WO2014101048A1 - 高效散热装置 - Google Patents

高效散热装置 Download PDF

Info

Publication number
WO2014101048A1
WO2014101048A1 PCT/CN2012/087677 CN2012087677W WO2014101048A1 WO 2014101048 A1 WO2014101048 A1 WO 2014101048A1 CN 2012087677 W CN2012087677 W CN 2012087677W WO 2014101048 A1 WO2014101048 A1 WO 2014101048A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
heat dissipation
heat dissipating
hydrophilic layer
substrate
Prior art date
Application number
PCT/CN2012/087677
Other languages
English (en)
French (fr)
Inventor
冯进
Original Assignee
Feng Jin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Feng Jin filed Critical Feng Jin
Priority to PCT/CN2012/087677 priority Critical patent/WO2014101048A1/zh
Publication of WO2014101048A1 publication Critical patent/WO2014101048A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/02—Coatings; Surface treatments hydrophilic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an efficient heat dissipation technology; and more particularly to an efficient heat dissipation device for a high power device or device.
  • BACKGROUND OF THE INVENTION The energy consumed by modern industrial equipment is increasing, and the excess heat generated is also increased. The subsequent heat dissipation is an urgent problem to be solved by engineers. Taking a computer as an example, because the current computer system is running faster and faster, the heat generated by the computer system is greatly increased at any time. The heat generated during the operation of the computer system will be reduced if not quickly transferred. The efficiency of the computer system, when reaching a certain temperature, can also cause the computer system to crash or be damaged.
  • an efficient heat sink is needed to transfer the heat generated when the computer system is running.
  • a common computer CPU is provided with an efficient heat sink, including a heat sink substrate, and a fan blows the wind toward the heat sink substrate to discharge the generated heat out of the computer and to cool the computer system.
  • the temperature of the air intake is high, and can be as high as about 50 degrees Celsius, and for a high-power CPU, the cooling efficiency of the high-efficiency heat sink is large. At a discount, the cooling effect is far from expected; and if a high-speed fan is used, it will bring a large noise.
  • An object of the present invention is to provide an independent high-efficiency heat sink that can provide heat dissipation efficiency without noise, overcoming the above-mentioned deficiencies.
  • the high-efficiency heat dissipating device includes a heat dissipating substrate, the heat dissipating surface of the heat dissipating substrate is pasted with at least one hydrophilic layer; and the other is provided for the hydrophilic layer.
  • the hydrophilic layer is a network structure.
  • the heat dissipation substrate has a flat or curved shape, an arc shape or a cylindrical structure, or a heat dissipation function as a substrate structure.
  • the liquid supply device comprises a liquid storage device and an infusion tube whose one end is connected to the liquid storage device and the other end is connected to the hydrophilic layer.
  • the liquid supply device includes a liquid reservoir integrally provided with the heat dissipation substrate, and one or more liquid discharge holes are provided on a surface in contact with the hydrophilic layer.
  • the liquid supply device is an integrated liquid supply chamber connected to the periphery of the heat dissipation substrate, and the liquid supply chamber is provided with one or more liquid discharge holes on the surface in contact with the hydrophilic layer, and the liquid storage device is connected to the liquid supply chamber.
  • the liquid supply device is provided with a water pump or an atomization or spray evaporation liquid replenishing liquid control device. .
  • the liquid supply device is provided with a liquid take-off control device.
  • the evaporating liquid is water or a volatile liquid or oil.
  • the evaporative liquid evaporates and humidifies the airflow to help the peripheral device to dissipate heat
  • FIG. 1 is a schematic structural view of a first embodiment of such an efficient heat dissipating device.
  • FIG. 2 is a schematic structural view of a second embodiment of the high-efficiency heat dissipating device. detailed description The invention will be further described below in conjunction with the drawings. As shown in FIG.
  • the high-efficiency heat dissipating device includes a planar heat dissipating substrate 1 , and the heat dissipating surface of the heat dissipating substrate is adhered with a layer of a hydrophilic hydrophilic layer made of a hydrophilic material.
  • a liquid supply device 3 for supplying an evaporation liquid to the hydrophilic layer the liquid supply device 3 is a liquid storage device, and a liquid outlet hole is provided at a bottom portion in contact with the hydrophilic layer.
  • the liquid supply device includes a liquid reservoir 30 and an infusion tube 31, and one end of the infusion tube communicates with the liquid reservoir, and the other end communicates with the hydrophilic layer.
