WO2014084284A1 - Système de fabrication d'un module d'émission de lumière à élément électroluminescent organique, et procédé de fabrication de module d'émission de lumière à élément électroluminescent organique - Google Patents

Système de fabrication d'un module d'émission de lumière à élément électroluminescent organique, et procédé de fabrication de module d'émission de lumière à élément électroluminescent organique Download PDF

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Publication number
WO2014084284A1
WO2014084284A1 PCT/JP2013/081974 JP2013081974W WO2014084284A1 WO 2014084284 A1 WO2014084284 A1 WO 2014084284A1 JP 2013081974 W JP2013081974 W JP 2013081974W WO 2014084284 A1 WO2014084284 A1 WO 2014084284A1
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WO
WIPO (PCT)
Prior art keywords
sheet
substrate
sealing member
tape
suction
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PCT/JP2013/081974
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English (en)
Japanese (ja)
Inventor
瑞喜 山平
和行 水戸
優記 大嶋
恵子 斎藤
久志 戸田
Original Assignee
三菱化学株式会社
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Application filed by 三菱化学株式会社 filed Critical 三菱化学株式会社
Priority to JP2014549880A priority Critical patent/JP6098644B2/ja
Publication of WO2014084284A1 publication Critical patent/WO2014084284A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present invention relates to an organic EL light emitting module manufacturing system and an organic EL light emitting module manufacturing method.
  • An organic electroluminescence (EL) light emitting module includes an organic EL element in which a light-transmitting substrate such as glass or plastic, an anode made of a transparent electrode, an organic EL layer made of an organic thin film, and a cathode are sequentially laminated.
  • the organic EL light emitting module has been energetically aimed at practical use in recent years because it exhibits surface emission with high brightness at a low voltage of about several volts and light emission in an arbitrary color tone is possible by selecting a light emitting material. Development is underway.
  • Patent Documents 1 to 3 each describe a method for manufacturing an organic EL light emitting module.
  • Patent Document 1 and Patent Document 2 describe a method of sealing an organic EL layer using a metal foil.
  • Patent Document 3 describes a method of sealing an organic EL layer with a sealing adhesive.
  • Patent Document 4 describes a structure in which a dehydrating agent or an oxygen scavenger is disposed in a sealing layer to prevent deterioration of the organic EL element due to moisture or oxygen.
  • Japanese Unexamined Patent Publication No. 2004-303528 Japanese Unexamined Patent Publication No. 2004-303529 Japanese Unexamined Patent Publication No. 2007-35514 Japanese Unexamined Patent Publication No. 2006-80084
  • Patent Documents 1 to 3 describe a method of sealing an organic EL layer by one layer. However, in the one layer, moisture from the outside may pass through and the organic EL element may be deteriorated.
  • Patent Document 4 describes a structure for preventing the deterioration of the organic EL element by disposing a dehydrating agent or the like.
  • a sealing structure having such a complicated laminated structure can be accurately and efficiently used.
  • the manufacturing system and manufacturing method to be realized have not been sufficiently studied.
  • This invention is made
  • the place made into the objective is the highly accurate and highly efficient manufacturing system of the organic electroluminescent light emitting module which can suppress deterioration of an organic electroluminescent element favorably,
  • Another object of the present invention is to provide a highly accurate and highly efficient manufacturing method of an organic EL light emitting module.
  • the gist of the present invention resides in the following [1] to [18].
  • An organic EL light emitting module manufacturing system A sealing member laminating apparatus that seals the organic EL element between the substrate and the sealing member by attaching a sealing member to one surface of the substrate on which the organic EL element is formed;
  • the sealing member laminating apparatus is A substrate adsorbing upper surface for adsorbing the substrate; A support base which is located below the upper surface of the suction and can support only the end of the substrate from below; A member set part that is located below the substrate adsorption upper surface part and on which the sealing member is placed; A movable suction part provided in the center of the substrate suction upper surface part, capable of sucking the center part of the substrate and movable up and down; The substrate is supported by the movable suction portion and the support base by releasing the suction of the substrate suction upper surface portion from the state where the substrate is sucked by the substrate suction upper surface portion and the movable suction portion.
  • An organic EL light emitting module manufacturing system A sealing member producing apparatus for producing a sealing member in which a first sheet-like member and a second sheet-like member having a wider surface than the first sheet-like member are laminated; A sealing member laminating apparatus for laminating the sealing member on one surface of a substrate on which an organic EL element is formed, and sealing the organic EL element between the substrate and the sealing member; Prepared,
  • the sealing member manufacturing apparatus is A sheet-like member adsorption portion having an adsorption surface provided with a plurality of suction holes for adsorbing members; A stage portion having a stage surface on which the first sheet-like member and the second sheet-like member can be sequentially placed; The sealing in which the first sheet-like member and the second sheet-like member are stacked by the sheet-like member adsorbing portion sequentially adsorbing the first sheet-like member and the second sheet-like member.
  • the sealing member manufacturing apparatus for manufacturing a member, In the stage portion, the second sheet-like member is placed in a region including a region where the first sheet-like member is placed,
  • the sealing member manufacturing apparatus includes a base portion having a first side surface and a second side surface for positioning the first sheet-like member and the second sheet-like member.
  • a plurality of alignment portions each having a standing portion standing upward from the portion; The plurality of alignment portions are installed such that a mutual distance between the first side surfaces is shorter than a mutual distance between the second side surfaces,
  • the first sheet-like member is placed on the stage surface of the stage portion such that an end portion thereof abuts on the first side surface of each of the plurality of alignment portions.
  • the sheet-like member adsorption unit adsorbs the first sheet-like member placed on the stage surface of the stage unit by adjoining the stage unit to the adsorption surface
  • the second sheet-like member is placed on the stage surface of the stage portion so that an end portion thereof abuts on the second side surface of each of the plurality of alignment portions.
  • suction part makes the said 1st sheet-like member adsorb
  • the sealing member manufacturing apparatus presses the first sheet-like member and the second sheet-like member, which are stacked by adsorbing the sheet-like member adsorption portion, against the adsorption surface, and the first sheet A thermocompression bonding part that forms a sealing member by the first sheet-like member and the second sheet-like member by performing a thermocompression-bonding process for heating the shape-like member and the second sheet-like member;
  • the sheet-like member adsorbing portion is provided outside a region facing the first sheet-like member in a region facing the second sheet-like member during execution of the thermocompression processing by the thermocompression-bonding portion.
  • the organic EL light-emitting module manufacturing system according to [2], wherein inhalation is performed only through the suction hole.
  • An adhesive material laminating apparatus for laminating an adhesive material for laminating the sealing member to the substrate to the sealing member,
  • the adhesive material is formed in a sheet shape, a release paper is attached to one surface of the adhesive material formed in a sheet shape, and a surface opposite to the one surface of the release paper is a belt-like shape Affixed to the tape member
  • the adhesive material laminating apparatus is A tape member adsorbing portion that performs an adsorbing operation for adsorbing the surface opposite to the surface on which the adhesive material is affixed in the tape member to which the adhesive material is affixed;
  • a roller portion that is formed in a cylindrical shape and rotates around a central axis, The tape member suction part sucks and holds the tape member above the sealing member placed on the placement table so that the first sheet-like member forms part of the upper surface,
  • the roller portion is configured such that the tape member is peeled from the tape member suction portion while the tape member is separated from the tape member along the longitudinal
  • the tape member adsorbing portion is formed on the other end side of the tape member when the roller portion peels the tape member from one end side along the longitudinal direction of the tape member.
  • the tape member has a pasting area to which the release paper is pasted and a blank area outside the pasting area.
  • the roller portion rolls from the blank region at one end of the tape member in the longitudinal direction to the other end so as to bond the adhesive material to the sealing member over the pasting region.
  • the adhesive material laminating apparatus includes: Including an upper surface portion covering the upper side of the tape member adsorbing portion, a lower surface portion covering the lower side of the mounting table, and a side surface portion covering a side of a space sandwiched between the upper surface portion and the lower surface portion, When the lower surface portion and the upper surface portion are relatively close to each other, the upper end of the side surface portion is in contact with the upper surface portion, and the lower surface portion is in contact with the lower end of the side surface portion, and the tape member A first state in which the space containing the placement table on which the tape member suction portion and the sealing member on which the sealing member is placed is sealed, and the lower surface portion are separated from the upper surface portion.
  • the apparatus further comprises a tape member peeling device for peeling the release paper attached to the tape member together with the tape member from the adhesive material
  • the tape member peeling device is Installed in a nitrogen atmosphere, A gripping part for gripping a blank area outside the sticking area to which the release paper is stuck in the tape member, and for peeling the release paper stuck to the tape member together with the tape member from the adhesive material;
  • the tape member peeled from the adhesive material and the release paper are placed, and a mounting table having an upper surface on which the tape member can be placed;
  • the partition member for partitioning the nitrogen atmosphere and the outside air is provided with a through-hole that fits the mounting table on the top surface when the mounting table moves upward, and a lid that covers the through-hole from the outside.
  • the organic EL light-emitting device according to any one of [4] to [7], wherein when the mounting table moves upward, the lid is pushed up by the upper surface on which the tape member is mounted.
  • thermocompression bonding apparatus that thermocompression-bonds the sealing member and the substrate
  • the thermocompression bonding apparatus is Including a hot plate portion for pressing the sealing member against the substrate and performing a sealing member thermocompression treatment for heating the sealing member;
  • the organic EL light emitting device according to any one of [1] to [8], wherein the hot plate portion is provided with a convex portion at a position corresponding to an end portion of the sealing member.
  • a substrate support step Thereafter, a substrate pressing step for moving the movable suction portion downward to bring the central portion of the substrate downward from the support base, and Next, while holding the suction of the substrate by the movable suction portion, while moving the member set portion on which the sealing member is placed, while interlocking the substrate and the movable suction portion, A pressing step of pressing the member set portion together with the substrate and the sealing member against the suction upper surface portion, and sequentially bonding the substrate and the sealing member from the central portion toward the end portion of the substrate;
  • a method for manufacturing an organic EL light emitting module comprising:
  • a method of manufacturing an organic EL light emitting module The first sheet-like member of a sealing member producing apparatus for producing a sealing member in which a first sheet-like member and a second sheet-like member having a wider surface than the first sheet-like member are laminated.
