WO2014076613A1 - Procédé de formation de motifs de graphène et matériaux de type graphène - Google Patents
Procédé de formation de motifs de graphène et matériaux de type graphène Download PDFInfo
- Publication number
- WO2014076613A1 WO2014076613A1 PCT/IB2013/059969 IB2013059969W WO2014076613A1 WO 2014076613 A1 WO2014076613 A1 WO 2014076613A1 IB 2013059969 W IB2013059969 W IB 2013059969W WO 2014076613 A1 WO2014076613 A1 WO 2014076613A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- pattern
- dimensional crystal
- crystal layer
- graphene
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 71
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 63
- 238000000059 patterning Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 title description 20
- 239000013078 crystal Substances 0.000 claims abstract description 81
- 229910052751 metal Inorganic materials 0.000 claims abstract description 66
- 239000002184 metal Substances 0.000 claims abstract description 66
- 230000000873 masking effect Effects 0.000 claims abstract description 39
- 229920002120 photoresistant polymer Polymers 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 34
- 238000005530 etching Methods 0.000 claims description 20
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical group Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 11
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 5
- 238000000206 photolithography Methods 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000001020 plasma etching Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 198
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 12
- 229910052725 zinc Inorganic materials 0.000 description 12
- 239000011701 zinc Substances 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Abstract
L'invention concerne un procédé de formation de motifs sur une couche cristalline bidimensionnelle telle, que par exemple une couche de graphène, une structure comprenant une couche cristalline bidimensionnelle à motifs et un dispositif d'éclairage comprenant la structure. Les motifs de la couche cristalline bidimensionnelle sont formés par dépôt d'une couche métallique (110) sur la couche cristalline bidimensionnelle (120), par dépôt d'une couche de masquage (130) sur la couche métallique, par création d'un motif (140) dans la couche de masquage, par transfert du motif créé dans la couche de masquage sur la couche métallique et par transfert du motif créé dans la couche métallique sur la couche cristalline bidimensionnelle.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261726075P | 2012-11-14 | 2012-11-14 | |
US61/726,075 | 2012-11-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014076613A1 true WO2014076613A1 (fr) | 2014-05-22 |
Family
ID=49585466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2013/059969 WO2014076613A1 (fr) | 2012-11-14 | 2013-11-07 | Procédé de formation de motifs de graphène et matériaux de type graphène |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2014076613A1 (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020167685A1 (fr) * | 2019-02-14 | 2020-08-20 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Films métalliques à orientation cristallographique ayant des couches cristallines bidimensionnelles |
EP3723122A1 (fr) * | 2019-04-10 | 2020-10-14 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Support de composant comprenant une structure à double couche |
US11033862B2 (en) | 2013-05-01 | 2021-06-15 | Koninklijke Philips N.V. | Method of manufacturing partially freestanding two-dimensional crystal film and device comprising such a film |
WO2022236380A1 (fr) * | 2021-05-14 | 2022-11-17 | Commonwealth Scientific And Industrial Research Organisation | Dispositif permettant d'interagir avec un rayonnement électromagnétique |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1482771A2 (fr) * | 2003-05-30 | 2004-12-01 | Dowa Mining Co., Ltd. | Panneau à circuit métal/céramique et son procédé de fabrication |
US20110220865A1 (en) * | 2010-03-11 | 2011-09-15 | Kabushiki Kaisha Toshiba | Transistor and manufacturing method thereof |
US20120085991A1 (en) * | 2010-10-12 | 2012-04-12 | International Business Machines Corporation | Graphene nanoribbons, method of fabrication and their use in electronic devices |
WO2012094045A2 (fr) | 2010-10-11 | 2012-07-12 | William Marsh Rice University | Retrait de couches de graphène couche par couche |
-
2013
- 2013-11-07 WO PCT/IB2013/059969 patent/WO2014076613A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1482771A2 (fr) * | 2003-05-30 | 2004-12-01 | Dowa Mining Co., Ltd. | Panneau à circuit métal/céramique et son procédé de fabrication |
US20110220865A1 (en) * | 2010-03-11 | 2011-09-15 | Kabushiki Kaisha Toshiba | Transistor and manufacturing method thereof |
WO2012094045A2 (fr) | 2010-10-11 | 2012-07-12 | William Marsh Rice University | Retrait de couches de graphène couche par couche |
US20120085991A1 (en) * | 2010-10-12 | 2012-04-12 | International Business Machines Corporation | Graphene nanoribbons, method of fabrication and their use in electronic devices |
Non-Patent Citations (4)
Title |
---|
CHUANXIN LIAN ET AL: "Quantum transport in patterned graphene nanoribbons", SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM, 2009. ISDRS '09. INTERNATIONAL, IEEE, PISCATAWAY, NJ, USA, 9 December 2009 (2009-12-09), pages 1 - 2, XP031919907, ISBN: 978-1-4244-6030-4, DOI: 10.1109/ISDRS.2009.5378286 * |
GALLAGHER P ET AL: "Disorder-induced gap behavior in graphene nanoribbons", PHYSICAL REVIEW B (CONDENSED MATTER AND MATERIALS PHYSICS) AMERICAN PHYSICAL SOCIETY BY AIP USA, vol. 81, no. 11, 5 March 2010 (2010-03-05), XP002719076, ISSN: 1098-0121 * |
KUMAR S ET AL: "Reliable processing of graphene using metal etchmasks", NANOSCALE RESEARCH LETTERS SPRINGER-VERLAG USA, vol. 6, December 2011 (2011-12-01), XP002719074, ISSN: 1931-7573 * |
YE LU ET AL: "High-On/Off-Ratio Graphene Nanoconstriction Field-Effect Transistor", SMALL WILEY-VCH VERLAG GMBH GERMANY, vol. 6, no. 23, 6 December 2010 (2010-12-06), pages 2748 - 2754, XP002719075, ISSN: 1613-6810 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11033862B2 (en) | 2013-05-01 | 2021-06-15 | Koninklijke Philips N.V. | Method of manufacturing partially freestanding two-dimensional crystal film and device comprising such a film |
WO2020167685A1 (fr) * | 2019-02-14 | 2020-08-20 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Films métalliques à orientation cristallographique ayant des couches cristallines bidimensionnelles |
US11694895B2 (en) | 2019-02-14 | 2023-07-04 | The Government of the United States of America, as represented by the Secretarv of the Navy | Method and use for low-temperature epitaxy and film texturing between a two-dimensional crystalline layer and metal film |
EP3723122A1 (fr) * | 2019-04-10 | 2020-10-14 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Support de composant comprenant une structure à double couche |
US11197367B2 (en) | 2019-04-10 | 2021-12-07 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier comprising a double layer structure |
WO2022236380A1 (fr) * | 2021-05-14 | 2022-11-17 | Commonwealth Scientific And Industrial Research Organisation | Dispositif permettant d'interagir avec un rayonnement électromagnétique |
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