WO2014062094A1

WO2014062094A1 - Thermoelectric module

Info

Publication number: WO2014062094A1
Application number: PCT/RU2013/000907
Authority: WO
Inventors: Юрий Максимович БЕЛОВ
Original assignee: Belov Yury Maksimovich
Priority date: 2012-10-15
Filing date: 2013-10-14
Publication date: 2014-04-24
Also published as: RU2511274C1

Abstract

The invention relates to thermoelectric devices, the operation of which is based on the use of the Peltier effect, and specifically to thermoelectric generators, thermoelectric cooling and heating devices and, more specifically, to thermoelectric modules included in such devices. The problem addressed by the present invention is that of producing thermoelectric modules of the type mentioned, in the manufacturing of which the process for connection to plates consisting of thermally and electrically conductive material of intermediate elements preconnected to thermoelectric elements is simplified. This problem is solved in that, in the thermoelectric module comprising semiconductive p-type thermoelectric elements and semiconductive n-type thermoelectric elements, which are arranged next to one another and each of which has two equidistant end surfaces and a lateral surface, plates consisting of thermally conductive and electrically conductive material, each plate having an internal surface facing the ends of the thermoelectric elements and arranged at a distance therefrom, and an external surface opposite the first surface, and intermediate elements consisting of thermally conductive and electrically conductive material, which are arranged between the thermoelectric elements and plates, and are nondetachably connected by the first ends thereof to the ends of the corresponding thermoelements, and by the second ends thereof to the plates, according to the invention through -openings are formed in the plates opposite the semiconductive thermoelectric elements, and the second ends of the intermediate elements are connected to the plates by means of thermally conductive and electrically conductive material via openings in said plates.

Description

THERMOELECTRIC MODULE

FIELD OF TECHNOLOGY

The invention relates to thermoelectric devices, the operation of which is based on the use of the Peltier effect, namely, to thermoelectric generators, thermoelectric cooling and heating devices, and, more specifically, to thermoelectric modules included in such devices.

BACKGROUND OF THE INVENTION

Known thermoelectric modules containing semiconductor thermoelectric elements of p-type and semiconductor thermoelectric elements of p-type, which are located next to each and made with two equidistant end surfaces and with a side surface, plates of heat and conductive material having each inner surface facing the ends of these thermoelectric elements and located at a distance from them, and the outer surface opposite to the first, and intermediate element of heat conductive material and disposed between said thermoelectric elements and said plates and is fixedly connected by their first ends to the ends of the respective thermoelectric elements, and their second ends to said plates (US 3279955A, 1966; US 5841064A, 1998).

In known thermoelectric modules of this type, the ends of the intermediate elements are connected to the plates by means of a connecting heat and conductive material located between the ends of the intermediate elements and the inner surfaces of the plates.

In the manufacture of such modules, problems arise with the introduction of the connecting material between the ends of the intermediate elements and the inner surfaces of the plates, especially when using solders as the connecting material. In addition, when using solders as a connecting material, problems arise with providing temperature soldering conditions necessary to maintain the strength of the connection of pre-connected thermoelectric and intermediate elements with semiconductor thermoelectric elements. SUMMARY OF THE INVENTION An object of the present invention is to provide thermoelectric modules of the indicated type, the manufacture of which simplifies the process of connecting intermediate elements pre-connected to thermoelectric elements with plates of thermally and electrically conductive material.

This problem is solved in that in a thermoelectric module containing p-type semiconductor thermoelectric elements and η-type semiconductor thermoelectric elements that are adjacent and each are made with two equidistant end surfaces and a side surface, plates of heat and conductive material having each inner surface facing the ends of thermoelectric elements and located at a distance from them, and the outer surface opposite to the first, and intermediate elements of thermally and electrically conductive material located between thermoelectric elements and plates and permanently connected with their first ends with the ends of the corresponding thermoelements and their second ends with plates, according to the invention, openings are made in the plates against the semiconductor thermoelectric elements, and the second ends of the intermediate elements are connected with plates by means of heat and electrically conductive material through holes in said plates.

This embodiment of the module simplifies the manufacturing process of the modules in mass production as a result of the fact that it allows simultaneously and from the outside to connect all thermoelectric elements with pre-connected intermediate elements from the heat and electrically conductive material to the plates of the heat and conductive material.

As the specified connecting material introduced into the hole can be used solder. This embodiment of the module allows the manufacture of modules in mass production using conventional materials.

Galvanically deposited metal can also be used as the specified connecting material introduced into the holes of the plates. This design of the module also allows the manufacture of modules in mass production, makes it possible to produce thermoelectric modules operating at high temperatures, which is important for modules used in thermoelectric generators. The cross-sectional area of the second intermediate elements at the junction with the plates may be less than the cross-sectional area of the first ends of the intermediate elements at the junction with the ends of the thermoelectric elements. This embodiment of the module allows to provide some elasticity of the connection of intermediate thermoelements with plates of thermally and electrically conductive material and to reduce the distance between thermoelectric elements in the module, which is of particular importance for the modules used in thermoelectric generators. Especially effective is the use of copper as a connecting material, which has high thermal and electrical conductivity and high ductility.