  • a first sheet-like member placement step in which the first sheet-like member is placed on a stage portion having a stage surface on which a member and the second sheet-like member can be placed in sequence; By sucking the sheet-like member suction portion of the sealing member manufacturing apparatus close to the stage portion, the first sheet-like member placed on the stage surface faces the stage surface and sucks the member.
  • a sealing member bonding apparatus bonds the sealing member to one surface of the substrate on which the organic EL element is formed, and seals the organic EL element between the substrate and the sealing member.
  • An organic EL sealing step In the first sheet-like member placement step, for the positioning of the placement of the first sheet-like member, the base portion having the first side surface and the second side surface are disposed upward from the base portion.
  • the first sheet-like member is placed on the stage portion so that the end portion comes into contact with the first side surface of each of the first side surface,
  • an end portion is brought into contact with the second side surface of each of the plurality of alignment portions in order to align the placement of the second sheet-like member.
  • the thermocompression bonding part of the sealing member manufacturing apparatus includes the first sheet-like member and the second sheet-like member laminated by the sheet-like member adsorption part in the second sheet-like member adsorption step.
  • the sealing member formed by the first sheet-like member and the second sheet-like member is pressed against the suction surface and subjected to a thermocompression treatment for heating the first sheet-like member and the second sheet-like member.
  • An adhesive material for bonding the sealing member to the substrate which is formed in a sheet shape and has a release paper pasted on one surface in advance, and the surface opposite to the one surface is the surface
  • a tape member adsorbing portion of an adhesive material laminating apparatus for adhering the adhesive material with a release paper affixed to a strip-shaped tape member to the sealing member, and the adhesive material in the tape member with the adhesive material affixed thereto
  • the suction holding unit that sucks and holds the tape member above the sealing member that is placed on the placement table so that the first sheet-like member forms part of the upper surface of the tape member suction unit.
  • Steps A roller portion that is formed in a cylindrical shape of the adhesive material laminating device and rotates around a central axis peels off the tape member from the tape member adsorption portion, and forms a band between the tape member adsorption portion and the tape member. Rolling from one end portion to the other end portion along the longitudinal direction of the tape member, and pressing the adhesive material against the sealing member from the tape member side by a peripheral surface.
  • the tape member adsorbing portion is the tape when the roller portion peels the tape member from one end side along the longitudinal direction of the tape member in the adhesive material laminating step.
  • the tape member has a pasting area to which the release paper is pasted and a blank area outside the pasting area,
  • the roller portion applies the adhesive material to the sealing member over the pasting region from the blank region at one end portion in the longitudinal direction of the tape member to the other end portion.
  • the adhesive material laminating apparatus comprises: Including an upper surface portion covering the upper side of the tape member adsorbing portion, a lower surface portion covering the lower side of the mounting table, and a side surface portion covering a side of a space sandwiched between the upper surface portion and the lower surface portion, When the lower surface portion and the upper surface portion are relatively close to each other, the upper end of the side surface portion is in contact with the upper surface portion, and the lower surface portion is in contact with the lower end of the side surface portion, and the tape member A first state in which the space containing the placement table on which the tape member suction portion and the sealing member on which the sealing member is placed is sealed, and the lower surface portion are separated from the upper surface portion.
  • nitrogen is supplied to the space after air is exhausted from the space when the first state is established in the nitrogen replacement chamber containing at least the lower surface portion.
  • a nitrogen substitution step is performed, [13] to [15], wherein after the nitrogen replacement step is performed, the space is maintained in a nitrogen atmosphere in the second state, and the adhesive material bonding step is performed.
  • a gripping part of a tape member peeling device installed in a nitrogen atmosphere grips a blank area outside the sticking area where the release paper is stuck on the tape member, and together with the tape member, the tape member An adhesive material peeling step for peeling the release paper affixed to the adhesive material;
  • the mounting table having an upper surface on which the tape member can be mounted includes a tape member mounting step for mounting the tape member and the release paper on which the grip portion has been peeled off from the adhesive material in the adhesive material peeling step.
  • the nitrogen atmosphere and the outside air are partitioned by a partition member,
  • the partition member is provided with a through hole that fits with the mounting table when the mounting table moves upward, and a lid that covers the through hole from the outside is installed, Any one of the above [13] to [16], further comprising a lid pushing-up step of pushing up the lid by the upper surface on which the tape member is placed by moving the mounting table upward.
  • thermocompression bonding apparatus for thermocompression bonding the sealing member and the substrate
  • a hot plate portion provided with a convex portion at a position corresponding to an end portion of the sealing member is the bonding step.
  • a sealing member thermocompression step for further pressing the sealing member attached to the substrate against the substrate and performing a sealing member thermocompression treatment for heating the sealing member.
  • the method for producing an organic EL light emitting module according to any one of [17].
  • the organic EL element is sealed with the sealing member in which the first sheet-like member and the second sheet-like member are laminated, the transmission of moisture and the like from the outside to the organic EL element is good.
  • an organic EL light emitting module that can prevent the deterioration of the organic EL element due to the transmitted moisture and the like.
  • first sheet-like member and the second sheet-like member are accurately aligned by the alignment portion and stacked on the substrate, the production efficiency in which generation of defective products due to misalignment is suppressed is suppressed.
  • a manufacturing system of a high organic EL light emitting module can be realized.
  • first sheet-like member and the second sheet-like member having different sizes are aligned by the same alignment mechanism, the first and second sheet-like members can be aligned with high accuracy, and the occurrence of defective products due to misalignment is suppressed. It is possible to realize a manufacturing system of the organic EL light emitting module with high production efficiency.
  • the apparatus can be simplified, so that the low-cost organic EL light emitting module can be simplified.
  • a manufacturing system can be realized.
  • the tact time can be shortened, and organic EL light emission with high production efficiency is achieved.
  • a module manufacturing system can be realized.
  • the suction is performed only through the suction hole provided outside the region facing the first sheet-like member among the regions facing the second sheet-like member. Therefore, in the first sheet-like member, it is possible to satisfactorily prevent the formation of irregularities due to the traces of inhalation by the suction holes provided on the suction surface of the sheet-like member suction portion, and thus organic EL light emission with good sealing performance Modules can be manufactured.
  • first sheet-like member and the second sheet-like member are brought into close contact with each other in the region facing the adsorption surface of the sheet-like member adsorption portion by thermocompression treatment, and the first sheet-like member and the second sheet-like member in the region Therefore, it is possible to satisfactorily prevent a space from being formed between them, so that an organic EL light emitting module having a good sealing performance can be manufactured.
  • the roller part rolls from one end part to the other end part along the longitudinal direction of the tape member, and the adhesive member is pressed against the sealing member from the tape member side by the peripheral surface to seal the adhesive member Since it is comprised so that it may affix on a member, since it can prevent favorably that a space arises between an adhesive material and a sealing member, an organic electroluminescent light emitting module with favorable sealing performance can be manufactured. it can.
  • the tape member adsorption portion performs an adsorption operation on the other end portion side of the tape member when the roller portion sticks the tape member to the sealing member from one end portion side along the longitudinal direction of the tape member. Since it continues, it is possible to prevent the tape member from falling downward while the roller portion is rolling. In addition, since the other end is adsorbed and fixed, the tape member and the sealing member are bonded with high accuracy without the relative position of the tape member and the sealing member being shifted during the rolling of the roller portion. And since generation
  • the nitrogen replacement operation is performed in the first state in which the lower surface portion and the upper surface portion are relatively close to each other, the volume of the space for performing the nitrogen replacement can be reduced.
  • the time of the gas introduction process can be shortened, and the production efficiency of the organic EL light emitting module can be increased.
  • the partition member for partitioning the nitrogen atmosphere and the outside air is provided with a through hole that fits into the mounting table when the mounting table moves upward, and is configured to push up the lid that covers the through hole by the upper surface of the mounting table. Therefore, it is possible to satisfactorily prevent the mixing of nitrogen and outside air through the through-holes, to suppress the generation of defective products due to the mixing of outside air, and to increase the production efficiency of the organic EL light emitting module.
  • the substrate is in a state of being supported by the movable suction portion and the support base, and then the central portion of the substrate is pushed downward from the support base by moving the movable suction portion downward, and then movable.
  • the member set unit on which the sealing member bonded with the adhesive material is moved is moved upward, and the substrate and the movable adsorption unit are interlocked to set the member.
  • the substrate and the sealing member are sequentially bonded to each other from the center to the end of the substrate by pressing the portion together with the sealing member on which the substrate and the adhesive are bonded to the upper surface portion of the substrate. Since it is comprised, it can prevent favorably that a space
  • the adhesive material and the sealing member can be attached to a predetermined position on the substrate with high accuracy.
  • the production system of the organic EL light emitting module with high production efficiency in which the generation of defective products due to the above is suppressed can be realized.
  • the hot plate portion is provided with a convex portion at a position corresponding to the end portion of the sealing member, the outer edge portion of the sealing member to which the adhesive material is bonded is more reliably thermocompression bonded to the substrate. It is possible to more reliably seal the organic EL element and the first sheet-like member formed on one surface of the film, and satisfactorily suppress deterioration of the organic EL element.
  • FIG. 1 is a cross-sectional view showing a configuration example of an organic EL light emitting module manufactured by the organic EL light emitting module manufacturing system and the organic EL light emitting module manufacturing method according to the present invention.
  • FIG. 2 is a flowchart showing the overall configuration of the organic EL light emitting module manufacturing system according to the present invention.
  • FIG. 3A and FIG. 3B are cross-sectional views of the main part of the sealing member manufacturing apparatus.
  • FIG. 4 is a top view showing the positional relationship between the pin member and the stage member.
  • FIG. 5 is an explanatory view showing a hot plate for heating the moisture absorbing layer and the protective layer.
  • FIG. 6 is an explanatory view showing a mounting table on which a sealing member in which a moisture absorption layer and a protective layer are stacked and bonded together is mounted.
  • FIG. 7A and FIG. 7B are cross-sectional views of main parts of the adhesive material bonding apparatus.
