WO2014062094A1 - Module thermoélectrique - Google Patents

Module thermoélectrique Download PDF

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Publication number
WO2014062094A1
WO2014062094A1 PCT/RU2013/000907 RU2013000907W WO2014062094A1 WO 2014062094 A1 WO2014062094 A1 WO 2014062094A1 RU 2013000907 W RU2013000907 W RU 2013000907W WO 2014062094 A1 WO2014062094 A1 WO 2014062094A1
Authority
WO
WIPO (PCT)
Prior art keywords
plates
thermoelectric
elements
conductive material
intermediate elements
Prior art date
Application number
PCT/RU2013/000907
Other languages
English (en)
Russian (ru)
Inventor
Юрий Максимович БЕЛОВ
Original Assignee
Belov Yury Maksimovich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Belov Yury Maksimovich filed Critical Belov Yury Maksimovich
Publication of WO2014062094A1 publication Critical patent/WO2014062094A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Definitions

  • thermoelectric devices the operation of which is based on the use of the Peltier effect, namely, to thermoelectric generators, thermoelectric cooling and heating devices, and, more specifically, to thermoelectric modules included in such devices.
  • thermoelectric modules containing semiconductor thermoelectric elements of p-type and semiconductor thermoelectric elements of p-type, which are located next to each and made with two equidistant end surfaces and with a side surface, plates of heat and conductive material having each inner surface facing the ends of these thermoelectric elements and located at a distance from them, and the outer surface opposite to the first, and intermediate element of heat conductive material and disposed between said thermoelectric elements and said plates and is fixedly connected by their first ends to the ends of the respective thermoelectric elements, and their second ends to said plates (US 3279955A, 1966; US 5841064A, 1998).
  • thermoelectric modules of this type the ends of the intermediate elements are connected to the plates by means of a connecting heat and conductive material located between the ends of the intermediate elements and the inner surfaces of the plates.
  • An object of the present invention is to provide thermoelectric modules of the indicated type, the manufacture of which simplifies the process of connecting intermediate elements pre-connected to thermoelectric elements with plates of thermally and electrically conductive material.
  • thermoelectric module containing p-type semiconductor thermoelectric elements and ⁇ -type semiconductor thermoelectric elements that are adjacent and each are made with two equidistant end surfaces and a side surface, plates of heat and conductive material having each inner surface facing the ends of thermoelectric elements and located at a distance from them, and the outer surface opposite to the first, and intermediate elements of thermally and electrically conductive material located between thermoelectric elements and plates and permanently connected with their first ends with the ends of the corresponding thermoelements and their second ends with plates, according to the invention, openings are made in the plates against the semiconductor thermoelectric elements, and the second ends of the intermediate elements are connected with plates by means of heat and electrically conductive material through holes in said plates.
  • This embodiment of the module simplifies the manufacturing process of the modules in mass production as a result of the fact that it allows simultaneously and from the outside to connect all thermoelectric elements with pre-connected intermediate elements from the heat and electrically conductive material to the plates of the heat and conductive material.
  • This embodiment of the module allows the manufacture of modules in mass production using conventional materials.
  • Galvanically deposited metal can also be used as the specified connecting material introduced into the holes of the plates.
  • This design of the module also allows the manufacture of modules in mass production, makes it possible to produce thermoelectric modules operating at high temperatures, which is important for modules used in thermoelectric generators.
  • the cross-sectional area of the second intermediate elements at the junction with the plates may be less than the cross-sectional area of the first ends of the intermediate elements at the junction with the ends of the thermoelectric elements.
  • This embodiment of the module allows to provide some elasticity of the connection of intermediate thermoelements with plates of thermally and electrically conductive material and to reduce the distance between thermoelectric elements in the module, which is of particular importance for the modules used in thermoelectric generators.
  • Especially effective is the use of copper as a connecting material, which has high thermal and electrical conductivity and high ductility.
  • Intermediate elements may at least partially enter the holes of the plates.
  • This embodiment of the module allows the fixation of thermoelectric elements in the manufacturing process without the use of additional materials, and the increased sizes of the parts of the intermediate elements protruding beyond the plane of the outer surface of the plates allow increasing the outer surface of the module, which is important for improving heat transfer.
  • the inner surfaces of these plates can be connected to sheets of heat and electrical insulation material having through holes located opposite the holes of the plates.
  • This embodiment simplifies the manufacture of modules due to the fact that it allows you to form plates of heat and conductive material on sheets of heat and electrical insulation material and connect the plates with intermediate elements.
  • thermoelectric elements and, in part, intermediate elements can be coated with a layer of heat and electrical insulation material.
  • This embodiment protects the thermoelectric elements from solder or deposited metal in the manufacture of the module, and also improves the insulation of the thermoelectric elements during operation of the device in which the thermoelectric module is used.
  • figure 1 is a General view of a thermoelectric module according to the present invention.
  • figure 2 is a General view of the constituent elements of a thermoelectric module according to the present invention, somewhat spaced;
  • FIG. 3 is a sectional view of an embodiment of a thermoelectric module according to the present invention
  • FIG. 4 is a sectional view of the constituent elements of a variant of a thermoelectric module according to the present invention, somewhat spaced.
