WO2014062094A1 - Thermoelectric module - Google Patents

Thermoelectric module

Info

Publication number
WO2014062094A1
WO2014062094A1 PCT/RU2013/000907 RU2013000907W WO2014062094A1 WO 2014062094 A1 WO2014062094 A1 WO 2014062094A1 RU 2013000907 W RU2013000907 W RU 2013000907W WO 2014062094 A1 WO2014062094 A1 WO 2014062094A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
elements
thermoelectric
plates
material
intermediate
Prior art date
Application number
PCT/RU2013/000907
Other languages
French (fr)
Russian (ru)
Inventor
Юрий Максимович БЕЛОВ
Original Assignee
Belov Yury Maksimovich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L35/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L35/02Details
    • H01L35/04Structural details of the junction; Connections of leads
    • H01L35/08Structural details of the junction; Connections of leads non-detachable, e.g. cemented, sintered, soldered, e.g. thin films

Abstract

The invention relates to thermoelectric devices, the operation of which is based on the use of the Peltier effect, and specifically to thermoelectric generators, thermoelectric cooling and heating devices and, more specifically, to thermoelectric modules included in such devices. The problem addressed by the present invention is that of producing thermoelectric modules of the type mentioned, in the manufacturing of which the process for connection to plates consisting of thermally and electrically conductive material of intermediate elements preconnected to thermoelectric elements is simplified. This problem is solved in that, in the thermoelectric module comprising semiconductive p-type thermoelectric elements and semiconductive n-type thermoelectric elements, which are arranged next to one another and each of which has two equidistant end surfaces and a lateral surface, plates consisting of thermally conductive and electrically conductive material, each plate having an internal surface facing the ends of the thermoelectric elements and arranged at a distance therefrom, and an external surface opposite the first surface, and intermediate elements consisting of thermally conductive and electrically conductive material, which are arranged between the thermoelectric elements and plates, and are nondetachably connected by the first ends thereof to the ends of the corresponding thermoelements, and by the second ends thereof to the plates, according to the invention through -openings are formed in the plates opposite the semiconductive thermoelectric elements, and the second ends of the intermediate elements are connected to the plates by means of thermally conductive and electrically conductive material via openings in said plates.

Description

Thermoelectric modules

TECHNICAL FIELD

The invention relates to thermoelectric devices, whose operation is based on the use of the Peltier effect, namely - to thermoelectric generators, thermoelectric heating and cooling devices, and more particularly - to the thermoelectric modules forming part of such devices.

BACKGROUND ART

Known thermoelectric modules containing semiconductor thermoelectric elements and P-type thermoelectric elements poluprovoodnikovye p- type which are disposed side by side and formed each with two end surfaces and equidistant from the lateral surface plates of heat conductive material and having each an inner surface facing the end faces of said thermoelectric elements and disposed at a distance from them, and an outer surface, opposite the first, and the intermediate element of heat conductive material and disposed between said thermoelectric elements and said plates and is fixedly connected by their first ends to the ends of the respective thermoelectric elements, and their second ends to said plates (US 3279955A, 1966; US 5841064A, 1998).

In conventional thermoelectric modules of this type the ends of the intermediate elements are connected to the connecting plates by means of heat and electrically conductive material located between the ends of the intermediate elements and the inner surfaces of the plates.

In the manufacture of such modules there are problems with the introduction of connecting material between the ends of the intermediate elements and the inner surfaces of the plates, especially when using solder as the joining material. Furthermore, when used as a solder joint material, there are problems with ensuring brazing temperature regimes required to preserve the strength of the bond and the pre-connected thermoelectric semiconductor elements with intermediate elements termolektricheskimi. DISCLOSURE OF INVENTION An object of the present invention is to provide a thermoelectric module of the type mentioned, which simplified the manufacture process of connecting with plates of heat conductive material and the intermediate elements connected to the pre termoelektricheskmi elements.

