribbon to be formed is not particularly limited as long as it is higher than Tout, but the surface temperature of the glass ribbon is preferably 510 ° C. or higher.
- the surface temperature of the glass ribbon is lower than 510 ° C., the deposition rate of the laminated film by the CVD method is remarkably reduced. Therefore, it is preferable to complete all the film formation when the glass ribbon has a surface temperature of 510 ° C. or higher.
- At least two layers may be formed at a temperature equal to or higher than Ts. If it is Ts or more, the strain introduced between the laminated film and the glass ribbon can be relaxed.
- At least one layer of the laminated film may be formed at a temperature equal to or lower than Ts.
- the strain temperature is approximately 510 ° C. or less (for example, 510 ° C. for soda lime glass). Therefore, when the film is formed in a state where the temperature of the glass ribbon is equal to or lower than the strain temperature Ts, the film formation speed of the laminated film is remarkably reduced, and it becomes difficult to perform film formation at a realistic film formation speed.
- the glass ribbon used in the present embodiment is a glass ribbon for high strain point glass, and has a strain temperature Ts of 550 ° C. or higher. Therefore, even if the temperature of the glass ribbon is equal to or lower than the strain temperature Ts, the advantage is obtained that the layer can be formed at an appropriate film forming rate if the temperature of the glass ribbon is 510 ° C. or higher. .
- the laminated film 13 composed of the titanium oxide layer 14, the silicon oxide layer 16, the first tin oxide layer 18, and the second tin oxide layer 20 is formed with Tg or less.
- the laminated film 13 is formed within a temperature range of Tg or lower and 510 ° C. or higher.
- the injector 60 Since the injector 60 is maintained at a temperature lower than that of the glass ribbon, heat exchange is performed with the injector 60 during film formation to lower the temperature of the glass ribbon.
- K1 a temperature drop per unit length of the glass ribbon in the temperature region where all laminated films are formed
- K1 is 0. C / m ⁇ K1 ⁇ 10 ° C./m.
- K1 is preferably set to 1 ° C./m ⁇ K1 ⁇ 5° C./m, more preferably 2 ° C./m ⁇ K1 ⁇ 3° C./m.
- the temperature drop K1 is the “temperature difference between the glass ribbon temperature at the inlet of the first injector and the glass ribbon temperature at the outlet of the last injector when forming the laminated film” in the temperature region where the laminated film is formed. Divided by the difference in the distance between the inlet position of the first injector and the outlet position of the last injector. If the temperature drop K1 is 10 ° C./m or more, the glass ribbon may be greatly deformed, and the glass ribbon may be damaged or cracked due to contact between the injector and the glass ribbon. If the temperature drop K1 is 0 ° C./m, the film is formed. In some cases, the glass ribbon is not gradually cooled in the slow cooling furnace 54, and the slow cooling furnace 54 is lengthened because the glass ribbon is gradually cooled after film formation.
- the glass ribbon whose temperature has been lowered by the injector 60 may be heated by an electric heater 56 or the like provided between the injectors 60 adjacent to each other along the glass ribbon transport direction to moderate the temperature drop K1.
- the amount of heat removed by the injector 60 also depends on the area of the lower surface 65 of the injector 60 that faces the glass ribbon. Therefore, the area of the lower surface 65 may be reduced in advance in order to reduce the amount of heat removal.
- the temperature of the glass ribbon used for calculating the temperature drop K1 is the temperature of the upper surface (film formation side) of the glass ribbon.
- the temperature difference between the upper surface of the glass ribbon and the lower surface of the position during film formation is preferably within 10 ° C.
- the center-to-center distance T INJ between the injectors adjacent in the glass ribbon transport direction is 1.0 m ⁇ T INJ ⁇ 25 / N INJ m is preferable.
- the reason why the center-to-center distance T INJ between the adjacent injectors is set to 1.0 m or more is that if the center-to-center distance T INJ is shorter than 1.0 m, the adjacent injectors may be affected.
- the center-to-center distance T INJ between the injectors is set to 1.0 m ⁇ T INJ ⁇ 4.17 m.
- the gap between adjacent injectors in other words, the heater disposition possible length L h is 1.0 ⁇ L INJ m ⁇ L h ⁇ 4.17 ⁇ L INJ m.
- the gap between the lower surface 65 of the injector 60 and the glass ribbon needs to be stable at the time of film formation.
