WO2014104559A1 - Module flexible de dissipation thermique de del utilisant un substrat en fibre de carbone et procédé de fabrication de celui-ci - Google Patents

Module flexible de dissipation thermique de del utilisant un substrat en fibre de carbone et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2014104559A1
WO2014104559A1 PCT/KR2013/009815 KR2013009815W WO2014104559A1 WO 2014104559 A1 WO2014104559 A1 WO 2014104559A1 KR 2013009815 W KR2013009815 W KR 2013009815W WO 2014104559 A1 WO2014104559 A1 WO 2014104559A1
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Prior art keywords
layer
circuit board
printed circuit
conductive
insulating layer
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PCT/KR2013/009815
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English (en)
Korean (ko)
Inventor
최은국
추정훈
Original Assignee
하이쎌 주식회사
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Publication of WO2014104559A1 publication Critical patent/WO2014104559A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a heat dissipation flexible module for a LED using a carbon fiber substrate and a method for manufacturing the same, and more particularly, a high heat dissipation printed circuit using a carbon fiber substrate as a heat dissipation plate, and including a printed circuit of a conductive paste. It relates to a substrate and a method of manufacturing the same.
  • the high heat dissipation printed circuit board according to the present invention may have more improved heat dissipation characteristics, light weight and ductility, and thus may be applied as a heat dissipation flexible module for LEDs.
  • PCB printed circuit board
  • electrical components such as integrated circuits, resistors, or switches are soldered. Circuits used in most computers and various display devices are installed on the printed circuit board.
  • Common methods for manufacturing the printed circuit board include an etching method and a method using a conductive paste.
  • a laminated plate is manufactured by casting, laminating, and sputtering a copper foil, which is a conductor, on an insulating material of a polymer resin, and applying a photolithography method to dissolving and removing unnecessary parts of the copper foil with chemicals, thereby requiring only a conductive pattern.
  • a photolithography method to dissolving and removing unnecessary parts of the copper foil with chemicals, thereby requiring only a conductive pattern.
  • this etching method uses an etching solution that is harmful to the human body. Therefore, these etching solutions have to be collected and processed, which is not environmentally friendly. Moreover, the cost of the photoresist used in the etching process is high, and the copper layer is used. There are many problems in the loss of material by etching and removing.
  • PCB printed circuit board
  • the conductive ink is generally a material in which metal particles of several tens to several tens of nanometers in diameter are dispersed in a solvent.
  • organic additives such as a dispersant are volatilized, and the metal particles are dispersed. The voids between them shrink and sinter to form conductors that are electrically and mechanically connected to each other.
  • the conductive paste is generally a material in which metal particles of several hundreds to thousands of nanometers in diameter are dispersed in an adhesive resin, and the conductive paste is printed on a substrate, and the resin is cured when heat is applied at a predetermined temperature. And electrical and mechanical contacts between the metal particles are fixed to form conductors connected to each other.
  • LEDs which are expanding their use not only for LCD TV backlights but also for lighting, emit light and heat, unlike ordinary lamps, while driving light, which accounts for about 20-30% and 70-80% of heat. Done. In particular, when heat generated during operation is quickly radiated, the light efficiency is also improved. In order to effectively transmit such heat, a metal circuit board is generally used.
  • a heat sink may be provided under the substrate, and a metal such as aluminum or magnesium is mainly used as a conventional substrate material.
  • the metal has the disadvantage that the weight of the substrate can not be reduced, and has a limitation that easy processing is difficult.
  • Japanese Patent Application Laid-Open No. 10-2012-0082947 discloses an aluminum substrate layer and a technology related to a heat dissipating laminate in which an adhesive layer, a resin layer, an adhesive layer, and a copper layer or an aluminum layer are laminated on the aluminum substrate layer.
  • Patent Application Publication No. 10-2012-0072801 Discloses an electrodeposition coating in which a first insulating layer by anodizing is formed, electrodeposited, and a second insulating layer is formed to form a circuit. The high heat dissipation substrate used and its manufacturing method are described.
  • an object of the present invention is to provide a novel high heat dissipation printed circuit board and a manufacturing method thereof having excellent heat dissipation efficiency and high strength.
  • Another object of the present invention is to provide a printed circuit board that includes a light-weight heat-dissipating substrate and improves conductivity while reducing the thickness of a wiring layer when forming a pattern by a direct printing method of a conductive paste.
  • the present invention is to provide a heat-dissipating flexible module for LED that can reduce heat generation and slim the product by using the high heat-dissipation printed circuit board and excellent electrical conductivity and uniformity and thickness of the wiring layer. For other purposes.