  • FIG. 8 is an explanatory view showing the operation of the suction reversal member.
  • FIG. 9 is an explanatory view showing delivery of the tape member by the suction reversal member and the suction transfer member.
  • FIG. 10A and FIG. 10B are explanatory diagrams showing a nitrogen replacement process in the nitrogen replacement chamber.
  • FIG. 11A, FIG. 11B, and FIG. 11C are explanatory views showing a process of attaching an adhesive material to a sealing member.
  • FIG. 12B are explanatory views showing the operation of the suction hand.
  • FIG. 13A and FIG. 13B are explanatory views showing the operation of the tape member peeling apparatus.
  • FIG. 14 is an explanatory diagram showing an operation of placing the tape member peeled off from the adhesive material by the tape member gripping member and the release paper attached to the tape member on the upper surface of the tape member mounting table.
  • FIG. 15A, FIG. 15B, FIG. 15C, FIG. 15D, FIG. 15E, and FIG. 15F are explanatory views showing the operation of the tape member mounting table.
  • FIG. 16 is an explanatory view showing the movement of the substrate carried into the organic EL light emitting module manufacturing system.
  • FIG. 17 is an explanatory view showing the position adjustment of the substrate in the sealing member bonding apparatus.
  • FIG. 18A and FIG. 18B are explanatory views showing the movement of the substrate into the vacuum chamber.
  • FIG. 19 is an explanatory view showing an apparatus for bonding a substrate to a sealing member.
  • 20 (a), 20 (b), 20 (c), and 20 (d) are explanatory views showing the arrangement pattern of the movable central suction portion.
  • FIG. 21A, FIG. 21B, FIG. 21C, and FIG. 21D are explanatory views showing a process of bonding the substrate and the sealing member.
  • FIG. 22 is an explanatory diagram illustrating a process in which the bonded substrate and the sealing member are thermocompression bonded.
  • the portion described as “nitrogen” or “N 2 ” is not limited to nitrogen but may be an inert gas such as argon.
  • an inert gas such as nitrogen or argon water and oxygen are usually 100 ppm or less, preferably 10 ppm or less, and more preferably 5 ppm or less.
  • vacuum as an atmosphere refers to a state where the pressure is reduced from atmospheric pressure, and is usually a vacuum degree of about 1 ⁇ 10 ⁇ 3 to 100 Pa.
  • the organic EL light emitting module 1 manufactured by the organic EL light emitting module manufacturing system and the organic EL light emitting module manufacturing method according to the present invention will be described.
  • FIG. 1 is a cross-sectional view showing a configuration example of an organic EL light emitting module 1 manufactured by the organic EL light emitting module manufacturing system and the organic EL light emitting module manufacturing method according to the present invention.
  • the organic EL light emitting module 1 includes a substrate 2, an organic EL element 3, an adhesive material 4, a moisture absorption layer 5 (first sheet-like member), and a protective layer 6 (second sheet-like member). including.
  • a plurality of elements of the organic EL light emitting module 1 such as the organic EL element 3, the adhesive material 4, the moisture absorption layer 5, and the protective layer 6 are formed on a single substrate 2.
  • a plurality of organic EL light emitting modules 1 are manufactured.
  • the organic EL element 3, the adhesive material 4, the moisture absorption layer 5, and the protective layer 6 are arranged in parallel in 3 rows and 4 columns on one substrate 2, so that 12 organic EL light emitting modules 1 are arranged.
  • Manufactured In the drawings shown below, there may be cases where a plurality of elements are shown, but the elements shown are configured in the same manner. In each drawing, a diagram showing two or three elements is used for convenience.
  • a plurality of elements may be arranged in parallel in at least one of the row direction and the column direction, or only one element may be formed on the substrate 2. Moreover, each element is not restricted to matrix form, You may be arranged in parallel by arbitrary aspects. From the viewpoint of improving productivity, it is preferable that a plurality of elements are formed on the substrate, and since the organic EL light emitting module 1 is easily cut, it is more preferable that the elements are arranged in a matrix.
  • an organic EL element 3 is formed on one surface 21 of the substrate 2.
  • the organic EL element 3 is sandwiched between the sheet-like adhesive material 4 disposed on the one surface 21 of the substrate 2 and the one surface 21 of the substrate 2. Therefore, one surface 31 of the organic EL element 3 is covered with one surface 21 of the substrate 2 and the other surface 32 is covered with the adhesive material 4.
  • a moisture absorbing layer 5 formed in a sheet shape is disposed on the other surface 42 opposite to the one surface 41 that covers the other surface 32 of the organic EL element 3. Therefore, the moisture absorption layer 5 is disposed so as to face the other surface 32 of the organic EL element 3 with the adhesive material 4 interposed therebetween. In addition, the moisture absorption layer 5 is arrange
  • the protective layer 6 has a recessed area 61 that accommodates the hygroscopic layer 5 and a flat area 62 around the recessed area 61.
  • the flat region 62 is bonded to the other surface 42 of the adhesive material 4.
  • the protective layer 6 is formed by forming a concave region 61 in advance by forming a region containing the hygroscopic layer 5 into a concave shape, or after forming the hygroscopic layer 5, the protective layer 6 conforms to the shape of the hygroscopic layer 5.
  • 6 is preferably formed with a recessed region 61.
  • the depth of the recess is preferably substantially equal to the thickness of the hygroscopic layer 5. The reason is that the surface formed by the hygroscopic layer 5 and the protective layer 6 is a flat surface, so that the adhesiveness with the adhesive material 4 is improved, and entry of moisture and oxygen from the outside can be prevented well. It is.
  • the sealing member 10 is comprised by the protective layer 6 and the moisture absorption layer 5 accommodated in the recessed area 61 of the protective layer 6.
  • the substrate 2 serves as a support for the organic EL element, and a quartz or glass plate, a metal plate or a metal foil, a plastic film or a sheet can be used.
  • a glass plate or a transparent synthetic resin plate or sheet such as polyester, polymethacrylate, polycarbonate, or polysulfone is preferred.
  • a method of providing a gas barrier property by providing a dense silicon oxide film or the like on at least one surface of a synthetic resin substrate is also a preferable method.
  • the thickness of the substrate 2 is usually 0.01 to 10 mm, preferably 0.02 to 1 mm.
  • the organic EL element 3 includes a first electrode formed on the substrate 2, an organic EL layer formed on the first electrode, and a second electrode formed on the organic EL layer. Light emitted from the light emitting layer of the organic EL layer of the organic EL element 3 is extracted through the substrate 2.
  • a conventionally well-known thing can be employ
  • the adhesive material 4 is a laminate of the substrate 2 and the organic EL element 3, the hygroscopic layer 5 and the protective layer 6, and is made of, for example, a thermoplastic sheet-like adhesive material having a thickness of about 25 to 100 ⁇ m. Since the characteristics of the adhesive material 4 have a great influence on the sealing performance of the organic EL light emitting module 1 together with the hygroscopic layer 5 and the protective layer 6, it is preferable that the material be a material that hardly holds moisture and oxygen.
  • the adhesive material 4 is preferably thermoplastic, and preferably contains a thermoplastic resin. Although it does not specifically limit as a thermoplastic resin contained in the adhesive material 4, For example, a polypropylene, polyethylene, a polystyrene, polyisobutylene, polyester, polyisoprene etc. can be mentioned. You may use these individually or in combination of 2 or more types.
  • the glass transition temperature of the thermoplastic resin is usually ⁇ 80 ° C. or higher, preferably ⁇ 20 ° C. or higher, from the viewpoint of heat resistance, and the upper limit is not particularly limited. It is also preferable that the adhesive 4 further contains a petroleum resin or a cyclic olefin polymer.
  • the moisture absorption layer 5 contains a desiccant
  • the desiccant is not particularly limited as long as it has a high hygroscopic property.
  • alkaline earth metals, alkali metals or oxides thereof, or inorganic porous materials can be used. These can be used alone or in combination of two or more.
  • alkaline earth metal or alkali metal oxides and inorganic porous materials are preferable, and calcium oxide and zeolite are particularly preferable.
  • the moisture absorption layer 5 is a sheet form.
  • the sheet-like moisture absorption layer can be produced by, for example, mixing a powdery desiccant with a resin and molding it into a sheet.
  • the moisture absorption layer may contain components other than the desiccant, and examples thereof include particles and rods made of Si, AlN, and C having high thermal conductivity.
  • the moisture absorption layer 5 of the present embodiment is formed in a sheet shape, and the lower limit of the thickness is usually 0.1 ⁇ m, preferably 1 ⁇ m, more preferably 10 ⁇ m.
  • the upper limit of the thickness is usually 500 ⁇ m, preferably 200 ⁇ m, more preferably 100 ⁇ m.
  • the protective layer 6 may block moisture and oxygen from the outside and may also function as a support when manufacturing the back member. Moreover, the protective layer 6 may have flexibility.
  • the protective layer 6 can be a metal foil or a laminate of a plastic film and an inorganic compound layer.
  • the protective layer 6 preferably has a gas barrier property.
  • the metal having gas barrier properties include aluminum, copper, nickel, alloy materials such as stainless steel and aluminum alloy.
  • a layer of an inorganic oxide such as silicon oxide or aluminum oxide, or a layer of inorganic nitride such as silicon nitride or aluminum nitride is laminated on a plastic film. And a laminated film.
  • the protective layer 6 is preferably a metal foil from the viewpoint of blocking moisture and oxygen from the outside, and the metal foil is preferably a copper foil and an aluminum foil from the viewpoint of cost reduction and workability, and has an appropriate rigidity. Then, aluminum foil is preferable. From the viewpoint of flexibility, a laminate of a plastic film and an inorganic compound is preferable.
  • the lower limit of the thickness of the protective layer 6 is usually 1 ⁇ m, preferably 10 ⁇ m, more preferably 40 ⁇ m.
  • the upper limit value of the thickness of the protective layer 6 is usually 500 ⁇ m, preferably 200 ⁇ m, more preferably 100 ⁇ m.
  • FIG. 2 is a flowchart showing the overall configuration of the embodiment of the manufacturing system of the organic EL light emitting module 1 according to the present invention.