- the gap between the lower surface 65 of the injector 60 and the glass ribbon fluctuates.
- the film thickness and the film quality are likely to be uneven.
- the film thickness is large (for example, 600 nm or more)
- the stress of the film is generated, so that the warp of the glass ribbon after the film formation tends to increase.
- the temperature is higher than the temperature drop of the glass ribbon in the temperature region where the laminated film 13 is formed.
- the glass ribbon can be cooled at a temperature lowering rate.
- the temperature was measured with a contact type K-type thermocouple (sensor, manufactured by Anri Keiki Co., Ltd .: 213K-TC1-ASP).
- Example 1 when producing the high strain point glass, as shown in FIG. 1, six heaters 60a to 60f and electric heaters 56 are arranged between the injectors in the slow cooling furnace, and the first ribbon is placed on the glass ribbon.
- the titanium oxide layer 14 is formed by the second injector 60a
- the silicon oxide layer 16 is formed by the second injector 60b
- the first tin oxide layer 18 is formed by the third injector 60c
- the fourth to sixth injectors are formed.
- the second tin oxide layer 20 was formed at 60d to 60f, and then cut into a desired size to form the transparent conductive film 10 for solar cells shown in FIG.
- the gas blown from the injectors 60a to 60f is as described above.
- the flow rate P of the glass ribbon was 300 ton / day, and the area S of the lower surface of the injector was 0.36 m 2 .
- oxygen gas can be used when producing silicon oxide, the film has no deterioration in film quality and has a low absorption.
- the gap from the lower surface of the injector to the glass ribbon was 7 mm ⁇ 1 mm.
- SiO 2 is 57.6, Al 2 O 3 is 7.0, SiO 2 + Al 2 O 3 is 64.6, MgO is 2.0, and CaO is 5 0.0, SrO 7.0, BaO 8.0, RO (MgO + CaO + SrO + BaO) 22.0, MgO + CaO 7.0, Na 2 O 4.1, K 2 O 6.3, Na 2 O + K 2
- a composition having O of 10.4 and ZrO 2 of 3.0 was used.
- the temperature of the glass ribbon was measured before and after the injector. The distance between measurement points was 2 m. The temperature of the glass ribbon on the lower surface of the center of the injector was calculated. Since the decrease in the temperature of the glass ribbon is mainly due to radiation cooling to the injector, the average temperature before and after the injector was taken as the temperature of the glass ribbon on the lower surface of the center of the injector. Table 1 shows the temperature measurement position and the temperature of the glass ribbon at the center of the injector when the transparent conductive film was formed using six injectors.
- the glass ribbon temperature at the inlet of the slow cooling furnace is 620 ° C.
- the glass ribbon temperature at the outlet of the slow cooling furnace is 250 ° C.
- the glass transition temperature Tg is 625 ° C.
- the glass strain temperature Ts is 570 ° C.
- Tg to Tg ⁇ 35 Three injectors were placed in the temperature range of 625 ° C., ie, in the temperature range of 625 ° C. to 590 ° C., and three layers were formed in the temperature range of Tg to Tg ⁇ 35 ° C.
- Three injectors were arranged in the temperature range from 590 ° C. to 550 ° C., and three layers were formed in the temperature range from Tg-35 ° C. to Ts-10 ° C.
- the temperature drop per unit length in the temperature range from Tg to Tg ⁇ 35 ° C. is 5 ° C./m to 7 ° C./m, and the average is 6 ° C./m. Maintained.
- the temperature drop per unit length in the temperature range from Tg-35 ° C. to Ts was also 2 ° C./m to 3.5 ° C./m.
- the temperature drop K1 per unit length of the glass ribbon in the temperature region for forming all the laminated films was 4.3 ° C./m.
- the temperature of the glass ribbon cooled from the inlet Iin to the outlet Iout of each injector was 4 ° C. to 14 ° C.
- the glass ribbon was gradually cooled at a drop temperature per unit length of 14 ° C./m to 18 ° C./m and an average of 16 ° C./m.
- the glass ribbon was cut into a desired size to obtain a substrate with a transparent conductive film for solar cells.
- the warpage of the transparent conductive substrate for solar cell thus manufactured was measured, the warpage was 0.3 mm and was within an allowable range (1 mm). Also, no scratches or cracks were generated.