  • the present invention is a heat radiation layer comprising a carbon fiber fabric; An insulation layer formed on the heat dissipation layer; A wiring layer formed on the insulating layer and patterned by a printing method of a conductive paste composition; And a metal plating layer formed on the patterned wiring layer.
  • the wiring shape of the patterned wiring layer is formed between the insulating layer and the wiring layer patterned by the printing method of the conductive paste composition so as to partially support the patterned wiring layer by being formed on the insulating layer. Accordingly, a second insulating layer may be additionally formed.
  • the present invention comprises a carbon fiber fabric by heating the binder having fluidity at high temperature to convert it into a liquid phase and filling it in the empty space made by the weft and warp of at least one or more carbon fiber fabrics to be used as a heat dissipation layer, Forming a heat dissipation layer;
  • the base substrate is attached by attaching one insulating layer selected from polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, heat resistant epoxy, polyarylate and polyimide to the heat dissipating layer.
  • Forming Forming a patterned wiring layer by printing a conductive paste composition comprising any one or a mixture thereof selected from conductive Ag paste, conductive Cu paste, conductive polymer, and gravure paste on the insulating layer of the base substrate in a predetermined pattern. step; And forming a metal plating layer on the patterned wiring layer by plating.
  • the method of manufacturing the printed circuit board may include:
  • the present invention is a conductive Ag paste on any one insulating layer selected from polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, heat-resistant epoxy, polyarylate and polyimide, Forming a patterned wiring layer by printing a conductive paste composition including any one or a mixture thereof selected from a conductive Cu paste, a conductive polymer, and a gravure paste in a predetermined pattern; Forming a metal plating layer on the patterned wiring layer by plating; Forming a heat dissipating layer comprising a carbon fiber fabric by heating the binder having fluidity at a high temperature to convert it into a liquid phase and filling it into an empty space formed by the weft and warp of at least one carbon fiber fabric to be used as a heat dissipating layer. ; And attaching an insulating layer including the wiring layer and the metal plating layer by the conductive paste to the heat dissipating layer.
  • the present invention can provide a heat dissipation flexible module for an LED including the high heat dissipation printed circuit board.
  • the high heat dissipation printed circuit board of the present invention is excellent in heat dissipation efficiency, has a high strength, and has the advantage of meeting the slimming of electronic products.
  • the present invention includes a heat-dissipating substrate which is light in weight, and can provide a printed circuit board having improved conductivity while thinning the thickness of the wiring layer by metal plating after forming the wiring by the direct printing method of the conductive paste.
  • the high heat dissipation printed circuit board of the present invention can reduce heat generation by reducing the uniformity and thickness of the wiring layer and the excellent electrical conductivity when used as a heat dissipation module for LEDs, and also can reduce the product weight with light weight and ductility. There is an advantage.
  • FIG. 1 is a cross-sectional view of a high heat radiation printed circuit board according to an embodiment of the present invention.
  • Figure 2 is a view showing a carbon fiber fabric which is a material of the heat sink used in the present invention.
  • FIG 3 is a cross-sectional view of a high heat radiation printed circuit board in which a binder is filled in a void space of a carbon fiber fabric when the heat dissipation layer is manufactured according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional view of a high heat radiation printed circuit board according to another embodiment of the present invention.
  • FIG. 5 is a diagram illustrating a manufacturing method of a high heat radiation printed circuit board according to an exemplary embodiment of the present invention.
  • FIG. 6 is a diagram illustrating a manufacturing method of a high heat radiation printed circuit board according to another embodiment of the present invention.
  • the high heat radiation printed circuit board according to the present invention is a heat radiation layer 12 including a carbon fiber fabric, an insulating layer 11 formed on the heat radiation layer, formed on the insulating layer and conductive
  • a high heat radiation printed circuit board comprising a wiring layer 10 patterned by a printing method of a paste composition and a metal plating layer 13 formed on the patterned wiring layer.
  • the heat dissipation layer of the high heat radiation printed circuit board includes a carbon fiber fabric.
  • carbon materials have high strength and thermal conductivity, and have a low density compared to metals, so that a lightweight substrate can be produced.
  • the present invention is to use the carbon fiber in the form of a fabric to improve the durability to use as a heat radiation layer.
  • carbon fiber is carbonized as polyacrylonitrile yarn, viscose yarn, pitch-based yarn, etc. are stretched in the longitudinal direction, and the carbon fiber has advantages of high strength and thermal conductivity such as electrical and mechanical properties. It is researched in various applications such as materials and precision machine parts.
  • Figure 2 shows a figure showing a carbon fiber fabric as a material of the heat dissipation layer used in the present invention.