  • the manufacturing system of the organic EL light emitting module 1 according to the present invention includes a sealing member manufacturing apparatus 100, an adhesive material laminating apparatus 200, a tape member peeling apparatus 300, and a sealing member laminating apparatus 400. And a thermocompression bonding apparatus 500.
  • the sealing member manufacturing apparatus 100 forms the sealing member 10 by laminating the hygroscopic layer 5 and the protective layer 6.
  • the adhesive material bonding apparatus 200 bonds the adhesive material 4 to the sealing member 10.
  • the tape member peeling apparatus 300 peels the release paper 45 (not shown in FIG. 1 and FIG. 2) previously attached to the adhesive material 4 from the adhesive material 4.
  • the sealing member bonding apparatus 400 attaches the sealing member 10 to the substrate 2 on which the organic EL element 3 is formed in advance.
  • the thermocompression bonding apparatus 500 performs thermocompression bonding between the sealing member 10 and the substrate 2.
  • sealing member manufacturing device 3A and 3B are cross-sectional views of the main part of the sealing member manufacturing apparatus 100.
  • the sealing member manufacturing apparatus 100 includes a plurality of pin members 110 (positioning portions), a plurality of stage members 120 (stage portions), and a suction head 130 (sheet-like member). And a hot plate 150 (thermocompression bonding portion) (not shown in FIG. 3).
  • the pin member 110 includes a base part 111 and a standing part 113 standing on the upper surface 112 of the base part 111.
  • the pedestal 111 has a first pedestal 114 having a cylindrical shape with a predetermined first diameter, and is formed to extend upward from the first pedestal 114, and has an upper surface 112, and the diameter becomes closer to the upper surface 112.
  • a second base part 115 having a truncated cone shape configured to be small.
  • the standing portion 113 is formed from a first standing portion 116 that is a cylindrical shape having a predetermined second diameter smaller than the first diameter, and from the first standing portion 116 upward, and an upper surface 117. And a second upright portion 118 having a truncated cone shape configured such that the diameter becomes smaller as it approaches the upper surface 117.
  • the side surface by the peripheral surface of the 1st standing part 116 is called 2nd side surface 119b.
  • the first base portion 114 constituting the first side surface 119a of the pin member 110 and the first standing portion 116 constituting the second side surface 119b are both assumed to be cylindrical. Either one or both may have other shapes such as a rectangular parallelepiped shape. Therefore, as will be described later, if the first side surface 119a is configured so that the hygroscopic layer 5 can be aligned, the first base portion 114 may have another shape such as a rectangular parallelepiped shape. Moreover, if the 2nd side surface 119b is comprised so that position alignment of the protective layer 6 is possible, the other 1st standing part 116 may be other shapes, such as a rectangular parallelepiped shape.
  • the stage member 120 is capable of placing the moisture absorption layer 5 as shown by a solid line in FIG. 3A, and on the back side of the protective layer 6 as shown by a solid line in FIG. 3B. It has the stage surface 121 which is the upper surface which can mount the center part which is the part in which the recessed part 61 is formed and is formed in convex shape.
  • the stage surface 121 is formed to have a shape and a width corresponding to the entire hygroscopic layer 5 and the central portion of the protective layer 6.
  • the flat region 62 of the protective layer 6 is placed on the upper surface 112 of the pedestal 111 of the pin member 110. As shown in FIG. Accordingly, the protective layer 6 is placed from the stage surface 121 to the upper surface 112 of the base portion 111 of the pin member 110.
  • the area on the back side of the recessed area 61 of the protective layer 6 is formed in a convex shape with respect to the plane area on the back side of the flat area 62.
  • the protective layer 6 is placed so that the recessed area 61 faces the suction surface 131 of the suction head 130. Therefore, when the protective layer 6 is placed on the stage member 120, the position of the stage surface 121 is lower than the upper surface 112 of the base 111 of the pin member 110 according to the height of the convex shape of the protective layer 6 described above. It is set to be.
  • FIG. 4 is a top view showing the positional relationship between the pin member 110 and the stage member 120.
  • each pin member 110 is installed adjacent to the central portion of the edge of the stage surface 121 in the stage member 120 having the square (or may be rectangular) stage surface 121. ing.
  • each pin member 110 is installed so that the mutual distance of the 1st side 119a may be shorter than the mutual distance of the 2nd side 119b.
  • the positional relationship between the pin member 110 and the stage member 120 is not limited to the example shown in FIG. 4.
  • Through holes are provided at equal intervals on the upper surface wider than the stage surface 121, and the pin members 110 are arranged in the respective through holes.
  • a plane of a square shape (which may be rectangular) corresponding to the stage surface 121 may be provided between the pin members 110.
  • FIGS. 3A and 3B show two stage members 120. While three or more stage members 120 are installed, A pin member 110 may be installed around each stage member 120. Specifically, for example, the stage members 120 may be arranged in 3 rows and 4 columns, and the pin members 110 may be installed around each stage member 120. According to such a configuration, the hygroscopic layer 5 and the protective layer 6 can be sequentially arranged in 3 rows and 4 columns, and twelve sealing members 10 can be generated in one operation step.
  • the stage member 120 moves up and down so that the distance between the stage surface 121 and the suction surface 131 of the suction head 130 (the suction surface 131 will be described later) changes.
  • the stage surface 121 is lowered to a position adjacent to the first side surface 119 a of the base 111 of the pin member 110.
  • the stage surface 121 is raised upward to a lower position corresponding to the height of the convex shape of the protective layer 6 described above with respect to the upper surface 112 of the base portion 111 of the pin member 110. Has moved.
  • the first side surface 119a of the base 111 of each pin member 110 is used to align the moisture absorption layer 5 placed on the stage surface 121 when the stage member 120 is at a low position.
  • the protective layer 6 is placed from the stage surface 121 to the upper surface 112 of the pedestal 111 of the pin member 110, the first portion 113 of the pin member 110 can be aligned.
  • Two side surfaces 119b can be used.
  • the second base portion 115 has a truncated cone shape.
  • the side surface of the second base portion 115 is formed. Further, it may be a shape having a recess or a notch in the vicinity of the boundary between the upper surface 112 and the upper surface 112 at least on the installation side of the protective layer 6.
  • the second pedestal 115 When the second pedestal 115 has a truncated cone shape, the vicinity of the boundary between the side surface of the second pedestal 115 and the upper surface 112 is in contact with the protective layer 6 so that the central part of the protective layer 6 is lifted from the stage surface 121. It is preferable that the diameter of the second base portion 115 is reduced as it approaches the upper surface 112 to such an extent that it does not become. The reason is that the alignment of the protective layer 6 and the bonding with the hygroscopic layer 5 can be performed with high accuracy, and the hygroscopic layer 5 is placed on the stage surface 121 of the stage member 120 and the first of the pin member 110. When the moisture absorbing layer 5 is disposed at a position determined by the side surface 119a, the moisture absorbing layer 5 is not easily caught on the end portion of the upper surface 112 of the base portion 111 of the pin member 110.
  • the side surface and the upper surface 112 of the second base part 115 when it has a shape near the boundary between the side surface of the second base part 115 and the upper surface 112 and having a recess or notch at least on the installation side of the protective layer 6, the side surface and the upper surface 112 of the second base part 115.
  • the vicinity of the boundary between the side surface of the second base portion 115 and the upper surface 112 becomes the protective layer 6 so that the central portion of the protective layer 6 does not float from the stage surface 121 when the vicinity of the boundary of the substrate contacts the protective layer 6.
  • a shape that does not contact is preferable.
  • the protective layer 6 is placed on the stage surface 121 of the stage member 120 and the first pin member 110 has a first surface.
  • the protective layer 6 is disposed at a position defined by the second side surface 119b of the standing portion 116, the protective layer 6 is not easily caught by the end portion of the upper surface 117 of the second side surface 119b of the first standing portion 116 of the pin member 110. .
  • the second standing portion 118 has a truncated cone shape.
  • the protective layer 6 is not designed to be hindered from adsorbing to the adsorption surface 131, the second standing portion 118 may be designed and manufactured precisely. 118 may be the same as the first standing portion 116, in other words, the structure without the second standing portion 118.
  • the pin member 110 has such a structure, the hygroscopic layer 5 and the protective layer 6 having different sizes are aligned and placed by the same pin member 110, so that the hygroscopic layer when laminated is stacked. 5 and the protective layer 6 can be favorably suppressed. Therefore, the hygroscopic layer 5 can be reliably accommodated in the recessed area 61 of the protective layer 6.
  • the suction head 130 has a suction surface 131 that is installed above the pin member 110 and the stage member 120 and faces the stage surface 121.
  • the suction surface 131 is provided with a plurality of suction holes 132, and when close to the stage surface 121, the moisture absorption layer 5 and the protective layer 6 sequentially placed on the stage surface 121 are sequentially vacuum-adsorbed.
  • the hot plate 150 heats and bonds the moisture absorption layer 5 and the protective layer 6 adsorbed by the adsorption surface 131 of the adsorption head 130 to each other.
  • the moisture absorbing layer 5 is placed on the stage surface 121 so that the end portion is in contact with the first side surface 119a of the pin member 110 in a state where the stage member 120 is in a low position. . Then, the adsorption head 130 descends in a direction approaching the stage surface 121 and adsorbs the moisture absorption layer 5 placed on the stage surface 121 to the adsorption surface 131.
  • the pin member 110 moves down together with the suction head 130 while maintaining the positional relationship between them, thereby allowing the suction head 130 to approach the stage surface 121.
  • the stage member 120 may be raised.
  • the moisture absorption layer 5 is adsorbed to the adsorption surface 131 of the adsorption head 130 and is held above the stage surface 121.
  • the stage member 120 moves so that the stage surface 121 is at the high position, and the end portion of the protective layer 6 contacts the second side surface 119 b of the pin member 110.
  • the protective layer 6 is placed from the stage surface 121 to the upper surface 112 of the base 111 of the pin member 110.
  • the adsorption head 130 is adsorbed on the adsorption surface 131 so as to overlap with the moisture absorption layer 5 holding the protective layer 6 placed on the stage surface 121 in the vicinity of the stage surface 121.
  • the movement of the pin member 110 at this time is the same as in the case of adsorption of the moisture absorption layer 5.