- the measurement of the curvature is performed by measuring the distance from the sensor to the surface of the transparent conductive substrate for solar cells while horizontally supporting both ends of the transparent conductive substrate for solar cells having a product size (1100 mm ⁇ 1400 mm). The transparent conductive substrate for solar cells was turned over, the distance from the sensor to the back surface of the transparent conductive substrate for solar cells was measured, and the measurement was performed by eliminating the influence of deflection due to its own weight.
- the temperature of the glass ribbon cooled from the inlet to the outlet of the injector was 14 ° C. or less.
- Table 1 From Table 1, find the temperature difference between the first injector inlet temperature and the last injector outlet temperature, and form the temperature range that forms all the layers divided by the difference of 10.5m in the distance between the first injector inlet position and the last injector outlet position
- Table 2 shows the temperature drop K1 per unit length.
- the temperature drop K1 per unit length of the temperature region forming all the layers was 5.0 ° C./m.
- the laminated film is formed at a temperature of Tg or less.
- Tg temperature of Tg or less.
- any heating means can be used without being limited thereto.
- Transparent conductive substrate for solar cells Glass substrate with laminated film
- Laminated Film 50 Glass Manufacturing Equipment 51 Melting Furnace 52 Float Bath 54 Slow Cooling Furnace 56 Electric Heater 60 Injector 70 Glass Ribbon
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Abstract
Description
前記積層膜は、2層以上の層で構成され、
前記ガラス基板は、歪温度Ts(℃)が550℃以上であり、
前記ガラス基板の転位温度をTg(℃)とした場合、前記積層膜はTg以下で形成され、
前記積層膜の全ての層を形成する温度領域における前記ガラスリボンの単位長さ当たりの降下温度K1が0℃/m<K1<10℃/mであることを特徴とする積層膜付きガラス基板の製造方法が提供される。
SiO2 55~72、
Al2O3 5~18、
MgO 2~8、
CaO 0~8、
SrO 0~8、
BaO 0~10、
MgO+CaO+SrO+BaO 3.5~27、
Na2O 0~15、
K2O 0~12、
ZrO2 0~5、
TiO2 0~5、
を含み、
B2O3を実質的に含有しない組成を有しても良い。
ZrO2 0.5~5
を含有しても良い。
Na2O+K2O 1~19
を含有しても良い。
MgO+CaO 5~15
を含有しても良い。
SiO2+Al2O3 64~82
を含有しても良い。
Fe2O3 0.005~0.1
を含有しても良い。
SiO2 55~72、
Al2O3 5~18、
MgO 2~8、
CaO 0~8、
SrO 0~8、
BaO 0~10、
MgO+CaO+SrO+BaO 3.5~27、
Na2O 0~15、
K2O 0~12、
ZrO2 0~5、
TiO2 0~5、
を含み、
B2O3を実質的に含有しないものであっても良い。