  • the carbon fiber fabric is a woven fabric of carbon fibers by warp and weft yarns, and as shown in FIG. 2, the structure is not a flat structure but has a half space between the warp yarns and the weft yarns.
  • the portion directly contacting the insulating layer may have a problem in adhesive strength and heat dissipation effect.
  • a binder may be used to fill the half space between the warp yarn and the weft yarn.
  • the binder used should have fluidity at a high temperature, and a high thermal conductivity should be used.
  • the binder may be used regardless of its kind as long as it has excellent chemical resistance, but preferably, epoxy or silicone may be used.
  • epoxy or silicone may be used.
  • Figure 3 is a view showing a cross-sectional view of a high heat radiation printed circuit board in which the bonding agent is filled in the empty space of the carbon fiber fabric in the manufacture of the heat dissipation layer.
  • the binder shown in the voids of the carbon fiber fabric flows sufficiently between the voids of the carbon fiber fabric to fill the voids, and there is no air or void space between the bonding surface with the insulating layer.
  • the bonding agent must be melted in a viscous liquid state by heating to be introduced into the carbon fabric to form a bonding surface with the insulating layer without the void space, thereby having good thermal conductivity.
  • the binder component may include a metal powder, a polymer material powder, a ceramic powder, or a mixed powder thereof having excellent thermal conductivity selected from among aluminum, copper, and nickel.
  • the average particle diameter of the metal powder which may be additionally included in the binder component may range from 0.1 um to 10 um.
  • the heat dissipation layer in the present invention may be a plurality of carbon fiber fabric is laminated.
  • the binder component may be obtained by laminating each carbon fiber fabric with the binder component already filled or by filling the binder at once after laminating each carbon fiber fabric.
  • a heat dissipation layer can be formed.
  • the thickness of the heat dissipation layer of the carbon fiber fabric containing the binder may be 10um to 150um, preferably 40um to 80um.
  • the insulating layer and the heat dissipating layer may be more easily attached to the heat dissipating layer made of the carbon fiber fabric including the bonding agent by using an additional adhesive or an additional adhesive of epoxy or silicon type.
  • the insulating layer may be used a variety of substrates such as polymer materials, ceramics, glass, silicon, more preferably polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, It may be any one selected from heat resistant epoxy, polyarylate and polyimide.
  • the thickness of the insulating layer should be thin in order to improve heat dissipation characteristics, but when the insulating layer becomes thinner, withstand voltage characteristics (the highest voltage that can withstand without destroying the insulation mechanism, MPCB generally used Must withstand 5,000 V / min.) And fall off to find the balance of both characteristics and adjust accordingly.
  • the thickness of the insulating layer that can be used may be 10um to 100um, preferably 12um to 25um.
  • the conductive paste wiring layer formed on the insulating layer may be formed by printing the conductive paste composition by a printing method.
  • the conductive paste used in the present invention includes particles of electrically conductive materials, which are conductive metals, nonmetals or powders of oxides, carbides, borides, nitrides, carbonitrides, and carbon such as carbon black and graphite. It includes a system powder.
  • the conductive paste particles may be formed of, for example, gold, aluminum, copper, indium, antimony, magnesium, chromium, tin, nickel, silver, iron, titanium, alloys thereof, and oxides, carbides, borides, nitrides, and carbonitrides thereof. It may include particles.
  • the shape of the particles is not particularly limited, and for example, plate-shaped, fiber-type and nano-sized nanoparticle nanotubes may be used. These conductive particles may be used alone or in combination.
  • the conductive paste may further include a binder to improve adhesion to the substrate, and generally, an epoxy resin, a phenol resin (phenol + formaldehyde), and a polyurethane resin.
  • Organic binders such as polyamide resin, acrylic resin, urea / melamine resin and silicone resin can be used.
  • the content of the binder may generally range from 10 to 50 wt% with respect to the content of the total paste composition, preferably from 15 to 40 wt%, but is not limited thereto.
  • the binder serves to reduce the electrical conductivity of the wiring layer including the conductive paste.
  • the viscosity of the conductive paste composition used in the present invention may be used in the range of 23 °C, 50 rpm HAKKE RHeoscope measurement standard 10,000 cps ⁇ 100,000 cps, but is not limited thereto.
  • additives may include Ag powder (pigment), natural and synthetic resins (binder), solvents, dispersants, coupling agents, viscosity modifiers and the like.
  • the conductive paste composition in the present invention may be preferably any one selected from conductive Ag paste, conductive Cu paste, conductive polymer, paste for gravure, or a mixture thereof.
  • the gravure paste is a kind of conductive silver (Ag) paste and has a particle size of 0.1 to 3 ⁇ m.