  • the protective layer 6 is adsorbed on the adsorption surface 131 of the adsorption head 130, and the hygroscopic layer 5 is accommodated in the recessed area 61 of the protective layer 6.
  • the hygroscopic layer 5 and the protective layer 6 constituting the member 10 are laminated.
  • the sealing member 10 is composed of the hygroscopic layer 5 and the protective layer 6, the organic EL element 3 sealed by the sealing member 10 can be well prevented from transmitting moisture and the like from the outside. Since the moisture absorption layer 5 absorbs a part of the moisture, the deterioration of the organic EL element 3 can be satisfactorily suppressed.
  • FIG. 5 is an explanatory view showing a hot plate 150 for heating the moisture absorbing layer 5 and the protective layer 6.
  • the suction head 130 is moved to another place where the hot plate 150 is located below while the sealing member 10 is sucked.
  • the hygroscopic layer 5 and the protective layer 6 stacked on the suction surface 131 of the suction head 130 and sucked upward are heated from below by the hot plate 150 and bonded together.
  • the hot plate 150 may heat and press the moisture absorbing layer 5 and the protective layer 6 and press them against the suction surface 131 of the suction head 130 for thermocompression bonding.
  • the heating temperature in thermocompression bonding is usually 40 ° C. or higher, preferably 50 ° C. or higher, and usually 300 ° C. or lower, preferably 200 ° C. or lower.
  • the heating time for thermocompression bonding is usually 1 second or longer, preferably 5 seconds or longer, and usually 30 minutes or shorter, preferably 15 minutes or shorter.
  • the adsorption head 130 is provided on the adsorption surface 131 outside the region facing the moisture absorption layer 5 in the region facing the protection layer 6. Adsorption is performed only by the suction holes 132 formed. This is preferable because it is possible to prevent the formation of irregularities due to the traces of adsorption by the suction holes 132 on the surface of the moisture absorption layer 5 facing the adsorption surface 131.
  • the suction head 130 is provided in the vicinity of the periphery of the region facing the moisture absorbing layer 5 out of the suction holes 132 provided outside the region facing the moisture absorbing layer 5 in the region facing the protective layer 6. Adsorption is preferably performed by the holes 132.
  • the boundary portion between the hygroscopic layer 5 and the protective layer 6 is sucked into a vacuum, and the hygroscopic layer 5 and the protective layer 6 come into close contact with each other at the boundary portion. Occurrence can be prevented.
  • FIG. 6 is an explanatory view showing a mounting table 610 on which the sealing member 10 in which the moisture absorption layer 5 and the protective layer 6 are laminated and bonded together is mounted.
  • the hygroscopic layer 5 and the protective layer 6 bonded together by the hot plate 150 are moved into the nitrogen replacement chamber 600 where the mounting table 610 is positioned below while being adsorbed by the adsorption head 130.
  • the mounting table 610 is installed in the nitrogen replacement chamber 600 and has a concave portion 616 on the upper surface 615 corresponding to the height of the convex shape generated by forming the concave region 61 in the protective layer 6. As shown in FIG.
  • the sealing member 10 in which the hygroscopic layer 5 and the protective layer 6 are laminated and bonded together has a convex shape of the protective layer 6 in the concave portion 616 on the upper surface 615 of the mounting table 610. Is placed so as to be accommodated. As shown in FIG. 6, the sealing member 10 is mounted on the recess 616 of the mounting table 610 in such a direction that the recess region 61 of the protective layer 6 is on the upper side. It is preferable that the recess 616 of the mounting table 610 has a suction hole and can suck the sealing member 10.
  • the adhesive material bonding apparatus 200 includes a plurality of pin members 210, a plurality of stage members 220, and a suction head 230.
  • the adhesive material laminating apparatus 200 further includes an adsorption reversal member 240 (not shown in FIGS. 7A and 7B), and an adsorption transfer member 250 (FIGS. 7A and 7B) as a tape member adsorption portion. (Not shown in FIG. 7), a mounting table 610 (not shown in FIGS. 7A and 7B), and a roller member 611 (not shown in FIGS. 7A and 7B).
  • the stage member 220 has a stage surface 221 that is an upper surface on which the adhesive material 4 having release papers 43a and 43b attached in advance on both sides can be placed.
  • the stage surface 221 is formed by a plurality of pin members 210 so as to have a shape and a width corresponding to the entire adhesive material 4.
  • the adhesive material 4 may have a release paper attached only on one side.
  • the plurality of pin members 210 are formed, for example, from a cylindrical first base portion 211 and the first base portion 211 upward, and having an upper surface 212. And a second base portion 215 having a frustoconical shape configured such that the diameter decreases as it approaches the upper surface 212.
  • a side surface 219 of the pin member 210 is configured by the peripheral surface of the first base portion 211.
  • the pin member 210 is configured such that when the adhesive material 4 is placed on the stage surface 221, the adhesive material 4 comes into contact with the side surface 219, and the upper surface 212 is the stage.
  • the upper surface 212 transitions to a lower state where the upper surface 212 is substantially the same height as the stage surface 221 from a higher state where the member 220 is higher than the stage surface 221. That is, the pin member 210 moves up and down relatively with respect to the stage surface 221 of the stage member 220.
  • the pin member 210 is set to the above-described high state, and the adhesive material 4 is placed on the stage surface 221 so that the release paper 43a is on the upper surface.
  • the side surface 219 of the pin member 210 the relative positional relationship of the plurality of adhesive materials 4 is maintained in a predetermined arrangement.
  • the suction head 230 has the release paper 43a on one surface and the release paper 43b on the other surface in advance, and the stage surface 221 of the stage member 220.
  • the adhesive material 4 placed on is adsorbed and held from above. Specifically, the stage member 220 and the pin member 210 are moved upward as a unit. After the surface of the suction head 230 and the upper surface 212 of the pin member 210 abut, only the stage member 220 is moved upward, and the suction head 230 and the adhesive material 4 are brought close to each other, so that the suction head 230 Adhesive material 4 is adsorbed.
  • the suction head 230 sucks the release paper 43a and holds the adhesive material 4 and the release paper 43b upward.
  • the adsorption head 230 and the stage member 220 are separated again to some extent to bring the pin member 210 into the low state, and the stage surface 221 of the plurality of stage members 220 and the plurality of pin members
  • the strip-shaped tape member 7 is placed over the upper surface 212 of 210. Note that one surface 71 facing upward in the placed tape member 7 has adhesiveness.
  • the adhesive material 4 that is attracted and held upward by the suction head 230 brings the suction head 230 and the stage member 220 close together again, thereby causing the tape member 7 to adhere.
  • release paper 43 a is removed from the tape member 7.
  • the removal of the release paper 43a may be performed manually or may be performed by an apparatus for removing the release paper.
  • the tape member 7 has a belt shape, but the tape member 7 may have a belt shape or a sheet shape that has been cut into a predetermined size in advance. It is preferable that the tape member 7 has a strip shape because the tape member can be easily and continuously supplied by unwinding operation in continuous production.
  • a blank area 72 where the adhesive material 4 is not attached is provided at least at one end of the belt-like tape member to which the adhesive material 4 is attached.
  • the strip-shaped tape member has the stage surface of the plurality of stage members 220 such that when the adhesive material 4 is applied, a blank area 72 where the adhesive material 4 is not applied is provided at least at one end. 221 and the upper surface 212 of the plurality of pin members 210. 7B, in the strip-shaped tape member 7 to which the adhesive material 4 is attached, the adhesive material 4 is disposed at the end opposite to the unwinding side in the longitudinal direction (on the right side in FIG. 7B). The figure in which the blank area 72 where no is attached is provided is shown.
  • the blank area 72 to which the adhesive material 4 is not applied may be on the tape winding side (left side in FIG. 7B) in FIG. 7B, or the band-shaped tape member may be wound. It may be an end having a side parallel to the extrusion direction (front side or back side as viewed in FIG. 7B).
  • FIG. 8 is an explanatory view showing the operation of the adsorption reversing member 240.
  • the adsorption reversal member 240 has adsorption surfaces 241 for adsorbing the area between the plurality of adhesive materials 4 attached to the tape member 7 and the blank area 72.
  • the suction reversal member 240 sucks the tape member 7 onto the suction surface 241 from above the tape member 7 placed over the stage surfaces 221 of the plurality of stage members 220 and the upper surfaces 212 of the plurality of pin members 210. . That is, on one surface 71 of the tape member 7, the region between the adhered adhesive materials 4 and the blank region 72 are adsorbed below the adsorption surface 241 of the adsorption reversal member 240.
  • the adsorption reversal member 240 performs a vertical reversal operation as shown in FIG. That is, on one surface 71 of the tape member 7, the region between the affixed adhesive materials 4 and the blank region 72 are adsorbed above the adsorption surface 241 of the adsorption reversal member 240.
  • the suction reversing member 240 is rotatably supported at both ends in the longitudinal direction, for example, and rotates up and down around the longitudinal direction to perform the upside down operation.
  • the upside down operation performed by the suction inversion member 240 may be performed by other methods.
  • FIG. 9 is an explanatory diagram showing delivery of the tape member 7 by the suction reversal member 240 and the suction transfer member 250 (tape member suction portion).
  • the adsorption transfer member 250 adsorbs the other surface 73 on the back side of one surface 71 of the tape member 7 from above the adsorption surface 241 of the adsorption reversal member 240 and also reverses the adsorption.
  • the member 240 ends the suction operation.
  • the tape member 7 is transferred from the suction reversal member 240 to the suction transfer member 250.
  • the adsorption transfer member 250 moves together with the tape member 7 on the nitrogen replacement chamber 600.
  • the adhesive material 4 to which only the release paper 43b is attached is used, first, as in FIG. 7A, the adhesive material 4 to which only the release paper 43b is attached is brought into contact with the side surface 219 of the pin member 210, And it arrange
  • the adhesive material 4 and the tape member 7 can be attached in the same process as described above.
  • a fluorinated resin can be used, and specific examples thereof include polytetrafluoroethylene.