This problem is solved in that in the thermoelectric module comprising a thermoelectric semiconductor elements and p-type thermoelectric semiconductor elements η-type, which are arranged side by side and formed each with two end surfaces and equidistant from the lateral surface plates of heat conductive material and having each inner surface facing the ends of the thermoelectric elements and disposed at a distance from them, and an outer surface, opposite the first, intermediate and e ementy of heat conductive material and disposed between the thermoelectric elements and plates and are integrally connected by their first ends to respective ends of the thermocouples and their second ends to the plates, according to the invention in the plates against the thermoelectric semiconductor elements are svoznye openings and second ends of the intermediate elements are connected with the plates by thermal and electrical conductive material through the openings in said plates.

This embodiment simplifies module manufacture process modules in mass production due to the fact that at the same time allows, and with the outside, connected to the plates of heat conducting material and all the thermoelectric elements with previously connected intermediate elements from thermal and electrical conductive material.

As said connecting material introduced into the hole the solder can be used. Such an arrangement allows the module to produce the modules in mass production using conventional materials.

As said connecting material introduced into the holes of plates may also be used galvanically deposited metal. This module also pozvolyaeyuschee execution modules manufactured in mass production, makes it possible to produce the thermoelectric modules operating at high temperatures, which is important for the modules used in thermoelectric generators. The cross sectional area of ​​second intermediate members at the joints with the plates may be smaller than the cross sectional area of ​​the first ends of the intermediate elements at the junctions with the ends of the thermoelectric elements. Such embodiment of the module allows for some elasticity thermoelements intermediate compound with plates of heat and electrically conductive material and reduce the distance between the thermoelectric elements in the module, which is of particular importance for the modules used in thermoelectric generators. Especially effective is the use as connecting copper material having high thermal and electrical conductivity and high ductility.

The intermediate elements can at least partly enter the hole plates. Such an arrangement enables the module fixation thermoelectric elements in the manufacturing process without the use of additional materials and dimensions enlarged portions intermediate elements projecting beyond the plane of the outer surfaces of the plates, can increase the outer surface area of ​​the module, which is important to improve heat transfer.

The inner surfaces of said plates can be bonded to the sheets of heat insulating material and having through-holes arranged with the holes of the plates. This embodiment simplifies production of the modules due to the fact that allows to form a plate of heat conductive material and sheets of thermal and electrical insulating material and connecting the plate to intermediate elements.

The side surfaces of thermoelectric elements and partially intervening elements may be coated with a layer of thermal and electrical insulating material. This embodiment provides protection against ingress of thermoelectric elements solder or metal deposited during manufacture of the module, and also improves the isolation of the thermoelectric elements in the device, which uses a thermoelectric module.

The invention disclosed in the embodiment with reference to the accompanying drawings.

OPISPNIE BRIEF DESCRIPTION OF THE DRAWINGS In the accompanying drawings:

1 - a general view of a thermoelectric module according to the present invention;

Figure 2 - a general view of a thermoelectric module of the constituent elements according to the present invention, several spaced;

on fig.Z - section of an embodiment of a thermoelectric module according to the present invention; FIG. 4 - sectional view of the thermoelectric module embodiment of the constituent elements according to the present invention, several spaced.

FIG. 5-12 - embodiments of the space A fig.Z;

DETAILED DESCRIPTION As shown in FIG. 1-3 a thermoelectric module comprises a thermoelectric semiconductor elements 1 are p-type thermoelectric semiconductor elements 2 η-type, are "placed side by side, and the plate 3 of thermal and electrical conductive material.

Each thermoelectric element 1, 2 (FIG. 4) is provided with two equidistant surfaces 1 ', 1', 2 ', 2 "and the side surface V" or 2 "'.

Each plate 3 (FIG. 4) has an inner surface 3 'facing towards the ends of the thermoelectric elements and disposed at a distance from them (FIG. 3), and an outer surface 3' opposite to the surface 3 '(FIG. 4).

Between the thermoelectric elements 1 and the plates 2 and 3 (FIG. 3) are arranged intermediate elements 4 of thermal and electrical conductive material such as copper, is integrally connected to its first end 4 '(FIG. 4) with the ends of the respective thermoelectric elements 1 and 2. between each intermediate member 4 made of copper and the semiconductor thermoelectric element 1 and the layer 2 is made of nickel and other metal (not shown in the drawings), which prevents the diffusion of copper in the thermoelectric material elements. The second ends 4 "intermediate members directed to the plates 3 (FIG. 4) and are connected with them (FIG. 3). The cross sectional area of ​​the second ends 4" (FIG. 4) of intermediate elements at the joints with the plates 3 is smaller than the cross area the first section end 4 'of intermediate elements at the junctions with the ends of the thermoelectric elements.