  • the gravure paste may be composed of 75% Ag powder, 10% resin, and 13% solvent 13% additive.
  • the particle size of the conductive paste composition may be in the range of 10 nm to 10 um, and a conductive paste having a 30 to 1,000 nm nanoparticle size or a conductive paste having a micro particle size of 1 to 7 um is preferable.
  • the conductive paste may form a wiring layer patterned in a pattern of a shape desired by a user by a direct printing method on a substrate.
  • the direct printing method may include a printing method such as screen printing, flexographic printing, rotary printing, gravure printing, offset printing, or dispenser on a substrate.
  • a conventionally well-known means can be used.
  • screen printing, gravure printing or offset printing is preferable.
  • the circuit wiring implemented by printing a conductive paste on the substrate has a high resistance, so the conductivity is not good, so it is difficult to use it as a circuit wiring, and there is a problem in that adhesion is not performed when using general solder paste. .
  • a metal plating layer may be formed on the conductive paste wiring.
  • the metal plating layer formed on the conductive paste wiring layer may be formed by electrolytic plating or electroless plating.
  • the thickness of the metal plating layer formed on the patterned wiring layer is 1 um to 10 um, preferably 2 to 5 um.
  • the metal plating layer in the present invention may be formed by electroless plating.
  • the uniformity of the wiring can be better than that of the metal plating layer formed by electroplating. This will be described in more detail below.
  • the start point of the wiring during the electroplating is located close to the electrode, and the reduction reaction of the metal occurs well so that the plating layer can be smoothly formed on the conductive paste layer, but as the wiring layer including the paste layer moves away from the starting point, The electrical conductivity of the paste is not as good as that of metal, and the efficiency of the reduction of metal ions is reduced due to the presence of a resistance along the length of the conductive paste. Therefore, as the wiring moves away from the starting point of the electrode, the thickness of the plating layer formed may become thin, and even the wiring may be formed discontinuously.
  • the thickness of the plating layer is made thick, the thickness of the finally manufactured circuit board may be thickened, and it may also provide a cause of defects during printing due to the high thickness.
  • the disadvantage of thickening the circuit board which is a problem caused by thickening the plating layer to improve the conductivity of the wiring, can be improved. It is possible to form a narrower width (pitch width) between the wiring lines than forming the metal plating layer by electroplating. Because in order to overcome the disadvantage that the thickness of the electroplating layer according to the length of the wiring during the electroplating, it is necessary to increase the thickness of the plating layer as described above, for this purpose, the plating amount should be increased during the electroplating, in this case, the wiring layer Only the upper end portion of is not plated, and the side portion of the wiring layer may be plated.
  • the plating layer is formed on the side of the wiring layer by making the thickness of the plating layer thick, so that the width (pitch width) between the wiring lines is narrowly formed.
  • the thickness of the electroplating layer according to the length of the wiring is not solved.
  • the width (pitch width) between the wiring lines can be formed narrower than that in the case of forming the plating layer by electroplating.
  • the metal plating layer is formed by electroless plating, and optionally, a metal plating layer by electroplating may be additionally formed on the plating layer formed by the electroless plating.
  • the metal used in the electroless metal plating in the present invention may be any one selected from Cu, Sn, Ag, Au, Ni or alloys thereof, but is not limited thereto.
  • Cu, Ag or Ni can be used.
  • the wiring layer formed by the electroless plating can form a layer thinner than the wiring layer by the conventional electroplating, and thus has the advantage of improving the electrical conductivity of the wiring.
  • a seed metal layer for forming the electroless metal plating layer may be further formed between the patterned conductive paste wiring layer and the electroless metal plating layer.
  • the seed metal layer may improve the reaction rate and selectivity of the electroless plating by allowing the seed metal to be adsorbed on the paste layer and thereby reducing the metal ions forming the electroless chemical plating layer.
  • the metal for forming the seed metal layer may be selected from Au, Ag, Pt, Cu, Ni, Fe, Pd, Co, or an alloy thereof, and seed metal components such as halides, sulfates, acetates, complex salts of seed metal components, and the like. Any component can be used as long as it is a transition metal salt.
  • the seed metal layer may contain other additional transition metal components other than the seed metal component.
  • transition metal components other than the seed metal may be contained using transition metal salts such as metal halides, metal sulfates, and metal acetates, and for this purpose, the same metal components as those of the electroless plating layer formed on the conductive paste layer may be used. It is preferable to use a salt of.
  • the electroless plating layer can be formed more quickly, and the electroless plating layer serves to help the electroless plating layer be formed only on the wiring layer on the conductive paste.