  • the adhesive material 4 to which only the release paper 43a is attached is used, first, as in FIG. 7A, the adhesive material 4 to which only the release paper 43a is attached is brought into contact with the side surface 219 of the pin member 210, In addition, the adhesive material surface on the opposite side of the release paper 43 a is disposed so as to contact the stage surface 221 of the stage member 220.
  • the stage surface 221 is formed of a material to which the adhesive material 4 does not adhere.
  • a fluorinated resin can be used, and specific examples thereof include polytetrafluoroethylene.
  • the pin member 210 is lowered to a position equal to or lower than the height of the surface of the release paper 43a of the adhesive material 4.
  • the adhesive surface of the adhesive tape member 7 is disposed so as to face the release paper 43 a of the adhesive material 4, and the adhesive surface of the tape member 7 is applied to the release paper 43 a of the adhesive material 4. Paste.
  • the tape member 7 to which the adhesive material 4 is attached via the release paper 43a can be obtained. According to this method, the step of inverting the tape member 7 to which the adhesive material 4 is attached is not necessary, and the production efficiency can be increased.
  • this process using the adhesive material 4 having the release paper attached to only one side is preferable.
  • FIGS. 10A and 10B are explanatory diagrams showing a nitrogen replacement process by the nitrogen replacement chamber 600.
  • FIG. 10A the nitrogen replacement chamber 600 has an upper surface 606 provided with a through hole 605.
  • the adsorption transfer member 250 that has adsorbed the tape member 7 downward is located above the placement table 610 in the nitrogen replacement chamber 600 on which the sealing member 10 is placed.
  • the mounting table 610 is provided with a roller member 611 (described later) that can move along the longitudinal direction of the tape member 7.
  • the upper portion of the suction transfer member 250 is covered by the upper surface portion 601 and the lower portion of the mounting table 610 is covered by the lower surface portion 602. Further, the side of the mounting table 610 is covered with a side surface 603.
  • the side surface 603 has a lower end in contact with the upper surface of the lower surface portion 602.
  • the through hole 605 provided in the upper surface 606 of the nitrogen replacement chamber 600 is blocked by the side surface portion 603 and the lower surface portion 602 so that the nitrogen in the nitrogen replacement chamber 600 does not flow out to the outside. Has been.
  • the upper surface portion 601 moves downward, or the lower surface portion 602, the side surface portion 603, and the nitrogen replacement chamber 600 move upward, and the upper surface portion 601 and the lower surface portion 602 are moved.
  • the side surface portion 603 the upper end of the side surface portion 603 abuts on the upper surface portion 601 and the lower end of the side surface portion 603 becomes the lower surface portion 602. Contact
  • the space is sealed (first state). It is assumed that the roller member 611 is disposed at a position that does not interfere even when the upper surface portion 601 and the lower surface portion 602 approach each other. At this time, the adhesive material 4 and the sealing member 10 are not in contact with each other. Then, in a state where the space is sealed, air is exhausted from the space and evacuated, and then nitrogen is supplied to create a nitrogen atmosphere in the space.
  • nitrogen replacement in the first state of the space is performed in a state in which the upper surface portion 601 and the lower surface portion 602 are close to each other, so that the volume of the space for discharging air and replacing nitrogen can be reduced.
  • the interior of the space can be made a nitrogen atmosphere in a shorter time.
  • FIGS. 11A, 11 ⁇ / b> B, and 11 ⁇ / b> C are explanatory diagrams illustrating a process of attaching the adhesive material 4 to the sealing member 10.
  • the lower surface portion 602 moves downward, or the upper surface portion 601 and the side surface portion 603 move upward, so that the upper surface portion 601 and the lower surface portion 602 are relatively separated from each other,
  • the roller member 611 becomes movable (second state) along the longitudinal direction of the tape member 7.
  • the lower surface portion 602 moves downward.
  • the roller member 611 includes a support portion 612 and a roller portion 613.
  • One end of the support portion 612 is supported by the mounting table 610 so as to be movable along the longitudinal direction of the tape member 7, and the other end supports the roller portion 613 so as to be rotatable.
  • the roller part 613 is formed in a cylindrical shape and rotates around the central axis.
  • the roller portion 613 has a strip-shaped tape member 7 between the suction transfer member 250 and the tape member 7 while peeling the tape member 7 from the suction transfer member 250. Rolling from one end to the other end along the longitudinal direction. That is, as the support portion 612 of the roller member 611 moves along the longitudinal direction of the tape member 7, the roller portion 613 rolls while peeling the tape member 7 from the suction transfer member 250. Further, the peripheral surface of the roller portion 613 presses the adhesive material 4 against the sealing member 10 from the tape member 7 side, and bonds the adhesive material 4 to the sealing member 10.
  • the roller portion 613 rolls from one end portion to the other end portion along the longitudinal direction of the tape member 7, and presses the adhesive material 4 against the sealing member 10 from the tape member 7 side by the peripheral surface. Since the adhesive material 4 is configured to be bonded to the sealing member 10, it is possible to favorably prevent a space from being generated between the adhesive material 4 and the sealing member 10.
  • the suction transfer member 250 is configured such that when the tape member 7 is peeled from the one end to the other end along the longitudinal direction of the tape member 7, the other end of the tape member is removed. It is preferable to continue the suction operation on the side. Thereby, it is possible to prevent the tape member 7 from falling downward while the roller portion 613 is rolling.
  • the tape member 7 and the sealing member 10 can be bonded with high accuracy without causing the positions of the tape member 7 and the sealing member 10 to shift during the rolling of the roller, and the occurrence of wrinkles in the adhesive material 4 can be prevented. It can prevent well and it can prevent that a space
  • the inside is provided by at least a part of the upper surface portion 601 and the suction transfer member 250 by an operator. Or it is preferable that the window part is provided so that it can confirm with monitoring apparatuses, such as imaging
  • the suction hand 700 will be described.
  • the suction hand 700 is used to transfer the adhesive material 4, the sealing member 10, and the tape member 7 bonded together to the vacuum chamber 800 from the nitrogen substitution chamber 600.
  • the vacuum chamber 800 is a container whose inside can be in a vacuum atmosphere.
  • FIG. 12A and 12B are explanatory views showing the operation of the suction hand 700.
  • FIG. 12 (a) the suction hand 700 has the tape member 7, the adhesive material 4, and the sealing member 10 that are mounted on the mounting table 610 and bonded to each other. 7 is attracted and held upward from the other surface 73 side.
  • the suction hand 700 is installed in the vacuum chamber 800 while sucking and holding the tape member 7, the adhesive material 4, and the sealing member 10 bonded together. Then, it moves above the mounting table 802 having the upper surface 801. Next, the suction hand 700 places the tape member 7, the adhesive material 4, and the sealing member 10 bonded together on the upper surface 801 of the placement table 802.
  • FIGS. 13A and 13B are explanatory views showing the operation of the tape member peeling apparatus 300.
  • the tape member peeling apparatus 300 includes a tape member bending member 301, a tape member gripping member 302 (grip), and a tape member peeling assisting member 303.
  • (B) includes a tape member mounting table 304 (mounting table) (not shown).
  • the tape member bending member 301 is, for example, a rod-like body that is supported so as to be movable toward the tape member 7 placed on the upper surface 801 of the placement table 802. When the portion comes into contact with the blank area 72 of the tape member 7, the blank area 72 of the tape member 7 is bent upward.
  • the tape member gripping member 302 moves away from the tape member 7 while gripping at least a part of the blank area 72 of the tape member 7 that is bent, whereby the tape member 7 and the tape member 7.
  • the release paper 43b affixed to is peeled from the adhesive material 4.
  • the tape member gripping member 302 moves away from the tape member 7 while gripping the blank area 72 of the bent tape member 7.
  • the tape member peeling auxiliary member 303 moves in the longitudinal direction of the tape member 7 similarly to the tape member holding member 302 while pressing the tape member 7 below the moving tape member holding member 302 against the adhesive material 4. Then, the tape member 7 is pulled by the tape member gripping member 302 with the position where the tape member peeling assisting member 303 is pressed against the adhesive material 4 as the tape member gripping member 302 and the tape member peeling assisting member 303 move.
  • the tape member 7 and the release paper 43 b attached to the tape member 7 are peeled from the adhesive material 4.
  • the tape member peeling auxiliary member 303 is formed so that it may have a right-angled triangular cross section, other shapes may be sufficient.
  • the peel angle of the peeled tape member 7 is preferably an acute angle.
  • the tape member peeling auxiliary member 303 has a flat surface in contact with the tape member 7, and the tape member 7 is pulled by the tape member gripping member 302. It is preferable that the angle of the cross section of the part which becomes a fulcrum is an acute angle shape. Further, when the shape of the tape member peeling assisting member 303 is a thin plate, the curvature of the shape of the cross section of the tape member peeling assisting member 303 that becomes a fulcrum when the tape member 7 is pulled by the tape member gripping member 302 is used. The radius is preferably 5 ⁇ m or more so as not to cut the tape member 7.
  • the radius of curvature of the cross-sectional shape of the tape member peeling assisting member 303 that becomes a fulcrum when the tape member 7 is pulled by the tape member gripping member 302 is uniformly peeled with the peeling angle kept at an acute angle. In order to achieve this, it is preferably 5 mm or less.
  • the tape member gripping member 302 places the tape member 7 peeled from the adhesive material 4 and the release paper 43b attached to the tape member 7 on the upper surface 305 of the tape member mounting table 304.
  • FIG. 14 illustrates the operation of placing the tape member 7 peeled from the adhesive material 4 by the tape member gripping member 302 and the release paper 43b attached to the tape member 7 on the upper surface 305 of the tape member mounting table 304.
  • the tape member peeling apparatus 300 is installed in a nitrogen atmosphere separated from the outside air by the partition member 310.
  • the tape member mounting base 304 is provided on the top surface of the partition member 310, and is covered from the outside by a lid 311 (lid portion) that is opened when pushed up. It moves below the hole 312.
  • the outer shape and outer diameter of the tape member mounting table 304 and the inner shape and inner diameter of the through hole 312 are set so that the tape member mounting table 304 and the through hole 312 can be fitted.
  • the lid 311 is in contact with the outer surface of the top surface of the partition member 310 via a sealing member such as an O-ring.