The inner surface 3 '(FIG. 4) of the plates 3 are connected to the sheets 5 from heat and electrically insulating material (Figs. 3 and 4).

The plates 3 against the thermoelectric elements 1 and 2 through holes 6 (Fig. 4). The sheets 5 are made through holes (not designated) disposed against the holes of the plates.

The second ends 4 "intermediate elements 4 are connected to the plate 3 by means of thermal and electrical conductive material 7 inserted into the holes 6 of plates 3 (FIG. 3). As the material 7 introduced into the holes 6 of the sheets 3, the solder used (in one embodiment, module) and galvanically deposited metal, such as copper (in another embodiment) or electrically and thermally conductive materials deposited tract deposition in vacuo or electrochemically. 201

The side surfaces V ", 2" 'of the thermoelectric elements 1, 2, and partly intermediate elements 4, are covered with a layer 8 of heat and electrically insulating material (Figure 3, 4).

FIGS 5-12 show embodiments of space A (Fig. 3) the intermediate elements 4 with the plates 3.

The intermediate elements 4 may enter the openings in the plates (FIGS. 5, 6, 8-12).

The second ends 4 "intermediate elements 4 may be arranged at a distance from the outer surface 3 'plates 3 (FIG. 7).

Thermal and electrical conductive material 7 may connect the side surface 4 '' (FIG. 4) the intermediate element 3 with the plates (FIGS. 5, 6, 8-11).

The holes 6 in the plates 3 (FIG. 4) can be performed with chamfers (not designated) on the inside (FIG. 5) and outer side plates (FIG. 6).

The edges of the holes 6 in the plates 3 can be curved towards the exterior (FIGS. 10, 11, 12) and an inner (Figs. 8, 9) of the surface plates.

The surface or surface portion of the second ends 4 "intermediate elements 4 may have a spherical shape (FIGS. 10, 12).

The connecting material 7 may connect the interior surface opening 6 and the side surface 4 '' of intermediate element 4 (FIGS. 5, 6).

The connecting material 7 may cover the outer surface

3 'plates 3 (Figure 8-12).

The connecting material 7 may cover the entire outer surface of the surface 3 'plates 3 (FIGS. 9, 11, 12).

Described thermoelectric module can be manufactured as follows oborazom.

On both sides of the plate (flat disk) of the thermoelectric materials of p-type and n-type applied coating that prevents difuzii copper plate material, and both sides of the joined plates coated with them flat elements made from heat and electrically conductive material such as copper. Then, on planes perpendicular to the flat sides of the products obtained semi-finished products, cut them into parts so as to obtain the corresponding semiconductor elements, which are connected to intermediate elements. Simultaneously or sequentially cut portion of the intermediate elements to the cross-sectional area intermediate the ends of the elements, remote from the ends of the thermoelectric elements was less than the cross sectional area of ​​the ends of the intermediate elements at the connection with the ends of the thermoelectric elements. Then cover the side surfaces of the thermoelements and the intermediate elements partially surface layer and heat insulating material. Simultaneously, on sheets of thermal and electrical insulating material is formed from a plate of heat conductive material and with holes whose arrangement corresponds to the arrangement of thermoelectric semiconductor elements in the module.

Collect the semiconductor elements alternating p-type and n-type with attached intermediate elements in the package, in which these elements are arranged adjacent to each other. Sheets plates mounted on the package of the semiconductor elements with attached intermediate elements. From the outer surfaces of the plates, and heat is applied to the conductive material in the form of galvanically deposited copper, or administered as a bonding material of solder which is heated.

If desired, the outer surfaces of the plates may be cleaned from excess solder or galvanically deposited metal. If necessary, surface treated plates together to restore the flatness of the module. Thus it may further be provided and the required distance between the external planes of the plates.

The plates can be made of bimetallic conductor, for example aluminum clad.

And a connecting plate and heat conductive material may be coated with an electrically insulating thermally conductive material such as aluminum oxide.