  • the wiring layer formed by the electroless plating of the present invention can form a layer thinner than the wiring layer by the conventional electroplating, there is an advantage that can improve the electrical conductivity of the wiring.
  • the electroless metal plating layer further comprises an electrolytic metal plating layer
  • the electrolytic metal plating layer further formed is any one selected from Ni, Cu, Sn, Au, Ag or alloys thereof, or Ni-P alloy, which is formed on the electroless plating layer, may be electroplated onto a metal wiring layer having a higher electrical conductivity than the conductive paste, thereby conducting a wiring layer (a layer including a conductive paste layer, an electroless plating layer, and an electroplating layer). Can be further improved.
  • the present invention is a wiring shape of the patterned wiring layer so as to support the patterned wiring layer by being partially formed on the insulating layer between the insulating layer and the wiring layer patterned by the printing method of the conductive paste composition. Accordingly, a second insulating layer may be additionally provided.
  • FIG. 4 is a cross-sectional view of a high heat dissipation printed circuit board including the second insulating layer of the present invention. Looking at this, it can be seen that the second insulating layer 15 is provided between the conductive paste wiring layer 10 and the insulating layer 11.
  • the second insulating layer 15 may be formed by a printing method, and more specifically, the liquid thermal conductive insulating material may be formed as a second insulating layer by a printing method.
  • the second insulating layer 15 may be any one selected from polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, heat resistant epoxy, polyarylate and polyimide.
  • One polymer resin may be selected, and the second insulating layer may have a thickness in the range of 5 um to 50 um, preferably 10 um to 20 um, and the width of the insulating layer may be defined by the patterned wiring layer. It may be 1.5 to 10 times the wiring width.
  • the withstand voltage characteristic may be increased in the vicinity of the circuit wiring realized by the conductive paste, and the heat dissipation effect to the external space may be increased in the part away from the circuit wiring.
  • a heat dissipation coating layer may be additionally formed on the top and / or bottom of the finally obtained printed circuit board.
  • the heat dissipation coating layer further enables an improved heat dissipation effect of 3 to 5% than the heat dissipation coating layer is not formed by widening the surface area.
  • the printed circuit board manufactured by the present invention may have heat reduction and improved heat dissipation characteristics, light weight, and ductility due to improved electrical conductivity, and thus may be applied as a heat dissipation flexible module for LEDs.
  • the wiring layer (the layer consisting of the conductive paste layer and the plating layer) is used as a current supply line to form a contact point so that the LED can be positioned on the wiring line formed by the wiring layer, and to solve the heat generated by the LED.
  • a heat dissipation layer containing a heat dissipation material by selectively providing an LED support to support the LED, it is applicable to the heat dissipation flexible module for LEDs.
  • the present invention can provide a method for manufacturing the high heat radiation printed circuit board, which will be described with reference to FIGS. 5 and 6.
  • FIG. 5 is a diagram illustrating a method of manufacturing a high heat radiation printed circuit board according to a method of forming a base substrate by attaching the heat dissipation layer to an insulating layer and then forming a wiring layer on the insulating layer.
  • a carbon fiber fabric by heating a binder having fluidity at a high temperature to convert it into a liquid phase and filling it in the empty space formed by the weft and warp of at least one or more carbon fiber fabrics to be used as a heat dissipating layer.
  • Forming a heat dissipation layer The base substrate is attached by attaching one insulating layer selected from polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, heat resistant epoxy, polyarylate and polyimide to the heat dissipating layer.
  • Forming Forming a patterned wiring layer by printing a conductive paste composition comprising any one or a mixture thereof selected from conductive Ag paste, conductive Cu paste, conductive polymer, and gravure paste on the insulating layer of the base substrate in a predetermined pattern. step; And forming a metal plating layer on the patterned wiring layer by plating.
  • a carbon fiber fabric is included by filling a void formed by the weft and warp of at least one carbon fiber fabric to be used as a heat dissipating layer by heating the binder having fluidity at a high temperature.
  • the step of forming the heat dissipation layer is achieved by impregnating a carbon fiber fabric with a heated epoxy- or silicone-based binder.
  • the binder content may be impregnated with 10 to 50% by weight of the total weight, the heating temperature of the binder may be adjusted according to the viscosity characteristics according to the type and temperature of the binder, vacuum or in a carbon fiber fabric It is preferable to make viscosity low enough so that the part which contains air does not generate
  • the impregnated carbon fiber fabric optionally has a sufficient fluidity by adopting a step of different heating temperature, such as the first heating process (100 to 150 °C) and the second heating process (150 to 230 °C), etc. Can be impregnated with carbon fabrics.
  • an ultrasonic device or the like may be used to increase the impregnation efficiency of the binder.
