WO2014107818A3 - Lagerungsvorrichtung zur lagerung und/oder zum transport von objekten aus der fertigung von elektronischen bauteilen - Google Patents

Lagerungsvorrichtung zur lagerung und/oder zum transport von objekten aus der fertigung von elektronischen bauteilen Download PDF

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Publication number
WO2014107818A3
WO2014107818A3 PCT/CH2014/000002 CH2014000002W WO2014107818A3 WO 2014107818 A3 WO2014107818 A3 WO 2014107818A3 CH 2014000002 W CH2014000002 W CH 2014000002W WO 2014107818 A3 WO2014107818 A3 WO 2014107818A3
Authority
WO
WIPO (PCT)
Prior art keywords
storing
production
site
objects
electronic components
Prior art date
Application number
PCT/CH2014/000002
Other languages
English (en)
French (fr)
Other versions
WO2014107818A2 (de
Inventor
Franz Zaugg
Original Assignee
Tec-Sem Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tec-Sem Ag filed Critical Tec-Sem Ag
Publication of WO2014107818A2 publication Critical patent/WO2014107818A2/de
Publication of WO2014107818A3 publication Critical patent/WO2014107818A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Abstract

Die Erfindung betrifft eine Vorrichtung zur Lagerung und/oder zum Transport von Objekten aus der Fertigung von elektronischen Bauteilen ausserhalb einer Prozessanlage, die eine Vielzahl von Aufnahmen zur Lagerung der Objekte aufweist, und die Mittel zur Einleitung von Stickstoff oder einem anderen Inertgas in die Vorrichtung versehen ist, um die Objekte mit Stickstoff zu umspülen. Um bei einer solchen Vorrichtung eine Verbesserung bezüglich einer Vermeidung von Verunreinigungen der Objekte aus dem Bereich der Fertigung von elektrischen Bauteilen erzielen zu können, werden Mittel zur Erwärmung des Stickstoffs oder des Inertgases auf eine Temperatur im Bereich der Objekte von zumindest 30°C oder mehr vorgeschlagen.
PCT/CH2014/000002 2013-01-09 2014-01-10 Lagerungsvorrichtung zur lagerung und/oder zum transport von objekten aus der fertigung von elektronischen bauteilen WO2014107818A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH102/13 2013-01-09
CH00102/13A CH707855B1 (de) 2013-01-09 2013-01-09 Vorrichtung zur Lagerung von Objekten aus der Fertigung von elektronischen Bauteilen.

Publications (2)

Publication Number Publication Date
WO2014107818A2 WO2014107818A2 (de) 2014-07-17
WO2014107818A3 true WO2014107818A3 (de) 2014-12-31

Family

ID=50150511

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH2014/000002 WO2014107818A2 (de) 2013-01-09 2014-01-10 Lagerungsvorrichtung zur lagerung und/oder zum transport von objekten aus der fertigung von elektronischen bauteilen

Country Status (2)

Country Link
CH (1) CH707855B1 (de)
WO (1) WO2014107818A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10573545B2 (en) 2016-06-28 2020-02-25 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack
KR20180001999A (ko) * 2016-06-28 2018-01-05 테크-샘 아게 개선된 기판 스토리지 및 프로세싱
US10643876B2 (en) 2016-06-28 2020-05-05 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack
DE202019101794U1 (de) 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
DE202019101793U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
US10720353B2 (en) 2018-07-04 2020-07-21 Murata Machinery, Ltd. Opener apparatus
DE202019101792U1 (de) 2018-07-04 2019-10-14 Murata Machinery, Ltd. Öffnungsvorrichtung
KR20220051391A (ko) * 2019-09-02 2022-04-26 무라다기카이가부시끼가이샤 웨이퍼 전달 장치, 웨이퍼 저장 용기 및 웨이퍼 저장 시스템
CN112874863B (zh) * 2021-02-07 2022-09-06 东莞阿尔泰显示技术有限公司 一种led灯珠的包装结构、叠放包装结构及其工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031554A (ja) * 1989-05-29 1991-01-08 Sharp Corp 半導体ウエハー搬送用クリーンボックス
WO2013151022A1 (ja) * 2012-04-04 2013-10-10 信越ポリマー株式会社 基板収納容器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH031554A (ja) * 1989-05-29 1991-01-08 Sharp Corp 半導体ウエハー搬送用クリーンボックス
WO2013151022A1 (ja) * 2012-04-04 2013-10-10 信越ポリマー株式会社 基板収納容器

Also Published As

Publication number Publication date
CH707855A2 (de) 2014-09-30
CH707855B1 (de) 2017-09-15
WO2014107818A2 (de) 2014-07-17

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