Intermediate elements may at least partially enter the holes of the plates. This embodiment of the module allows the fixation of thermoelectric elements in the manufacturing process without the use of additional materials, and the increased sizes of the parts of the intermediate elements protruding beyond the plane of the outer surface of the plates allow increasing the outer surface of the module, which is important for improving heat transfer.

The inner surfaces of these plates can be connected to sheets of heat and electrical insulation material having through holes located opposite the holes of the plates. This embodiment simplifies the manufacture of modules due to the fact that it allows you to form plates of heat and conductive material on sheets of heat and electrical insulation material and connect the plates with intermediate elements.

The lateral surfaces of thermoelectric elements and, in part, intermediate elements, can be coated with a layer of heat and electrical insulation material. This embodiment protects the thermoelectric elements from solder or deposited metal in the manufacture of the module, and also improves the insulation of the thermoelectric elements during operation of the device in which the thermoelectric module is used.

The invention is further disclosed by way of example with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS OF THE DRAWINGS The accompanying drawings show:

figure 1 is a General view of a thermoelectric module according to the present invention;

figure 2 is a General view of the constituent elements of a thermoelectric module according to the present invention, somewhat spaced;

Fig. 3 is a sectional view of an embodiment of a thermoelectric module according to the present invention; in FIG. 4 is a sectional view of the constituent elements of a variant of a thermoelectric module according to the present invention, somewhat spaced.

in FIG. 5-12 - embodiments of location A of FIG. 3;

DETAILED DESCRIPTION OF THE INVENTION As shown in FIG. 1-3, the thermoelectric module comprises p-type semiconductor thermoelectric elements 1, η-type semiconductor thermoelectric elements 2, which are ^" adjacent, and plates 3 of heat and electrically conductive material.

Each thermoelectric element 1, 2 (Fig. 4) is made with two equidistant surfaces 1 ', 1 "and 2', 2" and with a side surface V "or 2".

Each plate 3 (Fig. 4) has an inner surface 3 'facing the ends of the thermoelectric elements and located at a distance from them (Fig. 3), and an outer surface 3 "opposite to the surface 3' (Fig. 4).

Between the thermoelectric elements 1 and 2 and the plates 3 (Fig. 3), intermediate elements 4 are made of thermally and electrically conductive material, for example, copper, which is inseparably connected with its first ends 4 '(Fig. 4) with the ends of the corresponding thermoelectric elements 1 and 2. Between each intermediate element 4 of copper and the semiconductor thermoelectric element 1 and 2, a layer of nickel and other metals (not shown in the drawings) is made, which prevents the diffusion of copper into the material of the thermoelectric elements. The second ends 4 "of the intermediate elements are directed to the plates 3 (Fig. 4) and connected with them (Fig. 3). The cross-sectional area of the second ends 4" (Fig. 4) of the intermediate elements at the junctions with the plates 3 is less than the cross-sectional area cross-sections of the first ends 4 'of the intermediate elements at the junctions with the ends of the thermoelectric elements.

The inner surfaces 3 '(Fig. 4) of the plates 3 are connected to sheets 5 of heat and electrical insulation material (Figs. 3 and 4).

In the plates 3, through holes 6 are made against thermoelectric elements 1 and 2 (Fig. 4). In sheets 5, through holes (not indicated) are made that are located opposite the holes of the plates.

The second ends 4 "of the intermediate elements 4 are connected to the plates 3 by means of heat and conductive material 7 introduced into the holes 6 of the plates 3 (Fig. 3). Solder is used as the material 7 introduced into the holes 6 of the plates 3 (in one embodiment modulus) and a galvanically deposited metal, for example copper (in another embodiment) or electrically and thermally conductive materials deposited by deposition paths in vacuum or electrochemically. 201

The lateral surfaces V ", 2" 'of thermoelectric elements 1, 2 and partially intermediate elements 4 are covered with a layer 8 of heat and electrical insulation material (Figs. 3, 4).

In Figs. 5-12, embodiments of location A (Fig. 3) of intermediate elements 4 with plates 3 are shown.

Intermediate elements 4 can enter the holes in the plates (Fig. 5, 6, 8-12).

The second ends 4 "of the intermediate elements 4 can be located at some distance from the outer surface 3" of the plates 3 (Fig. 7).

The heat and conductive material 7 can connect the side surface 4 ″ (FIG. 4) of the intermediate elements with the plates 3 (FIGS. 5, 6, 8-11).

The holes 6 in the plates 3 (Fig. 4) can be made with chamfers (not indicated) on the inner (Fig. 5) and the outer side of the plates (Fig. 6).