  • FIG. 15 (a) to 15 (f) are explanatory diagrams showing the operation of the tape member mounting table 304.
  • FIG. 15A the tape member mounting table 304 that has moved below the through-hole 312 moves upward as shown in FIG. 15B, and passes through the tape member 7 from which the upper surface 305 has been peeled off. And adheres to the lower surface of the lid 311.
  • the tape member mounting table 304 moves further upward, the tape member mounting table 304 pushes the lid 311 upward at the upper surface 305 as shown in FIG.
  • the lid 311 pushed upward by the upper surface 305 of the tape member mounting table 304 is further lifted upward by a lid support member (not shown), and the tape member is removed by a tape member removal member (not shown).
  • the tape member 7 mounted on the upper surface 305 of the mounting table 304 and the release paper 43b attached to the tape member 7 are removed. This step may be performed manually or by an apparatus for removing the tape member.
  • the outer shape and outer diameter of the tape member mounting table 304 and the inner shape and inner diameter of the through hole 312 are such that the tape member mounting table 304 and the through hole 312 can be fitted. Is set. Therefore, even if the lid 311 is in the open state as shown in FIGS. 15C and 15D, the inflow of outside air through the through hole 312 can be well prevented. Note that it is preferable that the atmospheric pressure of the nitrogen atmosphere is higher than the external atmospheric pressure because the inflow of outside air can be more effectively prevented even if the airtightness is not high.
  • FIG. 16 is an explanatory view showing the movement of the substrate 2 carried into the manufacturing system of the organic EL light emitting module. As shown in FIG. 16, the substrate 2 moves while being supported from below by a plurality of rollers 411 that are rotatably supported.
  • FIG. 17 is an explanatory diagram showing position adjustment of the substrate 2 in the sealing member laminating apparatus 400.
  • the sealing member laminating apparatus 400 includes an imaging unit 401 that images the substrate 2, and the substrate 2 is placed, and the substrate 2 is moved and rotated based on the imaging result of the imaging unit 401.
  • an adjustment table 402 to be adjusted.
  • the imaging unit 401 images the substrate 2 placed on the adjustment table 402.
  • the adjustment table 402 adjusts the position of the substrate 2 based on the positions where the alignment marks shown at the two opposite corners and the four corners of the substrate 2 are previously photographed.
  • the control unit (not shown) of the adjustment base 402 determines that the position of the substrate 2 is shifted in the moving direction by the roller 411 compared to the specified position based on the imaging result. Then, the roller 411 is rotationally driven to move the substrate 2 to a specified position.
  • the control unit of the adjustment base 402 determines that the orientation of the substrate 2 is oblique on the placement surface with respect to the prescribed orientation based on the imaging result, the substrate 2 is in the prescribed orientation.
  • the adjustment table 402 is rotated along the mounting surface.
  • FIG. 18A and 18B are explanatory views showing the movement of the substrate 2 into the vacuum chamber 800.
  • FIG. 18A When the adjustment of the position and the like of the substrate 2 is completed, the adjustment table 402 moves below the lid portion 803 of the vacuum chamber 800 with the substrate 2 placed thereon (FIG. 18A).
  • the lid portion 803 has a concave portion 804 whose downward direction is the opening direction.
  • a substrate adsorbing member 805 substrate adsorbing upper surface portion
  • having a plurality of suction holes for vacuum adsorbing the substrate 2 on the lower surface 820 is indicated by a broken line in FIG. As shown, the substrate 2 placed on the adjustment table 402 is sucked and held upward.
  • the adjustment table 402 moves to the place where the photographing unit 401 or the like is installed and the position or the like is adjusted. , Away from the bottom of the lid 803 of the vacuum chamber 800.
  • the mounting table 802 (member setting unit) on which the sealing member 10 to which the adhesive material 4 is bonded is mounted at a position below the lid 803 of the vacuum chamber 800 where the adjustment table 402 is separated. It moves together with a chamber lower part 807 having a recess 806 that covers the lower side and the side of the mounting table 802 and opens upward.
  • the end surface of the concave portion 804 in the lid portion 803 of the vacuum chamber 800 and the end surface 808 of the concave portion 806 in the chamber lower portion 807 come into contact with each other, whereby the inside and the outside of the vacuum chamber 800 are partitioned, and the substrate 2 by the substrate adsorbing member 805 At the same time, the vacuuming operation for making the inside of the vacuum chamber 800 a vacuum atmosphere is performed, and the inside becomes a vacuum atmosphere.
  • the opening shape of the recess 806 of the chamber lower portion 807 is formed such that the end surface 808 supports the outer edge portion of the substrate 2. Accordingly, when the adsorption operation of the substrate 2 by the substrate adsorption member 805 is completed, the outer edge portion of the substrate 2 is supported by the end surface 808 (support base portion) of the recess 806 of the chamber lower portion 807.
  • the difference in height between the lower surface 820 and the end surface 808 is usually 10 mm or less, preferably 5 mm or less, and more preferably 2 mm or less in order to suppress an impact when contacting the outer edge portion of the substrate 2.
  • the difference in height from the end face 808 is usually 0.01 mm or more, preferably 0.1 mm or more in addition to the thickness of the substrate 2.
  • the end surface 808 (support base) of the recess 806 of the chamber lower portion 807 is the same as the surface facing the end surface of the recess 804 of the lid 803, but the end surface 808 is provided with a step. May be formed.
  • the outer edge portion of the substrate 2 supported by being in contact with the end surface 808 of the recess 806 of the chamber lower portion 807 may be the four corners of the rectangular substrate 2, or the end sides along two opposing short sides or long sides. Part.
  • FIG. 19 is an explanatory view showing an apparatus for bonding the substrate 2 to the sealing member 10 to which the adhesive material 4 is bonded.
  • a movable central suction portion 810 (movable suction portion) that can be moved in the vertical direction in the figure and can push down the substrate 2 is provided at the central portion of the substrate suction member 805.
  • the movable central suction portion 810 is formed with a pressing surface 811 that contacts the other surface 22 on the back side of the one surface 21 on which the organic EL element 3 is formed on the substrate 2.
  • the pressing surface 811 is also provided with a suction hole that can suck the substrate 2.
  • the tip of the movable suction portion 810 where the pressing surface 811 is formed may be a convex portion 812 as shown in FIG.
  • the substrate 2 bends downward by the weight of the substrate 2 itself.
  • the amount of downward displacement increases toward the center of the substrate 2.
  • the displacement amount of the central portion of the substrate 2 when the substrate 2 is sucked and only the outer edge portion of the substrate 2 is supported and bent downward by its own weight is previously stored. It is preferable to keep track of it.
  • the movable central suction portion 810 may be provided at a position corresponding to the central portion of the rectangular substrate 2 (FIG. 20A) or in the short direction passing through the central portion in the longitudinal direction of the substrate 2. It may be provided with a length of about the short side of the substrate 2 along a straight line (FIG. 20B). Moreover, the movable center adsorption
  • the mounting table 802 in the chamber lower portion 807 is movable upward, and the sealing member 10 to which the adhesive material 4 mounted on the upper surface 801 is bonded is attached to the substrate. 2 and the organic EL element 3 formed on the one surface 21 with the adhesive material 4 sandwiched between them, and the sealing member 10 and the substrate 2 can be bonded together via the adhesive material 4.
  • the mounting table 802 preferably has a suction hole (not shown) capable of sucking the sealing member 10 to which the adhesive material 4 placed on the upper surface 801 is bonded.
  • FIG. 21A is explanatory views showing a process of bonding the substrate 2 and the sealing member 10 through the adhesive material 4.
  • FIG. 21A the substrate 2 is adsorbed upward by the lower surface 820 of the substrate adsorbing member 805 and the pressing surface 811 of the movable central adsorbing portion 810.
  • the space inside the vacuum chamber 800 (more specifically, the space surrounded by the lid portion 803 and the chamber lower portion 807) is, for example, a nitrogen atmosphere at atmospheric pressure until the lid portion 803 and the chamber lower portion 807 come into contact with each other. Suppose there is.
  • the space inside the vacuum chamber 800 is evacuated after the lid portion 803 and the chamber lower portion 807 are brought into contact and in close contact until the substrate 2 and the sealing member 10 are bonded together via the adhesive material 4. Create a vacuum atmosphere.
  • the suction method of the movable central suction portion is vacuum suction, the vacuum degree of suction of the movable central suction portion to such an extent that the suction of the substrate 2 is maintained by the vacuum suction of the movable central suction portion. This is higher than the degree of vacuum in the space inside the vacuum chamber 800.
  • the sealing member 10 to which the adhesive material 4 placed on the upper surface 801 of the placement table 802 is bonded is attracted to the upper surface 801 of the placement table 802 by vacuum suction, the adhesive material 4 is removed.
  • the degree of vacuum in which the bonded sealing member 10 is vacuum-sucked on the upper surface 801 of the mounting table 802 is set higher than the degree of vacuum in the space inside the vacuum chamber 800.
  • the suction operation by the pressing surface 811 of the movable central suction portion 810 is continued and the suction operation by the lower surface 820 of the substrate suction member 805 is stopped, the outer edge portion of the substrate 2 is moved as shown in FIG.
  • the substrate 2 is bent downward by the weight of the substrate 2 itself, and the outer edge portion comes into contact with the end surface 808 of the recess 806 of the chamber lower portion 807.
  • the inside of the vacuum chamber 800 does not need to start evacuation, may start evacuation, or may start evacuation and does not have a predetermined degree of vacuum. Good.
  • the suction operation by the pressing surface 811 of the movable central suction portion 810 is continued, and the movable central suction portion 810 is moved downward (FIGS. 21C and 21D).
  • suction part 810 moves below by the amount of displacement of the center part of the board
  • the inside of the vacuum chamber 800 does not need to start evacuation, may start evacuation, or may start evacuation and does not have a predetermined degree of vacuum. Good.
  • the sealing member 10 mounted on the upper surface 801 comes into contact with the organic EL element 3 formed on the one surface 21 of the substrate 2 through the adhesive material 4. Then, the sealing member 10 and the substrate 2 are sequentially bonded from the central portion of the substrate 2 to the end portion via the adhesive material 4.