  • the liquid supply device 3 is a liquid storage tank 32 integrally provided with a substrate, and a plurality of liquid outlet holes 33 are disposed on a side surface of the liquid storage tank. The liquid outlet is connected to the hydrophilic layer. As shown in FIG.
  • the liquid supply device 3 includes a liquid supply chamber 36 integrally connected with the periphery of the substrate 1.
  • the liquid supply chamber is connected with an infusion tube 34, and the infusion tube is further One end is connected to a reservoir 35, the hydrophilic layer 2 is disposed in the middle of the liquid supply chamber, and a plurality of liquid outlet holes are disposed on the surface of the liquid supply chamber in contact with the hydrophilic layer.
  • FIG. 5 it is a fifth embodiment of the present invention, which is different from the fourth embodiment in that an infusion tube 34 is disposed between the accumulator 35 and the hydrophilic layer 2.
  • An atomizing device 37 either a water pump device or a shower device, is used to increase the heat dissipation effect.
  • a liquid level device may be provided on the liquid supply device, for example, the liquid level device is a sprinkler head, or a liquid take-off control device such as a water spray control device is arranged on the infusion tube, or an electromagnetic device is arranged on the infusion tube.
  • the valve controls the flow rate of the water droplets, and controls the flow rate or flow rate of the evaporation liquid into the closed chamber so that the evaporation liquid finally entering the hydrophilic layer is an appropriate amount.
  • the infusion tube of all the above embodiments may be any sealed tube made of a hydrophilic material consistent with the hydrophilic layer material, generally comprising an inner layer of a hydrophilic material, and a sealing outer layer, such as a plastic tube.
  • the evaporating liquid stored in the accumulator is generally water or oil or other liquid having a lower evaporation point, and the liquid accumulator may be filled with a hydrophilic mesh material for storing water, and the evaporating liquid is absorbed and accommodated therein. In the hydrophilic network material. In use, after the evaporating liquid in the hydrophilic layer is evaporated by high temperature, the evaporating liquid in the accumulator is continuously and continuously transported along the infusion tube due to the siphon principle or the capillary action under the action of gravity.
  • the humidity in the hydrophilic layer is maintained, and the evaporation of the evaporating liquid takes away the heat of the CPU, and the cooling is rapid and the temperature difference is obviously improved; at the same time, the evaporation of the evaporating liquid is in the space where the entire computer main board is located.
  • the fin is also disposed on the heat dissipating substrate, and the fan is disposed in cooperation with the fin, because the hydrophilic layer does not occupy a large space Therefore, the space occupied by the entire high-efficiency heat dissipating device is not large; and the evaporating liquid is evaporated and then dispersed in various spaces, so that the position of the fan as the blower fan is relatively flexible, and the design of the corresponding air duct can also be flexible.
  • the hydrophilic layer of the device and its infusion tube can be slightly improved on the basis of the existing high-efficiency heat sink, and can be redesigned and installed, the cost is low, and the structural design is also simple.
  • the design principle of the invention patent is to create a space with evaporation, which takes away the heat generated by the operation of the CPU and other electronic components by evaporation, and thus may be additionally provided with a humidifying device, or by centrifugal humidification, or high pressure humidification. , or wet film humidification, or steam humidification, or ultrasonic atomization humidification, etc., to create an evaporating environment, and then through the liquid evaporation will take away heat to achieve cooling.
  • the hydrophilic layer is a flexible material, which can be adapted to different The surface, because the heat generated by the heat generating device is transferred to the heat dissipating substrate, and then the liquid in the hydrophilic layer on the heat dissipating substrate is heated and evaporated, and the air cooling acts to accelerate the evaporation and take away the heat, thereby Cooling effect; Compared with the prior art, the cooling speed is rapid and the temperature difference is obviously improved; the airflow after evaporation and humidification of the evaporating liquid helps the peripheral device to dissipate heat; the space occupied by the efficient heat dissipating device is greatly reduced; the air duct design and the position of the air blower.
  • the high-efficiency heat dissipating device is applicable to any occasion where heat-dissipating measures are required for the heating element, including a high-power industrial heat dissipating device, which is also within the protection scope of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