  • FIG. 5-12 embodiments of location A of FIG. 3;
  • thermoelectric module comprises p-type semiconductor thermoelectric elements 1, ⁇ -type semiconductor thermoelectric elements 2, which are " adjacent, and plates 3 of heat and electrically conductive material.
  • thermoelectric element 1, 2 (Fig. 4) is made with two equidistant surfaces 1 ', 1 "and 2', 2" and with a side surface V "or 2".
  • Each plate 3 (Fig. 4) has an inner surface 3 'facing the ends of the thermoelectric elements and located at a distance from them (Fig. 3), and an outer surface 3 "opposite to the surface 3' (Fig. 4).
  • intermediate elements 4 are made of thermally and electrically conductive material, for example, copper, which is inseparably connected with its first ends 4 '(Fig. 4) with the ends of the corresponding thermoelectric elements 1 and 2.
  • a layer of nickel and other metals (not shown in the drawings) is made, which prevents the diffusion of copper into the material of the thermoelectric elements.
  • the second ends 4 "of the intermediate elements are directed to the plates 3 (Fig. 4) and connected with them (Fig. 3).
  • the cross-sectional area of the second ends 4" (Fig. 4) of the intermediate elements at the junctions with the plates 3 is less than the cross-sectional area cross-sections of the first ends 4 'of the intermediate elements at the junctions with the ends of the thermoelectric elements.
  • the inner surfaces 3 '(Fig. 4) of the plates 3 are connected to sheets 5 of heat and electrical insulation material (Figs. 3 and 4).
  • thermoelectric elements 1 and 2 Fig. 4
  • through holes are made that are located opposite the holes of the plates.
  • the second ends 4 "of the intermediate elements 4 are connected to the plates 3 by means of heat and conductive material 7 introduced into the holes 6 of the plates 3 (Fig. 3).
  • Solder is used as the material 7 introduced into the holes 6 of the plates 3 (in one embodiment modulus) and a galvanically deposited metal, for example copper (in another embodiment) or electrically and thermally conductive materials deposited by deposition paths in vacuum or electrochemically.
  • a galvanically deposited metal for example copper (in another embodiment) or electrically and thermally conductive materials deposited by deposition paths in vacuum or electrochemically.
  • thermoelectric elements 1, 2 and partially intermediate elements 4 are covered with a layer 8 of heat and electrical insulation material (Figs. 3, 4).
  • FIGs. 5-12 embodiments of location A (Fig. 3) of intermediate elements 4 with plates 3 are shown.
  • the second ends 4 "of the intermediate elements 4 can be located at some distance from the outer surface 3" of the plates 3 (Fig. 7).
  • the heat and conductive material 7 can connect the side surface 4 ′′ (FIG. 4) of the intermediate elements with the plates 3 (FIGS. 5, 6, 8-11).
  • the holes 6 in the plates 3 can be made with chamfers (not indicated) on the inner (Fig. 5) and the outer side of the plates (Fig. 6).
  • the edges of the holes 6 in the plates 3 can be bent towards the outer (Fig. 10, 11, 12) and inner (Fig. 8, 9) surface of the plates.
  • the surface or part of the surface of the second ends 4 "of the intermediate elements 4 may have a spherical shape (Fig. 10, 12).
  • the connecting material 7 can connect the inner surface of the hole 6 and the side surface 4 "of the intermediate elements 4 (Fig. 5, 6).
  • the connecting material 7 may cover the outer surface
  • the connecting material 7 can cover the entire outer surface of the surface 3 "of the plates 3 (Fig. 9, 11, 12).
  • thermoelectric module can be manufactured as follows.
  • thermoelectric materials On both sides of the plate (flat washer) of p-type and p-type thermoelectric materials, a coating is applied to prevent the diffusion of copper into the plate material, and both sides of the plates are coated with connecting flat elements made of heat and conductive material such as copper. Then, along planes perpendicular to the flat sides of the obtained semi-finished products, they are cut into pieces so that the corresponding semiconductor elements are obtained, to which the intermediate elements are connected. At the same time, parts of the intermediate elements are cut or sequentially cut so that the cross-sectional area of the ends of the intermediate elements remote from the ends of the thermoelectric elements is smaller than the cross-sectional area of the ends of the intermediate elements at their junctions with the ends of the thermoelectric elements.
  • thermocouples cover the side surfaces of the thermocouples and partially the surfaces of the intermediate elements with a layer of heat and electrical insulation material.
  • plates of heat and conductive material with holes are formed on sheets of heat and electrical insulation material with holes corresponding to the location of semiconductor thermoelectric elements in the module.
  • Sheets with plates are mounted on a package of semiconductor elements with intermediate elements attached to them. From the outer surfaces of the plates, a heat and conductive material is applied in the form of galvanically deposited copper, or a connecting material is introduced in the form of solder, which is heated.
  • the outer surfaces of the plates can be cleaned of excess solder or galvanically deposited metal. If necessary, they process the surface of the set of plates until the flatness of the module is restored. Moreover, the necessary distance between the outer planes of the plates can be additionally provided.
  • the plates may be made of bimetallic conductors, for example, clad aluminum.
  • the plates and the connecting heat and electrically conductive material may be coated with a thermally conductive insulating material, for example aluminum oxide.
  • the formation of plates of thermally conductive material can be carried out after joining sheets of thermally conductive material with holes made in them and semiconductor thermoelectric elements connected to intermediate elements.
  • thermoelectric devices thermoelectric cooling and heating devices
  • the outer surfaces of the plates are connected to the heat transfer elements of the devices or are part of the channel for the passage of coolant (not shown in the drawings).
  • Electric circuits formed by plates 3, intermediate elements 4 and thermoelectric elements 1, 2 are connected in generators to the consumer of electricity, and in cooling and heating devices to a source of electricity (not shown in the drawings).
  • the invention can be applied in thermoelectric generators, thermoelectric cooling and heating devices.