  • the suction operation by the movable central suction unit 810 is continued until the sealing member 10 and the substrate 2 are bonded to each other through the adhesive material 4, and the movable central suction unit 810 is moved by the mounting table 802.
  • the substrate 2 moves upward as the substrate 2 is pushed up.
  • the inside of the vacuum chamber 800 is preferably at a predetermined degree of vacuum.
  • the deflection due to the weight of the substrate 2 is large because the angle formed by the substrate 2 and the sealing member 10 is large, and the generation of voids can be suppressed well and uniformly adhered.
  • the amount of bending due to the weight of the substrate 2 is maximized.
  • the outer edge portion of the substrate 2 supported by being in contact with the end surface 808 is an edge portion along two opposing short or long sides of the rectangular substrate, the outer edge portion of the substrate 2 is in contact with and supported by the end surface 808.
  • the movable central suction portion 810 can suck the center line parallel to the edge of the substrate 2 supported by being in contact with the end surface 808, it is preferable because the substrate can be stably held.
  • the substrate 2 can be stably held and the amount of bending is large.
  • the movable central suction unit 810 continues to suck the substrate 2, and the mounting table 802 holds the sealing member 10.
  • the mounting table 802 holds the sealing member 10.
  • the movable central suction portion 810 has been described as moving downward by the amount of displacement deflected downward due to the weight of the substrate 2, but the downward movement amount of the movable central suction portion 810 is due to its own weight. It may be set to a value appropriately changed from the displacement amount.
  • the movable central suction unit 810 moves the mounting table 802 upward and the organic EL element 3 formed on the substrate 2 comes into contact with the sealing member 10 via the adhesive material 4.
  • the substrate 2 adsorbed at the same speed as the upward movement speed of 802 may be moved upward, or a predetermined load is applied downward (that is, to the substrate 2) during the movement, and the substrate 2 is placed.
  • the table 802 may be moved upward together with the substrate 2 in accordance with the pushing up of the table 802.
  • FIG. 22 is an explanatory diagram showing a process in which the substrate 2 and the sealing member 10 bonded together with the adhesive material 4 are thermocompression bonded.
  • the upper hot plate portion 501 located above the substrate 2, the adhesive material 4, and the sealing member 10 accommodated in the thermocompression bonding apparatus 500 removes the substrate 2 from the other surface 22 side of the substrate 2.
  • the substrate 2 is pressed toward the sealing member 10 through the adhesive material 4 while being heated.
  • the lower hot plate portion 502 (hot plate portion) below the substrate 2 the adhesive material 4 and the sealing member 10 accommodated in the thermocompression bonding apparatus 500 is sealed from the protective layer 6 side of the sealing member 10.
  • the member 10 is heated and the sealing member 10 is pressed toward the substrate 2. Therefore, the substrate 2, the adhesive material 4, and the sealing member 10 are sandwiched between the upper hot plate portion 501 and the lower hot plate portion 502 and are thermocompression bonded.
  • the region on the back side of the recessed region 61 of the protective layer 6 is formed in a convex shape with respect to the planar region on the back side of the flat region 62. Therefore, in the lower hot plate portion 502 facing the convex shape, the lower hot plate portion 502 has a shape and height corresponding to the convex shape in a range facing the flat region on the back side of the flat region 62, preferably in a shape corresponding to the convex shape. And the convex part 503 formed higher than the convex shape is provided.
  • the outer edge portion is more reliably thermocompression bonded to the substrate 2, and the organic EL element 3 and the moisture absorption layer 5 formed on the one surface 21 of the substrate 2 are more reliably sealed with the sealing member 10, the adhesive material 4, and the substrate 2. Can be stopped.
  • the organic EL element 3 is sealed by the sealing member 10 and the adhesive material 4 in which the moisture absorption layer 5 and the protective layer 6 are laminated, so that the organic EL due to the permeation of moisture or the like from the outside.
  • the organic EL light emitting module 1 that favorably suppresses the deterioration of the element 3 can be manufactured.
  • the moisture absorbing layer 5 and the protective layer 6 having different sizes are accurately aligned and stacked by a simple mechanism that simply moves the pin member 110 up and down, the production of defective products due to misalignment is suppressed.
  • a highly efficient manufacturing system of the organic EL light emitting module 1 can be realized.
  • the suction is performed only through the suction holes provided outside the region facing the moisture absorbing layer 5 among the regions facing the protective layer 6.
  • the formation of irregularities due to the traces of inhalation by the suction holes provided in the suction surface 131 of the suction head 130 can be prevented well, so that the organic layer having a good sealing performance can be obtained.
  • the EL light emitting module 1 can be manufactured.
  • the thermocompression bonding process between the protective layer 6 and the moisture absorbing layer 5 the moisture absorbing layer 5 and the protective layer 6 are brought into close contact with each other in the region facing the suction surface 131 of the suction head 130, and It is possible to satisfactorily prevent a space from being generated. Thereby, the organic electroluminescent light emitting module 1 with favorable sealing performance can be manufactured.
  • the roller portion 613 rolls from one end portion to the other end portion along the longitudinal direction of the tape member 7, and presses the adhesive material 4 against the sealing member 10 from the tape member 7 side by the peripheral surface. Since the adhesive material 4 is configured to be bonded to the sealing member 10, it is possible to favorably prevent a space from being generated between the adhesive material 4 and the sealing member 10. Thereby, the organic electroluminescent light emitting module 1 with favorable sealing performance can be manufactured.
  • the suction transfer member 250 continues the suction operation on the other end portion side of the tape member 7 when the roller portion 613 peels the tape member 7 from the one end portion side of the tape member 7. It is possible to prevent the tape member 7 from falling downward while the part 613 is rolling. Further, since the other end portion is adsorbed and fixed, the tape member 7 and the sealing member 10 can be accurately moved without the positions of the tape member 7 and the sealing member 10 being shifted during the rolling of the roller portion 613. Generation
  • the nitrogen replacement operation is performed in a state where the upper surface portion 601 and the lower surface portion 602 are relatively close to each other, the volume of the space for performing the nitrogen replacement can be reduced. And the time of the nitrogen gas introduction process can be shortened. Thereby, the production efficiency of the organic EL light emitting module 1 can be increased.
  • the partition member 310 for partitioning the nitrogen atmosphere from the outside air is provided with a through hole 312 that fits into the tape member mounting table 304 when the tape member mounting table 304 moves upward. Since the cover 311 covering the hole 312 is pushed up, mixing of nitrogen and outside air through the through-hole 312 can be well prevented. Thereby, the production efficiency of the organic EL light emitting module 1 can be increased.
  • the substrate 2 is supported by the movable central suction portion 810 and the end surface 808 of the concave portion 806 of the chamber lower portion 807, and then the movable central suction portion 810 is moved downward so that the central portion of the substrate 2 is placed in the chamber.
  • the sealing member 10 to which the adhesive material 4 is bonded is placed with the substrate 2 adsorbed by the movable central adsorbing portion 810 held down from the end surface 808 of the recess 806 of the lower portion 807.
  • the mounting table 802 is moved upward, and the substrate 2 and the movable central suction unit 810 are interlocked with each other, while the mounting table 802 is moved together with the sealing member 10 to which the substrate 2 and the adhesive material 4 are bonded together.
  • the substrate 2 and the sealing member 10 are sequentially bonded to each other through the adhesive 4 from the center portion to the end portion of the substrate 2. Thereby, since it can prevent favorably that a space
  • the adhesive material 4 and the sealing material are placed at predetermined positions on the substrate 2.
  • the member 10 can be affixed. Thereby, the manufacturing system of the organic EL light emitting module 1 with high production efficiency in which the occurrence of defective products due to the positional deviation is suppressed can be realized.
  • the convex portion 503 is provided in the lower hot plate portion 502 at a position corresponding to the end portion of the sealing member 10, the outer edge portion of the sealing member 10 to which the adhesive material 4 is bonded is more reliably substrated. 2, the organic EL element 3 and the hygroscopic layer 5 formed on the one surface 21 of the substrate 2 can be more reliably sealed, and the deterioration of the organic EL element 3 can be satisfactorily suppressed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un système de fabrication d'un module d'émission de lumière à élément électroluminescent organique, comprenant : un dispositif de production d'élément de scellement (100) servant à produire un élément de scellement (10) dans lequel sont empilées une couche d'absorption d'humidité (5) et une couche de protection (6) ; et un dispositif de collage d'élément de scellement (400) servant à coller l'élément de scellement (10) sur une surface (21) d'un substrat (2) sur lequel est formé un élément électroluminescent organique (3), et servant à sceller l'élément électroluminescent organique (3). Le dispositif de production d'élément de scellement (100) produit l'élément de scellement (10) dans lequel la couche d'absorption d'humidité (5) et la couche de protection (6) sont empilées à l'aide d'une tête d'aspiration (130) aspirant de manière séquentielle la couche d'absorption d'humidité (5) et la couche de protection (6).
PCT/JP2013/081974 2012-11-30 2013-11-27 Système de fabrication d'un module d'émission de lumière à élément électroluminescent organique, et procédé de fabrication de module d'émission de lumière à élément électroluminescent organique WO2014084284A1 (fr)

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JP2007085750A (ja) * 2005-09-20 2007-04-05 Konica Minolta Medical & Graphic Inc 輝尽性蛍光体シート封止体製造装置、輝尽性蛍光体シート封止体の製造方法
US20100075563A1 (en) * 2008-09-24 2010-03-25 Kabushiki Kaisha Toshiba Method of manufacturing flat-panel display device, apparatus for manufacturing flat-panel display device, and flat-panel display device

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JP3890070B2 (ja) * 2005-06-29 2007-03-07 キヤノンマシナリー株式会社 ガスポンプ

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JP2004296139A (ja) * 2003-03-25 2004-10-21 Sony Corp 貼合装置および貼合方法、ならびに表示装置の製造方法
US20060279209A1 (en) * 2005-06-14 2006-12-14 Tohoku Pioneer Corporation Self-emission panel, self-emission panel sealing member, and self-emission panel manufacturing method
CN1882203A (zh) * 2005-06-14 2006-12-20 日本东北先锋公司 自发光面板及其密封构件以及自发光面板的制造方法
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