WO2014107818A3 - Lagerungsvorrichtung zur lagerung und/oder zum transport von objekten aus der fertigung von elektronischen bauteilen - Google Patents
Lagerungsvorrichtung zur lagerung und/oder zum transport von objekten aus der fertigung von elektronischen bauteilen Download PDFInfo
- Publication number
- WO2014107818A3 WO2014107818A3 PCT/CH2014/000002 CH2014000002W WO2014107818A3 WO 2014107818 A3 WO2014107818 A3 WO 2014107818A3 CH 2014000002 W CH2014000002 W CH 2014000002W WO 2014107818 A3 WO2014107818 A3 WO 2014107818A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- storing
- production
- site
- objects
- electronic components
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packages (AREA)
Abstract
Die Erfindung betrifft eine Vorrichtung zur Lagerung und/oder zum Transport von Objekten aus der Fertigung von elektronischen Bauteilen ausserhalb einer Prozessanlage, die eine Vielzahl von Aufnahmen zur Lagerung der Objekte aufweist, und die Mittel zur Einleitung von Stickstoff oder einem anderen Inertgas in die Vorrichtung versehen ist, um die Objekte mit Stickstoff zu umspülen. Um bei einer solchen Vorrichtung eine Verbesserung bezüglich einer Vermeidung von Verunreinigungen der Objekte aus dem Bereich der Fertigung von elektrischen Bauteilen erzielen zu können, werden Mittel zur Erwärmung des Stickstoffs oder des Inertgases auf eine Temperatur im Bereich der Objekte von zumindest 30°C oder mehr vorgeschlagen.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00102/13A CH707855B1 (de) | 2013-01-09 | 2013-01-09 | Vorrichtung zur Lagerung von Objekten aus der Fertigung von elektronischen Bauteilen. |
CH102/13 | 2013-01-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2014107818A2 WO2014107818A2 (de) | 2014-07-17 |
WO2014107818A3 true WO2014107818A3 (de) | 2014-12-31 |
Family
ID=50150511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CH2014/000002 WO2014107818A2 (de) | 2013-01-09 | 2014-01-10 | Lagerungsvorrichtung zur lagerung und/oder zum transport von objekten aus der fertigung von elektronischen bauteilen |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH707855B1 (de) |
WO (1) | WO2014107818A2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10573545B2 (en) | 2016-06-28 | 2020-02-25 | Murata Machinery, Ltd. | Substrate carrier and substrate carrier stack |
KR20180001999A (ko) * | 2016-06-28 | 2018-01-05 | 테크-샘 아게 | 개선된 기판 스토리지 및 프로세싱 |
US10643876B2 (en) | 2016-06-28 | 2020-05-05 | Murata Machinery, Ltd. | Substrate carrier and substrate carrier stack |
DE202019101794U1 (de) | 2018-06-27 | 2019-10-09 | Murata Machinery, Ltd. | Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung |
DE202019101793U1 (de) | 2018-06-27 | 2019-10-09 | Murata Machinery, Ltd. | Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung |
DE202019101792U1 (de) | 2018-07-04 | 2019-10-14 | Murata Machinery, Ltd. | Öffnungsvorrichtung |
US10720353B2 (en) | 2018-07-04 | 2020-07-21 | Murata Machinery, Ltd. | Opener apparatus |
US12037193B2 (en) | 2019-09-02 | 2024-07-16 | Murata Machinery, Ltd. | Wafer delivery device, wafer storage container, and wafer storage system |
CN112874863B (zh) * | 2021-02-07 | 2022-09-06 | 东莞阿尔泰显示技术有限公司 | 一种led灯珠的包装结构、叠放包装结构及其工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH031554A (ja) * | 1989-05-29 | 1991-01-08 | Sharp Corp | 半導体ウエハー搬送用クリーンボックス |
WO2013151022A1 (ja) * | 2012-04-04 | 2013-10-10 | 信越ポリマー株式会社 | 基板収納容器 |
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2013
- 2013-01-09 CH CH00102/13A patent/CH707855B1/de active IP Right Maintenance
-
2014
- 2014-01-10 WO PCT/CH2014/000002 patent/WO2014107818A2/de active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH031554A (ja) * | 1989-05-29 | 1991-01-08 | Sharp Corp | 半導体ウエハー搬送用クリーンボックス |
WO2013151022A1 (ja) * | 2012-04-04 | 2013-10-10 | 信越ポリマー株式会社 | 基板収納容器 |
Also Published As
Publication number | Publication date |
---|---|
WO2014107818A2 (de) | 2014-07-17 |
CH707855B1 (de) | 2017-09-15 |
CH707855A2 (de) | 2014-09-30 |
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