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne des dispositifs thermoélectriques dont le fonctionnement est basé sur l'effet Peltier et notamment des générateurs thermiques, des refroidisseurs thermiques et des réchauffeurs thermiques, et plus particulièrement des modules thermoélectriques faisant partie de ces dispositifs. L'objectif visé par la présente invention est la création de modules thermoélectriques de type indiqué pour la fabrication desquels on a simplifié le processus de jonction avec les plaquettes en matériaux thermo- et électroconducteurs des éléments intermédiaires reliés préalablement aux éléments thermoélectriques. Cet objectif est réalisé en ce que le module thermoélectrique contenant des éléments thermoélectriques de type p et des éléments thermoélectriques semi-conducteurs de type n qui sont disposés côté à côté et présentant des surfaces d'extrémité équidistantes ainsi qu'une surface latérale, les plaquettes en matériaux thermo- et électroconducteurs ont chacune une surface interne orientée vers les extrémités des éléments thermoélectriques et disposée à une distance par rapport à eux ainsi qu'une surface externe opposé à la première, et des éléments intermédiaires en matériaux thermo- et électroconducteurs disposés entre les éléments thermoélectriques et les plaquettes et connectés rigidement par leurs premiers bouts aux extrémités des éléments thermoélectriques correspondants, et par leurs deuxièmes bouts aux plaquettes, selon l'invention on a réalisé dans les plaquettes en face des éléments thermoélectriques semi-conducteurs des via, et les deuxièmes bouts des éléments intermédiaires sont connectés aux plaquettes au moyen d'un matériau thermo- et électroconducteur par des via réalisés dans lesdites plaquettes.
PCT/RU2013/000907 2012-10-15 2013-10-14 Module thermoélectrique WO2014062094A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2012143818/28A RU2511274C1 (ru) 2012-10-15 2012-10-15 Термоэлектрический модуль
RU2012143818 2012-10-15

Publications (1)

Publication Number Publication Date
WO2014062094A1 true WO2014062094A1 (fr) 2014-04-24

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RU (1) RU2511274C1 (fr)
WO (1) WO2014062094A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110249439A (zh) * 2017-02-08 2019-09-17 麦格纳座椅公司 热电模块和柔性热电电路组件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279955A (en) 1963-01-08 1966-10-18 Gen Motors Corp Method of forming electroplated thermoelectric junction and resultant article
US5841064A (en) 1995-05-26 1998-11-24 Matsushita Electric Works, Ltd. Peltier module
US20060289050A1 (en) * 2005-06-22 2006-12-28 Alley Randall G Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4412209B2 (ja) * 2004-05-21 2010-02-10 パナソニック電工株式会社 熱電変換素子モジュールの製造方法
RU111354U1 (ru) * 2009-12-21 2011-12-10 Общество с ограниченной ответственностью "ТЕ-Групп" Термоэлектрический модуль, термоэлектрический элемент и заготовка для изготовления термоэлектрических элементов

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279955A (en) 1963-01-08 1966-10-18 Gen Motors Corp Method of forming electroplated thermoelectric junction and resultant article
US5841064A (en) 1995-05-26 1998-11-24 Matsushita Electric Works, Ltd. Peltier module
US20060289050A1 (en) * 2005-06-22 2006-12-28 Alley Randall G Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110249439A (zh) * 2017-02-08 2019-09-17 麦格纳座椅公司 热电模块和柔性热电电路组件

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Publication number Publication date
RU2511274C1 (ru) 2014-04-10

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