本実施例では、高歪点ガラスの製造に際し、図1に示したように、徐冷炉内に6個のインジェクター60a~60fと各インジェクターの間に電気ヒーター56を配置し、ガラスリボン上に第1のインジェクター60aで酸化チタン層14を形成し、第2のインジェクター60bで酸化ケイ素層16を形成し、第3のインジェクター60cで第1の酸化スズ層18を形成し、第4~第6のインジェクター60d~60fで第2の酸化スズ層20を形成し、その後所望の大きさに切断して、図3に示す太陽電池用透明導電膜10を形成した。各インジェクター60a~60fから吹き出されるガスは上述した通りである。6個のインジェクターは、インジェクター中心間を2m間隔で等間隔に配置した。ガラスリボンの流量Pは、300ton/day、インジェクターの下面の面積Sは、0.36m2であった。特に酸化ケイ素を作成する際に酸素ガスを使用できるために、膜質の劣化がなく、吸収の少ない膜であった。また、インジェクターの下面からガラスリボンまでの隙間を7mm±1mmとした。
13 積層膜
50 ガラス製造装置
51 溶解炉
52 フロートバス
54 徐冷炉
56 電気ヒーター
60 インジェクター
70 ガラスリボン
Claims (17)
- ガラスの原料を溶解する溶解炉と、溶融ガラスを溶融金属上に浮かせてガラスリボンを成形するフロートバスと、前記ガラスリボンを徐冷する徐冷炉と、を備えたガラス製造装置を用いて、CVD法により前記徐冷炉内に設けられた複数のインジェクターで前記ガラスリボン上に積層膜を形成し、前記ガラスリボンを切断する積層膜付きガラス基板の製造方法であって、
前記積層膜は、2層以上の層で構成され、
前記ガラス基板は、歪温度Ts(℃)が550℃以上であり、
前記ガラス基板の転位温度をTg(℃)とした場合、前記積層膜はTg以下で形成され、
前記積層膜の全ての層を形成する温度領域における前記ガラスリボンの単位長さ当たりの降下温度K1が0℃/m<K1<10℃/mであることを特徴とする積層膜付きガラス基板の製造方法。 - 前記ガラス基板は、50℃~350℃での線膨張係数が50×10-7/K~105×10-7/Kであることを特徴する請求項1に記載の製造方法。
- 前記ガラス基板は、ヤング率が75GPa以上であることを特徴する請求項1または2に記載の製造方法。
- 前記ガラス基板は、粘度をη(dPa・s)としたとき、logη=2を満たす温度が1500℃超であり、logη=4を満たす温度が1100~1260℃であることを特徴する請求項1乃至3のいずれか一つに記載の製造方法。
- 前記ガラス基板は、酸化物基準の質量%表示で、
SiO2 55~72、
Al2O3 5~18、
MgO 2~8、
CaO 0~8、
SrO 0~8、
BaO 0~10、
MgO+CaO+SrO+BaO 3.5~27、
Na2O 0~15、
K2O 0~12、
ZrO2 0~5、
TiO2 0~5、
を含み、
B2O3を実質的に含有しないことを特徴する請求項1乃至4のいずれか一つに記載の製造方法。 - 前記ガラス基板は、酸化物基準の質量%表示で、
ZrO2 0.5~5
を含有することを特徴する請求項5に記載の製造方法。 - 前記ガラス基板は、酸化物基準の質量%表示で、
Na2O+K2O 1~19
を含有することを特徴する請求項5または6に記載の製造方法。 - 前記ガラス基板は、酸化物基準の質量%表示で、
MgO+CaO 5~15
を含有することを特徴する請求項5乃至7のいずれか一つに記載の製造方法。 - 前記ガラス基板は、酸化物基準の質量%表示で、
SiO2+Al2O3 64~82
を含有することを特徴する請求項5乃至8のいずれか一つに記載の製造方法。 - 前記ガラス基板は、酸化物基準の質量%表示で、
Fe2O3 0.005~0.1
を含有することを特徴する請求項5乃至9のいずれか一つに記載の製造方法。 - 510℃以上の温度で、前記積層膜の少なくとも二つ以上の層が形成されることを特徴とする請求項1乃至10のいずれか一つに記載の製造方法。
- Ts以上の温度で、前記積層膜の少なくとも二つの層が形成されることを特徴とする請求項1乃至11に記載の製造方法。
- Ts未満の温度で、少なくとも一つの層が形成されることを特徴とする請求項1乃至12のいずれか一つに記載の製造方法。
- 510℃から前記徐冷炉の出口温度までの温度領域における単位長さ当たりの降下温度は、Tgから510℃までの温度領域における前記ガラスリボンの単位長さ当たりの降下温度よりも大きいことを特徴とする請求項1乃至13のいずれか一つに記載の製造方法。
- 前記ガラスリボンの搬送方向に沿って隣り合うインジェクター間にはヒーターが設けられていることを特徴とする請求項1乃至14のいずれか一つに記載の製造方法。
- 前記徐冷炉内に設けられた前記複数のインジェクターの数をNINJとすると、前記搬送方向に沿って隣り合うインジェクターの中心間距離TINJは、1.0m≦TINJ≦25/NINJmであることを特徴とする請求項1乃至15のいずれか一つに記載の製造方法。
- 前記インジェクターの下面とガラスリボンとの距離が、30mm以下であることを特徴する請求項1乃至16のいずれか一つに記載の製造方法。
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EP3186205A1 (en) * | 2014-08-28 | 2017-07-05 | Corning Incorporated | Methods and apparatus for strength and/or strain loss mitigation in coated glass |
WO2017141643A1 (ja) * | 2016-02-17 | 2017-08-24 | 旭硝子株式会社 | 遮熱ガラス |
US20210009458A1 (en) * | 2018-09-21 | 2021-01-14 | sedak GmbH & Co. KG | Device for annealing glass panes |
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