The edges of the holes 6 in the plates 3 can be bent towards the outer (Fig. 10, 11, 12) and inner (Fig. 8, 9) surface of the plates.

The surface or part of the surface of the second ends 4 "of the intermediate elements 4 may have a spherical shape (Fig. 10, 12).

The connecting material 7 can connect the inner surface of the hole 6 and the side surface 4 "of the intermediate elements 4 (Fig. 5, 6).

The connecting material 7 may cover the outer surface

3 "plates 3 (FIGS. 8-12).

The connecting material 7 can cover the entire outer surface of the surface 3 "of the plates 3 (Fig. 9, 11, 12).

The described thermoelectric module can be manufactured as follows.

On both sides of the plate (flat washer) of p-type and p-type thermoelectric materials, a coating is applied to prevent the diffusion of copper into the plate material, and both sides of the plates are coated with connecting flat elements made of heat and conductive material such as copper. Then, along planes perpendicular to the flat sides of the obtained semi-finished products, they are cut into pieces so that the corresponding semiconductor elements are obtained, to which the intermediate elements are connected. At the same time, parts of the intermediate elements are cut or sequentially cut so that the cross-sectional area of the ends of the intermediate elements remote from the ends of the thermoelectric elements is smaller than the cross-sectional area of the ends of the intermediate elements at their junctions with the ends of the thermoelectric elements. Then cover the side surfaces of the thermocouples and partially the surfaces of the intermediate elements with a layer of heat and electrical insulation material. At the same time, plates of heat and conductive material with holes are formed on sheets of heat and electrical insulation material with holes corresponding to the location of semiconductor thermoelectric elements in the module.

Collect alternating p-type and p-type semiconductor elements with intermediate elements attached to them in a bag in which these elements are located next to each other. Sheets with plates are mounted on a package of semiconductor elements with intermediate elements attached to them. From the outer surfaces of the plates, a heat and conductive material is applied in the form of galvanically deposited copper, or a connecting material is introduced in the form of solder, which is heated.

If necessary, the outer surfaces of the plates can be cleaned of excess solder or galvanically deposited metal. If necessary, they process the surface of the set of plates until the flatness of the module is restored. Moreover, the necessary distance between the outer planes of the plates can be additionally provided.

The plates may be made of bimetallic conductors, for example, clad aluminum.

The plates and the connecting heat and electrically conductive material may be coated with a thermally conductive insulating material, for example aluminum oxide.

By the methods of planar technology, the formation of plates of thermally conductive material can be carried out after joining sheets of thermally conductive material with holes made in them and semiconductor thermoelectric elements connected to intermediate elements.

In thermoelectric devices - thermoelectric generators, thermoelectric cooling and heating devices, the outer surfaces of the plates are connected to the heat transfer elements of the devices or are part of the channel for the passage of coolant (not shown in the drawings). Electric circuits formed by plates 3, intermediate elements 4 and thermoelectric elements 1, 2 are connected in generators to the consumer of electricity, and in cooling and heating devices to a source of electricity (not shown in the drawings). INDUSTRIAL APPLICABILITY

The invention can be applied in thermoelectric generators, thermoelectric cooling and heating devices.

Claims

CLAIM

1. A thermoelectric module comprising p-type semiconductor thermoelectric elements and η-type semiconductor thermoelectric elements that are adjacent to each other and have two substantially equidistant end surfaces and a side surface, plates of thermally and electrically conductive material having each the inner surface facing the ends of these thermoelectric elements and located at a distance from them, and the outer surface opposite to the first, and intermediate elements enti of heat and electrically conductive material located between the indicated thermoelectric elements and said plates and permanently connected by their first ends to the ends of the corresponding thermoelectric elements and indissolubly connected by their second ends to these plates by means of a connecting thermally and electrically conductive material, characterized in that, in said plates against said semiconductor thermoelectric elements, through holes are filled, and said connection The solid heat and conductive material and the second ends of these intermediate elements are connected through openings in these plates.

2. The thermoelectric module according to claim 1, characterized in that, the cross-sectional area of the second ends of these intermediate elements at the junction with the plates is less than the cross-sectional area of the first ends of these intermediate elements.

3. The thermoelectric module according to claim 2, characterized in that said intermediate elements are at least partially located in the holes of said plates.

4. The thermoelectric module according to claim 2, characterized in that, as the specified connecting material used solder.

5. The thermoelectric module according to claim 2, characterized in that, as the specified connecting material used precipitated metal.

6. The thermoelectric module according to claim 2, characterized in that, the inner surfaces of these plates are connected to sheets of heat and electrical insulation material having through holes located opposite the holes of the plates.

7. The thermoelectric module according to claim 2, characterized in that, the side surfaces of these thermoelectric elements and, in part, intermediate elements, are coated with a layer of heat and electrical insulation material.

SUBSTITUTE SHEET (RULE 26)