公开了一种高效散热装置。高效散热装置包括有散热基板（1），散热基板（1）散热面上贴覆有至少一层亲水层（2）；另有一给亲水层（2）提供蒸发液的供液装置（3）。在使用的时候，亲水层（2）中的蒸发液被高温蒸发，蒸发液的蒸发会将散热基板（1）散热面上的热量带走，降温迅速且温差明显提高；而同时，由于蒸发液的蒸发在整个散热基板（1）所在的空间内产生，从而蒸发液蒸发加湿后的气流有助于周边器件散热；视不同散热场合，高效散热器还可附加各种辅助装置，比如：均液器，取液室，取液控制等装置。这种高效散热装置的亲水层（2）及其输液管（31、34）可以在现有高效散热装置的基础上稍微进行改进，也可以重新设计安装，成本较低，结构设计也很简单。

Description

说明书
高效散热装置 技术领域 本发明涉及一种高效散热技术；尤其涉及大功率器件或装置的高 效散热装置。 背景技术 现代工业装备所消耗的能量越趋增大， 由此产生多余的热量也随 之增加， 随之而来的散热就是摆在工程人员的亟待解决的问题。 以电 脑为例， 由于现在的电脑系统运转速度越来越快， 电脑系统带来的热 量也随时大幅度的增加了， 在电脑系统运转期间产生的热量， 如果不 加以快速的移转， 会降低电脑系统的功效， 达到一定温度时， 还会导 致电脑系统的死机或者损坏，因此需要一高效散热装置来移转电脑系 统运转时产生的热量。 常见的电脑 CPU上都设置有高效散热装置， 包括有一散热基板， 另有一风扇将风吹向此散热基板， 以将所产生 的热量排出电脑内部， 并冷却电脑系统。 但是由于这种高效散热装 置的设计通过设置于电脑内部， 因此其进风的温度较高， 可高达约 摄氏 50度， 而对于高功率的 CPU而言， 这种高效散热装置的冷却效 率将大打折扣， 其冷却效果远远达不到预期； 而如果用高速风扇， 又会带大较大的噪音。 因此需要一种高效散热装置， 以提高电脑系 统散热效率， 并减少因使用风扇所产生的噪音。 当然也有使用液体 冷却的， 需要建立一个液体循环的结构， 体积庞大且成本昂贵， 结 构复杂。 发明内容 本发明的目的在于克服上述价格的不足而提供一种可以提供散 热效率同时又无噪音的独立的高效散热装置。 为实现上述目的， 本发明采用了下述技术方案： 这种高效散热装置， 包括有散热基板， 所述的散热基板散热面 上贴覆有至少一层亲水层； 另有一给亲水层提供蒸发液的供液装 置。 所述的亲水层为网状结构。 所述的散热基板为平板状或曲面状或弧状或圆筒状结构，或者是 具有散热功能的壳体做为基板结构。 所述的供液装置包括一储液器及一端与储液器相接、 另一端与 亲水层相接的输液管。 所述的与亲水层相接的输液管的一端设置有一控制供液的均液 器， 该均液器与亲水层相接。 所述的供液装置包括一与散热基板一体设置的储液器， 其与亲 水层相接触的面上设有一个以上的出液孔。 所述的供液装置为与散热基板四周连为一体供液室， 该供液室 与亲水层相接触的面上设有一个以上的出液孔， 储液器与供液室相 接。 所述的供液装置上设置有水泵或雾化或喷淋蒸发液补充取液控 制装置。 。 所述供液装置上设置有取液控制装置。 所述蒸发液为水或易挥发的液体或油。 通过上述技术方案， 从而该发明具有下述有益效果：
1. 降温迅速及温差明显提高；
2. 蒸发液蒸发加湿后的气流有助于周边器件散热；
3. 高效散热装置所占的空间大大减小；
4. 风道设计及送风器位置的灵活性大大提高；