  • the carbon fiber fabric impregnated with the binder can be cooled to room temperature and used in subsequent processes.
  • the heat dissipating layer may be laminated with a plurality of carbon fiber fabrics, in which case each of the plurality of carbon fiber fabrics is laminated with each after the binder component is impregnated into each carbon fiber fabric as described above.
  • the thermal radiation layer may be formed by impregnating and filling the binder at a time after laminating each carbon fiber fabric.
  • the manufacturing method of the present invention as described above for the binder component, it is possible to form a heat dissipation layer comprising a metal powder having excellent thermal conductivity selected from aluminum, copper, nickel or mixed powder thereof.
  • a polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, heat resistant epoxy, polyarylate and poly Attaching any one insulating layer selected from the mid to form a base substrate may be performed by attaching an insulating layer to the heat dissipating layer and laminating it through a hot press process.
  • the hot press process may be performed through a vacuum hot press process. This is to prevent partial generation of air or vacuum inside the heat dissipating layer including the bonding agent and the bonding interface with the insulating layer, and the hot press process is performed for 10 minutes at a pressure of 10 to 30T, preferably 15 to 25T. To 1 hour.
  • the insulating layer and the heat dissipating layer may be more easily attached to the heat dissipating layer made of the carbon fiber fabric including the bonding agent by using an additional adhesive or an additional adhesive.
  • the thickness of the pressure-sensitive adhesive layer or the adhesive layer by the additional pressure-sensitive adhesive or additional adhesive may be formed in 1 um ⁇ 20 um.
  • an epoxy or silicone type may be used as the pressure-sensitive adhesive.
  • the third step is patterned by printing a conductive paste composition including any one or a mixture thereof selected from conductive Ag paste, conductive Cu paste, conductive polymer, and gravure paste on the insulating layer of the base substrate in a predetermined pattern. Forming a wiring layer.
  • This may form a patterned wiring layer through pad printing, silk screen printing, gravure printing, and the like, as described above, and the particle size of the conductive paste composition may be in the range of 10 nm to 10 um, such as salpin bars.
  • a conductive paste having a particle size of 30 to 1,000 nm or a conductive paste having a micro particle size of 1 to 7 um is preferable.
  • the drying method is not limited to the type corresponding to the degree appropriately selected and applied by those skilled in the art according to the process conditions used, but from 80 to 200 degrees, preferably from 100 to 160 degrees 10 minutes to 3 Hot air drying can be used for hours.
  • the paste may undergo a curing step depending on the conditions of use.
  • the forming of the metal plating layer by plating on the patterned wiring layer is a step of forming a plating layer by electroplating or electroless plating.
  • the present invention may form a metal plating layer on the patterned wiring layer by electroless plating.
  • an electroless plating layer may be formed on the paste by using a transition metal salt, a reducing agent, a complex, or the like. Can be formed.
  • the electroless plating may be performed by reducing metal ions by a reducing agent by reducing and depositing a metal on a substrate or the like using a plating solution in which a compound containing a metal ion and a reducing agent are mixed.
  • the metal ions can be reduced by the reaction scheme described below.
  • non-limiting examples of the metal used for electroless plating may be Ag, Cu, Au, Cr, Al, W, Zn, Ni, Fe, Pt, Pb, Sn, Au, and the like. May be used alone or in combination of two or more thereof.
  • the plating solution used in the electroless plating may include a salt and a reducing agent of a metal to be plated, and non-limiting examples of the reducing agent may include formaldehyde, hydrazine or salts thereof, cobalt sulfate (II), formalin, Glucose, glyoxylic acid, hydroxyalkylsulfonic acid or salts thereof, hypophosphoric acid or salts thereof, boron hydride compounds, dialkylamine boranes, and the like, and various reducing agents may be used depending on the type of metal.
  • the reducing agent may include formaldehyde, hydrazine or salts thereof, cobalt sulfate (II), formalin, Glucose, glyoxylic acid, hydroxyalkylsulfonic acid or salts thereof, hypophosphoric acid or salts thereof, boron hydride compounds, dialkylamine boranes, and the like, and various reducing agents may be used depending on
  • the electroless plating solution may be prepared by forming a metal salt with a metal ion, a metal ion and a ligand to form a ligand and a complexing agent for preventing the metal from being reduced in the liquid phase and unstable solution. It may include a pH adjuster to maintain a suitable pH.
  • the thickness of the electroless metal plating layer is 1 um to 30 um, preferably 1 um to 10 um, the metal used for the electroless metal plating is Ag, Cu, Au, Cr, Al, W, Zn, It may be any one selected from Ni, Fe, Pt, Pb, Sn, Au or alloys thereof.