Methods of forming planar technology plates of heat conductive material may be performed after connection of the heat conductive sheets of material with holes made in them and the thermoelectric semiconductor elements connected to intermediate elements.

The thermoelectric devices - thermoelectric generators, thermoelectric cooling and heating devices are connected to the outer surface of plates with heat transfer devices or elements are part of the channel for coolant passage (not shown in the drawings). Electrically circuit formed by the plates 3, 4 and intermediate elements thermoelectric elements 1, 2 are connected to the electricity generators in the consumer, and in (not shown in the drawings) of cooling and heating devices to a power source. Industrial Applicability

The invention may be used in thermoelectric generators, thermoelectric cooling and heating devices.

Claims

CLAIM
1. A thermoelectric module comprising a thermoelectric semiconductor elements and p-type thermoelectric semiconductor elements η-type, which are arranged side by side and formed each with two, substantially equidistant from the end faces and side surface plates of heat conductive material and having each an inner surface facing the end faces of said thermoelectric elements and disposed at a distance from them, and an outer surface, opposite the first, intermediate and ale cients of thermal and electrically conductive material disposed between said thermoelectric elements and said plates and is fixedly connected by their first ends to the ends of the respective thermoelectric elements, and inseparably connected by their second ends to said plates by a bonding and heat conducting material, characterized in that, in said plates against said semiconductor thermoelectric elements vgaolneny through holes, and said connecting itelny heat and material elektroprovodnoy and second ends of said intermediate elements are connected through openings in said plates.
2. The thermoelectric module according to claim 1, characterized in that the cross-sectional area of ​​the second ends of said intermediate elements at the joints with the plates less than the cross sectional area of ​​the first ends of said intermediate elements.
3. The thermoelectric module according to claim 2, characterized in that said spacer elements at least partially disposed in the apertures of said plates.
4. The thermoelectric module according to claim 2, characterized in that as said material is a solder connection.
5. A thermoelectric module according to claim 2, characterized in that, as said joining material precipitated metal used.
6. The thermoelectric module according to claim 2, characterized in that, the inner surfaces of said plates are connected to the sheets of heat insulating material and having through-holes arranged with the holes of the plates.
7. The thermoelectric module according to claim 2, characterized in that, the side surface of said thermoelectric elements and, partially, the intermediate elements are covered with a layer of thermal and electrical insulating material.
SUBSTITUTE SHEET (RULE 26)
PCT/RU2013/000907 2012-10-15 2013-10-14 Thermoelectric module WO2014062094A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
RU2012143818A RU2511274C1 (en) 2012-10-15 2012-10-15 Thermoelectric module
RU2012143818 2012-10-15

Publications (1)

Publication Number Publication Date
WO2014062094A1 true true WO2014062094A1 (en) 2014-04-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU2013/000907 WO2014062094A1 (en) 2012-10-15 2013-10-14 Thermoelectric module

Country Status (2)

Country Link
RU (1) RU2511274C1 (en)
WO (1) WO2014062094A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279955A (en) 1963-01-08 1966-10-18 Gen Motors Corp Method of forming electroplated thermoelectric junction and resultant article
US5841064A (en) 1995-05-26 1998-11-24 Matsushita Electric Works, Ltd. Peltier module
US20060289050A1 (en) * 2005-06-22 2006-12-28 Alley Randall G Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4412209B2 (en) * 2004-05-21 2010-02-10 パナソニック電工株式会社 Method for manufacturing a thermoelectric conversion element module
RU111354U1 (en) * 2009-12-21 2011-12-10 Общество с ограниченной ответственностью "ТЕ-Групп" The thermoelectric module, the thermoelectric element and a blank for fabricating thermoelectric elements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279955A (en) 1963-01-08 1966-10-18 Gen Motors Corp Method of forming electroplated thermoelectric junction and resultant article
US5841064A (en) 1995-05-26 1998-11-24 Matsushita Electric Works, Ltd. Peltier module
US20060289050A1 (en) * 2005-06-22 2006-12-28 Alley Randall G Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures

Also Published As

Publication number Publication date Type
RU2511274C1 (en) 2014-04-10 grant

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