5. 成本显著降低， 结构设计简单， 可以对现有的高效散热装置进行 工作量不大的改造， 也可以重新设计安装。 附图说明 图 1是这种高效散热装置具体实施例 1的结构示意图。 图 2是这种高效散热装置具体实施例 2的结构示意图。 具体实施方式 下面结合附图对该发明作出进一歩的说明。 如图 1所示， 这种高效散热装置， 包括有平面的散热基板 1， 所 述的散热基板的散热面上通过粘接贴覆有一层网状的由亲水材料制 成的亲水层 2，比如网状海棉层，或者是树脂织物层，比如以 COOLMAX 为代表的一类异性纤维， 或者是类似含有羟基， 羧基等这样极性基团 的材料层，还包括有与基板一体设置的给亲水层提供蒸发液的供液装 置 3， 该供液装置 3为一储液器， 底部与亲水层相接触处设置有出液 孔。 如图 2所示， 为该发明的具体实施例二， 所述的供液装置包括 有一储液器 30以及输液管 31， 该输液管一端与储液器相通， 另一端 与亲水层相通。 如图 3所示， 为该发明的具体实施例三， 所述的供液装置 3为与 基板一体设置的储液箱 32， 在该储液箱的侧面上设置有若干出液孔 33， 该出液孔与亲水层相连接。 如图 4所示， 为该发明的具体实施例四， 所述的供液装置 3包括 与基板 1四周连为一体的供液室 36， 供液室上连接有一输液管 34， 输液管的另一端与一储液器 35相连， 亲水层 2设置于供液室中间， 供液室与亲水层相接触的面上设置有若干出液孔。 如图 5所示， 为该发明的具体实施例五， 其与实施例四的不同 之处在于， 在所述的储液器 35与亲水层 2之间的输液管 34上设置有 一雾化装置 37， 或者是水泵装置， 或者是喷淋装置， 以增加散热效 果。 当然还可以供液装置上设置有均液器， 比如这个均液器为一喷 淋头， 或者设置一个取液控制装置如喷水控制装置在输液管上， 或 者是在输液管上设置一电磁阀控制水滴流速， 控制蒸发液进入密闭 室的流速或者流量， 以便最后进入亲水层的蒸发液为适量。 上述所有具体实施例的输液管可以为任一种与亲水层材料一致 的亲水材料制成的密封管道， 一般是包括有一亲水材料内层， 再加 一密封外层， 如塑胶管体， 在储液器中存储的蒸发液一般为水或油 或者其他蒸发点较低的液体， 也可以在储液器中填充有用于储水的 亲水性网状材料， 蒸发液被吸收容纳在该亲水性网状材料中。 在使 用的时候， 亲水层中的蒸发液被高温蒸发掉之后， 因为虹吸原理或 者是重力作用下的毛细作用， 在储液器中的蒸发液会沿着输液管一 直被源源不断的输送到亲水层中来， 保持亲水层中的湿度， 而蒸发 液的蒸发会将 CPU的热量带走， 降温迅速且温差明显提高； 而同 时， 由于蒸发液的蒸发在整个电脑主板所在的空间内产生， 从而蒸 发液蒸发加湿后的气流有助于周边器件散热； 另一般还在散热基板 上一般还设置有鳍片， 以及与鳍片配合设置的风扇， 由于该亲水层 占用空间并不大， 从而整个高效散热装置所占用的空间也不大； 而 且蒸发液被蒸发后将发散在各处空间， 从而作为送风器风扇的位置 设置比较灵活， 相对应的风道的设计也可以很灵活； 这种高效散热 装置的亲水层及其输液管可以在现有高效散热装置的基础上稍微进 行改进， 也可以重新设计安装， 成本较低， 结构设计也很简单。 该发明专利的设计原理是营造一个有着蒸发的空间， 通过蒸发 来带走 CPU以及其他电子元器件工作时产生的热量， 故而还可以是 另外设置有加湿装置， 或者通过离心式加湿， 或者高压加湿， 或者 湿膜加湿， 或者蒸汽加湿， 或者超声波雾化加湿等方式， 营造一个 蒸发的环境， 再通过液体蒸发进会带走热量来实现降温。 与现有技术相比， 由于散热基板紧贴着发热器件的表面， 而亲 水层贴着散热基板， 不管散热基板的表面是平面还是球面还是曲 面， 亲水层为柔性材料， 可以适应不同的表面， 由于发热器件产生 的热量传递到散热基板上， 再通过散热基板上的亲水层中的液体被 加热并蒸发， 再加上风冷的共同作用下加速蒸发并带走热量， 从而 起到降温作用； 与现有技术相比， 降温迅速及温差明显提高； 蒸发 液蒸发加湿后的气流有助于周边器件散热； 高效散热装置所占的空 间大大减小； 风道设计及送风器位置的灵活性大大提高； 可以对现 有的高效散热装置进行工作量不大的改造， 也可以重新设计安装， 成本显著降低， 结构设计简单， 适应范围广。 虽然上述实施例是以具体的电脑为例， 但同理， 该高效散热装置 针对对象为任何需要对发热体采取散热措施的场合，包括大功率工业 散热装置， 同样属于本发明的保护范围。