  • a copper (copper) plating layer 1 to 30 using copper sulfate, formarin, sodium hydroxide, ethylene diamin tera acetyl acetate (EDTA) and an aqueous solution to which 2.2-bipyridyl is added as an accelerator
  • An electroless plating layer can be formed with a thickness of ⁇ m.
  • the electroless copper plating step may use a barrel plating apparatus.
  • the electroless plating of the present invention is composed of 85% D / I Water, 10-15% supplement, 25% -NaOH 2-5%, stabilizer 0.1-1%, 37% formalin 0.5-2% After air stirring for 10 to 15 minutes, the plating process can be performed for 25 to 30 minutes at a temperature of 40 to 500 °C, pH 13 or more.
  • the present invention provides a method for forming an electroless metal plating layer on top of the wiring layer, between forming the wiring layer of the conductive paste and forming a plating layer by electroless plating a transition metal on the patterned wiring layer.
  • the method may further include forming a seed metal layer.
  • the seed metal layer may be selected from Au, Ag, Pt, Cu, Ni, Fe, Pd, Co, or an alloy thereof, and may further contain other transition metal components other than the seed metal component.
  • a palladium salt may be used as the seed metal layer, and additional transition metal components may be contained using transition metal salts such as metal halides, metal sulfates, and metal acetates, and for this purpose, the electroless plating layer formed on the conductive paste layer may be used.
  • the salt of the same metal component as a component can be used.
  • the silver paste as a conductive paste in the aqueous solution may be dipped out of the substrate having the patterned pattern on the surface of the protective layer for 3 to 5 minutes, and then the electroless chemical copper plating may be performed through a drying process.
  • the resistance value of the electroless plating layer is low, the electrical conductivity is increased, and if a lower resistance is required, the resistance of the electroless copper plating may be increased by increasing the content of the metal to be plated.
  • the forming of the metal plating layer by electroplating on the patterned wiring layer may include forming the patterned wiring layer in an aqueous solution of copper plating, for example, copper sulfate (CuSO 4 ), sulfuric acid (H 2 SO 4 ), and a polishing agent.
  • the electroplating layer can be formed by immersing the formed substrate to form an electrolytic copper plating layer with a desired thickness and washing the surface with water.
  • electrolytic copper plating may be carried out in a 10 wt% aqueous solution of sulfuric acid, copper sulfate 90 g / L, copper stabilizer 2 ml / L, copper copper polish 5ml / L, and HCI 0.16 ml / L at a temperature of 40 ° C. to 60 ° C.
  • the present invention can perform an electroless silver plating process after the paste printing process and the electroless copper plating process.
  • the process conditions in this case also follow the general silver plating process, except that the metal salt used is silver salt (AgNo 3 ) rather than copper salt.
  • the plating layer can raise the thickness of 0.3 ⁇ 0.4 um, it can raise the thickness up to 0.1 ⁇ 1um according to the control of time.
  • the present invention may further proceed to form a plating layer by using electroless plating or electroplating as described above.
  • the electrolytic nickel is plated using an aqueous solution of nickel sulfate, nickel chloride, and boric acid on a copper surface plated in the electrolytic copper plating step, and then washed with water. Ultrasonic washing with ionized water is followed by drying through dehydration to produce products that meet the required properties.
  • the electrolytic copper plating may be increased to increase the content of the metal to be plated, thereby having a low resistance.
  • the present invention is the wiring of the patterned wiring layer so as to support the patterned wiring layer by being partially formed on the insulating layer between the step of forming the base substrate and forming the patterned wiring layer.
  • the method may further include forming a second insulating layer along the shape.
  • the second insulating layer may be formed by a printing method, and more specifically, as described above with reference to the liquid thermal conductive insulating material, the second insulating layer may be printed by pad printing, silk screen printing, gravure printing, or the like. It can be formed as an insulating layer of
  • the second insulating layer is any one polymer selected from polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, heat resistant epoxy, polyarylate and polyimide.
  • the resin may be selected, and the second insulating layer may have a thickness in the range of 5 um to 50 um, preferably 10 um to 20 um, and the width of the insulating layer is 1.5 to 10 times the wiring width of the wiring layer. Can be.
  • the present invention is different from the method shown in Figure 5, after the formation of the wiring layer on the insulating layer to form a heat dissipation layer and manufacturing the high heat-dissipation printed circuit board according to the method of attaching it to the insulating layer including the wiring layer A method can be provided which can be seen through FIG. 6.