Claims

权利要求书
1. 一种高效散热装置， 包括有散热基板， 其特征在于： 所述的散热 基板散热面上贴覆有至少一层亲水层； 另有一给亲水层提供蒸发 液的供液装置。
2. 如权利要求 1所述的高效散热装置， 其特征在于： 所述的亲水层 为网状结构。
3. 如权利要求 1或 2所述的高效散热装置， 其特征在于： 所述的散 热基板为平板状或曲面状或弧状或圆筒状结构， 或者是具有散热 功能的壳体做为基板结构。
4. 如权利要求 3所述的高效散热装置， 其特征在于： 所述的供液装 置包括一储液器及一端与储液器相接、 另一端与亲水层相接的输 液管。
5. 如权利要 4所述的高效散热装置， 其特征在于： 所述的与亲水层 相接的输液管的一端设置有一控制供液的均液器， 该均液器与亲 水层相接。
6. 如权利要求 3所述的高效散热装置， 其特征在于： 所述的供液装 置包括一与散热基板一体设置的储液器， 其与亲水层相接触的面 上设有一个以上的出液孔。
7. 如权利要求 3所述的高效散热装置， 其特征在于： 所述的供液装 置为与散热基板四周连为一体的供液室， 该供液室与亲水层相接 触的面上设有一个以上的出液孔， 储液器与供液室相接。
8. 如权利要求 4或 6或 7所述的高效散热装置， 其特征在于： 所述 的供液装置上设置有水泵或雾化或喷淋蒸发液补充取液控制装 置。
9. 如权利要求 4或 6或 7所述的高效散热装置， 其特征在于： 所述 蒸发液为水或易挥发的液体或油。
PCT/CN2012/087677 2012-12-27 2012-12-27 高效散热装置 WO2014101048A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/087677 WO2014101048A1 (zh) 2012-12-27 2012-12-27 高效散热装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/087677 WO2014101048A1 (zh) 2012-12-27 2012-12-27 高效散热装置

Publications (1)

Publication Number Publication Date
WO2014101048A1 true WO2014101048A1 (zh) 2014-07-03

Family

ID=51019700

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/087677 WO2014101048A1 (zh) 2012-12-27 2012-12-27 高效散热装置

Country Status (1)

Country Link
WO (1) WO2014101048A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101179917A (zh) * 2006-11-08 2008-05-14 财团法人工业技术研究院 一种环路型潜热散热方法和环路型潜热散热模块
CN102098904A (zh) * 2011-02-28 2011-06-15 株洲南车时代电气股份有限公司 一种电子元器件防烧毁散热装置及其方法
CN102157467A (zh) * 2010-02-12 2011-08-17 微邦科技股份有限公司 冷却散热系统及其冷却装置
CN102486355A (zh) * 2010-12-01 2012-06-06 富士通株式会社 冷却设备和电子设备
CN103019346A (zh) * 2012-12-27 2013-04-03 冯进 高效散热装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101179917A (zh) * 2006-11-08 2008-05-14 财团法人工业技术研究院 一种环路型潜热散热方法和环路型潜热散热模块
CN102157467A (zh) * 2010-02-12 2011-08-17 微邦科技股份有限公司 冷却散热系统及其冷却装置
CN102486355A (zh) * 2010-12-01 2012-06-06 富士通株式会社 冷却设备和电子设备
CN102098904A (zh) * 2011-02-28 2011-06-15 株洲南车时代电气股份有限公司 一种电子元器件防烧毁散热装置及其方法
CN103019346A (zh) * 2012-12-27 2013-04-03 冯进 高效散热装置

Similar Documents

Publication Publication Date Title
US6349760B1 (en) Method and apparatus for improving the thermal performance of heat sinks
US20080302505A1 (en) Evaporative cooling system
CN103019346A (zh) 高效散热装置
US7913507B2 (en) Electronic equipment cooling system
WO2018000773A1 (zh) 空冷散热器开闭可切换空冷凉水复合式冷却塔及运行方式
JP5829847B2 (ja) 室外機冷却装置
CN205066503U (zh) 闭式绝热蒸发冷却器
JP2010027700A (ja) サーバ装置
CN207320654U (zh) 一种高压配电箱的散热设备
JP2017116201A (ja) 熱交換装置
WO2014101048A1 (zh) 高效散热装置
CN210980195U (zh) 一种蒸发冷却换热器及其空气调节系统
CN104315695A (zh) 空调冷凝器用喷淋蒸发式泡沫金属强化换热装置
JP2001091167A (ja) 密閉式直交流型冷却塔
CN203133720U (zh) 高效散热装置
CN105202941B (zh) 闭式绝热蒸发冷却器
KR101036170B1 (ko) 컴퓨터부품용 복합냉각장치
CN207264869U (zh) 一种温控型变压器
CN209001329U (zh) 基于管状激光增益介质散热的喷雾冷却系统
KR101964736B1 (ko) 잠열 냉각기
CN109140744B (zh) 接水盘及空调机组
CN204836926U (zh) 一种利用液冷散热的电子装置和散热装置
CN110608491A (zh) 一种蒸发冷却换热器及其空气调节系统
CN205563397U (zh) 一体式液冷散热计算机机箱
CN206835521U (zh) 一种电子设备放置柜

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12890829

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205N DATED 02/09/2015)

122 Ep: pct application non-entry in european phase

Ref document number: 12890829

Country of ref document: EP

Kind code of ref document: A1