  • conductive Ag paste conductive on any one insulating layer selected from polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, heat resistant epoxy, polyarylate and polyimide
  • a heat dissipation coating may be additionally performed on the top and / or bottom of the finally obtained printed circuit board. In this case, there is an advantage that additional heat radiation effect of 3 ⁇ 5% can be obtained.
  • the high heat dissipation printed circuit board of the present invention can be used as a heat dissipation flexible module for LEDs because it can have reduced heat generation and improved heat dissipation, light weight, and ductility due to improved electrical conductivity.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne une carte de circuits imprimés à dissipation thermique élevée et un procédé de fabrication de celle-ci, la carte de circuits comprenant : une couche de dissipation thermique comprenant un tissu en fibres de carbone ; une couche isolante formée sur la couche de dissipation thermique ; une couche de câblage formée sur la couche isolante et ayant des motifs formés par un procédé d'impression d'un composite de pâte conductrice ; et une couche de dépôt métallique formée sur la couche de câblage à motifs. Etant donné que la carte de circuits imprimés à dissipation thermique élevée, selon la présente invention, peut avoir des caractéristiques relativement améliorées de dissipation thermique, de faible poids et de flexibilité, la carte de circuits imprimés à dissipation thermique élevée peut être appliquée à un module flexible de dissipation thermique de DEL.
PCT/KR2013/009815 2012-12-28 2013-11-01 Module flexible de dissipation thermique de del utilisant un substrat en fibre de carbone et procédé de fabrication de celui-ci WO2014104559A1 (fr)

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KR1020120156549A KR101399980B1 (ko) 2012-12-28 2012-12-28 탄소 섬유 기판을 이용한 led용 방열 플렉서블 모듈 및 이의 제조 방법
KR10-2012-0156549 2012-12-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104754862A (zh) * 2015-04-10 2015-07-01 松扬电子材料(昆山)有限公司 用于柔性线路板的铝箔镀铜基板及制作方法
WO2016137155A1 (fr) * 2015-02-24 2016-09-01 송인실 Panneau d'éclairage flexible
KR20180005777A (ko) * 2016-07-06 2018-01-17 이영순 표면실장 전자부품용 실리콘 가스켓의 제조방법 및 그를 통해 얻어진 실리콘 가스켓

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102071264B1 (ko) * 2017-07-24 2020-01-30 한국기계연구원 방열 기판 및 이의 제조방법
CN107613588B (zh) * 2017-08-14 2023-12-05 深圳市维特欣达科技有限公司 一种快热式发热板的制备方法及快热式发热板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181261A (ja) * 1994-12-27 1996-07-12 Nippon Steel Corp 半導体装置用ヒートスプレッダーおよびその製造法ならびに半導体装置
JP2001044332A (ja) * 1999-08-03 2001-02-16 Shinko Electric Ind Co Ltd 半導体装置
JP2006165299A (ja) * 2004-12-08 2006-06-22 U-Ai Electronics Corp プリント基板の製造方法
KR20060100142A (ko) * 2005-03-16 2006-09-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치용 직물 방열시트 및 이를 구비한플라즈마 디스플레이 장치
JP2011061157A (ja) * 2009-09-14 2011-03-24 Starlite Co Ltd Ｌｅｄ用ヒートシンク及び自動車用ｌｅｄランプ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181261A (ja) * 1994-12-27 1996-07-12 Nippon Steel Corp 半導体装置用ヒートスプレッダーおよびその製造法ならびに半導体装置
JP2001044332A (ja) * 1999-08-03 2001-02-16 Shinko Electric Ind Co Ltd 半導体装置
JP2006165299A (ja) * 2004-12-08 2006-06-22 U-Ai Electronics Corp プリント基板の製造方法
KR20060100142A (ko) * 2005-03-16 2006-09-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치용 직물 방열시트 및 이를 구비한플라즈마 디스플레이 장치
JP2011061157A (ja) * 2009-09-14 2011-03-24 Starlite Co Ltd Ｌｅｄ用ヒートシンク及び自動車用ｌｅｄランプ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016137155A1 (fr) * 2015-02-24 2016-09-01 송인실 Panneau d'éclairage flexible
CN104754862A (zh) * 2015-04-10 2015-07-01 松扬电子材料(昆山)有限公司 用于柔性线路板的铝箔镀铜基板及制作方法
KR20180005777A (ko) * 2016-07-06 2018-01-17 이영순 표면실장 전자부품용 실리콘 가스켓의 제조방법 및 그를 통해 얻어진 실리콘 가스켓
KR101883391B1 (ko) * 2016-07-06 2018-08-01 이영순 표면실장 전자부품용 실리콘 가스켓의 제조방법 및 그를 통해 얻어진 실리콘 가스켓

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